AAEON, a leading provider of Computer-on-Modules, has today announced the launch of two new COM Express Type 6 Compact Size solutions, the COM-RAPC6 and COM-ADNC6. Targeting the advanced robotics and edge gateway markets, the COM-RAPC6 is compatible with a variety of embedded CPUs from the 13th Generation Intel Core Processor line on a compact 95 mm x 95 mm form factor. The module gives customers a range of SKUs from the 13th Generation series, from the efficient 15 W Intel Processor U300E to 13th Generation Intel Core i7 Processors, running at 45 W. This grants users up to 14 (6P/8E) cores and 20 threads of processing power alongside technologies for the acceleration of deep learning inference workloads and I/O device virtualization.

With the COM-RAPC6 clearly favoring high performance, AAEON's second addition to its COM Express Type 6 product line, the COM-ADNC6, focuses on efficiency. The COM-ADNC6 offers a selection of embedded CPUs from the Intel Atom X Series, Intel Processor N-series, and the Intel Core i3-N305 alongside 16 GB of SODIMM-based LPDDR5 system memory. Given its compatible CPUs are comparable to the Intel Atom Processor E and Intel Celeron Processor J Series CPUs in power consumption, but with far greater performance, the COM-ADNC6 is positioned as a natural successor to the COM-BT.

AMD today announced the AMD Spartan UltraScale+ FPGA family, the newest addition to the extensive portfolio of AMD Cost-Optimized FPGAs and adaptive SoCs. Delivering cost and power-efficient performance for a wide range of I/O-intensive applications at the edge, Spartan UltraScale+ devices offer the industry's highest I/O to logic cell ratio in FPGAs built in 28 nm and lower process technology, deliver up to 30 percent lower total power consumption versus the previous generation, and contain the most robust set of security features in the AMD Cost-Optimized Portfolio.

"For over 25 years the Spartan FPGA family has helped power some of humanity's finest achievements, from lifesaving automated defibrillators to the CERN particle accelerator advancing the boundaries of human knowledge," said Kirk Saban, corporate vice president, Adaptive and Embedded Computing Group, AMD. "Building on proven 16 nm technology, the Spartan UltraScale+ family's enhanced security and features, common design tools, and long product lifecycles further strengthen our market-leading FPGA portfolio and underscore our commitment to delivering cost-optimized products for customers."

TrendForce reports a 29.6% QoQ in DRAM industry revenue for 4Q23, reaching US$17.46 billion, propelled by revitalized stockpiling efforts and strategic production control by leading manufacturers. Looking ahead to 1Q24, the intent to further enhance profitability is evident, with a projected near 20% increase in DRAM contract prices—albeit with a slight decrease in shipment volumes to the traditional off-season.

Samsung led the pack with the highest revenue growth among the top manufacturers in Q4 as it jumped 50% QoQ to hit $7.95 billion, largely due to a surge in 1alpha nm DDR5 shipments, boosting server DRAM shipments by over 60%. SK hynix saw a modest 1-3% rise in shipment volumes but benefited from the pricing advantage of HBM and DDR5, especially from high-density server DRAM modules, leading to a 17-19% increase in ASP and a 20.2% rise in revenue to $5.56 billion. Micron witnessed growth in both volume and price, with a 4-6% increase in each, resulting in a more moderate revenue growth of 8.9%, totaling $3.35 billion for the quarter due to its comparatively lower share of DDR5 and HBM.

MSI Claw A1M, the company's ambitious attempt at a handheld gaming console based on the Intel Core Ultra "Meteor Lake" processor, instead of AMD Ryzen Z1 "Zen 4," goes on sale from March 8, 2024. This is according to a now-retracted Newegg store listing that mentions the release dates of the three Claw A1M models. The lineup is led by the Claw A1M powered by a Core Ultra 155H processor, 16 GB of LPDDR5-6400 memory, and 1 TB of NVMe SSD storage; for $799. For $50 less at $749, you get the same device, but with 512 GB of NVMe SSD storage. For a further $100 less, at $699, you get a model with the Core Ultra 5 135H processor, but the same 16 GB LPDDR5 memory, and 512 GB SSD, as the $749 model.

