Samsung Electronics today reported financial results for the first quarter ended March 31, 2024. The Company posted KRW 71.92 trillion in consolidated revenue on the back of strong sales of flagship Galaxy S24 smartphones and higher prices for memory semiconductors. Operating profit increased to KRW 6.61 trillion as the Memory Business returned to profit by addressing demand for high value-added products. The Mobile eXperience (MX) Business posted higher earnings and the Visual Display and Digital Appliances businesses also recorded increased profitability.

The weakness of the Korean won against major currencies resulted in a positive impact on company-wide operating profit of about KRW 0.3 trillion compared to the previous quarter. The Company's total capital expenditures in the first quarter stood at KRW 11.3 trillion, including KRW 9.7 trillion for the Device Solutions (DS) Division and KRW 1.1 trillion on Samsung Display Corporation (SDC). Spending on memory was focused on facilities and packaging technologies to address demand for High Bandwidth Memory (HBM), DDR5 and other advanced products, while foundry investments were concentrated on establishing infrastructure to meet medium- to long-term demand. Display investments were mainly made in IT OLED products and flexible display technologies.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

"We are excited to deliver the industry's first 9th-gen V-NAND, which will bring future applications leaps forward. In order to address the evolving needs for NAND flash solutions, Samsung has pushed the boundaries in cell architecture and operational scheme for our next-generation product," said SungHoi Hur, Head of Flash Product & Technology at Samsung Electronics. "Through our latest V-NAND, Samsung will continue to set the trend for the high-performance, high-density solid state drive (SSD) market that meets the needs for the coming AI generation."

Renowned global memory brand Team Group Inc. is committed to providing consumers with diverse and optimal storage solutions. Today, it proudly unveils the Team Group MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs.

Team Group MP44Q M.2 PCIe 4.0 SSD utilizes the latest 3D QLC NAND, offering capacities of up to 4 TB. With the PCIe Gen 4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively. The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with Team Group's exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD's lifespan.

Micron Technology, Inc., today demonstrated its continued NAND technology leadership by announcing that its 232-layer QLC NAND is now in mass production and shipping in select Crucial SSDs, in volume production to enterprise storage customers and sampling to OEM PC manufacturers in the Micron 2500 NMVe SSD.

Micron 232-layer QLC NAND delivers unparalleled performance for use cases across mobile, client, edge and data center storage by leveraging these important capabilities:

• Industry-leading bit-density, up to 28% more compact than leading competitors'1 latest products
• Industry-leading NAND I/O speeds of 2400 MT/s, a 50% improvement over the prior generation
• 24% better read performance over the prior generation
• 31% better programming performance over the prior generation

Lenovo has unveiled a selection of ThinkCentre desktops powered by AMD Ryzen PRO 8000 Series desktop processors with up to 16 TOPS (trillion operations per second) of integrated NPU capability dedicated to process AI workloads, including the performance focused ThinkCentre M75t Gen 5, the flexible ThinkCentre M75s Gen 5, and the compact ThinkCentre M75q Gen 5. Designed to meet the diverse needs of modern business, the ThinkCentre M75 Gen 5 family of desktops harnesses the AI capability of its component while optimizing its energy efficiency to deliver impressive results.

"The AI PC era is already here and at Lenovo we are embracing it to unlock new possibilities," said Sanjeev Menon, vice president and general manager, Worldwide Desktop Business in Intelligent Devices Group, Lenovo. "The need for businesses to integrate AI into their operations continues to grow and our ThinkCentre M75 family of desktops, with a strong and stable power supply, the ability to upgrade components when needed, and the space to expand memory and optimize thermal management are the ideal options to enhance productivity with AI without heavy investments. Lenovo and AMD have a long-standing partnership focused on delivering value to our customers and we know users will be delighted by the leap in performance of our new desktops."

