Earlier this week, we got news of ASUS working on a design revision for its ROG Ally handheld game console to fix the positioning of its microSD card slot that was causing card and card-reader failures due to its location close to a thermal vent. It turns out that this revision is a whole different product, and ASUS is naming it the ROG Ally X. There's more to this console than simply a relocated microSD slot that won't fry your memory cards.

Apparently, ASUS has used the opportunity to give it a larger battery, and a larger M.2-2280 SSD bay, compared to the M.2-2242 slot on the original ROG Ally. This would open up end-users to the widest possible array of SSD choices. As a final bit of product differentiation, the ROG Ally X comes with a new black chassis trim. The larger battery makes the ROG Ally X heavier than the original. Besides these three hardware changes, the new ROG Ally X features the same kit as the original, and is hence expected to offer the same performance, albeit with improved battery life. ASUS is expected to formally launch the ROG Ally X on June 2, 2024.

Corsair today announced the launch of the MP700 PRO SE PCIe 5.0 SSD, capable of achieving sequential read speeds of up to 14,000 MB/sec and sequential write speeds up to 12,000 MB/sec. These impressive throughput figures are nearly twice as fast as what you'll see from the most capable PCIe 4.0 SSDs and up to 25 times faster than common SATA SSDs. The MP700 PRO SE is available in 2 TB and 4 TB capacities.

In addition to its phenomenal sequential read and write performance, the MP700 PRO SE takes advantage of the latest interface, controller, and NAND flash technologies to deliver outstanding random read and write performance - vital when it comes to transferring smaller files and serving as the primary OS drive. Experience faster load times for Windows, applications, and games, while transferring large files becomes a breeze. With native support for Microsoft DirectStorage, the MP700 PRO SE is ready to provide a gaming advantage not only in today's games but in tomorrow's too. The MP700 PRO SE performs at its best alongside the latest platforms such as Intel 14th Gen and AMD Ryzen 7000 series CPUs and PCIe 5.0 motherboards. However, it also maintains backwards compatibility with PCIe 4.0 motherboards, providing a clear upgrade path and ensuring the drive's longevity for years to come.

The MP700 PRO SE adheres to the industry standard M.2 2280 form factor, ensuring wide compatibility with a range of systems and platforms while maintaining ease of installation. Although the drive requires cooling to achieve optimal performance, the integrated M.2 cooling on most motherboards is more than capable. Additionally, the MP700 PRO SE is available with a stylish active cooler that keeps the drive running smoothly and minimizes throttling.

[Editor's note: Our in-depth review of the Corsair MP700 PRO SE 4 TB is now live]

Western Digital Corp. (NASDAQ: WDC) has expanded its SanDisk portfolio with the new 8 TB SanDisk Desk Drive, its highest capacity yet on an external desktop solid state drive (SSD). Featuring the speed and reliability of an SSD, this new class of drives gives content creators and business professionals an easy way to back up and access their high-resolution photos, videos and files quickly in a single, convenient location. From photo and video pros to tech enthusiasts, there are a growing number of digital creators generating massive amounts of content who need flexible high-capacity storage solutions to do more, faster.

"As digital content creation continues to soar, there is an increasing need for high-performing and high-capacity storage solutions to help manage and preserve it. Expanding our SSD portfolio is the first step in offering creators backup solutions that deliver the speed and flexibility they need to unlock their creativity," says Susan Park, Vice President, Consumer Solutions, Western Digital. "By next year, we expect to double the capacity of the SanDisk Desk Drive from 8 TB to 16 TB on a single desktop SSD."

TrendForce's latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13-18%, while NAND Flash contract prices have been adjusted to a 15-20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.

