A ramped up flow of early-to-mid March period leaks—regarding upcoming NVIDIA GeForce RTX 5060 Ti and RTX 5060 graphics cards—suggested an official pre-GTC 2025 unveiling of lower-end Blackwell gaming GPUs. Speculative specifications appeared online earlier in the month, but some key technical talking points seemed to be missing. As reported yesterday, insiders believe that Team Green has adjusted its new product release schedule. Leaked roadmaps have outlined GeForce RTX 5060 Ti cards arriving by mid-April 2025, with less potent RTX 5060 models launching around the middle of May. Despite the alleged delay, VideoCardz has continued its investigation into pre-launch conditions. Their latest report points to full GeForce RTX 5060 Ti specifications being distributed to board partners, at least in the recent past.

Leaked details seemingly reconfirm the existence of 16 GB and 8 GB variants (on a 128-bit memory bus); both utilizing the same GB206-300-A1 GPU with 4608 CUDA cores. VideoCardz disclosed a couple of finer (new) details:"based on the specs we have, both models will ship with 28 Gbps memory. This means that the bandwidth is 448 GB/s, which is 55% higher than the last-gen model. Moving on to GPU clocks, NVIDIA has set a 2407 MHz base clock and a 2572 MHz boost clock for this GB206-based model. This means that the base clock is 97 MHz and the boost is 37 MHz higher than the RTX 4060 Ti." The fresh leak suggest that a few of Team Green's AIBs will be configuring their custom designs with 8-pin power connectors; sufficient for a reported 180 W TDP-rated product. VideoCardz anticipates that the vast majority of GeForce RTX 5060 Ti models will utilize 16-pin connectors. Unfortunately, finalized price guides were not discovered during recent sleuthing sessions.

Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

As expected, Nintendo has kept quiet about the upcoming Switch 2 hybrid console's feature set and internal makeup. The next-gen portable gaming system's debut presentation served as a mostly surface-level teaser. News outlets have relied heavily on leaks for "insider" reportage, going back to the early 2020s—starting off with kopite7kimi's discovery of a mysterious NVIDIA "T239" chipset. As reported last week, Famiboards—a Nintendo-centric online forum—has served as a somewhat reliable source of inside track information. Earlier in the year, one member started to share NDA-busting details about Switch 2's display technology: "I've heard that the screen supports 120 Hz and VRR, which should help a lot in handheld." Weeks later, SecretBoy elaborated on the benefits of this setup: "developers can optimize the handheld profiles of their games with VRR and 40 FPS in mind."

The GamingLeaksAndRumours subreddit views SecretBoy's leaks as being fairly accurate/legitimate: "(they) called out the GPU performance before the clock speeds were leaked; 10 days later back in January (3 TFLOPS docked, 1.4/1.5 TFLOPS handheld)." Earlier today, the tipster's latest musings were compiled into a Reddit summary—another set of quotes reads as follows (in condensed form): "I will reiterate that the screen is 120 Hz with HDR and VRR support. That's what I'm personally most excited for...No idea about the actual quality of the screen, but I think OLED was always going to be too expensive for this feature set, which they needed to get into the first iteration of the hardware so that developers could optimize their games around it (speculation)." Screen technology connoisseurs have expressed much disappointment about Nintendo's alleged selection of an "inferior" panel—many will point out that Valve was inspired by the Switch OLED model (2021); their Steam Deck handheld was famously upgraded/refreshed in 2023 with a fancier screen. Invited guests will get to experience Switch 2's "hugely revelatory" LCD tech at various Nintendo-hosted international preview events in April.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

Back in January 2022, Electronic Arts and Lucasfilm Games announced a new "Star Wars strategy game." Press material revealed a production collaboration between Respawn Entertainment and Bit Reactor. The latter party was described as a: "newly formed studio, helmed by games industry veteran Greg Foerstch (ex-Firaxis Games). Respawn will produce the new Star Wars strategy game while Bit Reactor leads on the development of the title." EA's PR piece did not go into major detail, given the very early nature of the generically monikered strategy project. In the interim, Bit Reactor has spent just over three years of production time on their mystery title. Last Friday, the official Star Wars website published a schedule for next month's Celebration LIVE! Japan event.

