Earlier today Nintendo released its financial/earning reports for the fiscal year ending March 2023, and company president Shuntaro Furukawa has briefed investors about sales forecasts, according to a report published by Bloomberg. Furukawa-san predicts that the Switch gaming console will only sell 15 million units over the next fiscal year - sales have been slowing down for a while according to Nintendo's figures, with almost 18 million units purchased throughout 2022-23. The numbers are still very impressive when you consider that Nintendo's flagship gaming platform has been on the market for just over six years - across that span of time, total unit sales have hit the 125.62 million mark.

Furukawa also informed shareholders about the prospect of a Switch console successor arriving within the next fiscal period - Bloomberg's article brings the bad news at this point - it seems that Nintendo is not anticipating a new hardware launch within that time frame. Nintendo's software release schedule - especially in regards to first party titles - looks very threadbare for the rest of the year. The much anticipated Legend of Zelda: Tears of the Kingdom arrives on Friday (May 12) followed by Pikmin 4 in July, but things look to be quiet after that - unless Nintendo has a few surprises lined up for June's preview event season. Rumors of a next generation Switch have been doing the rounds since 2020, back then a "Pro" model was often touted - fans later found out that Nintendo had simply refreshed the system with an OLED panel, some tweaks to chipset efficiency, and updated the docking system to modern output standards - this premium model hit the market in late 2021.

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

Marketing pictures of two custom-design GeForce RTX 4070 "Ada" (non-Ti) graphics card models by GALAX, were leaked to the web. The more simple-looking of the two is very likely the GALAX RTX 4070 EX Gamer White; while the other more flashy of the two, could be the GALAX RTX 4070 SG White. What's interesting is that both cards are triple-slot, including with their I/O brackets, for what is supposed to be a mid performance-segment product positioned below the recently launched RTX 4070 Ti.

Rumored specifications of the RTX 4070 (non-Ti) have it, that the SKU is based on the same 4 nm "AD104" silicon as the RTX 4070 Ti, albeit significantly cut-down, with only 46 out of 60 streaming multiprocessors (SM) on the silicon being enabled (that's 76% of the available SIMD machinery). This works out to 5,888 CUDA cores, 46 RT cores, and 184 Tensor cores. The card might get the same 12 GB memory size, across the 192-bit GDDR6X memory bus of the AD104, with the same 21 Gbps memory speed, working out to 504 GB/s bandwidth. One reason why GALAX's cards look this buff could have to do with NVIDIA's partners reusing their RTX 4070 Ti board designs for their premium RTX 4070 cards.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

15th September, 2022, is when AMD will debut its Ryzen 7000 "Zen 4" desktop processors. The launch strategy of these chips looks similar to that of the Ryzen 5000 series. The company is preparing a lean launch lineup with just four SKUs—the Ryzen 9 7950X, the Ryzen 9 7900X, Ryzen 7 7800X, and the Ryzen 5 7600X. These SKUs succeed the 5950X, 5900X, 5800X, and 5600X, which made up the previous launch lineup. AMD in its recent interview with us, made it clear that 16-core/32-thread is the maximum core-count for the 7000 series, which would make the 7950X such a chip. The core-counts of the other SKUs are not known. All these models are built in the Socket AM5 package, featuring PCI-Express Gen 5 and DDR5 interfaces. But wait, there's more.

Although AMD led us to believe that it's going all-in with DDR5, we're hearing a spectacular rumor that suggests otherwise. Apparently, the company is designing Socket AM4 processors with "Zen 4" chiplets, possibly paired with the existing cIOD that supports PCI-Express Gen 4 and DDR4 interfaces. The rumor surfaced among sources lower down the supply-chain (resellers). It seems like AMD isn't convinced it could target the lower-end of the market with AM5 just yet, and isn't 100% confident that affordable DDR5 memory will come through in time. The "Zen 4" + AM4 processors would compete with Intel 600-series chipset motherboards that have DDR4 and PCIe Gen 4 connectivity. Trouble is, you can upgrade your Intel LGA1700 motherboard to one that has DDR5+PCIe Gen5 while keeping your processor; but you can't do so with an AM4 Zen 4 processor (you're stuck on AM4). AMD still gets to sell some processors, and those with AM4 platforms can rejoice.

