Giga Computing, an industry innovator and leader in enterprise hardware and advanced cooling solutions, today announced four new GIGABYTE servers built on the NVIDIA HGX B200 platform. This expansion of the GIGABYTE GPU server portfolio brings greater thermal design flexibility and support for the latest processors, including the new AI-optimized Intel Xeon 6 CPUs, giving customers more options as they tailor their systems for workloads and efficiency.

NVIDIA HGX B200 propels the data center into a new era of accelerating computing and generative AI. Built on NVIDIA Blackwell GPUs, the HGX B200 platform features 15X faster real-time inference on trillion-parameter models.

The floating esports suite will allow the ship's company of HMS Prince of Wales to compete against each other in an immersive gaming environment as part of a partnership between the Royal Navy and the British Esports Federation. While the classic Royal Navy game 'Uckers' is still going strong, the suite will allow further opportunities for ship's company to enhance digital skills and an additional space to decompress in their down time.

It's the result of a partnership between the Royal Navy and the British Esports Federation, the national body for esports in the United Kingdom. The facility includes 12 high-end Alienware Aurora R15 gaming desktop PCs, powered by NVIDIA GeForce RTX 4080 and Intel Core i7 processors. It will join other sports facilities onboard, including gyms, a boxing ring, plus areas for table tennis and running.

Under its new CEO, Lip-Bu Tan, Intel is stepping back from building its glass substrate technology in favor of sourcing ready-made solutions from specialized vendors. Driven by Tan's strategy to concentrate resources on Intel's primary lines, CPU/GPU development, and foundry, Intel's operations are becoming leaner. By outsourcing glass substrates, Intel can significantly reduce development timelines and mitigate the financial risk associated with pioneering novel substrate manufacturing. Crucially, this model grants Intel the freedom to evaluate multiple suppliers, pivot quickly if performance or cost benchmarks change, and integrate advanced packaging more rapidly than if it continued to develop substrates internally. Just as the company is focusing on 14A and 18A-P(T), abandoning in-house glass substrate development is a step in the right direction to reduce costs and achieve profitability.

Meanwhile, the glass‑substrate sector is gathering momentum, particularly among South Korean firms. SK Hynix, in partnership with Applied Materials, has been trialing its Absolics pilot line for some time, while Samsung has recently scaled up its efforts in this niche. JNTC celebrated the opening of its first glass‑substrate plant in May, announcing sixteen prospective clients and projecting revenues to climb from $14.7 million this year to $147 million in 2026, and ultimately hitting $735 million by 2028. A complementary facility under construction in Vietnam will triple the original plant's output, targeting a combined annual production of roughly 500,000 substrates. Intel hasn't yet named which suppliers it will partner with. Still, the company plans to tap into this growing network, potentially joining JNTC's customer roster, to support its advanced packaging roadmap and accelerate product rollouts.

Intel's CEO Lip-Bu Tan is looking at a big change to how the company makes chips for others, Reuters reports citing people who know about it. The new plan might mean Intel stops offering its 18A process technology to other companies. This is different from the strategy of the former CEO, Pat Gelsinger, who had invested heavily in the 18A manufacturing process. Since assuming leadership in March, Tan has been working to reduce costs and find new approaches to revive the struggling chipmaker. By June, he began expressing concerns that the 18A process was failing to attract new customers. Abandoning external sales of 18A technology and focusing on its 14A process would require Intel to take substantial write-offs on the billions invested in its development. Industry analysts suggest these charges could reach hundreds of millions or potentially billions of dollars.

Intel plans to show the board these options later this month. However, a final decision is not expected until this autumn given the complexity and financial stakes involved. Even if they change plans, Intel will still keep its promises about 18A process including producing small amounts of chips for Amazon and Microsoft, and making its own "Panther Lake" laptop processors scheduled for late 2025. Along with standard 18A, Intel is creating two upgraded versions: 18A-P launching in 2026 and 18A-PT arriving in 2028.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is working closely with the ASUS ROG team to explore the overclock potential of the new DDR5 CAMM2 form factor and have successfully reached the early milestone of Memtest-stable at DDR5-10000 memory speed with a 64 GB capacity CAMM2 module on a modified custom ASUS ROG Maximus Z890 Hero CAMM2 motherboard with an Intel Core Ultra 7 265K desktop processor.

