Digital Chat Station (DCS)—a tenured leaker of Qualcomm pre-release information—has shared new "Snapdragon 8 Elite Gen 2" chipset details. Earlier today, their Weibo feed was updated with a couple of technological predictions. The announced smartphone chip's "SM8850" identifier was disclosed once again, along with the repeated claim that Qualcomm has selected a 3 nm "N3P" node process. Industry watchdogs expect to see the San Diego-headquartered fabless semiconductor designer introduce its next-generation flagship smartphone SoC in October. The current-gen Snapdragon 8 Elite platform was unveiled last Fall; sporting cutting-edge "Oryon" (aka Phoenix) processor cores and an integrated Adreno 830 graphics solution. DCS reckons that the natural successor will reuse a familiar "2 + 6" core configuration; comprised of two prime "big performance" units, and six "normal" performance-tuned units. An Adreno 840 iGPU was listed as DCS's final point of conjecture.

The incoming "Snapdragon 8 Elite Gen 2" chipset was mentioned in the same sentence as rumored "Pegasus" cores (Phoenix's sequel)—slightly far-fetched rumors from 2024 suggested Qualcomm's upgraded processor architecture being tested at maximum frequencies of 5.0 GHz (on performance cores). As pointed out by Wccftech, Gen 1's performance cores run at 4.47 GHz (by default). In today's follow-up post, DCS claimed that Qualcomm's: "self-developed CPU architecture is now in the second generation, with a performance setting of over 380 W+." Industry watchdogs reckon that the "Snapdragon 8 Elite 2" chip will be capable of recording 3.8+ million point tallies in AnTuTu V10 gauntlets, thanks to the alleged utilization of ArmV9 architecture. DCS theorized that the speculated "SM8850" SoC will support ARM's Scalable Matrix Extension 1 (SME 1) and Scalable Vector Extension 2 (SVE2) instruction sets.

According to a report produced by semiconductor industry analysts at Kiwoom Securities—a South Korean financial services firm—Semiconductor Manufacturing International Corporation (SMIC) is expected to complete the development of a 5 nm process at some point in 2025. Jukanlosreve summarized this projection in a recent social media post. SMIC is often considered to be China's flagship foundry business; the partially state-owned organization seems to heavily involved in the production of (rumored) next-gen Huawei Ascend 910 AI accelerators. SMIC foundry employees have reportedly struggled to break beyond a 7 nm manufacturing barrier, due to lack of readily accessible cutting-edge EUV equipment. As covered on TechPowerUp last month, leading lights within China's semiconductor industry are (allegedly) developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production.

Huawei is reportedly evaluating an in-house developed laser-induced discharge plasma (LDP)-based machine, but finalized equipment will not be ready until 2026—at least for mass production purposes. Jukanlosreve's short interpretation of Kiwoom's report reads as follows: (SMIC) achieved mass production of the 7 nm (N+2) process without EUV and completed the development of the 5 nm process to support the mass production of the Huawei Ascend 910C. The cost of SMIC's 5 nm process is 40-50% higher than TSMC's, and its yield is roughly one-third." The nation's foundries are reliant on older ASML equipment, thus are unable to produce products that can compete with the advanced (volume and quality) output of "global" TSMC and Samsung chip manufacturing facilities. The fresh unveiling of SiCarrier's Color Mountain series has signalled a promising new era for China's foundry industry.

In a letter addressed to stockholders, Intel's new CEO—Lip-Bu Tan—roadmapped the importance of a couple of major upcoming product launches. Starting off, Team Blue's new chief detailed a fresh approach, with the casting off of old strategies: "achieving the results I know Intel is capable of starts by refocusing on our customers. This has been priority number one since my first day on the job. I am listening carefully to their feedback so that we continue driving the changes needed to delight our customers and strengthen our competitive position. Plain and simple, the time for talk is over. We must turn our words into action and deliver on our commitments. I have been pleased to see the leadership team has already started driving the culture change needed to make this happen. As CEO, I will continue to drive this transformation so that we move faster, work smarter and make it easier for customers to win with Intel."

Tan's mentioning of Core Ultra "Panther Lake" processors arriving within the second half of this year aligns with prior official statements. Insiders posited that Panther Lake-H (PTL-H) mobile CPUs were delayed into 2026 due to issues with the Foundry's 18A process node, but an Intel executive dismissed these claims a few weeks ago. Interestingly, the firm's Chinese office outlined an "early 2026 volume launch" of "Panther Lake (18A)" chips during a mid-March AI PC press event. A presentation slide indicated that an Early Enablement Program (EEP) is expected to start in October; Team Blue's loose terminology likely classes the sending off of samples—to OEMs, for approval—as a "real" product launch.