The upcoming generation of graphics cards from NVIDIA look set to feature significantly higher power budgets than their predecessors according to a recent claim from leaker Kopite. The RTX 4090 has been rumored to feature a TDP above 400 W for some time and this latest leak indicates that the RTX 4080 may also ship with an increased power requirement of 420 W. This RTX 4080 (PG139-SKU360) would represent an increase of 100 W compared to the RTX 3080 with power rises also expected with the RTX 4070 and RTX 4060. The RTX 4070 could see a power budget as high as 400 W if NVIDIA chooses to use GDDR6X memory for the card while the RTX 4060 is rumored to see a 50 W increase to 220 W at a minimum. The preliminary rumors indicate a launch date for these cards in late 2022.

AMD has historically thrown brute memory bus width at solving memory-management problems in its graphics architectures, but the Infinity Cache technology launched with RDNA2 proved to be a game changer, as GPUs with narrow 256-bit memory interfaces could compete with NVIDIA's offerings that have 384-bit wide memory interfaces and faster GDDR6X memory types. It looks like the competition between NVIDIA "Ada" and AMD RDNA3 graphics architectures is about to heat up, as rumors are emerging of AMD giving its biggest next-gen ASIC, the "Navi 31," a 384-bit wide memory interface.

This 50 percent increase in memory bus width, runs in concert with two associated rumors—one, that the company will use faster 20 Gbps GDDR6 memory chips; and two, that AMD may increase the size of the on-die Infinity Cache memory. Samsung is already mass-producing 20 Gbps and 24 Gbps GDDR6 memory chips. These are regular GDDR6 memory chips with JEDEC-standard signaling, and not GDDR6X, an exclusive memory type innovated by NVIDIA and Micron Technology, which leverages PAM4 signaling to increase data-rates. A theoretical "Navi 31" with 20 Gbps GDDR6 memory speeds would enjoy 960 GB/s of memory bandwidth, a massive 87.5 percent bandwidth increase over the RX 6900 XT. The on-die Infinity Cache operates at speeds measured in several TB/s. The increased bus width could also signal an increase in memory sizes, with the RX 6950 XT successor featuring at least 24 GB of memory.

The rumor mill is attempting to nail down the specific launch date of AMD's purported RDNA 2 series refresh. According to renowned leaker Enthusiastic Citizen over at Chiphell forums, AMD is now planning to launch updated versions of its RDNA2 graphics cards around April 20th or April 21st. It seems that AMD is updating three different SKUs based on the RDNA2 silicon, perhaps in order to increase their market attractiveness (and competitiveness) against both NVIDIA's lineup and Intel's upcoming Arc Alchemist series, which is expected to launch in the next several weeks as well.

The new cards, which are expected to carry updated model names, are currently expected to be the RX 6950XT (a response to NVIDIA's oft-delayed RTX 3090 Ti graphics card), the RX 6750XT (likely meant to compete against Intel's upcoming Arc Alchemist A700 series, and the RX 6650XT. The only available details purport to the RX 6950XT, which is expected to not only carry upgraded 18 Gbps GDDR6 VRAM, but also an increased power limit of 350 W (above the 300 W from the reference RX 6900XT. The other two GPU updates should follow suit along the memory frequency and power consumption increases.

NVIDIA is preparing to launch an ultimate solution for high-end laptops and gamers that could benefit from the high-performance graphics card integration in mobile systems like gaming laptops. Rumored to launch sometime in January, NVIDIA is preparing a GeForce RTX 3080 Ti mobile GPU SKU that supposedly offers the highest performance in the Ampere mobile family. According to sources close to VideoCardz, team green has prepared to announce RTX 3080 Ti mobile design with faster memory and higher total graphics power (TGP). The memory speed will get an upgrade to 16 Gbps, compared to the 14 Gbps speed in RTX 3080 mobile SKU.

Similarly, the total overall TGP will also receive a bump to 175 Watts. This is just a tad higher than the 165 Watt TGP of RTX 3080 mobile. The Ti version will upgrade the CUDA core count and other things like TMUs to undetermined specifications. Currently, it is rumored that the Ti version could carry 7424 CUDA cores, which is an upgrade from 6144 of the regular RTX 3080 version.

NVIDIA is rumored to be giving its GeForce RTX 30-series "Ampere" graphics card family a mid-term refresh by the 2022 International CES, in January; the company is also targeting Q4-2022, specifically October, to debut its next-generation RTX 40-series. The Q1 refresh will include "SUPER" branded SKUs taking over key price-points for NVIDIA, as it lands up with enough silicon that can be fully unlocked. This leak comes from Greymon55, a reliable source on NVIDIA leaks. It also aligns with the most recent pattern followed by NVIDIA to keep its GeForce product-stack updated. The company had recently released "Ti" updates to certain higher-end price-points, in response to competition from the Radeon RX 6000 "RDNA2" series.

