Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance.

The rapid growth of AI workloads and AI Processor/GPUs are exacerbating the memory bottleneck caused by the slowing performance improvements and scalability of SRAM and DRAM - presenting a major obstacle to maximizing system performance. To overcome this, there is a pressing need for intelligent memory solutions that offer higher power efficiency and greater bandwidth, coupled with a reevaluation of traditional memory architectures.

SK hynix has sped up its HBM4 development plans, according to a report from ZDNet. The company wants to start shipping HBM4 samples to NVIDIA this June, which is earlier than the original timeline. SK hynix hopes to start supplying products by the end of Q3 2025, this push likely aims to get a head start in the next-gen HBM market. To meet this sped-up schedule, SK hynix has set up a special HBM4 development team to supply NVIDIA. Industry sources indicated on January 15th that SK Hynix plans to deliver its first customer samples of HBM4 in early June this year. The company hit a big milestone when it wrapped up the HBM4 tapeout in Q4 2024, the last design step.

HBM4 marks the sixth iteration of high-bandwidth memory tech using stacked DRAM architecture. It comes after HBM3E, the current fifth-gen version, with large-scale production likely to kick off in late 2025 at the earliest. HBM4 boasts a big leap forward doubling data transfer ability with 2,048 I/O channels up from its forerunner. NVIDIA planned to use 12-layer stacked HBM4 in its 2026 "Rubin" line of powerful GPUs. However, NVIDIA has moved up its timeline for "Rubin" aiming to launch in late 2025.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of low latency DDR5-6400 CL30-39-39-102 memory specification in high-capacity kit configurations, up to 96 GB (2x 48 GB) kit capacity. This high performance memory kit specification will be available under the Trident Z5 RGB and Trident Z5 Royal series, with Intel XMP 3.0 memory overclock profile support.

The G.SKILL DDR5-6400 CL30 memory kit at 96 GB (2x 48 GB) combines high-capacity and low-latency to enable higher performance for memory intensive platforms and uses. The screenshot below shows this 96 GB (2x 48 GB) memory kit operating at DDR5-6400 CL30-39-39-102 with the ASUS ROG Maximus Z890 Hero motherboard and Intel Core Ultra 7 265K desktop processor.

Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly launches today at CES 2025 the TOUGHRAM XG RGB D5 7200 MT/s 32 GB (16 GB x2), now equipped with the latest CKD (Client Clock Driver) technology. This new addition to Thermaltake's high-performance DDR5 memory lineup integrates advanced technology with a sleek design, offering an exceptional solution for PC enthusiasts and professionals. With CKD technology, the TOUGHRAM XG RGB D5 Memory ensures superior signal integrity, improved power efficiency, and enhanced overclocking stability, delivering consistent performance under the most demanding workloads. Ideal for gaming, creative projects, and AI-driven applications, this memory module is engineered to exceed the expectations of modern high-performance computing.

"Thermaltake is committed to redefining the limits of DRAM memory technology to meet the evolving needs of gamers and professionals," said Kenny Lin, CEO of Thermaltake. "The TOUGHRAM XG RGB D5 with CKD technology exemplifies our dedication to delivering cutting-edge solutions that offer superior speed, stability, and customization; whether for serious gamers, creators, or even AI development, this memory sets a new benchmark in high-performance computing."

Corsair at the 2025 International CES brought a couple of new products from its memory and storage lines. This company used to be called "Corsair Memory" before it became Corsair Gaming, so they know a thing or two about enthusiast-segment memory and storage products, going back decades. We begin our tour with the new EX400U, a portable SSD with a 40 Gbps USB4 interface. The drive comes in 1 TB, 2 TB, and 4 TB capacities, and offers sequential transfer speeds of up to 4000 MB/s reads, with up to 3600 MB/s writes. The company hasn't made any claims on minimum write performance, so we don't know if the drive can be used for 4K or 8K RAW cinematography. More than PC, Corsair wants you to be enthused about its mobile chops. It can connect to an iPhone 15 or later as a mass-storage device, and supports MagSafe. Corsair plans to formally launch this on January 23.