All three models feature a physically identical body design, including the controller layout, and lighting. Performance between the Core Ultra 7 155H and Core Ultra 5 135H models, is bound to differ. The 155H has a 6P+8E+2LP CPU core configuration, but more importantly, maxes out the Graphics Tile, with all 8 Xe cores being enabled (1,024 unified shaders). The Core Ultra 5 135H has a 4P+8E+2LP CPU core config, while its iGPU has 7 Xe cores. The star attraction with this console is its 7-inch touchscreen with 1080p resolution at 120 Hz refresh rate. Comms on all three models include Wi-Fi 7 and Bluetooth 5.4.

Cadence's digital and custom/analog flows are certified on the Intel 18A process technology. Cadence design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs. Customers can now begin using the production-ready Cadence design flows and design IP to achieve design goals and speed up time to market.

"Intel Foundry is very excited to expand our partnership with Cadence to enable key markets for the leading-edge Intel 18A process technology," said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. "We will leverage Cadence's world-class portfolio of IP, AI design technologies, and advanced packaging solutions to enable high-volume, high-performance, and power-efficient SoCs in Intel Foundry's most advanced process technology. Cadence is an indispensable partner supporting our IDM2.0 strategy and the Intel Foundry ecosystem."

Chinese review outlets have received MSI Claw sample units—the "Please, Xiao Fengfeng" Bilibili video channel has produced several comparison pieces detailing how the plucky Intel Meteor Lake-powered handheld stands up against its closest rival; ASUS ROG Ally. The latter utilizes an AMD Ryzen Z1 APU—in Extreme or Standard forms—many news outlets have pointed out that the Z1 Extreme processor is a slightly reworked Ryzen 7 7840U "Phoenix" processor. Intel and its handheld hardware partners have not dressed up Meteor Lake chips with alternative gaming monikers—simply put, the MSI Claw arrives with Core Ultra 7-155H or Ultra 5-135H processors onboard. The two rival systems both run on Window 11, and also share the same screen size, resolution, display technology (IPS) and 16 GB LPDDR5-6400 memory configuration. The almost eight months old ASUS handheld seems to outperform its near-launch competition.

Xiao Fengfeng's review (Ultra 7-155H versus Z1 Extreme) focuses on different power levels and how they affect handheld performance—the Claw and Ally have user selectable TDP modes. A VideoCardz analysis piece lays out key divergences: "Both companies offer easy TDP profile switches, allowing users to adjust performance based on the game's requirements or available battery life. The Claw's larger battery could theoretically offer more gaming time or higher TDP with the same battery life. The system can work at 40 W TDP level (but in reality it's between 35 and 40 watts)...In the Shadow of the Tomb Raider test, the Claw doesn't seem to outperform the ROG Ally. According to a Bilibili creator's test, the system falls short at four different power levels: 15 W, 20 W, 25 W, and max TDP (40 W for Claw and 30 W for Ally)."

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

SK hynix Inc. announced today that it recorded an operating profit of 346 billion won in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses. The company posted revenues of 11.31 trillion won, operating profit of 346 billion won (operating profit margin at 3%), and net loss of 1.38 trillion won (net profit margin at negative 12%) for the three months ended December 31, 2023. (Based on K-IFRS)

SK hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising. "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said. The financial results of the last quarter helped narrow the operating loss for the entire year to 7.73 trillion won (operating profit margin at negative 24%) and net loss to 9.14 trillion won (with net profit margin at negative 28%). The revenues were 32.77 trillion won.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

Intel in its 2024 International CES presentation, unveiled its two new upcoming client microarchitectures, "Arrow Lake" and "Lunar Lake." Michelle Johnston Holthaus, EVP and GM of Intel's client computing group (CCG), in her keynote address, held up a next-generation Core Ultra "Lunar Lake" chip. This is the Lunar Lake-MX package, with MOP (memory on package). You have a Foveros base tile resembling "Meteor Lake," with on-package LPDDR5x memory stacks. With "Lunar Lake," Intel is reorganizing components across its various Foveros tiles—the Compute and Graphics tiles are combined into a single tile built on an Intel foundry node that's possibly the Intel 20A (we have no confirmation); and a smaller SoC tile that has all of the components of the current "Meteor Lake" SoC tile, and is possibly built on a TSMC node, such as N3.