Intel GPU enthusiasts have been waiting patiently for news regarding higher-end models; ever since the launches of wallet-friendly Arc Xe2 "Battlemage" B580 and B570 graphics cards. As the cliché goes; recent silence has been deafening—we last heard about a speculative expanded lineup of B-series SKUs around late January. At the time, three mysterious "Battlemage" PCI identifiers turned up online; courtesy of Tomasz Gawroński's detective work. Opinions were split about the exact nature of these leaked "BMG" IDs; one camp envisioned Team Blue having professional variants of their existing B580 in the pipeline—presumably with generously specced pools of 24 GB VRAM onboard. A more optimistic group posited that Intel's Arc Xe2 desktop gaming family would welcome more potent "B750, B770," and (maybe) "B780" SKUs.

Yesterday, Tomasz Gawroński (aka GawroskiT) interacted with another notable source of inside track information: Jaykihn (jaykihn0). Plenty of Team Blue-related "scoops" have emerged via Jaykihn's social media channel; mostly predictions regarding upcoming desktop, mobile and enterprise CPUs. Their latest leak indicates Intel's alleged abandoning of a high-end/larger "BMG-G31" GPU die in 2024; within the third quarter of that year. Insiders have long insisted that the Arc Xe2 "Battlemage" project navigated choppy waters during development; hence the appearance of endless theories about the whole caboodle being called off. Jaykihn clarified that he believes that a "retail" launch of "BMG-G31" dGPUs will no longer take place. Many watchdogs will assume that a gap will be filled by forthcoming Arc Xe3 "Celestial" discrete GPUs. Jaykihn stated that they have no fresh insights into how that project is going.

NVIDIA's supply of Chinese market-exclusive H20 AI GPU faces an uncertain future, due to recently introduced energy-efficiency guidelines. As covered over a year ago, Team Green readied a regional alternative to its "full fat" H800 "Hopper" AI GPU—designed and/or neutered to comply with US sanctions. Despite being less performant than Western siblings, the H20 model proved to be highly popular by mid-2024—industry analysis projected "$12 billion in take-home revenue" for NVIDIA. According to a fresh Reuters news piece, demand for cut-down "Hopper" hardware has surged throughout early 2025. The report cites "a rush to adopt Chinese AI startup DeepSeek's cost-effective AI models" as the main cause behind an increased snap up rate of H20 chips; with the nation's "big three" AI players—Tencent, Alibaba and ByteDance—driving the majority of sales.

The supply of H20 AI GPUs seems to be under threat on several fronts; Reuters points out that "U.S. officials were considering curbs on sales of H20 chips to China" back in January. Returning to the present day, their report sources "unofficial" statements from H3C—one of China's largest server equipment manufacturers and a key OEM partner for NVIDIA. An anonymous company insider outlined a murky outlook: "H20's international supply chain faces significant uncertainties...We were told the chips would be available, but when it came time to actually purchase them, we were informed they had already been sold at higher prices." More (rumored) bad news has arrived in the shape of alleged Chinese government intervention—the Financial Times posits that local regulators have privately advised that Tencent, Alibaba and ByteDance not purchase NVIDIA H20 chips.

Shipping manifests have served as fairly reliable sources of pre-launch information—Everest (aka Olrak29) has discovered many juicy details in recent times. Their latest sleuthing session—combing through NBD documents—has indicated AMD's (alleged) prepping of a larger socket design for next-generation mobile processors. A leaked document alludes to the existence of various "MEDUSA01" jig and block "FP10" socket validation parts. Current-generation Ryzen AI "Strix Point" 300 series APUs utilize the FP8 socket format. Based on the "MEDUSA01" shipping manifest, it seems that a successor will arrive with a larger footprint—measurements of 25 mm x 42.5 mm are repeated throughout the leaked description list. Industry watchdogs surmise that "Medusa Point's" BGA FP10 socket will be approximately 6% larger than its predecessor.

