Today, AMD introduced the new Ryzen Z1 Series processors, the ultimate high-performance processor for handheld PC gaming consoles. The Ryzen Z1 Series features two high performance processors, the Ryzen Z1 and Ryzen Z1 Extreme, both offering industry-leading gaming experiences, uncompromising battery life, and featuring AMD RDNA 3 architecture-based graphics. AMD is partnering with Asus to launch the first Ryzen Z1 Series device with the Asus ROG Ally, a premium handheld PC console, featuring up to a Ryzen Z1 Extreme processor.

"At AMD, we're continually advancing the next generation of gaming experiences, from consoles to desktops to on-the-go handheld devices," said Jason Banta, corporate vice president and general manager, Client OEM at AMD. "Ryzen Z1 processors deliver gamers an elite gaming experience and extreme portability in exciting gaming form factors."

Acer today announced new TravelMate business laptops, all powered by 13th Gen Intel Core vPro processors, and feature 16:10 premium OLED displays, 65 Wh fast charging long battery life, and secured log-in with fingerprint reader or IR camera, coming together to achieve the performance and mobility requirements of today's hybrid workforce.

Acer TravelMate P6 14
The latest TravelMate P6 14 is the ultimate premium business laptop for mobile professionals and executives. Professionals can experience elevated viewing experiences on a large screen surface with a 2.8K OLED (2880x1800) display panel, a 16:10 aspect ratio, and support for 100% coverage of the DCI-P3 color space. Powered by Intel vPro, and an Intel Evo design, the high-end business laptop is packed with power as it comes with 13th Gen Intel Core i7 processors, 32 GB LPDDR5 memory and a 65 Wh[1] fast-charging battery. Online business meetings and video calls are further enhanced with the laptop's FHD IR webcam, AI-powered noise-reduction technology through Acer PurifiedVoice, and upward-facing speakers with DTS Audio. A PrivacyPanel feature helps obscure viewing angles beyond 90° to defend against prying eyes. The TravelMate P6 14 laptop also features 2x2 Wi-Fi 6E and 5G connectivity for faster and stronger wireless internet connection needed by mobile professionals.

Today at the Amplify Partner Conference, HP Inc. announced new products and solutions to usher in the next era of hybrid work for everyone with a comprehensive set of computing solutions for hybrid flexibility. With only 22 percent of workers describing themselves as 'thriving' in hybrid work, it's clear companies are still figuring out how to make hybrid work. "Most companies want to move past the 'forced return' to the office era of hybrid work," said Alex Cho, President of Personal Systems, HP Inc. "The challenge is, they're not sure how to. We believe the future is hybrid flexibility, which delivers the best of the home and the office to workers everywhere."

According to HP's Future of Work study, 80 percent of workers want to be in the office some of the time, but many companies continue to struggle to get workers back in the office. HP research suggests that the most significant barrier to a return to office is a sub-optimal technology experience. In fact, 89 percent say technology is the most important factor driving return to office decisions. Similarly, of those who report thriving in hybrid work, 90 percent believe that access to the right technology and tools leads to a positive work experience. To accelerate employees' return to work, the right technology is required for optimal work setups, enabling success for companies and their employees.

Dynabook Americas, Inc., formerly Toshiba PC Company, has announced that it has refreshed its ultralight Portégé X40L-K and performance-rich 14-inch Tecra A40-K and 15-inch Tecra A50-K laptops to include the new hybrid-architecture 13th Gen Intel Core P-Series 28 W processors. All three laptops also include Windows 11 Pro standard for an enhanced productivity and intuitive computing experience.

"Next generation computing solutions capable of exceeding the demands of modern businesses and individuals is vital to Dynabook's success," said James Robbins, general manager, Dynabook Americas, Inc. "The addition of the 13th Gen Intel Core processors with our own mobile innovations allows Dynabook to deliver uncompromising, premium mobile computing solutions that seamlessly integrate into any business or learning environment. The immense power these three new laptops deliver demonstrates Dynabook's unrelenting commitment to producing the market's best professional-grade computing solutions."

Intel today expanded its 13th Gen Core "Raptor Lake" client processor family into the commercial segment. Devices in this segment are bought in bulk by large businesses and enterprises; the processors powering them have certain in-built device security and remote management features that enforce company policy regardless of where the employees take the devices. Intel has been pioneering hardware-level remote-management and device security features for close to two decades now, with its vPro feature-set (originally launched as Centrino vPro in the 2000s. The new 13th Gen Core vPro lineup covers popular processor models across various device form-factor classes, spanning ultraportables (15 W or below), thin-and-light commercial notebooks (28 W to 35 W segment); mainstream commercial notebooks (45 W to 55 W); and commercial desktops (65 W).

