During a recent demonstration, Intel showcased its cutting-edge packaging technologies, EMIB (embedded multi-die interconnect bridge) and Foveros, unveiling the highly-anticipated Meteor Lake processor with integrated LPDDR5X memory. This move appears to align with Apple's successful integration of LPDDR memory into its M1 and M2 chip packages. At the heart of Intel's presentation was the quad-tile Meteor Lake CPU, leveraging Foveros packaging for its chiplets and boasting 16 GB of Samsung's LPDDR5X-7500 memory. Although the specific CPU configuration remains undisclosed, the 16 GB of integrated memory delivers a remarkable peak bandwidth of 120 GB/s, outperforming traditional memory subsystems using DDR5-5200 or LPDDR5-6400.

Nevertheless, this approach comes with trade-offs, such as the potential for system-wide failure if a memory chip malfunctions, limited upgradeability in soldered-down configurations, and the need for more advanced cooling solutions to manage CPU and memory heat. While Apple pioneered on-package LPDDR memory integration in client CPUs, Intel has a history of using package-on-package DRAM with its Atom-branded CPUs for tablets and ultrathin laptops. While this approach simplifies manufacturing, enabling slimmer notebook designs, it curtails configuration flexibility. We are yet to see if big laptop makers such as Dell, HP, and Asus, take on this design in the coming months.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has begun supplying the industry's first 24-gigabyte (GB) Low Power Double Data Rate 5X (LPDDR5X) mobile DRAM package to its customers, following the mass production of LPDDR5X in November 2022. SK hynix, in January, developed LPDDR5T, which is an upgraded product of LPDDR5X prior to the development of the 8th generation LPDDR6, and is currently processing customer validation.

"The company integrated the High-K Metal Gate (HKMG) process in the 24 GB LPDDR5X package, enabling the product to deliver outstanding power efficiency and performance," said SK hynix. "The addition of the 24 GB package to our mobile DRAM product portfolio has given us a more flexibility in accommodating customers' needs."

Valve's Steam Deck handheld gaming console has launched with 16 GB of LPDDR5 memory running at 5500 MT/s. This is distributed over four 32-bit channels for 88 GB/s total bandwidth memory bandwidth. While the storage option can be upgraded, the memory is limited to 16 GB, and the memory chips are soldered. However, it seems like that problem can also be solved only if you are a professional and can solder well. Thanks to the Balázs Triszka on Twitter/X, we have witnessed a mod of Steam Deck, where memory gets upgraded from 16 to 32 GB.

The modder successfully bumped up the system memory using Samsung's LPDDR5 K3LKCKC0BM-MGCP memory chips. All it was needed was some experience with ball grid array (BGA) resoldering. No glue was under the chips, and they were easy to remove. You can see the pictures below, and the system shows the higher memory count.

Every week, Zheng Jiong (ZJ), Intel China's senior director of Client Customer Engineering in the Client Computing Group (CCG), and his team of engineers make the hourlong drive across Shanghai to meet with their counterparts at Lenovo. They make a beeline to the new Advanced System Innovation Lab deep inside Lenovo's offices. It's here that engineers from both companies pool their collective brainpower to solve some of the world's toughest hardware and software challenges - the ones that pave the path to lighter, sleeker and ever-more-powerful laptops that many consumers and businesses depend on every day. This new 750-square-foot lab, which opened in July, is filled with cutting-edge tech tools and laptop prototypes in various stages of development. It's one of many joint engineering labs across the world populated by Intel and Lenovo engineers.

Joint labs like these allow engineers to focus on solving tough issues-- ones that need to be addressed to prevent product delays or empty holiday gift boxes.
Said ZJ: "We share a long and illustrious history of deep engineering collaboration with Lenovo." He added that Intel has dedicated engineers tasked with specific roles in enabling and developing new designs together with their lead collaborator. "We work together very well and are thankful for the innovation support Lenovo has given us through joint labs like these."