Mid-way through last month, insider theorizations pointed to "Medusa Point" being a chiplet-based design. A "single 12-core Zen 6 CCD" was linked to a TSMC 3 nm-class node, with "N4P" reportedly selected for a separate mobile client I/O die. Readily available 4 nm Ryzen AI "Strix Point" processors are monolithic in nature. Initial inside track info mentioned RDNA 4 technology in the same equation as "Medusa Point," but recent Team Red's recent-ish targeting of "GFX1153" places RDNA 3.5 as the de facto choice.

At the tail end of 2024, AMD technical staffers added the "GFX1153" target to their first-party GPU supported chip list. Almost three months later, PC hardware news outlets and online enthusiasts have just picked up on this development. "GFX1150" family IPs were previously linked to Team Red's RDNA 3.5 architecture. This graphics technology debuted with the launch of Ryzen AI "Strix Halo," "Strix Point" and "Krackan Point" mobile processors. Recent leaks have suggested that Team Red is satisfied with the performance of RDNA 3.5-based Radeon iGPUs; warranting a rumored repeat rollout with next-gen "Medusa Point" APU designs.

Both "Medusa Point" and "Gorgon Point" mobile CPU families are expected to launch next year, with leaks pointing to the utilization of "Zen 6" and "Zen 5" processor cores (respectively) and RDNA 3.5 graphics architecture. RDNA 4 seems to be a strictly desktop-oriented generation. AMD could be reserving the "further out" UDNA tech for truly next-generation integrated graphics solutions. In the interim, Team Red's "GFX1153" IP will likely serve as "Medusa Point's" onboard GPU, according to the latest logical theories. Last year, the "GFX1152" target was associated with Ryzen AI 7 300-series "Krackan Point" APUs.

The status of Intel "Meteor Lake-S" (MTL-S) desktop processors was the subject of much speculation throughout 2023—by September of that year, Team Blue leadership projected an upcoming launch in 2024. Technically, Meteor Lake was deployed to "sort-of desktops" platforms—albeit in mini-PCs that utilized Core Ultra mobile chips. Industry moles insisted that Intel was still actively engaged in production of MTL-S samples in late 2023. According to a recent ITHome report, those insider tales turned out to be legitimate. On Monday (March 24), the online publication revealed the existence of a mysterious "Q46W" engineering sample—courtesy of Kyoka (a trusted source). A CPU-Z diagnostic revealed the unannounced CPU's turboboost capability reaching 4.5 GHz, while base frequency sat at the 2.8 GHz mark.

According to ITHome's investigative piece, Team Blue: "tested a very special desktop processor: it uses the Meteor Lake architecture, has 6 performance cores and 8 energy efficiency cores (6P+8E), but the performance cores (P-cores) do not support Hyper-Threading. The production date of the product in hand is the 51st week of 2023, which is obviously later than the time when Meteor Lake-S was reported to be cancelled for external sales. From this situation, 'Q46W' may be a development test processor for FCLGA1851 platform or the 800 series chipset. Kyoka believes that the processor should be in the ES2 stage." A Xianyu seller—tbNick_3u8k4—is reportedly offloading a surprising quantity of "Intel Confidential Q46W" processors, allegedly manufactured back in early 2024. Photos show tray-mounted units available for sale on Taobao's second hand market platform. tbNick_3u8k4 mentions that this particular batch of Q46W chips "requires a special motherboard to light up," suggesting that readily available Intel 800 Series chipset-based models are not fit for purpose.

Last week, we heard rumors about NVIDIA delaying its launches of GeForce RTX 5060 Ti and RTX 5060 by a couple of weeks. Initially, PC hardware watchdogs anticipated a product unveiling before GTC 2025 kick-off time. Industry insiders did not fully disclose the reasons behind Team Green's revised release schedules for more "budget-friendly" GB206 GPU-based offerings, but supply chain moles posited that GeForce RTX 5060 Ti graphics cards would reach retail by mid-April. As noted by VideoCardz last Saturday, a specific date was leaked by a reliable source: wxnod.

The tenured PC hardware soothsayer reckons that NVIDIA's GeForce RTX 5060 Ti "will be released on April 16th at 9 pm" in 16 GB and 8 GB forms. According to VideoCardz's insider network, "briefings" regarding this alleged launch date were not yet distributed to key figures (i.e. board partners). An upcoming Wednesday rollout could be legitimate, given that Team Green and AIBs let loose GeForce RTX 5070 cards on March 5. A recent leak of GeForce RTX 5060 Ti "full specifications" indicates the laying of groundwork; leading to a potential launch in the coming weeks.