The 13th Gen vPro series have a lot in common with the 12th Gen Core vPro series, At a hardware-level, these are processors based on the same "Raptor Lake" silicon as the mainstream-client 13th Gen Core processors, but with the enhanced vPro Management Engine that interacts with a compatible operating system to offer endpoint remote manageability for administrators. The desktop versions of these chips have identical SKU differentiation to 65 W 13th Gen Core processors already launched, but with either vPro or vPro Essentials feature-sets. Something similar applies to the 15 W U-segment, 28 W P-segment, and 35-45 W H-segment Core vPro processors. Along with these processors, Intel is debuting Q700-series chipsets specific to the form-factor. For U- and P-segment mobile processor SKUs, the core-logic is part of the processor package; while the H-segment and S-segment (desktop) processors come with discrete chipsets. With the 13th Gen, Intel is also standardizing a new WiFi 6E (Gig+) WLAN chipset with vPro features.

LG Electronics USA announced pricing and availability of its 2023 LG gram Style laptops at LG.com and select LG-authorized retailers. Created for those who love to express their unique style wherever they go, the LG gram Style laptops will be offered in 16- and 14-inch versions (models 16Z90RS and 14Z90RS). Exclusively available at LG.com from March 20, 2023 to April 16, 2023, customers can now get a 32 GB memory LG gram Style laptop for the price of a 16 GB model of the same screen size.

The LG gram Style features an elegant glass design that changes color when viewed from different angles. The focus on design continues inside the new laptop where a "hidden" haptic touch-pad with soft LED backlighting illuminates at the user's touch. Maintaining its reputation for its lightweight portability, the gram Style weighs under 3 pounds.

ASUS today announced Vivobook 13 Slate OLED (T3304), the new generation of this fun-filled 13.3-inch detachable 2-in-1 laptop that makes it make it easier to enjoy everything, everywhere. With its vivacious styling and versatile design, Vivobook 13 Slate OLED is a brilliant all-rounder. Its combination of a brilliant 13.3-inch OLED Dolby Vision Pantone Validated touchscreen and a quad-speaker Dolby Atmos sound system makes it the perfect choice for on-the-go entertainment.

Creativity is a cinch with the handy ASUS Pen 2.0, an MPP 2.0-compliant stylus with 4096 pressure levels, four swappable tips, and convenient one-click Bluetooth functions via a shortcut button. A speedy new eight-core Intel Core processor is faster and delivers better battery life than its predecessor, and is backed by a 512 GB PCIe SSD and up to 8 GB of fast LPDDR5 memory. The magnetically-attached keyboard, large touchpad, and a cover stand make it endlessly adaptable to any situation, and users can enjoy easy connectivity via the dual USB-C ports, audio jack and microSD card reader.

SK hynix Inc. (or "the company") reported today financial results for 2022 ended on December 31. The company recorded revenues of 44.648 trillion won, an operating profit of 7.007 trillion won and a net income of 2.439 trillion won. Operating and net profit margin for the full year was 16% and 5%, respectively. "Revenues continued to grow last year, but the operating profit decreased compared with a year earlier as the industry entered into a downturn from the second half," the company said. "With uncertainties still lingering, we will continue to reduce investments and costs, while trying to minimize the impact of the downturn by prioritizing markets with high growth potential."

In 2022, SK hynix increased high-capacity DRAM shipments for server/PC markets, while boosting sales of DDR5 and HBM - of which products that the company has a solid market leadership - to customers in the growing markets of AI, Big Data, and cloud computing. Particularly, revenues for the data center SSD more than quadrupled compared with a year earlier.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

ASUS today announced the 15.6-inch Vivobook Go 15 OLED (E1504F) and 14-inch Vivobook Go 14 (E1404F), two exciting and affordable lifestyle laptops that help make users productive or keep them entertained, wherever they go. These light and compact laptops feature superior OLED (E1504F) or IPS (E1404F) displays and powerful ASUS SonicMaster sound systems with DTS Audio Processing for immersive entertainment. The design is stylish and practical, with thoughtful touches that make the user's life easier, such as a 180° lay-flat hinge. Built to survive any lifestyle, these tough laptops are US military-grade tested for durability using the world's strictest test regime.

Speedy performance for any task is assured by up to AMD Ryzen 5 7000-series processors, 16 GB of LPDDR5 RAM and a 512 GB PCIe SSD. Other user-friendly features include an ASUS ErgoSense keyboard; smart conferencing via the HD webcam with ASUS 3D Noise Reduction (3DNR), AI noise cancelation, and a physical privacy shield; and a useful suite of ASUS apps including MyASUS, GlideX and ScreenXpert 3.

