SK hynix presented its leading memory solutions optimized for AI servers and AI PCs at Dell Technologies World (DTW) 2025 in Las Vegas from May 19-22. Hosted by Dell Technologies, DTW is an annual conference which introduces future technology trends. In line with DTW 2025's theme of "Accelerate from Ideas to Innovation," a wide range of products and technologies aimed at driving AI innovation was showcased at the event.

Based on its close partnership with Dell, SK hynix has participated in the event every year to reinforce its leadership in AI. This year, the company organized its booth into six sections: HBM, CMM (CXL Memory Module)-DDR5, server DRAM, PC DRAM, eSSDs, and cSSDs. Featuring products with strong competitiveness across all areas of DRAM and NAND flash for the AI server, storage and PC markets, the booth garnered strong attention from visitors.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs.

These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2025. The Company posted KRW 79.14 trillion in consolidated revenue, an all-time quarterly high, on the back of strong sales of flagship Galaxy S25 smartphones and high-value-added products. Operating profit increased to KRW 6.7 trillion despite headwinds for the DS Division, which experienced a decrease in quarterly revenue.

The Company has allocated its highest-ever annual R&D expenditure for 2024, and in the first quarter of this year, it has also increased its R&D expenditure by 16% compared to the same period last year, amounting to 9 trillion won. Despite the growing macroeconomic uncertainties due to recent global trade tensions and slowing global economic growth, making it difficult to predict future performance, the Company will continue to make various efforts to secure growth. Additionally, assuming that the uncertainties are diminished, it expects its performance to improve in the second half of the year.

Today, Chinese PC maker FEVM introduced the FA‑EX9 mini PC, powered by AMD's new Ryzen AI MAX+ 395 "Strix Halo" processor. This compact system measures just 192 × 190 × 55 mm (2 L volume) and packs 16 Zen 5 CPU cores alongside 40 RDNA 3.5 compute units (Radeon 8060S) and a dedicated XDNA 2 neural engine capable of 50 TOPS. FEVM configures the MAX+ 395 to run at up to 120 W sustained power, putting it in the same performance class as a Ryzen 9 9955HX paired with an RTX 4070 Laptop GPU. Memory comes as 128 GB of LPDDR5X on a 256‑bit bus, with up to 96 GB usable as video memory for large‑model inference. Storage is handled by dual M.2 PCIe 4.0 SSD slots, supporting up to 2 TB onboard and up to 16 TB total. The FA‑EX9 offers one HDMI 2.1 port, one DisplayPort 1.4, two USB4 Type‑C connectors for up to four 8K displays, and an OCuLink port for external GPU expansion. Inspiration for this mini PC seems to be NVIDIA's DGX Spark, which is Team Green's custom solution for local AI processing in an incredibly compact housing.

In comparison, NVIDIA's DGX Spark brings the GB10 Grace Blackwell superchip to a palm‑sized AI appliance. It combines a 20‑core Arm CPU cluster with a Blackwell GPU featuring next‑gen Tensor and RT cores, delivering up to 1,000 FP4 AI TOPS. The DGX Spark is built around 128 GB of unified LPDDR5X memory at 273 GB/s, up to 4 TB of self‑encrypting NVMe storage, four USB4 ports, one HDMI output, and a ConnectX‑7 SmartNIC providing 200 GbE networking for multi‑node clusters. Its chassis measures 150 × 150 × 50.5 mm (1.24 L volume) and draws approximately 170 W under load, with pricing starting at $2,999 for a 1 TB model or $3,999 for the 4 TB Founder's Edition, now available for preorder. While the FA‑EX9 balances general‑purpose computing, flexible GPU expansion, and high‑speed I/O for edge AI and creative professionals, the DGX Spark focuses on out‑of‑the‑box AI throughput and scale‑out clustering. The FA-EX9 is more of a general-purpose Swiss army knife, which can be used for anything from AI to gaming. Release date and pricing are still unknown.