Samsung Electronics today reported financial results for the second quarter ended June 30, 2023. The Company posted KRW 60.01 trillion in consolidated revenue, a 6% decline from the previous quarter, mainly due to a decline in smartphone shipments despite a slight recovery in revenue of the DS (Device Solutions) Division. Operating profit rose sequentially to KRW 0.67 trillion as the DS Division posted a narrower loss, while Samsung Display Corporation (SDC) and the Digital Appliances Business saw improved profitability.

The Memory Business saw results improve from the previous quarter as its focus on High Bandwidth Memory (HBM) and DDR5 products in anticipation of robust demand for AI applications led to higher-than-guided DRAM shipments. System semiconductors posted a decline in profit due to lower utilization rates on weak demand from major applications.

SK hynix Inc. today reported financial results for the second quarter of 2023. The company recorded revenue of 7.306 trillion won, operating loss of 2.882 trillion won (with operating margin of negative 39%), and net loss of 2.988 trillion won (with net margin of negative 41%) for the three-month period ended June 30, 2023.

"Amid an expansion in generative artificial intelligence (AI) market, which has largely been centered on ChatGPT, demand for AI server memory has increased rapidly," the company said. "As a result, sales of premium products such as HBM3 and DDR5 increased, leading to a 44% sequential increase in revenue for the second quarter, while operating loss narrowed by 15%."

It looks like the monolithic silicon that succeeds "Phoenix," codenamed "Strix Point," will finally introduce an increase in CPU core counts for the thin-and-light and ultraportable mobile platforms. "Strix Point" is codename for the next-generation APU die being developed at AMD, which, according to a leaked MilkyWay@Home benchmark result, comes with a 12-core/24-thread CPU.

The silicon is identified by MilkyWay@Home with the OPN "AMD Eng Sample: 100-000000994-03_N," and CPU identification string "AuthenticAMD Family 26 Model 32 Stepping 0 -> B20F00." The "Strix Point" CPU could be the second time AMD has increased CPU core-counts per CCX. From "Zen 3" onward, the company increased the cores per CCX from 4 to 8, allowing a single "Zen 3" CCX on the "Cezanne" monolithic silicon to come with 8 cores. It's highly likely that with "Zen 5," the company is increasing the cores/CCX to 12, and that "Strix Point" has one of these CCXs.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

Dynabook Americas, Inc., a leading provider of professional-grade laptops, today introduced its refreshed ultralight Portégé X30L-K which includes the new hybrid-architecture 13th Gen Intel Core P-Series 28 W processors. Weighing a mere 904 grams1, this professional grade laptop is configurable with 14 core CPUs, up to 32 GB of LPDDR5 memory, ultra-fast SSD, Wi-Fi 6E and choice of a vivid IGZO or multitouch 13.3-inch displays driven by Intel Iris Xe graphics, the Portégé X30L-K delivers uncompromising performance all day long.

The Portégé X30L-K comes standard with Windows 11 Pro to provide enhanced productivity features that deliver users a more personalized and intuitive user experience than previous generations of the operating system. The Portégé X30L-K is among the most secure laptops in the world and meets Microsoft's strict Secured-core PC requirements and addresses the security and manageability challenges posed by the accelerated shift towards flexible working patterns.

Synopsys, Inc. today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs. This agreement expands Synopsys' collaboration with Samsung to enhance the Synopsys IP offering for Samsung's advanced 8LPU, SF5, SF4 and SF3 processes and includes Foundation IP, USB, PCI Express, 112G Ethernet, UCIe, LPDDR, DDR, MIPI and more. In addition, Synopsys will optimize IP for Samsung's SF5A and SF4A automotive process nodes to meet stringent Grade 1 or Grade 2 temperature and AEC-Q100 reliability requirements, enabling automotive chip designers to reduce their design effort and accelerate AEC-Q100 qualification. The auto-grade IP for ADAS SoCs will include design failure mode and effect analysis (DFMEA) reports that can save months of development effort for automotive SoC applications.