AMD is likely readying its Radeon RX 9060 Series graphics cards for launch in the near future—an official Q2 2025 release window was announced late last month, but company representatives did not go into great detail regarding specifications or pricing. Early March leaks indicated that Team Red board partners were preparing custom Radeon RX 9060 XT models in 16 GB and 8 GB forms; a recent discovery—courtesy of the ever intrepid harukaze5719—corroborates these configurations. Last week, ASUS registered multiple unannounced TUF Gaming, PRIME and DUAL Radeon RX 9060 XT models with the South Korean Radio Agency. Interestingly, only the TUF Gaming OC and non-OC cards are specced with pools of 16 GB VRAM. The rest of the pack makes do with 8 GB.

Similarly, several EEC registrations of Acer "Nitro" and "Predator BiFrost" Radeon RX 9060 XT 16 GB and 8 GB SKUs were spotted by harukaze5719 three weeks ago. According to VideoCardz, leaked AIB technical data suggests the use of GDDR6, 20 Gbps memory chips and 128-bit memory interfaces. TechPowerUp's GPU database still specifies that the Radeon RX 9060 XT is based on a Navi 48 LE GPU variant, but other sources reckon that a "smaller" Navi 44 model would be more appropriate for this class of graphics card. With the rumored delay of NVIDIA's GeForce RTX 5060 Ti and RTX 5060 models, AMD's lower end RDNA 4 offerings could launch during a quiet period.

A ramped up flow of early-to-mid March period leaks—regarding upcoming NVIDIA GeForce RTX 5060 Ti and RTX 5060 graphics cards—suggested an official pre-GTC 2025 unveiling of lower-end Blackwell gaming GPUs. Speculative specifications appeared online earlier in the month, but some key technical talking points seemed to be missing. As reported yesterday, insiders believe that Team Green has adjusted its new product release schedule. Leaked roadmaps have outlined GeForce RTX 5060 Ti cards arriving by mid-April 2025, with less potent RTX 5060 models launching around the middle of May. Despite the alleged delay, VideoCardz has continued its investigation into pre-launch conditions. Their latest report points to full GeForce RTX 5060 Ti specifications being distributed to board partners, at least in the recent past.

Leaked details seemingly reconfirm the existence of 16 GB and 8 GB variants (on a 128-bit memory bus); both utilizing the same GB206-300-A1 GPU with 4608 CUDA cores. VideoCardz disclosed a couple of finer (new) details:"based on the specs we have, both models will ship with 28 Gbps memory. This means that the bandwidth is 448 GB/s, which is 55% higher than the last-gen model. Moving on to GPU clocks, NVIDIA has set a 2407 MHz base clock and a 2572 MHz boost clock for this GB206-based model. This means that the base clock is 97 MHz and the boost is 37 MHz higher than the RTX 4060 Ti." The fresh leak suggest that a few of Team Green's AIBs will be configuring their custom designs with 8-pin power connectors; sufficient for a reported 180 W TDP-rated product. VideoCardz anticipates that the vast majority of GeForce RTX 5060 Ti models will utilize 16-pin connectors. Unfortunately, finalized price guides were not discovered during recent sleuthing sessions.

Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

As expected, Nintendo has kept quiet about the upcoming Switch 2 hybrid console's feature set and internal makeup. The next-gen portable gaming system's debut presentation served as a mostly surface-level teaser. News outlets have relied heavily on leaks for "insider" reportage, going back to the early 2020s—starting off with kopite7kimi's discovery of a mysterious NVIDIA "T239" chipset. As reported last week, Famiboards—a Nintendo-centric online forum—has served as a somewhat reliable source of inside track information. Earlier in the year, one member started to share NDA-busting details about Switch 2's display technology: "I've heard that the screen supports 120 Hz and VRR, which should help a lot in handheld." Weeks later, SecretBoy elaborated on the benefits of this setup: "developers can optimize the handheld profiles of their games with VRR and 40 FPS in mind."