SK hynix Inc. announced today that it has developed the world's fastest mobile DRAM 'LPDDR5T (Low Power Double Data Rate 5 Turbo)' and provided sample products to customers. The new product, LPDDR5T, operates at a data rate of 9.6 gigabits per second (Gbps), 13% faster than the previous generation LPDDR5X unveiled in November 2022. To highlight the maximum speed the product features, SK hynix added 'Turbo' at the end of the standard name LPDDR5.

LPDDR5T, which operates in the ultra-low voltage range of 1.01 to 1.12 V set by the JEDEC (Joint Electron Device Engineering Council), is a product that not only features utmost speed but ultra-low power consumption. "The company pushed the technology to new limits in just two months after LPDDR5X, mobile DRAM with 8.5 Gbps specification, was introduced to the market in November 2022," SK hynix said. "We will solidify our leadership in the mobile DRAM market by providing products of various storage capacities that meet customers' needs."

Qualcomm has been working on its Snapdragon SoCs for quite some time now, with massive success in the mobile phone space. However, the company's processors needed to be up to the task regarding laptops. For a user to not look at x86 offerings, the only remaining performant alternatives are Apple's M processors. In 2021 Qualcomm purchased the Nuvia team that was developing massively efficient and high-performance IP for laptops, similar to Apple M processors. Today, according to the insights from Kuba Wojciechowski (@Za_Raczke) on Twitter, we have some potential information about the upcoming Nuvia-powered SoC codenamed Hamoa.

According to the Twitter thread, Qualcomm's Hamoa processors are part of the Snapdragon 8xc Gen 4 compute platform and feature up to eight high-performance P-cores and four low-power E-cores, all based on Nuvia's IP. Allegedly the P-cores are being tested at 3.4 GHz, while the E-cores are tested at 2.5 GHz. The SoC splits CPU cores into blocks, each being a four-core group with 12 MB of shared L2 cache. There is also an 8 MB L3 cache structure; it needs to be clarified whether it is per core block or for the entire SoC. The chip employs 12 MB of system-level cache, with 4 MB of memory for graphics-related tasks handled by iGPU. The iGPU of choice is Adreno 740, with all modern APIs supported. Discrete graphics solutions are supported by the top-end SKUs, which allow eight PCIe 4.0 lanes to be directed toward dGPU, along with an additional four PCIe 4.0 lanes for NVMe SSD. For RAM, the chip uses up to 64 GBs of LPDDR5X eight-channel memory with up to 4.2 GHz speeds. Chip's media engines are structured to support decoding up to 4K120 and encode up to 4K60 with AV1.

AAEON, a leading manufacturer of AI development solutions, announces the UP Xtreme i12 Edge, its latest addition to the UP product series. The UP Xtreme i12 Edge makes substantial upgrades on its predecessor with the power-efficient multicore architecture of 12th Generation Intel Core i7/i5/i3/Celeron Processors (formerly Alder Lake-P), onboard LPDDR5, and AI module support all contributing to its potential as a system suited to industrial, healthcare, and transport applications.

Providing exceptional expansion options, the UP Xtreme i12 Edge has four M.2 Keys for Wi-Fi 6, 5G, AI and PCIe 4.0 storage module support. With such options, users are able to bring edge AI computing capabilities to a wider variety of markets. Further, the UP Xtreme i12 Edge supports Intel Iris Xe graphics, Intel DL Boost, and the Intel Distribution of OpenVINO Toolkit, boosting GPU image classification inferencing performance by up to 2.81 times that of the previous generation.

The AORUS brand of GIGABYTE originated with gaming notebooks. At the 2023 International CES, AORUS presented a large number of gaming notebooks covering various market-segments, powered by the latest-generation 13th Gen Core "Raptor Lake" mobile processors, and GeForce RTX 40-series "Ada" Laptop GPUs. The AORUS 17X (17-inch) and AORUS 15X (15-inch) are the company's key performance gaming notebooks. Both come with 1440p Fast IPS 240 Hz displays, and rock an Intel Core i7-13700HX 8P+8E processor. The company didn't specify the GPU model in use, but we expect options to range from the RTX 4060 Laptop GPU, all the way up to the RTX 4090 Laptop GPU. 16 GB dual-channel DDR5-4800 memory, and 1 TB Gen 4 NVMe SSDs make for the rest of the specs.

