Frore Systems has demonstrated the massive increase in performance possible with AirJet solid-state active cooling chips in the new Samsung Galaxy Book4 Edge 14", the thinnest Notebook on the market at just 10.9 mm. The proof-of-concept Samsung Galaxy Book4 Edge 14", upgraded with AirJet, achieves an incredible 50% increase in sustained CPU & AI performance, showing that now, consumers really can demand it all. Frore Systems will be showcasing the upgraded Samsung Notebook in January at CES 2025.

Frore Systems achieved the 50% performance boost in the Samsung Galaxy Book4 Edge 14", from 12 Watts to 18 Watts, by replacing the two large fans currently used in the Notebook with four AirJet chips. This innovative solution reduces the cooling solution footprint by 45% - the fans consuming 8,800 mm² of space vs the AirJet footprint of just 4,800 mm². Therefore, the extremely compact AirJet solution creates additional space inside the Galaxy Book4 Edge 14", potentially allowing for increasing the battery size from the current 55.9 Wh to 64.8 Wh - a 16% increase - improving video runtime from 20 hours to 23.2 hours.

NVIDIA's brand new 25 Watt "little tiny Jetson Nano" - the Jetson Orin Nano Super - capable of 67 trillion operations per second (TOPS) of AI performance, is going to generate a lot of heat that could limit its performance if the device isn't supported by adequate cooling. Thanks to the high AI performance of the Jetson Orin Nano Super, breakthrough AI models such as NVIDIA Isaac for robotics, NVIDIA Metropolis for vision AI, and NVIDIA Holoscan for sensor processing, NVIDIA Omniverse Replicator for synthetic data generation (SDG) and NVIDIA TAO Toolkit for fine-tuning pretrained AI models may now run at the Edge, delivering compute efficiency, reduced latency and data privacy. But without adequate heat dissipation, the Jetson Orin Nano Super will be forced to throttle, significantly reducing its performance and diminishing the capabilities of Edge AI applications supported including robotics, industrial automation, smart cities, healthcare, and retail analytics.

AirJet PAK 5C-25 from Frore Systems, can provide the full 25 Watts of cooling NVIDIA's Jetson Orin Nano Super needs. The AirJet PAK 5C-25 is a fully self-contained, autonomous, plug and play, solid-state active cooling thermal module, that is thin, silent, dustproof, water resistant, and enables the full performance of the Jetson Nano Super, even in the toughest operating conditions. The AirJet PAK 5C-25 can be combined with the Jetson Orin Nano Super to remove 25 Watts of heat, even in industrial grade casings that are ultra compact, silent, vibration free, dustproof and water-resistant. These industrial grade casings, enabled by the AirJet PAK, are massively smaller and lighter than comparable fanless casings that require large, heavy heat sinks to dissipate heat.

At CES 2024, Frore Systems, the pioneering developer of AirJet Mini, the world's first Solid-State Active Cooling Chip, unveiled the AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.

Building on the success of the original AirJet Mini, which garnered widespread recognition, including the prestigious COMPUTEX 2023 Golden Award and CES 2024 "Best of Innovation" Award, Frore Systems continues to accelerate the pace of innovation in thermal management. The AirJet Mini Slim, featuring the same groundbreaking solid-state active cooling design of its predecessor, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.

ZOTAC TECHNOLOGY, a global manufacturer focused on innovation, launches the world's first Mini PC featuring the AirJet Solid-State Active Cooling system, as well as a lineup of ARM-based, lightweight edge computing platforms based on the NVIDIA Jetson system on module (SoM).

ZBOX PI430AJ WITH AIRJET, THE WORLD'S FIRST SOLID-STATE ACTIVE-COOLED MINI-PC
First debuted at COMPUTEX 2023, the ZBOX PI430AJ with AirJet is the first product of its kind to feature revolutionary Solid-State Active Cooling technology. With each unit featuring two AirJet Mini Modules by Frore Systems, these thin, silent modules are capable of removing significant heat through rapid airflow, raising the ZBOX PI430AJ's thermal ceiling without compromising its form factor. Taking advantage of the newfound possibilities enabled by the AirJet, the ZBOX PI430AJ is equipped with an Intel Core i3 processor, 8 GB LPDDR5 memory, M.2 SSD storage slot, and more - all within a system the size of a deck of cards.

