The Liquid Freezer III Series is compatible with Intel's LGA1700 and LGA1851. However, since the hotspot of the LGA1851-CPUs is off-center, offset mounting can improve cooling performance. The Intel LGA1700/1851 Offset Contact Frame Mounting Set enables precise alignment and thus optimizes cooling performance for Intel Core Ultra CPUs.

Significant improvements for powerful Core Ultra CPUs
The new mounting set shows its strength particularly in the Core Ultra 9 285K. The offset mounting allows a significant reduction in temperature.

Intel still depends on external partners for its semiconductor manufacturing strategy, with approximately 30% of its wafers currently outsourced to TSMC, according to Intel's Corporate Vice President of Investor Relations. This marks a significant shift from previous plans to eliminate external foundry dependencies, as the company now intends to maintain a permanent multi-foundry approach. "That is probably a high watermark for us," said John Pitzer during a recent investor dialogue with Morgan Stanley analyst Joe Moore. "But to the extent that I think a year ago, we were talking about trying to get that to zero as quickly as possible. That's no longer the strategy." Pitzer elaborated that Intel now views TSMC as "a great supplier" whose continued involvement "creates a good competition between them and Intel Foundry." The company is reportedly evaluating the optimal long-term outsourcing ratio, considering targets between 15-20% of total wafer production.

This strategic adjustment comes amid leadership changes at Intel, with interim CEOs Dave Zinsner and Michelle Johnston Holthaus granted increased decision-making authority while maintaining the core dual approach of developing "a world-class fabless company and a world-class foundry." The executive team focuses on strengthening Intel's product competitiveness before fully optimizing its foundry operations. This pragmatic approach is viewed as recognizing manufacturing realities in the highly complex semiconductor creation. Intel's willingness to leverage TSMC's advanced process technologies reflects both practical necessity and strategic flexibility as the company navigates its manufacturing transformation. Intel's fabrication self-sufficiency goals remain essential but will be balanced against product competitiveness and time-to-market considerations.

Intel Products today launched the Intel Assured Supply Chain (ASC) program, designed to provide additional transparency and assurance in the silicon manufacturing process. This specialized client system-on-chip (SoC) solution, initially offered on specific Intel Core Ultra Series 2 mobile and desktop SKUs, provides a digitally
attestable chain of custody of each chip's progress through the chip manufacturing process, leveraging a dedicated chip manufacturing pathway through specific Intel
manufacturing locations. With the ASC program, Intel Products delivers added transparency into processor manufacturing, assuring customers about the locations of
their silicon supply chain.

"Intel has long been a leader in secure, transparent and reliable semiconductor manufacturing, and the Intel Assured Supply Chain program is another step forward in strengthening trust in the technology that powers our customers' critical operations," said Jennifer Larson, general manager, Commercial Client Segments, Client Computing Group, Intel.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

TSMC appears to be in for a competitive period, as sources close to Reuters note that both NVIDIA and Broadcom have tested Intel's 18A node with initial test chips. These tests are early indicators of whether Intel can successfully pivot into the contract manufacturing sector currently dominated by TSMC. Intel's 18A technology—featuring RibbonFET transistors and PowerVia backside power delivery—continues progressing through its development roadmap. The technology's performance characteristics reportedly sit between TSMC's current and next-generation nodes, creating a narrow window of competitive opportunity that Intel must capitalize on. What makes these particular tests significant is their positioning relative to actual production commitments. Chip designers typically run multiple test phases before allocating high-volume manufacturing contracts, with each progression reducing technical risk.

Reuters also reported that a six-month qualification delay for third-party IP blocks, which represents a critical vulnerability in Intel's foundry strategy, potentially undermining its ability to service smaller chip designers who rely on these standardized components. However, when this IP (PHY, controller, PCIe interface, etc.) is qualified for the 18A node, it is expected to go into many SoCs that will equal in millions of shipped chips. Additionally, the geopolitical dimensions of Intel's foundry efforts ease concerns of US-based chip designers as they gain a valuable manufacturing partner in their supply chain. Nonetheless, the 18A node is competitive with TSMC, and Intel plans only to evolve from here. Intel's current financial trajectory is the number one beneficiary if it proves good. With foundry revenues declining 60% year-over-year and profitability pushed beyond 2027, the company must demonstrate commercial viability to investors increasingly skeptical of its capital-intensive manufacturing strategy. Securing high-profile customers like NVIDIA could provide the market validation necessary to sustain continued investment in its foundry infrastructure.