Beelink has unveiled its latest mini PC, the SEi13 Pro. It runs on an Intel Core i9-13900HK processor and Intel Iris Xe Graphics. This compact computer measuring 135x135x44.7 mm uses a hybrid CPU setup with performance and efficiency cores making it suitable for multitasking. The SEi13 Pro can interact with voice commands due to its built-in mic, which gets a boost from a B1 AI chip. This technology offers smart audio pickup with 360-degree omnidirectional coverage, capable of recognizing human voices within a 5-meter radius while filtering out background noise. The mini PC has two built-in speakers enhanced by DSP and a professional amplifier. The cooling system draws air from the bottom of the unit, allowing for near-silent operation at just 32dB.

On the hardware side, the SEi13 Pro is equipped with 32 GB of LPDDR5 RAM from Micron and includes an SSD from Crucial. Storage expansion is possible through dual SSD slots that support up to 8 TB. A practical dustproof design is implemented with a high-density metal filter at the bottom, preventing dust accumulation. For connectivity, the SEi13 Pro supports triple-display output through HDMI (4K at 60 Hz), DisplayPort 1.4 (4K at 144 Hz), and a rear USB-C port, allowing users to connect multiple monitors simultaneously. The SEi13 Pro with 32 GB RAM and 1 TB SSD is listed at $539 on Beelink website in two color options, space gray and frost silver.

Altera Corporation, a leader in FPGA innovations, today announced production shipments of its Agilex 7 FPGA M-Series, the industry's first high-end, high-density FPGA to feature integrated high bandwidth memory and support for DDR5 and LPDDR5 memory technologies. Offering over 3.8 million logic elements, Agilex 7 FPGA M-Series is optimized for applications that demand the highest performance and highest memory bandwidth, including AI, data centers, next-generation firewalls, 5G communications infrastructure and 8K broadcast equipment.

As data traffic continues to increase exponentially due to the growth of AI, cloud computing and video streaming services, the demand for higher memory bandwidth, increased capacity, and improved power efficiency has never been greater. Agilex 7 FPGA M-Series addresses these challenges by offering users high logic densities, a high-performance fabric and a memory interface that accelerates data throughput speeds while reducing memory bottlenecks and latency.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

We dedicated a lot of our launch presentation of Framework Desktop to the Ryzen AI Max processor it uses, and for a good reason. These truly unique, ultra-high-performance parts are the culmination of decades of technology and architecture investments that AMD has made, going all the way back to their acquisition of ATI in 2006. For our first technical deep dive on Framework Desktop, we're going to go even deeper into Ryzen AI Max and what makes it a killer processor for gaming, workstation, and AI workloads.

What makes Ryzen AI Max special is a combination of three elements: full desktop-class Zen 5 CPU cores, a massive 40-CU Radeon RDNA 3.5 GPU, and a giant 256-bit LPDDR5x memory bus to feed the two, supporting up to 128 GB of memory. Chips and Cheese did an excellent technical overview of the processor with AMD that goes even deeper on this, and we'll pull out some of the highlights along with our own insights. We'll start with the CPUs. Ryzen AI Max supports up to 16 CPU cores split across two 4 nm FinFET dies that AMD calls CCDs. These dies are connected together using an extremely wide, low power, low latency bus across the package substrate. The CPUs are full Zen 5 cores with 512-bit FPUs and support for AVX-512, a vector processing instruction set otherwise only available on Intel's top end server CPUs. We're excited for you to see the multicore performance numbers these CPUs can do in our upcoming press review cycle!

On March 3, Longsys, a branded semiconductor memory enterprise, made its first-ever appearance at MWC 2025 in Barcelona. Under the theme "New Mode of Storage Empowering Global Mobility", it showcased a series of innovative storage products, attracting widespread attention.

PTM Business Model: Full-Stack Customization Service
The Product Technology Manufacturing (PTM) model was a major highlight, showcasing Longsys' full-stack customization capabilities—from in-house controller development and product design to rigorous testing and intelligent manufacturing.

