AMD today launched two distinct kinds of mobile processors, the Ryzen 7045 "Dragon Range" serves the 45 W H- and HX-segments of performance and enthusiast notebooks with CPU core counts of up to 16-core/32-thread; while the U-segment, P-segment, and a portion of the H-segment (ranges of 15 W, 28 W, and 35 W), will be led by the Ryzen 7040 "Phoenix Point." Unlike the "Dragon Range" MCM, "Phoenix Point" is a monolithic silicon built entirely on the TSMC 4 nm EUV foundry node, and introduces a wealth of process-level and system-level power-management features.

AMD "Phoenix Point" combines an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a powerful iGPU based on the latest RDNA3 graphics architecture, and a feature-packed AI acceleration engine based on the XDNA architecture AMD built after the Xilinx acquisition. The CPU component is a fully-fledged "Zen 4" CCX, with 8 CPU cores featuring 1 MB of dedicated L2 cache per-core, and sharing a large 32 MB L3 cache. This is an increase from the previous generation "Rembrandt" and "Cezanne" dies that had a reduced 16 MB L3 shared among the eight "Zen 3" or "Zen 3+" CPU cores.

Acer today debuts the first models in its new Acer Swift Go line, adding to the award-winning Swift family of notebooks designed for today's mobile professionals, creators, and students. In addition, the new Acer Swift X 14 and Acer Swift 14 were launched with new modern designs, the latest performance technologies, and all the tools to help users stay productive and connected on the go. The Swift Go, Swift X 14 and Swift 14 models highlight new ultraportable designs that are incredibly sleek and stylish. Incorporating well-considered features such as angular edges and structural lines result in a more refined look for these notebooks, appealing to highly mobile customers seeking a more confident look and feel.

The Acer Swift laptop line has also been a recipient of numerous accolades in recent years, with the Swift Edge being named a CES 2023 Innovation Awards honoree. "Our new Swift laptops kick off 2023 with all-new designs that are elevated, modern, and offer a striking visual appeal," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "The new Swift laptops do not only look good but house an impressive array of the latest technologies and features including OLED and high-resolution displays, long-lasting batteries and new 13th Gen Intel Coreprocessors that deliver first-class performance."

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading brand of personal computers, is introducing new members of the AERO Creator Laptop Series with the 13th Gen. Intel Core Processors and NVIDIA GeForce RTX 40 Series Laptop GPUs: AERO 16 OLED and AERO 14 OLED. As the world is lifting lockdown restrictions, the wheels of the world economy have been revived toward the path of recovery. However, post-pandemic work patterns have become the new norm. Consumers' screen time is prolonged due to hybrid work patterns and working from home, whereas the frequency of business trips has also been rising.

GIGABYTE conducted in-depth analyses about the criticality of screens for creators on the move, which leads to the development of OLED eye-protection laptops with the world's strictest dual color calibration. With the new laptops, consumers will not only get to enjoy the visual feasts but also be prepared for highly productive creation processes. The GIGABYTE AERO Series has been targeting creators, designers, and office workers, offering strict color accuracy, low blue light eye-protection technology, and lightweight for high mobility as its main features. In terms of product design, after undergoing 88 CNC forging processes, the thorough tempering gives the laptop an exquisite appearance, elegant like a masterpiece of fine art. The "Illusory Iridescent" design concept added more quality details to the silky smooth texture, bringing a touch of aesthetic and inspiration to all work hours. The practicality of the creator laptops is once again elevated and now graced with a sleek artistic sense.

Intel today debuted its 2023 N-series entry-level mobile processors targeting a range of low-cost notebook applications, such as educational notebooks for bulk purchase and distribution by public schools. These processors are built on the same Intel 7 (10 nm Enhanced SuperFin) node as the 13th Gen Core processors, but come with just "Gracemont" E-cores, and no P-cores.

