Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its DDR5 Client Clock Driver (CKD) for next-generation, high-performance desktops and notebooks. The Rambus DDR5 CKD and SPD Hub are part of a new client memory interface chip product offering that brings server technology advancements to the client market. Leveraging over 30 years of memory system expertise, the Rambus DDR5 CKD enables new client DIMMs (CSODIMMs and CUDIMMs) to operate at state-of-the-art data rates of up to 7200 Megatransfers per second (MT/s), and deliver breakthrough performance in next-generation PCs.

"As advanced technologies first developed for the data center proliferate to the client space, increasingly powerful PCs will take gaming, content creation and AI to new levels," said Rami Sethi, SVP and general manager of Memory Interface Chips at Rambus. "This new DDR5 Client Clock Driver is the latest addition to our growing line up of chip solutions that enable breakthrough memory performance across the computing landscape, and bring more value to our customers."

ASRock has silently unveiled the X600TM-ITX, currently the "world's only" AM5 Thin Mini-ITX motherboard designed for AMD Ryzen 9000 "Zen 5" processors along with 8000 and 7000 series CPUs with a max TDP of 65 W. Its "Thin" Mini-ITX form factor (17.0 cm x 17.0 cm) stands out with a compact 25 mm I/O shield height compared to the standard 44 mm.

Unlike traditional Mini-ITX boards, the X600TM-ITX utilizes SODIMM memory (max. 96 GB of Dual DDR5 6400+) and supports onboard power supply via one DC Jack on the rear panel I/O, eliminating the need for a separate ATX PSU. This makes it an ideal choice for DIY mini PC enthusiasts. However, the board lacks PCIe slots for discrete GPUs, limiting its gaming potential. Nevertheless, the integrated graphics in AM5 processors should handle most games at lower settings, especially with higher-end CPUs.

IBASE Technology Inc., a leading manufacturer of industrial computers and embedded systems, unveils the IB962 3.5-inch single board computer (SBC) built on the advanced Intel Core Ultra 7/5 100 Series processors (formerly Meteor Lake U/H). Featuring 3D performance hybrid architecture, advanced AI capabilities, and available with built-in Intel Arc GPU, the processor delivers an optimal balance of performance and power efficiency and helps unlock the power of AI to create immersive graphics experiences.

The IB962 is available in a variety of models, with high-end models powered by the Intel Core Ultra 7-165H and Ultra 7-165U processors to meet different processing needs while maintaining a compact footprint of just 102 mm x 147 mm (4" x 5.8"). The IB962 series comprises two DDR5 SO-DIMM slots, supporting up to 64 GB of RAM to handle intensive multitasking and high-speed data processing with ease. A standout feature is its extensive display capability, supporting HDMI, DP++, LVDS, and eDP interfaces, allowing flexibility to connect multiple high-resolution displays simultaneously, whether for industrial automation, manufacturing, retail, entertainment, healthcare, or other edge AI applications.

AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

Chinese memory manufacturer YMTC has filed a lawsuit against U.S.-based Micron in California, alleging infringement of 11 patents related to 3D NAND Flash and DRAM products. YMTC seeks to halt Micron's sales of the allegedly infringing products in the U.S. and demands royalty payments. Founded in Wuhan, China, in 2016, YMTC is a key player in China's efforts to develop a domestic chip industry. However, in October 2022, the U.S. government placed YMTC on its Entity List, restricting its access to advanced U.S. manufacturing equipment for 3D NAND chips with 128 layers or more.

Before these restrictions, YMTC had obtained certification from Apple for its 128-layer 3D NAND chips, with the US tech giant considering using YMTC chips to reduce costs and diversify its supply chain beyond Samsung, SK Hynix and Micron. The lawsuit specifically targets Micron's 3D NAND Flash products with 96, 128, 176, and 232 layers, as well as certain DDR5 SDRAM products. This legal action follows a similar suit filed by YMTC against Micron in November, alleging infringement of eight U.S. patents related to 3D NAND Flash. With government backing, Chinese firms are increasingly engaging in patent litigation both domestically and internationally. Last year alone, Chinese courts handled over 5,000 technical intellectual property and monopoly cases.

