Phoronix has taken a short break away from monitoring the latest goings-on at AMD's software department—the site's editor-in-chief, Michael Larabel, took a moment to investigate patch notes relating to Intel's Xe and i915 Linux kernel graphics drivers. Earlier today, he noticed that "two additional PCI IDs" have been added to Team Blue's DG2/Alchemist family. This discovery prompted further sleuthing—after: "some searching and turning up hits within the Intel Compute Runtime code, 0x56BE is for an Intel Arc Graphics A750E variant and 0x56BF is for an Intel Arc Graphics A580E."

The aforementioned GPU identification codes seem to exist in gray area—the patch notes do not reveal whether these new variants are destined for desktop or mobile platforms. VideoCardz cited a remark made by "Bionic_Squash"—the reputable leaker reckons that the: "IDs are linked to Intel's Arc Embedded series. This family is tailored for industrial, business, and commercial applications, ranging from edge systems to powering large interactive screens." It is highly likely that Intel is paving the way for embedded/low-power variants of its existing Arc A750 and A580 GPUs. Tom's Hardware proposes that Team Blue is clearing out its inventory of remaining Alchemist silicon ahead of a successive generation's rollout—Battlemage is a major priority in 2024.

An intriguing offshoot of Intel's Meteor Lake generation of processors has been discovered by hardware sleuth momomo_us—an iBase MI1002 motherboard specification sheet contains references to a 14th Gen Core Ultra (Meteor Lake-PS) family, with a next-gen LGA1851 socket listed as the desktop platform. The industrial iBase Mini-ITX workstation board is "coming soon" according to a promotional image—this could signal a revival of Meteor Lake outside of laptop platforms. 2023 was a bit of a rollercoaster year for MTL-S SKUs (on socket LGA1851)—one moment Team Blue confirmed that it was happening, then a couple of days later it was disposed of. The upcoming Arrow Lake processor generation seems to be the logical taker of this mantle, but the (leaked) existence of Meteor Lake-PS throws a proverbial spanner into the works.

iBase's MTL-PS-ready boards will be niche "industrial/embedded" items—according to Tom's Hardware: "Intel hasn't officially revealed Meteor Lake PS, but given the "PS" designation, these upcoming processors target the IoT market, similar to Alder Lake PS. Therefore, it's safe to assume that Intel is bringing the mobile Meteor Lake processors to the LGA1851 socket...Although the motherboard has (this) socket, no chipset is present because Meteor Lake PS is the spitting image of the Meteor Lake chip and doesn't need a PCH." Team Blue is hyping up Arrow Lake (ARL-S) as its next-gen mainstream desktop platform, with a launch window set for later in 2024—by sharp contrast, Meteor Lake PS parts are highly unlikely to receive much fanfare upon release.

Ugreen, a leading innovator in consumer electronics, is excited to announce the launch of its inaugural Network Attached Storage (NAS) series. The launch is scheduled for March 26 on the popular crowdfunding platform, Kickstarter.com. This campaign is specifically aimed at users in the United States and Germany. As a special incentive, UGREEN is offering an early bird discount of 40%, with prices commencing at just USD $239.99. Visit Kickstarter.com to be among the first to experience UGREEN's innovative NASync series.

UGREEN NASync series is a versatile range designed to cater to a variety of use scenarios. The NASync DXP2800 and NASync DXP4800 and DXP4800 Plus are tailored for personal and home users. For power users and business solutions, UGREEN offers the NASync DXP6800 Pro and NASync DXP8800 Plus. Lastly, the NASync DXP480T Plus is specifically designed to meet the needs of creative and media professionals.

Know more about the Kickstarter campaign here.

George Hotz and his startup operation (Tiny Corporation) appeared ready to completely abandon AMD Radeon GPUs last week, after experiencing a period of firmware-related headaches. The original plan involved the development of a pre-orderable $15,000 TinyBox AI compute cluster that housed six XFX Speedster MERC310 RX 7900 XTX graphics cards, but software/driver issues prompted experimentation via alternative hardware routes. A lot of media coverage has focused on the unusual adoption of consumer-grade GPUs—Tiny Corp.'s struggles with RDNA 3 (rather than CDNA 3) were maneuvered further into public view, after top AMD brass pitched in.