The silicon physically features two "Gracemont" E-core clusters amounting to 8 E-cores, 6 MB of shared L3 cache, and an iGPU based on the Xe-LP graphics architecture, with 32 EUs (execution units). The silicon also features a GNI 3.0 for basic AI acceleration using a truncated version of the DLBoost instruction set, and an IPU (as in image processing unit), which can improve web-camera experience (on the fly background noise suppression). The iGPU also offers hardware-accelerated AV1 decoding. On the platform-side, the processor features a single-channel DDR5 memory interface that's backwards-compatible with DDR4, and also supports LPDDR5. Storage interfaces include eMMC, UFS 2.1, and NVMe SSD. Wireless networking options available with the platform include fast WiFi 6E and Bluetooth 5.2.

Ahead of CES 2023, Lenovo unveiled its latest ThinkPad X1 laptops featuring recycled materials, updated Lenovo Commercial Vantage software designed to highlight feature settings that can help improve energy efficiency, and a new Lenovo View application offering advanced computer vision technology for enhanced video image quality and tools for collaboration, security, and digital wellness. The latest line of ThinkVision monitors leads with the ultra-bright ThinkVision P27pz-30 and P32pz-30 mini-LED displays followed by ThinkVision's new T-series VOIP monitors built for hybrid work, featuring an integrated Microsoft Teams functionality, 5MP cameras, dual microphones, and speakers. Lenovo also introduced its latest professional-grade 4K ThinkVision P-series monitors and, for the home, new value-conscious Lenovo L-series monitors. Completing an efficient hybrid eco-system are new Lenovo accessories, including the unique Lenovo Go Desk Station, Lenovo Go 4K Pro Webcam, and Lenovo Professional Wireless Rechargeable Combo Keyboard and Mouse.

In line with its vision of achieving net-zero by 2050 aligned to Science Based Target initiatives, Lenovo continues to focus on supporting a circular economy by increasing the use of recycled materials in its products and packaging, and collaborating with industry partners to help increase energy efficiency of its devices. This includes working with suppliers and global logistics providers to decrease the emissions released in its supply chain and take every opportunity to increase the energy efficiency in Lenovo's factories and workplaces.

TECNO, a global innovative technology brand with operations in over 70 markets, recently announced the latest MEGABOOK S1 at TECNO Flagship Product Launch 2022 in Dubai, delivering its first flagship laptop to users.

In 2019, TECNO announced new efforts in building a digital product ecosystem by launching its AIoT business strategy, aiming to deliver digital to every person, home, and organization and help them create a fully- connected smart digital lifestyle. Following this vision, as the upgraded line of MEGABOOK T1, the flagship MEGABOOK S1 highlights the concept of ideas that create wonders, targeting users in professional fields like business and the creative industries, helping them work with ease while still achieving a higher efficiency.

Adding to its incredibly popular UP Xtreme product line, industry leader AAEON has announced the release of the UP Xtreme i12, the next generation developer board with 12th Generation Intel Core Processors (formerly Alder Lake-P). Improving upon the 11th Generation Intel Core Processor SoC of its predecessor, the UP Xtreme i11, AAEON's next-generation UP Xtreme i12 utilizes the 12 core, 16 thread hybrid architecture of 12th Generation Intel Core Processors, making it more energy-efficient despite possessing double the previous generation's thread count. With these improvements, the UP Xtreme i12 offers up to 20% greater CPU performance, while also hosting 32 GB onboard LPDDR5 system memory, which provides double the bandwidth and memory capacity of the previous generation.

The UP Xtreme i12's configuration of HDMI 2.0b, eDP 1.4, and two DP 1.4 slots give it the necessary tools to host four simultaneous 4K displays, alongside USB 4.0 and 2.5 GbE ports ensuring high-speed connectivity to peripheral cameras. Compounding this powerful, efficient function is the 2.47 x increase in graphics speed provided by Intel Iris Xe graphics, which makes the board an excellent candidate for smart retail deployments.

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

SK hynix Inc. reported today revenues of 10.98 trillion won, operating profit of 1.66 trillion won (with OP margin of 15%), and net income of 1.1 trillion won (with net income margin 10%) in the third quarter of 2022. Sales and operating profits decreased 20.5%, 60.5% respectively QoQ. SK hynix analyzed that revenues fell QoQ as both sales volume and price decreased due to sluggish demand for DRAM and NAND products amid worsening macroeconomic environment worldwide. In addition, SK hynix explained that despite the company improved cost competitiveness by increasing the sales proportion and yield of the latest 1anm DRAM and 176-layer 4D NAND, operating profit also decreased due to greater price drop than cost reduction.

