BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today showcases the B650MT motherboard, featuring the AMD Ryzen 5 PRO 7645 processor, the best workstation setup ideal for office users and businesses. The BIOSTAR B650MT motherboard delivers exceptional performance, efficiency, and security to meet the demands of the modern workplace; with support for up to 96 GB of DDR5 memory, it ensures seamless multitasking and exceptional system responsiveness. Offering a versatile storage solution with an M.2 slot and four SATA III ports, this motherboard provides lightning-fast data access and ample storage capacity. BIOSTAR's signature features, including Super Durable Solid Caps, Super Durable Inductor, and Super Hyper PWM, guarantee a dependable and long-lasting system.

With the latest AMD Ryzen 5 PRO 7645 processor, BIOSTAR's B650MT motherboard sets up an ideal platform for business and casual use. The AMD Ryzen 5 PRO 7645 processor offers a compelling blend of top-notch performance, cutting-edge security features, and energy efficiency, making it an excellent fit for the modern-day business sector. Powered by the groundbreaking AMD Zen 4 architecture, this desktop processor comes equipped with integrated AMD Radeon Graphics, simplifying integration, management, and administration tasks. With six cores and twelve threads, fast clock speeds reach up to 5.10 GHz, making it ideal for multitasking and demanding tasks.

The Geekbench database of benchmark submissions is yielding more leaks about Intel's upcoming 5th generation Xeon Scalable processors codenamed Emerald Rapids. Previously, we have covered the leak of the possibly top-end 64-core Xeon 8592+ Platinum and a 48-core Xeon 8558U processor. However, today, we are seeing information about lower-stack SKUs carrying up to 48 cores each. The first in line is the Xeon Platinum 8558P, a 48-core, 96-threaded CPU that runs at 2.7 GHz base frequency and 4.0 GHz boost frequency. It is equipped with 16 MB of L3 cache in addition to 192 MB of L2, making the total cache memory 260 MB. The integrated memory controller (IMC) of the Xeon Platinum 8558P supports eight-channel DDR5 running at 4800 MT/s, and the CPU has a TDP of 350 Watts.

The other SKU that was also listed was the Xeon Platinum 8551C, also a 48-core, 96-thread model with the same 260 MB cache configuration. However, this SKU has a higher base frequency of 2.9 GHz, with an unknown boost speed and unknown IMC configuration. An interesting thing to note about these 48C/96T SKUs is that they feature less cache compared to the previously leaked 48-core Xeon 8558U processor, which had 96 MB of L2 cache and 260 MB of L3 cache, making for a total of 356 MB of cache (which includes L1D and L1I as well). The segmentation that Intel is doing for its Xeon processors will be based not only on core count, frequency, and TDP but also on CPU cache sizes.

Uptake on AMD's latest generation mobile offerings has been slow and steady to put it mildly, but today TUXEDO Computers, a specialist in Linux notebooks at a range of performance and pricing tiers, has announced pre-orders for their new Sirius 16 gaming laptop. This machine combines AMD's latest generation Ryzen 7 7840HS "Phoenix" APU with a Radeon RX 7600M XT RDNA3 GPU inside a sleek all aluminium chassis design that strives to remain understated while still providing a "sleek gamer look" via programmable RGB keys. The Sirius 16 is TUXEDO's first go at an all-AMD configuration and they've held very little back, choosing to allow the full TDP rating of the Phoenix APU at 54 W sustained (or 80 W CPU-only turbo) as well as keeping the RDNA3 GPU at its rated 120 W TGP under full CPU+GPU loads. The Sirius 16 features venting out of both sides as well as the rear of the chassis, and roughly half of the bottom panel is open intake for the dual-fan cooling system.

