GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces a groundbreaking achievement with the Z790 AORUS TACHYON motherboard. Esteemed overclocker HiCookie has once again pushed the limits of performance, breaking the DDR5 memory overclocking world record. The Z790 AORUS TACHYON has achieved an astonishing DDR5-11254 frequency, surpassing all previous records. This remarkable achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

The GIGABYTE Z790 AORUS TACHYON is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Through the optimization of memory trace and the implementation of Shielded Memory Routing, the Z790 AORUS TACHYON achieves an impressive DDR5-11254 frequency, showcasing its advanced design and unmatched performance. The motherboard also features an integrated overclocking toolkit, equipped with convenient shortcut keys, toggle switches, and voltage detection functions, empowering overclockers to effortlessly push boundaries.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC designed and branded mini PC product family called Moonstone. Equipped with the latest AMD Ryzen 7000 processors in a compact 4x4 design with an innovative cooling solution, Moonstone delivers top-tier computing performance for a wide range of usages. Supporting up to 64 GB of DDR5-4800 high-speed RAM and up to 16 TB of storage, Moonstone will increase your computing output while keeping a minimal footprint on both your desk and energy bill.

"Perfect for working or gaming, we saw an opportunity to set the new standard of innovation-driven mini PC performance," said Aaron Rowsell, Simply NUC co-CEO, "Moonstone is the highest performing 4x4 ever launched."

Razer today launched the 2023 Razer Blade 14. This segment-disruptive 14-inch notebook packs gaming performance comparable to much thicker enthusiast-class notebooks; in a thin-and-light form-factor comparable to business/commercial notebooks. Across the market landscape, the Razer Blade 14 is designed to compete with the Apple MacBook Pro of a comparable screen size. Razer is timing launch of this notebook with that of the AMD Ryzen 7040HS "Phoenix" processor, because it's based on one. The notebook measures 31 cm x 22.8 cm x 1.79 cm (WxDxH with lid closed), and is 11.5% thinner than the 2022 Razer Blade 14. It's also 9% lighter, at 1.83 kg. Despite its size, the notebook packs a 68.1 Wh battery, which when paired with the rather high-end hardware, offers up to 10 hours of productivity.

Under the hood, the Razer Blade 14 (2023) rocks an AMD Ryzen 9 7940HS "Phoenix" processor, with an 8-core/16-thread "Zen 4" CPU, Ryzen AI accelerator, and Radeon 780M (12 CU) integrated graphics. The main graphics muscle, though, is the GeForce RTX 4070 Ada with 140 W TGP. The notebook provides the ability to switch between the discrete- and integrated graphics. The notebook also comes with two DDR5 SO-DIMM slots for up to 64 GB of socketed DDR5 memory; and an M.2-2280 Gen 4 NVMe slot for the main storage, a Gen 4 SSD. The WLAN module is also socketed, and offers Wi-Fi 6E and Bluetooth 5.2. The display is a 14-inch, 16:10 aspect-ratio QHD+ (2560 x 1600 pixels) unit, with 240 Hz refresh rate, and 3 ms response time. The display has 500 nits maximum brightness.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

Synopsys, Inc. today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs. This agreement expands Synopsys' collaboration with Samsung to enhance the Synopsys IP offering for Samsung's advanced 8LPU, SF5, SF4 and SF3 processes and includes Foundation IP, USB, PCI Express, 112G Ethernet, UCIe, LPDDR, DDR, MIPI and more. In addition, Synopsys will optimize IP for Samsung's SF5A and SF4A automotive process nodes to meet stringent Grade 1 or Grade 2 temperature and AEC-Q100 reliability requirements, enabling automotive chip designers to reduce their design effort and accelerate AEC-Q100 qualification. The auto-grade IP for ADAS SoCs will include design failure mode and effect analysis (DFMEA) reports that can save months of development effort for automotive SoC applications.

"Our extensive co-optimization efforts with Samsung across both EDA and IP help automotive, mobile, HPC, and multi-die system architects cope with the inherent challenges of designing chips for advanced process technologies," said John Koeter, senior vice president of product management and strategy for IP at Synopsys. "This extension of our decades-long collaboration provides designers with a low-risk path to achieving their design requirements and quickly launching differentiated products to the market."