Corsair has been agile in the PC overclocking memory space, responding to new trends with product launches, without having to wait for platforms such as trade shows, so there are no new products as such (You can feast your eyes on a DDR5-10000 Vengeance kit which uses CKD), but the company made two new accessory announcements for its Vengeance and Dominator product lines. For Vengeance, Corsair's mainstream and performance-segment memory line, the company announced Corsair Custom Lab, a service that allows you to customize die-cast designs onto the module's heat spreaders. We've seen a few examples at CES, but we're sure there will be more. The Custom Lab Vengeance RGB modules should be available in Q1 2025.

You've seen Splave on top of overclocking leaderboards, get ready to see him on PC hardware store shelves. The professional overclocker now has a line of high-end PC memory kits and power supplies in partnership with G.Skill and Enermax. The new Enermax Revolution DFX Pro 1350 W Splave Edition (the show demo was a different model as proof of concept) has a few features custom designed by him. The first one is a button that flushes all capacitors to make sure there's no residual power left in it when the AC input is switched off. Overclockers tend to need this between resets, and even waste a few seconds waiting on their PSUs to drain, or getting their motherboards to do that job (not recommended). The PSU has individually sleeved cables that are designed to not get in the way, and make them easier to manage; and the fan is configured to turn backwards for 20 seconds, blowing air out, each time the PSU is sent an ACPI shutdown command.

PNY today announced the specifications and availability of its high-performance DDR5 notebook memory, offered in 64 GB (2x32GB) and 32 GB (2x16GB) kits. Designed for tech enthusiasts, creators, and gamers who demand unrivaled performance, premium quality, and blazing-fast speeds, this new memory module harnesses the power of DDR5, runs at 5600 MHz, and features a CAS latency of 46.

Next Generation Technology
PNY Performance DDR5 is built to support the growing lineup of motherboards compatible with the new DDR5 memory standard. This cutting-edge technology introduces a host of new features previously unavailable or limited in earlier generations of notebook memory. DDR5 enables higher-density modules, with capacities up to four times greater per module than DDR4 and supports faster standard frequencies. PNY's Performance DDR5 memory offers speeds of 5600 MHz for outstanding performance and is available in 64 GB (2x32GB) and 32 GB (2x16GB) kits.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220G: Universal Flash Storage 4.1. In addition, an update to the complementary JESD223F UFS Host Controller Interface (UFSHCI) version 4.1 standard has also been published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.1 offers faster data access and improved performance over the earlier version of the standard while maintaining hardware compatibility to UFS 4.0. Both standards are available for download from the JEDEC website.

"JEDEC members are continually innovating to shape the standards that will drive the next generation of mobile devices and advanced applications, and the committee's dedication to ongoing improvements to the UFS series is paving the way for future innovation," said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards.

ADATA at the 2025 International CES brought several of its latest memory products. The technology dominating memory products this year is CKD, or client clock driver. But there's more, ADATA also introduced memory modules with RCD, or registered clock driver, or a clock driver for RDIMMs. We begin our tour with the XPG Lancer CUDIMM RGB series, the company's flagship PC overclocking memory product. The top-spec module shown here comes with speeds as high as DDR5-9733, a step above even the DDR5-9600 that most other brands brought. The module comes in densities of 16 GB and 24 GB; and speeds of DDR5-8400, DDR5-8800, DDR5-9200, DDR5-9600, besides the top DDR5-9733. When paired with a Core Ultra "Arrow Lake-S" processor in Gear 4 mode, these kits should easily cross 10,000 MT/s using manual overclocking.

Next up, the company showed us its AICore line of DDR5 RDIMMs for workstations and servers. The module packs an RCD, a registered clock driver, which is essentially a CKD for RDIMMs. It is a component that clears out and amplifies the DDR5 physical layer signal, letting the machine operate at higher memory frequencies. The AICore series comes in speeds of up to DDR5-8000, and densities of up to 16 GB per module. Other speed variants in the series include DDR5-6400 and DDR5-7200. The recommended platforms for these modules include Intel's Xeon W-3500/W-2500 series "Sapphire Rapids," and AMD Ryzen Threadripper 7000-series "Storm Peak."