The GamingLeaksAndRumours subreddit views SecretBoy's leaks as being fairly accurate/legitimate: "(they) called out the GPU performance before the clock speeds were leaked; 10 days later back in January (3 TFLOPS docked, 1.4/1.5 TFLOPS handheld)." Earlier today, the tipster's latest musings were compiled into a Reddit summary—another set of quotes reads as follows (in condensed form): "I will reiterate that the screen is 120 Hz with HDR and VRR support. That's what I'm personally most excited for...No idea about the actual quality of the screen, but I think OLED was always going to be too expensive for this feature set, which they needed to get into the first iteration of the hardware so that developers could optimize their games around it (speculation)." Screen technology connoisseurs have expressed much disappointment about Nintendo's alleged selection of an "inferior" panel—many will point out that Valve was inspired by the Switch OLED model (2021); their Steam Deck handheld was famously upgraded/refreshed in 2023 with a fancier screen. Invited guests will get to experience Switch 2's "hugely revelatory" LCD tech at various Nintendo-hosted international preview events in April.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

Back in January 2022, Electronic Arts and Lucasfilm Games announced a new "Star Wars strategy game." Press material revealed a production collaboration between Respawn Entertainment and Bit Reactor. The latter party was described as a: "newly formed studio, helmed by games industry veteran Greg Foerstch (ex-Firaxis Games). Respawn will produce the new Star Wars strategy game while Bit Reactor leads on the development of the title." EA's PR piece did not go into major detail, given the very early nature of the generically monikered strategy project. In the interim, Bit Reactor has spent just over three years of production time on their mystery title. Last Friday, the official Star Wars website published a schedule for next month's Celebration LIVE! Japan event.

Eagle-eyed journos and fans soon noticed an intriguing entry, titled: "Bit Reactor Developer Panel featuring Respawn Entertainment and Lucasfilm Games." The April 19 early Saturday evening slot—4:30PM to 5:30PM, Live on the Galaxy Stage—will be dedicated to a "first look at a new Star Wars turn-based tactics game." According to reports from last summer, Greg Foerstch and fourteen other former Firaxis team members are involved in the making of the EA/Lucasfilm's unnamed Star Wars turn-based IP. Interestingly, a Bit Reactor 2024 blog post goes to great lengths in explaining that there is more to their internal makeup than being mere "XCOM" veterans. The scope of Respawn Entertainment's involvement is not clear, but Vince Zampella's studio is primarily working on an untitled Star Wars Jedi: Survivor sequel. Earlier on in March, an ex-employee leak indicated the unfortunate cancelation of an unannounced first-person shooter game. Industry watchdogs believe that the now dissolved Respawn "new game incubation team" was tasked with the creation of a Titanfall multiplayer prototype.

Over a year ago, industry watchdogs posited that Apple was patiently waiting in line at the front of TSMC's 2 Nanometer GAA "VVIP queue." The securing of cutting-edge manufacturing processes seems to be a consistent priority for the Cupertino, California-headquartered fabless chip designer. Current generation Apple chipsets—at best—utilize TSMC 3 nm (N3E) wafers. Up until very recently, many insiders believed that the projected late 2026 launch of A20 SoC-powered iPhone 18 smartphones would signal a transition to the Taiwanese foundry's advanced 2 nm (N2) node process. Officially, TSMC has roadmapped the start of 2 nm mass production around the second half of 2025.

According to Jeff Pu—a Hong Kong-based analyst at GF Securities—the speculated A20 (2026) chipset could stick with N3P. Leaks suggest that aspects of Apple's next in line "A19" and "A19 Pro" mobile SoCs could be produced via a 3 nm TSMC process. MacRumors has picked up on additional inside track whispers; about Apple M5 processors (for next-gen iPad Pro models) being based on N3P—"likely due to increased wafer costs." Pu reckons that Apple's engineering team has provisioned a major generational improvement with A20's AI capabilities, courtesy of TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology. This significant upgrade is touted to tighten integration between the chip's processor, unified memory, and Neural Engine segments. Revised insider forecasts have positioned A21 chip designs as natural candidates for a shift into 2 nm GAA territories.

According to The Korea Economic Daily, an unlikely alliance—involving Samsung Electronics and Palantir Technologies—was formed at the end of last year. Late last week, insiders posited that the South Korean megacorporation's Foundry business was going through troubled times. It is not clear whether the assistance provided by Palantir's AI-infused suite has produced pleasing results chez Samsung's flagship production hubs, but insiders reckon that utilization of the software started just before Christmas. Local media outlets view this unusual pairing as a "gamble"—reportedly, the new-ish initiative has targeted an improved "semiconductor yield (ratio of good products in total production), quality, and productivity."