Powering everything is a 230 W power brick and an 80 Wh replaceable battery bolted inside the chassis. TUXEDO claims up to 10 hours of battery life at minimum display brightness with wireless disabled and without any programmable lighting enabled, or a more realistic 6 hours at medium brightness with wireless enabled and under minimal "office work" load.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

SK hynix presented its leading AI and high-performance computing (HPC) solutions at Supercomputing 2023 (SC23) held in Denver, Colorado between November 12-17. Organized by the Association for Computing Machinery and IEEE Computer Society since 1988, the annual SC conference showcases the latest advancements in HPC, networking, storage, and data analysis. SK hynix marked its first appearance at the conference by introducing its groundbreaking memory solutions to the HPC community. During the six-day event, several SK hynix employees also made presentations revealing the impact of the company's memory solutions on AI and HPC.

Displaying Advanced HPC & AI Products
At SC23, SK hynix showcased its products tailored for AI and HPC to underline its leadership in the AI memory field. Among these next-generation products, HBM3E attracted attention as the HBM solution meets the industry's highest standards of speed, capacity, heat dissipation, and power efficiency. These capabilities make it particularly suitable for data-intensive AI server systems. HBM3E was presented alongside NVIDIA's H100, a high-performance GPU for AI that uses HBM3 for its memory.

V-COLOR Technology Inc. is proud to announce the launch of a new TUF Gaming Alliance Memory, available in both DDR5 XPrism and DDR4 Prism Pro series, showcasing a striking design and exceptional performance. This collaboration with the ASUS TUF Gaming Alliance ensures that components bearing this badge undergo testing that surpasses the industry's standard norms. This rigorous testing is implemented to ensure superior compatibility, stability, and durability, catering to the specific needs of gamers and PC enthusiasts globally.

The new memory kits are offered in configurations of 32 GB (2x 16 GB) with speeds ranging from 5600 MHz to 6400 MHz for DDR5, and 16 GB (2x 8 GB) to 32 GB (2x 16 GB) with speeds ranging from 3200 MHz to 3600 MHz for DDR4 memory. The memory modules are equipped with powerful SK Hynix chips. DDR5 memory is compatible with Intel XMP, and DDR4 is compatible with both INTEL and AMD platforms.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

In support of World Environment Day, Team Group released the C175 ECO Net-Zero Flash Drive previously, which received positive reception from consumers worldwide. To encourage action against environmental pollution, Team Group has continued to devote itself to the development and design of environmentally friendly products. Now Team Group is launching the industry's first memory module with a recycled aluminium heat sink: the T-FORCE VULCAN ECO DDR5 Desktop Overclocking Memory.

Team Group takes social responsibility seriously, promoting sustainability through green research and development. For every 10,000 recycled aluminium T-FORCE VULCAN ECO DDR5 heat sinks made, carbon emissions are reduced by 73% or about 1,665 kg of carbon emissions. That is equivalent to the carbon footprint of 550,000 hand towels, 310,000 plastic straws, 30,000 plastic bags, and 10,000 PET bottles. The T-FORCE VULCAN ECO DDR5 also uses FSC-certified eco-packaging for the entire product, further contributing to the reduction of material and electronic waste.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

In a major leap forward for high-performance computing, Venom Computers announced the launch of its newest model: the BlackBook Zero 14" Phantom G9. The Phantom G9 is the latest example of Venom's commitment to blending unmatched power with conscientious sustainability and is designed for Venom's exclusive users, who include discerning professionals and informed tech enthusiasts.

"The Zero 14 Phantom isn't just about leading-edge specs, though we're proud of those," said Jaan Turon, Director of Venom. "This new model also embodies our dedication to longevity and service in what we call the Venom Value Cycle: a sustainable ethos that benefits both customers and the environment."

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming Peripherals, and Enthusiast Memory solutions, is excited to launch the TOUGHRAM XG RGB D5 Memory DDR5 7600/8000 MT/s 32 GB (16 GB x2) available in black and white. The TOUGHRAM XG RGB D5 is a high-performance DDR5 RAM module that features a unique X-shaped light bar with 16 LEDs. To satisfy different speed demands, the TOUGHRAM XG RGB D5 series provides frequency options starting from 5600MT/s, and now has new higher frequency additions of up to 8000MT/s and can support the latest Intel 14th Gen.

