Leading memory brand, Team Group, returns to COMPUTEX 2023 with the theme "DAZZLE．CHILL．INTEGRATE" to introduce six new products in the memory, cooling solution, and storage device categories. They will be unveiled for the first time at COMPUTEX (5/30-6/2), showcasing Team Group's latest cooling solutions and "aurora" RGB lighting tech as the highlights of the grand exhibition. This year's exhibition is split into two display areas for T-FORCE and T-CREATE's new products. In addition to a large gradient LED screen that will demonstrate T-FORCE's industry-leading RGB technology, there will be physical display areas for the new products, each of which will create an immersive interactive experience that displays the cooling and aurora theme of the exhibition. Attendees will be met with a visual feast of colorful lighting and cool tech.

T-FORCE XTREEM ARGB DDR5 Gaming Overclocking Memory is equipped with innovative dual light pipes which utilize black translucent acrylic and multi-optical designs to display a soft aurora-like flow of light. The matte heat spreader of the XTREEM ARGB DDR5 is made of high-quality 2 mm black aluminium alloy, which has undergone aluminium extrusion, CNC processing, sandblasting, and black anodizing, creating a unique material that combines the hardness and durability of basalt and the soft texture of black beach sand. It comes in a variety of frequencies starting from DDR5-7000 to DDR5-8266 and is specially designed for gamers after an extreme performance and dazzling RGB lighting.

Essencore, an emerging memory company, with its flagship consumer facing brand KLEVV is excited to announce its participation at COMPUTEX Taipei 2023. Essencore will showcase its B2B business solutions and B2C consumer products at the Expo from May 30th to June 2nd, 2023. COMPUTEX Taipei 2023 is back after a few years of absence due to the pandemic.Using this occasion to make a grand return, Essencore will showcase some of the most advanced memory and storage solutions built to dominate the global market.

KLEVV, Essencore's consumer brand, is thrilled to showcase its latest innovative products designed for gamers, content creators, and tech enthusiasts. The highlight of on-site demonstration includes the newly released CRAS V RGB and BOLT V DDR5 gaming/overclocking memory with a maximum clock speed of up to 8600MT/s, and a new DDR5 memory with 48 GB capacity per DIMM.

ADATA, the world's leading memory module and flash memory brand, in association with its subsidiary gaming performance brand, XPG, will take part in the world's largest computer trade show in Taipei from May 30 to June 2, 2023- Computex Taipei. As an industry leader, ADATA continues to implement the company's brand philosophy of "Innovating the Future" through its businesses. In addition to providing new technological products and solutions, ADATA is also committed to promoting the sustainable development of corporations in order to lead the future.

To realize this year's theme of "The Xtreme Future Leader - Infinite Innovation," ADATA has leveraged emerging technologies to launch new products that are sustainable and extraordinarily innovative including the most powerful Gen 5 SSD, industry-leading CXL (Compute Express Link) memory module, CAMM (Compression Attached Memory Module), XPG titanium power supply (XPG FUSION 1600 W), and professional industrial solutions. Be sure to visit Computex to experience a full range of new products!

GeIL, one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.

GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.

Ampere Computing today announced a new AmpereOne Family of processors with up to 192 single threaded Ampere cores - the highest core count in the industry. This is the first product from Ampere based on the company's new custom core, built from the ground up and leveraging the company's internal IP. CEO Renée James, who founded Ampere Computing to offer a modern alternative to the industry with processors designed specifically for both efficiency and performance in the Cloud, said there was a fundamental shift happening that required a new approach.

"Every few decades of compute there has emerged a driving application or use of performance that sets a new bar of what is required of performance," James said. "The current driving uses are AI and connected everything combined with our continued use and desire for streaming media. We cannot continue to use power as a proxy for performance in the data center. At Ampere, we design our products to maximize performance at a sustainable power, so we can continue to drive the future of the industry."

With more countries creating initiatives to develop homegrown processors capable of powering powerful supercomputing facilities, India has just presented its development milestone with Aum HPC. Thanks to information from the report by The Next Platform, we learn that India has developed a processor for powering its exascale high-performance computing (HPC) system. Called Aum HPC, the CPU was developed by the National Supercomputing Mission of the Indian government, which funded the Indian Institute of Science, the Department of Science and Technology, the Ministry of Electronics and Information Technology, and C-DAC to design and manufacture the Aum HPC processors and create strong, strong technology independence.

The Aum HPC is based on Armv8.4 CPU ISA and represents a chiplet processor. Each compute chiplet features 48 Arm Zeus Cores based on Neoverse V1 IP, so with two chiplets, the processor has 96 cores in total. Each core gets 1 MB of level two cache and 1 MB of system cache, for 96 MB L2 cache and 96 MB system cache in total. For memory, the processor uses 16-channel 32-bit DDR5-5200 with a bandwidth of 332.8 GB/s. To expand on that, HBM memory is present, and there is 64 GB of HBM3 with four controllers capable of achieving a bandwidth of 2.87 TB/s. As far as connectivity, the Aum HPC processor has 64 PCIe Gen 5 Lanes with CXL enabled. It is manufactured on a 5 nm node from TSMC. With a 3.0 GHz typical and 3.5+ GHz turbo frequency, the Aum HPC processor is rated for a TDP of 300 Watts. It is capable of producing 4.6+ TeraFLOPS per socket. Below are illustrations and tables comparing Aum HPC to Fujitsy A64FX, another Arm HPC-focused design.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is thrilled to announce the launch of its latest H610MH D5 motherboard. Based on Intel H610 single-chip architecture, the H610MH D5 flawlessly supports 12th/13th Generation Intel Core processors thanks to BIOSTAR's globally renowned design and manufacturing prowess.

The H610MH D5 motherboard is versatile. Engineered to cater both business and leisure, this motherboard brings BIOSTAR's cutting-edge technology, including the energy-efficient A.I FAN, informative Debug LED, and high-performing Intel GbE LAN to transform mundane tasks like web browsing, sending emails, and running office applications into a seamless experience.

Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node. Micron will be the first semiconductor company to bring EUV technology to Japan for production, with its Hiroshima fab playing a critical role in the company's development of the 1-gamma node. Micron expects to invest up to 500 billion yen in 1-gamma process technology over the next few years, with close support from the Japanese government, to enable the next wave of end-to-end technology innovation such as rapidly emerging generative artificial intelligence (AI) applications.

With each successive advancement in process technology to scale memory cells and advance performance, Micron enables increased memory density, improvement in power efficiency and lower cost per bit, helping to unlock new opportunities for digitization, sustainability and green transformation, and automation. The introduction of 1-gamma follows the development of Micron's 1-beta (1β), the industry's most advanced DRAM node today, which Micron mass produces in its Hiroshima fab. Micron continues to make progress on its EUV integration plans and expects to ramp EUV into production on the 1-gamma node in Taiwan and Japan from 2025 onwards.

Samsung Electronics, a world leader in advanced memory technology, today announced that its 16-gigabit (Gb) DDR5 DRAM, which utilizes the industry's most advanced 12 nanometer (nm)-class process technology, has started mass production. Samsung's completion of the state-of-the-art manufacturing process reaffirms its leadership in cutting-edge DRAM technology.

"Using differentiated process technology, Samsung's industry-leading 12 nm-class DDR5 DRAM delivers outstanding performance and power efficiency," said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics. "Our latest DRAM reflects our continued commitment to leading the DRAM market, not only with high-performance and high-capacity products that meet computing market demand for large-scale processing but also by commercializing next-generation solutions that support greater productivity."

TrendForce reveals that alongside the four major CSPs reducing their procurement volumes, OEMs like Dell and HPE have also scaled back their annual shipment volume forecasts at some point between February and April, predicting YoY declines of 15% and 12%, respectively. Furthermore, server demand in China is facing headwinds due to geopolitical and economic challenges. Consequently, TrendForce projects a downward revision in global server shipment volumes for this year—a 2.85% YoY decrease at 13.835 million units.

TrendForce emphasizes that the server market in 1H23 remains pessimistic, with 1Q23 shipments experiencing a 15.9% QoQ decrease due to off-season factors and end-user inventory adjustments. The expected industry boom in 2Q23 failed to materialize, leading to a modest QoQ growth estimate of only 9.23%. Persistent influences on server shipments include OEMs lowering shipment volumes, subdued domestic demand in China, and continuous supply chain inventory adjustments. ESG issues have also led CSPs to prolong server lifecycles and reduce procurement volume. Moreover, OEMs are lengthening supports period for older platforms as businesses seek to control capital expenditures, further contributing to market strain.

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly introduces the CVN ICICLE DDR5 high-performance memory for enthusiasts and overclockers. With a high-speed configuration of DDR5-6600 MHz frequency, this memory is built for speed.

The CVN ICICLE DDR5 memory supports Intel XMP 3.0 technology that allows users to boost performance with ease via the BIOS by activating the predefined and tested Intel XMP profile. Furthermore, its advanced heatsink design provides excellent heat dissipation to achieve higher overclocks.

Corsair Gaming, Inc. (Nasdaq: CRSR), a leading global provider and innovator of high-performance gear for gamers, streamers, content-creators, and gaming PC builders, today announced financial results for the first quarter ended March 31, 2023.

Andy Paul, Chief Executive Officer of Corsair, stated, "We are off to a strong start to 2023 with a 33% improvement in adjusted EBITDA compared to the year ago period. We are thrilled to see that enthusiast-level consumers continue to build new gaming PCs at a rate significantly above pre-pandemic levels. Recent third party data shows that Corsair continues to gain and hold leading market share positions in most of our categories of components used in those builds. The broader market for gaming peripherals is also holding up at a level significantly above pre-pandemic levels, although slightly behind 2022 levels, most notably in Europe. During 2023 we started to ship many new innovative products, including our FLEX OLED bendable monitor, engineered in partnership with LG. With lower priced GPUs coming to market and exciting new game titles being released this year, we are confident that the gaming market will continue to grow off the higher recent levels and we believe that Corsair can continue to gain market share in many of the new categories we are entering."

TrendForce's latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

TrendForce reports that the significant drop in DRAM prices was mostly attributed to high inventory levels of DDR4 and LPDDR5 as PC DRAM, server DRAM, and mobile DRAM collectively account for over 85% of DRAM consumption. Meanwhile, the market share for DDR5 remains relatively low.

The latest AMD AGESA 1.0.0.7 AM5 platform microcode that the company recently released to improve stability of machines powered by Ryzen 7000X3D processors, more importantly, prevent them from physical damage due to increased voltage in voltage-assisted overclocking scenarios; reportedly impacts memory overclocking capabilities, too, reports g01d3nm4ng0. The "PROCHOT Control" and "PROCHOT Deassertation Ramp" toggles that were available in the oldest versions of AGESA for AM5, are not available in the latest production AGESA.

The memory compatibility is also affected. AMD recently added support for odd-density DDR5 memory modules, such as 24 GB and 48 GB, which make up 48 GB and 96 GB 2-module (dual-channel, four sub-channel) kits. It is possible to max out 192 GB, but while the older AGESA 1.0.0.6 allowed memory frequencies of up to DDR5-6000 with SoC voltage of 1.3 V, the newer AGESA is only stable up to DDR5-4400 at this density. To be fair, most motherboards advertise maximum memory frequencies of under DDR5-4800 for memory configurations where there are two DIMMs per channel, and both DIMMs are dual-rank (so four dual-rank DIMMs in all, which is the least optimal memory configuration from a memory frequency and latency perspective).

ASUS today announced ExpertCenter PN53, a mini PC that harnesses the power of the latest AMD Ryzen 7000 series processors and AMD Radeon 600M series graphics. ExpertCenter PN53 features a triple-storage design that can accommodate a variety of storage combinations. Two PCIe 4.0 M.2 SSDs and DDR5 memory ensure fast boot-up and app loading times. In addition, ExpertCenter PN53 includes cleverly designed cooling features, AI-powered noise-cancelation technology for improved voice communications, and can support a single 8K monitor or up to four 4K monitors.

ExpertCenter PN53 offers up to 34% better single-thread performance and up to a 29% boost in multithread performance, compared to the previous PN51 model. In PCMark 10 Essentials group tests, ExpertCenter PN53 showed a 10% improvement in web browsing, videoconferencing, and app start-up times. It also performed 10% better than ExpertCenter PN51 in the Productivity test group that measures system performance with everyday office applications, including spreadsheets and writing workloads.

Finding itself embattled with AMD's EPYC "Genoa" processors, Intel is giving its 4th Gen Xeon Scalable "Sapphire Rapids" processor a rather quick succession in the form of the Xeon Scalable "Emerald Rapids," bound for Q4-2023 (about 8-10 months in). The new processor shares the same LGA4677 platform and infrastructure, and much of the same I/O, but brings about two key design changes that should help Intel shore up per-core performance, making it competitive to EPYC "Zen 4" processors with higher core-counts. SemiAnalysis compiled a nice overview of the changes, the two broadest points of it being—1. Intel is peddling back on the chiplet approach to high core-count CPUs, and 2., that it wants to give the memory sub-system and inter-core performance a massive performance boost using larger on-die caches.

The "Emerald Rapids" processor has just two large dies in its extreme core-count (XCC) avatar, compared to "Sapphire Rapids," which can have up to four of these. There are just three EMIB dies interconnecting these two, compared to "Sapphire Rapids," which needs as many as 10 of these to ensure direct paths among the four dies. The CPU core count itself doesn't see a notable increase. Each of the two dies on "Emerald Rapids" physically features 33 CPU cores, so a total of 66 are physically present, although one core per die is left unused for harvesting, the SemiAnalysis article notes. So the maximum core-count possible commercially is 32 cores per die, or 64 cores per socket. "Emerald Rapids" continues to be based on the Intel 7 process (10 nm Enhanced SuperFin), probably with a few architectural improvements for higher clock-speeds.

v-color Technology Inc., an industry leader in cutting-edge memory solutions, proudly unveils the game-changing 48 GB (24 GB x2) DDR5-8200 38-52-52-130 Manta XPrism RGB Extreme OC Memory in a range of 7200 to 8200 MHz kits. This state-of-the-art memory module is meticulously designed to cater to the evolving needs of gamers, overclockers, and enthusiasts who demand top-notch performance, reliability, and aesthetics.

The Manta XPrism RGB 48 GB (24 GB x2) DDR5-8200 CL38 Extreme OC Memory is crafted with the latest technological advancements, delivering unbeatable speed and efficiency. Featuring a 48 GB memory capacity and a staggering 8200 MHz frequency, this DDR5 memory module is poised to transform the performance of any high-end gaming or workstation system.

MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.

Yesterday SK Hynix reported its Q1 2023 results and to say that they were abysmal is being kind, as the company reported a 3.4 trillion won operating loss, or just over US$2.5 billion. That's no small hit to take for any company, especially when it's only the performance for a single quarter. However, SK Hynix is apparently trying to see its situation from a positive perspective and believes that the memory chip market will rebound in the second half of this year. The positive outlook isn't just based on what SK Hynix believes though, as various analysts and securities companies believe in an upswing in the second half of the year.

That said, Micron, one of SK Hynix main competitors, has a more drab outlook for the remainder of 2023 and is expecting a tough year ahead. SK Hynix is expecting production cuts by itself, Micron and Samsung to start to take effect sometime in the second quarter this year, which should see inventory drop to more normal levels for all three companies. SK Hynix is also expecting to see a higher demand for DDR5 DRAM later this year, especially in the mobile and server market space. Finally, SK Hynix is hoping that its customers will buy higher density memory products this year, replacing older, lower density solutions, be that DRAM or NAND flash related. SK Hynix is expecting to launch its Gen 5 10 nm DRAM and 238-layer NAND sometime next year, which the company is also hoping will bring more income to its coffers, but the company still has to make it through the rest of 2023 first.

ASUS today unveiled the TUF Gaming A620-PRO WiFi, a Socket AM5 motherboard based on the entry-level AMD A620 chipset. When ASUS debuted its A620 motherboard lineup, it lacked a product in the ATX form-factor, and its top motherboard model at the time was the Micro-ATX TUF Gaming A620M-Plus WiFi. The new A620-PRO WiFi is feature-packed, and looks like a product from a segment above. It draws power from a combination of 24-pin ATX, and 8+4 pin EPS, and although you don't get CPU overclocking support with this chipset, there's plenty of CPU power delivery for even 12-core and 16-core processors. A 13-phase VRM conditions power for the processor.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two CPU-attached M.2 NVMe slots, each with PCI-Express 4.0 x4 wiring. A PCI-Express 3.0 x16 slot (electrical Gen 3 x2), and two Gen 3 x1 slots wired to the A620 FCH, make for the rest of the expansion feature-set. Besides the CPU-attached M.2 NVMe slots, you get four SATA 6 Gbps ports from the A620 chipset for storage. Display connectivity includes a DisplayPort and HDMI. Networking connectivity consists of a 2.5 GbE wired Ethernet driven by a Realtek 8125 series controller; and 802.11ax (WiFi 6), with Bluetooth 5.3 (possibly an Intel WLAN module). USB ports include two 10 Gbps USB 3.2 Gen 2 type-A, two 5 Gbps USB 3.2 Gen 1 type-A and type-C, and four 5 Gbps ports via two internal USB 3.2 headers or internal ports, besides a handful USB 2.0 headers. The onboard audio solution is driven by an entry-level Realtek ALC892 CODEC, with 7.1-channel analog jacks. The motherboard offers USB BIOS Flashback. The company didn't reveal pricing.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

KLEVV, an emerging memory brand introduced by Essencore, is excited to unveil two new high performance DDR5 overclocking memory, the CRAS V RGB and the BOLT V. Designed to cater to a wide range of users, the CRAS V RGB and BOLT V DDR5 memory empower all aspects of computational requirements. They deliver outstanding performance on the latest AMD and Intel platforms, from gaming to content creation, with Intel XMP 3.0 and AMD EXPO overclocking features. Furthermore, the CRAS V RGB and BOLT V DDR5 memory are fully battle-hardened, passing the QVL tests required by major motherboard manufacturers. With strictly selected memory chips and meticulous manufacturing processes, they ensure the highest level of reliability, tailored to perform multitasking operation effortlessly.

Released under KLEVV's flagship memory range, the CRAS V RGB memory features modern design refined with exquisite attention to detail. Precision crafted aluminium heatsink highlighted by signature RGB lights visible on both top and fine gaps on the sides make for a sight to behold. The RGB lights are fully customizable and controllable with third-party software provided by world-renown motherboard manufacturers like ASUS, ASROCK, Gigabyte, and MSI with corresponding hardware, serving as the centerpiece of any build. The 32 GB (16 GB x2) 288 Pin DDR5 unbuffered DIMM kits are available in four base clock options starting at 6000MT/s, 6400MT/s, 7200MT/s, 7600MT/s, and extending up to blazing-fast 8000 MT/s.

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.

GEEKOM is thrilled to announce the release of the GEEKOM AS 6, an AMD-powered mini PC. This powerful, feature-packed PC is the result of an exclusive collaboration between GEEKOM and ASUS, with these two industry-leading companies teaming up to co-develop a Mini PC with better overall performance than the Intel NUC 13 Pro Arena Canyon, making it the best choice for the gaming and office of the future!

GEEKOM and ASUS always strive to bring users the most optimal mini PC experience, and the AS 6 is proof of that commitment. The AS 6, powered by the AMD Ryzen 9 6900HX processor, delivers unprecedented levels of performance to effortlessly handle any task-from playing the latest games to intensive office work. It is truly eye-opening to discover that the AMD Radeon Graphics 680M in the AS 6 boasts a staggering performance improvement of nearly 90% compared to Intel Iris Xe Graphics in the NUC 13 Pro. And the new Radeon graphics technology combined with ultrafast DDR5 memory offers up to 2x faster game performance than the last gen.