NVIDIA and its memory partners, SK Hynix, Samsung, and Micron, are preparing a new memory form factor called System on Chip Advanced Memory Module—SOCAMM shortly. This technology, adapting to the now well-known CAMM memory module standard, aims to bring additional memory density to NVIDIA systems. Taking inspiration from NVIDIA's Project DIGITS, it has now been developed independently by NVIDIA outside of any official memory consortium like JEDEC. Utilizing a detachable module design, SOCAMM delivers superior specifications compared to existing solutions, featuring 694 I/O ports (versus LPCAMM's 644 and traditional DRAM's 260), direct LPDDR5X memory substrate integration, and a more compact form factor.

For reference, current-generation Project DIGITS is using NVIDIA GB10 Grace Blackwell Superchip capable of delivering one PetaFLOP of FP4 compute, paired with 128 GB of LPDDR5X memory. This configuration limits the size of AI models that run locally on the device, resulting in up to 200 billion parameter models running on a single Project DIGITS AI PC. Two stacked Project DIGITS PCs are needed for models like Llama 3.1 405B with 405 billion parameters. Most interestingly, memory capacity is the primary limiting factor; hence, NVIDIA devotes its time to developing a more memory-dense SOCAMM standard. Being a replacement compatible with LPDDR5, it can use the same controller silicon IP with only the SoC substrate being modified to fit the new memory. With NVIDIA rumored to enter the consumer PC market this year, we could also see an early implementation in consumer PC products, but the next-generation Project DIGITS is the primary target.

Thanks to a well-known industry leaker, Jaykihn, Intel's Panther Lake-H processor family, built on the 18A process node, features three distinct configurations, with several power profiles for each case. The flagship model combines four "Cougar Cove" P-cores, eight "Skymont" E-cores, and four LPE cores alongside a 12-core Xe3 "Celestial" GPU. This variant supports LPDDR5X memory exclusively and delivers 180 TOPS of computational power for local AI workloads, operating at 25 W PL1 (base) and 64 W PL2 (turbo) power levels. Secondary configurations include a 4P+8E+4LP+4Xe3 model and a 4P+0E+4LP+4Xe3 variant, both rated at 100 TOPS and supporting both LPDDR5X and DDR5 memory.

The entry-level model operates at 15 W PL1 with 44 W PL2 in baseline mode, scaling to 25 W PL1 and 55 W PL2 in performance mode. All variants feature Thunderbolt 4 connectivity, with high-end models incorporating expanded PCIe 5.0 lane configurations. The integrated Xe3 graphics architecture scales from four to 12 cores across the product stack, with the top SKU eliminating DDR5 compatibility in favor of LPDDR5X optimization. The Panther Lake processor family is slated for launch within the latter half of 2025, and it will be the company's leading 18A product. As a "Lunar Lake" successor, Panther Lake will deliver improved IPC and optimization for new cores in the same device form-factor like laptops, ultrabooks, and handhelds.

Qualcomm has announced its latest mid-range offering, dubbed the Snapdragon 6 Gen 4. Compared to its predecessor, the Snapdragon 6 Gen 3, the improvements on the CPU side are rather modest, with Qualcomm claiming an 11% improvement. The CPU, now based on TSMC N4, packs four ARMv9-based Cortex-A720 P-cores, along with four Cortex-A520 E-cores, making it an 8-core system as tradition. On the GPU side, however, a substantial 29% improvement has been asserted, although the specifics remain under wraps as of this writing.

The chipset can be paired with up to 16 GB of LPDDR5-3200 memory, and displays up to FHD+ at 144 Hz are supported. INT4 support is also present the new NPU, which should allow for decent on-device AI capabilities. Gaming performance should also witness a decent jump, thanks to the aforementioned GPU improvement, paired with Game Super Resolution (upscaling) and Frame Motion Engine (frame generation, every other frame). For connectivity, Wi-Fi 6E, Bluetooth 5.4, and 5G (mm Wave, sub-6 GHz) are present. Up to 200 MP single-camera systems are supported, with Snapdragon's LLV (Low Light Vision) technology, Of course, being a budget segment SoC, it would be futile to expect high-end photography capabilities. As for videography, 4k30 and 1080p120 are supported, along with HLG and HDR10.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

