Verizon, the Network America relies on, together with Razer, the leading global lifestyle brand for gamers, today unveiled the Razer Edge 5G, the ultimate 5G handheld gaming device during the keynote address of RazerCon 2022. This groundbreaking collaboration will bring to market the world's first dedicated 5G handheld console—equipped with the world's most advanced display of any gaming handheld, powered by the latest Snapdragon G3xFort Gen 1 Gaming Platform, and running on Verizon 5G Ultra Wideband, the 5G network for gaming. It is specifically engineered to provide the best gaming performance while on the go.

"The core concept of every product we put out always boils down to one thing, our 'For Gamers. By Gamers.' motto," said Richard Hashim, Head of Razer's Mobile & Console Division. "With the Razer Edge, we've created the ultimate handheld gaming platform. Together with Verizon and Qualcomm, we designed the Razer Edge 5G to be a true gamer device, capable of supporting gamers' entire catalogs of AAA games or allowing them to stream endlessly online, taking their gaming experience on the go with low latency."

At the forefront of precision robotics engineering, AAEON has announced the UP Element i12 EDGE, in what the company believes will be a key step in innovating the autonomous mobile robot (AMR) and industrial automation markets.

Combining the agile architecture of 12th Generation Intel Core i3, i5, and i7 processor platforms with industrial-grade engineering, the UP Element i12 EDGE harnesses up to 10 cores and 12 threads, Intel Iris Xe graphics, and a selection of peripheral technologies in a rugged, flexible, and easily deployed edge system.
AAEON believes the UP Element i12 EDGE will have a significant role to play in the AMR market. With three USB 3.2 and two USB 2.0 ports for multiple 3D cameras and sensors, along with a dual COM port pin header for RS-232/422/485 connectivity, the device is equipped with enhanced object detection capabilities and more accurate positional data via LiDAR and IMU connections.

The AMD Ryzen 7 6800U has proved its power by bringing 200% average increase in maximum frame rate over previous generation games. (Up to 11% increase in single-core performance and 28% increase in multi-core performance) Now ONEXPLAYER has announced its latest 7-inch mini model to be fueled by AMD Ryzen 7 6800U, along with the Radeon 680M graphics and LPDDR5 memory. ONEXPLAYER Mini Pro will open its global pre-order on Sep 21th (9:00 a.m. PDT) on the official online store.

ONEXPLAYER Mini Pro also enables more flexible customization through embedded software, which were anticipated by lots of gamers. Now people can adjust the TDP, fan speed or GPU frequency depending on their preference when playing different types of games. The new feature of RGB lights also added personalization to top up the entertaining experience. In addition, the ONEXPLAYER Mini Pro reaches unprecedented lightness. In a limited body, all components are arranged efficiently to achieve the best gaming performance, yet only 599 g. Continuing from the previous 7-inch screen, this ONEXPLAYER Mini Pro body can be compatible with ONEXPLAYER's official docking. It also has 1920x1200 HD resolution and a higher pixel density at 323 ppi.

ASUS Republic of Gamers (ROG) today premieres Dare to be Ultimate: Building a World-Leading Gaming Phone, the design story video that reveals the genesis of the new ROG Phone 6D series of gaming smartphones. The ROG Phone 6D and ROG Phone 6D Ultimate are powered by the latest flagship MediaTek Dimensity 9000+ 5G chipset. Clocking up to 3.2 GHz CPU speeds, and boasting up to 16 GB of LPDDR5X RAM and 512 GB ROM of storage, the Dimensity 9000+ chipset provides flagship 5G experiences, perfect for mobile gamers.

"The pursuit of the ultimate performance and gaming experience has always been central for the ROG Phone. With each iteration, we consistently strive to surpass ourselves, achieving the spirit of For Those Who Dare," said S.Y. Hsu, Co-CEO, ASUS. "We are thrilled that this first collaboration with MediaTek has achieved such stunning performance, and we will continue to strive for continuous performance improvements."

The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

Today, Lenovo announced the next-generation ThinkPad X1 Fold that redefines the foldable PC category that Lenovo created in 2020. The new ThinkPad X1 Fold is designed to offer full PC performance with a larger screen area, while maintaining the ultra-portability that the original ground-breaking device offered. As the world's lightest 16-inch commercial laptop device, this next generation delivers a versatile, powerful and portable device - with a sleeker and thinner design that can be comfortably used as a primary PC. Improving on a category-defining PC is not easy, but Lenovo's done just that. Through a combination of customer feedback and end user insights, the innovative design features a 22% larger 16-inch folding OLED display, 25% thinner chassis, and thinner bezels all around to produce a premium, streamlined look and feel that extends to the aluminium frame and a back cover made from 100% recycled woven performance fabric.

When building a next-gen device, there's the advantage of learning from a solid base of customer experience and a groundswell of user input. This insight has served Lenovo well in defining four primary areas where the experience must be flawless: performance, keyboard, display and design.

According to TrendForce, DRAM market demand bit growth will only amount to 8.3% in 2023, sub-10% for the first time in history, and far lower than supply-side bit growth of approximately 14.1%. Data indicates the DRAM market to be severely oversupplied at least in 2023 and prices may continue to decline. NAND Flash is still in a state of oversupply and, although prices are expected to fall in the first half of next year, NAND Flash has built-in price elasticity compared to DRAM and average prices are expected to stimulate density growth in the enterprise SSD market after declining for several consecutive quarters. Demand bits are expected to grow by 28.9%, while supply bits will grow by approximately 32.1%.

From the perspective of various applications, rising inflation continues to impact demand in consumer markets, so the primary goal of memory brands has been to prioritize inventory correction. Especially in the past two years, a shortage of upstream components caused by the pandemic led memory brands to overbook purchase orders while sluggish sales on the distribution channel side have resulted in slow depletion of current notebook inventory, resulting in a further weakening of notebook demand in 2023. In terms of PC DRAM, the proportion of DDR4 and LPDDR4X in PC applications will fall further while the penetration rate of LPDDR5 and DDR5 continues to rise. However, the price premium of DDR5 will limit the growth of density in PCs. DRAM density in PCs is estimate to increase by approximately 7% annually in 2023. If manufactures cut DDR5 pricing more aggressively next year, installed capacity may be driven up to 9%, depending on whether DDR5 price concessions can be effectively reconciled with DDR4.

ASUS today revealed the all-new Zenfone 9 smartphone at a virtual launch event. Zenfone 9 is a totally redesigned compact 5.9-inch device with high performance and exciting new features. Powered by the latest flagship Snapdragon 8+ Gen 1 Mobile Platform, it's the most powerful Zenfone ever released. This latest generation Zenfone 9 has been totally redesigned to give it a premium, sleek look and feel, with four eye-catching new colors, a tactile new high-grip texture, and IP68 certification. The modern design features a massively upgraded dual-camera system with a 50 MP Sony IMX 766 main camera featuring a new 6-Axis Hybrid Gimbal Stabilizer, electronic image stabilization (EIS) and ultrafast autofocus technology for sharp, shake-free photos and videos. There's also a 12 MP IMX 363 ultrawide camera, and a 12 MP IMX 663 punch-hole front camera for crystal clear selfies and video chats.

As Zenfone 9 fits perfectly in one hand, the ASUS ZenUI 9 (Android 12) interface has been optimized for one-handed use. There's also the unique ASUS ZenTouch, a multifunction side-mounted power button incorporating a fingerprint sensor for hassle-free unlocking and support for convenient gesture controls. The new Connex Case accessory allows users to attach the Connex Card Holder or Connex Smart Stand, and there's also a new Smart Backpack Mount for safely attaching Zenfone 9 to a backpack's strap.

ASUS Republic of Gamers (ROG) today hosted the ROG Phone 6: For Those Who Dare virtual launch event to reveal the new ROG Phone 6 series of gaming smartphones, along with new models in the ROG Cetra series of True Wireless gaming headphones and ROG Delta series of gaming headsets, plus a collection of ROG Phone 6 accessories. The event concluded with an all-star showmatch, where 14 well-known influencers from 8 different countries competed on PUBG MOBILE to showcase their skills on the world's premium gaming smartphone.

