While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

AMD today announced the Ryzen 9 9000HX and 9000HX3D line of mobile processors targeting enthusiast-segment gaming notebooks and portable workstations. These chips compete in the same market-segment as the Intel Core Ultra 200HX series. Codenamed "Fire Range," and powered by the "Zen 5" microarchitecture, the chip succeeds the "Zen 4" based "Dragon Range." This is essentially a thin BGA package of the desktop "Granite Ridge" chiplet-based processor, just the way "Dragon Range" relates to "Raphael." The chip has two "Zen 5" CCDs with full-sized "Zen 5" cores that are geared for high clock speeds, and have the full hardware FP implementation for AVX512, unlike the "Zen 5" cores on the "Strix Point" mobile processor.

AMD has, curiously, skipped single-CCD variants of "Fire Range," there are no Ryzen 7 9000HX models being announced today. There are just three processor-models—the Ryzen 9 9955HX3D, the Ryzen 9 9955HX, and the Ryzen 9 9850HX. The 9955HX3D is AMD's flagship mobile processor for gaming notebooks. It features a 16-core/32-thread configuration, and features 3D V-Cache memory on one of the two CCDs. The chip hence comes with 144 MB of "total cache" (L2 + L3). It ticks at 2.50 GHz base frequency, and can boost up to 5.40 GHz for the CCD with 3D V-Cache. It comes with a configurable TDP range of 55 W and 75 W. There is no NPU, but the client I/O die puts out a boatload of I/O that includes 28 PCIe Gen 5 lane, from which 24 are usable, so the discrete GPU has a PCI-Express 5.0 x16 connection, besides two M.2 NVMe Gen 5 connections directly from the processor.

AMD today expanded its Ryzen 9000X3D line of Socket AM5 desktop processors that combine the "Zen 5" microarchitecture with 3D V-Cache technology, with the introduction of two high core-count models, the Ryzen 9 9950X3D and the Ryzen 9 9900X3D. The 9950X3D is a 16-core/32-thread chip, while the 9900X3D is 12-core/24-thread. These are dual-CCD processors, and much like the Ryzen 9 7000X3D, the 3D V-Cache is only present on one of the two CCDs, while the other is a regular CCD with just the 32 MB on-die L3 cache. There is one key difference, though. Since AMD has redesigned 3D V-Cache for "Zen 5" to be below the CCD and not above, the CCD with it has the same clock speed boosting characteristics as the CCD without 3D V-Cache; and AMD has worked to refine its software-based OS scheduler optimization such that productivity applications favor either of the CCDs, while games stick to the one with 3D V-Cache.

The Ryzen 9 9950X3D comes with a base frequency of 4.30 GHz, and boosts up to 5.70 GHz, with a 170 W TDP. This is much higher than the 5.20 GHz maximum boost frequency of the Ryzen 7 9800X3D, which makes the 9950X3D the company's fastest gaming desktop processor. The Ryzen 9 9900X3D is similarly interesting—you get a base frequency of 4.40 GHz, and 5.50 GHz maximum boost frequency, which is higher than that of the 9800X3D, although the CCD with the 3D V-Cache only has 6 cores. The 9950X3D should hence end up beating the 9800X3D in gaming workloads, while the 9900X3D should be either on par or slightly slower than the 9800X3D at gaming, although faster than any chip from the non-X3D Ryzen 9000 series.

AMD is at the 2025 International CES, and we join them for a brisk run of what they have in store for us through the year. We expect some important announcements, such as the next-gen Radeon RX gaming GPUs powered by RDNA 4, a new flagship desktop processor powered by 3D V-Cache technology, HX-segment Ryzen 9000 series processors for gaming notebooks and portable workstations, the fabled "Strix Halo" chip AMD plans to surprise Apple with; and a fleshing out of its mobile processor portfolio.19:02 UTC: The show is underway.19:02 UTC: Jack Huynh takes centerstage.

Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, matching non-X3D variants. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. Early leaks indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.