NVIDIA's next-generation will be powered by the "Lovelace" graphics architecture that sees even more hardware acceleration for the RTX feature-set, more raytraced effects, and preparation for future APIs. It also marks NVIDIA's return to TSMC, with the architecture reportedly being designed for the 5 nm (N5) silicon fabrication node. The current-gen GeForce "Ampere" chips are being products on an 8 nm foundry node by Samsung.

Nintendo Switch is one of the most successful gaming console launches in the past few years. It has seen massive consumer adoption, and Nintendo is even expanding its production. The only logical thing for other companies watching this would be to step in the game and launch their console. That is exactly was the latest rumor suggests about Apple. According to a rumor coming from the South Korean forum, Apple could be preparing a Switch-like design, just with its custom Apple ecosystem surrounding it. As the rumors suggest, the fruit company could get into the console gaming market by launching a product based on custom hardware. Rumors suggest that Apple could use a custom processor to power the console, which wouldn't be like M or A versions the company currently uses. Of course, this is just a rumor and it should be treated as such.

A fresh rumor straight from the rumor mill paints AMD's next APU iterations as being updated to the latest and greatest architectures the company has to offer. The rumor comes from ExecutableFix via Twitter, a leaker who has a relatively proven track record on being right regarding upcoming hardware releases. This rumor can lay some credence to others, painting AMD's Ryzen 7000 series as being the first AMD APU-only release since they began their journey with the Zen architecture - it makes sense for the company to integrate their latest architectures in the mobile-geared Rembrandt first, working out some possible interaction quirks that might arise between the two architectures when deployed in the same package.

The leaker further affirms that the Rembrandt APUs will feature up to 12 RDNA2 CUs, which would amount to 768 stream processors on-chip - a marked increase from the current-generation 8 CUs based on the Vega architecture on their Ryzen 4000 mobile series. The leaker also discloses that AMD's Warhol seems to be MIA in recent AMD documentation and planning when it comes to the deployment of Zen3+, and that Rembrandt should be the one to carry that particular architecture refinement through to the 6 nm process. It would seem that AMD's Vega would "finally" see its demise, bringing about some much-needed performance improvements to counter Intel's investments in GPU performance with Xe.

Intel announced their 11th Generation Tiger Lake-H processors for high-end gaming laptops at CES 2021. The three models announced are now shipping in slim gaming machines and target the AMD Ryzen 5000H series processors. The Intel models compete favorably in single-core performance but only feature four cores and eight threads while the Ryzen 5000H series processors include up to 8 cores and 16 threads giving them the clear advantage in multi-core performance.

Intel is planning to close this performance gap with the launch of three new 45 W 8 core 11th Generation H-series processors in Q2 2021 with a possible announcement at Computex. The three models include the unlocked Core i9-11980HK, Core i9-11900H, and the Core i7-11800H along with the Core i5-11400H with six cores. These new processors will compete directly with the Ryzen 9 5980HX, Ryzen 9 5900H, and Ryzen 7 5800H with the Core i9-11980HK likely to feature a boost clock of 5 GHz on multiple cores.

On December 31st, AMD's Radeon group has filed a patent for a chiplet architecture of the GPU, showing its vision about the future of Radeon GPUs. Currently, all of the GPUs available on the market utilize the monolithic approach, meaning that the graphics processing units are located on a single die. However, the current approach has its limitations. As the dies get bigger for high-performance GPU configurations, they are more expensive to manufacture and can not scale that well. Especially with modern semiconductor nodes, the costs of dies are rising. For example, it would be more economically viable to have two dies that are 100 mm² in size each than to have one at 200 mm². AMD realized that as well and has thus worked on a chiplet approach to the design.

AMD reports that the use of multiple GPU configuration is inefficient due to limited software support, so that is the reason why GPUs were kept monolithic for years. However, it seems like the company has found a way to go past the limitations and implement a sufficient solution. AMD believes that by using its new high bandwidth passive crosslinks, it can achieve ideal chiplet-to-chiplet communication, where each GPU in the chiplet array would be coupled to the first GPU in the array. All the communication would go through an active interposer which would contain many layers of wires that are high bandwidth passive crosslinks. The company envisions that the first GPU in the array would communicably be coupled to the CPU, meaning that it will have to use the CPU possibly as a communication bridge for the GPU arrays. Such a thing would have big latency hit so it is questionable what it means really.

