KLEVV, the leading consumer memory and storage brand introduced by Essencore, is excited to announce the launch of its brand-new URBANE V RGB DDR5 Gaming/OC memory. Ideal for advanced content creation and professional gaming. Inspired by the traditional bow and arrow, the URBANE V RGB DDR5 Gaming/OC memory captures the essence of speed, stability, and precision. It effortlessly blends style and functionality, with flowing curves evoking a bow, sleek white aesthetics reminiscent of a quill, and precision of archery portraying its cutting-edge hardware built for accuracy, symbolizing limitless potential—making it a perfect fit for any build.

Crafted from premium components, it features a 2 mm-thick aluminium heat sink with sleek linear grooves, refined curved edges, and a low-profile height of 42.5 mm, ensuring superior cooling efficiency and eye-catching aesthetics. Engineered with precision, it optimizes heat dissipation to regulate temperatures during intense gaming. Fully customizable RGB lighting offers 16 million colors and synchronized effects, seamlessly integrating with major motherboard RGB software for limitless personalization.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

Team Group Industrial has officially introduced the industry's first industrial-grade DDR5 6400 MHz CU-DIMM/CSO-DIMM memory modules. The innovative product addresses challenges posed by high-frequency operation on signal stability by incorporating a specialized component known as the Client Clock Driver (CKD), which effectively buffers and drives clock signals, ensuring the signals remain stable and complete even under high-frequency conditions. This advancement sets a new benchmark in industrial storage technology, enhancing reliability and performance for demanding applications.

Team Group utilizes DDR5 Clocked Unbuffered Dual Inline Memory Module technology, which enables frequency and voltage adjustments based on system load and operating conditions, facilitating exceptional data transmission speeds and optimized power consumption performance, fully supporting the dynamic load requirements prevalent in industrial applications, and delivering solutions with outstanding performance and reliability.

Team Group Inc.'s gaming brand, T-FORCE, has launched two new color variants for its high-end XTREEM memory series: the T-FORCE XTREEM DDR5 in pink and the T-FORCE XTREEM ARGB DDR5 in snow white. T-FORCE is committed to delivering the ultimate performance experience for gamers. In addition to continuously enhancing technical specifications, the design is also innovative. These memory modules not only fully unleash the performance required by overclocking gamers but also introduce a new, stylish aesthetic, meeting both performance and fashion demands.

The T-FORCE XTREEM DDR5 now comes in a new diamond rose variant, featuring a sandblasted metal texture heat spreader adorned with the T-FORCE logo. It makes a stunning debut among the diverse range of memory options. Meanwhile, the T-FORCE XTREEM ARGB DDR5 launches in white, with a snow-white sandblasted heat spreader and dual light bars, carefully selected to showcase a multi-layered optical design. This creates an immersive soft white RGB aurora effect. The T-FORCE XTREEM series supports overclocking technology on both Intel and AMD platforms, offering one-click overclocking with dual-mode modules that fully unleash peak performance. While TEAMGROUP continues to develop high-spec products, it also remains attuned to market trends, offering a variety of vibrant design choices to provide the best memory solutions for gamers.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces its first-ever CU-DIMM & CSO-DIMM memory modules, which work seamlessly with the latest Intel Core Ultra (Series 2) "Arrow Lake-S" Processors/ Z890 platform to unleash the true DDR5 performance. KLEVV's next-generation DDR5 memory lineup receives a substantial performance boost with the integration of advanced Client Clock Driver (CKD) technology. Incorporated via a small integrated circuit (IC) directly on the DIMM, CKD IC enhances the module's speed and efficiency for both desktop and laptop applications. By regenerating the memory chips' clock signal, it improves stability, supports higher operating frequencies, and minimizes electrical interference and signal degradation—pushing the boundaries of memory performance.

Designed for both performance desktop and laptop systems, KLEVV's new Standard CU-DIMM and CSO-DIMM memory modules combine the brand's renowned quality with cutting-edge DDR5 technology, making them ideal for both casual and professional users. Leveraging the innovative CKD architecture, these modules deliver exceptional stability and reliability, even at high speeds, effectively mitigating electrical interference that could otherwise hinder performance. With this advanced design, users can count on smooth, efficient operation, even under heavy workloads.

Micron Technology, Inc., today announced the availability of a brand-new category of clock driver memory with the launch of its Crucial DDR5 clocked unbuffered dual inline memory modules (CUDIMM) and clocked small outline dual memory modules (CSODIMM), which are now shipping in volume. The JEDEC-standard solutions run at speeds up to 6,400 MT/s (megatransfers per second), more than twice as fast as DDR4 and 15% faster than traditional non-clock-driver-based DDR5. Designed to provide more speed stability, faster downloads and better refresh rates, these solutions represent a completely new frontier of memory form factors for next-generation PCs. Micron's CUDIMM and CSODIMM solutions are the industry's first commercially available JEDEC-standard DDR5 CUDIMM and CSODIMM solutions to hit the market since JEDEC standardized the specification earlier this year.

