Every week, Zheng Jiong (ZJ), Intel China's senior director of Client Customer Engineering in the Client Computing Group (CCG), and his team of engineers make the hourlong drive across Shanghai to meet with their counterparts at Lenovo. They make a beeline to the new Advanced System Innovation Lab deep inside Lenovo's offices. It's here that engineers from both companies pool their collective brainpower to solve some of the world's toughest hardware and software challenges - the ones that pave the path to lighter, sleeker and ever-more-powerful laptops that many consumers and businesses depend on every day. This new 750-square-foot lab, which opened in July, is filled with cutting-edge tech tools and laptop prototypes in various stages of development. It's one of many joint engineering labs across the world populated by Intel and Lenovo engineers.

Joint labs like these allow engineers to focus on solving tough issues-- ones that need to be addressed to prevent product delays or empty holiday gift boxes.
Said ZJ: "We share a long and illustrious history of deep engineering collaboration with Lenovo." He added that Intel has dedicated engineers tasked with specific roles in enabling and developing new designs together with their lead collaborator. "We work together very well and are thankful for the innovation support Lenovo has given us through joint labs like these."

According to a post by @g01d3nm4ng0 on Twitter/X, we now know that AMD is readying yet another AGESA update for AM5 motherboards. The new version is, based on information from our own sources, a minor update to the current version. As such, AMD will be moving from 1.0.0.7b to 1.0.0.7c. @g01d3nm4ng0 didn't reveal any details of the new AGESA apart from the screenshot below, but we asked around and managed to find out what the new AESA addresses.

The update is specifically for those with Samsung DDR5 memory in their AM5 motherboards and it addresses multiple memory related stability issues. We weren't given the full details as to what those are, but there have been some reports about there being issues specifically with Samsung DDR5 memory in some AM5 boards and hopefully this will solve all those problems. We don't have a release time frame for the updated AGESA, but with 1.0.0.7b barely out the door, it might take a few weeks before this one makes it through all the internal testing at the motherboard makers.

ASRock launches the company's first all-white motherboard available on both Intel & AMD platforms, and the exciting thing is, this design is not limited to just high-end product, the first three motherboards to have this brand new outfit will be B760M-HDV/M.2 & H610M-HDV/M.2+ D5 from Intel, as for the AMD side we have B550M Pro SE. Looking good is no longer a privilege to expensive motherboards, for the first time stylish budget-friendly product has become a new trend of DIY.

Besides the brand new outfit, the functionality has been upgraded too, new Dragon 2.5G Lan and DDR5 memory support on selected models gives the new motherboard a boost of performance, all three motherboards are compatible with NVMe M.2 storage devises and most importantly, RGB LED header is available for stunning yet creative PC builds.

Inventec, a global leader in high-powered servers headquartered in Taiwan, is launching its cutting-edge C805G6 server for data centers based on AMD's newest 4th Gen EPYC platform—a major innovation in computing power that provides double the operating efficiency of previous platforms. These innovations are timely, as the industry worldwide faces converse challenges—on one hand, a growing need to reduce carbon footprints and power consumption, while, on the other hand, the push for ever higher computing power and performance for AI. In fact, in 2022 MIT found that improving a machine learning model tenfold will require a 10,000-fold increase in computational requirements.

Addressing both pain points, George Lin, VP of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG) notes that, "Our latest C805G6 data center solution represents an innovation both for the present and the future, setting the standard for performance, energy efficiency, and security while delivering top-notch hardware for powering AI workloads."

Lexar, a leading global brand of flash memory solutions, is excited to announce three additions to its gaming product lineup - the new Lexar NM790 M.2 2280 PCIe Gen 4×4 NVMe SSD, Lexar ARES DDR5 Desktop Memory in 6400MT/s, and Lexar ARES RGB DDR4 Desktop Memory in 3600MT/s.

The NM790 M.2 NVMe SSD is perfect for gamers and content creators, delivering incredible speeds of 7400 MB/s read, 6500 MB/s write thanks to its PCIe Gen 4 tech, which includes HMB 3.0 and Dynamic SLC Cache. So whether users are looking to vanquish foes in their gaming battles or conquer their latest creative pursuits, the NM790 SSD is ready to take on the challenge.