Overclocked CAMM2 Reaches DDR5-10000 Memtest-Stable Milestone
G.SKILL is always seeking out overclock memory performance wherever possible. With the in-development CAMM2 form factor and in cooperation with the ASUS ROG team, demonstrating stability is the first step toward enabling overclock memory specifications on future hardware platforms.

ASUS IoT, a leader in AIoT solutions, today introduces R680EA-IM-Z, a high-performance industrial ATX motherboard built to empower advanced industrial applications with exceptional processing power and robust reliability. Powered by 14th Gen Intel Core processors, R680EA-IM-Z delivers up to 21%-faster CPU performance, providing the optimal foundation for AI-enabled machine vision, robotics and real-time data analysis.

Optimized for data-heavy industrial workloads, R680EA-IM-Z efficiently handles high-resolution image processing and complex algorithmic tasks. Its advanced computing capability ensures seamless integration into intelligent manufacturing and automation systems - where real-time responsiveness and unwavering reliability are essential.

Intel today released the latest version of the Arc GPU Graphics Drivers. Version 101.6913 WHQL comes with optimization for "Mecha BREAK." The release also fixes a handful of issues. For Intel Arc B-series "Battlemage" discrete GPUs, a couple of issues are fixed. A bug that causes "Returnal" to experience an application crash during gameplay with ray tracing enabled, has been fixed. An intermittent application freeze with SPECapc for Maya 2024 during benchmark, has been fixed. The release also fixes a bug specific to the Arc "Battlemage" iGPUs of Core Ultra 200-series "Lunar Lake" processors, specifically, "Valorant" being unable to enumerate supported resolutions in game settings. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6913 WHQL

Safroadu Yeboah-Amankwah, Intel's Chief Strategy Officer will be leaving the company as of today, in another management overhaul. The news broke on Friday via Reuters and it's currently unclear if it was mutually agreed upon or if Saf—as he was known as in the company—was forced out. The Reuters piece mentions that he has "overseen growth initiatives, strategic partnerships and equity investments for Intel" as part of his role at the company. He was originally hired as Senior VP and Chief Strategy Officer and much of his work at Intel seems to have been related to Intel Capital, Intel's investment arm, which was spun off earlier this year.

Yeboah-Amankwah has held his position as CSO at Intel since September 2020 and he might just be one of the approximate 21,000 head cuts that company is planning this year. Reuters further reports that Sachin Katti, Intel's Chief Technology & AI Officer will be taking on some of his responsibilities. Time will tell if Lip-Bu Tan's new strategy of trying to build a leaner Intel will work in the long term, as although he's pledged to get rid of middle management, this appears to be something else, at least to an outside observer. The company hasn't issued an official statement, but Reuters got a statement confirming the departure that said "We are grateful for Saf's contributions to Intel and wish him the best."

Intel and Nokia are expanding their long-standing and strategic collaboration to advance core network infrastructures with the deployment of Intel Xeon 6 processors with Efficient-cores (E-cores) in the Nokia NFVI v5.0 and Nokia Core Networks Applications. With breakthrough energy efficiency, capacity and scalability for 5G core workloads, this joint infrastructure initiative will provide Nokia customers with up to a 60% reduction in power consumption, a 60% smaller server footprint and a 150% performance boost compared to widely deployed previous-generation servers.

"The combination of Intel Xeon 6 E-core processors - engineered for power-efficient, high-density compute - and Intel Infrastructure Power Manager, which delivers stable run-time power savings, provides a robust foundation for the most energy-efficient 5G core networks. We're proud to see Nokia Core Networks continue to lead with Intel Xeon processors, helping communications service providers reduce both power use and infrastructure footprint at scale," said Alexander Quach, Intel vice president and general manager of the Wireline and Core Network Division.

Looking to challenge AMD's gaming CPU supremacy, Intel is reportedly developing Nova Lake processors with enhanced cache technology that could rival the popular 3D V-Cache found in X3D chips. According to leaker @Haze2K1, Intel plans to add "bLLC" (big Last Line Cache) to at least two Nova Lake models. This improved L3 cache is similar to AMD's 3D V-Cache, which has made X3D chips the top pick for enthusiast gamers since 2022. The new processors with bLLC will have 8 P-cores and 4 LP-E-Cores. One version will include 20 E-cores, while another will have 12 E-cores. Both are expected to keep a 125 W TDP rating.