KLEVV today announced the CRAS C925 line of mid-range M.2 NVMe SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, to provide sequential transfer speeds of up to 7400 MB/s reads, and up to 6500 MB/s sequential writes, depending on the model. There are three of these based on capacity—500 GB, 1 TB, and 2 TB. All three offer up to 7400 MB/s sequential reads, while the maximum write speeds are up to 6200 MB/s for the 500 GB model, up to 6300 MB/s for the 1 TB model, and up to 6500 MB/s for the 2 TB model. Both the 500 GB and 1 TB models offer up to 670,000 IOPS 4K random reads, and up to 980,000 IOPS random writes; while the 2 TB model does up to 700,000 IOPS random reads, with up to 1 million IOPS random writes.

The KLEVV CRAS C925 combines a MaxioTech MAP1602 DRAMless controller with an unspecified brand of 3D TLC NAND flash memory. The drive features a single-sided design, in that even the top 2 TB model has all its components on one side of the PCB. You can use the included aluminium heat-spreader that reduces temperatures by 12%, or the heatsink your motherboard includes. KLEVV rates the write endurance of these drives at 600 TBW for the 500 GB model, 1,200 TBW for the 1 TB model, and 2,400 TBW for the 2 TB model. The company is backing the drives with a 5-year warranty. The company didn't reveal pricing, but mentioned that the drives will be available from May 2024.

At Embedded World 2024 in Nuremberg, Germany, industrial grade storage brand KingSpec (also known as YANSEN) presented its 2.5" SSD specialized for in-vehicle storage solutions. Embedded World serves as a global platform gathering industry-leading enterprises, technologies, and experts. At this exhibition, YANSEN showcased a solution specifically designed for in vehicle, rail transit and surveillance industries. With the rapid growth of electric vehicles and intelligent connected cars, the demand for reliable, high-capacity in-vehicle data storage is soaring. Secure storage solutions are becoming more essential. YANSEN's 2.5" in-vehicle SSD is engineered specifically for challenging transportation applications.

Rail transit operations face challenging conditions, requiring storage hardware capable of enduring wide temperature ranges, vibrations, and humidity. The 2.5" in-vehicle SSD has undergone rigorous testing beyond industry standards, with an operating temperature range of 0°C to 70°C and an MTBF exceeding 2 million hours. The product features conformal coating and underfill dispensing design to ensure data integrity even in extreme environments.

Lexar, a leading global brand of flash memory solutions, is excited to announce their lineup of products to be shown at the 2024 NAB Show, from April 14-17 at the Las Vegas Convention Center. The Lexar products deliver the high-speed performance that professional videographers, filmmakers, and creators demand in their cameras while also accelerating workflows.
Lexar's new Rugged Series includes the ARMOR GOLD SD UHS-II V60 Card. This card offers a max read speed of 280 MB/s and a max write speed of 210 MB/s, features an IP68 rating, and supports seamless 6K video capture. The ARMOR SILVER PRO SD UHS-II V60 Card also clocks in at a max read speed of 280 MB/s and delivers a write speed of 160 MB/s. It is also rated IP68 and supports 6K video as well. In the SSD category, the ARMOR 700 Portable SSD leverages USB 3.2 Gen 2x2 to provide max read/write speeds of 2000 MB/s1 and an IP66 rating lets users know that its design protects against both water and dust and is built to withstand up to 3-meter drops and falls.

Lexar is also excited to announce a new line of products dedicated to improving the professional workflow. The Lexar Professional PRO WORKFLOW is a 6-bay dock designed to maximize efficiency in the studio by allowing professionals to customize a solution with the modules they need. It is compatible with a range of WORKFLOW readers for CFexpress Type B and Type A 4.0 cards, SD and microSD UHS-II cards, and portable SSDs. It adopts Thunderbolt 4 and supports speeds up to 40 Gbps. The Lexar Professional PRO WORKFLOW GO is a portable solution that allows users to back up on location without a laptop. This 2-bay dock is battery-powered and supports speeds up to 10 Gbps.

