ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

ASRock has released new BIOS to support the latest AMD Ryzen 7000 Series Processors with AMD 3D V-Cache Technology, with new BIOS on ASRock X670E/B650E/B650 motherboards, you may enjoy the enhanced gaming performance powered by AMD Ryzen 7000X3D series processors. The latest BIOS is already available to download on ASRock website, be sure to update to the latest BIOS to enjoy the ultimate gaming experience with AMD 3D V-Cache Technology.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce a list of compatible motherboards for AMD's newly announced AMD Ryzen 7000X3D processors. AMD Ryzen 7000X3D processors, which include the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D, promise unparalleled gaming and compute performance thanks to their groundbreaking 3D V-Cache technology. Expected to provide top-of-the-line performance for demanding users, BIOSTAR announces that their AMD-AM5 motherboards are ready to support these new processors.

Flagship tier X670E VALKYRIE, RACING series B650EGTQ, and B650M-SILVER motherboards are the first batch of compatible BIOSTAR motherboards, ready to take on the shiny new AMD Ryzen 7000X3D processors. They are engineered with cutting-edge technology to ensure smooth and efficient performance for high-end gaming and professional applications.

AMD's Ryzen 7000-series CPUs with 3D V-Cache are set to launch next week and alongside the launch, there will obviously be reviews of the upcoming CPUs. As with many other companies, AMD prepared a reviewers guide for the media, to give them some guidance, as well as expected benchmark numbers based on the test hardware AMD used in-house. Parts of that reviewers guide has now appeared online, courtesy of a site called HD Tecnologia. For those that can't wait until next week's reviews, this gives a glimpse of what to expect, at least based on the games tested by AMD.

AMD put the Ryzen 9 7950X3D up against Intel's Core i9 13900K, both systems were equipped with 32 GB of DDR5-6000 memory and liquid cooling. Tests were done with both AMD's own Radeon RX 7900 XTX and an NVIDIA GeForce RTX 4090 graphics card. We won't go into details of the various benchmarks here, as you can find those below, but according to AMD's figures, AMD came out on top with a 5.6 percent win over the Intel CPU, at 1080p using the Radeon RX 7900 XTX and by 6 percent using the GeForce RTX 4090. This was across 22 different games, with Horizon Zero Dawn and F1 2021 being the games favouring the AMD CPU the most and Far Cry 6 and the CPU test in Ashes of the Singularity being the games favouring the AMD CPU the least. TechPowerUp will of course have a review ready for your perusing by the time the new CPUs launches next week, so you'll have to wait until then to see if AMD's own figures hold true or not.

AMD is preparing to release the latest version of its Chipset software. Version 5.01.29.2026 WHQL should be of particular interest for users planning to buy an upcoming Ryzen 7000X3D series processor. The chipset driver includes the "3D V-Cache Performance Optimizer driver" component, version 1.0.0.7. This gives Windows a degree of awareness of the asymmetric nature of 3DV cache on the 16-core 7950X3D and 12-core 7900X3D, where only one of the two CCDs (chiplets) has the 3DV cache memory, while the other is a regular "Zen 4" CCD with 32 MB on-die L3 cache. This awareness should in theory improve performance in less-parallelized workloads (such as games). The AMD website doesn't yet list this driver, but it should appear as we head closer to the market-availability date of the 7950X3D and 7900X3D (February 28). From the looks of it, the optimization works for both Windows 11 and Windows 10, so those on the older operating system for reasons, can keep rocking it.

AMD's next-generation Ryzen 7000-series "Phoenix" mobile processors are all the rage these days. Bound for 2023, these chips feature a powerful iGPU based on the RDNA3 graphics architecture, with performance allegedly rivaling that of a GeForce RTX 3060 Laptop GPU—a popular performance-segment discrete GPU. What's more, AMD is also taking a swing at Intel in the CPU core-count game, by giving "Phoenix" a large number of "Zen 4" CPU cores. The secret ingredient pushing this combo, however, is a large cache.

AMD has used large caches to good effect both on its "Zen 3" processors, such as the Ryzen 7 5800X3D, where they're called 3D Vertical Cache (3D V-cache); as well as its Radeon RX 6000 discrete GPUs, where they're called Infinity Cache. The only known difference between the two is that the latter is fully on-die, while the former is stacked on top of existing silicon IP. It's being reported now, that "Phoenix" will indeed feature a stacked 3D V-cache.

