TrendForce reports indicate a universal price increase for both DRAM and NAND Flash starting in the fourth quarter. DRAM prices, for instance, are projected to see a quarterly surge of about 3-8%. Whether this upward momentum can be sustained will hinge on the suppliers' steadfastness in maintaining production cuts and the degree of resurgence in actual demand, with the general-purpose server market being a critical determinant.

PC DRAM: DDR5 prices, having already surged in the third quarter, are expected to maintain their upward trajectory, fueled by the stocking of new CPU models. This forthcoming price hike cycle for both DDR4 and DDR5 is incentivizing PC OEMs to proceed with purchases. Although manufacturers still have substantial inventory and there's no imminent shortage, Samsung has been nudged to further slash its production. However, facing negative gross margins on DRAM products, most manufacturers are resistant to further price reductions, instead pushing for aggressive increases. This stance sets the stage for an anticipated rise in DDR4 prices by 0-5% and DDR5 prices by around 3-8% in the fourth quarter. Overall, as DDR5 adoption accelerates, an approximate 3-8% quarterly increase is projected for PC DRAM contract prices during this period.

Professionals working in harsh environments require not only rugged durability but portable solutions that don't weigh them down in the field. Dell Technologies' new Rugged product achieves this combination. In fact, it is the world's lightest 10-inch fully rugged Windows tablet. Featuring a robust ecosystem of accessories and hot-swappable batteries for extended performance, the 7030 Rugged Extreme Tablet was designed for workers who spend most of their time away from a desk. So, whether you're on the factory line, in a machine shop or atop a snowy mountain, the 7030 Rugged Extreme Tablet will make for the ultimate companion.

Dell's Most Portable Fully Rugged Tablet
Marrying durability and mobility, the 7030 Rugged Extreme Tablet is Dell's most portable fully rugged tablet. Its lightweight 2.2-pound chassis and convenient accessories mean the tablet won't feel unwieldy, so your muscles get relief during a long shift on the warehouse floor, at the scene of an accident or when navigating construction sites.

Micron Technology, Inc., today announced it has extended its industry-leading 1β (1-beta) process node technology with the introduction of 16Gb DDR5 memory. With demonstrated in-system functionality at speeds up to 7,200 MT/s, Micron's 1β DDR5 DRAM is now shipping to all data center and PC customers. Micron's 1β-based DDR5 memory with advanced high-k CMOS device technology, 4-phase clocking and clock-sync provides up to a 50% performance uplift and 33% improvement in performance per watt over the previous generation.

As CPU core counts increase to meet the demands of data center workloads, the need for higher memory bandwidth and capacities grows significantly to overcome the 'memory wall' challenge while optimizing the total cost of ownership for customers. Micron's 1β DDR5 DRAM allows computational capabilities to scale with higher performance enabling applications like artificial intelligence (AI) training and inference, generative AI, data analytics, and in-memory databases (IMDB) across data center and client platforms. The new 1β DDR5 DRAM product line offers current module densities in speeds ranging from 4,800 MT/s up to 7,200 MT/s for use in data center and client applications.

Intel's next-generation Lunar Lake processor has appeared in the SiSoftware Sandra benchmarking suite, and the online database has revealed many details, thanks to a spotting by @Olrak29 of X/Twitter. Considering Intel's Meteor Lake is still two months away from its launch, the presence of Lunar Lake's benchmarks is indeed intriguing. Interestingly, Intel showcased a Lunar Lake laptop at the Intel Innovation 2023 event, and this SiSoft entry might be related to that demo. The data from SiSoft details the system as a "Genuine Inte l(R) 0000 1.00 GHz (5M 20c 3.91 GHz + 2.61 GHz, 3.3 GHz IMC, 4x 2.5 MB + 4 MB L2, 2x 8 MB L3)," hinting at a "Lunar Lake Client System (Intel LNL-M LP5 RVP1)." Deciphering these details, the Lunar Lake system adopts a 4+4 core configuration, utilizing a mix of Lion Cove and Skymont architecture cores tailored for performance and efficiency.