SK hynix diagnosed that the semiconductor memory industry is facing an unprecedented deterioration in market conditions as uncertainties in the business environment continued. The deterioration occurred as the shipments of PCs and smartphone manufacturers, which are major buyers of memory chips, have decreased.

Verizon, the Network America relies on, together with Razer, the leading global lifestyle brand for gamers, today unveiled the Razer Edge 5G, the ultimate 5G handheld gaming device during the keynote address of RazerCon 2022. This groundbreaking collaboration will bring to market the world's first dedicated 5G handheld console—equipped with the world's most advanced display of any gaming handheld, powered by the latest Snapdragon G3xFort Gen 1 Gaming Platform, and running on Verizon 5G Ultra Wideband, the 5G network for gaming. It is specifically engineered to provide the best gaming performance while on the go.

"The core concept of every product we put out always boils down to one thing, our 'For Gamers. By Gamers.' motto," said Richard Hashim, Head of Razer's Mobile & Console Division. "With the Razer Edge, we've created the ultimate handheld gaming platform. Together with Verizon and Qualcomm, we designed the Razer Edge 5G to be a true gamer device, capable of supporting gamers' entire catalogs of AAA games or allowing them to stream endlessly online, taking their gaming experience on the go with low latency."

At the forefront of precision robotics engineering, AAEON has announced the UP Element i12 EDGE, in what the company believes will be a key step in innovating the autonomous mobile robot (AMR) and industrial automation markets.

Combining the agile architecture of 12th Generation Intel Core i3, i5, and i7 processor platforms with industrial-grade engineering, the UP Element i12 EDGE harnesses up to 10 cores and 12 threads, Intel Iris Xe graphics, and a selection of peripheral technologies in a rugged, flexible, and easily deployed edge system.
AAEON believes the UP Element i12 EDGE will have a significant role to play in the AMR market. With three USB 3.2 and two USB 2.0 ports for multiple 3D cameras and sensors, along with a dual COM port pin header for RS-232/422/485 connectivity, the device is equipped with enhanced object detection capabilities and more accurate positional data via LiDAR and IMU connections.

The AMD Ryzen 7 6800U has proved its power by bringing 200% average increase in maximum frame rate over previous generation games. (Up to 11% increase in single-core performance and 28% increase in multi-core performance) Now ONEXPLAYER has announced its latest 7-inch mini model to be fueled by AMD Ryzen 7 6800U, along with the Radeon 680M graphics and LPDDR5 memory. ONEXPLAYER Mini Pro will open its global pre-order on Sep 21th (9:00 a.m. PDT) on the official online store.

ONEXPLAYER Mini Pro also enables more flexible customization through embedded software, which were anticipated by lots of gamers. Now people can adjust the TDP, fan speed or GPU frequency depending on their preference when playing different types of games. The new feature of RGB lights also added personalization to top up the entertaining experience. In addition, the ONEXPLAYER Mini Pro reaches unprecedented lightness. In a limited body, all components are arranged efficiently to achieve the best gaming performance, yet only 599 g. Continuing from the previous 7-inch screen, this ONEXPLAYER Mini Pro body can be compatible with ONEXPLAYER's official docking. It also has 1920x1200 HD resolution and a higher pixel density at 323 ppi.

ASUS Republic of Gamers (ROG) today premieres Dare to be Ultimate: Building a World-Leading Gaming Phone, the design story video that reveals the genesis of the new ROG Phone 6D series of gaming smartphones. The ROG Phone 6D and ROG Phone 6D Ultimate are powered by the latest flagship MediaTek Dimensity 9000+ 5G chipset. Clocking up to 3.2 GHz CPU speeds, and boasting up to 16 GB of LPDDR5X RAM and 512 GB ROM of storage, the Dimensity 9000+ chipset provides flagship 5G experiences, perfect for mobile gamers.