The startup's social media feed is very transparent about showcasing everyday tasks, problem-solving and important decision-making. Several Acer Predator BiFrost Arc A770 OC cards were purchased and promptly integrated into a colorfully-lit TinyBox prototype, but Hotz & Co. swiftly moved onto Team Green pastures. Tiny Corp. has begrudgingly adopted NVIDIA GeForce RTX 4090 GPUs. Earlier today, it was announced that work on the AMD-based system has resumed—although customers were forewarned about anticipated teething problems. The surprising message arrived in the early hours: "a hard to find 'umr' repo has turned around the feasibility of the AMD TinyBox. It will be a journey, but it gives us an ability to debug. We're going to sell both, red for $15,000 and green for $25,000. When you realize your pre-order you'll choose your color. Website has been updated. If you like to tinker and feel pain, buy red. The driver still crashes the GPU and hangs sometimes, but we can work together to improve it."

Intel is quietly working on second generation Arc GPUs—we have not heard much about Xe2 "Battlemage" since CES 2024. Back in January, Tom "TAP" Petersen—an Intel fellow and marketing guru—casually revealed during an interview conducted by PC World: "I'd say about 30% of our engineers are working on Battlemage, mostly on the software side because our hardware team is on the next thing (Celestial)...Battlemage has already has its first silicon in the labs which is very exciting and there's more good news coming which I can't talk about right now." Intel appears to be targeting a loose late 2024 launch window; Petersen stated that he would like to see second generation products arrive at retail before CES 2025's commencement. The SiSoftware Sandra database was updated around mid-March with two very intriguing new Intel GPU entries—test systems (built on an ASUS PRIME Z790-P WIFI mainboard) were spotted running graphics solutions "equipped with 20 Xe-Core (160 EU) and 24 Xe-Cores (160 EU)."

Michael/miktdt commented on the freshly discovered database entries: "some smaller versions are on Sisoft...I guess they are coming. Single-float GP Compute looks quite good for just 160 VE/192 VE. Doesn't tell much about the release though, I guess anything between Q4 2024 and Q2 2025 is a possibility." Both models seem to sport 11.6 GB VRAM capacities—likely 12 GB—and 8 MB of L2 cache. Wccftech has guesstimated potential 192-bit memory bandwidth for these speculative lower-level GPUs. Team Blue has a bit more tweaking to do—based on leaked figures—but time is on their side: "the performance per core for Alchemist currently sits an average of 16% faster than the alleged Battlemage GPU which isn't a big deal since driver-level optimizations and final silicon can give a huge boost when the retail products come out."

According to a report by the Financial Times, China has banned the use of Intel and AMD chips in government computers. The decision, which aims to reduce reliance on foreign technology and boost domestic semiconductor production, is expected to have far-reaching implications for the global tech industry and geopolitical relations. The Chinese government has instructed PC suppliers to replace foreign-made CPUs with domestic alternatives in all government computers within the next two years. This directive is part of China's broader strategy to achieve self-sufficiency in critical technologies and reduce its vulnerability to potential supply chain disruptions or geopolitical tensions. The ban on Intel and AMD chips is likely to significantly impact the two companies, as China represents a substantial market for their products.

However, the move also presents an opportunity for Chinese semiconductor manufacturers like Loongson and Sunway to expand their market share and accelerate the development of their next-generation chip technologies. By reducing its dependence on foreign technology, China aims to strengthen its position in the global tech landscape and mitigate the risks associated with potential sanctions or export controls. As China pushes for self-sufficiency in semiconductors, the global technology industry will likely experience a shift in supply chains and increased competition from Chinese manufacturers. This development may also prompt other countries to reevaluate their reliance on foreign technology and invest in domestic production capabilities, potentially leading to a more fragmented and competitive global tech market.

