During Computex 2024, Intel announced the next-generation compute platform for the notebook segment in the form of the Core Ultra 200V series, codenamed Lunar Lake. Set for release in September 2024, these processors are generating excitement among tech enthusiasts and industry professionals alike. According to the latest leak by VideoCardz, Intel plans to unveil nine variants of Lunar Lake, including Core Ultra 7 and Core Ultra 5 models, with a single high-end Core Ultra 9 variant. While exact specifications remain under wraps, Intel's focus on artificial intelligence capabilities is clear. The company aims to secure a spot in Microsoft's Copilot+ lineup by integrating its fourth-generation Neural Processing Unit (NPU), boasting up to 48 TOPS of performance. All Lunar Lake variants are expected to feature a hybrid architecture with four Lion Cove performance cores and four Skymont efficiency cores.

This design targets low-power mobile devices, striking a balance between performance and energy efficiency. For graphics, Intel is incorporating its next-generation Arc technology, dubbed Battlemage GPU, which utilizes the Xe2-LPG architecture. The leaked information suggests that Lunar Lake processors will come with either 16 GB or 32 GB of non-upgradable LPDDR5-8533 memory. Graphics configurations are expected to include seven or eight Xe2 GPU cores, depending on the model. At the entry level, the Core Ultra 5 226V is rumored to offer a 17 W base power and 30 W maximum turbo power, with performance cores clocking up to 4.5 GHz. The top-tier Core Ultra 9 288V is expected to push the envelope with a 30 W base power, performance cores boosting to 5.1 GHz, and an NPU capable of 48 TOPS. You can check out the rest of the SKUs in the table below.

TrendForce has observed that in 2024, major CSPs such as Microsoft, Google, Meta, and AWS will continue to be the primary buyers of high-end AI servers, which are crucial for LLM and AI modeling. Following establishing a significant AI training server infrastructure in 2024, these CSPs are expected to actively expand into edge AI in 2025. This expansion will include the development of smaller LLM models and setting up edge AI servers to facilitate AI applications across various sectors, such as manufacturing, finance, healthcare, and business.

Moreover, AI PCs or notebooks share a similar architecture to AI servers, offering substantial computational power and the ability to run smaller LLM and generative AI applications. These devices are anticipated to serve as the final bridge between cloud AI infrastructure and edge AI for small-scale training or inference applications.

As Intel gears for the launch of Lunar Lake and Arrow Lake processors, the company appears to be preparing a new line of high-performance processors for gaming laptops. Recent developments suggest that the company is adapting its desktop-grade Arrow Lake-S chips for use in ultra-high-performance notebooks. The buzz began when X user @InstLatX64 spotted Intel testing a peculiar motherboard labeled "Arrow Lake Client Platform/ARL-S BGA SODIMM 2DPC." This discovery hints at the possibility of Intel packing up to 24 cores into laptop processors, eight more cores compared to the 16 cores expected in standard Arrow Lake-H mobile chips. By utilizing the full potential of Arrow Lake-S silicon in a mobile form factor, Intel aims to deliver desktop-class performance to high-end notebooks in a BGA laptop CPU.

The leaked chip would likely feature eight high-performance Lion Cove P-cores and 16 energy-efficient Skymont E-cores, along with an integrated Xe2 GPU. This configuration could provide the raw power needed for demanding games and professional applications in a portable package. However, implementing such powerful hardware in laptops presents challenges. The processors are expected to have a TDP of 45 W or 55 W, with actual power consumption potentially exceeding these figures to maintain high clock speeds. Success will depend not only on Intel's chip design but also on the cooling solutions and power delivery systems developed by laptop manufacturers. As of now, specific details about clock speeds and performance metrics remain under wraps. The test chip that surfaced showed a base frequency of 3.0 GHz, notably without AVX-512 support.

Intel, in its Computex 2024 event unveiled its Core Ultra 300 "Lunar Lake" processor, along with a Q3 2024 date for the processors. It now turns out that the processors won't arrive until Fall 2024, specifically September, when the various notebook OEMs will merely announce their products based on the chips, followed by market availability of these notebooks through Holiday 2024, according to a DigiTimes report. The report also says that Intel's Core Ultra "Arrow Lake-S" desktop processors could see an October 2024 announcement and availability for at least the Unlocked K- and KF SKUs, along with compatible Socket LGA1851 motherboards based on the top Intel Z890 chipset.

