The CAMM2 and LPCAMM2 form-factors were originally designed for thin-and-light notebooks, to provide them with memory replacements/upgrades without compromising on the Z-Height tolerances of the device's design. It looks like MSI sees a future for the CAMM2 form-factor on desktops, specifically the ones without cables sticking out. The company's next round of motherboards under its Project Zero banner will replace the conventional DDR5 DIMM slots with DDR5 CAMM2 slots. The company is joining forces with Kingston Technology for the effort.

Kingston is readying a new line of performance-segment CAMM2 modules under its FURY Impact brand that it originally uses for performance SO-DIMMs meant for gaming notebooks. MSI's next-gen Project Zero motherboard features contact points for a DDR5 CAMM2 module. A single CAMM2 module utilizes the entire 160-bit memory bus width of the Socket LGA1700 processor (that's both channels and their sub-channels). Kingston may release CAMM2 modules for most common memory sizes (such as 32 GB, 48 GB, 64 GB, and 96 GB), and most common DDR5 OC speeds for the platform (ranging between DDR5-6000 and DDR5-8000).

G.Skill is giving finishing touches to its new line of flagship overclocking PC DDR5 memory series, the Trident Z5 Royal. The series first broke cover in Computex 2023, but the company never got around to launching actual products. It's last Royal-branded memory series that made it to mass-production was the Trident Z Royal Elite DDR4 series from 2021. The company was probably dragging its feet with the Trident Z5 Royal series because by mid-2023, memory speeds in excess of 8000 MT/s weren't as popular as they are today, among the enthusiast crowd. The G.Skill Trident Z5 Royal series memory module comes in two trims, gold and silver. Both have the same geometric design, and are crowned by an acrylic lighting diffuser that resembles a cluster of gemstones. The series will probably consist of memory kits that are both high-capacity (48 GB, 64 GB, 96 GB); and high speed (DDR5-8000 and upward). The company will probably launch these next month. We'll be sure to swing by the G.Skill booth to show you more.The company's teaser video follows.

AMD today introduced the EPYC 4004 line of server processors in the Socket AM5 package. These chips come with up to 16 "Zen 4" CPU cores, a 2-channel DDR5 memory interface, and a 28-lane PCIe Gen 5 I/O, and are meant to power small-business servers, as well as cater to the dedicated web-server hosting business that generally attracts client-segment processors. This is the exact segment of market that Intel addresses with its Xeon E-2400 series processors in the LGA1700 package. The EPYC 4004 series offers a superior support and warranty regime compared to client-segment processors, besides ECC memory support, and AMD Secure Processor, and all of the security features you get with Ryzen PRO 7000 series processors for commercial desktops.

AMD's offer over the Xeon E-2400 series is its CPU core count of up to 16, which lets you fully utilize the 16-core limit of the Windows 2022 Server base license. The EPYC 4004 series is functionally the same processor as the Ryzen 7000 "Raphael" except for its ECC memory support. This chip features up to two 5 nm "Zen 4" CCDs with up to 8 cores, each; and an I/O die that puts out two DDR5 memory channels, and 28 PCIe Gen 5 lanes. Besides today's processor launch, several server motherboard vendors are announcing Socket AM5 server boards that are rackmount-friendly, and with server-relevant features.

TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year. It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.

HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50-60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.

Shuttle, a leading developer of Mini-PC solutions, today announces the launch of the DL30N. With its advanced technical specifications and robust design, this new fanless Mini-PC is aimed at professional users in a wide range of applications. Equipped with an Intel processor N100 and compatible with up to 16 GB of DDR5 SO-DIMM memory, the DL30N provides a solid foundation for applications that require high data processing speeds. Its two 2.5 Gbit/s network ports improve network performance even in complex network environments. With eight USB 3.2 Gen 1 ports and two COM ports, this machine offers exceptional connectivity for a wide range of applications.

Tom Seiffert, Head of Marketing & PR Europe at Shuttle, explains: "With the DL30N, we are specifically addressing the needs of companies looking for a reliable, powerful and noiseless solution. This PC is particularly suitable for use in areas such as digital signage, kiosk systems or even as a compact office PC."

ORIGIN PC, a leader in custom high-performance systems, today launched their latest laptops - the EON16-SX, NSX-16, NSL-14, and NSL-16. For gamers, the EON16-SX offers powerful 40-Series performance and the latest in processing efficiency with an Intel Core Ultra processor. Professionals have a much broader selection of workstation laptops moving forward with the introduction of the brand new NSX-16, NSL-14, and NSL-16 laptops. Designed for the Generation of AI, the new Intel Core Ultra processors also feature a built-in NPU and Intel AI Boost. Experience improved productivity, efficiency, and performance with AI-acceleration that can be used for video editing, multi-tasking, and more. All four of the new laptops meet MIL-STD-810H-SPEC standards, meaning they have passed extensive stress tests including extreme temperatures, humidity, shock, and more. Durable and powerful, yet completely portable, ORIGIN PC is proud to announce the newest editions to their world-class lineup of custom PCs.

The brand new EON16-SX and NSX-16 laptops are a fusion of high-performance and fully portable design. While only 4.29 lbs light and 0.77 inches thin, they offer high-performance via quality hardware like an Intel Core Ultra 7 155H, NVIDIA GeForce RTX 4070, DDR5 memory, and a spacious amount of high-speed SSD storage. Both laptops are also designed with a 16" 240 Hz 2560x1600 display, providing an expansive view of games, videos, and software. The two new laptops also take advantage of NVIDIA Optimus which automatically switches between the high performance dedicated GPU and power-efficient integrated GPU to maximize power efficiency. Packed with the latest technology, they boast a generous battery lifespan of 4 hours and 40 minutes. Customize the EON16-SX or NSX-16 with up to 64 GB of DDR5 memory and 16 TB of SSD storage, while also accessing a wide array of connectivity options.

EK, a leader in premium liquid cooling solutions, proudly unveils the EK-Quantum Momentum² Quad RAM Module Set D-RGB, an advanced cooling solution meticulously designed for effective thermal management of DDR4 and DDR5 memory modules. This comprehensive set includes a water block capable of covering four RAM sticks with aluminium heatsinks, integrating high-quality cooling efficiency with dynamic RGB lighting to enhance both the performance and visual appeal of any high-end computing setup. The system is specifically engineered to support configurations with four RAM sticks, optimizing cooling for modern high-performance memory arrays.

Enhanced Cooling and Sophisticated Design
The EK-Quantum Momentum² Quad RAM Module Set D-RGB accommodates both single and double-sided DDR4 and DDR5 memory modules, ensuring versatility across different RAM configurations. It features four sleek, black, anodized aluminium heatsinks with an elox finish for enhanced durability and corrosion resistance. This treatment not only improves the heatsinks' appearance but also boosts their thermal conductivity and cooling effectiveness.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of Ripjaws M5 RGB, a high-performance RGB DDR5 memory series designed for the latest DDR5-enabled Intel platforms. At launch, initial specifications will be offered up to DDR5-6400 CL32-39-39-102 96 GB (2x48GB). Available in matte black or matte white aluminium heatspreaders and features customizable RGB lighting, the Ripjaws M5 RGB is an ideal memory kit for a wide variety of PC builds and themes.

Designed for Stylish Performance
Available in matte white or matte black aluminium heatspreaders and standing at 41 mm tall, the Ripjaws M5 RGB series is designed for a minimalistic look and features customizable RGB lighting to match a wide variety of PC build themes.

Today, Lenovo launched the Lenovo ThinkPad P14s Gen 5 designed for professionals who need top-notch performance in a portable 14-inch chassis. Featuring a stunning 16:10 display, this mobile workstation is powered by AMD Ryzen PRO 8040 HS-Series processors. These processors are ultra-advanced and energy-efficient, making them perfect for use in thin and light mobile workstations. The AMD Ryzen PRO HS- Series processors also come with built-in Artificial Intelligence (AI) capabilities, including an integrated Neural Processing Unit (NPU) for optimized performance in AI workflows.

The Lenovo ThinkPad P14s Gen 5 is provided with independent software vendor (ISV) certifications and integrated AMD Radeon graphics, making it ideal for running applications like AutoCAD, Revit, and SOLIDWORKS with seamless performance. This mobile workstation is ideal for mobile power users, offering advanced ThinkShield security features and passes comprehensive MIL-SPEC testing for ultimate durability.

The rollout of SiPearl's much-anticipated Rhea processor for European supercomputers has been pushed back by a year to 2025, but the delay comes with a silver lining - a significant upgrade in core count and potential performance. Originally slated to arrive in 2024 with 72 cores, the homegrown high-performance chip will now pack 80 cores when it eventually launches. This decisive move by SiPearl and its partners is a strategic choice to ensure the utmost quality and capabilities for the flagship European processor. The additional 12 months will allow the engineering teams to further refine the chip's architecture, carry out extensive testing, and optimize software stacks to take full advantage of Rhea's computing power. Now called the Rhea1, the chip is a crucial component of the European Processor Initiative's mission to develop domestic high-performance computing technologies and reduce reliance on foreign processors. Supercomputer-scale simulations spanning climate science, drug discovery, energy research and more all require astonishing amounts of raw compute grunt.

By scaling up to 80 cores based on the latest Arm Neoverse V1, Rhea1 aims to go toe-to-toe with the world's most powerful processors optimized for supercomputing workloads. The SiPearl wants to utilize TSCM's N6 manufacturing process. The CPU will have 256-bit DDR5 memory connections, 104 PCIe 5.0 lanes, and four stacks of HBM2E memory. The roadmap shift also provides more time for the expansive European supercomputing ecosystem to prepare robust software stacks tailored for the upgraded Rhea silicon. Ensuring a smooth deployment with existing models and enabling future breakthroughs are top priorities. While the delay is a setback for SiPearl's launch schedule, the substantial upgrade could pay significant dividends for Europe's ambitions to join the elite ranks of worldwide supercomputer power. All eyes will be on Rhea's delivery in 2025, mainly from Europe's governments, which are funding the project.

Patriot Memory, a renowned name in performance memory and storage solutions, has teamed up with MSI, an innovator in gaming hardware, to unleash the Viper Xtreme 5 RGB DDR5 MPOWER Series - an extreme-speed DDR5 memory kit crafted for gamers, overclockers, and power users. This cutting-edge collaboration between the two brands combines blistering data rates up to 8000MT/s with massive 32 GB (16 GB x2) or 48 GB (24 GB x2) capacities. The Viper Xtreme 5 RGB DDR5 MPOWER series unleashes a torrent of memory bandwidth, turbocharging gaming rigs, content creation workstations, and other high-intensity applications demanding extreme responsiveness and throughput.

Optimized for Maximum Overclocking Potential
Intel XMP 3.0 certified for seamless plug-and-play overclocking on the latest Intel platforms, the Xtreme 5 RGB DDR5 MPOWER kit also integrates with MSI's user-friendly EZ Dashboard utility. This enables granular control over advanced timings and voltages to extract every last drop of performance.

ASRock today introduced the W790 WS R2.0 motherboard for workstations powered by 4th Gen Intel Xeon W-3400 and W-2400 series processors in the Socket LGA4677 package. Although its model name suggests that it is a revision of the W790 WS, the new W790 WS R2.0 appears to be a lite version of the original, which removes several I/O features. To begin with, the fancy I/O shroud makes way for bare connectors, where you can see several of the connectors stripped away. While the CPU VRM appears unchanged, the VRM heatsinks used on the R2.0 are of a simpler design. The design effort behind both these changes appears to be to make the board friendly to certain kinds of rackmount chassis.

Besides the design changes, the ASRock W790 WS R2.0 loses out on Thunderbolt 4, Wi-Fi 6E, and only has a single 10 GbE interface instead of dual-10 GbE on the original W790 WS. These aside, the W790 WS R2.0 is still a very capable workstation motherboard for the platform it's based on. It draws power from a combination of 24-pin ATX, two 8-pin EPS, and a 6-pin PCIe power; and uses a 22-phase CPU VRM. The board features four PCI-Express 5.0 x16 slots (x16/NC/x16/NC or x16/NC/x8/x8 or x8/x8/x8/x8), and one PCI-Express 4.0 x16 (electrical x4). The CPU socket is wired to eight memory slots, supporting quad-channel DDR5 memory, with support for DDR5 RDIMM-3DS, a total memory capacity of 2 TB, and a maximum overclocked memory speed of DDR5-6800.

The battle is over. Microsoft is finally changing the measuring methodology in its Task Manager from Mega Hertz (MHz) to Mega Transfers per second (MT/s). This comes amid the industry push for more technical correctness in RAM measuring, where the MHz nomenclature does not technically represent the speed at which the memory is actually running. While DRAM manufacturers list both MHz and MT/s, the advertised MHz number is much higher than the effective speed at which the DRAM is running, resulting in confusion and arguments in the industry about choosing the correct labeling of DRAM. A little history lesson teaches us that when single data rate (SDR) RAM was introduced, 100 MHz memory would perform 100 MT/s. However, when double data rate (DDR) memory appeared, it would allow for two memory transfers per clock cycle.

This would introduce some confusion where the MHz speed is often mixed up with MT/s. Hence, Microsoft is trying to repair the damage and list memory speeds in MT/s. Modern DDR5 memory makers are advertising DDR5 kits with "DDR5-4800" or "DDR5-6000," without any suffix like MHz or MT/s. This is because, for example, a DDR5-6000 kit runs at 6,000 MT/s, the effective speed is only 3,000 MHz. The actual clock of the memory is only half of what is advertised. The MT/s terminology would be more accurate and describe memory better. This Task Manager update is in the Windows 11 Insider Preview Build 22635.3570 in the Beta Channel, which will trickle down to stable Windows 11 updates for everyone soon.

Micron Technology, Inc., today announced the availability of Crucial LPCAMM2, the disruptive next-generation laptop memory form factor that features LPDDR5X mobile memory to level up laptop performance for professionals and creators. Consuming up to 58% less active power and with a 64% space savings compared to DDR5 SODIMMs, LPCAMM2 delivers higher bandwidth and dual-channel support with a single module. LPCAMM2 is an ideal high-performance memory solution for handling AI PC and complex workloads and is compatible with the powerful and versatile Lenovo ThinkPad P1 Gen 7 mobile workstations.

"LPCAMM2 is a game-changer for mobile workstation users who want to enjoy the benefits of the latest mobile high performance memory technology without sacrificing superior performance, upgradeability, power efficiency or space," said Jonathan Weech, senior director of product marketing for Micron's Commercial Products Group. "With LPCAMM2, we are delivering a future-proof memory solution, enabling faster speeds and longer battery life to support demanding creative and AI workloads."

TrendForce's latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13-18%, while NAND Flash contract prices have been adjusted to a 15-20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.

Before the 4/03 earthquake, TrendForce had initially predicted that DRAM contract prices would see a seasonal rise of 3-8% and NAND Flash 13-18%, significantly tapering from Q1 as seen from spot price indicators which showed weakening price momentum and reduced transaction volumes. This was primarily due to subdued demand outside of AI applications, particularly with no signs of recovery in demand for notebooks and smartphones. Inventory levels were gradually increasing, especially among PC OEMs. Additionally, with DRAM and NAND Flash prices having risen for 2-3 consecutive quarters, the willingness of buyers to accept further substantial price increases had diminished.

Thanks to recent developments in the AI field, and following in the wake of the world's recovery from COVID-19, the transition of factories to partial or full automation proceeds with unstoppable momentum. And the best place to learn about the latest technologies that aim to make this transition as painless as possible is at Automate 2024. This is North America's largest robotics and automation event, and it will be held in Chicago, Illinois from May 6 to 9.

Automate attracts professionals from around the world, and Apacer is no exception. Apacer team will be on hand to discuss the latest technological developments created by our experienced R&D team. Many of these developments were specifically created to reduce the pain points commonly experienced by fully automated facilities. Take CoreSnapshot, for example. This backup and recovery technology can restore a crashed system to full operation in just a few seconds, reducing downtime and associated maintenance costs. Apacer recently updated CoreSnapshot, creating CoreRescue ASR and CoreRescue USR. The name of CoreRescue ASR refers to Auto Self Recovery. This technology will harness AI to learn the system booting process and analyze how long a boot should take. If this average boot time is significantly longer than usual, the system will trigger the self-recovery process and revert to an earlier, uncorrupted version of the drive's content. CoreRescue USR offers similar functionality, except the self-recovery process is triggered by connecting a small USB stick drive.

Avril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI chips. HBM's unit sales price is several times higher than that of conventional DRAM and about five times that of DDR5. This pricing, combined with product iterations in AI chip technology that increase single-device HBM capacity, is expected to dramatically raise HBM's share in both the capacity and market value of the DRAM market from 2023 to 2025. Specifically, HBM's share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.

2024 sees HBM demand growth rate near 200%, set to double in 2025
Wu also pointed out that negotiations for 2025 HBM pricing have already commenced in 2Q24. However, due to the limited overall capacity of DRAM, suppliers have preliminarily increased prices by 5-10% to manage capacity constraints, affecting HBM2e, HBM3, and HBM3e. This early negotiation phase is attributed to three main factors: Firstly, HBM buyers maintain high confidence in AI demand prospects and are willing to accept continued price increases.

SK hynix participated in the first-ever Compute Express Link Consortium Developers Conference (CXL DevCon) held in Santa Clara, California from April 30-May 1. Organized by a group of more than 240 global semiconductor companies known as the CXL Consortium, CXL DevCon 2024 welcomed a majority of the consortium's members to showcase their latest technologies and research results.

CXL is a technology that unifies the interfaces of different devices in a system such as semiconductor memory, storage, and logic chips. As it can increase system bandwidth and processing capacity, CXL is receiving attention as a key technology for the AI era in which high performance and capacity are essential. Under the slogan "Memory, The Power of AI," SK hynix showcased a range of CXL products at the conference that are set to strengthen the company's leadership in AI memory technology.

SK hynix held a press conference unveiling its vision and strategy for the AI era today at its headquarters in Icheon, Gyeonggi Province, to share the details of its investment plans for the M15X fab in Cheongju and the Yongin Semiconductor Cluster in Korea and the advanced packaging facilities in Indiana, U.S.

The event, hosted by theChief Executive Officer Kwak Noh-Jung, three years before the May 2027 completion of the first fab in the Yongin Cluster, was attended by key executives including the Head of AI Infra Justin (Ju-Seon) Kim, Head of DRAM Development Kim Jonghwan, Head of the N-S Committee Ahn Hyun, Head of Manufacturing Technology Kim Yeongsik, Head of Package & Test Choi Woojin, Head of Corporate Strategy & Planning Ryu Byung Hoon, and the Chief Financial Officer Kim Woo Hyun.

Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128 GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron's industry-leading 1β (1-beta) technology, the 128 GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.

Micron's collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads. Micron's 128 GB DDR5 RDIMM memory will be supported by a robust ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, along with many others.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), including an industry-leading extreme current device for high-performance applications. With this new family of server PMICs, Rambus offers module manufacturers a complete DDR5 RDIMM memory interface chipset supporting a broad range of data center use cases.

"Advanced data center workloads like generative AI require the highest bandwidth and capacity server RDIMMs tailored to meet ever-increasing memory needs of a growing data pipeline," said Sean Fan, chief operating officer at Rambus. "With the addition of this new family of server PMICs, we expand our foundational technology and offer customers a comprehensive memory interface chipset that supports multiple DDR5 server platform generations."

Team Group Inc. has been committed to developing a wide range of memory products for years and has received international recognition for long-term efforts. Today, Team Group proudly announces that the gaming label and creator label, T-FORCE and T-CREATE, have taken home four awards from the Red Dot Design Award 2024 for the T-FORCE DARK AirFlow I SSD Cooler, T-FORCE SIREN GD120S AIO SSD Cooler, T-FORCE XTREEM DDR5 Desktop Memory, and T-CREATE CinemaPr P31 External SSD. The success is a testimony to Team Group's outstanding R&D capability and incredibly innovative designs, which have once again propelled new heights on the stage of a world-class design award.

One of the four most prestigious design awards in the world, the Red Dot Design Award of Germany is an important indicator of industrial design and development trends around the world. The Red Dot received thousands of submissions from over 60 countries in 2024, all vying for the highly influential award. Submissions are judged by a panel of experts, hailing from all over the world, on their innovation, solution, product, design, and concept. Team Group sub-labels, T-FORCE and T-CREAT, stood out with stellar R&D and quality designs, adding to Team Group's illustrious history.

SK hynix showcased its next-generation technologies and strengthened key partnerships at the TSMC 2024 Technology Symposium held in Santa Clara, California on April 24. At the event, the company displayed its industry-leading HBM AI memory solutions and highlighted its collaboration with TSMC involving the host's CoWoS advanced packaging technology.

TSMC, a global semiconductor foundry, invites its major partners to this annual conference in the first half of each year so they can share their new products and technologies. Attending the event under the slogan "Memory, the Power of AI," SK hynix received significant attention for presenting the industry's most powerful AI memory solution, HBM3E. The product has recently demonstrated industry-leading performance, achieving input/output (I/O) transfer speed of up to 10 gigabits per second (Gbps) in an AI system during a performance validation evaluation.

SK hynix Inc. announced today that it recorded 12.43 trillion won in revenues, 2.886 trillion won in operating profit (with an operating margin of 23%), and 1.917 trillion won in net profit (with a net margin of 15%) in the first quarter. With revenues marking an all-time high for a first quarter and the operating profit a second-highest following the records of the first quarter of 2018, SK hynix believes that it has entered the phase of a clear rebound following a prolonged downturn.

The company said that an increase in the sales of AI server products backed by its leadership in AI memory technology including HBM and continued efforts to prioritize profitability led to a 734% on-quarter jump in the operating profit. With the sales ratio of eSSD, a premium product, on the rise and the average selling prices rising, the NAND business has also achieved a meaningful turnaround in the same period.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH (Nasdaq: SGH) and a global leader in memory solutions, solid-state drives, and advanced memory, announces its new family of Add-In Cards (AICs) which implements the Compute Express Link (CXL) standard and also supports industry standard DDR5 DIMMs. These are the first in their class, high-density DIMM AICs to adopt the CXL protocol. The SMART 4-DIMM and 8-DIMM products enable server and data center architects to add up to 4 TB of memory in a familiar, easy-to-deploy form factor.

"The market for CXL memory components for data center applications is expected to grow rapidly. Initial production shipments are expected in late 2024 and will surpass the $2 billion mark by 2026. Ultimately, CXL attach rates in the server market will reach 30% including both expansion and pooling use cases," stated Mike Howard, vice president of DRAM and memory markets at TechInsights, an intelligence source to semiconductor innovation and related markets.