Intel's bLLC technology already exists in Clearwater Forest server processors where local cache integrates into the base tile positioned beneath active tiles. This structural approach mirrors AMD's current 9000-series X3D design, where V-Cache attaches to the bottom of CPU dies—a significant improvement over earlier generations that placed cache on top, causing thermal issues and clock speed limitations. Yet, Intel said no to consumer plans for a technology similar to AMD's 3D V-Cache. In November 2024, Intel's Tech Communications Manager Florian Maislinger told YouTubers der8auer and Bens Hardware that they didn't plan such a desktop version. The Nova Lake-S family is set to hit the market in late 2026 or early 2027, with at least six desktop models using new LGA 1954 packaging. The lineup will start from the top-end Core Ultra 9 485K with 52 cores and 150 W TDP and go down to the basic Core Ultra 3 415K offering 12 cores at 125 W TDP.

In just a few years, AMD has gone from the underdog to Intel's most serious challenger in the server world. Thanks to its EPYC processors, AMD now captures about a third of every dollar spent on server CPUs, up from essentially zero in 2017. Over that same period, Intel's share has slipped from nearly 100% to roughly 63%, signaling a significant shift in what companies choose to power their data centers. The real inflection point came with AMD's Zen architecture: by mid-2020, EPYC had already claimed more than 10% of server-CPU revenues. Meanwhile, Intel's rollout of Sapphire Rapids Xeons encountered delays and manufacturing issues, leaving customers to look elsewhere. By late 2022, AMD was over the 20% mark, and Intel found itself under 75% for the first time in years.

Looking ahead, analysts at IDC and Mercury Research, with data compiled by Bank of America, expect AMD's slice of the revenue pie to grow to about 36% by 2025, while Intel drops to around 55%. Arm-based server chips are also starting to make real inroads, forecast to account for roughly 9% of CPU revenue next year as major cloud providers seek more energy- and cost-efficient options. By 2027, AMD could approach a 40% revenue share, Intel may fall below half the market, and Arm designs could capture 10-12%. Remember that these figures track revenue rather than unit sales: AMD's gains come primarily from high-end, high-core-count processors, whereas Intel still shifts plenty of lower-priced models. With AMD poised to launch its Genoa and Bergamo EPYCs and Intel banking on the upcoming E-core Xeon 6 series to regain its footing, the fight for server-CPU supremacy is far from over. Still, Intel's once-unbeatable lead is clearly under threat.

GIGABYTE Technology, a global leader in high-performance motherboards, graphics cards, and hardware solutions, today announces the groundbreaking Ultra Turbo Mode feature for its Intel Z890 series motherboards. This innovative BIOS level enhancement unlocks significant gaming performance boosts of up to 35% without requiring any additional hardware investment. With a simple BIOS update, users can access dramatically enhanced system performance, further solidifying GIGABYTE's commitment to delivering innovative, reliable, and performance-driven solutions.

Maximize Performance without Extra Expense
The Ultra Turbo Mode extracts maximum performance from systems without the need for expensive hardware upgrades. By intelligently optimizing BIOS settings, this revolutionary feature unlocks hidden potential in the latest Intel Core Ultra 2 9/7/5 K-SKU processors. The results are impressive: memory performance achieves a remarkable boost of up to 68% in AIDA64 testing across various high-performance memory configurations. Gaming performance also sees significant gains, with up to 35% higher frame rates in demanding AAA titles like Hitman 3: Dartmoor.

Today, Dell unveils its new lineup of flagship laptops, now under the Dell Premium name. Powered by the latest Intel Core Ultra 200H series processors, these devices deliver meaningful performance advancements designed for students, creators and entrepreneurs who rely on their PCs to fuel their ambitions and keep pace with what's next.

Staying true to the XPS tradition, the new Dell Premium laptops uphold the signature craftsmanship and innovation that customers know and love - stunning displays, elevated and smooth finishes, monochromatic colors and cutting-edge technology. The new name signals a fresh chapter—one that makes it easier than ever to find the right PC while providing the same exceptional quality, design and performance.

Eurocom introduces the Nightsky RX517, a customizable and user-upgradeable 17.3-inch laptop built for professionals, creators, and power users who need a balance of screen size, flexibility, and long-term scalability. The Nightsky RX517 comes with large 17.3" internal display for these looking for larger size viewing area. At the core of the Nightsky RX517 is Intel Core Ultra 9 275HX processor with 24 cores / 24 threads and 36 MB cache, paired with the NVIDIA GeForce RTX 5070 Blackwell GPU (4608 CUDA cores, 144 Tensor AI cores, and 8 GB GDDR7 memory). This configuration is ideal for productivity workloads, 2D/3D content handling, development, multi-display environments, and smooth day-to-day performance.