ASRock Rack, the leading innovative server company, today announced its support of 4th Gen AMD EPYC processors with AMD "Zen 4c" architecture and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, as well as the expansion of their new products ranging from high-density storage, GPU, multi-nodes servers all for the new AMD processors.

"4th Gen AMD EPYC processors offer the highest core density of any x86 processor in the world and will deliver outstanding performance and efficiency for cloud-native workloads," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "Our latest family of data center processors allow customers to balance workload growth and flexibility with critical infrastructure consolidation mandates, enabling our customers to do more work, with more energy efficiency at a time when cloud native computing is transforming the data center."

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of high-performance server platforms supporting 4th Gen AMD EPYC processor for growing cloud native environments and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology for technical computing applications.

"Data centers prioritize sustainability, offering an opportunity to improve efficiency and meet goals," said Eric Kuo, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's server platforms, powered by 4th Gen AMD EPYC processors, contribute to environmental sustainability through power-efficient, high-performance solutions. Our leading workload performance enables efficient scale-out cloud-native workloads, achieving more with less power consumption."

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

YEYIAN Gaming, a leading global designer and manufacturer of innovative pre-built gaming PCs, peripherals, and computer components, is thrilled to announce the launch of four new RTX 4060 Ti GPU gaming desktop PC models: YARI II 27F0B-46T1N, YARI II 24F0B-46T1N, SHOGE 560XB-46T1U, and SHOGE 240FOB-46T1U. These models are part of the YARI II and SHOGE series, designed to deliver unparalleled gaming performance and reliability for content creators and pro gamers.

Four gaming desktops are powered by the latest NVIDIA GeForce RTX 4060 Ti graphics cards, which are based on the ultra-efficient NVIDIA Ada Lovelace architecture and offer an immersive, AI-accelerated gaming experience, including upgraded ray tracing and DLSS 3 technologies. The gaming desktops also feature the best-in-class components for both Intel and AMD platforms, as well as Core i7 and AMD Ryzen 5 processors, the NVMe M.2 SSDs, the DDR5/DDR4 memory modules, and come with Windows 11 Home pre-installed. Cooling performance is enhanced by RGB illuminated system fans and CPU AIO water-cooling for excellent system thermal performance under the most demanding of system loads.

A SemiAnalysis report sheds light on just how much smaller the "Zen 4c" CPU core is compared to the regular "Zen 4." AMD's upcoming high core-count enterprise processor for cloud data-center deployments, the EPYC "Bergamo," is based on the new "Zen 4c" microarchitecture. Although with the same ISA as "Zen 4," the "Zen 4c" is essentially a low-power, lite version of the core, with significantly higher performance/Watt. The core is physically smaller than a regular "Zen 4" core, which allows AMD to create CCDs (CPU core dies) with 16 cores, compared to the current "Zen 4" CCD with 8.

The 16-core "Zen 4c" CCD is built on the same 5 nm EUV foundry node as the 8-core "Zen 4" CCD, and internally features two CCX (CPU core complex), each with 8 "Zen 4c" cores. Each of the two CCX shares a 16 MB L3 cache among the cores. The SemiAnalysis report states that the dedicated L2 cache size of the "Zen 4c" core remains at 1 MB, just like that of the regular "Zen 4." Perhaps the biggest finding is their die-size estimation, which puts the 16-core "Zen 4c" CCD just 9.6% larger in die-area, than the 8-core "Zen 4" CCD. That's 72.7 mm² per CCD, compared to 66.3 mm² of the regular 8-core "Zen 4" CCD.

Micron Technology, Inc., (Nasdaq: MU) today announced volume production availability of high-capacity 96 GB DDR5 RDIMMs in speeds up to 4800MT/s, which have double the bandwidth compared to DDR4 memory. By unlocking the next level of monolithic technology, the integration of Micron's high-density memory solutions empowers artificial intelligence (AI) and in-memory database workloads and eliminates the need for costly die stacking that also adds latency. Micron's 96 GB DDR5 RDIMM modules are qualified with 4th Gen AMD EPYC processors. Additionally, the Supermicro 8125GS - an AMD-based system - includes the Micron 96 GB DDR5 modules and is an excellent platform for high-performance computing, artificial intelligence and deep learning training, and industrial server workloads.