The DigiTimes report invited a clarification from Intel through Digital Trends. The company in a statement reaffirmed that the chips will be available "starting in Q3 2024, as noted at Computex." This statement aligns with the timeline that the company would commence shipments of "Lunar Lake" processors to OEMs starting in June, followed by product announcements and market availability in the following months.

Intel today released the latest version of the Arc GPU Graphics drivers. Version 101.5592 WHQL is a minor update over the 101.5590 WHQL drivers that the company released on June 15. It corrects a bug that caused Pugetbench Extended Preset Benchmark to fail on Arc A-series discrete GPUs in certain Adobe Premiere Pro processing tests. The bug had caused the benchmark to fail to complete. The company took the opportunity to identify a handful more issues with certain Vulkan API games such as No Man's Sky, Enshrouded, and Doom Eternal. A bug that causes Topaz Video AI to throw up errors when exporting videos after using some models for video enhancements, has been identified.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5592 WHQL

Today marks a new milestone in the growth of Intel Foundry's design ecosystem as key partners Ansys, Cadence, Siemens, and Synopsys have announced the availability of reference flows for Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. This comes on the heels of recent announcements where those same partners declared readiness for Intel 18A designs. "Today's news shows how Intel Foundry continues to combine the best of Intel with the best of our ecosystem to help our customers realize their AI systems ambitions," said Suk Lee, vice president for Ecosystem Development, Intel Foundry.

The success of Intel Foundry is rooted in collaboration with a vibrant design ecosystem. This ensures customers can access our leading process and packaging technologies. Now, in collaboration with our ecosystem partners, we are making it as easy and as fast as possible for companies to optimize, fabricate and assemble their system-on-chip designs through our foundries, while enabling their designers with validated EDA tools, design flows and IP portfolios for silicon-through-package design. This systems foundry approach allows our customers to innovate at every layer of the stack so they can meet the complex computing demands of the AI era, where chip architectures increasingly rely on multiple CPUs, GPUs and NPUs in a package to achieve performance requirements.

According to the report from Phoronix, the upcoming Linux 6.11 kernel will introduce initial display support for the highly anticipated Intel Battlemage graphics processors. Battlemage, built on Intel's Xe2 architecture, represents the company's latest effort to challenge established players in the graphics arena. This new line of GPUs is designed to succeed the current DG2/Alchemist hardware, promising enhanced performance and improved power efficiency. The Linux 6.11 kernel will provide the fundamental capability to drive displays connected to Battlemage GPUs. While this initial support is a crucial first step, it lays the groundwork for more comprehensive functionality in future updates. Linux users and developers can look forward to testing and providing feedback on these new graphics solutions.

Intel's focus on power efficiency is evident in the features accompanying Battlemage support. The kernel will introduce Panel Replay functionality, a technology aimed at reducing display power consumption. This aligns with the growing demand for energy-efficient computing solutions, particularly in mobile and laptop segments. However, the work is far from complete. Intel's Linux graphics driver team continues to refine and optimize Battlemage support, with the goal of delivering a seamless experience by the time these GPUs hit the market later this year. The introduction of Battlemage support not only expands options for Linux users but also intensifies competition in the GPU market, potentially driving innovation across the industry. With promises of up to 1.5x over the previous generation Arc GPUs, we are in for a decent upgrade this year.

TSMC has commenced mass-production of chips for Intel on its 3 nm EUV FinFET foundry node, according to a report by Taiwan industry observer DigiTimes. Intel is using the TSMC 3 nm node for the compute tile of its upcoming Core Ultra 300 "Lunar Lake" processor. The company went into depth about "Lunar Lake" in its Computex 2024 presentation. While a disaggregated chiplet-based processor like "Meteor Lake," the new "Lunar Lake" chip sees the CPU cores, iGPU, NPU, and memory controllers sit on a single chiplet called the compute tile, built on the 3 nm node; while the SoC and I/O components are disaggregated the chip's only other chiplet, the SoC tile, which is built on the TSMC 6 nm node.

Intel hasn't gone into the nuts and bolts of "Arrow Lake," besides mentioning that the processor will feature the same "Lion Cove" P-cores and "Skymont" E-cores as "Lunar Lake," albeit arranged in a more familiar ringbus configuration, where the E-core clusters share L3 cache with the P-cores (something that doesn't happen on "Lunar Lake"). "Arrow Lake" also features a iGPU based on the same Xe2 graphics architecture as "Lunar Lake," and will feature an NPU that meets Microsoft Copilot+ AI PC requirements. What remains a mystery about "Arrow Lake" is the way Intel will go about organizing the various chiplets or tiles. Reports from February 2024 mentioned Intel tapping into TSMC 3 nm for just the disaggregated graphics tile of "Arrow Lake," but we now know from "Lunar Lake" that Intel doesn't shy away from letting TSMC fabricate its CPU cores. The first notebooks powered by "Lunar Lake" are expected to hit shelves within Q3-2024, with "Arrow Lake" following on in Q4.