"Our extensive co-optimization efforts with Samsung across both EDA and IP help automotive, mobile, HPC, and multi-die system architects cope with the inherent challenges of designing chips for advanced process technologies," said John Koeter, senior vice president of product management and strategy for IP at Synopsys. "This extension of our decades-long collaboration provides designers with a low-risk path to achieving their design requirements and quickly launching differentiated products to the market."

AAEON's UP brand, known for its sophisticated developer board range, have announced the release of the UP Squared i12, the smallest developer board with 12th Generation Intel Core /Celeron Processor 7000 Series Processors. The 85.6 mm x 90 mm form factor is the latest to move into its third generation, and much like recent releases from the brand's UP Xtreme and UP Squared Pro collections, the UP Squared i12 displays a number of distinct upgrades on its predecessor.

With 12th Generation Intel Core processors and onboard LPDDR5 on such a tiny board, the UP Squared i12 targets a number of key markets with its potential to be deployed as a low-cost, space-efficient, and high-performance foundation for developers to work with. AAEON believe the greater bandwidth speed offered by the board's LPDDR5 will be beneficial to projects in the smart retail space, being particularly suited to applications such as frictionless shopping and intelligent vending machines.

SK hynix Inc. announced today that it has completed the development of the industry's most advanced 1bnm, the fifth-generation of the 10 nm process technology, while the company and Intel began a joint evaluation of 1bnm and validation in the Intel Data Center Certified memory program for DDR5 products targeted at Intel Xeon Scalable platforms.

The move comes after SK hynix became the first in the industry to reach 1anm readiness and completed Intel's system validation of the 1anm DDR5, the fourth-generation of the 10 nm technology. The DDR5 products provided to Intel run at the world's fastest speed of 6.4 Gbps (Gigabits per second), representing a 33% improvement in data processing speed compared with test-run products in early days of DDR5 development.

Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node. Micron will be the first semiconductor company to bring EUV technology to Japan for production, with its Hiroshima fab playing a critical role in the company's development of the 1-gamma node. Micron expects to invest up to 500 billion yen in 1-gamma process technology over the next few years, with close support from the Japanese government, to enable the next wave of end-to-end technology innovation such as rapidly emerging generative artificial intelligence (AI) applications.

With each successive advancement in process technology to scale memory cells and advance performance, Micron enables increased memory density, improvement in power efficiency and lower cost per bit, helping to unlock new opportunities for digitization, sustainability and green transformation, and automation. The introduction of 1-gamma follows the development of Micron's 1-beta (1β), the industry's most advanced DRAM node today, which Micron mass produces in its Hiroshima fab. Micron continues to make progress on its EUV integration plans and expects to ramp EUV into production on the 1-gamma node in Taiwan and Japan from 2025 onwards.

TrendForce's latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

TrendForce reports that the significant drop in DRAM prices was mostly attributed to high inventory levels of DDR4 and LPDDR5 as PC DRAM, server DRAM, and mobile DRAM collectively account for over 85% of DRAM consumption. Meanwhile, the market share for DDR5 remains relatively low.

MINISFORUM is proud to unveil its latest series of office solutions, the Venus Series UN100 and UN305 Mini-PCs. These devices are designed to offer a superior office experience in a compact form factor, powered by advanced Intel N series processors (Intel N100 & Intel Core i3-N305) that provide significant performance improvements over entry-level products.

With up to 16 GB of LPDDR5-4800 on-board memory, M.2-2280 SATA SSD storage, and an expansion slot for a 2.5-inch hard drive and a TF card, UN100 and UN305 deliver quiet, energy-efficient, and reliable operation. The all-metal unibody design, manufactured using advanced CNC machining technology with a 0.6 L volume (136 mm long x 121 mm width x 39 mm height), offers a sleek and elegant appearance while maintaining exceptional portability without compromising on performance.

