Looking to challenge AMD's gaming CPU supremacy, Intel is reportedly developing Nova Lake processors with enhanced cache technology that could rival the popular 3D V-Cache found in X3D chips. According to leaker @Haze2K1, Intel plans to add "bLLC" (big Last Line Cache) to at least two Nova Lake models. This improved L3 cache is similar to AMD's 3D V-Cache, which has made X3D chips the top pick for enthusiast gamers since 2022. The new processors with bLLC will have 8 P-cores and 4 LP-E-Cores. One version will include 20 E-cores, while another will have 12 E-cores. Both are expected to keep a 125 W TDP rating.

Intel's bLLC technology already exists in Clearwater Forest server processors where local cache integrates into the base tile positioned beneath active tiles. This structural approach mirrors AMD's current 9000-series X3D design, where V-Cache attaches to the bottom of CPU dies—a significant improvement over earlier generations that placed cache on top, causing thermal issues and clock speed limitations. Yet, Intel said no to consumer plans for a technology similar to AMD's 3D V-Cache. In November 2024, Intel's Tech Communications Manager Florian Maislinger told YouTubers der8auer and Bens Hardware that they didn't plan such a desktop version. The Nova Lake-S family is set to hit the market in late 2026 or early 2027, with at least six desktop models using new LGA 1954 packaging. The lineup will start from the top-end Core Ultra 9 485K with 52 cores and 150 W TDP and go down to the basic Core Ultra 3 415K offering 12 cores at 125 W TDP.

AMD is giving finishing touches to the Ryzen 5 9600X3D processor, which could improve the company's standing in the mid-range, against Intel's Core i5-14600K and Core Ultra 5 245K. This came to light when AMD inadvertently leaked the SKU in its processor support list for the recently launched Radeon AI R9700 graphics card. The Ryzen 5 9600X3D will likely be a 6-core/12-thread processor based on the "Granite Ridge" silicon with 3D V-Cache memory. The processor is based on the latest "Zen 5" microarchitecture.

3D V-Cache is 64 MB of stacked cache on top of the 32 MB on-die cache, for a total of 96 MB last-level cache. Clock speeds of the 9600X3D could end up similar to those of the 9600X, given that AMD has changed the way the L3D (3D V-Cache die) stacks with the CCD (CPU complex die), inverting them, such that the L3D serves as a base tile for the CCD on top, giving the 9600X3D similar thermal and overclocking characteristics to the regular 9600X. The introduction of 3D V-Cache could significantly improve the gaming performance of the 9600X3D over the 9600X, giving gamers in the sub-$300 processor market segment a compelling alternative to the i5-14600K and the 245K.

A little over a year has passed since we last heard rumors about AMD releasing a sub-$200 chip for price-conscious gamers, the Ryzen 5 5500X3D for AM4. Well those rumors recently became reality as leaker @Zed__Wang on X spotted it on AMD's website. The "new" AMD Ryzen 5 5500X3D is a six-core, twelve-thread processor built on the Zen 3 architecture using TSMC's 7 nm process. It operates at a base clock of 3 GHz with boost speeds up to 4 GHz (the old 5600X3D runs 3.3 GHz base and 4.4 GHz boost clocks), with a 105 W power budget. The processor features 384 KB of L1 cache, 3 MB of L2 cache, and a substantial 96 MB of L3 cache.

The 5500X3D's main selling point is its 3D V-Cache technology combined with AM4 socket compatibility for existing systems. If you already have an AM4 system and aren't ready for a complete upgrade, the 5500X3D could be worth considering as a drop-in performance boost. The decision will largely depend on pricing when it becomes available since currently it isn't yet listed on any e-commerce websites. For new builds, a modern AM5 processor like the Ryzen 5 7600X or 9600X would be a better choice, offering more future upgrade paths.

Early indications of AMD's next-generation Ryzen processors have surfaced as AIDA64's newest beta release adds initial support for Ryzen 10000 "Zen 6" desktop, server, and mobile chips. The update was noted by X user HXL, suggesting that AMD has quietly shared basic specifications with developers of hardware monitoring software. Looking back, AIDA64 tends to announce chip support almost a year before official launches, so these new processors may not appear until Computex 2026. Leaks from March 2025 suggest that AMD's Zen 6 desktop lineup, currently codenamed Medusa Ridge, will remain compatible with the existing AM5 socket. This news should please PC enthusiasts because it means many users will not have to replace their motherboards when upgrading. Reports indicate that Medusa Ridge CPUs may include 12-core chiplet dies, marking a step forward from previous architectures.