The AMD Ryzen 7 9800X3D launched this November remains the fastest processor for PC gaming, but with just an 8-core/16-thread configuration, its performance in multithreaded productivity pales in comparison to the alternatives, including from AMD's own camp, such as the Ryzen 9 7950X3D. The company is planning to expand the Zen 5 X3D line of desktop processors in Q1-2025, with the introduction of its high core-count Ryzen 9 series SKUs, the Ryzen 9 9950X3D, and the Ryzen 9 9900X3D. HXL, a reliable source with hardware leaks, says that the Ryzen 9 X3D SKUs will lack the kind of "frequency debuff" we've seen with the older generation Ryzen 9 X3D chips such as the 7950X3D and 7900X3D.

On the 7950X3D, only one of the two 8-core CCDs comes with 3D V-Cache, the other is a regular CCD with 32 MB on-die L3 cache. The CCD with the 3D V-Cache has its frequency "debuffed" compared to the other CCD, mainly to deal with the thermal limitations of the way the 3D V-Cache is stacked on top of the CCD. With the Ryzen 9000 X3D generation, AMD has redesigned this CCD + L3D stacking such that the CCD is now above, directly interfacing with the STIM and IHS; with no conductive structural silicon along the way. This means that the CCD now thermally behaves like a regular Zen 5 CCD; and for this reason, not only will the CCD with 3D V-Cache on the 9950X3D/9900X3D have the same clock speeds and boosting behavior as the one without 3D V-Cache; but also the 9950X3D and 9900X3D are expected to ship with similar, if not identical clock speeds to the 9950X and 9900X.

During the prestigious IEDM 2024 conference, NVIDIA presented its vision for the future AI accelerator design, which the company plans to chase after in future accelerator iterations. Currently, the limits of chip packaging and silicon innovation are being stretched. However, future AI accelerators might need some additional verticals to gain the required performance improvement. The proposed design at IEDM 24 introduces silicon photonics (SiPh) at the center stage. NVIDIA's architecture calls for 12 SiPh connections for intrachip and interchip connections, with three connections per GPU tile across four GPU tiles per tier. This marks a significant departure from traditional interconnect technologies, which in the past have been limited by the natural properties of copper.

Perhaps the most striking aspect of NVIDIA's vision is the introduction of so-called "GPU tiers"—a novel approach that appears to stack GPU components vertically. This is complemented by an advanced 3D stacked DRAM configuration featuring six memory units per tile, enabling fine-grained memory access and substantially improved bandwidth. This stacked DRAM would have a direct electrical connection to the GPU tiles, mimicking the AMD 3D V-Cache on a larger scale. However, the timeline for implementation reflects the significant technological hurdles that must be overcome. The scale-up of silicon photonics manufacturing presents a particular challenge, with NVIDIA requiring the capacity to produce over one million SiPh connections monthly to make the design commercially viable. NVIDIA has invested in Lightmatter, which builds photonic packages for scaling the compute, so some form of its technology could end up in future NVIDIA accelerators

About a month ago, we reported about the AMD Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache that is flying off the shelves, with scalpers trying to make a profit from buying the retail inventory. The processor continues to face widespread availability issues more than a month after its launch, though the company assures consumers that relief is on the horizon. "We are working diligently to get as much supply to market as possible, with more processors being shipped every week," an AMD spokesperson told Tom's Hardware. "We expect availability to get better as shipments ramp throughout the quarter." The CPU is not only hard to find but also proves to be one of the most sought-after processors on Amazon.

The supply shortage has created opportunities for scalpers, who are listing the processor at prices reaching $1,000—more than double its retail price. Even established retailers like Walmart have listed the chip at inflated prices, approaching $800. Adding to consumers' challenges, some third-party sellers have posted fraudulent listings, making it crucial for buyers to verify seller credibility. While major retailers like Amazon, Newegg, Best Buy, and B&H Photo maintain the official $479 price point when in stock, securing a unit at this price has proven challenging for most consumers. As the holiday season is here, AMD's promised production ramp-up is much needed, as gamers have been planning their upgrade months in advance and are in dire need of pushing the performance of their systems up another notch.