Eagle-eyed journos and fans soon noticed an intriguing entry, titled: "Bit Reactor Developer Panel featuring Respawn Entertainment and Lucasfilm Games." The April 19 early Saturday evening slot—4:30PM to 5:30PM, Live on the Galaxy Stage—will be dedicated to a "first look at a new Star Wars turn-based tactics game." According to reports from last summer, Greg Foerstch and fourteen other former Firaxis team members are involved in the making of the EA/Lucasfilm's unnamed Star Wars turn-based IP. Interestingly, a Bit Reactor 2024 blog post goes to great lengths in explaining that there is more to their internal makeup than being mere "XCOM" veterans. The scope of Respawn Entertainment's involvement is not clear, but Vince Zampella's studio is primarily working on an untitled Star Wars Jedi: Survivor sequel. Earlier on in March, an ex-employee leak indicated the unfortunate cancelation of an unannounced first-person shooter game. Industry watchdogs believe that the now dissolved Respawn "new game incubation team" was tasked with the creation of a Titanfall multiplayer prototype.

Over a year ago, industry watchdogs posited that Apple was patiently waiting in line at the front of TSMC's 2 Nanometer GAA "VVIP queue." The securing of cutting-edge manufacturing processes seems to be a consistent priority for the Cupertino, California-headquartered fabless chip designer. Current generation Apple chipsets—at best—utilize TSMC 3 nm (N3E) wafers. Up until very recently, many insiders believed that the projected late 2026 launch of A20 SoC-powered iPhone 18 smartphones would signal a transition to the Taiwanese foundry's advanced 2 nm (N2) node process. Officially, TSMC has roadmapped the start of 2 nm mass production around the second half of 2025.

According to Jeff Pu—a Hong Kong-based analyst at GF Securities—the speculated A20 (2026) chipset could stick with N3P. Leaks suggest that aspects of Apple's next in line "A19" and "A19 Pro" mobile SoCs could be produced via a 3 nm TSMC process. MacRumors has picked up on additional inside track whispers; about Apple M5 processors (for next-gen iPad Pro models) being based on N3P—"likely due to increased wafer costs." Pu reckons that Apple's engineering team has provisioned a major generational improvement with A20's AI capabilities, courtesy of TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology. This significant upgrade is touted to tighten integration between the chip's processor, unified memory, and Neural Engine segments. Revised insider forecasts have positioned A21 chip designs as natural candidates for a shift into 2 nm GAA territories.

According to The Korea Economic Daily, an unlikely alliance—involving Samsung Electronics and Palantir Technologies—was formed at the end of last year. Late last week, insiders posited that the South Korean megacorporation's Foundry business was going through troubled times. It is not clear whether the assistance provided by Palantir's AI-infused suite has produced pleasing results chez Samsung's flagship production hubs, but insiders reckon that utilization of the software started just before Christmas. Local media outlets view this unusual pairing as a "gamble"—reportedly, the new-ish initiative has targeted an improved "semiconductor yield (ratio of good products in total production), quality, and productivity."

The Samsung Foundry appears to be going "all-in" with its 2 nm GAA node process; industry moles picked up on signals transmitted by an alleged special "task force (TF)." This elite team is reportedly entrusted with a challenging two-pronged goal; get 2 nm GAA over the finish line by late 2025, alongside the (connected) finalization of a much-rumored "Exynos 2600" mobile chipset. The Korea Economic Daily news article mentions the expansion of a "Samsung DS Division AI Center" back in December (2025), but falls short of labelling this department as the aforementioned "special task force." Despite a previous reluctance to share sensitive data with external companies, the latest report suggests a significant change in strategy. Further details were disclosed: "(Samsung's) collaboration with Palantir is handled by the DS Division AI Center...The AI Center is an organization that merged the DS Division Innovation Center and SAIT (formerly Samsung Advanced Institute of Technology) AI Center, and is developing DS Division-specific technologies using AI, advancing development software, building AI platforms, and controlling and advancing facilities and infrastructure." Around late February, industry inside trackers predicted continued "smooth" progress with the 2 nm GAA node. Samsung Foundry's fully upgraded "S2" mass production line is expected to come online by Q4 2025.

Officially, NVIDIA has only revealed mobile variants of its GeForce RTX 50 "Blackwell" GPU series going down to RTX 5070. At CES 2025, Jensen Huang's keynote presentation proposed a $1299 entry point for GB206-equipped gaming laptops—rated up to 800 AI TOPS. As demonstrated by recent market trends, "MSRP" recommendations are widely viewed as whimsical recommendations (at best). Pre-orders for upper crust to mid-range GeForce RTX 50-series laptops opened up on February 25, but the missing ROP (Raster Operations Pipeline) problem has seemingly spread to Blackwell's mobile offshoot. Reports suggest that necessary investigations have pushed initial customer-bound deliveries into April. Presumably, unannounced lower end products—in GeForce RTX 5060 and RTX 5050 Mobile form—are similarly delayed.