Before the 4/03 earthquake, TrendForce had initially predicted that DRAM contract prices would see a seasonal rise of 3-8% and NAND Flash 13-18%, significantly tapering from Q1 as seen from spot price indicators which showed weakening price momentum and reduced transaction volumes. This was primarily due to subdued demand outside of AI applications, particularly with no signs of recovery in demand for notebooks and smartphones. Inventory levels were gradually increasing, especially among PC OEMs. Additionally, with DRAM and NAND Flash prices having risen for 2-3 consecutive quarters, the willingness of buyers to accept further substantial price increases had diminished.

Corsair today announced the launch of the Corsair ONE i500 PC, a compact powerhouse packed with cutting-edge components and boasting high-end performance for content creators, AI-savvy professionals, and gamers. The sleek, space-saving design houses up to an NVIDIA GeForce RTX 4090 graphics card and Intel Core i9-14900K processor—both liquid cooled. Combined with next-gen DDR5 memory and 2 TB of NVMe SSD storage, the Corsair ONE i500 delivers the speed, storage, and reliability you'd expect from a high-end PC.

The Corsair ONE i500 PC is 30% smaller than a full-sized desktop PC but doesn't compromise on power. Modern liquid cooling delivers top-tier thermal efficiency, minimizing CPU and GPU temperatures while achieving faster performance, all while being noticeably quieter than traditional cooling. NVIDIA GeForce RTX 4090 and 4080 SUPER graphics cards power a quantum leap in framerates and AI-powered graphics, while Intel 14th Gen CPU architecture makes sure you game and multitask without compromise.

Thanks to recent developments in the AI field, and following in the wake of the world's recovery from COVID-19, the transition of factories to partial or full automation proceeds with unstoppable momentum. And the best place to learn about the latest technologies that aim to make this transition as painless as possible is at Automate 2024. This is North America's largest robotics and automation event, and it will be held in Chicago, Illinois from May 6 to 9.

Automate attracts professionals from around the world, and Apacer is no exception. Apacer team will be on hand to discuss the latest technological developments created by our experienced R&D team. Many of these developments were specifically created to reduce the pain points commonly experienced by fully automated facilities. Take CoreSnapshot, for example. This backup and recovery technology can restore a crashed system to full operation in just a few seconds, reducing downtime and associated maintenance costs. Apacer recently updated CoreSnapshot, creating CoreRescue ASR and CoreRescue USR. The name of CoreRescue ASR refers to Auto Self Recovery. This technology will harness AI to learn the system booting process and analyze how long a boot should take. If this average boot time is significantly longer than usual, the system will trigger the self-recovery process and revert to an earlier, uncorrupted version of the drive's content. CoreRescue USR offers similar functionality, except the self-recovery process is triggered by connecting a small USB stick drive.

Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion", the "Company" or "we") today announced its financial results for the quarter ended March 31, 2024. For the first quarter of 2024, net sales (GAAP) decreased sequentially to $189.3 million from $202.4 million in the fourth quarter of 2023. Net income (GAAP) decreased to $16.0 million, or $0.48 per diluted American Depositary Share of the Company ("ADS") (GAAP), from net income (GAAP) of $21.1 million, or $0.63 per diluted ADS (GAAP), in the fourth quarter of 2023.

For the first quarter of 2024, net income (non-GAAP) decreased to $21.6 million, or $0.64 per diluted ADS (non-GAAP), from net income (non-GAAP) of $31.3 million, or $0.93 per diluted ADS (non-GAAP), in the fourth quarter of 2023. All financial numbers are in U.S. dollars unless otherwise noted.

Kanguru announces their exceptional new line of hardware-based, internal self-encrypting drives designed to help organizations secure and protect their data. Under the Kanguru Defender Brand name customers know and trust, Kanguru is entering the internal hardware market with these new Defender internal hardware encrypted solid state drives. The self-encrypting SEDs are packed with security features to help organizations secure data on laptops and tablets, creating a secure data environment. The Defender SED's are also compliant with the Trusted Computing Group's Opal standard for secure drive architecture. In addition, Kanguru has partnered with Cigent, known for their innovative data security, device sanitation and ransomware prevention, to integrate additional cutting-edge endpoint protection into the suite of Kanguru Defender SED's.