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

According to South Korea's Money Today, SK hynix is currently engaged in the development of yet another variation of LPDDR5. The mega supplier of DRAM and flash memory chips has publicly disclosed its LPDDR5 Turbo (T) design—going back to late 2023; this iteration was advertised as the "world's fastest mobile memory standard." The first public demonstration of LPDDR5T (10533) was performed at last February's IEEE Solid State Circuit Conference. Currently, the familiar LPDDR5X standard is prevalent throughout commercial channels. Insiders believe that a proposed new "LPDDR5M" design will be released as a lower power alternative to LPDDR5X.

Insiders reckon that the unannounced LPDDR5M standard operates at lower voltages (reportedly 0.98 V), when compared to current offerings (X: 1.05 V). Given the nature of its acronym—Low Power Double Data Rate—this memory type was first devised with efficient operations in mind; ideal for mobile applications. An industry mole proposes that internal company discussions have highlighted a key percentage difference: "at maximum speed, LPDDR5M is ~8% more power efficient than LPDDR5X." The recent Money Today SK news article mentions that older LPDDR4 standards are classed as "legacy products" by company leadership. In contrast, LPDDR5 variants are (allegedly) categorized as "high value-added products." The rumored addition of LPDDR5M is viewed—by regional memory industry watchdogs—as a fortification (and diversification) of SK hynix's strategy; that already encompasses LPDDR5X and LPDDR5T. Tipsters posit that LPDDR5M memory is destined to feature inside next-gen smartphone devices with on-board AI capabilities.

Today, we introduced the Framework Desktop, a tiny 4.5L Mini-ITX desktop powered by AMD's massive new Ryzen AI Max processors. Pre-orders are open now, with first shipments in early Q3 2025. When AMD shared the Ryzen AI Max with us, we immediately knew we had to use it. It has up to 16 CPU cores at 5.1 GHz boost clock, discrete-level Radeon 8060S graphics, and support for up to an insane 128 GB of unified LPDDR5x. That enables 1440p or higher gaming on the heaviest titles, big creative and workstation workloads, and true local AI use cases. This is an absolute monster of a processor, and we shifted our roadmap a year ago to make space for it. In a desktop form factor, we get to unlock every bit of its performance with 120 W sustained power and 140 W boost while staying quiet and cool.

You may still be wondering, why does Framework need to build a desktop? Aren't desktops already modular and upgradeable? They are. In fact, the desktop PC ethos is part of what inspired the Framework Laptop to begin with. The desktop world is amazing. There is a broad, long-lived, interoperable ecosystem with hundreds of brands and hundreds of millions of consumers participating. You can build, upgrade, repair, and personalize to the limits of your imagination (and budget, and desk space), and share your amazing creations with all of the other true believers. We want to make this space as accessible as we possibly can by building a desktop that is simultaneously small and simple and incredibly powerful and customizable. Everyone should have the opportunity to experience the culture around PCs and PC gaming first-hand.

Micron Technology, Inc., today announced it is the first in the industry to ship samples of its 1γ (1-gamma), sixth-generation (10 nm-class) DRAM node-based DDR5 memory designed for next-generation CPUs to ecosystem partners and select customers. This 1γ DRAM milestone builds on Micron's previous 1α (1-alpha) and 1β (1-beta) DRAM node leadership to deliver innovations that will power future computing platforms from the cloud to industrial and consumer applications to Edge AI devices like AI PCs, smartphones and automobiles. The Micron 1γ DRAM node will first be leveraged in its 16 Gb DDR5 DRAM and over time will be integrated across Micron's memory portfolio to meet the industry's accelerating demand for high-performance, energy-efficient memory solutions for AI. Designed to offer speed capabilities of up to 9200 MT/s, the 16 Gb DDR5 product provides up to a 15% speed increase and over 20% power reduction compared to its predecessor.