"Delivering high-capacity memory solutions that enable the right performance for compute-intensive workloads is essential to Micron's role as a leading memory innovator and manufacturer. Micron's 96 GB DDR5 DRAM module establishes a new optimized total cost of ownership solution for our customers," stated Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "Our collaboration with a flexible system provider like Supermicro leverages each of our strengths to provide customers with the latest memory technology to address their most challenging data center needs."
"Supermicro's time-to-market collaboration with Micron benefits a wide variety of key customers," said Don Clegg, senior vice president, Worldwide Sales, Supermicro. "Micron's portfolio of advanced memory and storage products, aligned with Supermicro's broad server and storage innovations deliver validated, tested, and proven solutions for data center deployments and advanced workloads."

Innodisk has the right idea about how to do PCIe Gen 5 NVMe SSDs—to ditch the M.2 form-factor, and make them PCIe add-in cards. This would remove the need for cartoonishly disproportionate cooling solutions with high-pitched 20 mm fans; and rather allow SSD designers to use cooling solutions resembling those of graphics cards. Gen 5 NVMe controllers have a TDP of around 15 W, or roughly similar to that of a motherboard chipset. The M.2-2280 form-factor is tiny for the deployment of a sufficiently large heatsink, and so SSD designers are resorting to active cooling, using 20 mm fans that don't sound pleasant. Most single-slot VGA cooling solutions can make short work of 15 W of heat while being much quieter, some even fanless.

The Innodisk 5TG-P AIC SSD uses a PCIe Gen 5 + NVMe 2.0 SSD controller with a large passive heatsink, a PCI-Express 5.0 x4 host interface, and 32 TB of capacity. The drive runs entirely on slot power, and besides the 3D TLC NAND flash, uses a large DDR4 DRAM cache. The company claims sequential transfer speeds of up to 13 GB/s in either direction. Innodisk is targeting the PCIe 5TG-P at workstation and HEDT use-cases. The company is building them in server-relevant form-factors such as U.2 and E.1S. A CDM screenshot shows 13.62 GB/s sequential reads, with 11.55 GB/s sequential writes.

Schenker XMG also unveiled the new PRO 16 Studio workstation laptop at the Computex 2023 event, which will be equipped with an Intel Core i9-13900H CPU and up to an NVIDIA GeForce RTX 4070. In addition, the company is announcing the new WORK Base series and Vision-series laptops that are available under the Schenker brand, introducing new form-factors and bringing several other updates.

The new XMG Pro 16 Studio promises to be quite a versatile workstation laptop aimed at content creators, using a 16:10 aspect ratio screen, and packing some serious power with Intel's Core i9-13900H CPU and up to an NVIDIA GeForce RTX 4070 graphics card, as well as two DDR5 slots with DDR5-5200 support, and Thunderbolt 4. The XMG Pro 16 Studio also comes with NVIDIA Studio certification. Schenker also showed the efficient vapor chamber cooling that will be used in the XMG Pro 16 Studio. It also brings several upgrades compared to the current XMG Focus 16 laptop, which it can be compared to, at least performance-wise, including an additional USB-C power delivery, a Windows Hello camera, 2.5 Gbit LAN, longer battery life, and a slimmer aluminium body. Schenker notes that the XMG PRO 16 Studio should be available in Europe in late July or early August.