According to Bloomberg's latest investigation, Huawei and Semiconductor Manufacturing International Corporation (SMIC) have submitted patents on the self-aligned quadruple patterning (SAQP) pattern etching technique to enable SMIC to achieve 5 nm semiconductor production. The two Chinese giants have been working with the Deep Ultra Violet (DUV) machinery to develop a pattern etching technique allowing SMIC to produce a node compliant with the US exporting rules while maintaining the density improvements from the previously announced 7 nm node. In the 7 nm process, SMIC most likely used self-aligned dual patterning (SADP) with DUV tools, but for the increased density of the 5 nm node, a doubling to SAQP is required. In semiconductor manufacturing, lithography tools take multiple turns to etch the design of the silicon wafer.

Especially with smaller nodes getting ever-increasing density requirements, it is becoming challenging to etch sub-10 nm designs using DUV tools. That is where Extreme Ultra Violet (EUV) tools from ASML come into play. With EUV, the wavelengths of the lithography printers are 14 times smaller than DUV, at only 13.5 nm, compared to 193 nm of ArF immersion DUV systems. This means that without EUV, SMIC has to look into alternatives like SAQP to increase the density of its nodes and, as a result, include more complications and possibly lower yields. As an example, Intel tried to use SAQP in its first 10 nm nodes to reduce reliance on EUV, which resulted in a series of delays and complications, eventually pushing Intel into EUV. While Huawei and SMIC may develop a more efficient solution for SAQP, the use of EUV is imminent as the regular DUV can not keep up with the increasing density of semiconductor nodes. Given that ASML can't ship its EUV machinery to China, Huawei is supposedly developing its own EUV machines, but will likely take a few more years to show.

Intel and Arm have signed a memorandum of understanding that finalizes the Emerging Business Initiative, their collaboration to support the startup community. The initiative builds on the April 2023 multi-generation agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. Together, the companies will provide essential intellectual property (IP) and manufacturing support, while also making financial assistance available, to foster innovation and growth for startups developing a range of devices and servers built on Arm-based SoCs and manufactured by Intel Foundry. The Emerging Business Initiative was announced last month at Intel Foundry Direct Connect in San Jose, California.

"Intel Foundry and Arm share the belief that for technology to benefit everyone, the building blocks of innovation must be available to anyone. Startups play a crucial role in bringing the great promise of transformations like AI to reality. The Emerging Business Initiative provides a path for new companies to leverage leading-edge Arm-based SoCs and Intel Foundry's global manufacturing capabilities to make their ideas real," said Stuart Pann, Intel senior vice president and general manager of Foundry Services.

We are excited to announce the first Surface AI PCs built exclusively for business: Surface Pro 10 for Business and Surface Laptop 6 for Business. These new PCs represent a major step forward in customer-focused design and are packed with features that business customers have been requesting - from amazing performance and battery life to more ports, better security and custom, durable anti-reflective displays. These are the first Surface PCs optimized for AI, with the new Copilot key being added to Surface Laptop 6 and Surface Pro keyboards that accelerate access to the best Windows AI experiences. In addition to the new Surface for Business products, we are pleased to announce the Microsoft Adaptive Accessories will now be available to commercial customers.

These new PCs are powered by the latest Intel Core Ultra processors. We partnered with Intel to deliver the power and reliable performance our customers depend on, along with compelling AI experiences for Surface and the Windows ecosystem. Surface has also been leading in Neural Processing Unit (NPU) integration to drive AI experiences on the PC since 2019, and the benefits of these connected efforts are evident. From a performance perspective, Surface Laptop 6 is 2x faster than Laptop 52, and Surface Pro 10 is up to 53% faster than Pro 9. The benefits of the NPU integration include AI features like Windows Studio Effects and Live Captions and the opportunity for businesses and developers to build their own AI apps and experiences.