NVIDIA and its memory partners, SK Hynix, Samsung, and Micron, are preparing a new memory form factor called System on Chip Advanced Memory Module—SOCAMM shortly. This technology, adapting to the now well-known CAMM memory module standard, aims to bring additional memory density to NVIDIA systems. Taking inspiration from NVIDIA's Project DIGITS, it has now been developed independently by NVIDIA outside of any official memory consortium like JEDEC. Utilizing a detachable module design, SOCAMM delivers superior specifications compared to existing solutions, featuring 694 I/O ports (versus LPCAMM's 644 and traditional DRAM's 260), direct LPDDR5X memory substrate integration, and a more compact form factor.

For reference, current-generation Project DIGITS is using NVIDIA GB10 Grace Blackwell Superchip capable of delivering one PetaFLOP of FP4 compute, paired with 128 GB of LPDDR5X memory. This configuration limits the size of AI models that run locally on the device, resulting in up to 200 billion parameter models running on a single Project DIGITS AI PC. Two stacked Project DIGITS PCs are needed for models like Llama 3.1 405B with 405 billion parameters. Most interestingly, memory capacity is the primary limiting factor; hence, NVIDIA devotes its time to developing a more memory-dense SOCAMM standard. Being a replacement compatible with LPDDR5, it can use the same controller silicon IP with only the SoC substrate being modified to fit the new memory. With NVIDIA rumored to enter the consumer PC market this year, we could also see an early implementation in consumer PC products, but the next-generation Project DIGITS is the primary target.

Thanks to a well-known industry leaker, Jaykihn, Intel's Panther Lake-H processor family, built on the 18A process node, features three distinct configurations, with several power profiles for each case. The flagship model combines four "Cougar Cove" P-cores, eight "Skymont" E-cores, and four LPE cores alongside a 12-core Xe3 "Celestial" GPU. This variant supports LPDDR5X memory exclusively and delivers 180 TOPS of computational power for local AI workloads, operating at 25 W PL1 (base) and 64 W PL2 (turbo) power levels. Secondary configurations include a 4P+8E+4LP+4Xe3 model and a 4P+0E+4LP+4Xe3 variant, both rated at 100 TOPS and supporting both LPDDR5X and DDR5 memory.

The entry-level model operates at 15 W PL1 with 44 W PL2 in baseline mode, scaling to 25 W PL1 and 55 W PL2 in performance mode. All variants feature Thunderbolt 4 connectivity, with high-end models incorporating expanded PCIe 5.0 lane configurations. The integrated Xe3 graphics architecture scales from four to 12 cores across the product stack, with the top SKU eliminating DDR5 compatibility in favor of LPDDR5X optimization. The Panther Lake processor family is slated for launch within the latter half of 2025, and it will be the company's leading 18A product. As a "Lunar Lake" successor, Panther Lake will deliver improved IPC and optimization for new cores in the same device form-factor like laptops, ultrabooks, and handhelds.

Qualcomm has announced its latest mid-range offering, dubbed the Snapdragon 6 Gen 4. Compared to its predecessor, the Snapdragon 6 Gen 3, the improvements on the CPU side are rather modest, with Qualcomm claiming an 11% improvement. The CPU, now based on TSMC N4, packs four ARMv9-based Cortex-A720 P-cores, along with four Cortex-A520 E-cores, making it an 8-core system as tradition. On the GPU side, however, a substantial 29% improvement has been asserted, although the specifics remain under wraps as of this writing.