Essencore KLEVV brought in a formidable lineup of new PCIe Gen 5 NVMe SSDs and DDR5 memory for gamers and overclockers, at the 2023 Computex. The lineup is led by the KLEVV CRAS V RGB series of DDR5 memory that comes in high-end speeds of DDR5-6000 (30-36-36-76 @ 1.35 V), DDR5-6400 (32-38-38-78 @ 1.35 V), DDR5-7200 (34-44-44-84 @ 1.40 V), DDR5-7600 (36-46-46-86 @ 1.40 V), and DDR5-8000 (38-48-48-128 @ 1.55 V). These modules feature both Intel XMP 3.0 and AMD EXPO SPD profiles. The KLEVV BOLT V series form the company's mid-range, offering speeds of DDR5-6000 (30-36-36-76 @ 1.35 V), DDR5-6400 (32-38-38-78 @ 1.35 V), and DDR5-6800 (34-40-40-80 @ 1.35 V). Both XMP 3.0 and EXPO are to be found even with these modules. The company interestingly also has standard modules for DDR5-4800 and DDR5-5600, which make do with just 1.1 V. We also spied KLEVV's odd-capacity 24 GB and 48 GB CRAS V RGB modules.

The storage lineup for Essencore is led by the KLEVV CRAS C950 PCIe Gen 5 NVMe SSD, and the CRAS C910 Gen 4 SSD. The CRAS C950 comes in 1 TB, 2 TB, and 4 TB capacities, and uses a Phison E26-series controller paired with 3D TLC NAND flash. The 1 TB variant offers up to 11.5 GB/s sequential reads, with up to 8.5 GB/s sequential writes, while the 2 TB and 4 TB models do up to 12 GB/s sequential reads, with up to 11 GB/s sequential writes. The drive uses a chunky passive aluminium heatsink to keep cool. The CRAS C910, on the other hand, comes both as a bare drive (without heatsink), and as the CRAS C910 RGB, where it features a heatsink with an RGB diffuser. The drive uses an InnoGrit IG5220 controller, comes in capacities of up to 1 TB, and offers speeds of up to 5 GB/s sequential reads, with up to 4.8 GB/s sequential writes.

Patriot Memory introduced some truly unique memory and storage products at the 2023 Computex. The company showed us what is probably the world's first PCIe Gen 5 NVMe SSD with a DRAMless architecture. It also runs surprisingly cool for the kind of performance that's being claimed. The untitled Patriot Gen 5 SSD uses a Maxiotek MAP802A-F1C DRAMless controller that features a PCI-Express 5.0 x4 host interface. The drive comes in capacities of 1 TB, 2 TB, and 4 TB. The performance on offer easily matches or beats some of the early Gen 5 SSDs based on Phison E26. You get sequential speeds of up to 12 GB/s, with up to 10.5 GB/s sequential writes.

The company also showcased the Viper PV553, a more traditional Gen 5 SSD that uses a DDR4-based DRAM cache that can be as large as 4 GB for the 2 TB model. At this point we don't know which controller is powering this drive, but it's confirmed that it uses a DRAM cache, and needs active cooling. The performance on offer is up to 12.4 GB/s sequential reads, with up to 11.8 GB/s sequential writes. A side-effect of Gen 5 SSDs picking up traction in the market is that Gen 4 SSDs with fairly powerful specs are taking up mainstream pricing. The Viper VP4300 Lite is one such drive, it is a revision of the VP4300 from 2021. This drive uses an InnoGrit-sourced controller paired with 3D TLC NAND flash, DDR4 DRAM cache, and sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.8 GB/s writes. It comes in 500 GB thru 4 TB capacities, and unlike the original VP4300, lacks a heatsink.

ADATA and XPG, its gamer focused sub-brand, unveiled a plethora of memory and storage products at the 2023 Computex. We begin with PC memory, and we see the company showing off its upcoming models of the XPG DDR5 memory targeting enthusiasts. These include the XPG Caster RGB DDR5, which is capable of DDR5-9000, the XPG Lancer RGB ROG edition, capable of DDR5-7200, and the company's overclocking-capable DDR5-6400 R-DIMM targeting Xeon W workstations. The company also showed us "Project NeonStorm." This is an innovative new SSD cooling system that uses a self-contained liquid cooler.