These chips are expected to be manufactured using TSMC's N3P process, which is designed to deliver improved power efficiency and higher frequencies. Additionally, a Zen 6-based X3D series is likely to feature a 3D V-Cache, targeting gamers. A model like the Ryzen 7 10800X3D could follow the success of the 9800X3D by offering strong performance at its price. On the mobile side, "Medusa Point" processors are rumored to incorporate up to 22 hybrid cores that combine performance and efficiency cores under the Zen 6 architecture. However, these mobile chips seem to be further off, with a launch window set for late 2026 or early 2027. Although AIDA64's beta edition now recognizes Ryzen 10000 series chips, AMD's usual schedule suggests we will not see them in shops until mid-2026 at the earliest. Still, compatibility with AM5 and a move to a more advanced process promise meaningful improvements when Zen 6 finally arrives.

AMD today announced financial results for the first quarter of 2025. First quarter revenue was $7.4 billion, gross margin was 50%, operating income was $806 million, net income was $709 million and diluted earnings per share was $0.44. On a non-GAAP(*) basis, gross margin was 54%, operating income was $1.8 billion, net income was $1.6 billion and diluted earnings per share was $0.96.

"We delivered an outstanding start to 2025 as year-over-year growth accelerated for the fourth consecutive quarter driven by strength in our core businesses and expanding data center and AI momentum," said Dr. Lisa Su, AMD chair and CEO. "Despite the dynamic macro and regulatory environment, our first quarter results and second quarter outlook highlight the strength of our differentiated product portfolio and consistent execution positioning us well for strong growth in 2025."

CPU-Z's Q1 2025 validation data indicates a new trend in CPU core count preferences among PC users. Eight-core processors now account for 24.7% of all validations, a significant increase of 32.6% compared to previous data. In contrast, six-core processors have declined to 22.5% of validations, down by 6.9%. The higher core count of eight-core CPUs aligns with the increasing demand for multithreaded performance in various computing environments, from professional workstations to high-end gaming systems. Market share figures also reveal adjustments in consumer preferences regarding CPU manufacturers. Intel retains a majority of presence with 56.3% of the market. However, AMD's share has risen notably at 43.7%, representing a 16.6% increase from the previous year.

The shift in market shares suggests that users are increasingly drawn to AMD's offerings, which include competitive eight-core processors. A key contributor to the trend toward eight-core CPUs is the rising popularity of specific models. The Ryzen 7 9800X3D, for example, has significantly impacted this new statistic, becoming the most popular CPU according to the CPU-Z validations. This indicates that users are interested in eight-core offerings with 3D V-Cache technology for increased gaming performance. The shift away from six-core configurations, which now represent a smaller portion of the validation data, shows that eight cores are now a sweet spot for many gamers. For multitasking and gaming, it seems like a perfect choice.

AMD's Ryzen 9 9950X3D processor with 16 cores, 32 threads, and 3D V-Cache is an exceptional content creation and gaming workload machine. However, MSI's proprietary BIOS features reportedly enable substantial performance headroom beyond stock settings. MSI's latest internal testing confirms that specific firmware configurations can deliver up to 14.5% performance improvements in demanding titles like Monster Hunter Wilds. The performance uplift hinges on firmware update, with MSI recommending the installation of chipset driver v7.01.08.129 or higher, which includes the critical AMD Application Compatibility Database driver. Users who update to BIOS versions featuring AGESA 1.2.0.3 or newer may encounter an "Unknown Device" in Device Manager, which can be resolved by installing the AMD Application Compatibility Database driver included in the latest chipset package. When paired with AGESA 1.2.0.3+ BIOS implementations, this configuration yields measurable framerate improvements of approximately 10% in Metro Exodus and 8% in Far Cry 6 at 1080p resolution compared to legacy firmware.

MSI's BIOS feature suite provides several optimization pathways. Memory Try It! delivers pre-configured memory timing profiles, while High-Efficiency Mode optimizes graduated memory bandwidth across four performance tiers. The X3D Gaming Mode modifies core and SMT configurations and provides additional gaming-specific enhancements, though potentially at the expense of multi-threaded application performance. Benchmark data from MSI demonstrates that implementing DDR5-8000 CL38 Memory Try It! profiles alongside "Tighter" High-Efficiency Mode settings and X3D Gaming Mode activation delivers a 14.5% performance uplift in Monster Hunter Wilds compared to baseline DDR5-4800 configurations, and approximately 8% over XMP DDR5-7200 settings. Titles like Shadow of the Tomb Raider and Far Cry 6 both recorded approximately 6% performance gains under similar test conditions. MSI cautions that memory overclocking implementations may impact system stability, while X3D Gaming Mode's thread management modifications could reduce performance in heavily multi-threaded workloads. Performance benefits will necessarily vary based on GPU capabilities and system configuration.

AMD's next-generation Zen 6-based "Medusa Point" mobile APUs will not feature RDNA 4 graphics as previously speculated, according to recent code discoveries in AMD GPUOpen Drivers on GitHub. The Device ID "GfxIp12" associated with RDNA 4 architecture has been reserved only for discrete GPUs, confirming that the current Radeon RX 9000 series will exclusively implement AMD's latest graphics architecture. Current technical documentation indicates AMD will instead extend RDNA 3.5 implementation beyond the Zen 5 portfolio while potentially positioning UDNA as the successor technology for integrated graphics.

The chiplet-based Medusa Point design will reportedly pair a single 12-core Zen 6 CCD manufactured on TSMC's 3 nm-class node with a mobile client I/O die likely built on N4P. This arrangement is significantly different from current monolithic mobile solutions. Earlier speculation indicates the Medusa Point platform may support 3D V-Cache variants, leveraging the same vertical stacking methodology employed in current Zen 5 implementations. The mobile processor's memory controllers and neural processing unit are expected to receive substantial updates. However, compatibility limitations with AMD's latest graphics features, like FSR 4 technology, remain a concern due to the absence of RDNA 4 silicon. The Zen 6-powered Medusa Point processor family is scheduled for release in 2026, targeting premium mobile computing applications with a performance profile that builds upon AMD's current Strix Halo positioning.

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

AMD has confirmed pricing and launch for its newest Ryzen 9000X3D series processors, with the flagship 9950X3D priced at approximately 5599 RMB and the 9900X3D at 4599 RMB, according to preliminary Chinese store JD listings. Both processors will hit retail channels on March 12, with review embargoes reportedly lifting one day prior, as noted by VideoCardz. The Ryzen 9 9950X3D delivers 16 Zen 5 cores with boost frequencies reaching 5.7 GHz and operates within a 170 W TDP envelope. Its unique feature is 144 MB of combined cache memory (L2, L3, and stacked 3D V-Cache).

The 9900X3D scales back to 12 cores with 5.5 GHz peak frequencies and 140 MB total cache while reducing power consumption to 120 W TDP. These processors represent AMD's implementation of vertical cache stacking technology on its 12+ core Zen 5 setup, completing its Q1 2025 desktop portfolio expansion following earlier standard Ryzen 9000 series launches and the eight-core Ryzen 7 9800X3D. The 3D V-Cache technology could help with many workloads, with gaming performance expected to show the most significant gains and productivity expected to follow. We have to wait for official reviews to bring further conclusions, but we hope to hear official confirmation on availability soon.

AMD's Ryzen 9000HX lineup of "Fire Range" Zen 5 mobile processors is due for release within a vague March to April window, with the upcoming 3D V-Cache-equipped Ryzen 9 9955HX3D SKU touted to become a top choice for manufacturers of ultra high-end gaming laptops. The latest version of CPU-Z is ready (in advance) with support for Team Red's incoming product line; CPUID's patch notes (published on February 8) have revealed previously unannounced models. AMD's official introduction of Ryzen 9000HX series CPUs included an opening salvo of Ryzen 9 9955HX3D (16-core), 9955HX (16-core) and 9850HX (12-core) models.