Global memory brand Team Group announced the launch of its updated ELITE memory modules with enhanced frequencies today: the ELITE PLUS DDR5 and ELITE DDR5 Desktop Memory 6400 MHz (1.1 V CL52-52-52-103). Both comply with JEDEC memory standards and fulfill the needs of demanding applications and high-performance computing.

In response to the growing demand for high-speed computing and digital technology, Team Group has introduced the upgraded ELITE PLUS DDR5 6400 MHz and ELITE DDR5 6400 MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of learning, entertainment, and more on desktop computers. With the modules' low operating voltage of 1.1 V, power consumption is significantly reduced, and the computer's lifespan is extended. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process the double amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.

During yesterday's HBM3 Gen2 memory products yesterday, Micron also shared an updated roadmap with select media and partners. The most interesting details on that roadmap were updates to DRAM and GDDR memory products, with increases in capacity coming for both types of memory. Micron is aiming to launch 32 Gbit or 4 GB DDR5 memory ICs somewhere in the beginning of 2024, which means we can look forward to 32 GB single sided DIMMs with a single DRAM die per memory IC. This should, in theory at least, enable cheaper 32 GB DIMMs, but as always, it's unlikely that the cost saving will be passed on to the end customer. As far as server customers goes, Micron is planning 128 GB DIMMs for 2024, followed by 192 GB DIMMs in 2025 and 256 GB DIMMs in 2026.

When it comes to GDDR, Micron will be launching JEDEC standard GDDR7 memory with 16 and 24 Gbit dies, or 2 and 3 GB capacity, the latter could be the highest capacity GDDR7 memory IC on the market and could see some interesting graphics card configurations. Micron is promising speeds of up to 32 Gbps per pin or 128 GB/s per chip, which is a big jump up from its current best GDDR6X memory which tops out at 24 Gbps per pin or 96 GB/s per chip. GDDR7 differs from Micron's proprietary GDDR6X by using PAM-3 rather than PAM-4 signalling, although this is simply something that the likes of AMD and NVIDIA would have to design their GPUs around. Micron doesn't appear to have any plans for GDDR7X at this point in time. The company is also working on several new iterations of HBM memory over the coming years, with the company expecting to hit 2 TB/s sometime in 2026 or later.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2023. The Company posted KRW 60.01 trillion in consolidated revenue, a 6% decline from the previous quarter, mainly due to a decline in smartphone shipments despite a slight recovery in revenue of the DS (Device Solutions) Division. Operating profit rose sequentially to KRW 0.67 trillion as the DS Division posted a narrower loss, while Samsung Display Corporation (SDC) and the Digital Appliances Business saw improved profitability.

The Memory Business saw results improve from the previous quarter as its focus on High Bandwidth Memory (HBM) and DDR5 products in anticipation of robust demand for AI applications led to higher-than-guided DRAM shipments. System semiconductors posted a decline in profit due to lower utilization rates on weak demand from major applications.

SK hynix Inc. today reported financial results for the second quarter of 2023. The company recorded revenue of 7.306 trillion won, operating loss of 2.882 trillion won (with operating margin of negative 39%), and net loss of 2.988 trillion won (with net margin of negative 41%) for the three-month period ended June 30, 2023.

"Amid an expansion in generative artificial intelligence (AI) market, which has largely been centered on ChatGPT, demand for AI server memory has increased rapidly," the company said. "As a result, sales of premium products such as HBM3 and DDR5 increased, leading to a 44% sequential increase in revenue for the second quarter, while operating loss narrowed by 15%."

For those looking to build something more professional than your average run of the mill PC, ASUS new Pro WS W680M-ACE SE motherboard might be the thing you've been looking for. The Intel W680 chipset based board sports a mATX form factor and packs in a range of rather unusual features that you more often would find on a board from Supermicro or Tyan than ASUS. One such feature is onboard BMC remote management via an ASpeed AST2600 SoC which features a pair of Arm Cortex A7 cores and a Cortex M3, as well as a dedicated 2D graphics chip. The board also sports a SlimSAS port which supports either four SATA drives or a single PCIe 4.0 x4 storage device, although ASUS doesn't support any cables in the box for the port.