Earlier today, momomo_us—a notable source of pre-launch information—unearthed an alleged "Razer-authored" new product document. The American-Singaporean brand appears to be preparing a multitude of Razer Blade 16 (2025) SKUs, with a series identified as "RZ09-0528." The leaked MSRP guide contains a major error; Razer's forthcoming flagship model—powered by an AMD Ryzen AI 9 HX 370 "Strix Point" APU and GeForce RTX 5090 Mobile GPU—will not arrive at retail/e-tail with a $1499 price tag. Focusing on the opposite end of Razer's chart, VideoCardz highlighted the $1999 OLED-equipped SKU—featuring a Ryzen AI 9 365 processor and Team Green's unannounced GeForce RTX 5060 Mobile GPU. The speculative steep asking price is not a big surprise, given the expected tagging on of Razer "premium tax." Mid-way through last week, "lowly" GeForce RTX 5050-powered laptops were accidentally listed by retail outlets. The cheapest offering was advertised with a $1720 (including VAT) price point—based on these recent (possibly unfinalized) data points, industry watchdogs have predicted steep asking prices for even the most basic of Blackwell mobile options.

A mysterious HiSilicon Kirin X90 processor was included in a Chinese state report; the official assessment document seems to cover the topics of native CPU reliability and security. Jukanlosreve—a keen watcher of semiconductor industry inside tracks—highlighted the unannounced technology on social media. They alerted TP Huang (aka tphuang) to this discovery, possibly in reaction to the latter's reporting of a wholly Huawei-designed AI laptop. Last week, we heard about a speculated portable enterprise PC series powered by Kunpeng-920 mobile processors. HiSilicon is a Chinese fabless semiconductor firm, operating under Huawei ownership—normally, their Kirin processors are designated as smartphone-based solutions. Industry watchdogs believe that company leadership is paving the way for a new generation of personal and server processors—their current Kunpeng-900 series debuted back in 2019, so natural successors are very likely in the development pipeline. Early last year, insiders proposed that Huawei had prioritized its Ascend 910B AI accelerator chip—despite these rumors, Kirin-related leaks continued to trickle out.

According to industry moles, HiSilicon tends to spread its custom Arm-based Taishan core design across modern Kirin and Kunpeng processor families. Based on Jukanlosreve's initial detective work, Tom's Hardware proposed a plausible outlook for the (leaked) chip's future. Their report theorized: "Huawei's server and PC divisions have been relatively quiet, as evidenced by the lack of new Kunpeng SoC designs. The new Kirin X90, despite its name, could be a possible successor, considering that Huawei is reportedly launching a new 'AI PC' with HarmonyOS next month. It's likely to be fabricated using SMIC's 7 nm process featuring Taishan V120 cores based on either the Armv8 or Armv9 architectures, which are not subject to the US trade ban." Instead of using an old hat Kunpeng-920 SoC, Huawei's forthcoming next-gen "Qingyun" AI laptop could be equipped with a Kirin X90 APU—Tom's Hardware foresees an Apple MacBook-esque "integration of custom hardware and software" with the Chinese tech firm's fully in-house developed model.

Throughout the early months of 2025, PowerColor's new product strategy seemed to signal the retirement of their entry-level "Fighter" graphics card series. A natural replacement—dubbed "Reaper"—was debuted in an official capacity at CES 2025, with AMD's introduction of the new-gen Radeon RX 9070 Series. With the delay of Team Red's RDNA 4 global market release to March 6, the Taiwanese manufacturer proceeded with a launch of custom Radeon RX 7650 GRE Reaper models in China around late February. According to a past weekend VideoCardz news report, PowerColor is expanding its RDNA 3 portfolio once again. Their investigation has unearthed a new Radeon RX 7600 "Fighter V2" model—confusingly, this variant seems to borrow the recently introduced dual-fan Reaper cooling solution.