The way this liquid cooler works is that a high conductivity heat spreader transfers heat to a chamber containing a coolant fluid. This coolant heats up an aluminium alloy tube via convection. The inner wall of this tube serves as an airflow channel for a 20 mm fan. ADATA claims that this solution offers "over 20% better heat dissipation compared to SSDs without water cooling." This is also one of the very first SSDs we've seen that utilize Silicon Motion SM2508 PCIe Gen 5 NVMe controller. ADATA claims sequential reads of up to 14 GB/s, with up to 12 GB/s sequential writes. The drive comes in capacity-based models of up to 8 TB (could include 2 TB, 4 TB, and 8 TB). ADATA also showed off the Legend 970 PCIe Gen 5 NVMe SSD that uses a Phison E26-series controller, and comes in capacities of 1 TB and 2 TB. This drive belts out up to 10 GB/s reads, with up to 10 GB/s writes.

Kingston was thrilled to be back at Computex to showcase some of its new and upcoming products, including the new XS1000 External SSD and some of its new and current Fury DDR5 memory modules and kits. In addition to these new products, Kingston also showcased its dedication to enterprise and server market with DC600M enterprise SSD, industrial SD cards, and Server Premier DDR5 memory, as well as its focus on both creators, gamers, and those on the move, with the Fury DDR5 memory, Fury Renegade SSDs, the new DT microDuo and DTMax flash drives, SD and microSD cards, and more.

To be available in Q3 2023, the Kingston XS1000 External SSD aims to bring pocket-sized portability without compromising the performance. It will be available in 1 TB and 2 TB capacities, have USB 3.2 Gen 2 interface, and peak at 1000 MB/s read and write sequential performance. Kingston is also announcing an updated Fury Renegade DDR5 RGB memory lineup, which will be available in 16 GB to 48 GB capacities, bringing non-binary kits, and ranging from 6000 to 7200 MT/s. In addition, there is also the FURY Renegade PCIe 4.0 M.2 SSD, coming in capacities of up to 4 TB and reaching sequential read and write performance of up to 7,300 and 7,000 MB/s, respectively.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the global launch of the EVOL X15 AT gaming laptop equipped with the 13th generation Intel Core processors and NVIDIA GeForce RTX 4050/RTX 4060 graphics. The EVOL X15 AT sports a 15.6" QHD (2560x1440) 165 Hz display with NVIDIA G-SYNC support for stutter-free and tear-free gaming experience. Aside from Pine Blue and Mist Grey, the new EVOL X15 AT gaming laptop comes in the new Purple Grape color.

Having equipped with the latest NVIDIA GeForce RTX 40 Series laptop GPU, the COLORFUL EVOL X15 AT gaming laptop takes advantage of NVIDIA DLSS 3 and NVIDIA Reflex. The EVOL X15 AT with the GeForce RTX 4060 8 GB laptop GPU comes with a max TPD of up to 140 W delivering better graphics performance. The COLORFUL EVOL X15 AT features a Thunderbolt 4 (USB-C) that provides high-speed connection of up to 40 Gbps. The laptop comes with 16 GB of DDR5 memory, upgradeable to 64 GB, and 512 GB PCIe NVMe SSD with an empty M.2 slot that can accommodate M.2 PCIe Gen 3 SSDs.

Micron Technology, Inc. (Nasdaq: MU), today announced the Crucial Pro Series which features memory and storage products designed for gamers, content creators, workstation professionals or anyone needing the benefits of a robust, high-performance computing experience with plug-and-play functionality. The Crucial T700 PCIe Gen 5 SSD, the marquee product in the new Pro Series category, offers industry-leading sequential read/write speeds up to 12,400 MB/s and 11,800 MB/s respectively. Random read/write speeds of up to 1,500K IOPS enable faster gaming, video editing, 3D rendering or heavy workload applications. Another addition to the Crucial Pro Series is the Crucial DDR5 Pro and DDR4 Pro DRAM offerings with heat spreaders, providing out-of-the-box performance to improve system speed, bandwidth and responsiveness without the hassle of LEDs and the risks associated with overclocking and latency tuning.