"Lunar Lake" will pick up the mantle from "Meteor Lake" in the U-segment and H-segment (that's ultraportables, and thin-and-light), when it comes out later this year (we predict in the second half of 2024), with Core Ultra 2-series branding. Intel also referenced "Arrow Lake," which could finally bring light to the sluggish pace of development in its desktop segment. When it comes out later this year, "Arrow Lake" will debut Socket LGA1851, "Arrow Lake" will bring the AI Boost NPU to the desktop, along with Arc Xe-LPG integrated graphics. The biggest upgrade of course will be its new Compute tile, with its "Lion Cove" P-cores, and "Skymont" E-cores, that possibly offer a large IPC uplift over the current combination of "Raptor Cove" and "Gracemont" cores on the "Raptor Lake" silicon. It's also possible that Intel will try to bring "Meteor Lake" with its 6P+8E Compute tile, Xe-LPG iGPU, and NPU, to the LGA1851 socket, as part of some mid-range processor models. 2024 will see a Intel desktop processor based on a new architecture, which is the big takeaway here.

Intel's current generation mobile processor product stack is vast, to say the least. In Q4-2023, the company launched its Core Ultra "Meteor Lake" mobile processors spanning the U-segment (7 W to 28 W), and H-segment (35 W to 45 W). Today, the company capped the upper end of the stack with the 14th Gen Core HX-series mobile processors based on "Raptor Lake Refresh," which dial up core counts to 8P+16E. And now, the company is adding more choice to the U-segment with the Core Processor Series 1, based on a lower core-count variant of the "Raptor Lake Refresh" architecture.

The Core Processor Series 1 follows the same nomenclature as the Core Ultra, where the "Ultra" denotes the latest "Meteor Lake" architecture. Processor model numbering and case badges are similar between Core Processor Series 1 and Core Ultra, except the lack of the "Ultra" brand extension. These chips are built on the monolithic "Raptor Lake Refresh" dies on the Intel 7 foundry node, and lack innovations such as the Low-power Island cores, 3D Performance Hybrid architecture, the all important AI Boost and on-silicon NPU; as well as that 2x faster Arc Xe-LPG integrated graphics, but use existing combinations of "Raptor Cove" and "Gracemont" CPU cores, along with older Xe-LP graphics with up to 96 EU; and a mostly similar I/O.

Acer expanded its Swift family of thin and light laptops with new Intel Core Ultra processors featuring Intel's first neural processing unit (NPU) and integrated AI acceleration capabilities. Now even more performance-minded, capable, and intuitive for content creation, schoolwork, productivity, and play, the new Swift laptops' powerful processing and AI-supported features further the laptop's usability.

"After unveiling our first Intel Core Ultra laptops last month, we're debuting even more products in our Swift line to help a wider range of customers take advantage of premium laptop experiences and AI-supported technology for more exciting and effective PC use," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "Plus, these laptops feature impressive updates that help customers do more - and do them even better."

Acer announced new additions to its Aspire laptop line, showcasing an extensive range of performance and design options to support everyday computing needs.

The Aspire Vero 16 is the latest from its Vero product line, powered by the new Intel Core Ultra processors with Intel AI Boost and Wi-Fi 7 compatibility. Acer has committed to carbon neutrality for the Aspire Vero 16, following international standards for carbon footprint calculation and carbon neutrality. Actions are taken at each stage of the device lifecycle to minimize its carbon footprint, and then, high-quality carbon credits will be applied to attain carbon neutrality. The Intel Evo Edition laptop has increased the usage of post-consumer recycled (PCR) materials on the chassis, doubling that of the 2021 model, to combine eco-innovation and premium PC experiences on the device.

MINISFORUM unveiled a high-end tablet convertible based on the Windows 11 x64 platform. Called simply the V3 AMD Tablet, this 3-in-1 convertible can be used as a 14-inch tablet, or combined with a dock that adds a keyboard, trackpad, and a stand. The tablet measures 318 mm x 213.8 mm x mm 9.8 mm (WxDxH), weighing 946 g. Its 14-inch 16:10 aspect-ratio display offers a 2560 x 1600 pixels resolution, with 165 Hz refresh rate, 100% DCI-P3 coverage, and 500 nits maximum brightness. This display is backed by a sensitive touchscreen that supports MPP 2.6 SLA and sensitivity suitable for a natural handwriting stylus.