An early retail unit of AMD's upcoming Ryzen 7 5800X3D has made its way to a Peruvian site called XanxoGamging, who put it through its paces in a few benchmarks, of which none so far are game related. The tests run on the upcoming CPU suggests that it's about as fast as a Ryzen 7 5700X in most single and multi-core tests. This should largely be down to the slower clock speeds of the Ryzen 7 5800X3D, which holds it back in these benchmarks compared to the older Ryzen 7 5800X.

However, it seems like some benchmarks can take advantage of the extra cache and the Ryzen 7 5800X3D is outperforming the 5800X in Blender, by a small margin. That said, the Cinebench R23 results are not overly impressive, neither are the CPU-Z or Geekbench 5 numbers. None of this is really unexpected though, especially as AMD has specifically mentioned that the 3D V-Cache doesn't bring additional performance to most software. XanxoGaming has promised more benchmarks and game tests tomorrow, but mentions that it feels strange losing performance in normal software due to the lower clocks, but that they hope the performance can be improved over time by an improved UEFI/AGESA.

Although not yet available directly from AMD, its latest chipset drivers, version 4.03.03.624, have been released by Gigabyte and possibly other motherboard partners and it contains a couple of interesting additions. The first one is support for USB4, albeit only for 64-bit versions of Windows 10 at this point in time. This part really only applies to the Zen 3+ "Rembrandt" mobile Ryzen 6000-series CPUs so far, as they're the only products from AMD that supports USB4 at this point in time.

The other interesting part is that AMD has included a 3D V-Cache Performance Optimizer Driver for both the 64-bit version of Windows 10 and Windows 11. As to what this driver does, is anyone's guess at this point in time, but it's likely to be some kind of cache scheduler, or possibly a means for AMD to allocate software that can't take advantage of the 3D V-Cache to the CPU native cache. We should be finding out in a couple of weeks time, as the Ryzen 7 5800X3D is scheduled for retail availability on the 20th of April.

The global leading motherboard manufacturer, ASRock, announces that with BIOS update, ASRock AMD X570/B550/A520/X470/B450 motherboards will support the latest AMD Ryzen 5000/4000 series processors, including Ryzen 7 5800X3D. ASRock always design ahead to get for new processors and has been working with AMD to validate the latest BIOS AGESA code. The 3D V-Cache technology of AMD Ryzen 7 5800X3D processor offers significant improvements on gaming performance, update to the latest BIOS and get ready to game with new AMD Ryzen processors.

AMD recently announced the latest "Zen 3" and "Zen 2" new processors are coming to the market very soon for DIY users, which includes the ground-breaking AMD 3D V-Cache technology processor, the AMD Ryzen 7 5800X3D. Moreover, the mainstream Ryzen 7 5700X, Ryzen 5 5600, Ryzen 5 5500, Ryzen 5 4600G, Ryzen 5 4500, and Ryzen 3 4100 are all here for different levels of system builds.

MSI is committed to deliver gamers and creators the best experiences. This is why BIOS update is always great for most users. The latest AMD AGESA COMBO PI V2 1.2.0.6c BIOS was released for some MSI 500- and 400-series motherboards. The purpose of AGESA 1.2.0.6c is not only for better compatibility but also for maximizing AMD Ryzen 7 5800X3D performance. For the older 300-series motherboards, we will release the AGESA COMBO PI V2 1.2.0.6c beta BIOS by the end of April. Please refer to the following chart for more information.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today announced availability of high-performance server platforms supporting new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache technology for the modern data center. "The modern data center requires a powerful foundation to balance compute, storage, memory and IO that can efficiently manage growing volumes in the digital transformation trend," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology give our customers better energy efficiency and increased performance for a current and future of highly complex workloads."

"3rd Gen AMD EPYC processors with AMD 3D V-Cache technology continue to drive a new standard for the modern data center with breakthrough performance for technical computing workloads due to 768 MB of L3 cache, enabling faster time-to-results on targeted workloads. Fully socket compatible with our 3rd Gen AMD EPYC platforms, customers can adopt these processors to transform their data center operations to achieve faster product development along with exceptional energy savings," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.