Frore Systems, the maker of AirJet Mini, the World's first solid-state active cooling chip, demonstrated record breaking large capacity SSD performance, in an industry first 64 TB SSD storage device with AirJet. The collaboration with OWC, a leader in reliable solutions for computer hardware, accessories, and software, showcases the 64 TB OWC Mercury Pro U.2 Dual storage device with silent active cooling using 8 AirJet Minis, unleashing performance and enabling the fastest, compact, 64 TB capacity SSD storage device in its class.

Heat is the single biggest problem facing the electronics industry, and SSDs are no exception. The excessive heat generated by the fully loaded operation of 64 TB SSD renders the device inoperable when using traditional cooling methods like noisy mechanical fans or bulky ineffective heat sinks. With AirJet, the 64 TB OWC Mercury Pro U.2 Dual storage device operates between 2200 MB/s to 2600 MB/s sustained sequential writes, enabling large scale data storage in a compact form factor for the first time. This is great news for industries like film and television, that need silent, fast, secure and large-scale storage in small portable packages. The live demonstration of the 64 TB OWC Mercury Pro U.2 Dual storage device is on display at the Flash Memory Summit 2023 in Santa Clara, California.

Phison Electronics, a global leader in NAND flash and storage solutions, announces a technology demonstration of unique customer-based solutions fully realized through the IMAGIN+ customization service at Flash Memory Summit 2023.

Phison has expanded its IMAGIN+ design service to include AI computational models and AI services solutions. Customers work with specialized Phison teams to design and engineer custom flash deployments that precisely address the data performance and endurance requirements of next generation products including those highly optimized for aiDAPTIV AI+ML workloads. With IMAGIN+ design services, Phison teams work hand-in-hand with customers to deliver AI-boosted SSD solutions that address demanding requirements.

Zotac has displayed a couple of interesting mini PCs at the Computex 2023 show, including the ZBOX Pico PIA430AJ, the world's first solid-state active cooled mini PC, as well as a new Magnus One, packing an NVIDIA RTX 4070 graphics card, and a small Edge mini PCs with AMD's Ryzen 7 7840U APU.

While the new Magnus One ERP74070C looks quite impressive packing a 16-core Intel Core i7-13700 CPU and DLSS 3-capable GeForce RTX 4070 12 GB graphics card, all in 8.33 liters chassis, the star of the show was definitely the small ZBOX Pico. The new ZBOX Pico PI430AJ features the Frore Systems AirJet solid-state active cooling technology. Based on an Intel Core i3-N300 8-core chip, it is cooled by two of these solid-state coolers, allowing Zotac to make the ZBOX Pico even thinner and quieter. The new ZBOX Pico packs 8 GB of LPDDR5 on-board memory, has a single M.2 2280 NVMe PCIe 4 slot, three USB 3.2 Type-C ports, and all the usual connectivity, like the WiFi 6, Bluetooth 5.2, Gigabit LAN, and HDMI 2.0 and DisplayPort 1.4 outputs. Zotac also showcased the new ZBOX Edge MA762 mini PC, which is based on AMD's Phoenix Ryzen 7 7840U 8-core APU with AMD Radeon 780M graphics, all packed in a 0.64 liters chassis. As far as we know, the Ryzen 7 7840U should also feature the XDNA AI Accelerator (Ryzen AI) as well, and it is the fastest Ryzen Phoenix U-series APU with 15-30 W TDP.

Today, ZOTAC Technology launched the ZOTAC ZBOX PI430AJ with AirJet, the first Mini-PC to feature AirJet the world's first solid-state active cooling chip. The ZBOX PI430AJ with AirJet, at a mere 115 mm x 76 mm x 22 mm, now boasts twice the performance thanks to AirJet, making it the most powerful device in its class. AirJet cools devices with breakthrough technology that meets the ever-increasing demands of today's consumers. AirJet's compact size and unique capabilities enable faster, thinner, lighter, silent, and dustproof devices.

Heat is the single biggest problem facing the electronics industry, and until now, manufacturers have used antiquated thermal solutions like mechanical fans or bulky ineffective heat sinks to remove heat. These inadequate thermal solutions cause devices to rapidly overheat, forcing manufacturers to reduce device performance after only a few seconds of operation. This means consumers never really get the full processor performance they pay for.