Connectivity includes Wi-Fi 6E with Bluetooth 5.3, a USB-C V-Link (DP in), two 40 Gbps USB4, a fingerprint reader, and 4-pole headset jack. Under the hood, the MINISFORUM V3 is powered by an AMD Ryzen 7 8040U series "Hawk Point" processor, paired with 32 GB of LPDDR5-6400 memory, and a 2 TB M.2 Gen 4 NVMe SSD. The SoC has a 28 W configured TDP, and MINISFORUM has innovated a four flat copper heatpipe, dual fan cooling solution. The tablet also has a 4-speaker setup and multi-directional microphone. The front camera is 2 MP with full Windows Hello compatibility, while the rear cam is 5 MP. Powering it all is a 50.82 Wh battery, and a 65 W USB-PD power source over a type-C connector. Windows 11 Pro 23H2 with Ryzen AI enablement comes pre-installed. The company didn't reveal pricing.

Intel Core Ultra "Meteor Lake" mobile processor may be the the company's most efficient, but isn't a generation ahead of the 13th Gen Core "Raptor Lake" mobile processors in terms of performance. This isn't just because it has an overall lower CPU core count in its H-segment of SKUs, but also because its performance cores (P-cores) actually post a generational reduction in IPC, as David Huang in his blog testing contemporary mobile processors found out, through a series of single-threaded benchmarks. Huang did a SPECint 2017 performance comparison of Intel's Core Ultra 7 155H, and Core i7-13700H "Raptor Lake," with AMD Ryzen 7 7840HS, 7840H "Phoenix, Zen 4," and Apple M3 Pro and M2 Pro.

In his testing, the 155H, an H-segment processor, was found roughly matching the "Zen 4" based 7840U and 7840HS; while the Core i7-13700H was ahead of the three. Apple's M2 Pro and M3 Pro are a league ahead of all the other chips in terms of IPC. To determine IPC, Huang tested all processors with only one core, and their default clock speeds, and divided SPECint 2017 scores upon average clock speed of the loaded core logged during the course of the benchmark. Its worth noting here that the i7-13000H notebook was using dual-channel (4 sub-channel) DDR5 memory, while the Core Ultra 7 155H notebook was using LPDDR5, however Huang remarks that this shouldn't affect his conclusion that there has been an IPC regression between "Raptor Lake" and "Meteor Lake."

Neuchips, a leading AI Application-Specific Integrated Circuits (ASIC) solutions provider, will demo its revolutionary Raptor Gen AI accelerator chip (previously named N3000) and Evo PCIe accelerator card LLM solutions at CES 2024. Raptor, the new chip solution, enables enterprises to deploy large language models (LLMs) inference at a fraction of the cost of existing solutions.

"We are thrilled to unveil our Raptor chip and Evo card to the industry at CES 2024," said Ken Lau, CEO of Neuchips. "Neuchips' solutions represent a massive leap in price to performance for natural language processing. With Neuchips, any organisation can now access the power of LLMs for a wide range of AI applications."

MINISFORUM has just unveiled its latest entry-level office Mini PC, the UN100L, with a pre-sale price of $209 for the 16+512 GB version. This compact system is tailored for cost-effective entry-level markets, equipped with the 12th generation Intel N100 processor. It is particularly suitable for small and medium-sized business users with text-based office requirements and can also function as a set-top box.

The MINISFORUM UN100L features the 12th generation Intel Alder Lake-N100 ultra-low power processor, boasting four cores and four threads. With a baseline TDP power consumption as low as 6 W, it excels in energy efficiency compared to other processors. Simultaneously, its turbo boost performance can reach up to 9 W, a 30% improvement over the previous N5105 generation, fully satisfying the general home use needs of ordinary users. In terms of storage, the UN100L is equipped with 16 GB LPDDR5-4800 low-power, high-performance memory, enhancing data bandwidth. It incorporates an M.2 2280 PCIe 3.0 SSD while also supporting TF cards and 2.5-inch HDD, leading in storage expandability within its price range and suitable for use as a lightweight NAS.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s) in a single, comprehensive document. JESD318 CAMM2 is available for download from the JEDEC website.

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.

SK hynix Inc. announced today that it has started supplying its customers with 16 gigabyte (GB) packages of Low Power Double Data Rate 5 Turbo (LPDDR5T), the fastest mobile DRAM available today that can transfer 9.6 gigabits per second (Gbps). Since the successful development of its LPDDR5T in January, SK hynix has been preparing to commercialize the product by conducting performance verification with global mobile application processor (AP) manufacturers.