Designed to support up to four active displays with NVIDIA Surround View, the Nightsky RX517 empowers power users to expand their desktop environment for improved multitasking, creative workflows, and visual workspace management. The internal 17.3-inch FHD 144 Hz display delivers smooth visuals and large screen for creative and technical work. Following EUROCOM's user-friendly upgrade philosophy, the Nightsky RX517 offers user-accessible dual SODIMM slots supporting up to 128 GB of DDR5-5600 memory, and three physical M.2 NVMe slots enabling up to 24 TB of SSD storage in RAID 0/1/5 configurations. This allows users to upgrade storage and memory capabilities to meet user changing computing requirements without replacing the laptop.

Intel has confirmed plans to phase out its in-house automotive chip team and lay off most of the employees in that segment. In a memo to staff on Tuesday, the company stated that it will honor existing contracts with vehicle manufacturers and suppliers but will essentially dissolve the unit that designed and marketed its small automotive platform. This move supports Intel's new strategy under new CEO Lip-Bu Tan to concentrate on client computing and data center operations. "We are refocusing on our core client and data center portfolio to strengthen our product offerings and meet the needs of our customers," the statement said. "As part of this work, we have decided to wind down the automotive business within our Client Computing Group. We are committed to ensuring a smooth transition for our customers."

Intel's automotive division has never generated a major share of revenue, and the company does not report its results separately. Still, Intel highlights that over 50 million vehicles worldwide use its processors for services such as infotainment, electric vehicle management, and driver assistance. Despite that footprint, the division remains small compared with the rest of Intel's diverse chip portfolio. Importantly, the decision does not affect Mobileye, which Intel spun off and took public in 2023. Mobileye continues to operate independently, even though Intel retains nearly all of the voting shares. Intel has already informed its manufacturing staff of plans to cut up to 20% of its workforce starting in July. It will also outsource much of its marketing function to Accenture, relying on AI to manage campaigns. These actions are much needed for Intel's determination to make operations leaner and sharpen its focus on the markets where it remains strongest.

Intel's next generation Core Ultra 300-series "Nova Lake-HX" enthusiast mobile processor is expected to debut a new BGA package, the BGA2540. This was sniffed out from shipping manifests of prototype boards of the processor. Although not socketed, mobile processors tend to carry forward package sizes and pin maps across generations, to simplify notebook mainboard and cooling solution designs for OEMs. Over the past several generations, the enthusiast notebook segment of mobile processors from Intel, designated by "-HX" in the codename, have meant notebook-friendly BGA variants of the maxed out "-S" segment silicon, with the highest core counts on the by the company in the client segment.

We've known from older reports that the maxed out desktop "Nova Lake-S" sees a significant increase in core counts, with a core configuration of 16 P-cores, 32 E-cores, and 4 low power island E-cores, a 3-tiered hybrid processor topology similar to "Meteor Lake." Intel is looking to at processor base power values as high as 150 W for its top Core Ultra 9 K-series SKUs. It's very likely that this silicon will be carried over with either the same or similar core-count to "Nova Lake-HX," which is why Intel is needing a larger package for mobile. The desktop "Nova Lake-HX" will require a motherboard change, as the processor is expected to debut the new LGA1954 socket.

AI PCs are a new class of laptops designed to deliver AI-enhanced experiences—from productivity to creativity—that adapt to users' needs and enhance people's lives. For HP's Intel-based AI PCs, Intel contributed more than just hardware like its Intel Core Ultra processors. Intel worked closely with HP to co-engineer and optimize hardware platforms for AI workloads. By fine-tuning performance across the central processing unit (CPU), graphics processing unit (GPU) and neural processing unit (NPU), Intel helped HP benchmark and validate real-world use cases, ensuring selected AI applications run efficiently on HP devices.