RayNeo, a leading innovator in consumer Augmented Reality (AR) technology, has unveiled its latest XR glasses, the RayNeo Air 3s, at MWC 2025. Alongside this groundbreaking release, the company showcased its other two innovations: the AI-powered, Full-Color AR Glasses RayNeo X3 Pro and the Camera AI Glasses RayNeo V3. Together, these cutting-edge devices underscore RayNeo's unwavering commitment to redefining immersive experiences and enhancing everyday usability through advanced AR solutions.

RayNeo Air 3s: Lightweight XR for Seamless Daily Use
The RayNeo Air 3s redefines the landscape of lightweight XR glasses, seamlessly merging portability with state-of-the-art display technology. Equipped with 3840 Hz high-frequency dimming, a staggering 200,000:1 contrast ratio, and a 154% sRGB color gamut, the Air 3s delivers breathtaking image quality, setting a new benchmark for birdbath display solutions. Its expansive 201-inch virtual screen and TÜV Rheinland-certified eye comfort technology ensure an immersive yet comfortable experience, making it ideal for all-day wear.

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

Today, at MWC 2025, Lenovo unveiled groundbreaking advancements in hybrid AI with integrated devices and solutions to empower creators, professionals, and enterprises. The new offerings exemplify Lenovo's vision of Smarter AI for all and showcase how end-to-end AI can offer seamless creation, connection, and collaboration. The range of technology launched at MWC—from new device form factors to affordable edge inference—show the maturity and versatility of Lenovo's AI portfolio while linking bold innovation with real-world impact.

"We believe in the power of convergence: bringing together AI models, data, and computing power—running on devices, on the edge, and in the cloud—to build AI solutions for customers," said Lenovo CEO and chairman Yuanqing Yang, who delivered a keynote address at MWC. "This convergence drives stronger ecosystem connectivity, unleashing the power of AI to augment human creativity to turn ideas into reality."

Today at MWC 2025, Lenovo announced new Yoga and IdeaPad AI laptops, alongside software and innovative new proofs of concept visuals and accessories that leverage the power of AI to supercharge creativity and productivity for consumers. With a greater selection of Copilot+1 AI PCs offering AI-enabled experiences like Windows Studio Effects, new NVIDIA GPU options for heavy-duty processing tasks, and new Lenovo Aura Edition laptops imagined with Intel that streamline the PC experience, Lenovo's new Yoga and IdeaPad laptops make creating, completing tasks, and enjoying content seamless, simple, and fun. Lenovo's new AI laptops, software, and concepts unveiling at MWC continue to expand on the company's wide AI portfolio, embodying its promise to deliver Smarter Technology for All - combining cutting-edge innovation, user-centric versatility, and exceptional value to meet the needs of more consumers.

"As we push the limits of AI innovation higher than ever, it is important to remember that delivering access to AI for all is equally a core tenet of Lenovo's philosophy. Likewise, as we endeavor to redefine the boundaries of power in technology, we must ensure that it continues to be a positive force," said Jun Ouyang, Lenovo's Senior Vice President and General Manager of the Consumer Segment, Intelligent Devices Group. "With the announcement of innovations like the Yoga Pro 9i Aura Edition, the IdeaPad Slim 3x, and the Lenovo Yoga Solar PC Concept, Lenovo has delivered a suite of new devices and proofs of concept that empower end users to let their creativity shine, their 'process' unbounded by the processing of their PC thanks to AI-powered innovation."

On Feb. 28, 2025, Naga Chandrasekaran, executive vice president, chief global operations officer and general manager of Intel Foundry Manufacturing, sent a message to Intel employees in Ohio updating them on the latest planned construction completion dates for Ohio One Mod 1 and Mod 2 that are under construction in New Albany, Licking County, Ohio. I continue to be impressed by the progress you are driving on our Ohio One campus. We have come a long way since construction began, and I am grateful for all that you've accomplished to lay the groundwork for our future as we make Ohio one of the world's leading hubs of advanced semiconductor manufacturing.

Last quarter, we achieved our "go vertical" milestone when the "basement" level of the fab was completed - and work on the above-ground structure is now underway. The campus has been transformed in ways that bring Ohio's natural beauty to the site. You are also doing so much beyond our campus to support Ohioans in our neighborhood and across the state by creating education and workforce development initiatives, building local business partnerships, and volunteering and investing in the community. I am proud of the impact you are making.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, introduces the COLORFUL X15 XS - a budget-friendly yet powerful gaming laptop designed for gamers and creators seeking performance and value. Building from the success of the X15 XS series gaming laptops, the latest model features a cleaner and simpler design and new packaging.