Super Micro Computer, Inc. (SMCI), a global leader in high-performance computing, storage, networking solutions, and green computing technology, announces breakthrough performance with the 3rd Gen AMD EPYC Processors with AMD 3D V-Cache Technology in Supermicro advanced servers. The high density, performance-optimized, and environmentally friendly SuperBlade and multi-node optimized TwinPro and the dual-processor optimized Ultra systems will show significant performance improvement when using the new AMD EPYC 7003 Processors with AMD 3D V-Cache for technical computing applications.

"Supermicro servers, leveraging new AMD CPUs, will deliver the increased performance gains our manufacturing customers are looking for to run higher-resolution simulations to design better and more optimized products using the latest CAE applications," said Vik Malyala, President, EMEA, senior vice president, WW FAE, solutions and business. "Our high-performance server platforms will solve more complex problems for engineers and researchers with the new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache."

AMD announced the general availability of the world's first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, formerly codenamed "Milan-X." Built on the "Zen 3" core architecture, these processors expand the 3rd Gen EPYC CPU family and can deliver up to 66 percent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.

These new processors feature the industry's largest L3 cache delivering the same socket, software compatibility and modern security features as 3rd Gen AMD EPYC CPUs while providing outstanding performance for technical computing workloads such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA) and structural analysis. These workloads are critical design tools for companies that must model the complexities of the physical world to create simulations that test and validate engineering designs for some of the world's most innovate products.

In a livestream talking about AMD's mobile CPUs with HotHardware, Robert Hallock shone some light on the rumours about the Ryzen 7 5800X3D lacking manual overclocking. As per earlier rumours, something TechPowerUp! confirmed with our own sources, AMD's Ryzen 7 5800X3D lacks support for manual CPU overclocking and AMD asked its motherboard partners to remove these features in the UEFI. According to the livestream, these CPUs are said to be hard locked, so there's no workaround when it comes to adjusting the CPU multiplier or Voltage, but at least AMD has a good reason for it.

It turns out that the 3D V-Cache is Voltage limited to a maximum of 1.3 to 1.35 Volts, which means that the regular boost Voltage of individual Ryzen CPU cores, which can hit 1.45 to 1.5 Volts, would be too high for the 3D V-Cache to handle. As such, AMD implemented the restrictions for this CPU. However, the Infinity Fabric and memory bus can still be manually overclocked. The lower Voltage boost also helps explain why the Ryzen 7 5800X3D has lower boost clocks, as it's possible that the higher Voltages are needed to hit the higher frequencies.

TechPowerUp has verified a rumour posted over on VideoCardz that is quite puzzling, as AMD has asked motherboard makers to remove support for overclocking in the UEFI/BIOS for the Ryzen 7 5800X3D. When we asked for a reason as to why this was the case, we were told that AMD was keeping that information to themselves for the time being. The details provided by AMD are short and to the point "5800X3D 8C16T 100-xxxxxxxxx 105 W AGESA: PI 1206b 1/28 Please hide Vermeer-X CPU OC BIOS SETUP options".

The information suggests that this happened back at the end of January, although it's no surprise that this information took some time to leak, as it's not the kind of information that would normally make its way outside of the motherboard manufacturers. AGESA 1.2.0.6 B is also the most current release for a wide range of motherboards, even though it doesn't seem to be offered as a final release from all of the board makers just yet. It's unclear why AMD has done this, but it suggests that there might be some issues related to the 3D V-Cache and overclocking.

This week, the International Solid-State Circuits Conference is taking place online and during one of the sessions, AMD shared some more details of its 3D V-Cache design. The interesting part here is the overall design of AMD's 3D V-Cache, as well as how it interfaces with its CPU dies. The cache chip itself is said to measure 36 mm² and interfaces directly with the L3 cache using a Through Silicon Via or TSV interface. For all the CPU cores to be able to communicate with the 3D V-Cache, AMD has implemented a shared ring bus design at the L3 level. The entire L3 cache is said to be available to each of the cores, which should further help improve performance.