Intel today released the latest version of Arc GPU Graphics Drivers. Version 101.5379 Beta comes with a massive selection of game-specific performance updates. To begin with, the drivers introduce optimization for Diablo IV ray tracing update; Dragon's Dogma 2 (performance up 18% on average), Horizon Forbidden West (up 6%), and The Legend of the Condor Heroes. The drivers also introduce performance updates for a large selection of games, including Conqueror's Blade (+54%), Detroit: Become Human (+172%), God of War (+36%), and Sons of the Forest (+9%).

Among the issues fixed with 101.5379 Beta include an application crash with Counter Strike 2 at launch; and a similar application crash with DOTA 2; and for Arc iGPUs, an application crash with Serif Affinity Photo 2 when running the benchmark; and Alan Wake 2, which experiences display corruption when turning off the global reflection settings. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5379 Beta

The Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. CHIPS Act funding aims to increase U.S. semiconductor manufacturing and research and development capabilities, especially in leading-edge semiconductors. Intel is the only American company that both designs and manufactures leading-edge logic chips. The proposed funding would help advance Intel's critical semiconductor manufacturing and research and development projects at its sites in Arizona, New Mexico, Ohio and Oregon, where the company develops and produces many of the world's most advanced chips and semiconductor packaging technologies.

"Today is a defining moment for the U.S. and Intel as we work to power the next great chapter of American semiconductor innovation," said Intel CEO Pat Gelsinger. "AI is supercharging the digital revolution and everything digital needs semiconductors. CHIPS Act support will help to ensure that Intel and the U.S. stay at the forefront of the AI era as we build a resilient and sustainable semiconductor supply chain to power our nation's future."

Today, Lenovo launched its latest business laptop offerings in the form of the ThinkPad L series and ThinkPad X13 series. The new laptops are a testament to Lenovo's commitment to innovation and sustainability with features such as enhanced repairability, more recycled materials, efficient power management, and powerful processing capabilities with built-in security and manageability. With these offerings, Lenovo is not only showcasing its technological expertise but also its dedication to supporting a diverse customer base in achieving success across many business segments.

Lenovo's latest ThinkPad L series and X13 series with multiple advancements geared towards enhancing user experience. The new models offer several form factors - including 13-inch or 13-inch 2-in-1, 14-inch and introducing new 16-inch displays in ThinkPad L16 - catering to those in need of portability without compromising performance. Equipped with an optional higher resolution 5MP camera, users can expect enhanced video conferencing and content creation capabilities. The 16:10 ratio displays are designed to offer an immersive viewing experience for optimal productivity and with support up to 64 GB RAM, these laptops promise seamless multitasking and enhanced performance. Improvements in rear vent thermals ensure efficient cooling for prolonged usage, while select models offer support for up to Wi-Fi 7 and 4G LTE or 5G sub6 on select models, enhancing connectivity options. Powered by Intel Core Ultra processors with Intel vPro or AMD Ryzen PRO 7030 Series processors on ThinkPad L14 Gen 5 and L16 Gen 1, these new laptops are designed to optimally run Windows 11 and are poised to elevate productivity and streamline professional tasks.

Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.

GIGABYTE Technology and Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise solutions, will showcase their solutions at the GIGABYTE booth #1224 at NVIDIA GTC, a global AI developer conference running through March 21. This event will offer GIGABYTE the chance to connect with its valued partners and customers, and together explore what the future in computing holds.

The GIGABYTE booth will focus on GIGABYTE's enterprise products that demonstrate AI training and inference delivered by versatile computing platforms based on NVIDIA solutions, as well as direct liquid cooling (DLC) for improved compute density and energy efficiency. Also not to be missed at the NVIDIA booth is the MGX Pavilion, which features a rack of GIGABYTE servers for the NVIDIA GH200 Grace Hopper Superchip architecture.