According to leaked information, PowerColor is expected to launch its "V2" Fighter model to a global buying audience. The AIB's Radeon RX 7650 GRE Reaper cards (in black or white) will continue to serve as Chinese market exclusives. The leaked "RX7600 8G-F/V2" product identifier indicates that PowerColor is keeping its "Fighter" family alive for a little bit longer, perhaps with a designation of cards that utilize older generation architecture. Insiders propose that the incoming PowerColor RX 7600 Fighter V2 model is configured with reference specifications; mirroring version 1.0's credentials. VideoCardz has mocked up speculative packaging (see below); they reckon that a black variant is lined up for an imminent release—the aforementioned product code has cropped up across retail databases.

Nintendo seems to readying a speculated mid-2025 launch of the much-anticipated Nintendo Switch 2 hybrid games console, according to industry watchdogs. International preview events are scheduled to happen throughout April, so online theories have settled on potential May or June release windows. Members of Famiboards—a Nintendo discussion forum—have kept tabs on a wide variety of pre-launch information outlets, going back to 2021. Their latest tracking activities—with eyes firmly trained on shipping manifests—have produced compelling evidence of Switch 2 materials turning up on North American shores in the recent past. A Famiboards detective detailed their discoveries: "so, it finally happened. HVBG exported 383,000 units of the completed console set between January 17th and January 22nd. They were all shipped to the US, and all were of the USZ (US/Canada) region code. 41,598 units of the charging grip were also shipped to the US, confirming that HGU0620 is the charging grip with a product code of BEE-A-ESSKA, which matches the Switch 1 charging grip's HAC-A-ESSKA."

Nintendo's mid-January unveiling of Switch 2 served as a refreshing break from the norm; the Japanese gaming giant operates under very secretive conditions. Their early 2025 teaser showcased a device that seemed to recycle its predecessor's feature set, but the CGI trailer implied mouse-like functionality. Patent leaks have provided further insight into the design of Nintendo's next-gen Joy-Con. Last month, Shuntaro Furukawa—the company's president—disclosed that his team was taking "all possible measures" to provide sufficient stock for Switch 2's launch window. This week's insider investigation paints a promising picture, at least for potential North American buyers: "383k is a decent-sized shipment, but I wouldn't be surprised if the numbers increase. HVBG had received 1.2 million units of one-per-system parts like the SoC and screen as of December, and 1.7 million as of January, and we can expect 100% of those to end up in units shipped to the US. One thing we can learn from the shipments is that the console set is not a bundle."

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

The PC hardware rumor mill theorized that NVIDIA would unveil its GeForce RTX 5060 Ti and RTX 5060 graphics cards today (March 13). An official announcement has not yet transpired—at the time of writing. Earlier in the week, specification sheets for Team Green's cheaper Blackwell GPU models were leaked online—courtesy of kopite7kimi, a noted inside tracker of NVIDIA activities. Not long after that disclosure, reportage focused on an Acer Nitro N50 pre-built gaming PC—featuring an unannounced GeForce RTX 5060 GPU with 8 GB of GDDR7 SDRAM. The relatively rapid delivery of GB206 related leaks suggests that something is on the imminent release horizon.

An anonymous tip-off from a Chinese audience member has resulted in the publication of another VideoCardz investigative article. Apparently an unnamed local e-tailer provided pre-release price points (presumably including VAT) for GeForce RTX 5060 Ti and RTX 5060 graphics card; 4299 RMB and 3799 RMB (respectively). For reference, the tipster's screenshot also included prices for various GeForce RTX 5070 models—the cheapest being 4799 RMB (~$663 USD). As noted by VideoCardz, Chinese baseline MSRP for the RTX 5070 is 4599 RMB (~$635 USD). Curiously, the webstore's entry for a non-specific GeForce RTX 5060 card designates it as a 12 GB variant. This could be a pre-launch error, based on placeholder material—recent leaks have indicated the existence of a lone GeForce RTX 5060 SKU, with 8 GB of VRAM. The GeForce RTX 5060 Ti is tipped to arrive in two forms: with 8 GB or 16 GB VRAM configurations onboard. VideoCardz has heard whispers from industry moles about a possible official lifting of new product embargoes, ahead of next week's GTC 2025 conference.