In addition, Intel has validated Micron DDR5 CUDIMM and CSODIMM solutions up to capacities of 64 gigabytes (GB) for use with its Intel Core Ultra processors (Series 2), which were launched last week on Oct. 10.

As a global leader in memory solutions, Team Group Inc. today unveiled its latest T-Force CKD (Client Clock Driver) DDR5 Gaming Memory. Following the worldwide attention received for the 7200 MHz T-CREATE EXPERT Ai CKD DDR5 showcased at COMPUTEX 2024, the T-Force gaming brand takes performance to new heights with the upcoming T-Force XTREEM CKD DDR5 8200 to 9000 (Gear 2) 2x24GB, featuring overclocking capabilities reaching up to 9600 MHz (Gear 4). Consumers can now push the limits of CUDIMM overclocking on the Intel Z890 platform with next-generation CKD DDR5 overclocking memory, achieving unprecedented performance breakthroughs.

Team Group continues to lead the industry in pushing boundaries by crafting the T-Force XTREEM CKD DDR5, which breaks beyond JEDEC frequency specifications. Utilizing CKD components and Intel XMP profiles on the Intel Z890 motherboard, users can effortlessly overclock to DDR5 speeds beyond 9000 MHz with a single click. Unlike JEDEC-compliant memory modules, the T-Force XTREEM CKD DDR5 leverages CKD components to enhance and buffer high-frequency signals from the CPU, ensuring more stable signal transmission to the memory modules. This enables DDR5 to push overclocking performance to even higher frequencies, surpassing traditional U-DIMM overclocking limitations.

The world's leading brand for memory modules and flash memory and long-term Intel partner, ADATA Technology and its gaming brand XPG (Xtreme Performance Gear) today announced the launch of new DDR5 CUDIMM memory, including XPG LANCER RGB DDR5 CUDIMM gaming memory and ADATA DDR5 CUDIMM memory, supporting the latest Intel Core Ultra Desktop Processor (Series 2) and providing a variety of options that satisfy the needs of extreme gamers and general users.

DDR5 CUDIMM features a base clock speed starting at 6,400MT/s and is equipped with a key CKD (Clock Driver) component which ensures stable operation at high frequencies. It is compatible with existing Intel Core Desktop Processors and memory speed can easily top 9,000MT/s when overclocked on a Z890 motherboard. This DDR5 CUDIMM is expected to be a powerful next-generation DDR5 memory, greatly improving the processing efficiency and stability of desktop platforms.

ASRock has unveiled a full lineup of Z890 motherboards, led by the new Taichi series flagship models. This series offers a powerful mix of options for extreme enthusiasts, including the ASRock Z890 Taichi AQUA, Taichi OCF, Taichi, and Taichi Lite. Other ASRock Z890 motherboards include the gaming-focused Phantom Gaming series, featuring the Nova, Riptide, and Lightning models, as well as the popular Steel Legend, LiveMixer, and Pro series for mainstream users. The new Z890 motherboards support the latest Intel Core Ultra 200 series processors, offering more high-speed expansion such as PCI-Express 5.0 support for a graphics card, as well as M.2 SSD, and more importantly up to two Thunderbolt 4 ports for all Z890 motherboards.

The New Era of Taichi
The white-styled ASRock Z890 Taichi AQUA introduces a unique hybrid thermal design developed in collaboration with Alphacool, which combines air and water cooling for the VRM and M.2 block. The Z890 Taichi AQUA also features the first detachable M.2 water block for Gen-5 SSDs, simplifying and streamlining installation.

Today, Micron updated its corporate logo with new symbolism. The redesign comes as Micron celebrates over four decades of technological advancement in the semiconductor industry. The new logo features a distinctive silicon color, paying homage to the wafers at the core of Micron's products. Its curved lettering represents the company's ability to stay ahead of industry trends and adapt to rapid technological changes. The design also incorporates vibrant gradient colors inspired by light reflections on wafers, which are the core of Mircorn's memory and storage products.

This rebranding effort coincides with Micron's expanding role in AI, where memory and storage innovations are increasingly crucial. The company has positioned itself beyond a commodity memory supplier, now offering leadership in solutions for AI data centers, high-performance computing, and AI-enabled devices. The company has come far from its original 64K DRAM in 1981 to HBM3E DRAM today. Micron offers different HBM memory products, graphics memory powering consumer GPUs, CXL memory modules, and DRAM components and modules.