Colorful unveiled the iGame B760M Ultra Z, a Socket LGA1700 motherboard in the Micro-ATX form-factor, with a distinctive white PCB, but that's hardly the story—this is Colorful's first motherboard with backside connectors, for more discretely cabled PC builds. The board doesn't use any marketing buzzwords such as "BTF" or "Project Zero," but has its onboard connectors aligned to support PC cases with motherboard tray cutouts for either of the two standards. The board draws power from a combination of 24-pin ATX and 4-pin ATX connectors (sufficient for Intel Performance Power Delivery profile). The processor is wired to a PCI-Express 5.0 x16 slot, and an M.2-2280 Gen 4 slot. Colorful used the region of the PCB next to the four DDR5 memory slots—where you'd normally have 24-pin and other connectors—to position an additional M.2 slot hidden behind a heatsink. There is yet another M.2 slot between the two PCIe slots.

The backside of the PCB has the board's power connectors, four SATA 6 Gbps ports, the USB- and HD audio headers, fan headers, and the front-panel headers. Networking connectivity include Wi-Fi 6E and 2.5 GbE. USB connectivity includes two 5 Gbps type-A USB 3.2 Gen 1 ports, a 10 Gbps type-C USB 3.2 Gen 2 port, and four USB 2.0 ports. There are two additional 5 Gbps ports via an internal header. HDMI and DisplayPort make up the display connectivity. The motherboard offers the USB BIOS Flashback feature. Available now in the Chinese market, the Colorful iGame B760M Ultra Z is priced at RMB ¥1,199 or (converts to USD $167).

Artificial intelligence isn't just driving headlines and stock valuations. It's also "pushing the boundaries of silicon technology, packaging technology, the construction of silicon, and the construction of racks and data centers," says Intel's Bob Brennan. "There is an insatiable demand," Brennan adds. Which is great timing since his job is to help satisfy that demand.

Brennan leads customer solutions engineering for Intel Foundry, which aims to make it as easy and fast as possible for the world's fabless chipmakers to fabricate and assemble their chips through Intel factories. "We are engaged from architecture to high-volume manufacturing—soup to nuts—and we present the customer with a complete solution," Brennan asserts.

Two years ago, Intel Corporation and the Italian Government initiated negotiations over the "enabling" of a new state-of-the-art back-end manufacturing facility—a potential investment of up to 4.5 billion euros was mentioned at the time. Italy's chipmaking fund was put together in order to attract several big semiconductor firms, but Team Blue appeared to be the primary target. This week, Minister Adolfo Urso confirmed to media outlets that Intel had: "given up or postponed its investments in France and Italy, compared with others that it plans in Germany." Intel has not commented on this announcement according to a Reuters report—a spokesperson declined to make a statement.

Italy's Business Minister stated that he will welcome a continuation of negotiations, if Intel leadership chooses to diversify its construction portfolio outside of Germany: "if it decides to complete those projects, we are still here." His nation is set to receive further investments, following a recent announcement from Silicon Box—the Singapore-headquartered advanced semiconductor packaging company has signed an up to €3.2 billion deal. Their new Italian facility will: "enable next generation applications in artificial intelligence (AI), high performance computing (HPC)," and other segments. Urso reckons that "there will be others in coming months." He also added that a ministry task force had conducted talks with unnamed Taiwanese groups.

According to the latest report by Reuters, the US government is preparing to announce a multi-billion dollar grant for Intel's chip manufacturing operations in Arizona next week, possibly worth more than $10 billion. US President Joe Biden and Commerce Secretary Gina Raimondo will make the announcement, which is part of the 2022 CHIPS and Science Act aimed at expanding US chip production and reducing dependence on China and Taiwan manufacturing. The exact amount of the grant has yet to be confirmed, but rumors suggest it could exceed $10 billion, making it the most significant award yet under the CHIPS Act. The funding will include grants and loans to bolster Intel's competitive position and support the company's US semiconductor manufacturing expansion plans. This comes as a surprise just a day after the Pentagon reportedly refused to invest $2.5 billion in Intel as a part of a secret defense grant.