TrendForce's latest report on the memory industry reveals that DRAM and NAND Flash revenues are expected to see significant increases of 75% and 77%, respectively, in 2024, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM.

Furthermore, industry revenues are projected to continue growing in 2025, with DRAM expected to increase by 51% and NAND Flash by 29%, reaching record highs. This growth is anticipated to revive capital expenditures and boost demand for upstream raw materials, although it will also increase cost pressure for memory buyers.

AMD's upcoming "Strix Halo" mobile processor that features up to 16 "Zen 5" CPU cores and a powerful iGPU with 40 compute units, is beginning to surface in online benchmark databases. We've gone into the juicy technical bits about the processor in our older articles, but put simply, it is a powerful mobile processor meant to square off against the likes of the Apple M3 Pro and M3 Max. A chiplet-based processor, much like the upcoming "Granite Ridge" desktop processor and "Fire Range" mobile processor, "Strix Halo" features up to 16 full-sized "Zen 5" cores, as it uses up to two of the same "Eldora" CCDs as them; but wired to a large I/O die that contains the oversized iGPU, and an NPU, besides the memory controllers. The iGPU has 40 compute units (2,560 stream processors), and is based on the RDNA 3.5 graphics architecture, while the NPU is the same 50 TOPS-class unit carried over from "Strix Point."

A prototype HP laptop powered by a "Strix Halo" processor that uses a single 8-core "Zen 5" CCD, was spied on the web. This chip has eight full-sized "Zen 5" cores that share a 32 MB L3 cache. The iGPU on the I/O die has its own 32 MB Infinity Cache memory that cushions memory transfers. In our older reports, we speculated as to what the memory interface of "Strix Halo" would be. It turns out that the chip exclusively features a 256-bit wide LPDDR5X memory interface, which is double the bus width of "Strix Point." This is essentially what a "quad-channel DDR5" memory interface would be, and AMD is using a memory speed standard of at least LPDDR5X-8000. From the machine's point of view, this would be just a couple of hardwired LPDDR5X chips, or a pair of LPCAMM 2 modules. Back to the benchmarks, and we are shown a single-thread CPU score of 2099 to 2177 points, and a multithreaded score ranging between 5477 points to 13993 points. The laptop was tested with an unknown version and distribution of Linux. The CPU cores are shown boosting up to 5.35 GHz.

GIGAIPC, an embedded solution-focused subsidiary of GIGABYTE, is excited to announce the launch of its new series of all-in-one industrial panel PCs, specifically designed to meet the unique needs of the retail industry. These cutting-edge PCs are available in three sizes—21.5", 15.6", and 11.6"—making them perfect for kiosks, POS systems, and a variety of other retail applications.

The models, named TA-215AN97A-A1, TA-156AN97A-A1, and TA-116AN97A-A1, are powered by high-performance Intel Alder Lake N97 processors. These processors provide significant improvements in speed and efficiency, allowing for seamless multitasking and enhanced processing power, which is essential for demanding retail applications. This ensures that businesses can operate smoothly, even during peak hours.

Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.

Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Trident Z5 Royal Neo series DDR5 memory, designed for AMD AM5 platforms. Trident Z5 Royal Neo memory comes with AMD EXPO (Extended Profiles for Overclocking) technology, and will be available up to DDR5-8000 CL38-48-48-127 extreme speed memory specification in 32 GB (2x16GB) and 48 GB (2x24GB) kit capacities. With a mirrored finish in gold or silver, this new memory series is the ideal DDR5 memory solution for enthusiasts and overclockers to build a stylish, high-performance AMD PC system.

Luxury-Class DDR5 with AMD EXPO
Following the luxury-class Trident Z5 Royal design with CNC-cut aluminum heatspreader in mirrored-finish gold or silver colors and a crystalline light bar for magnificent RGB lighting, the Trident Z5 Royal Neo is designed for AMD AM5 platforms with AMD EXPO profile. Customizable RGB lighting is supported through the G.SKILL Trident Z Lighting Control software or third-party motherboard lighting software.