The Samsung Foundry appears to be going "all-in" with its 2 nm GAA node process; industry moles picked up on signals transmitted by an alleged special "task force (TF)." This elite team is reportedly entrusted with a challenging two-pronged goal; get 2 nm GAA over the finish line by late 2025, alongside the (connected) finalization of a much-rumored "Exynos 2600" mobile chipset. The Korea Economic Daily news article mentions the expansion of a "Samsung DS Division AI Center" back in December (2025), but falls short of labelling this department as the aforementioned "special task force." Despite a previous reluctance to share sensitive data with external companies, the latest report suggests a significant change in strategy. Further details were disclosed: "(Samsung's) collaboration with Palantir is handled by the DS Division AI Center...The AI Center is an organization that merged the DS Division Innovation Center and SAIT (formerly Samsung Advanced Institute of Technology) AI Center, and is developing DS Division-specific technologies using AI, advancing development software, building AI platforms, and controlling and advancing facilities and infrastructure." Around late February, industry inside trackers predicted continued "smooth" progress with the 2 nm GAA node. Samsung Foundry's fully upgraded "S2" mass production line is expected to come online by Q4 2025.

Officially, NVIDIA has only revealed mobile variants of its GeForce RTX 50 "Blackwell" GPU series going down to RTX 5070. At CES 2025, Jensen Huang's keynote presentation proposed a $1299 entry point for GB206-equipped gaming laptops—rated up to 800 AI TOPS. As demonstrated by recent market trends, "MSRP" recommendations are widely viewed as whimsical recommendations (at best). Pre-orders for upper crust to mid-range GeForce RTX 50-series laptops opened up on February 25, but the missing ROP (Raster Operations Pipeline) problem has seemingly spread to Blackwell's mobile offshoot. Reports suggest that necessary investigations have pushed initial customer-bound deliveries into April. Presumably, unannounced lower end products—in GeForce RTX 5060 and RTX 5050 Mobile form—are similarly delayed.

Earlier today, momomo_us—a notable source of pre-launch information—unearthed an alleged "Razer-authored" new product document. The American-Singaporean brand appears to be preparing a multitude of Razer Blade 16 (2025) SKUs, with a series identified as "RZ09-0528." The leaked MSRP guide contains a major error; Razer's forthcoming flagship model—powered by an AMD Ryzen AI 9 HX 370 "Strix Point" APU and GeForce RTX 5090 Mobile GPU—will not arrive at retail/e-tail with a $1499 price tag. Focusing on the opposite end of Razer's chart, VideoCardz highlighted the $1999 OLED-equipped SKU—featuring a Ryzen AI 9 365 processor and Team Green's unannounced GeForce RTX 5060 Mobile GPU. The speculative steep asking price is not a big surprise, given the expected tagging on of Razer "premium tax." Mid-way through last week, "lowly" GeForce RTX 5050-powered laptops were accidentally listed by retail outlets. The cheapest offering was advertised with a $1720 (including VAT) price point—based on these recent (possibly unfinalized) data points, industry watchdogs have predicted steep asking prices for even the most basic of Blackwell mobile options.

A mysterious HiSilicon Kirin X90 processor was included in a Chinese state report; the official assessment document seems to cover the topics of native CPU reliability and security. Jukanlosreve—a keen watcher of semiconductor industry inside tracks—highlighted the unannounced technology on social media. They alerted TP Huang (aka tphuang) to this discovery, possibly in reaction to the latter's reporting of a wholly Huawei-designed AI laptop. Last week, we heard about a speculated portable enterprise PC series powered by Kunpeng-920 mobile processors. HiSilicon is a Chinese fabless semiconductor firm, operating under Huawei ownership—normally, their Kirin processors are designated as smartphone-based solutions. Industry watchdogs believe that company leadership is paving the way for a new generation of personal and server processors—their current Kunpeng-900 series debuted back in 2019, so natural successors are very likely in the development pipeline. Early last year, insiders proposed that Huawei had prioritized its Ascend 910B AI accelerator chip—despite these rumors, Kirin-related leaks continued to trickle out.