HP's latest AI PCs for business users—including the EliteBook X, EliteBook Ultra (announced in January at CES 2025) and EliteBook 8 (unveiled in March at HP Amplify)—are examples of how Intel's software and platform teams worked closely with HP to optimize performance and AI readiness on Intel Core Ultra-based systems. "We are delighted by the exceptional results Intel's Client Software team and HP's Commercial Personal Systems team achieved for the recent release of Intel Core Ultra 200V series devices," said Carla Rodriguez, vice president and general manager of the Client Software Ecosystem in the Client Computing Group at Intel.

Thermaltake has launched the WAir CPU Cooler a cooling solution for workstations that handle demanding tasks like 3D rendering and AI processing. This cooler supports Intel LGA4677 and AMD sTR5/SP6 sockets and is capable of delivering up to 500 W TDP cooling capacity. It measures 143.2 x 115 x 165 mm (L x W x H) and has a single-tower design with aluminium fins. Thermaltake WAir cooler features six 6 mm diameter heat pipes connected to a large nickel plated copper base with high-quality solder paste between heat pipes and heat sinks to enhance thermal conductivity.

The WAir uses two upgraded TOUGHFAN 14 Pro units. Each fan is 140.8 x 140.8 x 26.4 mm in size and runs at speeds from 500 to 1500 RPM controlled by PWM. Users can adjust the fan positions to fit different memory module heights. The fans have liquid crystal polymer (LCP) blades that help reduce vibration at top speeds. Each fan delivers up to 83.4 CFM airflow with 1.86 mm-H₂O static pressure and 24.4 dBA noise levels. The fans connect with 4-pin PWM connectors and offer 50,000 hours of operational life. Thermaltake didn't provide exact pricing and availability for the WAir CPU cooler series.

Intel GPUs, both iGPUs and Arc, on Linux, can achieve a surprising 20% performance boost by taking direct action within their own graphics stack. The company has long incorporated security mitigations into its open-source Compute Runtime to protect against vulnerabilities like Spectre, but these safeguards have carried a hidden cost. With the introduction of a build-time option named NEO_DISABLE_MITIGATIONS, Intel now allows users to compile the Compute Runtime without these extra checks, thereby reclaiming up to 20% in OpenCL and Level Zero workloads. Behind the scenes, Intel's engineers have been testing unmitigated builds on GitHub for months, and the results have been clear: disabling these driver-level mitigations can significantly speed up shader compilation, AI-driven upscaling routines, and physics simulations that rely on GPU compute.

Intel's confidence in disabling these checks stems from the fact that modern Linux kernels already address Spectre vulnerabilities comprehensively at the operating system level. To keep users informed, the Compute Runtime build will emit a warning if it detects a kernel lacking the necessary patches, ensuring transparency about any residual risk. Canonical's Ubuntu team has partnered with Intel to introduce this enhancement in its upcoming 25.10 release. But make no mistake, this is Intel's initiative: the company is driving the performance improvements, publishing unmitigated binaries upstream, and coordinating with distribution partners to make the change broadly available. Security teams at Intel have analyzed the potential attack surface and concluded that the performance gains far outweigh the minimal risk, especially given that Intel's own builds have been running unmitigated without incident.

In another breakthrough in single-board computing, AAEON has released the de next-RAP8, the world's smallest board featuring embedded 13th Generation Intel Core Processors, measuring just 3.31" x 2.17" (84 mm x 55 mm). Available with a choice of the Intel Core i7-1365UE, Intel Core i5-1335UE, or Intel Core i3-1315UE, all at 15 W, the de next-RAP8 can leverage up to 10 cores and 12 threads. The board also boasts up to 16 GB of LPDDR5x system memory and Intel Iris Xe graphics.

Designed for drone and robotics applications, the de next-RAP8 hosts two Intel-based RJ-45 ports, one for 2.5GbE and one for 1GbE speeds, alongside two USB 3.2 Gen 2 Type-A ports on its rear I/O. Rounding off its physical ports are an HDMI 1.2a port and a 12 V DC Jack. The board adds to these with a relatively dense set of pin headers and connectors. Given the board's target application fields being robotics and drones, the most notable inclusions are an 8-bit GPIO, four USB 2.0, and two RS-232/422/285 signals, all of which are available via a 40-pin header on the board's CPU-side. For more industrial use, the de next-RAP8 offers SMBus/I2C as an optional function.