SK hynix explained that LPDDR5T is the optimal memory to maximize the performance of smartphones, with the highest speed ever achieved. The company also emphasized that it would continue to expand the application range of this product and lead the generation shift in the mobile DRAM sector. The LPDDR5T 16 GB package operates in the ultra-low voltage range of 1.01 to 1.12 V set by the Joint Electron Device Engineering Council (JEDEC), and can process 77 GB of data per second, which is equivalent to transferring 15 full high-definition (FHD) movies in one second.

Valve has announced an updated version of the Steam Deck and the headline feature is the new 7.4-inch OLED display. That's a mere 0.4-inches bigger than the original Steam Deck LCD display and it retains the same 1280 x 800 resolution. However, everything else related to the display has been improved and the refresh rate is now 90 Hz rather than 60 Hz. The display is also a lot brighter, with an SDR rating of 600 nits and an HDR rating of 1000 nits. Valve also claims a 110 percent P3 colour gamut, a one million to one contrast ratio and a sub 0.1 ms response time. On top of that, Valve has added what the company calls "high performance touch" which is said to improve the responsiveness of the display.

It's not just the display that has been improved, as Valve has moved to a 6 nm AMD Zen 2 based SoC which seems to allow the GPU to run at 1.6 GHz at all times, as Valve no longer lists a frequency range for the GPU. The power envelope remains the same though, with a range of 4-15 Watts. Paired with the new SoC is faster LPDDR5 memory at 6400 MT/s, up from 5500 MT/s, which should provide a small boost in gaming performance. An improved cooling solution is also part of the package, which is also likely a reason for the more constant GPU clocks. Gone are the entry level storage SKUs and the OLED version of the Steam Deck only comes with 512 GB or 1 TB of internal storage. The WiFi and Bluetooth module has also been overhauled and now supports WiFi 6E and Bluetooth 5.3. The battery has also been boosted from a 40 Whr pack to a 50 Whr pack and Valve now claims three to 12 hours of battery life during gaming, as well as faster charging times. Finally the weight has dropped by 29 grams, which might not be much, but still impressive considering the larger battery pack. The downside you ask? That would be the price, as Valve is asking for US$549/€569 for the 512 GB version, with the 1 TB coming at US$649/€679 when it becomes available on the 16th of November.

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

SK hynix Inc., today reported the financial results for the third quarter ended September 30, 2023. The company recorded revenues of 9.066 trillion won, operating losses of 1.792 trillion won and net losses of 2.185 trillion won in the three-month period. The operating and net margins were a negative 20% and 24%, respectively. After bottoming out in the first quarter, the business has been on a steady recovery track, helped by growing demand for products such as high-performance memory chips, the company said.

"Revenues grew 24%, while operating losses narrowed 38%, compared with the previous quarter, thanks to strong demand for high-performance mobile flagship products and HBM3, a key product for AI applications, and high-capacity DDR5," the company said, adding that a turnaround of the DRAM business following two quarters of losses is particularly hopeful. SK hynix attributed the growth in sales to increased shipments of both DRAM and NAND and a rise in the average selling price.

SK hynix Inc. announced today that it has started commercialization of the LPDDR5T (Low Power Double Data Rate 5 Turbo), the world's fastest DRAM for mobile with 9.6 Gbps speed. The company said that it has obtained the validation that the LPDDR5T is compatible with Qualcomm Technologies' new Snapdragon 8 Gen 3 Mobile Platform, marking the industry's first case for such product to be verified by the U.S. company.

SK hynix has proceeded with the compatibility validation of the LPDDR5T, following the completion of the development in January, with support from Qualcomm Technologies. The completion of the process means that it is compatible with Snapdragon 8 Gen 3. With the validation process with Qualcomm Technologies, a leader in wireless telecommunication products and services, and other major mobile AP (Application Processor) providers successfully completed, SK hynix expects the range of the LPDDR5T adoption to grow rapidly.

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications—including the cloud, edge devices and automotive vehicles.

Attended by about 600 customers, partners and industry experts, the event served as a platform for Samsung executives to expand on the company's vision for "Memory Reimagined," covering long-term plans to continue its memory technology leadership, outlook on market trends and sustainability goals. The company also presented new product innovations such as the HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD.