EK Waterblocks has unveiled a new air cooler design at their Computex 2020 replacement, EK Cooling Expo. The company released one image of a prototype cooler which appears to include 4 heat pipes and an EK branded fan. EK representatives confirmed to Overclock 3D that the EK heatsink has not been finalized and is still undergoing product design. EK didn't say if they are planning other models or announce pricing/availability of the heatsink. Will EK become a serious competitor in the air cooling market against established players such as Noctua?

Update 09:34 UTC: EK has confirmed that they will be introducing both single and dual-tower models in the EK-AIR series of products, which will feature modern D-RGB lighting, premium build quality, modern aesthetics, and great cooling.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is now bringing some fantastic news for those who have been dying to try out the NeonMaker software without a set of Riing Quad Fans. The NeonMaker software now supports Riing Trio and the Floe DX series coolers. Now is the best chance for users to try out the NeonMaker with different Thermaltake products. Not only will you be able to personalize your lighting effects freely by utilizing the NeonMaker software, but you can also synchronize with the TT RGB Plus software to maximize the control of your RGB effects.

NeonMaker not only provides various default effects, but also lets users customize lighting colors, adjust effects' via the timeline, and lighting directions using the software editor. It also allows users to personalize their lighting effects on each LED, granting access to further customizable lighting options. There's no need to wait, enjoy all RGB related features on the NeonMaker software by using Riing Trio Fans and Floe DX series products.

According to sources at DigiTimes, Intel will announce its advanced cooling solutions for project Athena thin and light laptops, at 2020's CES. Pushing project Athena to be the finest of all laptop options, Intel wants to give users the ability to have their laptops run even cooler than ever with a new thermal solution that will supposedly enable an additional 25-30% of cooling headroom. The new cooling module will combine two ingredients to make up for a powerful cooling solution - vapor chambers and graphite sheets.

Usually, the cooling modules inside laptops are placed between the keyboard and laptop's bottom shell, where they could utilize only a small space, so thermal management became hard. In contrast, Intel's design is combining the vapor chamber with graphite sheets to create a bigger surface for heat dissipation. The vapor chamber will replace all the current modules and connect to graphite sheets placed behind the laptop screen, where a lot of area is available. Connecting the vapor chamber to the graphite sheet is a laptop hinge, where a graphite cooling solution would pass through. This hints at a complete redesign of laptop hinges, so we can expect to see some creative solutions there as well. Additionally, this design will allow manufacturers to make fanless laptops that use lower-power CPU models, and we can expect to see even slimmer laptop designs than ever before.

Thermal Solutions specialist GELID Solutions unveils the latest cooling kit for the M.2 Type 22110 Solid State Drives. The SubZero M.2 XL is a product of GELID Solution Gamer product line. The SubZero M.2 XL is designed to cool down the M.2 Type 22110 SSD efficiently and prevents thermal throttling. It helps to improve performance, increase durability and enhance data integrity of the M.2 solid-state drives.

The SubZero M.2 XL uses the ultra-slim aluminium heatsink and the specially crafted thermal pads to deliver the best heat transfer and maintain significantly lowered operating temperatures for memory ICs and other electronic components of the M.2 Type SSD. Additionally, the set of 3 ultra-durable silicone ring fixtures is supplied with the SubZero M.2 XL to ensure safe mounting of the heatsink. The SubZero M.2 XL features quick installation and fits all standard M.2 Type 22110 SSD designed for laptops or desktops.

Cooler Master, a global leader in designing and manufacturing innovative computer components introduces the MasterAir MA620M CPU Air Cooler. Continuing the renowned MasterAir Series, the MA620M are dual aluminium towers equipped with a newly designed cross-platform mounting system to provide maximum air cooling.

Peak Performance, Unique Aesthetic
The MA620M features a unique dual tower heatsink with enlarged fins and utilizes 6 copper heat pipes for optimal air flow and cooling performance. Inspired by a stealth-like aesthetic design, the MA620M employs unique lighting effects across the top cover of the cooler, powered by addressable RGB.

Cooler Master, a global leader in designing innovative PC components, introduces the MasterFan SF120M, a new addition to the flagship MasterFan Series of computer case fans. The SF120M is designed purely with performance in mind.

The SF120M features a patented, anti-vibration motor featuring dual ball-bearings to reduce friction, increase performance, and minimize noise during operation. Additionally, the frame's exclusive sound damping design featuring rubber corner pads lessen vibrations, further minimizing noise.