Powered by up to a 12th Gen Intel Core i5-12500H processor and an NVIDIA RTX 3050 laptop GPU, the COLORFUL X15 XS delivers the speed and efficiency needed to tackle a wide range of tasks. Whether you're working on demanding projects, studying for exams, or diving into immersive gaming sessions, the X15 XS ensures smooth multitasking, responsive performance, and stunning graphics. With advanced cooling and a high-refresh-rate display, the X15 XS is built to keep up with your productivity and entertainment needs without compromise.

MSI, the world-leading gaming & creator laptop brand, today announced its groundbreaking RTX 50 Series laptops at MSIology: Dragonforged Dominance Launch Event - a new lineup inspired by the ancient Norse myth of Yggdrasil. Embracing the themes of renewal and resilience, MSI's innovative devices integrate three core principles: innovative technology, luxurious aesthetics, and extreme performance.

Dragonforged Dominance Launch Event
"Much like the mythic World Tree that connects the nine realms, our new laptops are designed to meet diverse user expectations—from immersive gaming to high-end professional work" said Steven Yang, MSI Notebook Regional Sales & Marketing Manager.

Intel has successfully deployed two advanced ASML High-NA Twinscan EXE:5000 EUV lithography systems at its D1 development facility near Hillsboro, Oregon, processing approximately 30,000 wafers in a single quarter. The High-NA EUV systems, each reportedly valued at $380 million, represent a substantial improvement over previous lithography tools, achieving resolution down to 8 nm with a single exposure compared to the 13.5 nm resolution of current Low-NA systems. Early operational data indicates these machines are approximately twice as reliable as previous EUV generations, addressing reliability challenges that previously hampered Intel's manufacturing progress. The ability to accomplish with a single exposure what previously required three exposures and approximately 40 processing steps has been reduced to just "single digit" processing steps.

Intel has historically been an early adopter of high-NA EUV lithography, a much more aggressive strategy than its competitors like TSMC, which manufactures its advanced silicon using low-NA EUV tools. The company plans to utilize these systems for its upcoming 14A chip manufacturing process, though no specific mass production date has been announced. While ASML classifies these Twinscan EXE:5000 systems as pre-production tools not designed for high-volume manufacturing, Intel's extensive wafer processing is more of a test bed. The early adoption provides Intel with valuable development opportunities across various High-NA EUV manufacturing aspects, including photomask glass, pellicles, and specialized chemicals that could establish future industry standards. Intel's current 18A node is utilizing Low-NA lithography tools, where Intel is only exploring High-NA with it for testing, before moving on to 14A high-volume manufacturing with High-NA EUV.

Almost five years ago, SK hynix announced a planned $9 billion acquisition of Intel's NAND flash memory and storage business. The semiconductor giant's takeover process has been a gradual affair; the first phase was complete by the end of 2021, with Asian governing bodies—just before Christmas—giving clearance to absorb Chinese facilities. Within this time frame, the South Korean giant pulled in Team Blue's SSD NAND design and R&D departments—thus establishing the "Solidigm" entity. According to a new Businesskorea report, SK hynix is about to pay off a final installment; allegedly $2.235 billion.

Industry insiders believe that SK hynix's takeover of Intel NAND and storage properties will be completed by next month. This (rumored) March time fortification will place SK hynix in direct competition with a nearby rival: Samsung. Businesskorea believes that recent expansions signal a "competitive edge"—targeting increased demand for enterprise SSD products. Google and Meta are reportedly engaged in widespread upgrading of data center facilities. The local publication reckons that: "SK Hynix plans to capitalize on this trend by strengthening its position in the market and leveraging AI to drive innovation and growth." The aforementioned absorption of Intel intellectual property (IP) plus R&D resources is viewed as a crucial move in reinforcing an already solid foundation.

ASUS today announced an all-new series of servers powered by the latest Intel Xeon 6 processors, including the Xeon 6900-series, 6500P/6700P-series and 6300-series processors. These powerhouse processors deliver exceptional performance, efficiency and scalability, featuring up to 128 Performance-cores (P-cores) or 288 Efficient-cores (E-cores) per socket, along with native support for PCI Express (PCIe 5.0) and DDR5 6400 MT/s memory speeds. The latest ASUS server solutions also incorporate the updated BMC module within the ASPEED 2600 chipset, providing improved manageability, security and compatibility with a wide range of remote management software - and coincide with the unveiling of the latest Intel Xeon 6 processors.