Intel on Friday (14/06) released the latest version of the Arc GPU Graphics Drivers. Version 101.5590 WHQL adds Game On (day-zero) optimization for Destiny 2: The Final Shape, and Elden Ring: Shadow of the Erdtree. For the Arc A-series discrete GPUs, the drivers also enhance performance of a couple of older Direct3D 11 and Direct3D 10 titles. For Chivalry 2, you can expect up to 13% improved performance at 1080p with epic settings; while for the original Crysis (2007), performance can be up by 10% with very high settings. The drivers provide similar performance uplifts for the Arc Series integrated graphics in Core Ultra "Meteor Lake" processors, with up to 16% uplifts for Chivalry 2, and up to 6% for Crysis 2 (2011). An intermittent application crash with No Rest for the Wicked has been fixed.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5590 WHQL

Intel has identified the root cause for stability issues being observed with certain high-end 13th- and 14th Gen Core "Raptor Lake" processor models, which were causing games and other compute-intensive applications to randomly crash. When the issues were first identified, Intel recommended a workaround that would reduce core-voltages and restrict the boost headroom of these processors, which would end up with reduced performance. The company has apparently discovered the root cause of the problem, as Igor's Lab learned from confidential documents.

The documents say that Intel isolated the problem to a faulty value in the microcode's end of the eTVB (enhanced thermal velocity boost) algorithm. "Root cause is an incorrect value in a microcode algorithm associated with the eTVB feature. Implication Increased frequency and corresponding voltage at high temperature may reduce processor reliability. Observed Found internally," the document says, mentioning "Raptor Lake-S" (13th Gen) and "Raptor Lake Refresh-S" (14th Gen) as the affected products.

MSI, the leading brand in gaming products, is proud to announce the launch of the MAG Infinite E1. Equipped with processors up to 14th Gen Intel processor and NVIDIA GeForce RTX 40 Series graphics card, the MAG Infinite E1 is designed to be the ultimate gaming companion, delivering unmatched functionality. Built with the iconic MAG spirit of durability and robust construction, the MAG Infinite E1 showcases a design that conveys a stable and endurance, appealing to gamers seeking both power and reliability.

The MAG Infinite E1 is powered by up to an Intel Core i7 processor, offering significant performance enhancements over its predecessor. When combined with the NVIDIA RTX 40 Series graphics card, the MAG Infinite E1 not only leaps in performance but also in AI-enhanced graphics capabilities. Gamers can immerse themselves in lifelike virtual environments with advanced ray tracing and enjoy ultra-high frame rates with minimal latency. Furthermore, the MAG Infinite E1 is equipped with state-of-the-art transmission capabilities including DDR5 memory and M.2 PCI-e SSD slots, ensuring peak performance and making it the ideal choice for gamers who demand the very best.

ASML, the world's sole provider of extreme ultraviolet (EUV) lithography systems essential for manufacturing the most advanced chips, has revealed its roadmap for pushing semiconductor scaling even further. In a recent presentation, former ASML president Martin van den Brink announced the company's plans for a new "Hyper-NA" EUV technology that would succeed the High-NA EUV systems, which are just beginning to deploy. The Hyper-NA tools, still in early research stages, would increase the numerical aperture to 0.75 from High-NA's 0.55, enabling chips with transistor densities beyond the projected limits of High-NA in the early 2030s. This higher numerical aperture should reduce reliance on multi-patterning techniques that add complexity and cost.

Hyper-NA is bringing challenges of its own to commercialization. Key obstacles include light polarization effects that degrade imaging contrast, requiring polarization filters that reduce light throughput. Resist materials may also need to become thinner to maintain resolution. While leading EUV chipmakers like TSMC can likely extend scaling for several more nodes using multi-patterning with existing 0.33 NA EUV tools, Intel has adopted 0.55 High-NA to avoid these complexities. But Hyper-NA will likely become essential across the industry later this decade as High-NA's physical limits are reached. Beyond Hyper-NA, few alternative patterning solutions exist besides expensive multi-beam electron lithography, which lacks the throughput of EUV photolithography. To continue classical scaling, the industry may need to eventually transition to new channel materials with superior electron mobility properties compared to silicon, requiring novel deposition and etch capabilities.