Intel has been investing significantly in its US expansion, recently opening a $3.5 billion advanced packaging facility in New Mexico, supposed to create extravagant packaging technology like Foveros and EMIB. The chipmaker is also expanding its semiconductor manufacturing capacity in Arizona, with plans to build new fabs in the state. Arizona is quickly becoming a significant hub for semiconductor manufacturing in the United States. In addition to Intel's expansion, Taiwan Semiconductor Manufacturing Company (TSMC) is also building new fabs in the state, attracting supply partners to the region. CHIPS Act has a total funding capacity of $39 billion allocated for semiconductor production and $11 billion for research and development. The Intel grant will likely cover the production part, as Team Blue has been reshaping its business units with the Intel Product and Intel Foundry segments.

ZOTAC Technology Limited, a global leader in innovative technology solutions, expands its product portfolio with the GPU Server Series. The first series of products in ZOTAC's Enterprise lineup offers organizations affordable and high-performance computing solutions for a wide range of demanding applications, from core-to-edge inferencing and data visualization to model training, HPC modeling, and simulation.

The ZOTAC series of GPU Servers comes in a diverse range of form factors and configurations, featuring both Tower Workstations and Rack Mount Servers, as well as both Intel and AMD processor configurations. With support for up to 10 GPUs, modular design for easier access to internal hardware, a high space-to-performance ratio, and industry-standard features like redundant power supplies and extensive cooling options, ZOTAC's enterprise solutions can ensure optimal performance and durability, even under sustained intense workloads.

ASRock announces that its 700/600 series motherboards support the newly released Intel Core i9-14900KS processor with a new BIOS version to fully unleash its powerful performance. Consumers only need to update to the latest BIOS version to seamlessly experience enhanced gaming performance and productivity. ASRock will continue to update the BIOS for its 700/600 series motherboards. Consumers can update to the latest BIOS version through the ASRock official website or the Live Update & APP Shop, thus fully enjoying the extreme performance offered by the Intel Core i9-14900KS processor.

To download the latest BIOS, visit the support section in the product page of your motherboard model. Start here.

Rumors from last week pointed to a possible $3.5 billion government defense-related investment—Intel was linked to this very lucrative semiconductor supply contract. Insiders posited that the US Department of Commerce was readying a rough $1 billion investment, while the Pentagon prepared around $2.5 billion. The latter has scrapped those plans, according to anonymous sources—Bloomberg believes that this: "move threatens to limit the total amount that Intel has been expecting to get in federal funding, setting up a contentious situation." The publication's moles have requested complete anonymity, due to the secretive nature of policy negotiations.

The US Department of Commerce deliberates over the nation's CHIPS Act—this fund could be utilized to "make up for the shortfall," following the Pentagon's reported last minute course change. The Department of Commerce could be forced to foot the entire bill—of $3.5 billion—if Intel's services are secured. Negotiations over a so-called "Secure Enclave" project have been ongoing since last year, according to insiders. It is possible that the "fast-moving" military spending bill set off alarms at the Pentagon—the Department of Defense's reasonings were not revealed by Bloomberg's investigation. Several media outlets have requested official comments from the two arms of government. Yesterday, Intel shares fell by 3%—as reported Investopedia—with the market reacting to rumors of cancelled plans.

ASUS Republic of Gamers (ROG) today announced that an international group of elite overclockers has set four world records with an ROG Maximus Z790 Apex Encore motherboard featuring the new Intel Core i9-14900KS processor. Along with the ASUS overclocking team, overclocking expert Elmor pushed this processor to a dazzling 9117.75 MHz. Safedisk used the same setup to achieve three additional world records: PiFast completed in just 6.79 seconds, SuperPI 1M finished in 3.768 seconds, and PYPrime 32B finished in 97.596 seconds.

The ROG Maximus Z790 Apex motherboard family is the ultimate choice for enthusiasts and overclockers seeking style and power in their gaming setup. The motherboards are built to help the world's most talented overclockers shatter barriers on their way to new records. In the past few years, the ROG Maximus Z790 Apex motherboard was used to push a 13th Gen Intel Core i9-13900K processor past the 9 GHz barrier for an impressive world record, and the ROG Maximus Z790 Apex Encore was used to push the 14th Gen Intel Core i9-14900KF to 9043.92 MHz.