ADLINK Technology Inc., a global leader in edge computing, and a global supplier of industrial PCs and motherboards, announces the launch of the new IMB-C Value Series of ATX motherboards, extending the IMB series motherboard range with new, more affordable, options for users seeking high-performance at a lower price point. The IMB-C value series comes with processor options ranging from Gen 10 to Gen 14 Intel Core i9/i7/i5/i3 and includes features such as 2.5 Gbe, PCIe 4.0, DDR4, and USB 3.0, to suit applications in warehousing, industrial automation, smart manufacturing, and new energy.

The IMB-C series expands the IMB ATX motherboard range, providing a cost-effective alternative to the high-performance IMB-M series. Tailored for budget-sensitive projects without sacrificing essential features, the IMB-C models support DDR4 and PCIe 4.0, catering to applications that require solid performance with cost efficiency. Conversely, the IMB-M series is designed for top-tier performance, supporting DDR5 and PCIe 5.0, ideal for cutting-edge industrial use. The IMB-C series offers a comprehensive portfolio from Intel's 10th to 14th gen processors. Specifically, the IMB-C46 and IMB-C46H models come equipped with the Q470 and H420E chipsets respectively, optimized for 10th Gen Intel Core processors. Meanwhile, the IMB-M47 with the Q670 chipset, and the IMB-M47H with the H610 chipset, both support the 12th to 14th gen Intel Core processors, aligning with advanced system requirements and higher performance expectations.

MSI introduced the PRO B650-A WIFI, a feature-rich entry-mainstream Socket AM5 motherboard under its PRO series. Built in the standard ATX form-factor, the board features a 6-layer PCB, and includes heatsinks for all its M.2 slots, The board draws power from a 24-pin ATX and two 8-pin EPS power connectors and uses a 14+2+1 phase VRM solution that's capable of even the top 170 W TDP Ryzen 9 chips. The CPU socket is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two M.2 NVMe Gen 4 slots. The board's third M.2 Gen 4 slot is wired to the B650 FCH.

The MSI PRO B650-A WIFI offers a fairly premium onboard audio solution driven by a Realtek ALC4080 CODEC. USB connectivity includes a 20 Gbps USB 3.2 Gen 2x2 type-C port, three 10 Gbps USB 3.2 Gen 2 type-A, four 5 Gbps USB 3.2 Gen 1, and a few USB 3.2 and USB 2.0 ports by internal headers. Display outputs include HDMI and DisplayPort. Networking connectivity includes a 2.5 GbE interface driven by a Realtek 8125B controller, and an AMD/Mediatek sourced WLAN module with Wi-Fi 6E and Bluetooth 5.3. Besides the three M.2 Gen 4 slots, you get four SATA 6 Gbps ports. The board supports USB BIOS Flashback. The company didn't reveal pricing.

Micron Technology, Inc., today announced it is now sampling its multiplexed rank dual inline memory module (MRDIMMs). The MRDIMMs will enable Micron customers to run increasingly demanding workloads and obtain maximum value out of their compute infrastructure. For applications requiring more than 128 GB of memory per DIMM slot, Micron MRDIMMs outperform current TSV RDIMMs by enabling the highest bandwidth, largest capacity with the lowest latency and improved performance per watt to accelerate memory-intensive virtualized multi-tenant, HPC and AI data center workloads.1 The new memory offering is the first generation in the Micron MRDIMM family and will be compatible with Intel Xeon 6 processors.

"Micron's latest innovative main memory solution, MRDIMM, delivers the much-needed bandwidth and capacity at lower latency to scale AI inference and HPC applications on next-generation server platforms," said Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "MRDIMMs significantly lower the amount of energy used per task while offering the same reliability, availability and serviceability capabilities and interface as RDIMMs, thus providing customers a flexible solution that scales performance. Micron's close industry collaborations ensure seamless integration into existing server infrastructures and smooth transitions to future compute platforms."