Today, MLCommons published results of its industry AI performance benchmark, MLPerf Training v4.0. Intel's results demonstrate the choice that Intel Gaudi 2 AI accelerators give enterprises and customers. Community-based software simplifies generative AI (GenAI) development and industry-standard Ethernet networking enables flexible scaling of AI systems. For the first time on the MLPerf benchmark, Intel submitted results on a large Gaudi 2 system (1,024 Gaudi 2 accelerators) trained in Intel Tiber Developer Cloud to demonstrate Gaudi 2 performance and scalability and Intel's cloud capacity for training MLPerf's GPT-3 175B1 parameter benchmark model.

"The industry has a clear need: address the gaps in today's generative AI enterprise offerings with high-performance, high-efficiency compute options. The latest MLPerf results published by MLCommons illustrate the unique value Intel Gaudi brings to market as enterprises and customers seek more cost-efficient, scalable systems with standard networking and open software, making GenAI more accessible to more customers," said Zane Ball, Intel corporate vice president and general manager, DCAI Product Management.

AMD's upcoming Ryzen 9000 "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture won't beat the Ryzen 7000X3D series at gaming workloads, said Donny Woligroski, the company's senior technical marketing manager, in an interview with Tom's Hardware. The new "Zen 5" chips, such as the Ryzen 7 9700X and Ryzen 9 9950X, will come close to the gaming performance of the 7800X3D and 7950X3D, but won't quite beat it. The new processors, however, will offer significant generational performance uplifts in productivity workloads, particularly multithreaded workloads that use vector extensions such as VNNI and AVX512. The Ryzen 7 7800X3D remains the fastest gaming desktop processor you can buy, it edges out even Intel's Core i9-14900KS, in our testing.

Given this, we expect the gaming performance of processors like the Ryzen 7 9700X and Ryzen 9 9950X to end up closer to those of the Intel Core i9-13900K or i9-14900K. Gamers with a 7000X3D series chip or even a 14th Gen Core i7 or Core i9 chip don't have much to look forward to. AMD confirmed that it's already working on a Ryzen 9000X3D series—that's "Zen 5" with 3D V-cache technology, and is sounds confident of holding on to the title of having the fastest gaming processors. This doesn't seem implausible.

EK, the leading manufacturer of premium liquid cooling gear, is proud to introduce the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi. This top-tier Ultrablock-class product, part of EK's renowned Quantum Line, is engineered for the ASUS ROG Maximus Z790 Extreme motherboard to ensure flawless compatibility.

The EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi is equipped with the award-winning EK-Quantum Velocity² cooling engine, delivering direct cooling to crucial motherboard components, such as the primary M.2 drive. This monoblock also features:

• Direct connection to Vector² GPU water block and Active Backplate Sets via bypass valves
• Temperature sensors
• Liquid flow meter
• Direct integration with the ROG water-cooling zone
• ILM Replacement Kit

The high purchase price of an electric vehicle (EV) remains one of the biggest barriers for potential buyers on a global scale. EVs are currently more expensive to build than traditional gasoline-powered cars, primarily because of the high costs associated with advanced battery and e-motor technology. The near-term solution is to enhance the efficiency of the existing battery technology through energy savings at the vehicle level, including improved integration with EV station infrastructure. This is exactly the challenge that Silicon Mobility, an Intel Company, has now solved with today's launch of the new OLEA U310 system-on-chip (SoC). This next-gen technology promises to significantly improve the overall performance of electric vehicles (EVs), streamline design and production processes, and expand SoC services to ensure seamless operation across various EV station platforms.

Representing a first for the industry, the new SoC is the only complete solution that combines hardware and software in one and is engineered to match the need for powertrain domain control in electrical architectures with distributed software. Built with a unique hybrid and heterogeneous architecture, a single OLEA 310 FPCU can replace as many as six standard microcontrollers in a system combination in which it controls an inverter, a motor, a gearbox, a DC-DC converter and an on-board-charger. Using the 310 FPCU, original equipment manufacturers (OEMs) and Tier 1 suppliers can control multiple and diverse power and energy functions simultaneously in real time.