Intel's upcoming 11th Generation Core i9-11900K processor boosts up to 5.30 GHz, according to rumored specs of various 11th Gen Core "Rocket Lake-S" desktop processors, sourced by Harukaze5719. According to this specs-sheet, both the Core i9-11900K and the Core i7-11700K (i7-10700K successor) are 8-core/16-thread parts, and clock-speeds appear to be the only apparent product segmentation between the two. The i9-11900K has a maximum single-core boost frequency of 5.30 GHz, and 4.80 GHz all-core boost. The i7-11700K, on the other hand, has an all-core boost of 4.60 GHz, and 5.00 GHz single-core boost. This time around, even the Core i7 part gets Thermal Velocity Boost.

11th Gen Core i5 continues to be 6-core/12-thread, with Intel allegedly readying an unlocked Core i5-11600K, and a locked i5-11400. Both parts lack TVB. The i5-11600K ticks up to 4.90 GHz single-core, and 4.70 GHz all-core; while the i5-11400 does 4.20 GHz single-core, and 4.40 GHz all-core. The secret-sauce with "Rocket Lake-S" is the introduction of the new "Cypress Cove" CPU cores, which Intel claims offer a double-digit percent IPC gain over the current-gen "Comet Lake," an improved dual-channel DDR4 memory controller with native support for DDR4-3200, a PCI-Express Gen 4 root-complex, and a Gen12 Xe-LP iGPU. The "Cypress Cove" CPU cores also feature VNNI and DLBoost, which accelerate AI DNN; as well as limited AVX-512 instructions. The 11th Gen core processors will also introduce a CPU-attached M.2 NVMe slot, similar to AMD Ryzen. Intel is expected to launch its first "Rocket Lake-S" processors before Q2-2021.

AMD has attempted to fix their mobile processor naming situation with the launch of Ryzen 5000 desktop processors, by skipping Ryzen 4000 on desktop AMD has brought their mobile and desktop processor generations under the one naming scheme. However, it seems this naming scheme simplification hasn't gone as well as expected with leaked specifications for the upcoming Ryzen 5000 mobile series showing a mix of Zen 2 and Zen 3 processors. The leaked processors include the AMD Ryzen 3 5300U (Zen 2), Ryzen 3 5400U (Zen 3), Ryzen 5 5500U (Zen 2), Ryzen 5 5600U (Zen 3), Ryzen 7 5700U (Zen 2), and the Ryzen 7 5800U (Zen 3).

These new processors will maintain the core counts of their Ryzen 4000 predecessors while gaining a modest bump to base and boost speeds. These clock speed improvements will be accompanied by the claimed 19% IPC uplift on the Zen 3 based processors. The processors will also benefit from increased Vega iGPU cores and iGPU clock speed boosts. This combination should offer significantly improved performance over previous generation Ryzen 4000 mobile processors which already offered strong performance against Intel's offerings. AMD is expected to officially announce these processors at an event in January with prices slightly above previous generations.

AMD recently announced their first Ryzen 5000 series chips catering to the high-end market. AMD announced the Ryzen 5 5600X, Ryzen 7 5800X, and Ryzen 9 5900X with the bold claim of gaming supremacy. These chips came with price increases across the board over their predecessors being priced at 299 USD for the Ryzen 5 5600X, 449 USD for the Ryzen 7 5800X, and 549 USD for the 5900X. The AMD Ryzen 5 5600 which is expected to offer the best price to performance was not announced at the event to the disappointment of many wanting to upgrade their Ryzen systems.

According to a recent report AMD plans to release the Ryzen 5 5600 in early 2021 for 220 USD. This represents an 80 USD price cut over the Ryzen 5 5600X and a 20 USD price increase over the Ryzen 5 3600. This launch will likely coincide with BIOS updates for 400 series motherboards to support Ryzen 5000 chips. If AMD can match the performance of Intel's i5-10600K with the Ryzen 5 5600 they will likely have a very impressive value chip on their hands.

Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen and the upcoming ClockTuner for Ryzen, revealed three pieces of juicy details on the upcoming 4th Gen AMD Ryzen "Vermeer" performance desktop processors. He predicts AMD turning up CPU core counts with this generation, including the introduction of new 10-core SKUs, possibly to one-up Intel in the multi-threaded performance front. Last we heard, AMD's upcoming "Zen 3" CCDs (chiplets) feature 8 CPU cores sharing a monolithic 32 MB slab of L3 cache. This should, in theory, allow AMD to create 10-core chips with two CCDs, each with 5 cores enabled.