According to CPU-Z version 2.14, three additional "Fire Range" SKUs are seemingly on the way. Starting off with the Ryzen 9 9950HX3D—a (presumably) slightly less potent 3D V-Cache-sporting model—its nomenclature suggests that it will sit just below the series flagship. The 9950HX model is expected to slot just under the already announced 9955HX chip. The newly revealed 9845HX SKU could become the lowest 12-core offering within AMD's "Fire Range" product stack.

One of AMD's key announcements at its 2025 International CES keynote was the Ryzen 9000HX line of processors, codenamed "Fire Range." A successor to the 7000HX "Dragon Range," this is essentially a BGA package of the "Granite Ridge" MCM, which combines one or two "Zen 5" CCDs with a client I/O die. The processor lacks an NPU and has a basic iGPU, but is meant for enthusiast segment gaming notebooks and portable workstations, as it's meant to be paired with discrete GPUs, taking advantage of the package's lavish 28 PCIe Gen 5 lanes. The Ryzen 9 9955HX3D stands out in the series as the only model with 3D V-Cache, making it possibly the fastest mobile processor for gaming notebooks—faster than even the "Arrow Lake-HX," given how the desktop 9800X3D compares to the Core Ultra 9 285K at gaming.

Notebook OEM Dream Machines put out a press release which specifies that the first notebooks powered by the 9955HX3D will ship either toward the end of March, or early-April 2025. "Fire Range" is known to have scored design wins from several popular notebook OEMs, which means the chips could have a good run at the markets this generation. Notebooks powered by the 9955HX3D and discrete GPU options that include the GeForce RTX 5090 Laptop GPU and the RTX 5070 Ti Laptop GPU, are expected to be priced around €2,530 and €3,860, respectively.

While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

AMD today announced the Ryzen 9 9000HX and 9000HX3D line of mobile processors targeting enthusiast-segment gaming notebooks and portable workstations. These chips compete in the same market-segment as the Intel Core Ultra 200HX series. Codenamed "Fire Range," and powered by the "Zen 5" microarchitecture, the chip succeeds the "Zen 4" based "Dragon Range." This is essentially a thin BGA package of the desktop "Granite Ridge" chiplet-based processor, just the way "Dragon Range" relates to "Raphael." The chip has two "Zen 5" CCDs with full-sized "Zen 5" cores that are geared for high clock speeds, and have the full hardware FP implementation for AVX512, unlike the "Zen 5" cores on the "Strix Point" mobile processor.

AMD has, curiously, skipped single-CCD variants of "Fire Range," there are no Ryzen 7 9000HX models being announced today. There are just three processor-models—the Ryzen 9 9955HX3D, the Ryzen 9 9955HX, and the Ryzen 9 9850HX. The 9955HX3D is AMD's flagship mobile processor for gaming notebooks. It features a 16-core/32-thread configuration, and features 3D V-Cache memory on one of the two CCDs. The chip hence comes with 144 MB of "total cache" (L2 + L3). It ticks at 2.50 GHz base frequency, and can boost up to 5.40 GHz for the CCD with 3D V-Cache. It comes with a configurable TDP range of 55 W and 75 W. There is no NPU, but the client I/O die puts out a boatload of I/O that includes 28 PCIe Gen 5 lane, from which 24 are usable, so the discrete GPU has a PCI-Express 5.0 x16 connection, besides two M.2 NVMe Gen 5 connections directly from the processor.

AMD today expanded its Ryzen 9000X3D line of Socket AM5 desktop processors that combine the "Zen 5" microarchitecture with 3D V-Cache technology, with the introduction of two high core-count models, the Ryzen 9 9950X3D and the Ryzen 9 9900X3D. The 9950X3D is a 16-core/32-thread chip, while the 9900X3D is 12-core/24-thread. These are dual-CCD processors, and much like the Ryzen 9 7000X3D, the 3D V-Cache is only present on one of the two CCDs, while the other is a regular CCD with just the 32 MB on-die L3 cache. There is one key difference, though. Since AMD has redesigned 3D V-Cache for "Zen 5" to be below the CCD and not above, the CCD with it has the same clock speed boosting characteristics as the CCD without 3D V-Cache; and AMD has worked to refine its software-based OS scheduler optimization such that productivity applications favor either of the CCDs, while games stick to the one with 3D V-Cache.