"The pursuit of the ultimate performance and gaming experience has always been central for the ROG Phone. With each iteration, we consistently strive to surpass ourselves, achieving the spirit of For Those Who Dare," said S.Y. Hsu, Co-CEO, ASUS. "We are thrilled that this first collaboration with MediaTek has achieved such stunning performance, and we will continue to strive for continuous performance improvements."

The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

Today, Lenovo announced the next-generation ThinkPad X1 Fold that redefines the foldable PC category that Lenovo created in 2020. The new ThinkPad X1 Fold is designed to offer full PC performance with a larger screen area, while maintaining the ultra-portability that the original ground-breaking device offered. As the world's lightest 16-inch commercial laptop device, this next generation delivers a versatile, powerful and portable device - with a sleeker and thinner design that can be comfortably used as a primary PC. Improving on a category-defining PC is not easy, but Lenovo's done just that. Through a combination of customer feedback and end user insights, the innovative design features a 22% larger 16-inch folding OLED display, 25% thinner chassis, and thinner bezels all around to produce a premium, streamlined look and feel that extends to the aluminium frame and a back cover made from 100% recycled woven performance fabric.

When building a next-gen device, there's the advantage of learning from a solid base of customer experience and a groundswell of user input. This insight has served Lenovo well in defining four primary areas where the experience must be flawless: performance, keyboard, display and design.

According to TrendForce, DRAM market demand bit growth will only amount to 8.3% in 2023, sub-10% for the first time in history, and far lower than supply-side bit growth of approximately 14.1%. Data indicates the DRAM market to be severely oversupplied at least in 2023 and prices may continue to decline. NAND Flash is still in a state of oversupply and, although prices are expected to fall in the first half of next year, NAND Flash has built-in price elasticity compared to DRAM and average prices are expected to stimulate density growth in the enterprise SSD market after declining for several consecutive quarters. Demand bits are expected to grow by 28.9%, while supply bits will grow by approximately 32.1%.

From the perspective of various applications, rising inflation continues to impact demand in consumer markets, so the primary goal of memory brands has been to prioritize inventory correction. Especially in the past two years, a shortage of upstream components caused by the pandemic led memory brands to overbook purchase orders while sluggish sales on the distribution channel side have resulted in slow depletion of current notebook inventory, resulting in a further weakening of notebook demand in 2023. In terms of PC DRAM, the proportion of DDR4 and LPDDR4X in PC applications will fall further while the penetration rate of LPDDR5 and DDR5 continues to rise. However, the price premium of DDR5 will limit the growth of density in PCs. DRAM density in PCs is estimate to increase by approximately 7% annually in 2023. If manufactures cut DDR5 pricing more aggressively next year, installed capacity may be driven up to 9%, depending on whether DDR5 price concessions can be effectively reconciled with DDR4.

ASUS today revealed the all-new Zenfone 9 smartphone at a virtual launch event. Zenfone 9 is a totally redesigned compact 5.9-inch device with high performance and exciting new features. Powered by the latest flagship Snapdragon 8+ Gen 1 Mobile Platform, it's the most powerful Zenfone ever released. This latest generation Zenfone 9 has been totally redesigned to give it a premium, sleek look and feel, with four eye-catching new colors, a tactile new high-grip texture, and IP68 certification. The modern design features a massively upgraded dual-camera system with a 50 MP Sony IMX 766 main camera featuring a new 6-Axis Hybrid Gimbal Stabilizer, electronic image stabilization (EIS) and ultrafast autofocus technology for sharp, shake-free photos and videos. There's also a 12 MP IMX 363 ultrawide camera, and a 12 MP IMX 663 punch-hole front camera for crystal clear selfies and video chats.

As Zenfone 9 fits perfectly in one hand, the ASUS ZenUI 9 (Android 12) interface has been optimized for one-handed use. There's also the unique ASUS ZenTouch, a multifunction side-mounted power button incorporating a fingerprint sensor for hassle-free unlocking and support for convenient gesture controls. The new Connex Case accessory allows users to attach the Connex Card Holder or Connex Smart Stand, and there's also a new Smart Backpack Mount for safely attaching Zenfone 9 to a backpack's strap.