Scaling and manufacturing of ever shrinking semiconductor devices is becoming more challenging as smaller nodes are introduced. As we have approached 7 nanometers, economies of scale are becoming more influential than scales of manufacturing. For example, the development of the 7 nm node development cost more than 3 billion USD, while smaller nodes are expected to see that price cross the 5 billion USD mark. So given that we are approaching the limit where we can't squeeze more transistors in two-dimensional space without huge economical impact, we have to utilize another dimension in order to keep performance improvements coming.

AMD has filed a patent for cooling a 3D stacked memory with thermo-electric coolers - TECs, also known as Peltier devices. Being that TECs are made out of P-type and N-type semiconductors, they can easily be integrated into existing silicon manufacturing methods and controlled like a regular device. The process AMD has patented basically describes how to insert the TEC between memory and logic devices, where it draws heat from either logic or memory with each side being able to dissipate the heat. That effect is possible due to nature of TEC, where the direction of heat flow is changed inverting the voltage.

Even more Antec was available for would-be lookers into their stand, with the company showing off a number of PC chassis and Antec's suggested cooling solution to be paired with said cases. The Antec PRIZM Cooling Matrix is one such cooling system, which pairs a dual-fan setup with 2x 120 mm fans framed by ARGB lighting. Antec say these are compatible with almost all manufacturers' RGB control systems, and feature hydraulic fan bearings for what Antec feels is the best performance. The PRIZM Cooling Matrix Dual Fan Setup is rated for a 45000 hours operating time.

LIAN LI Industrial Co. Ltd., a world leading manufacturer of aluminum chassis and peripherals, is proud to unveil the latest addition to its family of well-received RGB fan with the BORA Digital. Following the great success of the BORA and BORA Lite cooling fans, the price competitive BORA Digital is here to dominate in style with 3 frame finishes, built-in 12 addressable LEDs customizable via a RGB controller (or motherboard), and one of the most silent performances in the field, thanks to its adjustable speed and fluid dynamic bearings.

DIYPC, the leading professional manufacturer of computer cases and accessories DIYPC, is thrilled to announce another addition to its exciting line of chassis for gamers and enthusiasts. The DIYPC Rainbow Flash-R1 is a modern style casing that is aimed to accommodate system builders of all levels and give an inspired chassis that looks and feels premium.

A sleek front and tempered glass side panel give a clean, elegant look while showing off the internals of your build. The DIYPC Rainbow Flash-R1 chassis also features modern usability and maintenance features as well as design cues that make it standout from the rest with a touch of RGB in the front via the integrated lighting.

EK Water Blocks, the leading premium liquid cooling gear manufacturer, announces the expansion and global availability of newly released Classic Product Lineup. The Classic Lineup is directly addressing price-conscious users while reusing some of the key technological solutions that set the EK as the market leader in the PC liquid cooling industry. The packaging, just as the products themselves are streamlined and simplified, making Classic Line Products the pure essence of liquid cooling. And now, it's available for everyone.

The portfolio is now bearing all the relevant parts that a user needs to complete his liquid cooling loop. The existing combo unit, CPU block and GPU block are now joined with Classic Line radiators, fittings and even a GPU block for the ROG Strix GeForce RTX 2080 Ti graphics card. The Classic Lineup is implementing EK's market-proven technologies that ensure high-quality and high-performance liquid cooling products at a more accessible price. Available at about 3/4 of the price of leading EK Quantum series products, our products can now reach more liquid cooling enthusiasts that desire efficient cooling with EK's guaranteed quality and excellent customer support.

Be quiet!, the market leader in PC power supplies in Germany since 2007, announces Dark Rock Slim, a compact high-end CPU cooler that offers high physical clearance for any memory module. With a supported TDP of up to 180 watts, Dark Rock Slim offers enough headroom for silently cooling any mainstream processor while keeping the space above occupied RAM slots clear.

Dark Rock Slim is part of the Dark Rock 4 cooler family and works with all current Intel and mainstream AMD sockets. Cooling characteristics, performance and appearance are inspired by the Dark Rock 4 series, with the new compact heat sink providing high clearance for better RAM compatibility. Its high 180 watt cooling performance is achieved with a maximum noise level of just 23.6 dB(A), which is a result of a perfect synergy between cooling fan, heat sink and heat pipe design.

Leading PC case designer and manufacturer Fractal Design today revealed a stunning new take on one of their most popular new case designs with the Define S2 Vision, a modification of the S2 chassis with a range of upgrades including dark tempered glass panels on all sides. Define S2 Vision comes in two variants: the RGB version equipped with a full ensemble of Prisma ARGB accessories, and the Blackout version outfitted with all new Dynamic X2 PWM Black fans, also available separately today.