Microsoft launched its Majorana 1 chip—the world's first quantum processor powered by a Topological Core architecture—last month. The company's debuting of its Majorana design was celebrated as a significant milestone—in 2023, an ambitious roadmap was published by Microsoft's research department. At the time, a tall Majorana particle-based task was set: the building of a proprietary quantum supercomputer within a decade. Returning to the present day; outside parties have criticized Microsoft's February announcements. The Register published an investigative piece earlier today, based on quotes from key players specializing in the field of Quantum studies. Many propose a theoretical existence of Majorana particles, while Microsoft R&D employees have claimed detection and utilization. The Register referred back to recent history: "(Microsoft) made big claims about Majorana particles before, but it didn't end well: in 2021 Redmond's researchers retracted a 2018 paper in which they claimed to have detected the particles."

As pointed out by Microsoft researcher Chetan Nayak; their latest paper was actually authored last March 2024, but only made public in recent weeks. Further details of progress are expected next week, at the American Physical Society (APS) 2025 Joint March Meeting. The Register has compiled quotes from vocal critics; starting with Henry Legg—a lecturer in theoretical physics at the University of St Andrews, Scotland. The noted scholar believes—as divulged in a scientific online comment—that Microsoft's claimed Quantum breakthrough: "is not reliable and must be revisited." Similarly, collaborators from Germany's Forschungszentrum Jülich institute and the University of Pittsburgh, USA released a joint video statement. (Respectively) Experimental physicist Vincent Mourik and by Professor Sergey Frolov outlined: "distractions caused by unreliable scientific claims from Microsoft Quantum."

Intel representatives have placed a Panther Lake demonstration sample unit on an actual pedestal; as reported by PC Games Hardware (PCGH). German press outlets and other visitors were greeted by Team Blue's dedicated showcase plinth at this week's Embedded World 2025 expo/trade fair. The Nuremberg-based event is advertised as a "world-leading conference presenting state-of-the art technology and forward-looking research." Attendees and industry watchdogs reckon that the prominently displayed demo piece is an example of Intel's Panther Lake-H (PTL-H) mobile-oriented chip design. Last October, Pat Gelsinger (now ex-CEO) unveiled a physical PTL-H sample on-stage during his special guest appearance at Lenovo Tech World 2024. During a CES 2025 keynote presentation, Michelle Johnston Holthaus (Intel's interim co-boss) confirmed a 2025 launch window, while holding up another (or the same) Panther Lake chip.

Recent industry insider whispers have suggested that the Intel Foundry is encountering problems with their 18A node process; thus causing a shift in Panther Lake's release schedule. One prominent leaker claims that Team Blue's opening salvo of PTL-H products will roll out in 2026, but rumors were dismissed by an official source (last week). John Pitzer—Corporate Vice President of Investor Relations at Intel—insisted on multiple occasions, during a fireside chat, that his team's Core Ultra 300 series (aka Panther Lake-H) is on track for launch within the second half of 2025. Intel's Embedded World 2025 booth does not feature any technical rundowns relating to the showcased next-gen offering; their minimalist plinth is simply adorned with blue text spelling out: "Panther Lake." NDA-busting details have emerged online, courtesy of insider leaks—the top-most PTL-H SKU could appear with a 4P+8E+4LP+12Xe3 configuration.

The rising prominence of Huawei's Ascend accelerator series has generated plenty of news articles over the past couple of months. Earlier in the week, reports suggested that the Chinese technology giant had circumvented international trade sanctions. Many observers will forget that parts of Huawei's portfolio contain "less ambitious" products; namely notebook PCs. Despite navigating tricky conditions in 2024, the manufacturer still has access to a supply of Intel-produced processors—but a contingency plan is reportedly in place. TP Huang (aka tphuang) reckons that a completely in-house formulated "domestic commercial PC" is due for release in China. The technology soothsayer's social media post mentioned a "7 nm Kunpeng-920 CPU" clocked at 2.6 GHz. Previously, Huawei's Kunpeng proprietary processor designs were deployed in server (2024) and desktop (2020) environments.

According to Huawei Central, company representatives have disclosed that the mysterious Kunpeng-920-powered AI laptop will be added to their "Qingyun" enterprise-oriented product range. TP Huang elaborated with additional leaked details—the forthcoming model is tipped to feature: "fully domestic power management integrated circuits (PMIC); including Unisoc CT100 replacing EPSON in clock generator. It is expected to run on HarmonyOS PC version and a localized dev tool chain." An extension of Huawei and DeepSeek's current relationship is anticipated to trickle down to portable devices—insiders believe that the new AI notebook will support DeepSeek's model on edge. TP Huang predicts an April launch window.