Intel's high-end "Arrow Lake" processors have just become significantly more affordable, with the Core Ultra 7 265K and 265KF now priced below $250 US at major American retailers. In recent weeks, Intel has officially reduced its suggested retail prices from $399 to $309 and from $384 to $294, and retailers have pushed the savings even further. Today, shoppers can pick up the unlocked Core Ultra 7 265K for $239.99 and the graphics-disabled 265KF for $229.99 at Micro Center, reflecting a roughly 40 percent discount off launch pricing. In addition to these cuts, Micro Center is bundling the 265K with an ASUS Z890 AYW Gaming Wi-Fi motherboard and a 32 GB G.Skill Ripjaws S5 DDR5-6000 memory kit for $499, saving buyers approximately $70 compared to purchasing the components separately. Newegg's deal includes a free 16 GB Patriot Viper Venom DDR5-6400 kit with the 265K, while Amazon's Spring Bundle features two full-price PC games, Dying Light: The Beast and Civilization VII, plus software licenses valued at $159.

Internationally, similar markdowns are appearing across Intel's Arrow Lake‑S lineup. In the UK, LambdaTek lists the Core Ultra 9 285 K at £481.18, the 265K at £234.04, and the 265KF at £230.97. The mid-range Core Ultra 5 245 K and 245KF both dip under £220. With their 20 cores and strong multithreaded performance, the Core Ultra 7 265K and 265KF now stand out in the sub‑$250 segment, especially when bundled with motherboards, memory, and games. Consumers should balance these productivity gains against expected Arrow Lake gaming results and keep an eye on AMD's upcoming 3D V‑Cache processors, which promise to intensify competition in the under‑$300 market later this year.

Alphacool International GmbH, based in Braunschweig, has been a pioneer in PC water cooling technology for over 20 years. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is now expanding its portfolio with the new Eisblock Aurora Arc B580 Steel Legend + Challenger with Backplate.

The GPU water cooler is precisely tailored to fit the layout of ASRock's Intel Arc B580 Steel Legend and Challenger graphics cards. An updated fin structure, optimized water flow, and an improved jetplate ensure high cooling performance. The chrome-plated copper base offers excellent thermal conductivity and long-lasting durability. Subtle RGB lighting complements the elegant design and provides even illumination.

Intel today announced a series of leadership appointments aligned with its focus on strengthening customer relationships and becoming a more engineering-focused company. Greg Ernst, a respected sales leader with more than 20 years of Intel experience, has been named chief revenue officer. In addition, Srinivasan Iyengar, Jean-Didier Allegrucci and Shailendra Desai are joining Intel in key engineering leadership roles.

"We see significant opportunities ahead to strengthen our product offerings and meet the changing needs of our customers," said Lip-Bu Tan, CEO of Intel. "Greg, Srini, J-D and Shailendra are highly accomplished leaders with strong reputations across our ecosystem, and they will each play important roles as we position our business for the future."

GEEKOM, a leading innovator in mini PC technology, is set to release its latest powerhouse, the GEEKOM IT15, setting a new benchmark for compact computing. Designed for professionals and businesses, this ultra-compact mini PC combines high-performance processing, robust stability, and unparalleled connectivity, making it the perfect solution for modern workspaces.

At the heart of the IT15 is Intel's 2nd Gen Core Ultra processor (up to Ultra 9), which delivers enhanced single-core performance and improved energy efficiency. By eliminating Hyper-Threading, the system optimizes pure computing power, ensuring rapid response times and higher productivity. With a turbo clock of up to 5.4 GHz, it effortlessly handles demanding tasks such as video editing, coding, and graphic design. The IT15 also leverages AI-driven performance optimization, enhancing system efficiency for task scheduling, power management, and content creation workflows.

RuggON, a global provider of rugged computing solutions, announces the launch of the SOL 7, a groundbreaking 12-inch fully rugged tablet and the first powered by Intel Arrow Lake processors. Designed for high-performance computing in demanding environments, the SOL 7 delivers next-generation AI capabilities, robust durability and seamless connectivity for critical sectors including public safety, automotive applications, warehousing, logistics, and agricultural.

Unmatched AI Performance with Intel Arrow Lake
Powered by the latest the latest Intel Core Ultra 5/7 processor with integrated Intel AI Boost, the SOL 7 enables powerful on-device AI for real-time analytics, image recognition, and rapid decision-making. Equipped with a suite of data capture tools including optional 2D barcode scanner with OCR, NFC reader with FIDO2 security, smart card reader, fingerprint reader and UHF RFID reader, the SOL 7 empowers field professionals to operate smarter, faster, and more securely.