ASUS Republic of Gamers (ROG) today hosted the ROG Phone 6: For Those Who Dare virtual launch event to reveal the new ROG Phone 6 series of gaming smartphones, along with new models in the ROG Cetra series of True Wireless gaming headphones and ROG Delta series of gaming headsets, plus a collection of ROG Phone 6 accessories. The event concluded with an all-star showmatch, where 14 well-known influencers from 8 different countries competed on PUBG MOBILE to showcase their skills on the world's premium gaming smartphone.

The new ROG Phone 6 series includes the ROG Phone 6 and the ROG Phone 6 Pro, the most powerful ROG Phones ever made. They are powered by the latest flagship Snapdragon 8+ Gen 1 Mobile Platform with up to 3.2 GHz CPU clock speeds, up to 18 GB of LPDDR5 RAM, and up to 512 GB of storage. The upgraded GameCool 6 cooling system features novel 360° CPU cooling technology to unleash maximum sustained performance. A monster 6000 mAh battery capacity provides extended battery life for long game sessions. Supreme visuals are delivered by a 6.78-inch Samsung AMOLED HDR10+ display that uses exclusive ROG tuning technology to achieve an amazing 165 Hz refresh rate, an industry-leading 720 Hz touch-sampling rate and a world-beating 23 ms ultra-low touch latency. The new series is accompanied by a full array of exclusive ROG Phone 6 accessories, including the new AeroActive Cooler 6 and ROG Phone 6 Glass Screen Protector.

LG Electronics USA announced pricing and availability of its 2022 LG gram lineup of premium laptops. Ideal for a wide variety of users who value supreme portability and sleek, ultra-light designs that adopt innovative software and the latest hardware to offer even more power and convenience, LGs latest gram lineup - LG gram, LG gram 2-in-1 and +view for LG gram are available now at LG.com and at select LG-authorized retailers nationwide. The 2022 LG gram lineup features : gram 17 (17Z90Q), gram 16 (16Z90Q), gram 15 (15Z90Q), gram 14 (14Z90Q), gram 2-in-1 (16T90Q and 14T90Q), and the series' first-ever portable monitor, +view for LG gram (16MQ70).

Each new LG gram laptop provides powerful performance backed by a 12th Gen Intel Core processor. This year's laptops have also been upgraded to the latest Gen4 NVMe SSD, and employ low-voltage LPDDR5 RAM to achieve a performance boost versus outgoing models. Intel Evo Platform certified, the 2022 LG grams deliver excellent battery life, giving users the freedom to work, or play, wherever their day takes them. LG's premium laptops are synonymous with superb picture quality.. Featuring 16:10 aspect ratio, WQXGA (2,560 x 1,600) resolution IPS panels, the new grams provide sharp, vibrant images with high brightness, 99 percent coverage of the DCI-P3 color space, and plenty of screen real estate to meet users' diverse productivity and entertainment needs. What's more, LG's advanced IPS displays are now anti-glare, reducing distracting reflections and making it easier for users to see what they're working on, regardless of ambient light conditions.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6 GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas. The Dimensity 1050 combines mmWave 5G and sub-6 GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6 nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5 GHz and the latest Arm Mali-G610 graphics engine.

"The Dimensity 1050, and its combination of sub-6 GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands," said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. "With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines." In addition to 5G optimizations, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek's HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band - 2.4 GHz, 5 GHz and 6 GHz - that extends game time and performance. Additionally, high-end UFS 3.1 storage and LPDDR5 memory ensure ultra-fast data streams to accelerate apps, social feeds and faster FPS in games.

Acer today introduced a suite of powerful new laptops across its popular Swift and Spin notebook ranges, all featuring 12th Gen Intel Core processors and Windows 11. The Swift 3 OLED combines a beautiful display with powerful performance for professionals on-the-go, while the Spin 5 and Spin 3 are designed for professionals who need a portable laptop with multi-mode functionality.