Micron Technology, Inc., today announced it is sampling the automotive-grade Micron 4150AT SSD, the world's first quad-port SSD, capable of interfacing with up to four systems on chips (SoCs) to centralize storage for software-defined intelligent vehicles. The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface and ruggedized automotive design. With these features, the automotive-grade SSD provides the ecosystem with data center-level flexibility and power.

"As storage requirements race to keep up with rich in-vehicle experiences featuring AI and advanced algorithms for higher levels of autonomous safety, this era demands a new paradigm for automotive storage to match," said Michael Basca, Micron vice president of embedded products and systems. "Building on our collaboration with the innovators redefining next-generation automotive architectures, Micron has reimagined storage from the ground up to deliver the world's first quad-port SSD - the Micron 4150AT - which provides the industry flexibility and horsepower to roll out the transformative technologies on the horizon."

Sabrent today debuted the Rocket 4 line of DRAMless M.2 NVMe Gen 4 SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, and provide sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.4 GB/s writes. The drives also offer 4K random access performance of up to 1 million IOPS reads, and 0.95 million IOPS writes. For now, Sabrent is launching 1 TB and 2 TB capacity variants of the Rocket 4, but the company is preparing to launch a larger 4 TB variant soon.

The Sabrent Rocket 4 combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash memory (also known as the BiCS 6). There's just a copper foil heat spreader to keep things cool. The 12 nm E27T doesn't run anywhere near as hot as the E18, so you can make do with the heatsink your motherboard includes, or run it the way it is. The 1 TB variant is priced at $99.99, and the 2 TB variant at $199.99. The company didn't reveal pricing of the unreleased 4 TB variant.

T-CREATE, the creator brand of leading memory provider Team Group Inc., today launched the T-CREATE CinemaPr product series that is designed specifically for filming. With versatility in mind, the product line is meticulously designed to meet the diverse needs of professional users. The CinemaPr logo is inspired by pixels and consists of nine squares with a strategically placed red square in the upper right corner that ingeniously represents "REC." This concept embodies the continuous recording and preservation of every precious frame, empowering content creation with real-time shooting, editing, and cutting-edge technology.

The first product unveiled from the T-CREATE CinemaPr series is the T-CREATE CinemaPr P31 Portable External SSD. Tailored for professional photographers and videographers, this product is designed to seamlessly integrate with professional cages for cameras, DSLRs, and smartphones. It features a groundbreaking patented design with 12 screw holes (compatible with standard 1/4'' screw hole cages) and comes with a set-screws bundle. This innovative design eliminates the constraints of traditional locking point designs, allowing for easy installation on professional cages. Featuring a USB Type-C interface, the CinemaPr P31 Portable External SSD boasts a maximum transfer speed of 2,000 MB/s, ensuring effortless storage of large files in various encoding formats to empower creators to capture every moment in stunning detail.

YMTC X3-6070 3D QLC NAND flash chips are claimed by the company to offer endurance comparable to 3D TLC NAND flash chips from its competitors, ITHome reports. The company launched the new NAND flash chip at an event earlier this week. The X3-6070 is based on YMTC's 3rd Generation Xtracking architecture, and is 128-layer, which may not sound very competitive, given that other brands have moved up to 176-layer, or 232-layer; but YMTC says that the 128-layer design-choice is one of the four key ingredients to achieving high endurance for this chip.

The other three ingredients are innovations in the materials making up the NAND flash physical layer, new error-correction algorithms, and optimizations at the level of the SSD controller. The X3-6070 can sustain 4,000 P/E cycles per cell, YMTC claims, which is in league of contemporary 3D TLC NAND flash chips. It is able to do so, at lower costs from the QLC architecture. Besides the X3-6070, YMTC also launched a few first-party reference design SSDs that fully implement the controller-level optimizations needed for the chip to perform and endure as advertised.