Redefining efficiency and scalability
Intel Xeon 6 processors are engineered to meet the needs of modern data centers, AI-driven workloads and enterprise computing. Offering a choice between P-core and E-core architectures, these processors provide flexibility for businesses to optimize performance and energy efficiency based on specific workloads.

ASUS today announced the all-new ExpertBook B5 laptop series (B5405/B5605) - a lightweight, AI-enhanced marvel powered by the latest up to Intel Core Ultra processors (Series 2) with Intel vPro and built-in Intel Arc graphics, ushering in a new era of productivity. Packed with cutting-edge AI capabilities, including a dedicated NPU, ExpertBook B5 is built to streamline complex business tasks and accelerate productivity - especially during video calls, with exclusive ASUS AI ExpertMeet delivering optimized audio, video and real-time transcription for seamless collaboration.

Engineered for professionals who demand both performance and security, ExpertBook B5 is protected by ASUS ExpertGuardian, an enterprise-grade security suite that safeguards data, user identities and system integrity with multi-layered protection. With an up to 15 hours battery life for all-day performance on the go, this durable, MIL-STD-810H-tested business laptop empowers uninterrupted productivity. ExpertBook B5 also underscores the ASUS commitment to sustainability with the integration of a Digital Product Passport (DPP), providing transparent lifecycle tracking and reinforcing responsible environmental practices.

Leading network platform provider AAEON this week announced the release of its FWS-7370, a Rackmount Network Appliance powered by Intel Atom P5300 series CPUs (formerly Snow Ridge). Compatible with the higher end models from the series, the FWS-7370 offers up to 24 cores alongside integrated network and security features like Intel QuickAssist Technology for hardware-accelerated encryption, decryption, and compression of large datasets.

The FWS-7370's standard I/O grants users a total of 12 LAN ports, comprised of four RJ-45 ports for 2.5GbE and four RJ-45 ports for 1GbE—each with one pair LAN bypass, as well as four 10GbE SFP+ ports. AAEON note that the platform's networking capacity can be expanded via NIM slot, which can accommodate either a PoE module for an additional dual 2.5GbE PoE LAN interfaces or extra fiber-based networking ports for extended distances.

Earlier today, three of Intel's South Korean authorized distributors announced the introduction of Raptor Lake-R-based "Value Pack Genuine" buying options—Danawa's news section stated that the involved companies are: PC Direct, Coit, and Intec & Company. The newly revealed "reasonably priced" packages will contain 14th Generation Core i5-14600KF or i5-14400F processors. A photo preview (see below) showcases very plain blue retail boxes (with no logo), adorned with information-carrying stickers. The freshly unveiled "Value Pack (genuine product)" designs are region exclusive (for the moment); seemingly slotting somewhere in-between Intel's traditional "Boxed" retail and barebones "Tray" processor offerings.

According to the Danawa report, one of the local distributors stated: "this is a very meaningful moment as it is the first time that an official Intel value pack has been released in Korea. We are pleased to offer a more reasonable price while maintaining the same warranty period and standards as existing genuine products. We hope that this release will allow more consumers to upgrade their PCs without burden." Western news sites have highlighted the Core i5 14600KF Value Pack's cheapest available price point (identified via the Danawa comparison engine); KRW 284,540 (~$199 USD). The traditional "Boxed" retail equivalent goes for KRW 295,700 (~$207 USD), while the barebones "Tray" (OEM-oriented) package is priced at KRW 261,200 (~$183 USD). Tom's Hardware checked out the new offering's Batch # and Serial # codes: "on Intel's warranty information page, (it) said that the ATPO (Batch #) we listed indicated that it was a tray processor...We'd like to believe the numbers on the image were just placeholders that belong to a tray processor, or that Intel RMAs in South Korea are all handled by its distributors." Danawa's news piece repeatedly claims that the two new options offer lower pricing compared to "existing genuine box products," but come with the "same genuine warranty" terms.

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

Intel today showcased how Intel Xeon 6 processors with Efficient-cores (E-cores) have dramatically accelerated time-to-market adoption for the company's solutions in collaboration with the ecosystem. Since product introduction in June 2024, 5G core solution partners have independently validated a 3.2x performance improvement, a 3.8x performance per watt increase and, in collaboration with the Intel Infrastructure Power Manager launched at MWC 2024, a 60% reduction in run-time power consumption.