The TOUGHRAM XG RGB D5 7600/8000 MT/s are made with superior components to achieve uncompromised speed. Built with tightly-screened ICs and a 10-layer PCB with 2oz copper inner layer, The TOUGHRAM XG RGB D5 can deliver outstanding response time performance and overclocking performance. The high-quality 10μ gold fingers on the ram provide high wear resistance to reinforce durability. Additionally, the TOUGHRAM XG RGB D5 Memory DDR5 is equipped with a doubled bank group architecture, increasing capacity without lag. To reach long-term stability, the DDR5 memory features a native Power Management IC (PMIC) to optimize power efficiency with merely 1.1 V low operating voltage. The TOUGHRAM XG RGB D5 7600/8000 MT/s include the on-die error correction code (ECC) can strengthen stability and reliability through its auto error correction.

Today, Lenovo announced the new ThinkStation P8 tower workstation powered by AMD Ryzen Threadripper PRO 7000 WX-Series processors and NVIDIA RTX GPUs. Designed to deliver unparalleled performance, reliability and flexibility for professionals who demand the best from their workstations, the bold new ThinkStation P8 builds on the success of the award-winning P620, the world's first workstation powered by AMD Ryzen Threadripper PRO processors. Featuring an optimized thermal design in a versatile Aston Martin inspired chassis, the ThinkStation P8 combines Lenovo's legendary reliability, customer experience and innovation with breakthrough compute architecture courtesy of AMD and NVIDIA. ThinkStation P8 raises the bar for intense workloads across multiple segments focused on outcome-based workflow agility.

"At Lenovo, we understand that our customers need high-quality workstations that can adapt to their changing and diverse needs. That's why we collaborated with AMD and NVIDIA to create the ThinkStation P8, a workstation that combines power, flexibility and enterprise-grade features," said Rob Herman, vice president and general manager, Workstation and Client AI Business Unit, Lenovo. "Designed to offer unparalleled performance and scalability, whether to run complex simulations, render stunning visuals, or develop cutting-edge AI applications, the ThinkStation P8 can handle it all. And with Lenovo's certifications, security and support, you can trust that the ThinkStation P8 will exceed expectations."

Micron Technology, Inc. (Nasdaq: MU), today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128 GB DDR5 RDIMM memory featuring best-in-class performance of up to 8000 MT/s to support data center workloads today and into the future. These high-capacity, high-speed memory modules are engineered to meet the performance and data-handling needs of a wide range of mission-critical applications in data center and cloud environments, including artificial intelligence (AI), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads.

Powered by Micron's industry-leading 1β (1-beta) technology, the 32Gb DDR5 DRAM die-based 128 GB DDR5 RDIMM memory delivers the following enhancements over competitive 3DS through-silicon via (TSV) products:

• more than 45% improved bit density
• up to 24% improved energy efficiency
• up to 16% lower latency
• up to a 28% improvement in AI training performance

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

Alibaba's T-Head unit, responsible for the design and development of in-house IC design, has announced the first domestic SSD controller based on the PCIe 5.0 specification standard. Called the Zhenyue 510, the SSD controller is aimed at enterprise SSD offerings. Interestingly, the Zhenyue 510 is powered by T-Head's custom Xuantie C910 cores based on RISC-V instruction set architecture (ISA). Supporting the PCIe 5.0 standard for interfacing, the SSD controller uses DDR5 memory as a cache buffer. Regarding the performance, there are no official figures yet, but the company claims to have 30% lower input/output latencies compared to competing offerings. T-Head claims the SSD has an IO processing capability of "3400 Kilo IOs per second, a data bandwidth of 14 Gbytes/s, and an extremely high energy efficiency of 420 Kilo IO per second for every Watt".