Moreover, the benchmark report pegs this CPU as a low-power laptop variant with a 17 W TDP. While it operates at a 1.0 GHz base frequency, it reached a speed of 3.91 GHz during the testing. However, these numbers should be taken cautiously since it's likely an engineering sample. Cache details are outlined, suggesting a 2.5 MB L2 cache per P-core, an added 4 MB L2 cache for E-cores, and a 16 MB L3 cache. No details on the integrated GPU were revealed, although it's anticipated that Lunar Lake will house Intel's Xe2-LPG graphics and LPDDR5 system memory. Intel has shared that Lunar Lake is scheduled for a 2024 release in mobile/laptop devices, targeting performance-per-watt leadership. Arrow Lake processors, catering to desktops, might share the core architecture and are anticipated to launch around the same timeframe.

The adage that a person's home is their castle has never been truer than today. Our home is our sanctuary, our getaway, a place where we can relax. But it's also so much more than that. It has become a place where we work, where we exercise and as a gamer, where I play.

Like most people, my typical day starts in the kitchen with a cup of coffee. I often move out to the patio overlooking the yard and answer a few early morning messages before heading to my home office. If I'm lucky, I can take a brain break around lunch and watch a quick episode of my latest binge. After work, I'll grab my yoga mat for a quick workout in spare room, followed by a video chat with my good friend in Taiwan from the living room. And as my friend tells me, she seeks quiet refuge for our chat anywhere in the house where the kids aren't blasting out their latest hip hop tunes. Then I try to close the day by chilling out in the comfort of my bedroom for a quick check of my next day's calendar and urgent emails.

ASUS today announced ASUS Chromebook Plus CX34, a compact, lightweight and cost-effective all-rounder 14-inch laptop that's ideal for users seeking enhanced productivity and creativity on the go. Chromebook Plus laptops offer up to double the speed, double the memory, and double the storage—and Chromebook Plus CX34 is the very first Chromebook Plus from ASUS. ASUS Chromebook Plus Enterprise CX34 built with ChromeOS business device manageability will be released this year mid-November.

Powerful, portable and primed to push productivity further, ASUS Chromebook Plus CX34 sports a stylish and durable design that weighs a mere 1.44 kg and is packed with features to help users achieve more. These include AI-powered tools and apps powered by an up to Intel Core i7 processor, as well as a 180° lay-flat hinge, expansive 5.7-inch touchpad, fast, stable WiFi 6 and up to 10-hour battery life to enable energetic individuals to power through everyday work and play. The all-new laptop is available in Pearl White or Rock Grey colorways, exuding understated modern style.

Acer today launched the company's first Chromebook Plus laptops, the Acer Chromebook Plus 515 and Acer Chromebook Plus 514, debuting with Google's Chromebook Plus initiative that offers a new tier of Chromebook performance, emphasizing better hardware designs with upgraded displays and cameras, and paired with new productivity, creativity, and multimedia capabilities.

The Acer Chromebook Plus 515 and Acer Chromebook Plus 514 both have the hardware and technology features customers need to stay productive, entertained and connected. These new models are powered by modern high-performance processors, and high-resolution IPS displays and 1080p crystal clear cameras flanked by narrow bezels to keep the focus on the vibrant visuals.

The rumors of Nintendo's next-generation Switch handheld gaming console have been piling up ever since the competition in the handheld console market got more intense. Since the release of the original Switch, Valve has released Steam Deck, ASUS made ROG Ally, and others are also exploring the market. However, the next-generation Nintendo Switch 2 is closer and closer, as we have information about the chipset that will power this device. Thanks to Kepler_L2 on Twitter/X, we have the codenames of the upcoming processors. The first generation Switch came with NVIDIA's Tegra X1 SoC built on a 20 nm node. However, later on, NVIDIA supplied Nintendo with a Tegra X1+ SoC made on a 16 nm node. There were no performance increases recorded, just improved power efficiency. Both of them used four Cortex-A57 and four Cortex-A53 cores with GM20B Maxwell GPUs.

For the Nintendo Switch 2, NVIDIA is said to utilize a customized variant of NVIDIA Jetson Orin SoC for automotive applications. The reference Orin SoC carries a codename T234, while this alleged adaptation has a T239 codename; the version is most likely optimized for power efficiency. The reference Orin design is a considerable uplift compared to the Tegra X1, as it boasts 12 Cortex-A78AE cores and LPDDR5 memory, along with Ampere GPU microarchitecture. Built on Samsung's 8 nm node, the efficiency would likely yield better battery life and position the second-generation Switch well among the now extended handheld gaming console market. However, including Ampere architecture would also bring technologies like DLSS, which would benefit the low-power SoC.

When it comes to Intel powered mini PCs, Zotac is one of the main players in the market and its latest addition, the ZBOX Pro PI339 pico is an almost pocket friendly PC based on an Intel Processor N100. For those not familiar with Intel's N-range of CPUs, these are pretty much the E-cores from Intel's higher-end chips and Intel offers a range of options from two to eight cores. The N100 is a quad core part that peaks at a 3.4 GHz turbo frequency, has 6 MB of cache and a 6 W TDP. Zotac has paired the CPU with a somewhat meagre 4 GB of LPDDR5/LPDDR5X memory and there's no way to add more RAM to this system.

Storage is handled by a single M.2 slot that's compatible with PCIe 3.0 x4 NVMe or SATA drives up to 2280 in size. In terms of connectivity the ZBOX Pro PI339 pico has a pair of HDMI 2.1 ports that are limited to 4K output at 60 Hz, two USB 3.2 Gen 2 (10 Gbps) Type A ports, a Gigabit Ethernet port and a barrel plug for power input. It's unfortunate that Zotac didn't go with USB-C for the power input, as it would've made the ZBOX far easier to power, since the supplied power adapter only outputs 20 Watts. There's also onboard WiFi 6 and Bluetooth 5.2 support, although the rather large antennas are a somewhat odd addition to the small PC. Zotac claims to support Windows 11 / Windows 10 IoT ENT LTSC 2021, Ubuntu 20.04.5 LTS Linux, but most likely any flavour of Linux should work. The ZBOX Pro PI339 pico measures 115 x 76 x 27 mm (WxDxH) and has a volume of a mere 0.27 litres. No word on pricing as yet.

During a recent demonstration, Intel showcased its cutting-edge packaging technologies, EMIB (embedded multi-die interconnect bridge) and Foveros, unveiling the highly-anticipated Meteor Lake processor with integrated LPDDR5X memory. This move appears to align with Apple's successful integration of LPDDR memory into its M1 and M2 chip packages. At the heart of Intel's presentation was the quad-tile Meteor Lake CPU, leveraging Foveros packaging for its chiplets and boasting 16 GB of Samsung's LPDDR5X-7500 memory. Although the specific CPU configuration remains undisclosed, the 16 GB of integrated memory delivers a remarkable peak bandwidth of 120 GB/s, outperforming traditional memory subsystems using DDR5-5200 or LPDDR5-6400.

Nevertheless, this approach comes with trade-offs, such as the potential for system-wide failure if a memory chip malfunctions, limited upgradeability in soldered-down configurations, and the need for more advanced cooling solutions to manage CPU and memory heat. While Apple pioneered on-package LPDDR memory integration in client CPUs, Intel has a history of using package-on-package DRAM with its Atom-branded CPUs for tablets and ultrathin laptops. While this approach simplifies manufacturing, enabling slimmer notebook designs, it curtails configuration flexibility. We are yet to see if big laptop makers such as Dell, HP, and Asus, take on this design in the coming months.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has begun supplying the industry's first 24-gigabyte (GB) Low Power Double Data Rate 5X (LPDDR5X) mobile DRAM package to its customers, following the mass production of LPDDR5X in November 2022. SK hynix, in January, developed LPDDR5T, which is an upgraded product of LPDDR5X prior to the development of the 8th generation LPDDR6, and is currently processing customer validation.

"The company integrated the High-K Metal Gate (HKMG) process in the 24 GB LPDDR5X package, enabling the product to deliver outstanding power efficiency and performance," said SK hynix. "The addition of the 24 GB package to our mobile DRAM product portfolio has given us a more flexibility in accommodating customers' needs."

Valve's Steam Deck handheld gaming console has launched with 16 GB of LPDDR5 memory running at 5500 MT/s. This is distributed over four 32-bit channels for 88 GB/s total bandwidth memory bandwidth. While the storage option can be upgraded, the memory is limited to 16 GB, and the memory chips are soldered. However, it seems like that problem can also be solved only if you are a professional and can solder well. Thanks to the Balázs Triszka on Twitter/X, we have witnessed a mod of Steam Deck, where memory gets upgraded from 16 to 32 GB.

The modder successfully bumped up the system memory using Samsung's LPDDR5 K3LKCKC0BM-MGCP memory chips. All it was needed was some experience with ball grid array (BGA) resoldering. No glue was under the chips, and they were easy to remove. You can see the pictures below, and the system shows the higher memory count.