AMD has recently filed a patent revealing plans to implement "multi-chip stacking" in future Ryzen SoCs, as Wccftech reports, quoting a post on X from @coreteks: "New patent from AMD shows how future Zen SoCs could look. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones". The patent details a new approach where smaller chiplets partially overlap with a larger die, creating space for additional components and functions on the same die. This strategy aims to improve the efficiency of the contact area, thus making room for higher core counts, larger caches, and increased memory bandwidth within the same die size. The proposed stacking will reduce the physical distance between components through overlapping chiplets, thus minimizing interconnect latency and achieving faster communication between different chip parts. The design will also improve power management, as the segregated chiplets allow for better control of each unit through power gating.

Even if long-time rival Intel has lost some of its momentum (and market share) this year, AMD's chance to push ahead with its intention to become number one in the market is to continue to innovate. In the same way that its 3D V-Cache technology made the X3D processor lineup so successful, this chip stacking approach could play a major role in future AMD Ryzen SoCs. It seems that AMD is committed to moving away from the monolithic design era and taking the road of multi-chiplet; however, it can be a long wait until (and if) this chip stacking will complete the journey from patents to design, production, and final product.

Unlike the Ryzen 7 9700X, which was off to a glacial start when it launched, the new Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache is flying off the shelves. This is the fastest gaming processor you can buy, and gamers want their best machines in place when the next generation of GPUs make landfall starting January 2025. As of this writing, the 9800X3D is out of stock on Newegg, Amazon, and Micro Center. The chip is, however, available through systems integrators and OEMs, who probably secured their inventory of the chip separately. A quick look over at eBay suggests that the 9800X3D is being scalped—the practice where individuals buy up inventory of the processor at retail prices, and re-sell it at a mark-up. We are seeing prices in the range of $670 to $800. There are probably limits to how high scalpers can price the 9800X3D, because at a high enough price, buyers could simply not be interested in the chip, and simply pick up a much cheaper 7800X3D, or the versatile 7950X3D, or even go Intel with the i9-14900K.

AMD Ryzen 7 9800X3D will be available to purchase from today, November 7, 2024. The 8-core/16-thread processor features 3D V-Cache technology, and is based on the "Zen 5" microarchitecture. AMD has priced the 9800X3D at $480 (MSRP). The processor was reviewed by TechPowerUp yesterday, we conclude that it is the fastest processor for a gaming PC build, posting the highest frame-rates at any resolution. It is 12% faster than Intel's flagship Core Ultra 9 285K "Arrow Lake" processor at gaming (at 1080p), although the processor falls behind in productivity workloads due to its significantly lower CPU core count than other CPUs, such as the cheaper Core i7-14700K or Core Ultra 7 265K. The 9800X3D is only around 5% faster than its predecessor, the 7800X3D, at gaming, although it is 13% faster than the 5800X3D.

You can read all about the AMD Ryzen 7 9800X3D in its TechPowerUp Review.

The latest update to CPU-Z, the popular system information and diagnostic tool, has rolled out comprehensive support for upcoming processor architectures from both AMD and Intel, along with new memory standards. Among the notable additions is support for AMD's Ryzen 7 9800X3D, which builds upon AMD's successful 3D V-Cache technology and is scheduled to launch tomorrow. The update also covers Intel's "Arrow Lake" processors, including both HX and H series variants. The Arrow Lake lineup integration spans multiple performance tiers, from the flagship Core Ultra 9 285HX down to the mainstream Core Ultra 5 series. The H-series mobile processors, including the Core Ultra 9 285H and various Ultra 7 and Ultra 5 models, are also fully supported.