The new ROG Phone 6 series includes the ROG Phone 6 and the ROG Phone 6 Pro, the most powerful ROG Phones ever made. They are powered by the latest flagship Snapdragon 8+ Gen 1 Mobile Platform with up to 3.2 GHz CPU clock speeds, up to 18 GB of LPDDR5 RAM, and up to 512 GB of storage. The upgraded GameCool 6 cooling system features novel 360° CPU cooling technology to unleash maximum sustained performance. A monster 6000 mAh battery capacity provides extended battery life for long game sessions. Supreme visuals are delivered by a 6.78-inch Samsung AMOLED HDR10+ display that uses exclusive ROG tuning technology to achieve an amazing 165 Hz refresh rate, an industry-leading 720 Hz touch-sampling rate and a world-beating 23 ms ultra-low touch latency. The new series is accompanied by a full array of exclusive ROG Phone 6 accessories, including the new AeroActive Cooler 6 and ROG Phone 6 Glass Screen Protector.

LG Electronics USA announced pricing and availability of its 2022 LG gram lineup of premium laptops. Ideal for a wide variety of users who value supreme portability and sleek, ultra-light designs that adopt innovative software and the latest hardware to offer even more power and convenience, LGs latest gram lineup - LG gram, LG gram 2-in-1 and +view for LG gram are available now at LG.com and at select LG-authorized retailers nationwide. The 2022 LG gram lineup features : gram 17 (17Z90Q), gram 16 (16Z90Q), gram 15 (15Z90Q), gram 14 (14Z90Q), gram 2-in-1 (16T90Q and 14T90Q), and the series' first-ever portable monitor, +view for LG gram (16MQ70).

Each new LG gram laptop provides powerful performance backed by a 12th Gen Intel Core processor. This year's laptops have also been upgraded to the latest Gen4 NVMe SSD, and employ low-voltage LPDDR5 RAM to achieve a performance boost versus outgoing models. Intel Evo Platform certified, the 2022 LG grams deliver excellent battery life, giving users the freedom to work, or play, wherever their day takes them. LG's premium laptops are synonymous with superb picture quality.. Featuring 16:10 aspect ratio, WQXGA (2,560 x 1,600) resolution IPS panels, the new grams provide sharp, vibrant images with high brightness, 99 percent coverage of the DCI-P3 color space, and plenty of screen real estate to meet users' diverse productivity and entertainment needs. What's more, LG's advanced IPS displays are now anti-glare, reducing distracting reflections and making it easier for users to see what they're working on, regardless of ambient light conditions.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6 GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas. The Dimensity 1050 combines mmWave 5G and sub-6 GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6 nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5 GHz and the latest Arm Mali-G610 graphics engine.

"The Dimensity 1050, and its combination of sub-6 GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands," said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. "With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines." In addition to 5G optimizations, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek's HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band - 2.4 GHz, 5 GHz and 6 GHz - that extends game time and performance. Additionally, high-end UFS 3.1 storage and LPDDR5 memory ensure ultra-fast data streams to accelerate apps, social feeds and faster FPS in games.

Acer today introduced a suite of powerful new laptops across its popular Swift and Spin notebook ranges, all featuring 12th Gen Intel Core processors and Windows 11. The Swift 3 OLED combines a beautiful display with powerful performance for professionals on-the-go, while the Spin 5 and Spin 3 are designed for professionals who need a portable laptop with multi-mode functionality.

The new Acer Swift 3 OLED laptop (SF314-71) is powered by the latest 12th Gen Intel Core H-series processors with Intel Iris Xe graphics, PCIe Gen 4 SSDs and up to 16 GB of LPDDR5 memory, offering professionals, freelancers and students powerful performance for creation-focused work and gaming. The laptop has also been Intel Evo verified as meeting key experience targets such as instant wake from sleep and offering 10 hours of real-world battery life. In a pinch, a 30-minute charge yields over 4 hours of battery life. Light, modern and thin, the Swift 3 OLED features a 14-inch 16:10 WQXGA+ (2.8k) OLED display with a 92% screen-to-body ratio, which is VESA DisplayHDR True Black 500-certified. The display provides true-to-life images supporting 100% of the DCI-P3 color gamut. The laptop has a 17.9 mm-thin aluminium metal chassis, weighs just 1.4 kg, and features an OceanGlass touchpad made from ocean-bound plastic waste that provides users with a sleek glass-like tactile feeling when scrolling.