Kanguru's military grade AES 256-bit hardware encryption is enforced on the entire drive using stand-alone, independent hardware-based encryption security, not just specific files or folders. These internal encrypted drives automatically lock themselves when powered off, making all data stored within, (including the Operating System) completely inaccessible.

SK hynix held a press conference unveiling its vision and strategy for the AI era today at its headquarters in Icheon, Gyeonggi Province, to share the details of its investment plans for the M15X fab in Cheongju and the Yongin Semiconductor Cluster in Korea and the advanced packaging facilities in Indiana, U.S.

The event, hosted by theChief Executive Officer Kwak Noh-Jung, three years before the May 2027 completion of the first fab in the Yongin Cluster, was attended by key executives including the Head of AI Infra Justin (Ju-Seon) Kim, Head of DRAM Development Kim Jonghwan, Head of the N-S Committee Ahn Hyun, Head of Manufacturing Technology Kim Yeongsik, Head of Package & Test Choi Woojin, Head of Corporate Strategy & Planning Ryu Byung Hoon, and the Chief Financial Officer Kim Woo Hyun.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2024. The Company posted KRW 71.92 trillion in consolidated revenue on the back of strong sales of flagship Galaxy S24 smartphones and higher prices for memory semiconductors. Operating profit increased to KRW 6.61 trillion as the Memory Business returned to profit by addressing demand for high value-added products. The Mobile eXperience (MX) Business posted higher earnings and the Visual Display and Digital Appliances businesses also recorded increased profitability.

The weakness of the Korean won against major currencies resulted in a positive impact on company-wide operating profit of about KRW 0.3 trillion compared to the previous quarter. The Company's total capital expenditures in the first quarter stood at KRW 11.3 trillion, including KRW 9.7 trillion for the Device Solutions (DS) Division and KRW 1.1 trillion on Samsung Display Corporation (SDC). Spending on memory was focused on facilities and packaging technologies to address demand for High Bandwidth Memory (HBM), DDR5 and other advanced products, while foundry investments were concentrated on establishing infrastructure to meet medium- to long-term demand. Display investments were mainly made in IT OLED products and flexible display technologies.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

"We are excited to deliver the industry's first 9th-gen V-NAND, which will bring future applications leaps forward. In order to address the evolving needs for NAND flash solutions, Samsung has pushed the boundaries in cell architecture and operational scheme for our next-generation product," said SungHoi Hur, Head of Flash Product & Technology at Samsung Electronics. "Through our latest V-NAND, Samsung will continue to set the trend for the high-performance, high-density solid state drive (SSD) market that meets the needs for the coming AI generation."

Renowned global memory brand Team Group Inc. is committed to providing consumers with diverse and optimal storage solutions. Today, it proudly unveils the Team Group MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs.

Team Group MP44Q M.2 PCIe 4.0 SSD utilizes the latest 3D QLC NAND, offering capacities of up to 4 TB. With the PCIe Gen 4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively. The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with Team Group's exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD's lifespan.

Micron Technology, Inc., today demonstrated its continued NAND technology leadership by announcing that its 232-layer QLC NAND is now in mass production and shipping in select Crucial SSDs, in volume production to enterprise storage customers and sampling to OEM PC manufacturers in the Micron 2500 NMVe SSD.

Micron 232-layer QLC NAND delivers unparalleled performance for use cases across mobile, client, edge and data center storage by leveraging these important capabilities:

• Industry-leading bit-density, up to 28% more compact than leading competitors' latest products
• Industry-leading NAND I/O speeds of 2400 MT/s, a 50% improvement over the prior generation
• 24% better read performance over the prior generation
• 31% better programming performance over the prior generation

Lenovo has unveiled a selection of ThinkCentre desktops powered by AMD Ryzen PRO 8000 Series desktop processors with up to 16 TOPS (trillion operations per second) of integrated NPU capability dedicated to process AI workloads, including the performance focused ThinkCentre M75t Gen 5, the flexible ThinkCentre M75s Gen 5, and the compact ThinkCentre M75q Gen 5. Designed to meet the diverse needs of modern business, the ThinkCentre M75 Gen 5 family of desktops harnesses the AI capability of its component while optimizing its energy efficiency to deliver impressive results.

"The AI PC era is already here and at Lenovo we are embracing it to unlock new possibilities," said Sanjeev Menon, vice president and general manager, Worldwide Desktop Business in Intelligent Devices Group, Lenovo. "The need for businesses to integrate AI into their operations continues to grow and our ThinkCentre M75 family of desktops, with a strong and stable power supply, the ability to upgrade components when needed, and the space to expand memory and optimize thermal management are the ideal options to enhance productivity with AI without heavy investments. Lenovo and AMD have a long-standing partnership focused on delivering value to our customers and we know users will be delighted by the leap in performance of our new desktops."

KLEVV today announced the CRAS C925 line of mid-range M.2 NVMe SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, to provide sequential transfer speeds of up to 7400 MB/s reads, and up to 6500 MB/s sequential writes, depending on the model. There are three of these based on capacity—500 GB, 1 TB, and 2 TB. All three offer up to 7400 MB/s sequential reads, while the maximum write speeds are up to 6200 MB/s for the 500 GB model, up to 6300 MB/s for the 1 TB model, and up to 6500 MB/s for the 2 TB model. Both the 500 GB and 1 TB models offer up to 670,000 IOPS 4K random reads, and up to 980,000 IOPS random writes; while the 2 TB model does up to 700,000 IOPS random reads, with up to 1 million IOPS random writes.

The KLEVV CRAS C925 combines a MaxioTech MAP1602 DRAMless controller with an unspecified brand of 3D TLC NAND flash memory. The drive features a single-sided design, in that even the top 2 TB model has all its components on one side of the PCB. You can use the included aluminium heat-spreader that reduces temperatures by 12%, or the heatsink your motherboard includes. KLEVV rates the write endurance of these drives at 600 TBW for the 500 GB model, 1,200 TBW for the 1 TB model, and 2,400 TBW for the 2 TB model. The company is backing the drives with a 5-year warranty. The company didn't reveal pricing, but mentioned that the drives will be available from May 2024.

At Embedded World 2024 in Nuremberg, Germany, industrial grade storage brand KingSpec (also known as YANSEN) presented its 2.5" SSD specialized for in-vehicle storage solutions. Embedded World serves as a global platform gathering industry-leading enterprises, technologies, and experts. At this exhibition, YANSEN showcased a solution specifically designed for in vehicle, rail transit and surveillance industries. With the rapid growth of electric vehicles and intelligent connected cars, the demand for reliable, high-capacity in-vehicle data storage is soaring. Secure storage solutions are becoming more essential. YANSEN's 2.5" in-vehicle SSD is engineered specifically for challenging transportation applications.

Rail transit operations face challenging conditions, requiring storage hardware capable of enduring wide temperature ranges, vibrations, and humidity. The 2.5" in-vehicle SSD has undergone rigorous testing beyond industry standards, with an operating temperature range of 0°C to 70°C and an MTBF exceeding 2 million hours. The product features conformal coating and underfill dispensing design to ensure data integrity even in extreme environments.

Lexar, a leading global brand of flash memory solutions, is excited to announce their lineup of products to be shown at the 2024 NAB Show, from April 14-17 at the Las Vegas Convention Center. The Lexar products deliver the high-speed performance that professional videographers, filmmakers, and creators demand in their cameras while also accelerating workflows.
Lexar's new Rugged Series includes the ARMOR GOLD SD UHS-II V60 Card. This card offers a max read speed of 280 MB/s and a max write speed of 210 MB/s, features an IP68 rating, and supports seamless 6K video capture. The ARMOR SILVER PRO SD UHS-II V60 Card also clocks in at a max read speed of 280 MB/s and delivers a write speed of 160 MB/s. It is also rated IP68 and supports 6K video as well. In the SSD category, the ARMOR 700 Portable SSD leverages USB 3.2 Gen 2x2 to provide max read/write speeds of 2000 MB/s1 and an IP66 rating lets users know that its design protects against both water and dust and is built to withstand up to 3-meter drops and falls.