As this is a workstation motherboard, it obviously supports ECC memory and in this case we're talking DDR5 with full transactional ECC support, rather than the on-die ECC that all DDR5 features. Other more common motherboard features include a pair of PCIe 4.0 x4 NMVe M.2 slots, a single PCIe 5.0 x16 slot, a PCIe 4.0 x4 slot and a PCIe 3.0 x1 slot. The board also has a pair of 2.5 Gbps Ethernet port and a third 1 Gbps Ethernet port which is connected the AST2600, a 10 Gbps USB 3.2 Gen 2 Type-C port, as well as a DisplayPort and HDMI port, plus a VGA port which again is connected to the AST2600. ASUS promises 24/7 reliability at ambient temperatures of up to 45 degrees C and a relative humidity of up to 80 percent. The board also comes with ASUS' Control Center Express, which is ASUS' IT management software. No word on pricing, but the ATX sized version retails for around US$330, suggesting that the mATX version should be somewhat cheaper.

ASUS Republic of Gamers (ROG) today announced collaboration centered around EVA-02 and Asuka from the long-celebrated Evangelion anime series. PC DIY builders and anime lovers can now enjoy a second impact of premium ROG components and peripherals elevated by the classic EVA-02 red and orange colorway with a variety of custom Evangelion-themed decals and graphics. The new powerhouse arsenal includes a ROG Maximus motherboard, ROG Strix GeForce RTX graphics card, ROG Ryujin AIO cooler, ROG Hyperion gaming case, graphics card holder, peripherals and other gear.

ROG Maximus Z790 Hero EVA-02 Edition motherboard
This special version of the feature-packed ROG Maximus Z790 Hero arrives with EVA-02's signature red and orange theme, with traces of green. The backplate design comes with EVA-02 Beast Mode and Evangelion patterns, supporting this motherboard's immense power and control, as it takes 13th Gen Intel Core processors and DDR5 memory kit to the next level. And an A.T. Field design around the CPU socket and Polymo lighting on the I/O cover switches between Asuka and regular EVA-02 as another artistic flourish.

It looks like the monolithic silicon that succeeds "Phoenix," codenamed "Strix Point," will finally introduce an increase in CPU core counts for the thin-and-light and ultraportable mobile platforms. "Strix Point" is codename for the next-generation APU die being developed at AMD, which, according to a leaked MilkyWay@Home benchmark result, comes with a 12-core/24-thread CPU.

The silicon is identified by MilkyWay@Home with the OPN "AMD Eng Sample: 100-000000994-03_N," and CPU identification string "AuthenticAMD Family 26 Model 32 Stepping 0 -> B20F00." The "Strix Point" CPU could be the second time AMD has increased CPU core-counts per CCX. From "Zen 3" onward, the company increased the cores per CCX from 4 to 8, allowing a single "Zen 3" CCX on the "Cezanne" monolithic silicon to come with 8 cores. It's highly likely that with "Zen 5," the company is increasing the cores/CCX to 12, and that "Strix Point" has one of these CCXs.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing several new servers to its already broad application optimized product line. These new servers incorporate the new AmpereOne CPU, with up to 192 single-threaded cores and up to 4 TB of memory capacity. Applications such as databases, telco edge, web servers, caching services, media encoding, and video gaming streaming will benefit from increased cores, faster memory access, higher performance per watt, scalable power management, and the new cloud security features. Additionally, Cloud Native microservice based applications will benefit from the lower latencies and power usage.

"Supermicro is expanding our customer choices by introducing these new systems that incorporate the latest high core count CPUs from Ampere Computing," said Michael McNerney, vice president of Marketing and Security, Supermicro. "With high core counts, predictable latencies, and up to 4 TB of memory, users will experience increased performance for a range of workloads and lower energy use. We continue to design and deliver a range of environmentally friendly servers that give customers a competitive advantage for various applications."

