PNY today announced the specifications and availability of its high-performance DDR5 notebook memory, offered in 64 GB (2x32GB) and 32 GB (2x16GB) kits. Designed for tech enthusiasts, creators, and gamers who demand unrivaled performance, premium quality, and blazing-fast speeds, this new memory module harnesses the power of DDR5, runs at 5600 MHz, and features a CAS latency of 46.

Next Generation Technology
PNY Performance DDR5 is built to support the growing lineup of motherboards compatible with the new DDR5 memory standard. This cutting-edge technology introduces a host of new features previously unavailable or limited in earlier generations of notebook memory. DDR5 enables higher-density modules, with capacities up to four times greater per module than DDR4 and supports faster standard frequencies. PNY's Performance DDR5 memory offers speeds of 5600 MHz for outstanding performance and is available in 64 GB (2x32GB) and 32 GB (2x16GB) kits.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220G: Universal Flash Storage 4.1. In addition, an update to the complementary JESD223F UFS Host Controller Interface (UFSHCI) version 4.1 standard has also been published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.1 offers faster data access and improved performance over the earlier version of the standard while maintaining hardware compatibility to UFS 4.0. Both standards are available for download from the JEDEC website.

"JEDEC members are continually innovating to shape the standards that will drive the next generation of mobile devices and advanced applications, and the committee's dedication to ongoing improvements to the UFS series is paving the way for future innovation," said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards.

ADATA at the 2025 International CES brought several of its latest memory products. The technology dominating memory products this year is CKD, or client clock driver. But there's more, ADATA also introduced memory modules with RCD, or registered clock driver, or a clock driver for RDIMMs. We begin our tour with the XPG Lancer CUDIMM RGB series, the company's flagship PC overclocking memory product. The top-spec module shown here comes with speeds as high as DDR5-9733, a step above even the DDR5-9600 that most other brands brought. The module comes in densities of 16 GB and 24 GB; and speeds of DDR5-8400, DDR5-8800, DDR5-9200, DDR5-9600, besides the top DDR5-9733. When paired with a Core Ultra "Arrow Lake-S" processor in Gear 4 mode, these kits should easily cross 10,000 MT/s using manual overclocking.

Next up, the company showed us its AICore line of DDR5 RDIMMs for workstations and servers. The module packs an RCD, a registered clock driver, which is essentially a CKD for RDIMMs. It is a component that clears out and amplifies the DDR5 physical layer signal, letting the machine operate at higher memory frequencies. The AICore series comes in speeds of up to DDR5-8000, and densities of up to 16 GB per module. Other speed variants in the series include DDR5-6400 and DDR5-7200. The recommended platforms for these modules include Intel's Xeon W-3500/W-2500 series "Sapphire Rapids," and AMD Ryzen Threadripper 7000-series "Storm Peak."

SK hynix has returned to Las Vegas for Consumer Electronics Show (CES) 2025, showcasing its latest AI memory innovations reshaping the industry. Held from January 7-10, CES 2025 brings together the brightest minds and groundbreaking technologies from the world's leading tech companies. This year, the event's theme is "Dive In," inviting attendees to immerse themselves in the next wave of technological advancement. SK hynix is emphasizing how it is driving this wave through a display of leading AI memory technologies at the SK Group exhibit. Along with SK Telecom, SKC, and SK Enmove, the company is highlighting how the Group's AI infrastructure brings about true change under the theme "Innovative AI, Sustainable Tomorrow."

Groundbreaking Memory Tech Driving Change in the AI Era
Visitors enter SK Group's exhibit through the Innovation Gate, greeted by a video of dynamic wave-inspired visuals which symbolize the power of AI. The video shows the transformation of binary data into a wave which flows through the exhibition, highlighting how data and AI drives change across industries. Continuing deeper into the exhibit, attendees make their way into the AI Data Center area, the focal point of SK hynix's display. This area features the company's transformative memory products driving progress in the AI era. Among the cutting-edge AI memory technologies on display are SK hynix's HBM, server DRAM, eSSD, CXL, and PIM products.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today unveils its groundbreaking B850 and B840 series motherboards, introducing a new era of performance optimization and EZ-friendly design for the latest AMD Ryzen processors with full-line PCIe Gen 5 x16 graphics cards support.⁠