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

Leading provider of advanced AI solutions AAEON (Stock Code: 6579), has released the inaugural offering of its AI Inference Server product line, the MAXER-2100. The MAXER-2100 is a 2U Rackmount AI inference server powered by the Intel Core i9-13900 Processor, designed to meet high-performance computing needs.
The MAXER-2100 is also able to support both 12th and 13th Generation Intel Core LGA 1700 socket-type CPUs, up to 125 W, and features an integrated NVIDIA GeForce RTX 4080 SUPER GPU. While the product's default comes with the NVIDIA GeForce RTX 4080 SUPER, it is also compatible with and an NVIDIA-Certified Edge System for both the NVIDIA L4 Tensor Core and NVIDIA RTX 6000 Ada GPUs.

Given the MAXER-2100 is equipped with both a high-performance CPU and industry-leading GPU, a key feature highlighted by AAEON upon the product's launch is its capacity to execute complex AI algorithms and datasets, process multiple high-definition video streams simultaneously, and utilize machine learning to refine large language models (LLMs) and inferencing models.

As AMD prepares to roll out its next-generation Ryzen 9000 series of CPUs based on Zen 5 architecture, we are starting to see some systems being tested by third-party OEMs and system integrators. Today, we have Geekbench 6 scores of the Ryzen 9 9900X CPU, and the 12-core, 24-thread processor that has demonstrated impressive performance gains. Boasting a base clock of 4.4 GHz and a boost clock of up to 5.6 GHz, the CPU features only 120 W TDP, a significant reduction from the previous 170 W of the previous generation. In Geekbench 6 tests, the Ryzen 9 9900X achieved a single-core score of 3,401 and a multicore score of 19,756.

These results place it ahead of Intel's current flagship Core i9-14900KS, which scored 3,189 points in single-core performance. Regarding multicore tasks, the i9-14900K scored 21,890 points, still higher than AMD's upcoming 12-core SKU. The benchmark of AMD's CPU was conducted on an ASUS ROG Crosshair X670E Gene motherboard with 32 GB of DDR5 memory. As anticipation builds for the official release, these early benchmarks suggest that AMD will deliver a compelling product that balances high performance with improved energy efficiency. The top tier models will still carry a 170 W TDP, while some high-end and middle-end SKUs get a TDP reduction like the Ryzen 7 9700X and Ryzen 5 9600X dial down to 65 W, decreased from 105 W in their previous iterations.

ASUS Republic of Gamers today announced the launch of the ROG NUC gaming PC. The first-ever ROG NUC PC is packed with cutting-edge technology and performance for AAA gaming and more.

Gaming, redefined
Featuring Intel Core Ultra 9 or Intel Core Ultra 7 processors and NVIDIA GeForce RTX 4070 or 4060 discrete graphics, the ROG NUC PC is a compact powerhouse that delivers unmatched gaming experiences. The high-performance hybrid architecture of Intel Core Ultra processors provides gamers with the power needed to stream, edit, record and play without skipping a beat. The 2.5-liter chassis is designed for quick system access to make upgrades and cleaning easy. Plus, the compatible ROG Raikiri Pro controller can be used to deliver a console-like experience for gamers seeking uncompromised performance and flexibility in a compact form factor.

Lenovo announced the ThinkCenter Neo Ultra, a compact high-performance desktop meant for power users and creative professionals. This desktop is larger than what would qualify as a mini-PC, with its 3.6 L volume, but is significantly smaller than a tower. Despite its compact size, it comes with a full-featured I/O. The desktop is powered by Intel's 14th Gen Core vPro "Raptor Lake Refresh" platform, and uses a custom form-factor desktop motherboard based on Intel Q670 chipset that supports various commercial desktop features under vPro. The processor and memory are socketed and hence user upgradeable.