AAEON, a leader in industrial IoT and AI Edge solutions, has announced the release of two new SMARC modules, the uCOM-IMX93 and uCOM-ASL, powered by the NXP i.MX 93 Applications Processor Family and Intel Atom x7000RE Processor Series for the Edge, respectively. This news comes following the revival of AAEON's SMARC product line last year, which has since brought a range of x86 and RISC-based options to the market. The uCOM-IMX93 is equipped with the relatively low-power Arm Cortex -A55 and M33 processors as part of its NXP i.MX 93 platform, from which it also provides two native CAN 2.0 FD interfaces and integrated NXP 2D Graphic Acceleration functionality.

The module offers dual Gigabit Ethernet ports, one of which supports time sensitive networking, multiple GPIO and HDMI options, as well as optional TPM 2.0, making it well-suited to deployment in portable edge solutions like industrial HMI and smart building control solutions. Moreover, the module's extensive UART interfaces and -40°C to 85°C temperature range provide a low maintenance, efficient, and more easily deployed module suited to users that require low maintenance, rugged operation on the edge, with AAEON noting its Universal Update Utility (UUU) Serial Download Mode and aforementioned environmental specs as conducive to fleet management solution integration.

SK hynix Inc. announced today that it recorded best-ever yearly performance with 66.1930 trillion won in revenues, 23.4673 trillion won in operating profit (with an operating margin of 35%), and 19.7969 trillion won in net profit (with a net margin of 30%). Yearly revenues marked all-time high, exceeding the previous record in 2022 by over 21 trillion won and operating profit exceeded the record in 2018 during the semiconductor super boom.

In particular, fourth quarter revenues went up by 12% to 19.7670 trillion won, operating profit up 15% to 8.0828 trillion won (with an operating margin of 41%) from the previous quarter and net profit recorded 8.0065 trillion won (with a net margin of 41%). SK hynix emphasized that with prolonged strong demand for AI memory, the company achieved all-time high result through world-leading HBM technology and profitability-oriented operation. HBM continued its high growth in fourth quarter marking over 40% of total DRAM revenue and eSSD also showed constant increase in sales. With remarkable product competitiveness based profitability-oriented operation, the company established a stable financial condition which led to improved outcome.

ASUS today announced the next-generation ASUS Chromebook CR series of laptops, tailored to meet the needs of K-12 students. The ASUS Chromebook CR series stands out as the ideal companion for students, whether engaged in in-person classroom learning or remote education. The rugged and modular design, featuring replaceable internal parts, guarantees both durability and longevity. With 11.6-inch or 12.2-inch Corning Gorilla Glass touchscreens and a 180° lay-flat or 360°-flippable hinge, the laptops offer flexibility for enriched educational experiences. This design fosters the adventurous mindset of modern students, ensuring an enjoyable and secure learning journey, whether they're engaging in online courses or in-class sessions - ready for every learning journey.

A trusted study partner
For K-12 students, an everyday-use laptop should be invincible. With lively and active users, scratches and knocks are an almost-inevitable part of their daily routine, so the ASUS Chromebook CR series features an all-round rubber bumper for extra peace of mind. The laptops also feature a rugged design that's tested to meet or exceed the MIL-STD-810H US military-grade standard, and use tough Corning Gorilla Glass to protect the touchscreen from scratches. Additionally, the spill-resistant keyboard can cope with minor water spills without harm, so minor splashes on the desk or at the dinner table can be easily drained, cleaned, and dried. Finally, the special fingerprint-resistant finish keeps the laptop cleaner for longer.

Today marks the launch of the new ASUS Vivobook Pro 15 (N6506CU), the latest version of this high-performance 15.6-inch laptop designed for pro creators and pro gamers.

ASUS Vivobook Pro 15 offers seamless creativity and gaming with cutting-edge components: up to the latest Intel Core Ultra 9 processor (Series 2) with a built-in 13 TOPS NPU, NVIDIA GeForce RTX 4050 GPU with a low-latency MUX switch, 24 GB DDR5 RAM, and a 2 TB PCIe SSD. It boasts advanced ASUS IceCool Pro cooling technology that enables up to a 125-watt combined thermal design power (TDP).

