SK hynix showcased its next-generation technologies and strengthened key partnerships at the TSMC 2024 Technology Symposium held in Santa Clara, California on April 24. At the event, the company displayed its industry-leading HBM AI memory solutions and highlighted its collaboration with TSMC involving the host's CoWoS advanced packaging technology.

TSMC, a global semiconductor foundry, invites its major partners to this annual conference in the first half of each year so they can share their new products and technologies. Attending the event under the slogan "Memory, the Power of AI," SK hynix received significant attention for presenting the industry's most powerful AI memory solution, HBM3E. The product has recently demonstrated industry-leading performance, achieving input/output (I/O) transfer speed of up to 10 gigabits per second (Gbps) in an AI system during a performance validation evaluation.SK hynix also operated a collaboration zone with the host company to emphasize the importance of cooperating with TSMC in the area of CoWoS to solidify its HBM leadership. The display follows the two companies' recent announcement that they will establish a closer and more innovative partnership to develop new technologies such as next-generation HBM products.

In addition to its HBM solutions, SK hynix also displayed a range of its high-performance products that are set to supplement the AI industry. The lineup included CXL memory with an integrated interface, MCR DIMM and 3DS RDIMM memory modules for servers, LPCAMM2 and LPDDR5T optimized for on-device AI, and the next-generation graphic DRAM GDDR7.

In a workshop held two days before the TSMC 2024 Technology Symposium, Head of HBM PI Unoh Kwon and Head of Package Engineering Jaesik Lee presented their talk titled "HBM and Heterogeneous Integrated Technology." As seen through its active participation in the symposium, SK hynix plans to strengthen its AI memory competitiveness by advancing its partnerships in various areas including technology, business, and trends.