The new Acer Swift 3 OLED laptop (SF314-71) is powered by the latest 12th Gen Intel Core H-series processors with Intel Iris Xe graphics, PCIe Gen 4 SSDs and up to 16 GB of LPDDR5 memory, offering professionals, freelancers and students powerful performance for creation-focused work and gaming. The laptop has also been Intel Evo verified as meeting key experience targets such as instant wake from sleep and offering 10 hours of real-world battery life. In a pinch, a 30-minute charge yields over 4 hours of battery life. Light, modern and thin, the Swift 3 OLED features a 14-inch 16:10 WQXGA+ (2.8k) OLED display with a 92% screen-to-body ratio, which is VESA DisplayHDR True Black 500-certified. The display provides true-to-life images supporting 100% of the DCI-P3 color gamut. The laptop has a 17.9 mm-thin aluminium metal chassis, weighs just 1.4 kg, and features an OceanGlass touchpad made from ocean-bound plastic waste that provides users with a sleek glass-like tactile feeling when scrolling.

AYANEO has recently announced the AYANEO 2 featuring AMD's latest "Rembrandt" Ryzen 7 6800U APU with Zen 3+ & RDNA2 architectures. The AMD Ryzen 7 6800U is a mobile processor with a configurable TDP of 15 - 28 W featuring 8 cores and 16 threads with a base clock of 2.7 GHz and a boost of 4.7 GHz. The processor also includes integrated Radeon 680M graphics with 12 RDNA2 cores running at 2.2 GHz which should offer performance almost twice of that as the Steam Deck. This APU is paired with an unspecified amount of LPDDR5 6400 MHz memory and a 7" 1280×800 IPS frameless display. The console is also set to feature an integrated fingerprint sensor and has been showcased running numerous games such as Metro Exodus, Cyberpunk 2077, Witcher 3, and Elden Ring. The AYANEO 2 is set to launch sometime later this year however an exact date or pricing was not shared.

Intel today debuted the 12th Gen Core HX "Alder Lake" processors for high-end gaming notebooks and mobile workstations. These processors are designed to bring desktop-class performance to the mobile segment, and debut the "Alder Lake" C0 silicon in a mobile package. Until now, the fastest Core "Alder Lake" mobile processor was based on a silicon that physically had 6 performance cores (P-cores), and 8 efficiency cores (E-cores). The HX-series sees the desktop C0 silicon, with its 8 P-cores and 8 E-cores, and 30 MB of L3 cache, in the mobile form factor.

This also brings PCI-Express 5.0 x16 PEG connectivity for discrete graphics cards, 8-lane DMI 4.0 chipset bus, and a mobile variant of the Z690 chipset, which can put out two M.2 NVMe Gen 4 slots in addition to the one from the processor die. The additional PCIe budget should allow up to two discrete Thunderbolt 4 controllers. Memory support includes dual-channel (4 sub-channel) DDR5-4800, dual-channel DDR4-3200, and LPDDR4-4267. Certain models even have ECC memory support, targeted at mobile workstations. Intel is using the highest bins of the C0 die, coupled with some aggressive power-management, to achieve processor base power (PBP) of 55 W (10 W lower than the 65 W PBP of the desktop Core i9-12900). The maximum turbo power value for all SKUs is set at 154 W. All processor models in the Core HX series will come with memory overclocking support, some even with CPU overclocking support.

AMD is planning a massive integrated graphics performance uplift for its next-generation Ryzen 7000U mobile processors. Codenamed "Phoenix," this SoC will feature a CPU based on the "Zen 4" microarchitecture with a higher CPU core count than the Intel alternative of the time; and an iGPU based on the RDNA3 graphics architecture. AMD is planning to endow this with the right combination of a CU count and engine clocks, to result in performance that roughly matches the NVIDIA GeForce RTX 3060 Laptop GPU, a popular performance-segment discrete GPU for notebooks, according to greymon55. Other highlights of "Phoenix" include a DDR5 + LPDDR5 memory interface, and PCI-Express Gen 5. The SoC is expected to be built on the TSMC N5 (5 nm) process, and debut in 2023.