D5 Bionic Corsa: Redefining Memory Overclocking
At the heart of GIGABYTE's new B850/ B840 motherboard series lies the innovative D5 Bionic Corsa technology, a game-changing approach to memory performance. This breakthrough technology has achieved remarkable up to 8600 MT/s DDR5 speeds, setting a new standard for memory overclocking. Through the intelligent AORUS AI SNATCH software, users can now effortlessly enhance their system's performance with unprecedented ease. The AI-powered EXPO AI BOOST feature eliminates the traditional time-consuming trial and error process, delivering optimized memory profiles that balance performance and stability with just a few clicks.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

By now, it's a surprise to almost nobody that NVIDIA plans to launch its next-generation RTX 5000-series "Blackwell" gaming graphics cards at the upcoming CES 2025 event in Las Vegas in early January. Previously, leaks and rumors gave us a full run-down of expected VRAM amounts and other specifications and features for the new GPUs, but these have yet to be confirmed by NVIDIA—for obvious reasons. Now, though, it looks as though iBuyPower has jumped the gun and prematurely revealed the new specifications for its updated line-up of pre-built gaming PCs with RTX 5000-series GPUs ahead of NVIDIA's official announcement. The offending product pages have since been removed, but they both give us confirmation of the previously leaked VRAM amounts and of the expected release cadence for RTX 5000, which will reportedly see the RTX 5070 Ti and RTX 5080 launch before the RTX 5090 flagship.

On iBuyPower's now-pulled pages, the NVIDIA GeForce RTX 5080 16 GB and GeForce RTX 5070 Ti 16 GB can be seen as the GPUs powering two different upcoming Y40 pre-built gaming PCs from the system integrator. The VRAM specifications here coincide with what we have previously seen from other leaked sources. Unfortunately, while an archived version of the page for the pre-built containing the RTX 5080 appears to show the design for an ASUS TUF Gaming RTX 5080 with a triple-fan cooler, it looks like iBuyPower is using the same renders for both the 5080 and 5070Ti versions of the pre-built PCs. What's also interesting is that iBuyPower looks to be pairing the next-gen GPUs with 7000-series AMD X3D CPUs, as opposed to the newly released AMD Ryzen 9000 X3D chips that have started making their way out into the market.

NVIDIA's GeForce RTX 5090 graphics card printed circuit board has allegedly been shown in the flesh, showing the memory layout and some interesting engineering choices. The custom PCB variant (non-Founders Edition) houses more than 40 capacitors, which is perhaps not standard on the FE reference board, and 16 GDDR7 memory modules. The leaked PCB, which extends beyond standard dimensions and traditional display connector configurations, is reportedly based on NVIDIA's PG145 reference design. The memory modules are distributed systematically: five on the left, two below, five on the right, and four above the GPU die. The interface is PCIe 5.0 x16.

As NVIDIA has reportedly designated 32 GB GDDR7 memory capacity for these cards, this roughly translates into 16 x 2 GB GDDR7 memory modules. At the heart of the card lies what sources claim to be the GB202 GPU, measuring 24×31 mm within a 63×56 mm package. Power delivery uses a 16-pin 12V-6x2 power connector, as expected. The entire PCB features only a single power connector, so the 16-pin 12V-2x6, but with an updated PCIe 6.0 CEM specification, is the logical choice.

Apacer Technology, a global leader in digital storage solutions, has announced the mass production of its latest industrial-grade DDR5-6400 CUDIMM and CSODIMM memory modules. These modules are the first to feature a fully lead-free resistor design, eliminating the need for exemptions under the EU RoHS directive. Equipped with premium professional-grade Clock Driver (CKD) components and Transient Voltage Suppressors (TVS) diode as dual-core technologies, the modules are specifically engineered for high-performance computing (HPC) and artificial intelligence (AI) applications. These products ensure exceptional stability and security even in extreme industrial environments, providing enterprises with reliable, eco-friendly, and high-performance solutions.