Every week, Zheng Jiong (ZJ), Intel China's senior director of Client Customer Engineering in the Client Computing Group (CCG), and his team of engineers make the hourlong drive across Shanghai to meet with their counterparts at Lenovo. They make a beeline to the new Advanced System Innovation Lab deep inside Lenovo's offices. It's here that engineers from both companies pool their collective brainpower to solve some of the world's toughest hardware and software challenges - the ones that pave the path to lighter, sleeker and ever-more-powerful laptops that many consumers and businesses depend on every day. This new 750-square-foot lab, which opened in July, is filled with cutting-edge tech tools and laptop prototypes in various stages of development. It's one of many joint engineering labs across the world populated by Intel and Lenovo engineers.

Joint labs like these allow engineers to focus on solving tough issues-- ones that need to be addressed to prevent product delays or empty holiday gift boxes.
Said ZJ: "We share a long and illustrious history of deep engineering collaboration with Lenovo." He added that Intel has dedicated engineers tasked with specific roles in enabling and developing new designs together with their lead collaborator. "We work together very well and are thankful for the innovation support Lenovo has given us through joint labs like these."

Samsung Electronics today reported financial results for the second quarter ended June 30, 2023. The Company posted KRW 60.01 trillion in consolidated revenue, a 6% decline from the previous quarter, mainly due to a decline in smartphone shipments despite a slight recovery in revenue of the DS (Device Solutions) Division. Operating profit rose sequentially to KRW 0.67 trillion as the DS Division posted a narrower loss, while Samsung Display Corporation (SDC) and the Digital Appliances Business saw improved profitability.

The Memory Business saw results improve from the previous quarter as its focus on High Bandwidth Memory (HBM) and DDR5 products in anticipation of robust demand for AI applications led to higher-than-guided DRAM shipments. System semiconductors posted a decline in profit due to lower utilization rates on weak demand from major applications.

SK hynix Inc. today reported financial results for the second quarter of 2023. The company recorded revenue of 7.306 trillion won, operating loss of 2.882 trillion won (with operating margin of negative 39%), and net loss of 2.988 trillion won (with net margin of negative 41%) for the three-month period ended June 30, 2023.

"Amid an expansion in generative artificial intelligence (AI) market, which has largely been centered on ChatGPT, demand for AI server memory has increased rapidly," the company said. "As a result, sales of premium products such as HBM3 and DDR5 increased, leading to a 44% sequential increase in revenue for the second quarter, while operating loss narrowed by 15%."

It looks like the monolithic silicon that succeeds "Phoenix," codenamed "Strix Point," will finally introduce an increase in CPU core counts for the thin-and-light and ultraportable mobile platforms. "Strix Point" is codename for the next-generation APU die being developed at AMD, which, according to a leaked MilkyWay@Home benchmark result, comes with a 12-core/24-thread CPU.

The silicon is identified by MilkyWay@Home with the OPN "AMD Eng Sample: 100-000000994-03_N," and CPU identification string "AuthenticAMD Family 26 Model 32 Stepping 0 -> B20F00." The "Strix Point" CPU could be the second time AMD has increased CPU core-counts per CCX. From "Zen 3" onward, the company increased the cores per CCX from 4 to 8, allowing a single "Zen 3" CCX on the "Cezanne" monolithic silicon to come with 8 cores. It's highly likely that with "Zen 5," the company is increasing the cores/CCX to 12, and that "Strix Point" has one of these CCXs.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

Dynabook Americas, Inc., a leading provider of professional-grade laptops, today introduced its refreshed ultralight Portégé X30L-K which includes the new hybrid-architecture 13th Gen Intel Core P-Series 28 W processors. Weighing a mere 904 grams1, this professional grade laptop is configurable with 14 core CPUs, up to 32 GB of LPDDR5 memory, ultra-fast SSD, Wi-Fi 6E and choice of a vivid IGZO or multitouch 13.3-inch displays driven by Intel Iris Xe graphics, the Portégé X30L-K delivers uncompromising performance all day long.

The Portégé X30L-K comes standard with Windows 11 Pro to provide enhanced productivity features that deliver users a more personalized and intuitive user experience than previous generations of the operating system. The Portégé X30L-K is among the most secure laptops in the world and meets Microsoft's strict Secured-core PC requirements and addresses the security and manageability challenges posed by the accelerated shift towards flexible working patterns.