Additionally, CPU-Z now recognizes Intel's complete Raptor Lake refresh, covering an extensive range of processors across different power segments. This includes the Core 7 series (160HL through 150U), Core 5 series (130HL through 120U), and Core 3 series (100HL through 100U), catering to various computing needs from high-performance to energy-efficient applications. The update extends beyond processors to support CUDIMM ((Clocked Unbuffered DIMM) DDR5 memory. CUDIMMs represent a modified DDR5 memory featuring an integrated Client Clock Driver (CKD) that generates its clock signal to minimize noise and jitter at speeds of 6400 MT/s and above, ensuring better stability and data integrity than traditional DDR5 modules.

DOWNLOAD CPU-Z 2.12 here.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

Just last week, AMD announced the arrival of its upcoming Ryzen 9000 series of CPUs with 3D V-Cache for November 7. However, we might be in for a treat, as AMD could be preparing Threadripper 9000WX/X series of CPUs with 3D V-Cache. According to VideoCardz, the ASUS Pro WS WRX90E-SAGE SE board appears to include an intriguing feature in its settings—there's a configuration option related to 3D V-Cache control, though this setting currently doesn't have any practical application with the available Threadripper 7000WX and 7000X processors. The presence of this setting hasn't been officially documented by ASUS, showing that this feature could indeed end up in future iterations of Threadripper processors, namely the 9000WX/X series.

AMD currently offers 3D V-Cache treatment in its high-end Genoa-X CPUs, with up to 96 cores and 192 threads, and 1,152 MB of L3 cache. These CPUs were praised for their capabilities in the high-performance computing sector, performing calculations at unprecedented rates thanks to the massive cache size and bandwidth. If AMD decides to opt-in for the HEDT market with 3D V-Cache, we might see an appearance with the upcoming Threadripper generation. However, right now, it is only speculation based on undocumented features in ASUS's high-end board. Even if these CPUs are planned, we are not near their launch as the priority is launching and shipping the consumer-oriented Ryzen 7 9800X3D CPU on November 7.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

AMD's upcoming Ryzen 9000X3D series of processors with 3D V-Cache have been reportedly scheduled to arrive in January 2025 and should make a debut at the CES event, a few months later than initially expected. While disappointing for eager enthusiasts, the delay could signify that AMD is taking extra precautions to ensure a smooth launch and deliver a product that meets the high-performance standards set by its previous 3D V-Cache offerings. Delaying the new product launch could also be a strategic move by AMD to avoid potential supply chain issues or to align the launch with other product announcements.

We previously reported that the series will maintain the same cache size configurations as the last generation with 3D V-Cache, and it will just be an upgrade to up the performance of the new Zen 5 design. The launch of the 9000X3D series follows a smaller six-month gap from the regular Ryzen 9000 series, where the previous Ryzen 7000X3D and 5000X3D followed seven and seventeen months after the launch of their regular SKUs, respectively.

If you're on the Socket AM4 platform, AMD is never gonna give you up, never gonna let you down, never gonna run around and desert you; never gonna make you cry, never gonna say goodbye, never gonna tell a lie, and hurt you. The company is reportedly giving finishing touches to a firecracker of a sub-$200 chip for price-conscious gamers, the Ryzen 5 5500X3D. That's right, AMD is bringing 3D V-cache technology to the mid-range, with a new 6-core processor based on the "Zen 3" microarchitecture, but enjoying the gaming performance boost from 96 MB of L3 cache on tap.

AMD already has a 6-core X3D Socket AM4 chip, the Ryzen 5 5600X3D, which joined the product stack a couple of years after AMD's original Ryzen 7 5800X3D took the gaming PC processor scene by storm, matching the then swanky new Core i9-12900K "Alder Lake" despite being based on an older-generation "Zen 3" architecture. Not much else is known about the 5500X3D, except that it could have a lower clock speed than the 5600X3D. Back in November 2023, when news of the 5700X3D first hit the scene, the 5500X3D was rumored to be a 6-core/12-thread chip with 3.00 GHz base frequency and 4.00 GHz maximum boost, compared to the 3.30 GHz base and 4.40 GHz boost frequency of the 5600X3D. Given that AMD launched the 5600X3D at $230, AMD could target a sub-$200 price point to wow gamers on AM4, such as $199.

AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.

Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

AMD Ryzen processors with 3D Vertical Cache technology, denoted with the "X3D" brand extension on processor model numbers, are showing unexpected popularity numbers with close to a quarter of respondents to a TechPowerUp Frontpage Poll question saying that they use one. In August, we asked our readers if they use a Ryzen X3D processor. The question was "Are you using an AMD Ryzen X3D CPU with 3D V-Cache?" This was a few months into the launch of the Ryzen 7000X3D processor series that restored the gaming performance leadership for AMD against Intel's 13th Gen Core "Raptor Lake" processors.

Since the poll went live in August, we've seen 31,862 responses. From these, 14,732, or 46% say that they use a classic Ryzen processor (one without 3D V-cache). followed by 9,780 or 31% saying they use an Intel processor; an impressive 4,316 or 14% saying they use a Socket AM4 Ryzen 5000X3D series processor (5800X3D or 5600X3D); followed by 3,034 or 10% saying they use the latest 7000X3D series "Zen 4" processors. The X3D series together make 7,350 votes, or 23%.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

ASUS Republic of Gamers (ROG) today announced the new ROG Strix SCAR 17 X3D, the perfect fusion of cutting-edge silicon and ROG engineering. Featuring the AMD Ryzen 9 7945HX3D mobile processor equipped with AMD 3D V-Cache technology for the very first time, the Strix SCAR 17 X3D takes performance to a whole new level. By doubling the L3 cache of the mighty Ryzen 9 7945HX processor, the Ryzen 9 7945HX3D gives users a boost in games that are hungry for this onboard ultrafast memory. Paired with a 240 Hz QHD display, Conductonaut Extreme liquid metal on the GPU, and a vapor chamber, the Strix SCAR 17 X3D is ready to dominate the leaderboards.

Making great processors even better
While the original 2023 ROG Strix SCAR 17 came equipped with AMD Ryzen 7000 Series processors, the AMD Ryzen 9 7945HX3D is truly in a league of its own. It leverages the power of AMD 3D V-Cache technology, a stacking of extra ultra-high-speed L3 cache vertically on top of one of the two core compute dies (CCD). This extra cache enables the eight cores to perform certain calculations quickly and efficiently, notably in gaming. For situations where increasing CPU frequency simply doesn't show significant performance gains, 3D V-Cache technology holds the potential to unlock extra compute power.

Tipsters have noticed that ASUS is preparing a new high-end laptop with an unannounced AMD processor—the upcoming ROG Strix SCAR 17-inch model (G733PYV-LL046W,) will apparently sport a Ryzen 9 7945HX3D APU (with 128 MB of L3 cache). The inclusion of "X3D" in the processor's name has generated a lot of interest, given that Team Red's 3D V-Cache technology has existed mainly within mainstream desktop-oriented Ryzen 7000 and 5000 processor lineups. This leaked dual-CCD APU is probably being lined up to take on upper-echelon Intel Raptor Lake-HX processors, as well as refreshed variants.

The leak indicates that this APU will likely sit at the top of the Zen 4-based Dragon Range-H lineup—being a 5.4 GHz max. boost clock, 16-core/32-thread CPU, with a configurable TDP (between 55 W and 75 W) and Radeon 610M iGPU. The host ASUS ROG Strix SCAR 17 laptop is no slouch thanks to some very generous hardware specifications, including a mobile NVIDIA RTX 4090 GPU, 32 GB of DDR5 memory, 2 TB SSD, and a 17.3" 240 Hz IPS display. Listed at 5599 AUD (~$3800) on Computer Alliance, or £3904.79 (~$5000) chez Lamba-Tek, you would expect the best possible performance for those prices. The two online retailers have not confirmed any concrete release dates for the high-end ASUS laptop.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.