According to Digital Chat Station—a repeat leaker of unannounced Qualcomm hardware—unnamed Android smartphone manufacturers are considering an eSIM-only operating model for future flagship devices. Starting with the iPhone 14 generation (2022), Apple has continued to deliver gadgets that are not reliant on "slotted-in" physical SIM cards. According to industry insiders, competitors could copy the market leader's homework—Digital Chat Station's latest Weibo blog post discusses the space-saving benefits of eSIM operation; being "conducive to lightweight and integrated design." Forthcoming top-tier slimline Android mobile devices are tipped to utilize Qualcomm's rumored second-generation "Snapdragon 8 Elite Gen 2" (SM8850) chipset.

Digital Chat Station reckons that: "SM8850 series phones at the end of the year are testing eSIM. Whether they can be implemented in China is still a question mark. Let's wait and see the iPhone 17 Air. In order to have an ultra-thin body, this phone directly cancels the physical SIM card slot. Either it will be a special phone for the domestic market, or it will get eSIM." The phasing out of physical SIM cards within the Chinese mobile market could be a tricky prospect for local OEMs, but reports suggest that "traditionally-dimensioned" flagship offerings will continue to support the familiar subscriber identity module standard. Physical SIM card purists often point out that the format still provides superior network support range.

Software redesigns are often a polarizing affair. No matter how a company approaches the task, the final product will always please some people, while displeasing others. However, this fact has hardly ever hindered tech giants from tinkering - or 'innovating', as they call it - and the same is expected for this year's iOS 19 and macOS 16 operating systems. As multiple sources have pointed out, including the reliable Mark Gurman, iOS 16 is likely to receive a major redesign this year, which will include design elements borrowed from Apple's VisionOS - the operating system that powers the Vision Pro.

The same applies to the upcoming macOS 16, internally code-named "Cheer", which is also borrow inspiration from VisionOS. We have witnessed hints of this in iOS 18 already, which includes round icons in the control center, as opposed to its predecessor's square icons with rounded edges. Interestingly, Gurman did not confirm whether all app icons will switch to a round shape, which will be quite interesting since older macOS and OS X versions, all the way to Catalina, boasted round app icons. Of course, design changes are often cyclic, especially in the case with Apple. Moreover, increased translucency should also be prevalent throughout macOS 16 and iOS 19 - yet another design choice that is likely to be divisive in nature. Either way, both iOS 19 and macOS 16 are expected to debut in the summer at WWDC 25, which means we don't have much waiting to do before being granted a sneak peek into the future of macOS and iOS.

According to a Reuters technology report, Meta's engineering department is engaged in the testing of their "first in-house chip for training artificial intelligence systems." Two inside sources have declared this significant development milestone; involving a small-scale deployment of early samples. The owner of Facebook could ramp up production, upon initial batches passing muster. Despite a recent-ish showcasing of an open-architecture NVIDIA "Blackwell" GB200 system for enterprise, Meta leadership is reported to be pursuing proprietary solutions. Multiple big players—in the field of artificial intelligence—are attempting to breakaway from a total reliance on Team Green. Last month, press outlets concentrated on OpenAI's alleged finalization of an in-house design, with rumored involvement coming from Broadcom and TSMC.

One of the Reuters industry moles believes that Meta has signed up with TSMC—supposedly, the Taiwanese foundry was responsible for the production of test batches. Tom's Hardware reckons that Meta and Broadcom were working together with the tape out of the social media giant's "first AI training accelerator." Development of the company's "Meta Training and Inference Accelerator" (MTIA) series has stretched back a couple of years—according to Reuters, this multi-part project: "had a wobbly start for years, and at one point scrapped a chip at a similar phase of development...Meta last year, started using an MTIA chip to perform inference, or the process involved in running an AI system as users interact with it, for the recommendation systems that determine which content shows up on Facebook and Instagram news feeds." Leadership is reportedly aiming to get custom silicon solutions up and running for AI training by next year. Past examples of MTIA hardware were deployed with open-source RISC-V cores (for inference tasks), but is not clear whether this architecture will form the basis of Meta's latest AI chip design.

A curiously-specced Acer Nitro N50 (N50-656) pre-built gaming PC system was spotted and then reported online, courtesy of momomo_us's diligent eye—trained on all manner of international retail and e-tail webstores. EvoPC—a small indie outfit, located in Nancy, France—has inadvertently hinted about a potential upcoming launch of NVIDIA's unannounced GeForce RTX 5060 model. VideoCardz believes that Team Green will be unveiling the lower end of its gaming-oriented "Blackwell" GPU product stack.