Lexar is also excited to announce a new line of products dedicated to improving the professional workflow. The Lexar Professional PRO WORKFLOW is a 6-bay dock designed to maximize efficiency in the studio by allowing professionals to customize a solution with the modules they need. It is compatible with a range of WORKFLOW readers for CFexpress Type B and Type A 4.0 cards, SD and microSD UHS-II cards, and portable SSDs. It adopts Thunderbolt 4 and supports speeds up to 40 Gbps. The Lexar Professional PRO WORKFLOW GO is a portable solution that allows users to back up on location without a laptop. This 2-bay dock is battery-powered and supports speeds up to 10 Gbps.

Micron Technology, Inc., today announced it is sampling the automotive-grade Micron 4150AT SSD, the world's first quad-port SSD, capable of interfacing with up to four systems on chips (SoCs) to centralize storage for software-defined intelligent vehicles. The Micron 4150AT SSD combines market-leading features such as single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface and ruggedized automotive design. With these features, the automotive-grade SSD provides the ecosystem with data center-level flexibility and power.

"As storage requirements race to keep up with rich in-vehicle experiences featuring AI and advanced algorithms for higher levels of autonomous safety, this era demands a new paradigm for automotive storage to match," said Michael Basca, Micron vice president of embedded products and systems. "Building on our collaboration with the innovators redefining next-generation automotive architectures, Micron has reimagined storage from the ground up to deliver the world's first quad-port SSD - the Micron 4150AT - which provides the industry flexibility and horsepower to roll out the transformative technologies on the horizon."

Sabrent today debuted the Rocket 4 line of DRAMless M.2 NVMe Gen 4 SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, and provide sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.4 GB/s writes. The drives also offer 4K random access performance of up to 1 million IOPS reads, and 0.95 million IOPS writes. For now, Sabrent is launching 1 TB and 2 TB capacity variants of the Rocket 4, but the company is preparing to launch a larger 4 TB variant soon.

The Sabrent Rocket 4 combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash memory (also known as the BiCS 6). There's just a copper foil heat spreader to keep things cool. The 12 nm E27T doesn't run anywhere near as hot as the E18, so you can make do with the heatsink your motherboard includes, or run it the way it is. The 1 TB variant is priced at $99.99, and the 2 TB variant at $199.99. The company didn't reveal pricing of the unreleased 4 TB variant.

T-CREATE, the creator brand of leading memory provider Team Group Inc., today launched the T-CREATE CinemaPr product series that is designed specifically for filming. With versatility in mind, the product line is meticulously designed to meet the diverse needs of professional users. The CinemaPr logo is inspired by pixels and consists of nine squares with a strategically placed red square in the upper right corner that ingeniously represents "REC." This concept embodies the continuous recording and preservation of every precious frame, empowering content creation with real-time shooting, editing, and cutting-edge technology.

The first product unveiled from the T-CREATE CinemaPr series is the T-CREATE CinemaPr P31 Portable External SSD. Tailored for professional photographers and videographers, this product is designed to seamlessly integrate with professional cages for cameras, DSLRs, and smartphones. It features a groundbreaking patented design with 12 screw holes (compatible with standard 1/4'' screw hole cages) and comes with a set-screws bundle. This innovative design eliminates the constraints of traditional locking point designs, allowing for easy installation on professional cages. Featuring a USB Type-C interface, the CinemaPr P31 Portable External SSD boasts a maximum transfer speed of 2,000 MB/s, ensuring effortless storage of large files in various encoding formats to empower creators to capture every moment in stunning detail.