TrendForce projects a strong 13-18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative. The slight dip in Q2 NAND Flash purchasing—compared to Q1—does not detract from the overall market's momentum, which continues to be influenced by decreasing supplier inventories and the impact of production cuts.

eMMC demand is predominantly driven by Chinese smartphone brands, leading to a substantial boost in shipments from Chinese module makers as some suppliers have reduced their supply. Buyers are increasingly adopting solutions from module makers to meet production needs, enhancing the technological advancement of Chinese module factories and their outreach to premier clients. This trend is likely to increase the penetration of eMMC products among smartphone customers, with a projected 10-15% rise in eMMC contract prices in Q2 due to a sharp rebound in NAND Flash wafer prices.

MSI, a global leader in gaming PC hardware, is thrilled to announce the release of its highly anticipated SSD powerhouse, the SPATIUM M580 FROZR, ushering in a new era of storage performance. With cutting-edge technology and innovative thermal solutions, this SSD is set to redefine the standards of speed and reliability in storage solutions.

SPATIUM M580 FROZR, Reaching New Heights with Crowned Speeds
The SPATIUM M580 FROZR sets a new benchmark in storage performance with its revolutionary features. Powered by the state-of-the-art PHISON E26 PCIe Gen 5 controller and equipped with advanced 3D NAND flash modules boasting 232 layers, this SSD achieves mind-blowing read speeds of up to 14.6 GB/s and write speeds of up to 12.7 GB/s, up to 2 times faster transfer rates compared to current PCIe 4.0 SSDs. This represents a significant leap in speeds, boosted by a DRAM cache buffer and a SLC Cache, providing users with lightning-fast data access and gaining valuable milliseconds in latency for gaming, content creation, and professional applications. Additionally, the M580 FROZR is fortified with LPDC ECC and E2E Data Protection, ensuring data integrity and reliability. With a high TBW (Terabytes Written) value and backed by a comprehensive 5-year warranty, users can trust in the durability and longevity of the SPATIUM M580 FROZR in 1 TB, 2 TB and 4 TB variants after an easy installation.

Greenliant is now sampling its new NVMe NANDrive ball grid array (BGA) solid state drives (SSDs) to customers requiring reliable, high performance data storage for embedded systems used in high stress, extreme environments. Operating between -40 and +95 degrees Celsius, NVMe NANDrive SSDs support the PCIe Gen3x4 interface and are built in an industry standard M.2 1620 (16 x 20 mm, 291-ball) package. See NVMe NANDrive information at https://bit.ly/NVMe-BGA-SSD.

"Building on our proven track record with PATA, SATA and eMMC NANDrive, Greenliant delivers another outstanding high reliability BGA SSD, now with the high speed PCIe NVMe interface, and features that meet the requirements of the most demanding applications," said Arthur Kroyan, vice president, business development and marketing, Greenliant."

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

Leaked Samsung PBSSD presentation material popped up online a couple of days prior to the kick-off day of NVIDIA's GTC 2024 conference (March 18)—reports (at the time) jumped on the potential introduction of a "petabyte (PB)-level SSD solution," alongside an enterprise subscription service for the US market. Tom's Hardware took the time to investigate this matter—in-person—on the showroom floor up in San Jose, California. It turns out that interpretations of pre-event information were slightly off—according to on-site investigations: "despite the name, PBSSD is not a petabyte-scale solid-state drive (Samsung's highest-capacity drive can store circa 240 TB), but rather a 'petascale' storage system that can scale-out all-flash storage capacity to petabytes."

Samsung showcased a Supermicro Petascale server design, but a lone unit is nowhere near capable of providing a petabyte of storage—the Tom's Hardware reporter found out that the demonstration model housed: "sixteen 15.36 TB SSDs, so for now the whole 1U unit can only pack up to 245.76 TB of 3D NAND storage (which is pretty far from a petabyte), so four of such units will be needed to store a petabyte of data." Company representatives also had another Supermicro product at their booth: "(an) H13 all-flash petascale system with CXL support that can house eight E3.S SSDs (with) four front-loading E3.S CXL bays for memory expansion."