EK, the leading computer cooling solutions provider, is rolling out a brand-new water block built from the ground up for the LGA 1700 socket, explicitly designed for delidded Intel Core CPUs. It bears improvements that benefit 14th-generation CPUs and shares almost no parts with the previously released Intel Direct Die water block. It includes a purpose-developed cold plate, cooling fin structure, and mounting mechanism. It relies on standoffs positioned at the four corners of the water block to ensure optimal contact with the CPU, eliminating concerns about applying too much or too little pressure on the bare CPU die, just like the AM5 Direct Die water block. EK's latest water block features EK-Matrix7 compatibility, meaning the product's height and port distance are managed in 7 mm increments for easier loop planning and precise results.

EK-Quantum Velocity² Direct Die D-RGB - 1700 Core Edition
This new direct die LGA 1700 water block is built from scratch and made to squeeze every bit of performance out of the 14th-generation Intel Core CPUs. The top is seethrough glass-like acrylic, with rich D-RGB illumination behind the window, which is riddled with aluminium bars going over the top and two G1/4" extenders that interrupt the flow of the black-anodized aluminium bars. These G1/4" extenders are standard Torque micro extenders. They can be replaced by other products from the EK-Quantum Torque Micro series, be it extenders of different finish, HDP or HDC fittings.

Minisforum consistently impressed us with its bold small footprint computing solutions over the years, and they've taken things a level up this Computex. Imagine a docking station on which you installed a graphics card like you'd slot in an NES cartridge. That's the Minisforum DEG1 OCulink graphics docking station. The dock resembles an 8-bit era Atari. You install a graphics card vertically on its PCI-Express 4.0 x16 slot (electrical Gen 4 x4), and connect 12 V power from the dock to the card (12V-2x6 and 3x 8-pin supported). The dock connects to the host machine over Oculink (Gen 4 x4).

The R3GAF is a pre-built external GPU based on the AMD Radeon RX 7600M XT. It connects to the host over Oculink, and uses an internap power supply to drive the card, with a configured power limit of 120 W. Besides the GPU's connectivity, the dock puts out a trio pf 5 Gbps USB 3.2 Gen 1 ports. Next up, is a Thunderbolt 4 (40 Gbps) dock that puts out two downstream Thunderbolt ports, a handful USB-C ports, an internal M.2 slot, card reader, and DisplayPort output demuxed from the Thunderbolt uplink.

We've seen a lot of motherboards with the power, SATA and USB connectors on the rear at Computex this year, but Chinese Maxsun decided to put the PCIe x16 slot on the back of its Mini-ITX MS-Terminator B760BKB D5 motherboard. This might seem like a crazy move, but with the right chassis, this means that the graphics card won't need a PCIe extension cable, while fitting in a compact chassis. It's also become increasingly hard to retain signal integrity over ribbon cables and with PCIe 5.0, it might be impossible. Another added benefit of this design is that the board also has a PCIe 3.0 x4 slot available for something like a 10 Gbps network card or just about anything else you'd want to plug into a compact PC.

The overall board specs don't really stick out from the crowd, as the Intel B760 chips is a somewhat limiting factor as well. In addition to the PCIe 5.0 x16 slot and the PCIe 3.0 x4 slot, the board also has a pair of PCIe 4.0 M.2 NVMe slots—one on each side of the PCB—and a slim SAS connector using an SFF-8654 connector. In addition to this, the board also has two DDR5 DIMM slots, four SATA ports, a 2.5 Gbps Ethernet port, a DP 1.2, an HDMI 2.0 port, a USB Type-C port of unknown speed and WiFi 6 and Bluetooth 5.2. The power design consists of a fairly basic 8+1+1 phase setup. We'd like to see this board design to become a standard, as it makes a lot of sense for the SFF market to allow for a better placement of the PCI x16 slot to allow for a more compact chassis without having to compromise on the choice of graphics card.

In addition to the new PC cases and PSUs, ENERMAX also unveiled a couple of new and interesting AIO CPU coolers and fans at the Computex 2024 show, including the LIQTECH XTR AiO which can handle quite a high thermal load, the new AQUACore concept, which is actually a compact CPU cooler that integrates the pump and the radiator into a compact solution, and new Montage Flow fans with magnetic daisy-chaining.

The one that piqued our interest is definitely the LIQTECH XTR AIO liquid CPU cooler series, which can handle some impressive thermal loads. To be available in 240 mm, 280 mm, and 360 mm radiator sizes, the LIQTECH XTR can easily AMD Threadripper and Intel Xeon processors, offering 100 percent coverage and uses a powerful EF1 pump in combination with patented shunt-channel technology. According to Enermax and what we saw at the show, the smaller 240 mm can handle well over 500 W of thermal load, while the 360 mm one goes well over 900 W. The LIQTECH XTR also includes a digital built-in display on the pump/block unit, which shows CPU and GPU temperature, or fan RPM data.