Lenovo announced the latest additions to its Lenovo Legion ecosystem of gaming devices, accessories, and software today at CES 2025, delivering a deep bench of devices across a wide range of form-factors that give gamers of all levels powerful options to game their way in pursuit of 'reaching their impossible'. These new devices include:

• The Lenovo Legion Go S (8", 1) and Lenovo Legion Go S (8", 1) - Powered by SteamOS, gaming handheld devices featuring an 8-inch screen with VRR support, a chassis sporting fused TrueStrike controllers with adjustable trigger switches and hall-effect joysticks, and the world's first officially licensed handheld powered by SteamOS.
• The Lenovo Legion Go (8.8", 2), a gaming handheld prototype device planned to feature a native landscape OLED display, up to double the RAM compared to previous generation, and a bigger battery.
• The redesigned Lenovo Legion Pro 7i (16", 10), Lenovo Legion Pro 5i (16", 10) and Lenovo Legion Pro 5 (16", 10) laptops, with new aggressive design language, more performance, and new Lenovo PureSight OLED display options.
• A fully redesigned Legion Space gaming software solution that unifies all Lenovo Legion device settings, syncs with all Lenovo Legion ecosystem devices, provides access to all games in one library, and features a suite of new AI-powered features that help gamers up their game, their streams, and their enjoyment.
• The Lenovo Legion Pro 34WD-10 monitor, a PureSight OLED display with gaming-specific features to give competitive gamers an edge on the map.
• Lenovo also announced other new additions to its Legion and LOQ laptops and desktops, the latest Legion Tab, and a selection of Legion accessories to complement the gaming devices.

ASUS Republic of Gamers (ROG) today announced the arrival of the 2025 ROG Flow Z13, a powerful gaming tablet. This versatile 2-in-1 gaming machine now features the brand new ultra-powerful AMD Ryzen AI Max+ 395 with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

Nintendo Switch 2 promises to be this year's big (well small) gaming platform launch. It goes up against a growing ecosystem of handhelds based on x86-64 mobile processors running Windows, its main play would have to be offering a similar or better gameplay experience, but with better battery life, given that all of its hardware is purpose-built for a handheld console, and runs a highly optimized software stack; and the SoC forms a big part of this. Nintendo turned to NVIDIA for the job, given its graphics IP leadership, and its ability to integrate it with Arm CPU IP in a semi-custom chip. Someone with access to a Switch 2 prototype, likely an ISV, took the device apart, revealing the chip, a die-shrunk version of the Tegra T239 from 2023.

It's important to note that prototype consoles physically appear nothing like the final product, they're just designed so ISVs and game developers can validate them, and together with PC-based "official" emulation, set up the ability to develop or port games to the new platform. The Switch 2 looks very similar to the original Switch, it is a large tablet-like device, with detachable controllers. The largest chip on the mainboard is the NVIDIA Tegra T239. Nintendo Prime shared more details about the chip.

TrendForce's latest investigations reveal that the DRAM market is expected to face downward pricing pressure in 1Q25 as seasonal weakness aligns with sluggish consumer demand for products like smartphones. Additionally, early stockpiling by notebook manufacturers—over potential import tariffs under the Trump administration—has further exacerbated the pricing decline.

Conventional DRAM prices are projected to drop by 8% to 13%. However, if HBM products are included, the anticipated price decline will range from 0% to 5%.

ASUS today announced ASUS NUC 14 Pro AI, the world's first mini PC featuring Intel Core Ultra processors (Series 2) integrated with Microsoft Copilot+. This revolutionary device is engineered to deliver unparalleled performance for use across diverse sectors, easily handling business, entertainment, and industrial apps. Boasting compact dimensions and advanced AI capabilities, ASUS NUC 14 Pro AI sets a new benchmark for mini PC innovation, offering an alternative to traditional desktops in a compact package.