GIGABYTE has a special treat for creators on the move, with the AERO 16 OLED (16-inch) and AERO 14 OLED (14-inch). As their names suggest, they feature OLED displays. These come with 16:10 aspect-ratio displays. The 14-inch model rocks a 2560 x 1600 pixels resolution, and the 16-inch one does 3840 x 2400 pixels. Both displays are Samsung AMOLED sourced, and Pantone validated for a very wide color gamut. The 14-inch model is powered by a Core i7-13700HX 8P+8E processor and 16 GB of LPDDR5 memory; while the 16-inch model rocks a Core i9-13900H 6P+8E processor with 32 GB of DDR5-4800 memory. Both come with a variety of RTX 40-series Laptop GPU options, and 1 TB of Gen 4 NVMe storage.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

AMD today launched two distinct kinds of mobile processors, the Ryzen 7045 "Dragon Range" serves the 45 W H- and HX-segments of performance and enthusiast notebooks with CPU core counts of up to 16-core/32-thread; while the U-segment, P-segment, and a portion of the H-segment (ranges of 15 W, 28 W, and 35 W), will be led by the Ryzen 7040 "Phoenix Point." Unlike the "Dragon Range" MCM, "Phoenix Point" is a monolithic silicon built entirely on the TSMC 4 nm EUV foundry node, and introduces a wealth of process-level and system-level power-management features.

AMD "Phoenix Point" combines an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a powerful iGPU based on the latest RDNA3 graphics architecture, and a feature-packed AI acceleration engine based on the XDNA architecture AMD built after the Xilinx acquisition. The CPU component is a fully-fledged "Zen 4" CCX, with 8 CPU cores featuring 1 MB of dedicated L2 cache per-core, and sharing a large 32 MB L3 cache. This is an increase from the previous generation "Rembrandt" and "Cezanne" dies that had a reduced 16 MB L3 shared among the eight "Zen 3" or "Zen 3+" CPU cores.

Acer today debuts the first models in its new Acer Swift Go line, adding to the award-winning Swift family of notebooks designed for today's mobile professionals, creators, and students. In addition, the new Acer Swift X 14 and Acer Swift 14 were launched with new modern designs, the latest performance technologies, and all the tools to help users stay productive and connected on the go. The Swift Go, Swift X 14 and Swift 14 models highlight new ultraportable designs that are incredibly sleek and stylish. Incorporating well-considered features such as angular edges and structural lines result in a more refined look for these notebooks, appealing to highly mobile customers seeking a more confident look and feel.

The Acer Swift laptop line has also been a recipient of numerous accolades in recent years, with the Swift Edge being named a CES 2023 Innovation Awards honoree. "Our new Swift laptops kick off 2023 with all-new designs that are elevated, modern, and offer a striking visual appeal," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "The new Swift laptops do not only look good but house an impressive array of the latest technologies and features including OLED and high-resolution displays, long-lasting batteries and new 13th Gen Intel Coreprocessors that deliver first-class performance."

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading brand of personal computers, is introducing new members of the AERO Creator Laptop Series with the 13th Gen. Intel Core Processors and NVIDIA GeForce RTX 40 Series Laptop GPUs: AERO 16 OLED and AERO 14 OLED. As the world is lifting lockdown restrictions, the wheels of the world economy have been revived toward the path of recovery. However, post-pandemic work patterns have become the new norm. Consumers' screen time is prolonged due to hybrid work patterns and working from home, whereas the frequency of business trips has also been rising.

GIGABYTE conducted in-depth analyses about the criticality of screens for creators on the move, which leads to the development of OLED eye-protection laptops with the world's strictest dual color calibration. With the new laptops, consumers will not only get to enjoy the visual feasts but also be prepared for highly productive creation processes. The GIGABYTE AERO Series has been targeting creators, designers, and office workers, offering strict color accuracy, low blue light eye-protection technology, and lightweight for high mobility as its main features. In terms of product design, after undergoing 88 CNC forging processes, the thorough tempering gives the laptop an exquisite appearance, elegant like a masterpiece of fine art. The "Illusory Iridescent" design concept added more quality details to the silky smooth texture, bringing a touch of aesthetic and inspiration to all work hours. The practicality of the creator laptops is once again elevated and now graced with a sleek artistic sense.

Intel today debuted its 2023 N-series entry-level mobile processors targeting a range of low-cost notebook applications, such as educational notebooks for bulk purchase and distribution by public schools. These processors are built on the same Intel 7 (10 nm Enhanced SuperFin) node as the 13th Gen Core processors, but come with just "Gracemont" E-cores, and no P-cores.