The Define S2 Vision was designed with the goal of bringing together beauty and function, and with its full tempered glass exterior, you'll experience the radiance of your system from every angle. Be the center of attention with the Define S2 Vision RGB, or choose the Blackout edition with Dynamic X2 PWM Black fans for a more subtle yet equally eye-catching effect.

CES may have officially ended but our coverage from the trade show continues. Bitspower had invited TechPowerUp to come visit their suite, mentioning there would be something new and unexpected, and that indeed was the case. Our tour began with the customary showcase of the new GPU water blocks compatible with reference, and board partner designs, for the new NVIDIA GeForce RTX 2060 and relatively new AIC RTX 2070/80(Ti) cards as well. These feature integrated RGB lighting compatible with all major motherboard lighting solutions for control, and adopt the split central-inlet flow design as well.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, announces the launch of a new all-in-one liquid cooler series, LIQTECH II. Responding the market demand of cooling solution for high-end CPUs, LIQTECH II can deliver enthusiast-grade cooling capacity of 500+ watts (TDP) and is compatible with both Intel and AMD sockets (except AMD sTR4).

Furthermore, certified by main motherboard makers (ASRock, ASUS, Gigabyte, and MSI), LIQTECH II can support the latest addressable RGB lighting synchronization with advanced motherboards featuring addressable RGB headers (pin assignment: 5V/D/-/G) to create dynamic visual effects. LIQTECH II is perfect for overclocked systems, image editing workstations, and high-end gaming machines.

INNO3D, a leading manufacturer of awesome high-end graphics hardware components and various innovations enriching your life, introduces its new iCHILL cooling solution. Designed around NVIDIA's GeForce RTX series factoring in the sheer power and performance of the RTX 20 series, with the first beneficiary's being the INNO3D GeForce RTX 2070 and RTX 2080. The iCHILL X3 is fully equipped to allow heat dissipation and airflow optimization so that you can push your high-end graphics card to the limit.

Years of R&D has allowed INNO3D to make technological advancements, continuously pushing the boundaries and bolster their expertise in the graphics card industry. It has elevated iCHILL to a point that makes a difference for high-end gamers and design creation professionals achieving high performance with outstanding temperature control and at super quiet noise levels.

The European brand SilentiumPC presents the new Spartan 3 PRO RGB HE1024 as a cost-effective alternative to stock CPU coolers, which is intended for professional system builders and DIY projects on a budget. This extremely compact and lightweight cooler utilizes four 6 mm Heatpipes and aluminum heatsink for excellent cooling performance and oversized Sigma PRO RGB 100 PWM-controlled fan for quiet operation.

Its new RGB Illumination system lights up the fan with stunning yet discreet colors and effects. All the major motherboard RGB systems are supported, including Asus Aura, ASRock RGB LED, EVGA RGB and MSI Mystic Light as wells as manual control via the included Nano RGB controller, making the Spartan 3 PRO RGB a ready-to-go RGB solution.

Lian Li Industrial Co. Ltd., world's leading manufacturer of aluminum chassis for enthusiasts and custom OEM/ODM case solutions is proud to announce its ultimate platform for cooling with the Lian Li PC-O11 Air high-airflow chassis. Bearing the same multi-chamber design as the PC-O11 Dynamic, the PC-O11 Air takes that design and maximizes it for the best amount of airflow and cooling ever. The perfect chassis for high-performance workstation where cooling is a must for stability and performance, the PC-O11 Air guarantees unmatched cooling potential to take your build to the fullest.

The O11 Air is available from $129, while the O11 Air with Bora fans is available for $149.

EKWB were full of updates at Computex this year, as seen in our other news post, but this did not stop them from unveiling wholly new concepts as it comes to the company. These are ideas that their R&D thinktank decided to explore beyond the norm, and first up is the creation of a new brand under the EK Special Projects (Spec) team that is tentatively named König, after their founder Eduard König. As we found out in person, Eddy has a passion for woodworking in addition to managing a company, and decided to combine the two. The new König brand intends to offer a personalized, made-to-order experience wherein they will work with the end user to design and manufacture products to match a lifestyle. This is currently built around solid wood of multiple varieties, three Slovenian version of which were shown at their suite, but they are open to working with other materials including carbon fiber, anodized aluminum, leather and so on. They shared some images of some example products as it pertains to watercooling (CPU block top covers, GPU blocks and backplate, fittings and so on) as well as modded cases with wooden panels as seen below. Be sure to also click on the story to read more on an entirely different concept from the company.