InnoGrit's low-wattage 12 nanometer IG5666 controller popped up on the T-FORCE GE PRO PCIe 5.0 SSD series earlier in the year, but attention has turned to another consumer-grade design. Parent company—Yingren Technology—is not well known outside of China, although its InnoGrit brand has started to make inroads within Western markets. The enterprise-level YRS900 PCIe 5.0 SSD controller was announced last September—this open-source RISC-V-based solution was designed/engineered to "align with U.S. export restrictions." According to cnBeta and MyDrivers reports, a new YRS820 controller has successfully reached the mass production phase. This is a PCIe 5.0 consumer-grade controller, likely derived from its big sibling (YRS900).

According to InnoGrit presentation material, their new model is based on: "RISC-V instruction architecture, adopts a 4-channel PCIe 5.0 interface, is equipped with 8 NAND flash memory channels, supports NVMe 2.0 protocol, has an interface transmission rate of 2667MT/s, can be paired with 3D TLC/QLC, and supports a maximum capacity of up to 8 TB." Company representatives stated that the YRS820 controller is destined to be fitted on high-end consumer parts—the AI PC market segment is a key goal, since the YRS820 is able to: "accelerate data processing for specific applications and have high stability, consistency and security." cnBeta highlighted some anticipated performance figures: "YRS820 achieves sequential read 14 GB/s, sequential write 12 GB/s, random read and random write up to 2000K IOPs and 1500K IOPs respectively." InnoGrit did not reveal a release timetable, since their latest consumer-grade controller is going through a validation process. The company is currently collaborating with domestic NAND flash memory and DRAM manufacturers, as well as other industry bodies.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today it had developed a line of Industrial Temp solid-state drives specifically for system builders and design engineers that require a wider operating temperature range for extreme environments. These SSDs are designed for devices such as self-serve kiosks, digital signage, robots, point of sale, and military and agriculture applications among others.

With support for SATA interfaces, these industrial SSDs will be available in 128 GB through 1 TB capacities in industrial operating temperature range (-40°C to 85°C) to address climate-controlled and non-climate-controlled environments. Kingston i-Temp SATA SSDs include 2.5-inch and M.2 2280 form factors to offer advanced SATA 3, 6 Gbps controllers that automatically perform wear-leveling, garbage collection and other vital NAND Flash management features. They also incorporate high speed next-generation 3D NAND Flash Memory and are drop-in replacements for HDDs delivering higher reliability and up to 20x greater performance.

All industrial grade controller and NAND components are carefully screened and tested to certify proper functionality. Designed with specialized firmware to provide thermal management via throttling, and if necessary, shutdown to help protect data. System builders and their end customers can feel protected with lifecycle management, including a controlled bill of material and a locked firmware code that ensures the SSD that qualifies at the beginning stage of their project is the same SSD they will purchase throughout. Additionally, if ever needed, product change and end-of-life notification support as well as engineering and failure analysis resources are provided.

SK hynix is displaying its latest AI memory technologies at NVIDIA's GPU Technology Conference (GTC) 2024 held in San Jose from March 18-21. The annual AI developer conference is proceeding as an in-person event for the first time since the start of the pandemic, welcoming industry officials, tech decision makers, and business leaders. At the event, SK hynix is showcasing new memory solutions for AI and data centers alongside its established products.

Showcasing the Industry's Highest Standard of AI Memory
The AI revolution has continued to pick up pace as AI technologies spread their reach into various industries. In response, SK hynix is developing AI memory solutions capable of handling the vast amounts of data and processing power required by AI. At GTC 2024, the company is displaying some of these products, including its 12-layer HBM3E and Compute Express Link (CXL)1, under the slogan "Memory, The Power of AI". HBM3E, the fifth generation of HBM2, is the highest-specification DRAM for AI applications on the market. It offers the industry's highest capacity of 36 gigabytes (GB), a processing speed of 1.18 terabytes (TB) per second, and exceptional heat dissipation, making it particularly suitable for AI systems. On March 19, SK hynix announced it had become the first in the industry to mass-produce HBM3E.