The chipset can be paired with up to 16 GB of LPDDR5-3200 memory, and displays up to FHD+ at 144 Hz are supported. INT4 support is also present the new NPU, which should allow for decent on-device AI capabilities. Gaming performance should also witness a decent jump, thanks to the aforementioned GPU improvement, paired with Game Super Resolution (upscaling) and Frame Motion Engine (frame generation, every other frame). For connectivity, Wi-Fi 6E, Bluetooth 5.4, and 5G (mm Wave, sub-6 GHz) are present. Up to 200 MP single-camera systems are supported, with Snapdragon's LLV (Low Light Vision) technology, Of course, being a budget segment SoC, it would be futile to expect high-end photography capabilities. As for videography, 4k30 and 1080p120 are supported, along with HLG and HDR10.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

AAEON, a leader in industrial IoT and AI Edge solutions, has announced the release of two new SMARC modules, the uCOM-IMX93 and uCOM-ASL, powered by the NXP i.MX 93 Applications Processor Family and Intel Atom x7000RE Processor Series for the Edge, respectively. This news comes following the revival of AAEON's SMARC product line last year, which has since brought a range of x86 and RISC-based options to the market. The uCOM-IMX93 is equipped with the relatively low-power Arm Cortex -A55 and M33 processors as part of its NXP i.MX 93 platform, from which it also provides two native CAN 2.0 FD interfaces and integrated NXP 2D Graphic Acceleration functionality.

The module offers dual Gigabit Ethernet ports, one of which supports time sensitive networking, multiple GPIO and HDMI options, as well as optional TPM 2.0, making it well-suited to deployment in portable edge solutions like industrial HMI and smart building control solutions. Moreover, the module's extensive UART interfaces and -40°C to 85°C temperature range provide a low maintenance, efficient, and more easily deployed module suited to users that require low maintenance, rugged operation on the edge, with AAEON noting its Universal Update Utility (UUU) Serial Download Mode and aforementioned environmental specs as conducive to fleet management solution integration.

SK hynix Inc. announced today that it recorded best-ever yearly performance with 66.1930 trillion won in revenues, 23.4673 trillion won in operating profit (with an operating margin of 35%), and 19.7969 trillion won in net profit (with a net margin of 30%). Yearly revenues marked all-time high, exceeding the previous record in 2022 by over 21 trillion won and operating profit exceeded the record in 2018 during the semiconductor super boom.

In particular, fourth quarter revenues went up by 12% to 19.7670 trillion won, operating profit up 15% to 8.0828 trillion won (with an operating margin of 41%) from the previous quarter and net profit recorded 8.0065 trillion won (with a net margin of 41%). SK hynix emphasized that with prolonged strong demand for AI memory, the company achieved all-time high result through world-leading HBM technology and profitability-oriented operation. HBM continued its high growth in fourth quarter marking over 40% of total DRAM revenue and eSSD also showed constant increase in sales. With remarkable product competitiveness based profitability-oriented operation, the company established a stable financial condition which led to improved outcome.

ASUS today announced the next-generation ASUS Chromebook CR series of laptops, tailored to meet the needs of K-12 students. The ASUS Chromebook CR series stands out as the ideal companion for students, whether engaged in in-person classroom learning or remote education. The rugged and modular design, featuring replaceable internal parts, guarantees both durability and longevity. With 11.6-inch or 12.2-inch Corning Gorilla Glass touchscreens and a 180° lay-flat or 360°-flippable hinge, the laptops offer flexibility for enriched educational experiences. This design fosters the adventurous mindset of modern students, ensuring an enjoyable and secure learning journey, whether they're engaging in online courses or in-class sessions - ready for every learning journey.

A trusted study partner
For K-12 students, an everyday-use laptop should be invincible. With lively and active users, scratches and knocks are an almost-inevitable part of their daily routine, so the ASUS Chromebook CR series features an all-round rubber bumper for extra peace of mind. The laptops also feature a rugged design that's tested to meet or exceed the MIL-STD-810H US military-grade standard, and use tough Corning Gorilla Glass to protect the touchscreen from scratches. Additionally, the spill-resistant keyboard can cope with minor water spills without harm, so minor splashes on the desk or at the dinner table can be easily drained, cleaned, and dried. Finally, the special fingerprint-resistant finish keeps the laptop cleaner for longer.