Thermaltake showcased the new Pacific M360 Plus D5 Hard Tube Water Cooling Kit, Pacific M360 D5 Hard Tube Water Cooling Kit, and Pacific M240 D5 Hard Tube Water Cooking Kitduring COMPUTEX 2018 at Nangang Exhibition Hall in Taipei. Supporting Thermaltake's patented TT RGB PLUS Software, the Pacific M360 Plus is a new addition to TT RGB PLUS Ecosystem. This high-performance liquid cooling kit is designed for high-end gaming systems. Inside you will find a Pacific W4 PlusCPU waterblock, Pacific PR22-D5 Pluspump/reservoir combo, Pacific RL360 Plusradiator, 3 Riing Plus 12RGB fans, 8 Pacific C-Procompression fittings and other accessories.

The Pacific M360 and Pacific M240 are efficient, yet quality liquid cooling solutions for all watercooled PCs. The Pacific M360comes with a hardware-controlled Pacific W4 RGB CPU waterblock, Pacific PR22-D5 pump/reservoir combo, Pacific RL360 radiator, 3 hardware-controlled Riing 12 RGB fans, 6 Pacific C-Pro compression fittings and other accessories. The Pacific M240features a Pacific W3 CPU waterblock, Pacific PR15-D5 pump/reservoir combo, Pacific R240 radiator, 3 hardware-controlled Riing 12 RGB fans, 6 Pacific C-Pro compression fittings and other accessories.

EVGA today announced a new development achieved by its engineering teams and in-house overclockers Vince "KINGPIN" Lucido and Illya "TiN" Tsemenko. The new solution, dubbed the ROBOCLOCKER, aims to allow for greater efficiency and ease-of-use in extreme cooling solutions using liquid nitrogen, by providing a basis for a semi-closed loop.

EVGA says this new extreme cooling solution allowed KINGPIN and TiN to break 5 new 3DMark World Records, thus paving the way for future World Record overclocking setups. You can watch a video demonstrating the ROBOCLOCKER in action after the break.

After the recent release of our pre-built fully liquid cooled Gaming PCs, we are turning to our DIY customers once again. EK Water Blocks, the Slovenia-based premium computer liquid cooling gear manufacturer is releasing a new kit, the A360G!

The twist is the included 360mm EK-AluStream radiator that offers extreme cooling performance for its thickness of 28mm. Dense aluminum fins combined with a slim profile provide a huge cooling surface, while the radiator remains compatible with most cases on the market. EK-AluStream radiators are optimized for maximum heat dissipation across the entire operational range of the included high-static pressure EK-Vardar fans which deliver exceptional performance at both low and high RPM operation.

The world's first waterblock designed for naked die cooling throws years of conventional wisdom out of the window. It features six unique patentable features including its "in-frame" mounting mechanism. The man behind NUDEcnc, Arek Tobiszewski has started this Kickstarter campaign in order to get a professional CNC machine, which will enable this inventor to deliver Ncore and other cool projects to the audience. He has been brave enough to send the Ncore for a review to Kyle Bennett from HardOcp; Linus tech tips; buildzoid, and Techlipton. Some of the reviews are already up, and are very promising.

Cooler Master with 25 years of innovation in thermal design and production, unveils a wide range of cooling products that is set to redefine liquid and air cooling. There is the revolutionary design in heat transfer with the Heat Column that allows exceptional performance in low-profile coolers. Smart features such as thermal detection and addressable RGB LED in liquid and air coolers offer users many options from Cooler Master. And increase co-development cooling products, puts Cooler Master at the forefront of thermal design.

Break-Through Design in Heat Transfer for MasterAir G100M
The revolutionary unified design of the Heat Column combines the contact with the CPU with thermal conductivity and phase transition. The entire block of Heat Column (Ø41.2) is able to transfer a massive amount of heat away from the CPU in the shortest distance possible. This break-through design enables low profile design of the MasterAir G100M to reach TDP of 130W that matches performance of traditional heatsinks.

Researchers based on Purdue University have designed an intrachip cooling technology, which will likely pave the way for future generations of high performance 3D microprocessors. The research was part of a DARPA-funded commission for Purdue University's Birck Nanotechnology Center; a fundamental requirement stipulated by DARPA was the ability for this cooling system to handle chips generating 1 kW of heat per cm², more than 10x the amount current high-performance computers generate.

The new cooling system circulates an electrically insulated liquid coolant directly into electronic chips through an intricate series of tiny microchannels. This means that no longer will cooling systems be limited to the nowadays-employed conventional chip-cooling methods, which make use of finned metal plates called heat sinks. These are attached to computer chips to dissipate heat, but have a fundamental flaw: they do not remove heat efficiently enough for an emerging class of high-performance, 3D electronics, where too much heat hinders the performance of electronic chips or damages the tiny circuitry, especially in small "hot spots" that are located below the topmost layer of the chip.