Axiomtek—a world-renowned leader relentlessly devoted to the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the SHB160, a new PICMG 1.3 full-size single board computer powered by the LGA1700 13th/12th Gen Intel Core i7/i5/i3, Pentium or Celeron processor with the Intel R680E/H610E chipset. The industry-specific SBC supports dual 2.5 GbE LAN for the ultimate connection experience with blazing data-transfer speed. It also supports PCIe 4.0 for more flexibility and higher bandwidth to GPUs, SSDs, and other peripherals. Offering superior computing performance, rugged design, flexible I/O expansion as well as enhanced graphics capabilities, the SHB160 aims to satisfy the requirements of AIoT applications such as vision inspection, objective classification, factory automation, intelligent video analysis, and smart city.

Axiomtek's SHB160 offers up to four DDR5-4400 MHz ECC or non-ECC U-DIMM slots for up to 128 GB of system memory. The full-size slot CPU card has six SATA-600 ports with software RAID 0/1/5/10 support (Intel R680E chipset) or four SATA-600 ports (Intel H610E chipset). In addition, the SHB160 has one M.2 Key M 2280 slot with PCIe 4.0 x4 signal for NVMe SSD (Intel R680E chipset). It also delivers superior graphics performance with the Intel UHD Graphics and offers dual display configurations via DVI-I and DisplayPort++ (internal header) ports. One PCIe x16 Gen 4 slot, one PCIe x4 Gen 4 slot or four PCIe x1 Gen 4 slots, and four 32-bit PCI bus masters are available on the board to provide an optimum solution with a diverse range of configurations. Equipped with one M.2 Key E 2230 slot, the SHB160 also supports Wi-Fi 6 for faster data transferring while reducing latency and enhancing security.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announced the ultimate memory performance of DDR5 XMP 8000 is achieved with the X670E AORUS MASTER motherboard based on the latest AMD AGESA BIOS code at a SOC voltage of 1.3 V.

GIGABYTE always works closely with AMD to ensure our motherboard designs provide supreme performance and reliability, particularly on the optimum memory performance by exclusively advanced memory layout design. Meanwhile, GIGABYTE is releasing a new beta BIOS for the X670 and B650 AORUS/AERO series motherboards for the most remarkable memory performance on the AM5 platform. The new BIOS will be available at the end of July in succession. Please pay close attention to the GIGABYTE website to download the update for optimal performance.

The leading memory brand Team Group has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48 GB module, as well as a lower 24 GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.

Current industrial DDR5 memory on the market has a maximum capacity of about 32 GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, Team Group has made capacity upgrades across its industrial DDR5 memory products, offering new 24 GB and 48 GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.

XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.

By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.

The "Granite Rapids-D" line of upcoming processors are designed for data-center servers on the edge. These non-socketed processors come in BGA4368 packages. The company is reportedly readying at least two key variants of these chips based on core-counts and memory channels. The "Granite Rapids-D" HCC (high core-count) is an MCM of a "Granite Rapids" LCC (low-core count) compute tile, and a single I/O tile with a 4-channel DDR5 memory interface.

The "Granite Rapids-D" XCC (extreme core-count) has one "Granite Rapids" HCC (high core-count) compute tile, and two I/O tiles that make up the chip's 8-channel DDR5 memory interface. A probable reason for the confusion between LCC, HCC, and XCC terminologies for "Granite Rapids-D" is because the compute tiles are carried over from the main "Granite Rapids-SP" server processors, where they mean different things for the core-counts of mainline servers.

Scientists at the Tokyo Institute of Technology have developed a new type of stacked or 3D DRAM that the researchers call Bumpless Build Cube 3D or BBCube 3D, which relies on Through Silicon Vias or TSVs to connect the DRAM dies. This is a different approach to HBM which relies on micro bumps to connect the layers together and the Japanese scientists are saying that their bumpless wafer-on-wafer solution should allow not only for an easier manufacturing process, but more importantly, improved cooling, as the TSVs can channel the heat from the DRAM dies down into whatever substrate the BBCube 3D stack is finally mounted onto.