World's first AI-enabled mini PC, powered by Intel Core Ultra processors (Series 2)
ASUS NUC 14 Pro AI represents a major leap in AI mini PC technology. It's powered by up to the latest Intel Core Ultra 9 processors (Series 2) that feature a multi-architecture design incorporating CPU, GPU, and NPU technologies. Delivering a total of 120 platform TOPS and 48 NPU TOPS, ASUS NUC 14 Pro AI provides 3X the AI performance of previous-generation NUC models, making it ideal for commercial use, edge computing, and IoT applications.

AAEON's UP brand, most known for its pioneering developer board portfolio, has released the UP Xtreme i14 Edge, a Mini PC equipped with Intel Core Ultra processing, Intel Arc graphics, and 64 GB of LPDDR5 system memory. The PC is primarily geared towards applications requiring high performance computer vision, such as smart traffic monitoring and AI-assisted commercial security systems, but given the serial communication options available on the PC, the UP Xtreme i14 Edge would be just as suitable for the remote monitoring and control of industrial setups.

Outside the integrated CPU, GPU, and NPU of its Intel Core Ultra SoC, a key standout feature of the UP Xtreme i14 Edge is the fact it offers double the system memory of its predecessor, at 64 GB, as well as substantial upgrades to available display outputs. The UP Xtreme i14 Edge offers two HDMI 2.1 ports with Fixed Rate Link (FRL) technology for high bandwidth and improved display output quality. In addition to this, the system also contains one DP 1.2 port and a DP 1.4 interface via its USB Type-C port, giving users simultaneous 4K displays at 144 Hz.

Gear up for unparalleled mobile gaming with the new MSI Claw 8 AI+& Claw 7 AI+ refresh. Powered by the next-gen Intel Core Ultra 7 processor (Series 2), these two compact powerhouses combine exceptional performance with outstanding efficiency. Enjoy stunning visuals on vibrant displays, available in two sizes: 7-inch and the new 8-inch, enhanced by AI-driven precision.

Upgraded with larger batteries for longer gaming sessions and optimized power consumption for smoother performance. Designed for optimal comfort during intense gameplay, the Claw 8 AI+ and Claw 7 AI+ feature sleek ergonomic designs, advanced cooling technology, and comprehensive I/O ports for seamless connectivity. As the Copilot+ PC-capable handhelds available, they set a new standard for portable gaming.

TrendForce's latest investigations reveal that the global DRAM industry revenue reached US$26.02 billion in 3Q24, marking a 13.6% QoQ increase. The rise was driven by growing demand for DDR5 and HBM in data centers, despite a decline in LPDDR4 and DDR4 shipments due to inventory reduction by Chinese smartphone brands and capacity expansion by Chinese DRAM suppliers. ASPs continued their upward trend from the previous quarter, with contract prices rising by 8% to 13%, further supported by HBM's displacement of conventional DRAM production.

Looking ahead to 4Q24, TrendForce projects a QoQ increase in overall DRAM bit shipments. However, the capacity constraints caused by HBM production are expected to have a weaker-than-anticipated impact on pricing. Additionally, capacity expansions by Chinese suppliers may prompt PC OEMs and smartphone brands to aggressively deplete inventory to secure lower-priced DRAM products. As a result, contract prices for conventional DRAM and blended prices for conventional DRAM and HBM are expected to decline.

AAEON's UP brand, which began with the creation of the credit-card sized UP developer board almost a decade ago, has introduced the UP 710S, a modernized, slimline 85 mm x 56 mm single-board that retains the DNA of its iconic predecessor, but with the addition of new features and greater performance to reflect the technological advancements made over the years.

While the UP 710S retains the credit-card sized form factor of the original UP Board, AAEON has reduced the board's height by 10 mm in order to make the already compact board more suitable for deployment in space-constrained environments, with its height now measuring just 25.13 mm. While such a design change would typically require a tradeoff in the form of a reduction in I/O options, but the UP 710S maintains key functions like GPIO, I2C, SPI, and COM that were previously attainable via a 40-pin HAT through dedicated wafers.