SK hynix has returned to Las Vegas for Consumer Electronics Show (CES) 2025, showcasing its latest AI memory innovations reshaping the industry. Held from January 7-10, CES 2025 brings together the brightest minds and groundbreaking technologies from the world's leading tech companies. This year, the event's theme is "Dive In," inviting attendees to immerse themselves in the next wave of technological advancement. SK hynix is emphasizing how it is driving this wave through a display of leading AI memory technologies at the SK Group exhibit. Along with SK Telecom, SKC, and SK Enmove, the company is highlighting how the Group's AI infrastructure brings about true change under the theme "Innovative AI, Sustainable Tomorrow."

Groundbreaking Memory Tech Driving Change in the AI Era
Visitors enter SK Group's exhibit through the Innovation Gate, greeted by a video of dynamic wave-inspired visuals which symbolize the power of AI. The video shows the transformation of binary data into a wave which flows through the exhibition, highlighting how data and AI drives change across industries. Continuing deeper into the exhibit, attendees make their way into the AI Data Center area, the focal point of SK hynix's display. This area features the company's transformative memory products driving progress in the AI era. Among the cutting-edge AI memory technologies on display are SK hynix's HBM, server DRAM, eSSD, CXL, and PIM products.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today unveils its groundbreaking B850 and B840 series motherboards, introducing a new era of performance optimization and EZ-friendly design for the latest AMD Ryzen processors with full-line PCIe Gen 5 x16 graphics cards support.⁠

D5 Bionic Corsa: Redefining Memory Overclocking
At the heart of GIGABYTE's new B850/ B840 motherboard series lies the innovative D5 Bionic Corsa technology, a game-changing approach to memory performance. This breakthrough technology has achieved remarkable up to 8600 MT/s DDR5 speeds, setting a new standard for memory overclocking. Through the intelligent AORUS AI SNATCH software, users can now effortlessly enhance their system's performance with unprecedented ease. The AI-powered EXPO AI BOOST feature eliminates the traditional time-consuming trial and error process, delivering optimized memory profiles that balance performance and stability with just a few clicks.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

By now, it's a surprise to almost nobody that NVIDIA plans to launch its next-generation RTX 5000-series "Blackwell" gaming graphics cards at the upcoming CES 2025 event in Las Vegas in early January. Previously, leaks and rumors gave us a full run-down of expected VRAM amounts and other specifications and features for the new GPUs, but these have yet to be confirmed by NVIDIA—for obvious reasons. Now, though, it looks as though iBuyPower has jumped the gun and prematurely revealed the new specifications for its updated line-up of pre-built gaming PCs with RTX 5000-series GPUs ahead of NVIDIA's official announcement. The offending product pages have since been removed, but they both give us confirmation of the previously leaked VRAM amounts and of the expected release cadence for RTX 5000, which will reportedly see the RTX 5070 Ti and RTX 5080 launch before the RTX 5090 flagship.

On iBuyPower's now-pulled pages, the NVIDIA GeForce RTX 5080 16 GB and GeForce RTX 5070 Ti 16 GB can be seen as the GPUs powering two different upcoming Y40 pre-built gaming PCs from the system integrator. The VRAM specifications here coincide with what we have previously seen from other leaked sources. Unfortunately, while an archived version of the page for the pre-built containing the RTX 5080 appears to show the design for an ASUS TUF Gaming RTX 5080 with a triple-fan cooler, it looks like iBuyPower is using the same renders for both the 5080 and 5070Ti versions of the pre-built PCs. What's also interesting is that iBuyPower looks to be pairing the next-gen GPUs with 7000-series AMD X3D CPUs, as opposed to the newly released AMD Ryzen 9000 X3D chips that have started making their way out into the market.

NVIDIA's GeForce RTX 5090 graphics card printed circuit board has allegedly been shown in the flesh, showing the memory layout and some interesting engineering choices. The custom PCB variant (non-Founders Edition) houses more than 40 capacitors, which is perhaps not standard on the FE reference board, and 16 GDDR7 memory modules. The leaked PCB, which extends beyond standard dimensions and traditional display connector configurations, is reportedly based on NVIDIA's PG145 reference design. The memory modules are distributed systematically: five on the left, two below, five on the right, and four above the GPU die. The interface is PCIe 5.0 x16.