Processor options range from the Core i5-14500 (6P+8E), going all the way up to the Core i9-14900 (8P+16E), including vPro and regular SKUs; and energy-efficient "T" SKUs. Memory options range from 16 GB (1x 16 GB) up to 64 GB (2x 32 GB) DDR5-4800. The sole graphics option is an NVIDIA GeForce RTX 4060 desktop GPU, all four of its display connectors are directly wired out on the rear I/O. There are two M.2-2280 Gen 4 slots, storage options range from 1x 256 GB Gen 4, to 2x 1 TB Gen 4. Networking connectivity include 2.5 GbE and Wi-Fi 6E. USB ports include a 20 Gbps USB 3.2 Gen2x2 type-C on the front-panel, two 10 Gbps USB 3.2 Gen 2, and four additional USB 3.2 type-A ports at the back. The case measures 195 mm x 191 mm x 108 mm, and depending on the configuration, can weigh around 3.5 kg.

AMD's upcoming Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture will see a slight improvement in memory overclocking capabilities. A chiplet-based processor, just like the Ryzen 7000 "Raphael," "Granite Ridge" combines one or two "Zen 5" CCDs, each built on the TSMC 4 nm process, with a client I/O die (cIOD) built on the 6 nm node. The cIOD of "Granite Ridge" appears to be almost identical to that of "Raphael." This is the chiplet that contains the processor's DDR5 memory controllers.

As part of the update, Ryzen 9000 "Granite Ridge" should be able to run DDR5-6400 with a 1:1 ratio between the MCLK and FCLK domains. This is a slight increase from the DDR5-6000 sweetspot speed of Ryzen 7000 "Raphael" processors. AMD is reportedly making it possible for motherboard manufacturers and prebuilt OEMs to enable a 1:2 ratio, making it possible to run high memory speeds such as DDR5-8000, although performance returns with memory speeds would begin to diminish beyond the DDR5-6400 @ 1:1 setting. Memory manufacturers should launch a new wave of DDR5 memory kits with AMD EXPO profiles for DDR5-6400.

TrendForce reports that a recovery in demand for general servers—coupled with an increased production share of HBM by DRAM suppliers—has led suppliers to maintain their stance on hiking prices. As a result, the ASP of DRAM in the third quarter is expected to continue rising, with an anticipated increase of 8-13%. The price of conventional DRAM is expected to rise by 5-10%, showing a slight contraction compared to the increase in the second quarter.

TrendForce notes that buyers were more conservative about restocking in the second, and inventory levels on both the supplier and buyer sides did not show significant changes. Looking ahead to the third quarter, there is still room for inventory replenishment for smartphones and CSPs, and the peak season for production is soon to commence. Consequently, it is expected that smartphones and servers will drive an increase in memory shipments in the third quarter.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, is excited to unveil the brand-new FIT V DDR5 gaming memory with a sleek, ultra-low-profile design. KLEVV's FIT V DDR5 gaming memory modules are available in 16 GB (16 GB x1) and 32 GB (16 GB x2) kits, with diverse clock speeds of 5600MT/s, 6000 MT/s, and 6400 MT/s. Meticulously crafted for gamers, content creators, and casual users on a budget, these modules offer cutting-edge features and top-tier performance at an attractive price. They boast a streamlined, ultra-low-profile 33 mm form factor, made possible by an innovative aluminium heat spreader with a contemporary minimalist aesthetic, finished in an eye-catching white hue. This design significantly boosts performance and enhances the visual appeal of any build.

The FIT V DDR5 gaming memory modules offer cutting-edge features at an attractive price. Superior KLEVV memory technology, including a built-in PMIC, ensures consistent performance with efficient power delivery and dependability. KLEVV's signature multilayer PCB design improves signal strength and robustness. The FIT V DDR5 modules also incorporate a precision thermal sensor for optimal performance calibration and on-die ECC for effective error correction, ensuring peak functionality and reliability. The FIT V DDR5 gaming memory readily supports Intel XMP 3.0 and AMD EXPO technology to extract maximum performance.