YMTC X3-6070 3D QLC NAND flash chips are claimed by the company to offer endurance comparable to 3D TLC NAND flash chips from its competitors, ITHome reports. The company launched the new NAND flash chip at an event earlier this week. The X3-6070 is based on YMTC's 3rd Generation Xtracking architecture, and is 128-layer, which may not sound very competitive, given that other brands have moved up to 176-layer, or 232-layer; but YMTC says that the 128-layer design-choice is one of the four key ingredients to achieving high endurance for this chip.

The other three ingredients are innovations in the materials making up the NAND flash physical layer, new error-correction algorithms, and optimizations at the level of the SSD controller. The X3-6070 can sustain 4,000 P/E cycles per cell, YMTC claims, which is in league of contemporary 3D TLC NAND flash chips. It is able to do so, at lower costs from the QLC architecture. Besides the X3-6070, YMTC also launched a few first-party reference design SSDs that fully implement the controller-level optimizations needed for the chip to perform and endure as advertised.

TrendForce projects a strong 13-18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative. The slight dip in Q2 NAND Flash purchasing—compared to Q1—does not detract from the overall market's momentum, which continues to be influenced by decreasing supplier inventories and the impact of production cuts.

eMMC demand is predominantly driven by Chinese smartphone brands, leading to a substantial boost in shipments from Chinese module makers as some suppliers have reduced their supply. Buyers are increasingly adopting solutions from module makers to meet production needs, enhancing the technological advancement of Chinese module factories and their outreach to premier clients. This trend is likely to increase the penetration of eMMC products among smartphone customers, with a projected 10-15% rise in eMMC contract prices in Q2 due to a sharp rebound in NAND Flash wafer prices.

MSI, a global leader in gaming PC hardware, is thrilled to announce the release of its highly anticipated SSD powerhouse, the SPATIUM M580 FROZR, ushering in a new era of storage performance. With cutting-edge technology and innovative thermal solutions, this SSD is set to redefine the standards of speed and reliability in storage solutions.

SPATIUM M580 FROZR, Reaching New Heights with Crowned Speeds
The SPATIUM M580 FROZR sets a new benchmark in storage performance with its revolutionary features. Powered by the state-of-the-art PHISON E26 PCIe Gen 5 controller and equipped with advanced 3D NAND flash modules boasting 232 layers, this SSD achieves mind-blowing read speeds of up to 14.6 GB/s and write speeds of up to 12.7 GB/s, up to 2 times faster transfer rates compared to current PCIe 4.0 SSDs. This represents a significant leap in speeds, boosted by a DRAM cache buffer and a SLC Cache, providing users with lightning-fast data access and gaining valuable milliseconds in latency for gaming, content creation, and professional applications. Additionally, the M580 FROZR is fortified with LPDC ECC and E2E Data Protection, ensuring data integrity and reliability. With a high TBW (Terabytes Written) value and backed by a comprehensive 5-year warranty, users can trust in the durability and longevity of the SPATIUM M580 FROZR in 1 TB, 2 TB and 4 TB variants after an easy installation.

Greenliant is now sampling its new NVMe NANDrive ball grid array (BGA) solid state drives (SSDs) to customers requiring reliable, high performance data storage for embedded systems used in high stress, extreme environments. Operating between -40 and +95 degrees Celsius, NVMe NANDrive SSDs support the PCIe Gen3x4 interface and are built in an industry standard M.2 1620 (16 x 20 mm, 291-ball) package. See NVMe NANDrive information at https://bit.ly/NVMe-BGA-SSD.

"Building on our proven track record with PATA, SATA and eMMC NANDrive, Greenliant delivers another outstanding high reliability BGA SSD, now with the high speed PCIe NVMe interface, and features that meet the requirements of the most demanding applications," said Arthur Kroyan, vice president, business development and marketing, Greenliant."

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.