T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.

T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.

The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

COLORFIRE has introduced the new Aries series memory modules. The new Aries memory will be sold in kits, with the main specifications being DDR4 3600 8 GB x2 and 16 GB x2, all with a timing of CL16. It also includes DDR5 variants, offering DDR5-6000 16 GB x2 and 6400 16 GB x2 at different frequencies. The Aries memory, positioned above the previously released Scorpio series, features optimized timing and the addition of DDR5 standards. By incorporating zodiac elements into the memory design, COLORFIRE is continuing to experiment with its product offerings.

COLORFIRE, a brand by Chinese hardware maker COLORFUL, is tailored to cater to younger users and a range of different styles. The products align with diverse elements like cute, anime, and trendy lifestyle themes. COLORFIRE has successfully captivated users with its "Cyber Rua Cat" theme, launching the highly popular MEOW series, which includes VGA, motherboards, memory, SSDs, and a full range of peripherals such as speakers and headphones.

V-COLOR is set to revolutionize the future of memory technology with the launch of the world's first RGB DDR5 O CUDIMM (High Speed Overclocked CUDIMM). This groundbreaking innovation for the next-generation desktop platform, offering unmatched speeds and efficiency for desktop applications. This memory module has a new heatsink patent (Patent No. 113208127) to increase heat dissipation efficiency to a new level, and the introduction of the exclusive light guide rod patented coating technology (Patent No. M653290) allows the light guide rod to attract attention regardless of whether it has RGB effects or not.

The DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) technology dynamically adjusts clock frequency and voltage based on workload and system conditions. This cutting-edge capability results in faster data transmission, lower power consumption, and enhanced stability, making it a game-changer in the industry.

TrendForce reports that memory module makers have been aggressively increasing their DRAM inventories since 3Q23, with inventory levels rising to 11-17 weeks by 2Q24. However, demand for consumer electronics has not rebounded as expected. For instance, smartphone inventories in China have reached excessive levels, and notebook purchases have been delayed as consumers await new AI-powered PCs, leading to continued market contraction.

This has led to a weakening in spot prices for memory products primarily used in consumer electronics, with Q2 prices dropping over 30% compared to Q1. Although spot prices remained disconnected from contract prices through August, this divergence may signal potential future trends for contract pricing.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and advanced memory, has launched a new line of DDR5 Registered DIMMs (RDIMMs) with conformal coating which are specifically designed for use in liquid immersion servers. This innovative product line combines the superior performance of DDR5 technology with enhanced protection, ensuring reliability and longevity in the most demanding data center environments.

Arthur Sainio, DRAM product director for SMART explains the significance of this introduction, "Our new DDR5 RDIMMs with conformal coating represent the perfect fusion of cutting-edge performance and rugged reliability for the next generation of immersion-cooled data centers. By combining the speed and efficiency of DDR5 technology with advanced protective coatings, we're enabling our customers to push the boundaries of computing power while ensuring long-term durability in demanding liquid immersion environments. This product embodies our commitment to innovation and our drive to meet the evolving needs of high-performance computing applications."

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

Micron Technology, a leader in innovative data center solutions, today announced it has achieved its qualification sample milestone for the Micron CZ120 memory expansion modules using Compute Express Link (CXL). Micron is the first in the industry to achieve this milestone, which accelerates the adoption of CXL solutions within the data center to tackle the growing memory challenges stemming from existing data-intensive workloads and emerging artificial intelligence (AI) and machine learning (ML) workloads.

Using a new and emerging CXL standard, the CZ120 required substantial hardware testing for reliability, quality and performance across CPU providers and OEMs, along with comprehensive software testing for compatibility and compliance with OS and hypervisor vendors. This achievement reflects the collaboration and commitment across the data center ecosystem to validate the advantages of CXL memory. By testing the combined products for interoperability and compatibility across hardware and software, the Micron CZ120 memory expansion modules satisfy the rigorous standards for reliability, quality and performance required by customers' data centers.

Yesterday we reported on DDR6 memory hitting new heights of performance and it looks like LPDDR6 will follow suit, at least based on details in a JEDEC presentation. LPDDR6 will just like LPDDR5 be available as solder down memory, but it will also be available in a new LPCAMM2 module. The bus speed of LPDDR5 on LPCAMM2 modules is expected to peak at 9.2 GT/s based on JEDEC specifications, but LPDDR6 will extend this to 14.4 GT/s or roughly a 50 percent increase. However, today the fastest and only LPCAMM2 modules on the retail market which are using LPDDR5X, comes in at 7.5 GT/s, which suggests that launch speeds of LPDDR6 will end up being quite far from the peak speeds.

There will be some other interesting changes to LPDDR6 CAMM2 modules as there will be a move from 128-bit per module to 192-bit per module and each channel will go from 32-bits to 48-bits. Part of the reason for this is that LPDDR6 is moving to a 24-bit channel width, consisting of two 12-bit sub channels, as mentioned in yesterday's news post. This might seem odd at first, but in reality is fairly simple, LPDDR6 will have native ECC (Error Correction Code) or EDC (Error Detection Code) support, but it's currently not entirely clear how this will be implemented on a system level. JEDEC is also looking at developing a screwless solution for the CAMM2 and LPCAMM2 memory modules, but at the moment there's no clear solution in sight. We might also get to see LPDDR6 via LPCAMM2 modules on the desktop, although the presentation only mentions CAMM2 for the desktop, something we've already seen that MSI is working on.

EK, a leader in premium liquid cooling solutions, proudly unveils the EK-Quantum Momentum² Quad RAM Module Set D-RGB, an advanced cooling solution meticulously designed for effective thermal management of DDR4 and DDR5 memory modules. This comprehensive set includes a water block capable of covering four RAM sticks with aluminium heatsinks, integrating high-quality cooling efficiency with dynamic RGB lighting to enhance both the performance and visual appeal of any high-end computing setup. The system is specifically engineered to support configurations with four RAM sticks, optimizing cooling for modern high-performance memory arrays.

Enhanced Cooling and Sophisticated Design
The EK-Quantum Momentum² Quad RAM Module Set D-RGB accommodates both single and double-sided DDR4 and DDR5 memory modules, ensuring versatility across different RAM configurations. It features four sleek, black, anodized aluminium heatsinks with an elox finish for enhanced durability and corrosion resistance. This treatment not only improves the heatsinks' appearance but also boosts their thermal conductivity and cooling effectiveness.

Technology Inc. proudly announces that its XFinity Series has been honored with the prestigious Red Dot Design Award for 2024. This esteemed recognition celebrates the XFinity Series for its original design, remarkable visual appeal, and outstanding performance. Renowned for its sleek design and exceptional performance, the XFinity Series has captivated the esteemed Red Dot Design Award jury, earning accolades for its exceptional quality and creativity. This acknowledgment underscores v-color's dedication to delivering products that not only excel in performance but also set new benchmarks in design excellence.

With v-color's new gold/silver streamline light guide rod, and enhanced LED brightness, the RGB lighting emits a smooth and soft glow, elevating system aesthetics to new heights. Bid farewell to traditional transparent plastic and embrace artwork-like illumination that captivates whether lit or unlit.

Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128 GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron's industry-leading 1β (1-beta) technology, the 128 GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.

Micron's collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads. Micron's 128 GB DDR5 RDIMM memory will be supported by a robust ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, along with many others.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), including an industry-leading extreme current device for high-performance applications. With this new family of server PMICs, Rambus offers module manufacturers a complete DDR5 RDIMM memory interface chipset supporting a broad range of data center use cases.

"Advanced data center workloads like generative AI require the highest bandwidth and capacity server RDIMMs tailored to meet ever-increasing memory needs of a growing data pipeline," said Sean Fan, chief operating officer at Rambus. "With the addition of this new family of server PMICs, we expand our foundational technology and offer customers a comprehensive memory interface chipset that supports multiple DDR5 server platform generations."

SK hynix showcased its next-generation technologies and strengthened key partnerships at the TSMC 2024 Technology Symposium held in Santa Clara, California on April 24. At the event, the company displayed its industry-leading HBM AI memory solutions and highlighted its collaboration with TSMC involving the host's CoWoS advanced packaging technology.

TSMC, a global semiconductor foundry, invites its major partners to this annual conference in the first half of each year so they can share their new products and technologies. Attending the event under the slogan "Memory, the Power of AI," SK hynix received significant attention for presenting the industry's most powerful AI memory solution, HBM3E. The product has recently demonstrated industry-leading performance, achieving input/output (I/O) transfer speed of up to 10 gigabits per second (Gbps) in an AI system during a performance validation evaluation.

Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-generation client memory. This new product aims to enhance the speed and stability of memory data access to match the ever-increasing CPU operating speed and performance.

Previously, clock driver functionality was integrated into the Registering Clock Driver (RCD) chips used on server RDIMM or LRDIMM modules, not deployed to the PCs. In the DDR5 era, as data rates climb 6400 MT/s and above, the clock driver has emerged as an indispensable component for client memory.