In alignment with the global push for sustainability, Apacer's fully lead-free DDR5 series has attracted significant customer interest, particularly for its compliance with the EU RoHS 7(c)-I lead exemption clause. By adopting this series early, customers can proactively mitigate risks associated with the expiration of exemption extensions. Now in mass production, these fully lead-free DDR5 CUDIMM and CSODIMM modules not only help customers meet international regulatory standards but also empower them to gain a competitive edge in the high-performance computing market.

With decades of expertise in building critical storage and memory for world-leading digital devices, Biwin will now bring its innovative and high-performance products to meet the evolving demands of today's digital consumers.

Biwin's featured products will be showcased at CES 2025 and available on Amazon JP in December 2024, followed by Amazon UK in January 2025, and will roll out to key markets in APAC, Latin America and India with the start of 2025.

Nanya Technology's Board of Directors today has approved a strategic partnership with PieceMakers Technology, Inc. ("PieceMakers") to jointly develop customized ultra-high-bandwidth memory solutions. As part of the collaboration, Nanya Technology will subscribe to a cash capital increase of up to NT$ 660 million, purchasing up to 22 million common shares at NT$ 30 per share in PieceMakers. Upon completion of the capital increase, Nanya Technology is expected to acquire up to approximately 38% stakes of PieceMakers.

To meet the growing demand for high-performance memory driven by AI and edge computing, this collaboration will combine Nanya Technology's 10 nm-class DRAM innovation with PieceMakers' expertise in customized DRAM design to develop high-value, high-performance, and low-power customized ultra-high-bandwidth memory solutions, unlocking new opportunities in AI and high-performance computing markets.

Sandisk Corporation today previewed its new corporate branding and creative direction, signaling a bold debut of the company's comeback launch as a standalone Flash and memory technology innovator, planned for early 2025.

Defined by a 'Mindset of Motion', Sandisk's new creative direction represents a future forward philosophy where by creating paths and possibilities for people to go without limits, the company unites the current moment and their aspirations. This mindset brings people closer to their ambitions and creates a circle of collaboration for progress and future growth.

Lexar late last week introduced the ARES DDR5-6000 CL26 memory kit. The kit is optimized for AMD Ryzen platforms, such as the recently launched Ryzen 7 9800X3D. It comes with an AMD EXPO profile for DDR5-6000 and tight timings, including a CAS latency of 26, or 55 ns. It also includes an Intel XMP 3.0 profile that enables the same timings. Typical DDR5-6000 kits tend to come with a CL of 30. Under the hood, the kit uses SK Hynix A-die DRAM chips, and a 10-layer PCB. The module features thermal pads for not just the DRAM chips, but also the PMIC. These transfer heat to a 1.8 mm-thick aluminium heatspreader that's crowned by a silicone diffuser for the module's lighting setup that consists of eight ARGB LEDs, with 13 lighting presets. The module comes in two color options—silver and black. The company didn't reveal pricing or availability information.

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, proposes a novel 3D integrated charge-coupled device (CCD) that can operate as a block-addressable buffer memory, in support of data-intensive compute applications. Memory operation is demonstrated on a planar proof-of-concept CCD structure which can store 142 bits. Implementing an oxide semiconductor channel material (such as IGZO) ensures sufficiently long retention time and enables 3D integration in a cost-efficient, 3D NAND-like architecture. Imec expects the 3D CCD memory density to scale far beyond the DRAM limit.

The recent introduction of the compute express link (CXL) memory interface provides opportunities for new memories to complement DRAM in data-intensive compute applications like AI and ML. One example is the CXL type-3 buffer memory, envisioned as an off-chip pool of memories that 'feeds' the various processor cores with large data blocks via a high-bandwidth CXL switch. This class of memories meets different specifications than byte-addressable DRAM, which increasingly struggles to maintain the cost-per-bit-trend scaling line.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, introduces the Storming V 16 GB / 8 GB DDR4 memory ideal for budget-friendly, casual home entertainment systems.