"Today's demanding applications and user workloads require increased performance, along with greater storage capacity and memory bandwidth, to fully leverage the capabilities provided by the latest generation of CPU platforms," said Jonathan Weech, senior director of product marketing for Micron's Commercial Products Group. "The world class Crucial T700 Gen 5 SSD provides unrivaled performance to tackle gaming, UHD/8k+ photo and video editing, heavy workload applications and large data sets. Crucial DDR5 Pro DRAM offers speeds up to 5600MT/s with sleek new heat spreaders that deliver enormous bandwidth under the heaviest of workloads to ensure consistent, maximum performance for gamers and creatives alike."

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

Team Group unveiled its mighty Team Xtreem DDR5 memory for overclocking, at the 2023 Computex. These modules are designed such that their PCBs are shorter than their height, and instead of cramming RGB LEDs on top, the 2 mm-thick aluminium heat spreader turns into an extruded heatsink. Some of the higher speed versions of these run at DRAM voltages as high as 1.45 V, so the heatsink design should come in handy. The T-Force Xtreem comes in speeds ranging between DDR5-6400 and DDR5-8266, and in capacities ranging from 16 GB (2x 8 GB), going all the way up to 96 GB (2x 48 GB). The T-Force Xtreem RGB has an additional design element in the form of an acrylic RGB LED diffuser, although from the looks of it, this acrylic bit seems to be covering the fins of the heat spreader. It comes in the same speed-based and capacity based variants, as the regular Xtreem DDR5.

PC OEM giant Acer has a growing lineup of retail channel PC products, including DIY enthusiast PC hardware under its Predator brand. The company showed some of this off at the 2023 Computex, in a booth organized by its memory products OEM BIWIN. First up, we have the Predator Hermes RGB line of high-end DDR5 memory kits. These feature elaborate aluminium heatspreaders with RGB LED illumination. We caught one of these in action, with a multi-zone RGB lighting. The Hermes RGB comes in 32 GB (2x 16 GB), and 64 GB (2x 32 GB) kits, and in speeds of DDR5-6800, DDR5-7200, DDR5-7600, DDR5-7800, and DDR5-8000, with CAS latencies ranging between 32 to 36T, and module voltages between 1.40 V to 1.45 V.

Among the consumer storage products showed off by the company include the MSC300 line of UHS-I microSDXC cards capable of 160 MB/s sequential speeds, which comes in capacities ranging between 32 GB to 256 GB. Among the SSD products shown were stuff we are already familiar with, including the FA100 Gen 4 NVMe SSD, RE100 Gen 3 NVMe SSD, the SA100 and RE100 SATA 6 Gbps SSDs; the SD100 lines of DDR4 and DDR5 SO-DIMM memory for laptops; CFE100 line of CFexpress cards, and and handful USB flash drives (UFDs).

At the 2023 Computex, we caught CORSAIR's flagship PC memory line, the DOMINATOR Titanium DDR5 series. These are built to, well, dominate the overclocking and benchmark records scene, and come in several high-speed models, such as DDR5-8000 and DDR5-8266, and capacities as high as 192 GB (4x 48 GB kits). The company also has a limited batch of 500 "First Edition" kits, which feature a gold-on-white color scheme, and the company's highest grade of manual binning.

A defining feature about the DOMINATOR Titanium DDR5 series is their heat spreader design, which consists of 2 mm-thick aluminium making contact with the DRAM chips, which connect to an upper copper heatsink with RGB LEDs studded. The edges of the top have mount-holes, so a set of 2 or 4 of these DIMMs can be bolted onto the company's latest DHX cooling module. This is essentially a chunky slab of anodized aluminium that soaks up and dissipates heat from the DIMMs, and has slats that let the RGB lighting through. CORSAIR is backing these with lifetime warranties, and plans to launch them in July 2023.

SK hynix Inc. announced today that it has completed the development of the industry's most advanced 1bnm, the fifth-generation of the 10 nm process technology, while the company and Intel began a joint evaluation of 1bnm and validation in the Intel Data Center Certified memory program for DDR5 products targeted at Intel Xeon Scalable platforms.

The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10 nm technology. The DDR5 products provided to Intel run at the world's fastest speed of 6.4 Gbps (Gigabits per second), representing a 33% improvement in data processing speed compared with test-run products in early days of DDR5 development.