According to industry moles, HiSilicon tends to spread its custom Arm-based Taishan core design across modern Kirin and Kunpeng processor families. Based on Jukanlosreve's initial detective work, Tom's Hardware proposed a plausible outlook for the (leaked) chip's future. Their report theorized: "Huawei's server and PC divisions have been relatively quiet, as evidenced by the lack of new Kunpeng SoC designs. The new Kirin X90, despite its name, could be a possible successor, considering that Huawei is reportedly launching a new 'AI PC' with HarmonyOS next month. It's likely to be fabricated using SMIC's 7 nm process featuring Taishan V120 cores based on either the Armv8 or Armv9 architectures, which are not subject to the US trade ban." Instead of using an old hat Kunpeng-920 SoC, Huawei's forthcoming next-gen "Qingyun" AI laptop could be equipped with a Kirin X90 APU—Tom's Hardware foresees an Apple MacBook-esque "integration of custom hardware and software" with the Chinese tech firm's fully in-house developed model.

Throughout the early months of 2025, PowerColor's new product strategy seemed to signal the retirement of their entry-level "Fighter" graphics card series. A natural replacement—dubbed "Reaper"—was debuted in an official capacity at CES 2025, with AMD's introduction of the new-gen Radeon RX 9070 Series. With the delay of Team Red's RDNA 4 global market release to March 6, the Taiwanese manufacturer proceeded with a launch of custom Radeon RX 7650 GRE Reaper models in China around late February. According to a past weekend VideoCardz news report, PowerColor is expanding its RDNA 3 portfolio once again. Their investigation has unearthed a new Radeon RX 7600 "Fighter V2" model—confusingly, this variant seems to borrow the recently introduced dual-fan Reaper cooling solution.

According to leaked information, PowerColor is expected to launch its "V2" Fighter model to a global buying audience. The AIB's Radeon RX 7650 GRE Reaper cards (in black or white) will continue to serve as Chinese market exclusives. The leaked "RX7600 8G-F/V2" product identifier indicates that PowerColor is keeping its "Fighter" family alive for a little bit longer, perhaps with a designation of cards that utilize older generation architecture. Insiders propose that the incoming PowerColor RX 7600 Fighter V2 model is configured with reference specifications; mirroring version 1.0's credentials. VideoCardz has mocked up speculative packaging (see below); they reckon that a black variant is lined up for an imminent release—the aforementioned product code has cropped up across retail databases.

Nintendo seems to readying a speculated mid-2025 launch of the much-anticipated Nintendo Switch 2 hybrid games console, according to industry watchdogs. International preview events are scheduled to happen throughout April, so online theories have settled on potential May or June release windows. Members of Famiboards—a Nintendo discussion forum—have kept tabs on a wide variety of pre-launch information outlets, going back to 2021. Their latest tracking activities—with eyes firmly trained on shipping manifests—have produced compelling evidence of Switch 2 materials turning up on North American shores in the recent past. A Famiboards detective detailed their discoveries: "so, it finally happened. HVBG exported 383,000 units of the completed console set between January 17th and January 22nd. They were all shipped to the US, and all were of the USZ (US/Canada) region code. 41,598 units of the charging grip were also shipped to the US, confirming that HGU0620 is the charging grip with a product code of BEE-A-ESSKA, which matches the Switch 1 charging grip's HAC-A-ESSKA."

Nintendo's mid-January unveiling of Switch 2 served as a refreshing break from the norm; the Japanese gaming giant operates under very secretive conditions. Their early 2025 teaser showcased a device that seemed to recycle its predecessor's feature set, but the CGI trailer implied mouse-like functionality. Patent leaks have provided further insight into the design of Nintendo's next-gen Joy-Con. Last month, Shuntaro Furukawa—the company's president—disclosed that his team was taking "all possible measures" to provide sufficient stock for Switch 2's launch window. This week's insider investigation paints a promising picture, at least for potential North American buyers: "383k is a decent-sized shipment, but I wouldn't be surprised if the numbers increase. HVBG had received 1.2 million units of one-per-system parts like the SoC and screen as of December, and 1.7 million as of January, and we can expect 100% of those to end up in units shipped to the US. One thing we can learn from the shipments is that the console set is not a bundle."

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

The PC hardware rumor mill theorized that NVIDIA would unveil its GeForce RTX 5060 Ti and RTX 5060 graphics cards today (March 13). An official announcement has not yet transpired—at the time of writing. Earlier in the week, specification sheets for Team Green's cheaper Blackwell GPU models were leaked online—courtesy of kopite7kimi, a noted inside tracker of NVIDIA activities. Not long after that disclosure, reportage focused on an Acer Nitro N50 pre-built gaming PC—featuring an unannounced GeForce RTX 5060 GPU with 8 GB of GDDR7 SDRAM. The relatively rapid delivery of GB206 related leaks suggests that something is on the imminent release horizon.