Nintendo has officially announced that its next-generation Switch console will feature backward compatibility, allowing players to use their existing game libraries on the new system. However, those eagerly awaiting the console's release may need to exercise patience as launch expectations have shifted to early 2025. On the official X account, Nintendo has announced: "At today's Corporate Management Policy Briefing, we announced that Nintendo Switch software will also be playable on the successor to Nintendo Switch. Nintendo Switch Online will be available on the successor to Nintendo Switch as well. Further information about the successor to Nintendo Switch, including its compatibility with Nintendo Switch, will be announced at a later date."

While the original Switch evolved from a 20 nm Tegra X1 to a more power-efficient 16 nm Tegra X1+ SoC (both featuring four Cortex-A57 and four Cortex-A53 cores with GM20B Maxwell GPUs), the Switch 2 is rumored to utilize a customized variant of NVIDIA's Jetson Orin SoC, now codenamed T239. The new chip represents a significant upgrade with its 12 Cortex-A78AE cores, LPDDR5 memory, and Ampere GPU architecture with 1,536 CUDA cores, promising enhanced battery efficiency and DLSS capabilities for the handheld gaming market. With the holiday 2024 release window now seemingly off the table, the new console is anticipated to debut in the first half of 2025, marking nearly eight years since the original Switch's launch.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of PS-007A LPDDR5 CAMM2 Connector Performance Standard. The connector, referred to as "LP5CAMM2," is designed to offer a standardized modular LPDDR5 solution with ecosystem support, unlike the traditional LPDDR5 memory-down approach. Developed by JEDEC's JC-11 Committee for Mechanical Standardization, PS-007A is available for free download from the JEDEC website.

As compared to a DDR5 SODIMM connector, benefits of the LP5CAMM2 connector include:

• Better signal integrity (SI) and improved radio frequency interference (RFI)
• To enable a module solution with lower power consumption and increased battery life
• 50% form factor reduction with the similar Z height

Samsung Electronics today reported financial results for the third quarter ended Sept. 30, 2024. The Company posted KRW 79.1 trillion in consolidated revenue, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. Operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division. The strength of the Korean won against the U.S. dollar resulted in a negative impact on company-wide operating profit of about KRW 0.5 trillion compared to the previous quarter.

In the fourth quarter, while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels. Against this backdrop, the Company will concentrate on driving sales of High Bandwidth Memory (HBM) and high-density products. The Foundry Business aims to increase order volumes by enhancing advanced process technologies. Samsung Display Corporation (SDC) expects the demand of flagship products from major customers to continue, while maintaining a quite conservative outlook on its performance. The Device eXperience (DX) Division will continue to focus on premium products, but sales are expected to decline slightly compared to the previous quarter.

Details of what is claimed to be Google's upcoming Tensor G5 and G6 SoCs have popped up over on Notebookcheck.net and the site claims to have found the specs on a public platform, without going into any further details. Those that were betting on the Tensor G5—codenamed Laguna—delivering vastly improved performance over the Tensor G4, are likely to be disappointed, at least on the CPU side of things. As previous rumours have suggested, the chip is expected to be manufactured by TSMC, using its N3E process node, but the Tensor G5 will retain the single Arm Cortex-X4 core, although it will see a slight upgrade to five Cortex-A725 cores vs. the three Cortex-A720 cores of the Tensor G4. The G5 loses two Cortex-A520 cores in favour of the extra Cortex-A725 cores. The Cortex-X4 will also remain clocked at the same peak 3.1 GHz as that of the Tensor G4.

Interestingly it looks like Google will drop the Arm Mali GPU in favour of an Imagination Technologies DXT GPU, although the specs listed by Notebookcheck doesn't add up with any of the specs listed by Imagination Technologies. The G5 will continue to support 4x 16-bit LPDDR5 or LPDDR5X memory chips, but Google has added support for UFS 4.0 memory, something that's been a point of complaint for the Tensor G4. Other new additions is support for 10 Gbps USB 3.2 Gen 2 and PCI Express 4.0. Some improvements to the camera logic has also been made, with support for up to 200 Megapixel sensors or 108 Megapixels with zero shutter lag, but if Google will use such a camera or not is anyone's guess at this point in time.