The Storming V DDR4 memory is an excellent choice for modern home entertainment systems, combining outstanding performance with affordability. Designed for casual entertainment and gaming, it delivers exceptional speed and stability, handling popular mid-range titles effortlessly to provide smooth gameplay and rapid data transfer rates. With a strong emphasis on practicality and performance, the Storming V DDR4 is the smart choice to elevate your everyday computing and entertainment experience.

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion in 2024, growing 6.5% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast - OEM Perspective at SEMICON Japan 2024. Semiconductor manufacturing equipment growth is expected to continue in the following years, reaching new records of $121 billion in 2025 and $139 billion in 2026, supported by both the front-end and back-end segments.

"Three consecutive years of projected growth in investments in semiconductor manufacturing reflect the vital role our industry plays in underpinning the global economy and advancing technology innovation," said Ajit Manocha, SEMI president and CEO. "Since our July 2024 forecast, the outlook for 2024 semiconductor equipment sales has brightened, especially with stronger-than-expected investments from China and in AI-related sectors. Together with our forecast extension through 2026, it highlights the robust growth drivers across segments, applications, and regions."

The CXL Consortium, an industry standard body advancing coherent connectivity, announces the release of its Compute Express Link (CXL) 3.2 Specification. The 3.2 Specification optimizes CXL Memory Device monitoring and management, enhances functionality of CXL Memory Devices for OS and Applications, and extends security with the Trusted Security Protocol (TSP).

"We are excited to announce the release of the CXL 3.2 Specification to advance the CXL ecosystem by providing enhancements to security, compliance, and functionality of CXL Memory Devices," said Larrie Carr, CXL Consortium President. "The Consortium continues to develop an open, coherent interconnect and enable an interoperable ecosystem for heterogeneous memory and computing solutions."

Samsung Electronics and SK hynix are working together to standardize "Low Power Double Data Rate 6 (LPDDR6) - Processing in Memory (PIM)" technology according to a report from Business Korea. This collaboration seeks to accelerate the development of low power memory products. The cooperation is still in its early stage, the companies initial work is focused on registering the standard with the Joint Electron and Device Engineering Council (JEDEC). Discussions are underway to determine technical requirements, specific characteristics of LPDDR with PIM, such as "internal bandwidth"—the data transfer rate within the memory, unlike the "external bandwidth" between the processor and memory in traditional systems. According to a Samsung Electronics representative, the two companies are in the process of developing a timeline for standardization.

This partnership is notable given how Samsung and SK hynix compete in the high-bandwidth memory (HBM) market. SK hynix beat Samsung in profits reporting 7.3 trillion won in the third quarter, while Samsung made 3.86 trillion won. However, the rise of AI with its increased demand for more memory has shaken up the scene pushing for teamwork instead of wasting resources in developing completely different and unstandardized products. Both firms see PIM technology as a way to grow, previous attempts to independently develop PIM products include Samsung's HBM and LPDDR5-PIM and SK hynix's GDDR6-PIM.

Samsung Electronics today announced new leadership for the next phase of the Company's growth and to strengthen its future competitiveness, focusing on the semiconductor business.

Young Hyun Jun, Vice Chairman and Head of Device Solutions (DS) Division, was named CEO and will also become the Head of Memory Business and Samsung Advanced Institute of Technology. Jinman Han was promoted to President and will become the Head of Foundry Business, while Seok Woo Nam will become Chief Technology Officer of Foundry Business, a newly-created position.

Patriot, a global leader in high-performance memory and storage solutions, has shattered performance records once again. The company's flagship DDR5 memory, Viper Xtreme 5, powered renowned overclocking expert Snakeeyes to achieve a groundbreaking global memory frequency world record on the HWBOT platform: an astonishing 6305.8 MHz (12,611.6 MT/s).

Snakeeyes not only set the frequency record but also claimed multiple top accolades on the HWBOT platform, including:

• First Place in the World Record Rankings
• First Place in the DDR5 SDRAM Rankings
• First Place in the Global Team Rankings
• First Place in the DDR5 SDRAM Team Rankings

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry's first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).