AYANEO has recently announced the AYANEO 2 featuring AMD's latest "Rembrandt" Ryzen 7 6800U APU with Zen 3+ & RDNA2 architectures. The AMD Ryzen 7 6800U is a mobile processor with a configurable TDP of 15 - 28 W featuring 8 cores and 16 threads with a base clock of 2.7 GHz and a boost of 4.7 GHz. The processor also includes integrated Radeon 680M graphics with 12 RDNA2 cores running at 2.2 GHz which should offer performance almost twice of that as the Steam Deck. This APU is paired with an unspecified amount of LPDDR5 6400 MHz memory and a 7" 1280×800 IPS frameless display. The console is also set to feature an integrated fingerprint sensor and has been showcased running numerous games such as Metro Exodus, Cyberpunk 2077, Witcher 3, and Elden Ring. The AYANEO 2 is set to launch sometime later this year however an exact date or pricing was not shared.

Intel today debuted the 12th Gen Core HX "Alder Lake" processors for high-end gaming notebooks and mobile workstations. These processors are designed to bring desktop-class performance to the mobile segment, and debut the "Alder Lake" C0 silicon in a mobile package. Until now, the fastest Core "Alder Lake" mobile processor was based on a silicon that physically had 6 performance cores (P-cores), and 8 efficiency cores (E-cores). The HX-series sees the desktop C0 silicon, with its 8 P-cores and 8 E-cores, and 30 MB of L3 cache, in the mobile form factor.

This also brings PCI-Express 5.0 x16 PEG connectivity for discrete graphics cards, 8-lane DMI 4.0 chipset bus, and a mobile variant of the Z690 chipset, which can put out two M.2 NVMe Gen 4 slots in addition to the one from the processor die. The additional PCIe budget should allow up to two discrete Thunderbolt 4 controllers. Memory support includes dual-channel (4 sub-channel) DDR5-4800, dual-channel DDR4-3200, and LPDDR4-4267. Certain models even have ECC memory support, targeted at mobile workstations. Intel is using the highest bins of the C0 die, coupled with some aggressive power-management, to achieve processor base power (PBP) of 55 W (10 W lower than the 65 W PBP of the desktop Core i9-12900). The maximum turbo power value for all SKUs is set at 154 W. All processor models in the Core HX series will come with memory overclocking support, some even with CPU overclocking support.

AMD is planning a massive integrated graphics performance uplift for its next-generation Ryzen 7000U mobile processors. Codenamed "Phoenix," this SoC will feature a CPU based on the "Zen 4" microarchitecture with a higher CPU core count than the Intel alternative of the time; and an iGPU based on the RDNA3 graphics architecture. AMD is planning to endow this with the right combination of a CU count and engine clocks, to result in performance that roughly matches the NVIDIA GeForce RTX 3060 Laptop GPU, a popular performance-segment discrete GPU for notebooks, according to greymon55. Other highlights of "Phoenix" include a DDR5 + LPDDR5 memory interface, and PCI-Express Gen 5. The SoC is expected to be built on the TSMC N5 (5 nm) process, and debut in 2023.

AMD's upcoming Socket AM5 Ryzen 7000-series "Raphael" desktop processors will ship with native support for DDR5-5200 memory speed, according to a marketing slide by memory maker Apacer (which also owns the overclocking memory brand ZADAK). The "Zen 4" based desktop processors will feature a dual-channel DDR5 (4 sub-channel) interface, just like the 12th Gen Core "Alder Lake," but with no backwards compatibility with DDR4.