This is an essential step towards Chinese self-sufficiency as T-Head has designed various ICs for processing different tasks. Still, now Alibaba's chip design unit has a domestic design for storage as well. Claiming low latency figures, the Zhenyue 510 is suitable for enterprise workloads like big data analysis, as well as AI inference/training systems workloads. The development of Zhenyue 510 started in 1H 2021, and it took the company more than two years to complete the design and validation of the chip to prepare it for deployment. This is the second Chinese-made SSD controller after Yingren Technology (InnoGrit) announced their chip in September.

Kingston Technology, a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce. Kingston retains its number 1 position with an estimated 78.12% market share on $13.5 billion (USD) revenue. TrendForce states DRAM module sales in 2022 saw a 4.6% YoY decline across the industry. Kingston's revenue showed a slight decrease but held its position as the global leader for the 20th consecutive year.

According to the report, the world's top five memory module houses accounted for 90% of total sales in 2022 with Kingston maintaining its dominant market share of 78.12%. Consumer buying trends for electronic products took a hit from high inflation but Kingston's robust brand scale along with its comprehensive product supply chain limited its decline, keeping it firmly at the top of market share rankings.

KLEVV, an emerging memory brand introduced by Essencore, is excited to unveil brand new additions to its high-capacity non-binary DDR5 overclocking memory range, meticulously designed to meet the demanding needs of gamers, content creators, and PC enthusiasts across the globe. KLEVV's DDR5 memory lineup now boasts novel non-binary and high-capacity combinations aimed at bringing users a diverse, cutting-edge product range.

Globally popular CRAS V RGB, CRAS XR5 RGB, and BOLT V DDR5 gaming/overclocking memory are now available in non-binary 48 GB (24 GB x2) and high-capacity 64 GB (32 GB x2) kits, ensuring enhanced performance and multitasking capabilities. Ideal for modern-day computing needs, these new units are suitable for PC workstations and gaming rigs that settle for nothing but the very best. KLEVV's CRAS V RGB and CRAS XR5 RGB DDR5 gaming/overclocking memory offer up to 8000MT/s clock speed, perfect for content creators seeking to harness the unparalleled performance of the latest DDR5 technology.

Samsung Electronics today reported financial results for the third quarter ended September 30, 2023. Total consolidated revenue was KRW 67.40 trillion, a 12% increase from the previous quarter, mainly due to new smartphone releases and higher sales of premium display products. Operating profit rose sequentially to KRW 2.43 trillion based on strong sales of flagship models in mobile and strong demand for displays, as losses at the Device Solutions (DS) Division narrowed.

The Memory Business reduced losses sequentially as sales of high valued-added products and average selling prices somewhat increased. Earnings in system semiconductors were impacted by a delay in demand recovery for major applications, but the Foundry Business posted a new quarterly high for new backlog from design wins. The mobile panel business reported a significant increase in earnings on the back of new flagship model releases by major customers, while the large panel business narrowed losses in the quarter. The Device eXperience (DX) Division achieved solid results due to robust sales of premium smartphones and TVs. Revenue at the Networks Business declined in major overseas markets as mobile operators scaled back investments.

Montage Technology, a leading data processing and interconnect IC company, today announced it has taken the lead in trial production of the 3rd-generation DDR5 Registering Clock Driver (RCD03) designed for use in DDR5 RDIMMs. With its blazingly fast 6400 MT/s data rate, the RCD03 sets a new bar for DDR5 memory performance in upcoming server platforms. It unlocks dramatic capacity, bandwidth, and latency improvements to meet the growing demands of data center, cloud, and AI applications.

The RCD03 marks a major advancement in Montage's continued role as an innovator driving rapid DDR5 developments. This chip achieves a 14.3% speed increase over the 2nd-gen DDR5 RCD and a 33.3% increase over the 1st--gen, making it one of the fastest DDR5 memory interface solutions available today.

Leading global motherboard manufacturer, ASRock, proudly announces its new WRX90 WS EVO & TRX50 WS motherboard for new AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors. The new motherboards support 4/8 channel memory up to 1 TB/2 TB DDR5 ECC RDIMM, PCI-Express 5.0 expansion slots, server grade storage expansion such as Slim-SAS & MCIO and 10 Gbps Ethernet, giving ultimate performance for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.