Intel today launched the Core i9-14900KS Special Edition desktop processor, which forms the company's new flagship product in the desktop segment. The Core i9-14900KS is based on the same "Raptor Lake Refresh" silicon as the i9-14900K, and offers an 8P+16E core configuration. What's new is that Intel has increased clock speeds for both the P-cores and E-cores. The P-cores now boost up to 6.20 GHz, a 200 MHz increase over those of the i9-14900K; while the E-cores boost up to 4.50 GHz, a 100 MHz increase. But these tiny speed bumps aren't what make the i9-14900KS special. It's the 320 W Extreme Power Delivery Profile, something the regular i9-14900K lacks. On select Intel Z790 and Z690 motherboards with two 8-pin EPS power connectors, the processor is able to draw large amounts of power to hold onto its high boost frequencies. Intel also made the i9-14900KS from the highest bins of the "Raptor Lake Refresh" silicon.

The Core i9-14900KS comes with a 3.20 GHz base frequency for the P-cores. Each of the 8 "Raptor Cove" P-cores comes with 2 MB of dedicated L2 cache. The 16 "Gracemont" E-cores are arranged in four E-core clusters. Each cluster shares a 4 MB L2 cache among its four cores. The 8 P-cores and 4 E-core clusters share a 36 MB L3 cache. The processor comes with a base power value of 150 W—25 W higher than the 125 W of the i9-14900K. Its maximum turbo power is still 253 W, and is engaged on platforms capable of Intel Performance Power Delivery Profile. It's only with some of the more premium motherboards that the 320 W Extreme Power Delivery Profile is engaged. The Core i9-14900KS is a Special Edition SKU, meaning that it may not be available in all the markets where the i9-14900K sells. Intel is pricing this chip at $690, a $100 premium over the i9-14900K, though interestingly, $50 cheaper than what its predecessor, the i9-13900KS, launched at.

Be sure to check out the TechPowerUp Review of the Core i9-14900KS.The launch press-deck by Intel, along with its first-party performance claims, follows.

ASUS today announced BIOS updates that enable support for up to 256 GB of memory on its Intel 700 and 600 series motherboards that use DDR5 modules. Such models with four DIMM slots can now support up to 256 GB of memory, while such models with two DIMM slots can now support up to 128 GB. These enhancements significantly improve multitasking potential, ensuring smooth and seamless computing. AMD AM5 motherboards from ASUS do not require a BIOS update to enable support for up to 256 GB of DDR5 memory modules.

The BIOS updates can be accessed on the ASUS support pages for the models listed below.

MeLE, designers of mini PCs, and industrial PCs, unveiled the Fanless Stick PC PCG02 Pro. Measuring 146 mm x 61 mm x 20 mm (LxWxH), this thing is about the size of two smartphones duct-taped together, but weighing as much as one (since there's no battery inside). Under the hood is an Intel N100 "Alder Lake-N" processor, which features one "Gracemont" E-core cluster for a 4-core/4-thread CPU, and an Intel Xe LP-based iGPU with 24 execution units. The N100 in the MeLE PCG02 Pro is wired to 8 GB or 16 GB of LPDDR4X-4266 memory. Storage is in the form of 128 GB or 256 GB of eMMC. The device comes with Windows 11 Home single language pre-installed.

The Fanless Stick PC PCG02 Pro comes with an impressive set of connectivity for its size. Networking options include Wi-Fi 5 ac + Bluetooth 5.1, and a 1 GbE wired Ethernet. Display outputs include two HDMI 2.1, which can power a pair of 4K Ultra HD displays at 60 Hz, each. USB connectivity includes two USB 3.2 Gen 1 (5 Gbps) type-A ports; and a USB 3.2 Gen 2 (10 Gbps) type-C. There is a second type-C port used for power input through any USB PD 3.0 source that can deliver 25 W. A power adapter is included. Depending on the memory- and storage size opted for, the Fanless Stick PC PCG02 Pro is priced between USD $270 to $290. It can power a range of applications between home-entertainment (it's completely fanless), through digital signage, or even most office applications.