"As 5G core networks continue to build out using Intel Xeon processors, which are deployed in the vast majority of 5G networks worldwide, infrastructure efficiency, power savings and uncompromised performance are essential criteria for communication service providers (CoSPs). Intel is pleased to announce that our 5G core solution partners have accelerated the adoption of Intel Xeon 6 with E-cores and are immediately passing along these benefits to their customers. In addition, with Intel Infrastructure Power Manager, our partners have a run-time software solution that is showing tremendous progress in reducing server power in CoSP environments on existing and new infrastructure." -Alex Quach, Intel vice president and general manager of Wireline and Core Network Division

As enterprises modernize infrastructure to meet the demands of next-gen workloads like AI, high-performing and efficient compute is essential across the full spectrum - from data centers to networks, edge and even the PC. To address these challenges, Intel today launched its Xeon 6 processors with Performance-cores (P-cores), providing industry-leading performance for the broadest set of data center and network infrastructure workloads and best-in-class efficiency to create an unmatched server consolidation opportunity.

"We are intensely focused on bringing cutting-edge leadership products to market that solve our customers' greatest challenges and help drive the growth of their business," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "The Xeon 6 family delivers the industry's best CPU for AI and groundbreaking features for networking, while simultaneously driving efficiency and bringing down the total cost of ownership."

MiTAC Computing Technology Corporation, a leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation, today announced the launch of its latest server systems and motherboards powered by the latest Intel Xeon 6 with P-core processors. These industry-leading processors are designed for compute-intensive workloads, providing up to twice the performance for the widest range of workloads including AI and HPC.

Driving Innovation in AI and High-Performance Computing
"For over a decade, MiTAC Computing has collaborated with Intel to push the boundaries of server technology, delivering cutting-edge solutions optimized for AI and high-performance computing (HPC)," said Rick Hwang, President of MiTAC Computing Technology Corporation. "With the integration of the latest Intel Xeon 6 P-core processors our servers now unlock groundbreaking AI acceleration, boost computational efficiency, and scale cloud operations to new heights. These innovations provide our customers with a competitive edge, empowering them to tackle demanding workloads with superior empower our customers with a competitive edge through superior performance and an optimized total cost of ownership."

LG Electronics USA (LG) today announced pricing and pre-order availability of its 2025 AI-enabled LG gram lineup, the company's first on-device AI-laptops powered by Intel Core Ultra Series 2 CPUs. Introduced at CES 2025, the new lineup includes the LG gram Pro Z90TP ($1999 to $2399), LG gram Pro Copilot+PC Z90TS ($1849 to $2399), LG gram Pro 2-in-1 T90TP ($1999 to $2399) and LG gram Copilot+PC Z90TL ($1999 to $2399). Leveraging LG's gram AI technology, and cloud AI capabilities powered by GPT-4o, these laptops deliver impressive hybrid AI performance while preserving the LG gram's iconic slim and lightweight design.

Throughout the duration of the pre-order period (Feb. 24, 2025 to March 23, 2025), customers will receive an LG gram +view IPS portable monitor (349.99 value) at no additional cost and $200 savings on select models. All standard terms of purchase apply.

MSI is excited to partner with SEGA for an exclusive limited-time offer! From February 20 to March 20, 2025, customers who purchase selected MSI Z890 Series Motherboards will receive a FREE Like a Dragon: Pirate Yakuza in Hawaii game key. Dive into the pirate adventure and level up your gaming experience today!

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A Bloomberg report said Silver Lake Management, a large private equity firm, has begun exclusive talks to buy a controlling stake in Intel's Altera division. Altera focuses on versatile chips that are widely used in telecommunications networks. The size of the stake is still being worked out, but negotiations have moved forward, people familiar with the deal said, speaking on condition of anonymity. They caution that things could slow down or the deal might not happen. When asked, people speaking for Intel and Silver Lake did not comment.

The news jolted the market, sending Intel shares up as much as 17% on Tuesday, Feb. 18, 2025, marking their biggest single-day gain in nearly five years. The surge was driven in part by separate speculation about a potential spinoff involving Taiwan Semiconductor Manufacturing Co (TSMC). By late afternoon trading in New York, Intel shares were up 15%, valuing the company at about $117 billion. If the sale goes through, it would mark a major shift for Intel as it tries to reshape its business. While there is no information on the size of the deal, last November Lattice Semiconductor Corp. and a group of buyout firms expressed interest in Altera. Some insiders said that potential buyers valued Altera at just $9 billion, a big drop for Intel, which bought Altera in 2015 for about $17 billion. Intel faces continued challenges following Gelsinger's departure, as the company searches for both a new CEO and a replacement for its Data Center and AI division head, who recently left to become Nokia's chief executive.