Ultimate Performance & Rock-Solid Stability
To ensure stability for AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors in all conditions and systems loads, the WRX90 WS EVO & TRX50 WS has been given a flagship-class server grade ultra-low loss PCB and 18+3+3 phase SPS Dr.MOS VRM design to ensure ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

SK hynix Inc., today reported the financial results for the third quarter ended September 30, 2023. The company recorded revenues of 9.066 trillion won, operating losses of 1.792 trillion won and net losses of 2.185 trillion won in the three-month period. The operating and net margins were a negative 20% and 24%, respectively. After bottoming out in the first quarter, the business has been on a steady recovery track, helped by growing demand for products such as high-performance memory chips, the company said.

"Revenues grew 24%, while operating losses narrowed 38%, compared with the previous quarter, thanks to strong demand for high-performance mobile flagship products and HBM3, a key product for AI applications, and high-capacity DDR5," the company said, adding that a turnaround of the DRAM business following two quarters of losses is particularly hopeful. SK hynix attributed the growth in sales to increased shipments of both DRAM and NAND and a rise in the average selling price.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to introduce the brand-new RGB DDR5 GAMING X memory. BIOSTAR's newest RGB DDR5 GAMING X 16 GB 6400 MHz memory module is a masterclass in precision engineering, tailor-made for every gamer's passion. From the casual enthusiast to the dedicated mid-range player and the elite pro gamer seeking peak performance, this memory is the ultimate upgrade, ready to elevate any gaming rig to battle-ready perfection.

The RGB DDR5 GAMING X memory offers users a captivating visual experience, enhancing the aesthetics of any gaming or workstation setup with its stunning RGB lights. Seamlessly compatible with BIOSTAR's RGB-sync-ready motherboards, it allows for a harmonious synchronization of colors and effects, elevating the ambiance of the user's rig while ensuring peak performance.

Lexar, a leading global brand of flash memory solutions, is excited to announce THOR OC DDR5 Desktop Memory. Featuring a complete redesign that pays homage to Thor's hammer, this memory also boasts a durable, solid aluminium heatsink that more than stands up to the challenges of overclocking by providing superior heat dissipation. Lexar THOR OC DDR5 Desktop Memory delivers up to 6000MT/s with timing as low as CL32 for a truly next-gen experience. It features a low-profile form factor that is perfect for compact PC builds. It also supports Intel XMP 3.0 and AMD EXPO overclocking and is compatible with most DDR5 motherboards.

Lexar THOR OC DDR5 Desktop Memory's on-die Error Correction Code (ECC) offers improved stability and reliability while its on-board Power Management IC (PMIC) enhances power efficiency. Another option for PC users is THOR OC DDR4 Desktop Memory. It offers 3200MT/s performance with timing of CL16 and is designed for PC enthusiasts and extreme gamers. It has an aluminium heat spreader with a winged design to keep systems running cool and is compatible with INTEL XMP 2.0 and AMD Ryzen.

Velocity Micro, the premier builder of award-winning enthusiast desktops, laptops, high performance computing solutions, and professional workstations announces the immediate availability of the ProMagix G480a and G480i - two GPU servers optimized for High Performance Computing and Artificial Intelligence. Powered by either dual AMD Epyc 4th Gen or dual 4th Gen Intel Scalable Xeon processors, these 4U form factor servers support up to eight dual slot PCIe Gen 5 GPUs to create incredible compute power designed specifically for the highest demand workflows including simulation, rendering, analytics, deep learning, AI, and more. Shipments begin immediately.

"By putting emphasis on scalability, functionality, and performance, we've created a line of server solutions that tie in the legacy of our high-end brand while also offering businesses alternative options for more specialized solutions for the highest demand workflows," said Randy Copeland, President and CEO of Velocity Micro. "We're excited to introduce a whole new market to what we can do."