An imminent announcement—reportedly marked down for this week—could include another GB203-based variant; the GeForce RTX 5060 Ti—in addition, they reckon that NVIDIA will reveal a next-gen "entry-mainstream" offering; in the shape of GeForce RTX 5050. Comprehensive details leaked onto the internet over the past weekend. EvoPC's webshop advertises the "currently unavailable" Acer Nitro N50-656 system with a steep €1589 (~$1735 USD) price tag (subject to change). Their basic rundown of internal parts lists: an Intel Core i7-14700F processor, 32 GB (2 x 16 GB) DDR5 RAM, and NVIDIA's GeForce RTX 5060 GPU with 8 GB of GDDR7 SDRAM.

In an exclusive report, Windows Central has claimed that Microsoft is collaborating with an unnamed "PC gaming OEM" on an Xbox handheld console. Jez Corden has heard from several insiders; they reckon that a "later in 2025" launch is possible, if development goes smoothly enough. A leak from Winter 2024 indicated that Microsoft's gaming division was "targeting a handheld gaming experience," but Phil Spencer has freely disclosed his ambitions for his team's portable project. Last November, he confirmed that something was in pipeline—with a view to take on very visible competition: Steam Deck, ASUS ROG Ally and Lenovo Legion Go. The latest Windows Central investigative piece divulges some unprecedented details about: "codename 'Keenan,' this gaming handheld will look unmistakably 'Xbox' we're told, complete with an official Xbox guide button, and Xbox design sensibilities. Given that this is a partner device, similar to Lenovo's SteamOS partnership with Valve, I expect this handheld to be more PC-oriented. Keenan is almost definitely running full Windows, putting the Microsoft Store and PC Game Pass front and center, alongside the ability to install things like Steam."

Based on inside track knowledge, Corden anticipates operating system innovations: "I expect the handheld will test new Windows 11 'device aware' capabilities, while reducing third-party OEM bloatware that are typical of devices like the Lenovo Legion Go and ASUS ROG Ally. I expect Microsoft will leverage widgets on the Xbox Game Bar on PC for controlling things like TDP and fan speed, while hopefully having a more streamlined OS experience for controller use. Of course, existing PC gaming OEMs will benefit from these efforts as well—but the research will also help with Microsoft's further-out plans." Almost a month and a half ago, Spencer outlined a sort of wishlist for "innovative" future Xbox hardware—given that Sony is rumored to be devising a "standalone PlayStation handheld," he was likely envisioning next-gen home consoles. Windows Central's sources have provided additional insights into potential Xbox Series X|S successors.

Supply chain insiders believe that NVIDIA's "Blackwell Ultra" GB300 AI chip design will get a formal introduction at next week's GTC 2025 conference. Jensen Huang's keynote presentation is scheduled—the company's calendar is marked with a very important date: Tuesday, March 18. Team Green's chief has already revealed a couple of Blackwell B300 series details to investors; a recent earnings call touched upon the subject of a second half (of 2025) launch window. Industry moles have put spotlights on the GB300 GPU's alleged energy hungry nature. According to inside tracks, power consumption has "significantly" increased when compared to a slightly older equivalent; NVIDIA's less refined "Blackwell" GB200 design.

A Taiwan Economic Daily news article predicts an upcoming "second cooling revolution," due to reports of "Blackwell Ultra" parts demanding greater heat dissipation solutions. Supply chain leakers have suggested effective countermeasures—in the form of fully liquid-cooled systems: "not only will more water cooling plates be introduced, but the use of water cooling quick connectors will increase four times compared to GB200." The pre-Christmas 2024 news cycle proposed a 1400 W TDP rating. Involved "Taiwanese cooling giants" are expected to pull in tidy sums of money from the supply of optimal heat dissipating gear, with local "water-cooling quick-connector" manufacturers also tipped to benefit greatly. The UDN report pulled quotes from a variety of regional cooling specialists; the consensus being that involved partners are struggling to keep up with demand across GB200 and GB300 product lines.