Today marks the launch of the new ASUS Vivobook Pro 15 (N6506CU), the latest version of this high-performance 15.6-inch laptop designed for pro creators and pro gamers.

ASUS Vivobook Pro 15 offers seamless creativity and gaming with cutting-edge components: up to the latest Intel Core Ultra 9 processor (Series 2) with a built-in 13 TOPS NPU, NVIDIA GeForce RTX 4050 GPU with a low-latency MUX switch, 24 GB DDR5 RAM, and a 2 TB PCIe SSD. It boasts advanced ASUS IceCool Pro cooling technology that enables up to a 125-watt combined thermal design power (TDP).

Lenovo announced the latest additions to its Lenovo Legion ecosystem of gaming devices, accessories, and software today at CES 2025, delivering a deep bench of devices across a wide range of form-factors that give gamers of all levels powerful options to game their way in pursuit of 'reaching their impossible'. These new devices include:

• The Lenovo Legion Go S (8", 1) and Lenovo Legion Go S (8", 1) - Powered by SteamOS, gaming handheld devices featuring an 8-inch screen with VRR support, a chassis sporting fused TrueStrike controllers with adjustable trigger switches and hall-effect joysticks, and the world's first officially licensed handheld powered by SteamOS.
• The Lenovo Legion Go (8.8", 2), a gaming handheld prototype device planned to feature a native landscape OLED display, up to double the RAM compared to previous generation, and a bigger battery.
• The redesigned Lenovo Legion Pro 7i (16", 10), Lenovo Legion Pro 5i (16", 10) and Lenovo Legion Pro 5 (16", 10) laptops, with new aggressive design language, more performance, and new Lenovo PureSight OLED display options.
• A fully redesigned Legion Space gaming software solution that unifies all Lenovo Legion device settings, syncs with all Lenovo Legion ecosystem devices, provides access to all games in one library, and features a suite of new AI-powered features that help gamers up their game, their streams, and their enjoyment.
• The Lenovo Legion Pro 34WD-10 monitor, a PureSight OLED display with gaming-specific features to give competitive gamers an edge on the map.
• Lenovo also announced other new additions to its Legion and LOQ laptops and desktops, the latest Legion Tab, and a selection of Legion accessories to complement the gaming devices.

ASUS Republic of Gamers (ROG) today announced the arrival of the 2025 ROG Flow Z13, a powerful gaming tablet. This versatile 2-in-1 gaming machine now features the brand new ultra-powerful AMD Ryzen AI Max+ 395 with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

Nintendo Switch 2 promises to be this year's big (well small) gaming platform launch. It goes up against a growing ecosystem of handhelds based on x86-64 mobile processors running Windows, its main play would have to be offering a similar or better gameplay experience, but with better battery life, given that all of its hardware is purpose-built for a handheld console, and runs a highly optimized software stack; and the SoC forms a big part of this. Nintendo turned to NVIDIA for the job, given its graphics IP leadership, and its ability to integrate it with Arm CPU IP in a semi-custom chip. Someone with access to a Switch 2 prototype, likely an ISV, took the device apart, revealing the chip, a die-shrunk version of the Tegra T239 from 2023.

It's important to note that prototype consoles physically appear nothing like the final product, they're just designed so ISVs and game developers can validate them, and together with PC-based "official" emulation, set up the ability to develop or port games to the new platform. The Switch 2 looks very similar to the original Switch, it is a large tablet-like device, with detachable controllers. The largest chip on the mainboard is the NVIDIA Tegra T239. Nintendo Prime shared more details about the chip.

TrendForce's latest investigations reveal that the DRAM market is expected to face downward pricing pressure in 1Q25 as seasonal weakness aligns with sluggish consumer demand for products like smartphones. Additionally, early stockpiling by notebook manufacturers—over potential import tariffs under the Trump administration—has further exacerbated the pricing decline.

Conventional DRAM prices are projected to drop by 8% to 13%. However, if HBM products are included, the anticipated price decline will range from 0% to 5%.