SK hynix Inc. announced today that it will participate in the GTC 2025, a global AI conference taking place March 17-21 in San Jose, California, with a booth titled "Memory, Powering AI and Tomorrow". The company will present HBM and other memory products for AI data centers and on-device and memory solutions for automotive business essential for AI era.

Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM (Small Outline Compression Attached Memory Module), a new memory standard for AI servers.At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.

Following the industry's first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.

"We are proud to present our line-up of industry-leading products at GTC 2025," President & Head of AI Infra Juseon (Justin) Kim said. "With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider forward."