The second generation of AMD Ryzen Z-series processors for handheld gaming consoles, will be led by the Ryzen Z2 Extreme. There will also be an affordable Ryzen Z2 (non-Extreme). We've known for some time that the Z2 Extreme is based on the 4 nm "Strix Point" monolithic silicon, with some optimization (the highest bins to facilitate the best energy efficiency); but now we have a few more details thanks to a leak by Golden Pig Upgrade. AMD's engineering effort with the Z2 Extreme will be to give the console the most generational performance uplift from the iGPU, rather than the CPU.

The "Strix Point" silicon features a significantly updated iGPU from the previous-generation "Phoenix." It's based on the more efficient RDNA 3.5 graphics architecture, which is better optimized for LPDDR5 memory; and comes with 16 compute units (CU), compared to 12 on the "Phoenix." The Ryzen Z2 Extreme will come with all 16 CU enabled. The CPU is where some interesting changes are planned. The "Strix Point" silicon features a dual-CCX CPU, one of these contains four "Zen 5" CPU cores sharing a 16 MB L3 cache, while the other features eight "Zen 5c" cores sharing an 8 MB L3 cache. For the Ryzen Z2 Extreme, AMD is going with an odd 3+5 core configuration. What this means is that the Ryzen Z2 Extreme will have 3 "Zen 5" cores, and 5 "Zen 5c" cores. The L3 cache on the CCX with "Zen 5" cores has been reduced to 8 MB in size. On paper, this is still an 8-core/16-thread CPU with 16 MB of L3 cache (same as "Phoenix,") but now you know that there's more going on.

Leading white box provider AAEON has released the FWS-2290, its most powerful desktop network appliance to date. The FWS-2290 is the first from the company's Network Security Division to feature Intel Processor N-series CPUs, with the Intel Processor N97 being the chosen default processor, but the full Intel Processor N-series range being supported.

This choice of CPU platform lends the FWS-2290 to use in Unified Threat Management (UTM) and Virtual Private Network (VPN) applications, given its inclusion of integrated security features such Intel Control-Flow Enforcement Technology (CET), Intel Advanced Encryption Standard Instructions (AES-NI), and Virtualization Technology for Directed I/O.

TrendForce's latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.

Smartphone brands continue to remain cautious despite some server OEMs continuing to show purchasing momentum. Consequently, TrendForce forecasts that Q4 memory prices will see a significant slowdown in growth, with conventional DRAM expected to increase by only 0-5%. However, benefiting from the rising share of HBM, the average price of overall DRAM is projected to rise 8-13%—a marked deceleration compared to the previous quarter.

NVIDIA has reportedly discontinued its dual-rack GB200 NVL36x2 GPU model, opting to focus on the single-rack GB200 NVL72 and NVL36 models. This shift, revealed by industry analyst Ming-Chi Kuo, aims to simplify NVIDIA's offerings in the AI and HPC markets. The decision was influenced by major clients like Microsoft, who prefer the NVL72's improved space efficiency and potential for enhanced inference performance. While both models perform similarly in AI large language model (LLM) training, the NVL72 is expected to excel in non-parallelizable inference tasks. As a reminder, the NVL72 features 36 Grace CPUs, delivering 2,592 Arm Neoverse V2 cores with 17 TB LPDDR5X memory with 18.4 TB/s aggregate bandwidth. Additionally, it includes 72 Blackwell GB200 SXM GPUs that have a massive 13.5 TB of HBM3e combined, running at 576 TB/s aggregate bandwidth.

However, this shift presents significant challenges. The NVL72's power consumption of around 120kW far exceeds typical data center capabilities, potentially limiting its immediate widespread adoption. The discontinuation of the NVL36x2 has also sparked concerns about NVIDIA's execution capabilities and may disrupt the supply chain for assembly and cooling solutions. Despite these hurdles, industry experts view this as a pragmatic approach to product planning in the dynamic AI landscape. While some customers may be disappointed by the dual-rack model's cancellation, NVIDIA's long-term outlook in the AI technology market remains strong. The company continues to work with clients and listen to their needs, to position itself as a leader in high-performance computing solutions.