As NVIDIA has reportedly designated 32 GB GDDR7 memory capacity for these cards, this roughly translates into 16 x 2 GB GDDR7 memory modules. At the heart of the card lies what sources claim to be the GB202 GPU, measuring 24×31 mm within a 63×56 mm package. Power delivery uses a 16-pin 12V-6x2 power connector, as expected. The entire PCB features only a single power connector, so the 16-pin 12V-2x6, but with an updated PCIe 6.0 CEM specification, is the logical choice.

Apacer Technology, a global leader in digital storage solutions, has announced the mass production of its latest industrial-grade DDR5-6400 CUDIMM and CSODIMM memory modules. These modules are the first to feature a fully lead-free resistor design, eliminating the need for exemptions under the EU RoHS directive. Equipped with premium professional-grade Clock Driver (CKD) components and Transient Voltage Suppressors (TVS) diode as dual-core technologies, the modules are specifically engineered for high-performance computing (HPC) and artificial intelligence (AI) applications. These products ensure exceptional stability and security even in extreme industrial environments, providing enterprises with reliable, eco-friendly, and high-performance solutions.

In alignment with the global push for sustainability, Apacer's fully lead-free DDR5 series has attracted significant customer interest, particularly for its compliance with the EU RoHS 7(c)-I lead exemption clause. By adopting this series early, customers can proactively mitigate risks associated with the expiration of exemption extensions. Now in mass production, these fully lead-free DDR5 CUDIMM and CSODIMM modules not only help customers meet international regulatory standards but also empower them to gain a competitive edge in the high-performance computing market.

With decades of expertise in building critical storage and memory for world-leading digital devices, Biwin will now bring its innovative and high-performance products to meet the evolving demands of today's digital consumers.

Biwin's featured products will be showcased at CES 2025 and available on Amazon JP in December 2024, followed by Amazon UK in January 2025, and will roll out to key markets in APAC, Latin America and India with the start of 2025.

Nanya Technology's Board of Directors today has approved a strategic partnership with PieceMakers Technology, Inc. ("PieceMakers") to jointly develop customized ultra-high-bandwidth memory solutions. As part of the collaboration, Nanya Technology will subscribe to a cash capital increase of up to NT$ 660 million, purchasing up to 22 million common shares at NT$ 30 per share in PieceMakers. Upon completion of the capital increase, Nanya Technology is expected to acquire up to approximately 38% stakes of PieceMakers.

To meet the growing demand for high-performance memory driven by AI and edge computing, this collaboration will combine Nanya Technology's 10 nm-class DRAM innovation with PieceMakers' expertise in customized DRAM design to develop high-value, high-performance, and low-power customized ultra-high-bandwidth memory solutions, unlocking new opportunities in AI and high-performance computing markets.

Sandisk Corporation today previewed its new corporate branding and creative direction, signaling a bold debut of the company's comeback launch as a standalone Flash and memory technology innovator, planned for early 2025.

Defined by a 'Mindset of Motion', Sandisk's new creative direction represents a future forward philosophy where by creating paths and possibilities for people to go without limits, the company unites the current moment and their aspirations. This mindset brings people closer to their ambitions and creates a circle of collaboration for progress and future growth.

Lexar late last week introduced the ARES DDR5-6000 CL26 memory kit. The kit is optimized for AMD Ryzen platforms, such as the recently launched Ryzen 7 9800X3D. It comes with an AMD EXPO profile for DDR5-6000 and tight timings, including a CAS latency of 26, or 55 ns. It also includes an Intel XMP 3.0 profile that enables the same timings. Typical DDR5-6000 kits tend to come with a CL of 30. Under the hood, the kit uses SK Hynix A-die DRAM chips, and a 10-layer PCB. The module features thermal pads for not just the DRAM chips, but also the PMIC. These transfer heat to a 1.8 mm-thick aluminium heatspreader that's crowned by a silicone diffuser for the module's lighting setup that consists of eight ARGB LEDs, with 13 lighting presets. The module comes in two color options—silver and black. The company didn't reveal pricing or availability information.

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, proposes a novel 3D integrated charge-coupled device (CCD) that can operate as a block-addressable buffer memory, in support of data-intensive compute applications. Memory operation is demonstrated on a planar proof-of-concept CCD structure which can store 142 bits. Implementing an oxide semiconductor channel material (such as IGZO) ensures sufficiently long retention time and enables 3D integration in a cost-efficient, 3D NAND-like architecture. Imec expects the 3D CCD memory density to scale far beyond the DRAM limit.