The Ryzen 9 9950X3D comes with a base frequency of 4.30 GHz, and boosts up to 5.70 GHz, with a 170 W TDP. This is much higher than the 5.20 GHz maximum boost frequency of the Ryzen 7 9800X3D, which makes the 9950X3D the company's fastest gaming desktop processor. The Ryzen 9 9900X3D is similarly interesting—you get a base frequency of 4.40 GHz, and 5.50 GHz maximum boost frequency, which is higher than that of the 9800X3D, although the CCD with the 3D V-Cache only has 6 cores. The 9950X3D should hence end up beating the 9800X3D in gaming workloads, while the 9900X3D should be either on par or slightly slower than the 9800X3D at gaming, although faster than any chip from the non-X3D Ryzen 9000 series.

AMD is at the 2025 International CES, and we join them for a brisk run of what they have in store for us through the year. We expect some important announcements, such as the next-gen Radeon RX gaming GPUs powered by RDNA 4, a new flagship desktop processor powered by 3D V-Cache technology, HX-segment Ryzen 9000 series processors for gaming notebooks and portable workstations, the fabled "Strix Halo" chip AMD plans to surprise Apple with; and a fleshing out of its mobile processor portfolio.19:02 UTC: The show is underway.19:02 UTC: Jack Huynh takes centerstage.

Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, matching non-X3D variants. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. Early leaks indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.

The AMD Ryzen 7 9800X3D launched this November remains the fastest processor for PC gaming, but with just an 8-core/16-thread configuration, its performance in multithreaded productivity pales in comparison to the alternatives, including from AMD's own camp, such as the Ryzen 9 7950X3D. The company is planning to expand the Zen 5 X3D line of desktop processors in Q1-2025, with the introduction of its high core-count Ryzen 9 series SKUs, the Ryzen 9 9950X3D, and the Ryzen 9 9900X3D. HXL, a reliable source with hardware leaks, says that the Ryzen 9 X3D SKUs will lack the kind of "frequency debuff" we've seen with the older generation Ryzen 9 X3D chips such as the 7950X3D and 7900X3D.

On the 7950X3D, only one of the two 8-core CCDs comes with 3D V-Cache, the other is a regular CCD with 32 MB on-die L3 cache. The CCD with the 3D V-Cache has its frequency "debuffed" compared to the other CCD, mainly to deal with the thermal limitations of the way the 3D V-Cache is stacked on top of the CCD. With the Ryzen 9000 X3D generation, AMD has redesigned this CCD + L3D stacking such that the CCD is now above, directly interfacing with the STIM and IHS; with no conductive structural silicon along the way. This means that the CCD now thermally behaves like a regular Zen 5 CCD; and for this reason, not only will the CCD with 3D V-Cache on the 9950X3D/9900X3D have the same clock speeds and boosting behavior as the one without 3D V-Cache; but also the 9950X3D and 9900X3D are expected to ship with similar, if not identical clock speeds to the 9950X and 9900X.

During the prestigious IEDM 2024 conference, NVIDIA presented its vision for the future AI accelerator design, which the company plans to chase after in future accelerator iterations. Currently, the limits of chip packaging and silicon innovation are being stretched. However, future AI accelerators might need some additional verticals to gain the required performance improvement. The proposed design at IEDM 24 introduces silicon photonics (SiPh) at the center stage. NVIDIA's architecture calls for 12 SiPh connections for intrachip and interchip connections, with three connections per GPU tile across four GPU tiles per tier. This marks a significant departure from traditional interconnect technologies, which in the past have been limited by the natural properties of copper.

Perhaps the most striking aspect of NVIDIA's vision is the introduction of so-called "GPU tiers"—a novel approach that appears to stack GPU components vertically. This is complemented by an advanced 3D stacked DRAM configuration featuring six memory units per tile, enabling fine-grained memory access and substantially improved bandwidth. This stacked DRAM would have a direct electrical connection to the GPU tiles, mimicking the AMD 3D V-Cache on a larger scale. However, the timeline for implementation reflects the significant technological hurdles that must be overcome. The scale-up of silicon photonics manufacturing presents a particular challenge, with NVIDIA requiring the capacity to produce over one million SiPh connections monthly to make the design commercially viable. NVIDIA has invested in Lightmatter, which builds photonic packages for scaling the compute, so some form of its technology could end up in future NVIDIA accelerators

About a month ago, we reported about the AMD Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache that is flying off the shelves, with scalpers trying to make a profit from buying the retail inventory. The processor continues to face widespread availability issues more than a month after its launch, though the company assures consumers that relief is on the horizon. "We are working diligently to get as much supply to market as possible, with more processors being shipped every week," an AMD spokesperson told Tom's Hardware. "We expect availability to get better as shipments ramp throughout the quarter." The CPU is not only hard to find but also proves to be one of the most sought-after processors on Amazon.