Lexar, a leading global brand of flash memory solutions, is excited to introduce the SL500 Portable SSD, the latest addition to its portable SSD lineup. Featuring a super-slim, solid aluminium unibody construction that fits in the palm of your hand, the Lexar SL500 Portable SSD delivers exceptional 2000 MB/s max read and 1800 MB/s max write speeds for maximized efficiency.

The SL500 Portable SSD is compatible with a wide range of devices. It is a slim and convenient companion for the iPhone 15 series, serving as a backup for photos, videos, and more. It pairs especially well with iPhone 15 Pro and iPhone 15 Pro Max devices. It supports Apple Pro Res Recording allowing users to shoot directly to the drive in 4K at up to 60 FPS. Paired with Mac OSX 10.6+, Windows 11/10/7/8, or Android 4.4+, it offers substantial extra storage. It can also be used to store massive game files for PlayStation 4, PlayStation 4 Pro, PlayStation 5 with system software version 4.50 or higher (playing or storing PS4 games; storing PS5 games), Xbox One, and Xbox Series X | S (playing or storing Xbox One games; storing Xbox Series X | S games). It also comes with Lexar DataShield, a 256-bit AES encryption software to keep files secure.

SK hynix unveiled a new consumer product based on its latest solid-state drive (SSD), PCB01, which boasts industry-leading performance levels at GPU Technology Conference (GTC) 2024. Hosted by NVIDIA in San Jose, California from March 18-21, GTC is one of the world's leading conferences for AI developers. Applied to on-device AI PCs, PCB01 is a PCIe fifth-generation SSD which recently had its performance and reliability verified by a major global customer. After completing product development in the first half of 2024, SK hynix plans to launch two versions of PCB01 by the end of the year which target both major technology companies and general consumers.

Optimized for AI PCs, Capable of Loading LLMs Within One Second
Offering the industry's highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s, PCB01 doubles the speed specifications of its previous generation. This enables the loading of LLMs required for AI learning and inference in less than one second. To make on-device AIs operational, PC manufacturers create a structure that stores an LLM in the PC's internal storage and quickly transfers the data to DRAMs for AI tasks. In this process, the PCB01 inside the PC efficiently supports the loading of LLMs. SK hynix expects these characteristics of its latest SSD to greatly increase the speed and quality of on-device AIs.

Thermaltake USA, the leading PC Case, Cooling, Power, and memory solutions, proudly announces the launch of twelve innovative models in the LCGS (Liquid Cooled Gaming System) Reactor series, available exclusively at Best Buy. This launch marks a significant milestone for Thermaltake, introducing the next generation of gaming PCs, meticulously designed with the newly unveiled The Tower 300 Micro Tower Chassis. These gaming powerhouses are equipped with the latest high-performance components, including the cutting-edge Intel Core 14th Gen i9/i7 processors, NVIDIA GeForce RTX 40 Super Series/4090 graphics cards, 32 GB of DDR5 5600 MT/s memory, and expansive 2 TB NVMe M.2 SSD storage.

Each system in the LCGS Reactor series boasts a 360 mm radiator liquid cooling solution, ensuring exceptional cooling performance and stability during intense gaming sessions. The addition of vibrant color options such as Snow, Black, Hydrangea Blue, and Turquoise adds a personalized touch to these systems, catering to gamers' and content creators' diverse tastes and styles. Tailored for the most demanding gamers and creative professionals, these pre-built gaming desktop PCs are assembled and rigorously tested by Thermaltake's skilled engineers in the USA, ensuring unparalleled build quality and reliability.

TrendForce reports that anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimize losses and lower costs in hopes of returning to profitability this year. Kioxia and WD led the charge from March, boosting their capacity utilization rates to nearly 90%—a move not widely adopted by their competitors.

TrendForce points out that to meet the demand surge in the second half of the year, especially given Kioxia and Western Digital's currently low inventory, the production increase is mainly targeting 112-layer and select 2D products. This strategy is expected not only to secure profitability within the year but also to contribute to a projected 10.9% rise in the annual NAND Flash industry supply bit growth rate for 2024.