If something seems too good to be true, then it often is and the earlier rumoured price point of the "vanilla" ASUS ROG Ally at US$499.99 was apparently one such instance. Pricing information from serial Twitter leaker SnoopyTech suggests it will instead be priced at US$599.99, which seems a lot more realistic. Aside from using the 6-core CPU with a more limited GPU, the cheaper ROG Ally will also see its internal storage cut in half to 256 GB, compared to 512 GB for the "Extreme" version.

The rest of the specs appear to be identical, with both models sporting 16 GB of LPDDR5 memory, the 7-inch, 120 Hz 1080p display and possibly even the same 40 Whr battery pack. At US$70 more than the equivalent Steam Deck, it might be a tough sell, especially as it's only US$100 to upgrade to the fully featured version, a much smaller cost increase compared to each of the Steam Deck SKUs, where you're looking at spending more to get more. It could simply be that this is a sales tactic by ASUS, to push most of its potential customers to buy the more expensive model.

ASUS's sensational handheld game console, the ROG Ally, will be priced at $699.99 for the model powered by the top AMD Ryzen Z1 Extreme processor, according to a leak by SnoopyTech. This top model will feature a 7-inch Full HD screen with 120 Hz refresh-rate, and Dolby Atmos-capable audio. Under the hood, the Ryzen Z1 is based on the 4 nm "Phoenix" silicon, featuring an 8-core/16-thread "Zen 4" CPU, and its full Navi3 iGPU based on the RDNA3 graphics architecture, with 12 CU (768 stream processors). This chip is wired to 16 GB of LPDDR5 memory, and a 512 GB NVMe SSD.

ASUS has a cheaper model of the ROG Ally designed for cloud gaming and casual gaming, powered by the Ryzen Z1 (non-Extreme). The non-Extreme Z1 rocks a 6-core/12-thread "Zen 4" CPU, but a heavily cut down iGPU with just 4 CU (256 stream processors), which are plenty for the intended use-cases. ASUS could price this much lower than the top model, with speculations pointing to $499.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

LattePanda launched the powerful and hackable single board server, the LattePanda Sigma. With its super computing power, this device opens up endless possibilities for tech enthusiasts, developers, small businesses & enterprises. With its innovative design and unique features, the LattePanda Sigma is poised to redefine the world of single board servers and drive innovation to new heights.

The LattePanda Sigma is powered by the 13th-generation Intel Core i5-1340P Rapter Lake (12-Core, 16-Thread) processor and features Intel Iris Xe Graphics, providing optimal graphics performance. Its optimized power consumption minimizes power usage by almost 50%, making it an eco-friendly choice. With 16 GB of high-speed Dual-Channel LPDDR5-6400 MHz RAM, the LattePanda Sigma can handle even the most demanding tasks with ease, making it perfect for graphic design, gaming, and video editing.

ASUS ROG Ally, the company's handheld game console that started out as an April Fool's joke before being announced as a serious product development and ASUS's answer to the Steam Deck, is a lean-mean gaming machine powered by the AMD Ryzen Z1 Extreme processor. Announced earlier today, the Z1 Extreme is a highly power-optimized version of the 4 nm "Phoenix" silicon that packs an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, along with its full-config iGPU based on the latest RDNA3 graphics architecture, with 12 CU (768 stream processors), and an LPDDR5 memory interface.

On the ROG Ally, the Z1 Extreme is configured with a 1.70 GHz CPU clock-speed, along with a 2.10 GHz iGPU engine clock. Multiplayer Italy went hands-on with the ROG Ally, and showed off a gameplay of "DOOM Eternal," where the ROG Ally pumps out 71 FPS, with an SoC power-draw of 25.7 W, and an SoC temperature of just 56°C. ASUS and AMD are expected to give the ROG Ally the full spectrum of software-level optimizations suitable for the device, such as dynamic resolution (Radeon Boost), which should hold frame-rates above 60 FPS at all times.