An anonymous tip-off from a Chinese audience member has resulted in the publication of another VideoCardz investigative article. Apparently an unnamed local e-tailer provided pre-release price points (presumably including VAT) for GeForce RTX 5060 Ti and RTX 5060 graphics card; 4299 RMB and 3799 RMB (respectively). For reference, the tipster's screenshot also included prices for various GeForce RTX 5070 models—the cheapest being 4799 RMB (~$663 USD). As noted by VideoCardz, Chinese baseline MSRP for the RTX 5070 is 4599 RMB (~$635 USD). Curiously, the webstore's entry for a non-specific GeForce RTX 5060 card designates it as a 12 GB variant. This could be a pre-launch error, based on placeholder material—recent leaks have indicated the existence of a lone GeForce RTX 5060 SKU, with 8 GB of VRAM. The GeForce RTX 5060 Ti is tipped to arrive in two forms: with 8 GB or 16 GB VRAM configurations onboard. VideoCardz has heard whispers from industry moles about a possible official lifting of new product embargoes, ahead of next week's GTC 2025 conference.

Microsoft launched its Majorana 1 chip—the world's first quantum processor powered by a Topological Core architecture—last month. The company's debuting of its Majorana design was celebrated as a significant milestone—in 2023, an ambitious roadmap was published by Microsoft's research department. At the time, a tall Majorana particle-based task was set: the building of a proprietary quantum supercomputer within a decade. Returning to the present day; outside parties have criticized Microsoft's February announcements. The Register published an investigative piece earlier today, based on quotes from key players specializing in the field of Quantum studies. Many propose a theoretical existence of Majorana particles, while Microsoft R&D employees have claimed detection and utilization. The Register referred back to recent history: "(Microsoft) made big claims about Majorana particles before, but it didn't end well: in 2021 Redmond's researchers retracted a 2018 paper in which they claimed to have detected the particles."

As pointed out by Microsoft researcher Chetan Nayak; their latest paper was actually authored last March 2024, but only made public in recent weeks. Further details of progress are expected next week, at the American Physical Society (APS) 2025 Joint March Meeting. The Register has compiled quotes from vocal critics; starting with Henry Legg—a lecturer in theoretical physics at the University of St Andrews, Scotland. The noted scholar believes—as divulged in a scientific online comment—that Microsoft's claimed Quantum breakthrough: "is not reliable and must be revisited." Similarly, collaborators from Germany's Forschungszentrum Jülich institute and the University of Pittsburgh, USA released a joint video statement. (Respectively) Experimental physicist Vincent Mourik and by Professor Sergey Frolov outlined: "distractions caused by unreliable scientific claims from Microsoft Quantum."

Intel representatives have placed a Panther Lake demonstration sample unit on an actual pedestal; as reported by PC Games Hardware (PCGH). German press outlets and other visitors were greeted by Team Blue's dedicated showcase plinth at this week's Embedded World 2025 expo/trade fair. The Nuremberg-based event is advertised as a "world-leading conference presenting state-of-the art technology and forward-looking research." Attendees and industry watchdogs reckon that the prominently displayed demo piece is an example of Intel's Panther Lake-H (PTL-H) mobile-oriented chip design. Last October, Pat Gelsinger (now ex-CEO) unveiled a physical PTL-H sample on-stage during his special guest appearance at Lenovo Tech World 2024. During a CES 2025 keynote presentation, Michelle Johnston Holthaus (Intel's interim co-boss) confirmed a 2025 launch window, while holding up another (or the same) Panther Lake chip.

Recent industry insider whispers have suggested that the Intel Foundry is encountering problems with their 18A node process; thus causing a shift in Panther Lake's release schedule. One prominent leaker claims that Team Blue's opening salvo of PTL-H products will roll out in 2026, but rumors were dismissed by an official source (last week). John Pitzer—Corporate Vice President of Investor Relations at Intel—insisted on multiple occasions, during a fireside chat, that his team's Core Ultra 300 series (aka Panther Lake-H) is on track for launch within the second half of 2025. Intel's Embedded World 2025 booth does not feature any technical rundowns relating to the showcased next-gen offering; their minimalist plinth is simply adorned with blue text spelling out: "Panther Lake." NDA-busting details have emerged online, courtesy of insider leaks—the top-most PTL-H SKU could appear with a 4P+8E+4LP+12Xe3 configuration.