Apple's recent unveiling of refreshed Mac Studio models—in "mismatched" M3 Ultra and M4 Max forms—was greeted with a lukewarm reception from press and public. The absence of an M4 Ultra option has disappointed many folks within the high-end Mac buying populace—rumors of a delayed development of Apple's "Mac Studio M4 Ultra model" emerged online last October. The M3 Ultra processor serves as a somewhat dissatisfying stopgap—prior to last week's official announcement, insiders were still actively questioning the existence of said chip. Last week, Apple representatives reportedly informed Ars Technica and Numerama about their "Ultra" tier not reaching "every chip generation." Follow-up articles have suggested that the M4 Max chip design does not feature an UltraFusion connector; thus cutting off a main path to potential M4 Ultra routes.

Based on previous-gen history, Mac-specialist news sites propose the upcoming M3 Ultra chipset being—in effect—the result of two M3 Max chips joined together via Apple's UltraFusion connection system. Further speculation points to the company's engineering department having to start with a blank canvas; involving a speculative monolithic die design. Noted Apple leaker—Mark Gurman—has disclosed additional theories via his paywalled Bloomberg "Power On" newsletter. As interpreted by MacRumors: "Apple is reluctant to develop an M4 Ultra chip from scratch due to production challenges, costs, and the relatively small sales volume of its desktop computers, like the Mac Studio. So, that seems to rule out the only other way in which Apple could have released an M4 Ultra chip." Several media outlets posit that Apple will skip a generation, and instead focus on getting UltraFusion connections working with next-gen "M5" processors. A refreshed Mac Pro lineup is reportedly on the cards; mid-January reports linked the next-gen workstation series to a very powerful "Hidra" chip design.

AMD has officially stated that its portfolio of RDNA 4 generation graphics cards consists of Radeon RX 9070 XT, RX 9070, and RX 9060 XT models. Last December, a longer list of GPUs appeared online—this pre-Christmas 2024 leak revealed Radeon RX 9060, RX 9050 and RX 9040 identifiers. Team Red seems to be working on populating the lower end of its Radeon RX 9000 family—similarly, Team Green is reportedly expanding its "Blackwell" GPU generation into the "entry-mainstream" segment with their RTX 5050 card design.

Late last week, a Mexican PC hardware retailer inadvertently added Radeon RX 9060 and 9050 categories (not product listings) to its webstore. Noted graphics card watchdogs picked up on the shop's accidental adding of search filters; prompting the swift removal of NDA-busting material (by the time of writing). Resultant VideoCardz news coverage has spread the word of possible forthcoming launches of much cheaper RDNA 4 GPU models. AMD and involved board partners are likely aiming to get lower-mid-range Radeon RX 9060 XT cards out of the door by the second quarter of 2025. Recent leaks indicate Radeon RX 9060 (non-XT) and RX 9050-class products potentially arriving at retail closer to summertime, with speculated "Navi 44" GPUs onboard.

Last week, Acer registered a glut of new graphics card SKUs—an extensive EEC filing revealed several unannounced Nitro and Predator BiFrost Radeon RX 9060 XT models. The AMD board partner seems to be preparing two memory configurations for its lower-end RDNA 4 custom cards: 16 GB and 8 GB (GDDR6). VideoCardz reached out to AIB industry moles, in order to establish whether the aforementioned specification points were concrete. A past weekend report "reconfirms" incoming 16 GB and 8 GB variants. Going back to RDNA 3, Team Red released its Radeon RX 7600 XT GPU in 16 GB form, while the cheaper Radeon RX 7600 made do with a VRAM pool of 8 GB. An unnamed board partner's list of launch day offerings reportedly contains basic technical specs (see screenshot below).

Leaked Radeon RX 9060 XT details show 16 GB GDDR6 and 8 GB GDDR6 variants, with 128-bit memory interfaces. VideoCardz believes that 20 Gbps memory chips will be utilized, as featured on recently launched Radeon RX 9070 series cards. The leaked product list indicates that required juice will be delivered through a lone 8-pin power connector; a minimum PSU requirement suggestion is 500 W, although this could jump up to 550 W for factory overlocked SKUs. A speculative "Navi 48 LE" GPU variant is present within TechPowerUp's GPU database entry for the Radeon RX 9060 XT. VideoCardz reckons that a "Navi 44" GPU would be more appropriate for this class; perhaps derived from a mobile part. The leak suggests the presence of a single HDMI 2.1 port, as well as two DP 2.1 ports—a smaller GPU would have trouble driving more than that. During an official RDNA 4 launch event—held in Beijing, late last month—a Team Red representative announced a loose Q2 2025 launch window for Radeon RX 9060 XT graphics cards.