Today, AMD introduced the new Ryzen Z1 Series processors, the ultimate high-performance processor for handheld PC gaming consoles. The Ryzen Z1 Series features two high performance processors, the Ryzen Z1 and Ryzen Z1 Extreme, both offering industry-leading gaming experiences, uncompromising battery life, and featuring AMD RDNA 3 architecture-based graphics. AMD is partnering with Asus to launch the first Ryzen Z1 Series device with the Asus ROG Ally, a premium handheld PC console, featuring up to a Ryzen Z1 Extreme processor.

"At AMD, we're continually advancing the next generation of gaming experiences, from consoles to desktops to on-the-go handheld devices," said Jason Banta, corporate vice president and general manager, Client OEM at AMD. "Ryzen Z1 processors deliver gamers an elite gaming experience and extreme portability in exciting gaming form factors."

Acer today announced new TravelMate business laptops, all powered by 13th Gen Intel Core vPro processors, and feature 16:10 premium OLED displays, 65 Wh fast charging long battery life, and secured log-in with fingerprint reader or IR camera, coming together to achieve the performance and mobility requirements of today's hybrid workforce.

Acer TravelMate P6 14
The latest TravelMate P6 14 is the ultimate premium business laptop for mobile professionals and executives. Professionals can experience elevated viewing experiences on a large screen surface with a 2.8K OLED (2880x1800) display panel, a 16:10 aspect ratio, and support for 100% coverage of the DCI-P3 color space. Powered by Intel vPro, and an Intel Evo design, the high-end business laptop is packed with power as it comes with 13th Gen Intel Core i7 processors, 32 GB LPDDR5 memory and a 65 Wh[1] fast-charging battery. Online business meetings and video calls are further enhanced with the laptop's FHD IR webcam, AI-powered noise-reduction technology through Acer PurifiedVoice, and upward-facing speakers with DTS Audio. A PrivacyPanel feature helps obscure viewing angles beyond 90° to defend against prying eyes. The TravelMate P6 14 laptop also features 2x2 Wi-Fi 6E and 5G connectivity for faster and stronger wireless internet connection needed by mobile professionals.

Today at the Amplify Partner Conference, HP Inc. announced new products and solutions to usher in the next era of hybrid work for everyone with a comprehensive set of computing solutions for hybrid flexibility. With only 22 percent of workers describing themselves as 'thriving' in hybrid work, it's clear companies are still figuring out how to make hybrid work. "Most companies want to move past the 'forced return' to the office era of hybrid work," said Alex Cho, President of Personal Systems, HP Inc. "The challenge is, they're not sure how to. We believe the future is hybrid flexibility, which delivers the best of the home and the office to workers everywhere."

According to HP's Future of Work study, 80 percent of workers want to be in the office some of the time, but many companies continue to struggle to get workers back in the office. HP research suggests that the most significant barrier to a return to office is a sub-optimal technology experience. In fact, 89 percent say technology is the most important factor driving return to office decisions. Similarly, of those who report thriving in hybrid work, 90 percent believe that access to the right technology and tools leads to a positive work experience. To accelerate employees' return to work, the right technology is required for optimal work setups, enabling success for companies and their employees.

Dynabook Americas, Inc., formerly Toshiba PC Company, has announced that it has refreshed its ultralight Portégé X40L-K and performance-rich 14-inch Tecra A40-K and 15-inch Tecra A50-K laptops to include the new hybrid-architecture 13th Gen Intel Core P-Series 28 W processors. All three laptops also include Windows 11 Pro standard for an enhanced productivity and intuitive computing experience.

"Next generation computing solutions capable of exceeding the demands of modern businesses and individuals is vital to Dynabook's success," said James Robbins, general manager, Dynabook Americas, Inc. "The addition of the 13th Gen Intel Core processors with our own mobile innovations allows Dynabook to deliver uncompromising, premium mobile computing solutions that seamlessly integrate into any business or learning environment. The immense power these three new laptops deliver demonstrates Dynabook's unrelenting commitment to producing the market's best professional-grade computing solutions."