Next up, are two features that should interest overclockers - which is Bubliy's main domain. The processors should support a feature called "Curve Optimizer," enabling finer-grained control over the boost algorithm, and on a per-core basis. As we understand, the "curve" in question could even be voltage/frequency. It remains to be seen of the feature is leveraged at a CBS level (UEFI setup program), or by Ryzen Master. Lastly, there's mention of new Infinity Fabric dividers that apparently helps you raise DCT (memory controller) frequencies "slightly higher" in mixed mode. AMD is expected to debut its 4th Gen Ryzen "Vermeer" desktop processors within 2020.

Nintendo is reportedly planning to release an upgraded Switch model in early 2021 according to a new report from Taiwanese news outlet Economic Daily News. The new SKU will feature internal flash memory from Macronix and is rumored to receive an upgraded screen, along with enhancements to interactivity features such as haptics, sensors, and the JoyCon controllers. It is currently unknown if this upgrade will replace the base Nintendo Switch as we saw with the battery upgrade in 2019 or if it will be the long-rumored Nintendo Switch Pro. The possibility of an upgraded model is plausible given that the Nintendo Switch was launched back in 2017 but it is unlikely to compete with next-generation consoles, as with any rumor be sure to take it with a grain of salt until Nintendo officially announces anything.

The Apple A14X Bionic is an upcoming processor from Apple which is expected to feature in the upcoming iPad Pro models and should be manufactured on TSMC's 5 nm node. Tech YouTuber Luke Miani has recently provided a performance graph for the A14X chip based on "leaked/suspected A14 info + average performance gains from previous X chips". In these graphs, the Apple A14X can be seen matching the Intel Core i9-9880H in Geekbench 5 with a score of 7480. The Intel Intel Core i9-9880H is a 45 W eight-core mobile CPU found in high-end notebooks such as the 2019 16-inch MacBook Pro and requires significant cooling to keep thermals under control.

If these performance estimates are correct or even close then Apple will have a serious productivity device and will serve as a strong basis for Apple's transition to custom CPU's for it's MacBook's in 2021. Apple may use a custom version of the A14X with slightly higher clocks in their upcoming ARM MacBooks according to Luke Miani. These results are estimations at best so take them with a pinch of salt until Apple officially unveils the chip.

A user on ChipHell going by the alias Alienxzy posted a screenshot taken from an alleged insider account with information regarding plans for next-gen RTX 3090 as fabricated by NVIDIA's AIB partner Colorful. According to the original information, posted on ChipHell as a screenshot, Colorful will be releasing two high-end versions of the RTX 3090 graphics card, in the form of the Vulcan (air-cooled) and Neptune (hybrid cooling) models. According to it, and when the text is parsed through a translator, the tentative pricing for NVIDIA's next-gen is slated at CNY 13,999 (online selling) for the Vulcan X OC, and CNY 12,999 (again online selling) for the Neptune. These translate to roughly $2,000 for the high-end Vulcan X OC and (strangely, for a hybrid, water-cooled version) $1875 for the Neptune. Another pricing of CNY 12,000 is mentioned for the Vulcan ($1,730), so that might actually be the real pricing (and makes more sense compared to the Neptune).

Some more information is present on the rumor-mill-powering post, such as a 5 V RGB capability that pairs the graphics cards' lighting with that of the motherboard (and vice-versa), as well as improved in-card display for the Vulcan X; meanwhile, sales of the Neptune graphics card for the previous generation were reportedly low, which is why its pricing is reportedly being revised close to its introduction, which will be in the same ballpark of the Vulcan X OC. If true, this should set the pricing trend for NVIDIA's expected top offering in the RTX 3000 series, and it's creeping ever higher - the cost to have a generation's best performer is becoming more and more (insert descriptor here). Even considering NVIDIA's all but guaranteed Founders' Edition, we're looking at a steep pricing landscape. Do please note the rumor tag on the title of the news post, as this isn't confirmed information in any way or form. Images below for the Vulcan X and Neptune are merely representative of current generation's offerings.

Today we are in for an interesting rumor. According to industry sources of Coreteks, Samsung is rumored to be preparing investment in GlobalFoundries manufacturing facilities. In the latest ave of Asian foundries getting away from China and getting close to EU and US soils, Samsung is the latest one to join the list. First, let's explain the situation. The Trump administration has been pushing TSMC to drop all orders from Huawei, and TSMC did it. That way, Huawei Technologies has lost a major chip supplier which enabled the company a competitive edge. Now, the company must turn to Chinese manufacturers and it can't use any US-made product.