At Computex 2024, Colorful has introduced a new PC series of premium componentry for games, called iGame Ultra Series. Carrying a premium white aesthetics, the Ultra Series serves as clean and elegant component for PC builds. At the heart of the Ultra Series is the GeForce RTX 4080 SUPER graphics card. The card has a triple-fan cooling solution with vapor chamber technology that keeps temperatures under control. Powering this GPU is the iGame Z790D5 Ultra motherboard. Supporting the latest Intel 14th Gen CPUs and up to 192 GB of DDR5-7800 RAM. An array of ultra-fast PCIe 5.0 and 4.0 M.2 slots allow multiple high-speed SSDs for ridiculous storage performance. Keeping all of these elite components running is the 850 W iGame P850G Ultra W 80 Plus Gold power supply. Its modular design with dedicated PCIe 5.0 connectors ensures clean cable management and stable power delivery. For cooling the CPU, there is the iGame LQ360 Ultra W all-in-one liquid cooler, which sports a massive 360 mm radiator and a trio of high-static pressure fans. All of these premium components are housed in the iGame C23A Ultra W full-tower chassis. With a spacious dual-compartment layout, front USB-C port, and preinstalled vertical GPU bracket, it offers both incredible expandability and sleek aesthetics.

Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) today announced a definitive agreement under which Apollo-managed funds and affiliates will lead an investment of $11 billion to acquire from Intel a 49% equity interest in a joint venture entity related to Intel's Fab 34. The transaction represents Intel's second Semiconductor Co-Investment Program (SCIP) arrangement. SCIP is an element of Intel's Smart Capital strategy, a funding approach designed to create financial flexibility to accelerate the company's strategy, including investing in its global manufacturing operations, while maintaining a strong balance sheet.

Located in Leixlip, Ireland, Fab 34 is Intel's leading-edge high-volume manufacturing (HVM) facility designed for wafers using the Intel 4 and Intel 3 process technologies. To date, Intel has invested $18.4 billion in Fab 34. This transaction allows Intel to unlock and redeploy to other parts of its business a portion of this investment while continuing the build-out of Fab 34. As part of its transformation strategy, Intel has committed billions of dollars of investments to regaining process leadership and building out leading-edge wafer fabrication and advanced packaging capacity globally.

The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly announces the launch of several next-gen AI+ gaming and business productivity laptops featuring the latest Intel and AMD processors at COMPUTEX 2024. These laptops offer more than 100 TOPS of AI computing power and support more than 500 AI models run optimized on Intel Core Ultra processors, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enabled than any other processor vendor. When equipped with a GeForce RTX Laptop GPU, they offer up to 542 TOPS, delivering peak performance and enabling unique AI experiences.

Additionally, MSI unveiled the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (codenamed "Lunar Lake") and an 8-inch screen, providing a smoother and broader mobile gaming experience.

ASUS, a leading data center solutions provider, today proudly unveils its expertise in delivering comprehensive solutions for high-performance computing (HPC), AI, and diverse enterprise needs in its Data Center Solutions VIP Showcase at Computex 2024. At the event, ASUS demonstrates its expertise in servers, storage and data center architecture with support for Intel, AMD and NVIDIA technologies, as well as its liquid/air-cooling solutions and proprietary, high-quality software platforms. Equipped to meet the demanding requirements of today's data-intensive workloads, ASUS offers tailored solutions that are meticulously designed to elevate performance, reliability and scalability. From research institutions, financial firms, to manufacturing facilities, ASUS stands ready to empower organizations with cutting-edge HPC capabilities.

Unveiling enhanced flexibility with Intel Xeon 6 processors
To build a top-notch ecosystem, strong integration and partnerships are crucial for excellence. ASUS proudly introduces its latest servers, RS700-E12 and RS720-E12 series, powered by Intel Xeon 6 processors. Through fine tuning in hardware design, we've adeptly addressed the challenges of higher performance as well as increased power consumption, while also embracing modular design for more efficient motherboard layout and serviceability. Empowered by ASPEED AST2600 and PFR AST1060, these advancements have been seamlessly integrated into the all-new ASMB12-iKVM on the Intel Xeon 6 processor platform, resulting in remarkable CPU performance and fortified out-of-band management and security. This new architecture enriches all workloads, leveraging Intel 7 process paired with multiple compute cores etched on Intel 3 process, to deliver unparalleled efficiency and reliability.