The silicon physically features two "Gracemont" E-core clusters amounting to 8 E-cores, 6 MB of shared L3 cache, and an iGPU based on the Xe-LP graphics architecture, with 32 EUs (execution units). The silicon also features a GNI 3.0 for basic AI acceleration using a truncated version of the DLBoost instruction set, and an IPU (as in image processing unit), which can improve web-camera experience (on the fly background noise suppression). The iGPU also offers hardware-accelerated AV1 decoding. On the platform-side, the processor features a single-channel DDR5 memory interface that's backwards-compatible with DDR4, and also supports LPDDR5. Storage interfaces include eMMC, UFS 2.1, and NVMe SSD. Wireless networking options available with the platform include fast WiFi 6E and Bluetooth 5.2.

Ahead of CES 2023, Lenovo unveiled its latest ThinkPad X1 laptops featuring recycled materials, updated Lenovo Commercial Vantage software designed to highlight feature settings that can help improve energy efficiency, and a new Lenovo View application offering advanced computer vision technology for enhanced video image quality and tools for collaboration, security, and digital wellness. The latest line of ThinkVision monitors leads with the ultra-bright ThinkVision P27pz-30 and P32pz-30 mini-LED displays followed by ThinkVision's new T-series VOIP monitors built for hybrid work, featuring an integrated Microsoft Teams functionality, 5MP cameras, dual microphones, and speakers. Lenovo also introduced its latest professional-grade 4K ThinkVision P-series monitors and, for the home, new value-conscious Lenovo L-series monitors. Completing an efficient hybrid eco-system are new Lenovo accessories, including the unique Lenovo Go Desk Station, Lenovo Go 4K Pro Webcam, and Lenovo Professional Wireless Rechargeable Combo Keyboard and Mouse.

In line with its vision of achieving net-zero by 2050 aligned to Science Based Target initiatives, Lenovo continues to focus on supporting a circular economy by increasing the use of recycled materials in its products and packaging, and collaborating with industry partners to help increase energy efficiency of its devices. This includes working with suppliers and global logistics providers to decrease the emissions released in its supply chain and take every opportunity to increase the energy efficiency in Lenovo's factories and workplaces.

TECNO, a global innovative technology brand with operations in over 70 markets, recently announced the latest MEGABOOK S1 at TECNO Flagship Product Launch 2022 in Dubai, delivering its first flagship laptop to users.

In 2019, TECNO announced new efforts in building a digital product ecosystem by launching its AIoT business strategy, aiming to deliver digital to every person, home, and organization and help them create a fully- connected smart digital lifestyle. Following this vision, as the upgraded line of MEGABOOK T1, the flagship MEGABOOK S1 highlights the concept of ideas that create wonders, targeting users in professional fields like business and the creative industries, helping them work with ease while still achieving a higher efficiency.

Adding to its incredibly popular UP Xtreme product line, industry leader AAEON has announced the release of the UP Xtreme i12, the next generation developer board with 12th Generation Intel Core Processors (formerly Alder Lake-P). Improving upon the 11th Generation Intel Core Processor SoC of its predecessor, the UP Xtreme i11, AAEON's next-generation UP Xtreme i12 utilizes the 12 core, 16 thread hybrid architecture of 12th Generation Intel Core Processors, making it more energy-efficient despite possessing double the previous generation's thread count. With these improvements, the UP Xtreme i12 offers up to 20% greater CPU performance, while also hosting 32 GB onboard LPDDR5 system memory, which provides double the bandwidth and memory capacity of the previous generation.

The UP Xtreme i12's configuration of HDMI 2.0b, eDP 1.4, and two DP 1.4 slots give it the necessary tools to host four simultaneous 4K displays, alongside USB 4.0 and 2.5 GbE ports ensuring high-speed connectivity to peripheral cameras. Compounding this powerful, efficient function is the 2.47 x increase in graphics speed provided by Intel Iris Xe graphics, which makes the board an excellent candidate for smart retail deployments.

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

SK hynix Inc. reported today revenues of 10.98 trillion won, operating profit of 1.66 trillion won (with OP margin of 15%), and net income of 1.1 trillion won (with net income margin 10%) in the third quarter of 2022. Sales and operating profits decreased 20.5%, 60.5% respectively QoQ. SK hynix analyzed that revenues fell QoQ as both sales volume and price decreased due to sluggish demand for DRAM and NAND products amid worsening macroeconomic environment worldwide. In addition, SK hynix explained that despite the company improved cost competitiveness by increasing the sales proportion and yield of the latest 1anm DRAM and 176-layer 4D NAND, operating profit also decreased due to greater price drop than cost reduction.

SK hynix diagnosed that the semiconductor memory industry is facing an unprecedented deterioration in market conditions as uncertainties in the business environment continued. The deterioration occurred as the shipments of PCs and smartphone manufacturers, which are major buyers of memory chips, have decreased.