If that wasn't enough, the researchers believe that BBCube 3D will be able to deliver higher speeds than HBM courtesy of a combination of the TSVs being relatively short and "high-density signal parallelism". BBCube 3D is expected to deliver up to a 32 fold increase in bandwidth compared to DDR5 memory and a four fold increase compared to HBM2E memory, while at the same time, drawing less power. The research paper goes into a lot more details for those interested at taking a closer look at this potentially revolutionary shift in DRAM assembly. However, the question that remains unanswered is if this will end up as a real world product some time in the near future, which is all based on how manufacturable BBCube 3D memory will be.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, announces the best-performing business and casual motherboards for Intel 12/13th gen core processors in 2023. Tailored to cater to a wide range of users, from office applications to system integration businesses and home entertainment, the B760MX2-E, B760MZ-E PRO, B760MX2-E D4, and B760MX2-E PRO D4 motherboards pack an impressive suite of features and functionality ready to perform at the highest standard.

Powered by Intel's 12th and 13th-generation processors, these motherboards provide a seamless computing experience with higher performance, improved data integrity, and lower power consumption, setting new benchmarks in their respective segments. With B760MX2-E, B760MZ-E PRO motherboards supporting DDR5, and B760MX2-E D4, B760MX2-E PRO D4 motherboards supporting DDR4 memory, they provide exceptional memory support and performance. The B760MZ-E PRO and the B760MX2-E PRO D4 motherboards support up to 128 GB of memory while the B760MX2-E and the B760MX2-E D4 motherboards support up to 64 GB of memory capacity, providing users ample choice when it comes to system performance.

TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline. Despite suppliers' concerted efforts, inventory levels persistently remain high, keeping prices low. While production cutbacks may help to curtail quarterly price declines, a tangible recovery in prices may not be seen until 2024.

PC DRAM: The benefits of consolidated production cuts on DDR4 by the top three suppliers are expected to become evident in the third quarter. Furthermore, inventory pressure on suppliers has been partially alleviated due to aggressive purchasing by several OEMs at low prices during 2Q23. Evaluating average price trends for PC DRAM products in 3Q23 reveals that DDR4 will continue to remain in a state of persistent oversupply, leading to an expected quarterly price drop of 3~8%. DDR5 prices—influenced by suppliers' efforts to maintain prices and unmet buyer demand—are projected to see a 0-5% quarterly decline. The overall ASP of PC DRAM is projected to experience a QoQ decline of 0~5% in the third quarter.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce a new white colored edition of its flagship Trident Z5 RGB series DDR5 memory, featuring extreme overclocked speeds of up to DDR5-8200 at 24 GB x 2 kit capacity.

The White Choice of Overclocked Performance DDR5 Memory
The new white version of the Trident Z5 RGB series boasts a sleek white aluminium heat spreader and features a black brushed-aluminium strip inset across the center, providing PC enthusiasts an ideal high-performance overclocked memory kit in a white themed PC build.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

Hardware leaker MEGAsizeGPU has uploaded photos of unreleased G.Skill DIMMs—they claim that the leaked hardware "is the world's first 24G*2 DDR5 expo module: F5-6000J4048F24GX2-TZ5NR." The next-gen Trident Z5 memory is said to be rated for a 6000 MT/s data transfer rate, and close-up shots of labels on heatsinks point to the sample units being non-binary 24 GB DDR5 memory modules that can support EXPO profiles for AMD's Ryzen 7000-series CPUs. MEGAsizeGPU claims that "6000 MHz is the sweetspot for Ryzen" (AM5).

Off-screen captures show a PC system booting up in DDR5-6000 mode—within a Windows OS environment, CPU-Z demonstrates that these new Trident Z5 modules are based on SpecTek-made 24Gb DRAM ICs (instead of binary 16Gb)—SpecTek is a division working under Micron Technology. G.SKILL will likely be selling non-binary Z5 memory in pairs, so we expect to see matched 48 GB dual-channel kits popping up on the market soon. MEGAsizeGPU did not mention anything about pricing or availability. Kingston debuted its own non-binary memory offerings at Computex 2023, but presentation material on hand did not mention whether their new models support AMD's Extended Profiles for Overclocking (EXPO).

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.