The recent introduction of the compute express link (CXL) memory interface provides opportunities for new memories to complement DRAM in data-intensive compute applications like AI and ML. One example is the CXL type-3 buffer memory, envisioned as an off-chip pool of memories that 'feeds' the various processor cores with large data blocks via a high-bandwidth CXL switch. This class of memories meets different specifications than byte-addressable DRAM, which increasingly struggles to maintain the cost-per-bit-trend scaling line.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, introduces the Storming V 16 GB / 8 GB DDR4 memory ideal for budget-friendly, casual home entertainment systems.

The Storming V DDR4 memory is an excellent choice for modern home entertainment systems, combining outstanding performance with affordability. Designed for casual entertainment and gaming, it delivers exceptional speed and stability, handling popular mid-range titles effortlessly to provide smooth gameplay and rapid data transfer rates. With a strong emphasis on practicality and performance, the Storming V DDR4 is the smart choice to elevate your everyday computing and entertainment experience.

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion in 2024, growing 6.5% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast - OEM Perspective at SEMICON Japan 2024. Semiconductor manufacturing equipment growth is expected to continue in the following years, reaching new records of $121 billion in 2025 and $139 billion in 2026, supported by both the front-end and back-end segments.

"Three consecutive years of projected growth in investments in semiconductor manufacturing reflect the vital role our industry plays in underpinning the global economy and advancing technology innovation," said Ajit Manocha, SEMI president and CEO. "Since our July 2024 forecast, the outlook for 2024 semiconductor equipment sales has brightened, especially with stronger-than-expected investments from China and in AI-related sectors. Together with our forecast extension through 2026, it highlights the robust growth drivers across segments, applications, and regions."

The CXL Consortium, an industry standard body advancing coherent connectivity, announces the release of its Compute Express Link (CXL) 3.2 Specification. The 3.2 Specification optimizes CXL Memory Device monitoring and management, enhances functionality of CXL Memory Devices for OS and Applications, and extends security with the Trusted Security Protocol (TSP).

"We are excited to announce the release of the CXL 3.2 Specification to advance the CXL ecosystem by providing enhancements to security, compliance, and functionality of CXL Memory Devices," said Larrie Carr, CXL Consortium President. "The Consortium continues to develop an open, coherent interconnect and enable an interoperable ecosystem for heterogeneous memory and computing solutions."

Samsung Electronics and SK hynix are working together to standardize "Low Power Double Data Rate 6 (LPDDR6) - Processing in Memory (PIM)" technology according to a report from Business Korea. This collaboration seeks to accelerate the development of low power memory products. The cooperation is still in its early stage, the companies initial work is focused on registering the standard with the Joint Electron and Device Engineering Council (JEDEC). Discussions are underway to determine technical requirements, specific characteristics of LPDDR with PIM, such as "internal bandwidth"—the data transfer rate within the memory, unlike the "external bandwidth" between the processor and memory in traditional systems. According to a Samsung Electronics representative, the two companies are in the process of developing a timeline for standardization.

This partnership is notable given how Samsung and SK hynix compete in the high-bandwidth memory (HBM) market. SK hynix beat Samsung in profits reporting 7.3 trillion won in the third quarter, while Samsung made 3.86 trillion won. However, the rise of AI with its increased demand for more memory has shaken up the scene pushing for teamwork instead of wasting resources in developing completely different and unstandardized products. Both firms see PIM technology as a way to grow, previous attempts to independently develop PIM products include Samsung's HBM and LPDDR5-PIM and SK hynix's GDDR6-PIM.

Samsung Electronics today announced new leadership for the next phase of the Company's growth and to strengthen its future competitiveness, focusing on the semiconductor business.

Young Hyun Jun, Vice Chairman and Head of Device Solutions (DS) Division, was named CEO and will also become the Head of Memory Business and Samsung Advanced Institute of Technology. Jinman Han was promoted to President and will become the Head of Foundry Business, while Seok Woo Nam will become Chief Technology Officer of Foundry Business, a newly-created position.