Friday, June 27th 2025

Some Intel Nova Lake CPUs Rumored to Challenge AMD's 3D V-Cache in Desktop Gaming
Looking to challenge AMD's gaming CPU supremacy, Intel is reportedly developing Nova Lake processors with enhanced cache technology that could rival the popular 3D V-Cache found in X3D chips. According to leaker @Haze2K1, Intel plans to add "bLLC" (big Last Line Cache) to at least two Nova Lake models. This improved L3 cache is similar to AMD's 3D V-Cache, which has made X3D chips the top pick for enthusiast gamers since 2022. The new processors with bLLC will have 8 P-cores and 4 LP-E-Cores. One version will include 20 E-cores, while another will have 12 E-cores. Both are expected to keep a 125 W TDP rating.
Intel's bLLC technology already exists in Clearwater Forest server processors where local cache integrates into the base tile positioned beneath active tiles. This structural approach mirrors AMD's current 9000-series X3D design, where V-Cache attaches to the bottom of CPU dies—a significant improvement over earlier generations that placed cache on top, causing thermal issues and clock speed limitations. Yet, Intel said no to consumer plans for a technology similar to AMD's 3D V-Cache. In November 2024, Intel's Tech Communications Manager Florian Maislinger told YouTubers der8auer and Bens Hardware that they didn't plan such a desktop version. The Nova Lake-S family is set to hit the market in late 2026 or early 2027, with at least six desktop models using new LGA 1954 packaging. The lineup will start from the top-end Core Ultra 9 485K with 52 cores and 150 W TDP and go down to the basic Core Ultra 3 415K offering 12 cores at 125 W TDP.
Sources:
TechSpot, @Haze2K1 on X
Intel's bLLC technology already exists in Clearwater Forest server processors where local cache integrates into the base tile positioned beneath active tiles. This structural approach mirrors AMD's current 9000-series X3D design, where V-Cache attaches to the bottom of CPU dies—a significant improvement over earlier generations that placed cache on top, causing thermal issues and clock speed limitations. Yet, Intel said no to consumer plans for a technology similar to AMD's 3D V-Cache. In November 2024, Intel's Tech Communications Manager Florian Maislinger told YouTubers der8auer and Bens Hardware that they didn't plan such a desktop version. The Nova Lake-S family is set to hit the market in late 2026 or early 2027, with at least six desktop models using new LGA 1954 packaging. The lineup will start from the top-end Core Ultra 9 485K with 52 cores and 150 W TDP and go down to the basic Core Ultra 3 415K offering 12 cores at 125 W TDP.
140 Comments on Some Intel Nova Lake CPUs Rumored to Challenge AMD's 3D V-Cache in Desktop Gaming
I hope Intel gives it to AMD over this one.
I'm seeing why Intel is losing marketshare so fast. They're too far behind and their agility in the face of competition is on par with an ocean-faring supertanker. Let's be very generous and very optimistic and say that this rumour is accurate AND the gaming variants with extra cache are launching on time in the first wave of Nova Lake releases. If both those things are true, Intel might have an answer to AMD's X3D range a mere four years late.
To put that in perspective, four years ago Intel had just launched their back-ported Rocket Lake onto 2015's 14nm process, and the Radeon 6900XT was the most recent flagship GPU launch.
On that topic, Intel is already paying for advanced packaging so does it really cost that much more to include bLLC? Most of the desktop market is gamers so it's probably going to be more in demand than the non-bLLC chips, as AMD's pricing suggests ($305 for the 9700X and $472 for the 9800X3D). I imagine that statement, 'Intel plans to add "bLLC" (big Last Line Cache) to at least two Nova Lake models,' is a very conservative lower limit on the number of models. Last rumor I saw, Zen 6 was on N2X and Nova Lake on N2P, which would mean Nova Lake should come to market first. Although I think that rumor is unlikely; AMD is already skipping N3 entirely (except Zen 5c servers), waiting also for the most advanced N2 node would be a long wait.
Intel is sitting on a gold mine with its fabs but all that capacity is wasted making shitty Intel CPUs that less and less people want.
Also, according to Intel's patent:
Rentable Unit reduce the processing time better than hyper-threading technology since Northwood P-4.
Intel + intel or nvidia graphics is the default out there and what corporations buy for Windows. If they are going to move off intel for laptops and mini desktops it's going to be when Windows on ARM is good enough as more and more applications are just done in a browser now. It's not dirty tricks either here.
Stop thinking like a gamer. We are in the same situation as when it was Athalon 64. It dominated in servers and dual socket workstations when it came to corporations but for desktops it was all Pentium 4 and for laptops it was all Pentium M. Except this time around intels current products are actually only worse than AMDs when it comes to gaming and not for actual work. And again, gaming doesn't really count for work any more than masturbation does.
When it comes to the corporate world AMD is in servers and workstations you won't see it in other areas. Even then it will not be with an AMD GPU. And if the system is really important it's now not going to be using x86 at all. You're talking stuff from IBM. And at the server level we often aren't talking Windows at all but linux or Unix.
Let's see how long it'll take until the new CEO realizes the mistake.
Shame they aren't pushing nova lake to q4 2025 and are getting an arrowlake refresh
The biggest struggle was probably EUV lithogaphy. Intel stuck with multi-patterning DUV while TSMC had EUV with N7 in 2017 and N7+ later became their high volume node (2019, with apple buying most of the wafers i believe?) Intel's 10nm was solidly compatable to TSMCs 7nm for density and performance was there, but if your chip takes 30 steps of mask and etch with DUV and your competitor can do it in a handful with EUV, you just don't compete. Yours is harder to make, yours has more steps that can go wrong, and every day you have to problem solve your competitor gets more used to their new EUV process.
the EUV fumble alone put intel probably 5 years behind TSMC. TSMC also had a huge advantage being a foundry by service, they could go all in on the subtle data-driven tweaks here and there (the type of thing that turned a N7 into an N7+ or what ever optimized for lower power or higher frequency, etc) because they always had a big enough client to foot the bill for research, and enough clients in general to profit off the highly optimized nodes that followed. Intel made chips for Intel.
But the fact that Intel is here today with EUV on Intel 4 process, has great chiplet tech, and is bringing fancy vcache to the table, shows they know how to get back up from such a fall from grace. The question on my mind is can intel turn foundry as a service into the beast that can feed chip design once again.
Let's stop this myth of "Intel only failed because of 10nm", Intel's decline is due to Intel as an organisation failing across the board, the client group, data center group have all failed alongside the manufacturing group.