The supply shortage has created opportunities for scalpers, who are listing the processor at prices reaching $1,000—more than double its retail price. Even established retailers like Walmart have listed the chip at inflated prices, approaching $800. Adding to consumers' challenges, some third-party sellers have posted fraudulent listings, making it crucial for buyers to verify seller credibility. While major retailers like Amazon, Newegg, Best Buy, and B&H Photo maintain the official $479 price point when in stock, securing a unit at this price has proven challenging for most consumers. As the holiday season is here, AMD's promised production ramp-up is much needed, as gamers have been planning their upgrade months in advance and are in dire need of pushing the performance of their systems up another notch.

AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

Unlike the Ryzen 7 9700X, which was off to a glacial start when it launched, the new Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache is flying off the shelves. This is the fastest gaming processor you can buy, and gamers want their best machines in place when the next generation of GPUs make landfall starting January 2025. As of this writing, the 9800X3D is out of stock on Newegg, Amazon, and Micro Center. The chip is, however, available through systems integrators and OEMs, who probably secured their inventory of the chip separately. A quick look over at eBay suggests that the 9800X3D is being scalped—the practice where individuals buy up inventory of the processor at retail prices, and re-sell it at a mark-up. We are seeing prices in the range of $670 to $800. There are probably limits to how high scalpers can price the 9800X3D, because at a high enough price, buyers could simply not be interested in the chip, and simply pick up a much cheaper 7800X3D, or the versatile 7950X3D, or even go Intel with the i9-14900K.

AMD Ryzen 7 9800X3D will be available to purchase from today, November 7, 2024. The 8-core/16-thread processor features 3D V-Cache technology, and is based on the "Zen 5" microarchitecture. AMD has priced the 9800X3D at $480 (MSRP). The processor was reviewed by TechPowerUp yesterday, we conclude that it is the fastest processor for a gaming PC build, posting the highest frame-rates at any resolution. It is 12% faster than Intel's flagship Core Ultra 9 285K "Arrow Lake" processor at gaming (at 1080p), although the processor falls behind in productivity workloads due to its significantly lower CPU core count than other CPUs, such as the cheaper Core i7-14700K or Core Ultra 7 265K. The 9800X3D is only around 5% faster than its predecessor, the 7800X3D, at gaming, although it is 13% faster than the 5800X3D.

You can read all about the AMD Ryzen 7 9800X3D in its TechPowerUp Review.

The latest update to CPU-Z, the popular system information and diagnostic tool, has rolled out comprehensive support for upcoming processor architectures from both AMD and Intel, along with new memory standards. Among the notable additions is support for AMD's Ryzen 7 9800X3D, which builds upon AMD's successful 3D V-Cache technology and is scheduled to launch tomorrow. The update also covers Intel's "Arrow Lake" processors, including both HX and H series variants. The Arrow Lake lineup integration spans multiple performance tiers, from the flagship Core Ultra 9 285HX down to the mainstream Core Ultra 5 series. The H-series mobile processors, including the Core Ultra 9 285H and various Ultra 7 and Ultra 5 models, are also fully supported.

Additionally, CPU-Z now recognizes Intel's complete Raptor Lake refresh, covering an extensive range of processors across different power segments. This includes the Core 7 series (160HL through 150U), Core 5 series (130HL through 120U), and Core 3 series (100HL through 100U), catering to various computing needs from high-performance to energy-efficient applications. The update extends beyond processors to support CUDIMM ((Clocked Unbuffered DIMM) DDR5 memory. CUDIMMs represent a modified DDR5 memory featuring an integrated Client Clock Driver (CKD) that generates its clock signal to minimize noise and jitter at speeds of 6400 MT/s and above, ensuring better stability and data integrity than traditional DDR5 modules.

DOWNLOAD CPU-Z 2.12 here.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.