Given that GlobalFoundries is a company headquartered in the US (Santa Clara, California), the company is an American corporation, which has fabs in the US, as well as in Europe. It is truly a global foundry system. Samsung, a Korean semiconductor manufacturer, has been rumored to invest in GlobalFoundries Dresden fab, located in Germany. The company will help GlobalFoundries expand its power supply capacity from 63 MegaWatts to 100 MegaWatts. The proposed expansion of GlobalFoundries Dresden fab would be funded exclusively by Samsung. So why is Samsung doing this? The answer to this question is pretty simple - to get closer to western markets. Even if GlobalFoundries has foundries all over the world, it is a US company at its core. So Samsung hopes that from this investment, it can get closer to US soil and gain some new customers in the future. After all, Samsung plans to become the world's biggest semiconductor manufacturer by 2030, the position currently held by its rival TSMC. Below you can check out the expansion plan illustrated by Coreteks:

NVIDIA is slowly preparing to launch its next-generation Ampere graphics cards for consumers after we got the A100 GPU for data-centric applications. The Ampere lineup is getting more and more leaks and speculations every day, so we can assume that the launch is near. In the most recent round of rumors, we have some new information about the GPU SKU and memory of the upcoming GeForce RTX 3070 and RTX 3070 Ti. Thanks to Twitter user kopite7kimi, who had multiple confirmed speculations in the past, we have information that GeForce RTX 3070 and RTX 3070 Ti use a GA104 GPU SKU, paired with GDDR6 memory. The cath is that the Ti version of GPU will feature a new GDDR6X memory, which has a higher speed and can reportedly go up to 21 Gbps.

The regular RTX 3070 is supposed to have 2944 CUDA cores on GA104-400 GPU die, while its bigger brother RTX 3070 Ti is designed with 3072 CUDA cores on GA104-300 die. Paired with new technologies that Ampere architecture brings, with a new GDDR6X memory, the GPUs are set to be very good performers. It is estimated that both of the cards would reach a memory bandwidth of 512 GB/s. So far that is all we have. NVIDIA is reportedly in Design Validation Test (DVT) phase with these cards and is preparing for mass production in August. Following those events is the official launch which should happen before the end of this year, with some speculations indicating that it is in September.

In a recent report by the Verge, Microsoft is reportedly planning a budget console to go along with the Xbox Series X known as the Xbox Series S. The Xbox Series S will be a successor to the popular Xbox One S, codenamed Lockhart it's set to feature the key next-generation improvements found in the Xbox Series X and provide them at a lower price point.

Sources say that the Xbox Series S will target 1080p 60FPS and 1440p 6̶0̶F̶P̶S̶ 30FPS gaming performance, this will be achieved with roughly 1/3rd of the GPU power at 4 TeraFLOPs, and 10 GB of GDDR6 RAM. The Xbox Series S console is rumored to share the same 7 nm AMD Zen 2 SoC a̶t̶ ̶a̶ ̶l̶o̶w̶e̶r̶ ̶c̶l̶o̶c̶k̶ and the same ultra-fast PCIe 4.0 SSD. The console may not feature a disc drive like the Xbox One S All Digital Edition. Microsoft is yet to publicly say anything about the console, so take these rumors with a grain of salt.

Update Jun 30th: Sources tell Eurogamer that Microsoft is planning to unveil the console at an event in August.

An unknown NVIDIA GeForce "Ampere" GPU model surfaced on 3DMark Time Spy online database. We don't know if this is the RTX 3080 (RTX 2080 successor), or the top-tier RTX 3090 (RTX 2080 Ti successor). Rumored specs of the two are covered in our older article. The 3DMark Time Spy score unearthed by _rogame (Hardware Leaks) is 18257 points, which is close to 31 percent faster than the RTX 2080 Ti Founders Edition, 22 percent faster than the TITAN RTX, and just a tiny bit slower than KINGPIN's record-setting EVGA RTX 2080 Ti XC. Futuremark SystemInfo reads the GPU clock speeds of the "Ampere" card as 1935 MHz, and its memory clock at "6000 MHz." Normally, SystemInfo reads the memory actual clock (i.e. 1750 MHz for 14 Gbps GDDR6 effective). Perhaps SystemInfo isn't yet optimized for reading memory clocks on "Ampere."