Synopsys, Inc. today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs. This agreement expands Synopsys' collaboration with Samsung to enhance the Synopsys IP offering for Samsung's advanced 8LPU, SF5, SF4 and SF3 processes and includes Foundation IP, USB, PCI Express, 112G Ethernet, UCIe, LPDDR, DDR, MIPI and more. In addition, Synopsys will optimize IP for Samsung's SF5A and SF4A automotive process nodes to meet stringent Grade 1 or Grade 2 temperature and AEC-Q100 reliability requirements, enabling automotive chip designers to reduce their design effort and accelerate AEC-Q100 qualification. The auto-grade IP for ADAS SoCs will include design failure mode and effect analysis (DFMEA) reports that can save months of development effort for automotive SoC applications.

"Our extensive co-optimization efforts with Samsung across both EDA and IP help automotive, mobile, HPC, and multi-die system architects cope with the inherent challenges of designing chips for advanced process technologies," said John Koeter, senior vice president of product management and strategy for IP at Synopsys. "This extension of our decades-long collaboration provides designers with a low-risk path to achieving their design requirements and quickly launching differentiated products to the market."

AAEON's UP brand, known for its sophisticated developer board range, have announced the release of the UP Squared i12, the smallest developer board with 12th Generation Intel Core /Celeron Processor 7000 Series Processors. The 85.6 mm x 90 mm form factor is the latest to move into its third generation, and much like recent releases from the brand's UP Xtreme and UP Squared Pro collections, the UP Squared i12 displays a number of distinct upgrades on its predecessor.

With 12th Generation Intel Core processors and onboard LPDDR5 on such a tiny board, the UP Squared i12 targets a number of key markets with its potential to be deployed as a low-cost, space-efficient, and high-performance foundation for developers to work with. AAEON believe the greater bandwidth speed offered by the board's LPDDR5 will be beneficial to projects in the smart retail space, being particularly suited to applications such as frictionless shopping and intelligent vending machines.

SK hynix Inc. announced today that it has completed the development of the industry's most advanced 1bnm, the fifth-generation of the 10 nm process technology, while the company and Intel began a joint evaluation of 1bnm and validation in the Intel Data Center Certified memory program for DDR5 products targeted at Intel Xeon Scalable platforms.

The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10 nm technology. The DDR5 products provided to Intel run at the world's fastest speed of 6.4 Gbps (Gigabits per second), representing a 33% improvement in data processing speed compared with test-run products in early days of DDR5 development.

Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node. Micron will be the first semiconductor company to bring EUV technology to Japan for production, with its Hiroshima fab playing a critical role in the company's development of the 1-gamma node. Micron expects to invest up to 500 billion yen in 1-gamma process technology over the next few years, with close support from the Japanese government, to enable the next wave of end-to-end technology innovation such as rapidly emerging generative artificial intelligence (AI) applications.

With each successive advancement in process technology to scale memory cells and advance performance, Micron enables increased memory density, improvement in power efficiency and lower cost per bit, helping to unlock new opportunities for digitization, sustainability and green transformation, and automation. The introduction of 1-gamma follows the development of Micron's 1-beta (1β), the industry's most advanced DRAM node today, which Micron mass produces in its Hiroshima fab. Micron continues to make progress on its EUV integration plans and expects to ramp EUV into production on the 1-gamma node in Taiwan and Japan from 2025 onwards.

TrendForce's latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

TrendForce reports that the significant drop in DRAM prices was mostly attributed to high inventory levels of DDR4 and LPDDR5 as PC DRAM, server DRAM, and mobile DRAM collectively account for over 85% of DRAM consumption. Meanwhile, the market share for DDR5 remains relatively low.

MINISFORUM is proud to unveil its latest series of office solutions, the Venus Series UN100 and UN305 Mini-PCs. These devices are designed to offer a superior office experience in a compact form factor, powered by advanced Intel N series processors (Intel N100 & Intel Core i3-N305) that provide significant performance improvements over entry-level products.

With up to 16 GB of LPDDR5-4800 on-board memory, M.2-2280 SATA SSD storage, and an expansion slot for a 2.5-inch hard drive and a TF card, UN100 and UN305 deliver quiet, energy-efficient, and reliable operation. The all-metal unibody design, manufactured using advanced CNC machining technology with a 0.6 L volume (136 mm long x 121 mm width x 39 mm height), offers a sleek and elegant appearance while maintaining exceptional portability without compromising on performance.