The 3D V-Cache is made up of multiple 8 MB "slices" which has a 1,024 contact interface with a single CPU core, for a total of 8,192 connections in total between the CCX and the 3D V-Cache. This allows for a bandwidth in excess of two terabyte per second, per slice, in full duplex mode. This should allow for full L3 speeds for the 3D V-Cache, despite the fact that it's not an integrated part of the CCX. AMD is also said to have improved the design of its CCX for the upcoming Ryzen 7 5800X3D in several ways to try and reduce the power draw, while improving clock speeds. AMD has yet to reveal a launch date for the Ryzen 7 5800X3D, but it'll be interesting to see if the 3D V-Cache and the various minor optimizations can make it competitive with Intel's Alder Lake CPUs until Zen 4 arrives.

The AMD Milan-X EPYC 7773X 3D V-Cache is a 64-core, 128-thread server processor with 804 MB of cache that is currently shipping to global data centers. These processors are not yet officially available in retail channels but Chinese content creator kenaide has managed to acquire and test two qualification sample chips on a SuperMicro dual-socket motherboard. The AMD EPYC 7773X is detected as 100-000000504-04 CPU by CPU-Z confirming that it's an engineering sample with clock speeds 100 MHz below the 2.2 GHz and 3.5 GHz base and boost speeds of the official processor.

The processors each feature 32 MB L2, 256 MB L3, and 512 MB of 3D V-Cache for a total of 1608 MB cache in the configuration that was benchmarked with Cinebench R23 and 3DMark. The processors were also "overclocked" to 4.8 GHz using the EPYC Milan/Rome ES/QS Overclocking tool by increasing their power limit to 1500 W from 280 W and boosting the voltage to 1.55 V. This 4.8 GHz clock speed is only a target with the actual speed reached not reported and no benchmarks for the overclocked processors shared.

AMD (NASDAQ:AMD) today announced revenue for the fourth quarter of 2021 of $4.8 billion, operating income of $1.2 billion, net income of $974 million and diluted earnings per share of $0.80. On a non-GAAP basis, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.92. For full year 2021, the company reported revenue of $16.4 billion, operating income of $3.6 billion, net income of $3.2 billion and diluted earnings per share of $2.57. On a non-GAAP basis, operating income was $4.1 billion, net income was $3.4 billion and diluted earnings per share was $2.79.

"2021 was an outstanding year for AMD with record annual revenue and profitability," said AMD President and CEO Dr. Lisa Su. "Each of our businesses performed extremely well, with data center revenue doubling year-over-year driven by growing adoption of AMD EPYC processors across cloud and enterprise customers. We expect another year of significant growth in 2022 as we ramp our current portfolio and launch our next generation of PC, gaming and data center products."

AMD via its official YouTube has shared a video that goes into slightly more detail on their usage of V-Cache on the upcoming Zen 3+ CPUs. Firstly demoed to the public on AMD's Computex 2021 event, the 3D V-Cache leverages TSMC's SoIC stacking technology, which enables silicon developments along the Z axis, instead of the more usual footprint increase along the X axis. The added 3D V-Cache, which was shown in Computex as being deployed in a prototype Ryzen 9 5900X 12-core CPU, adds 64 MB of L3 cache to each CCX (the up-to-eight-cores core complex on AMD's latest Zen design), basically tripling the amount of L3 cache available for the CPU. This, in turn, was shown to increase FPS in games quite substantially (somewhere around 15%), as games in particular are sensitive to this type of CPU resources.

The added information explains that there is no usage of microbumps - instead, there is a perfect alignment between the bottom layer (with the CCX) and the top layer (the L3 cache) which enables the bonding process to occur naturally via the TSVs (Through Silicon Vias) already present in the silicon, in a zero-gap manner, between both halves of the CPU-cache sandwich. To enable this, AMD flipped the CCX upside down (the core complex now faces the bottom of the chip, instead of the top), shaved 95% of the silicon on top of the upside-down core complexes, and then attaches the 3D V-Cache chips on top of this formation. This also has the added bonus of decreasing the distance between the L3 cache and the CCX (the distance between both in the Z axis is around 1,000 times smaller than if the L3 cache was deployed in the classical X axis), which decreases power consumption, temperatures, and latency, allowing for further increases to system performance. Look after the break for the full video.