The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, gaming monitors and power supply units, proudly announces a new milestone achieved with the Z890 Taichi OCF motherboard. In a remarkable overclocking feat, overclocker AKM broke a world record in memory overclocking, pushing memory frequency to a staggering DDR5-12527 MHz. This milestone was accomplished using the Intel Core Ultra 9 285K Processor, paired with the Z890 Taichi OCF motherboard and v-color Manta XFinity RGB memory, to set an impressive new benchmark in performance.

The Z890 Taichi OCF is the pinnacle of ASRock's commitment to extreme overclocking, embodying the philosophy "Built for Extreme Overclocking." Engineered to meet the demands of professional overclockers, this motherboard delivers unparalleled precision, overclocking capability, and performance. With an advanced design that allows for peak stability and high-frequency performance, the Z890 Taichi OCF has quickly set a new standard for enthusiasts and professionals who push their systems to the limit.

Expanding the system's computing capability with an additional accelerator like a GPU is common. However, expanding the system's memory capacity with room for more DIMM is something new. Thanks to ServeTheHome, we see that at the OCP Summit 2024, Lenovo showcased its ThinkSystem SR860 V3 server, leveraging CXL technology and Astera Labs Leo memory controllers to accommodate a staggering 16 TB of DDR5 memory across 128 DIMM slots. Traditional four-socket servers face limitations due to the memory channels supported by Intel Xeon processors. With each CPU supporting up to 16 DDR5 DIMMs, a four-socket configuration maxes out at 64 DIMMs, equating to 8 TB when using 128 GB RDIMMs. Lenovo's new approach expands this ceiling significantly by incorporating an additional 64 DIMM slots through CXL memory expansion.

The ThinkSystem SR860 V3 integrates Astera Labs Leo controllers to enable the CXL-connected DIMMs. These controllers manage up to four DDR5 DIMMs each, resulting in a layered memory design. The chassis base houses four Xeon processors, each linked to 16 directly connected DIMMs, while the upper section—called the "memory forest"—houses the additional CXL-enabled DIMMs. Beyond memory capabilities, the server supports up to four double-width GPUs, making it also a solution for high-performance computing and AI workloads. This design caters to scale-up applications requiring vast memory resources, such as large-scale database management, and allows the resources to stay in memory instead of waiting on storage. CXL-based memory architectures are expected to become more common next year. Future developments may see even larger systems with shared memory pools, enabling dynamic allocation across multiple servers. For more pictures and video walkthrough, check out ServeTheHome's post.

Apacer, a global leader in digital storage solutions, today announced the official release of its flagship NOX RGB DDR5 Gaming Memory, specially designed for the world's most demanding gamers and aesthetics. Engineered for unprecedented speed, stability, and stunning visual effects, the NOX RGB DDR5 is the ultimate upgrade for those seeking top-tier performance.

Peak Performance Redefined
With its overclocking capability reaching up to 8000 MT/s, the NOX RGB DDR5 Gaming Memory is built to deliver cutting-edge performance in the most intense gaming environments. The inclusion of the latest overclocking technologies, such as Intel XMP 3.0 and AMD EXPO, makes it easier than ever for gamers to achieve peak performance with just a single click.

GeIL - Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers, announced today that its full range of DDR5 memory products, from 6400 MT/s to 8000 MT/s, will now be available in both CUDIMM and UDIMM options to meet diverse consumer needs. For high-end overclocking applications, GeIL is introducing two new high-speed specifications, 8800 MT/s and 9200 MT/s, offering overclocking enthusiasts an optimal choice for top performance. Both CUDIMM and UDIMM options ensure excellent compatibility and full support for Intel's latest Core Ultra Processors (Series 2).

According to the latest JEDEC standards, CUDIMM includes an additional CKD (Clock Driver) chip, which regenerates the clock signal directly on the DIMM. This integration reduces signal degradation and noise, resulting in enhanced memory stability and performance, with stable operation at speeds of 6400 MT/s and even reaching up to 7200 MT/s. For both standard and high-performance applications, the CKD chip plays a crucial role in signal integrity and reliability, enabling faster, more stable speeds.