AMD already stated that Ryzen 7000 processors have a design focus on memory overclocking capabilities, including AMD EXPO, a custom memory module SPD extension standard rivaling Intel XMP 3.0, which will come with fine-grained settings specific to the AMD memory controller architecture. Until now, AMD relied on A-XMP, a motherboard vendor-enabled feature based in the UEFI firmware setup program, which translates Intel XMP SPD profiles of memory modules into AMD-approximate settings.

NVIDIA has today announced its Grace CPU Superchip, a monstrous design focused on heavy HPC and AI processing workloads. Previously, team green has teased an in-house developed CPU that is supposed to go into servers and create an entirely new segment for the company. Today, we got a more detailed look at the plan with the Grace CPU Superchip. The Superchip package represents a package of two Grace processors, each containing 72 cores. These cores are based on Arm v9 in structure set architecture iteration and two CPUs total for 144 cores in the Superchip module. These cores are surrounded by a now unknown amount of LPDDR5x with ECC memory, running at 1 TB/s total bandwidth.

NVIDIA Grace CPU Superchip uses the NVLink-C2C cache coherent interconnect, which delivers 900 GB/s bandwidth, seven times more than the PCIe 5.0 protocol. The company targets two-fold performance per Watt improvement over today's CPUs and wants to bring efficiency and performance together. We have some preliminary benchmark information provided by NVIDIA. In the SPECrate2017_int_base integer benchmark, the Grace CPU Superchip scores over 740 points, which is just the simulation for now. This means that the performance target is not finalized yet, teasing a higher number in the future. The company expects to ship the Grace CPU Superchip in the first half of 2023, with an already supported ecosystem of software, including NVIDIA RTX, HPC, NVIDIA AI, and NVIDIA Omniverse software stacks and platforms.

Max Tech performed the first detailed teardown of the Apple Mac Studio, the most powerful Mac since Apple dumped Intel for processors in favor of its own silicon based around high-performance Arm chips built from the ground-up for its own software ecosystem. The M1 Ultra SoC powering the Mac Studio is its most striking piece of technology, with Apple attaching some very tall performance claims not just for its CPU compute performance, but also graphics rendering performance.

The M1 Ultra SoC is physically huge, with roughly similar package size to an AMD EPYC processor in the SP3 package. An integrated heatspreader (IHS) covers almost the entire topside of the package. Things get interesting under the hood. The M1 Ultra is a multi-chip module of two M1 Max dies connected on package using Apple UltraFusion, a coherent fabric interconnect that allows the various components of the two M1 Max dies to access memory controlled by the other die. Speaking of memory, The M1 Ultra features up to 128 GB of LPDDR5 memory that's on-package, This memory is used for the CPU, GPU, as well as the neural processor, and has a combined memory bandwidth of 800 GB/s. The M1 Ultra features up to 20 CPU cores, up to 32 Neural cores, and up to 64 GPU cores (8,192 programmable shaders).

Intel's Arc discrete lineup of graphics card are set to hit the notebook/laptop segment first, and today's discovery is no different. BHPhotoVideo, one of the largest US tech retailers, has posted a listing of Samsung's Galaxy Book2 Pro laptop, spotting Intel's Arc discrete graphics solution. According to the listing, this model was spotting an undisclosed Intel Arc Graphics, 2.1 GHz 12-core CPU, 16 GB of LPDDR5-6400 memory, 512 GB of NVMe PCIe Gen4 storage, 15.6-inch 1080p AMOLED display, WiFi-6E, and came in just 1.13 KG body weight. All of this is packed at 1349.99 USD, which is an early sign of the structure of laptop prices carrying Intel's Arc GPUs.

BHPhotoVideo has now taken down the website listing; however, we still have evidence thanks to the leaker, which you can see below. For more information regarding the exact SKU and more Arc Alchemist data, we have to wait for the March 30th launch.

Dynabook Americas, Inc., formerly Toshiba PC Company, today announced the all-new Portégé X40L-K, a hyperlight 14-inch modern laptop that takes premium, high-performance computing to new extremes. The Portégé X40L-K is among the first wave of new laptops from Dynabook to benefit from the enhanced performance, efficiency and security offered by hybrid architecture 12th Gen Intel Core P-Series 28 W processors, LPDDR5 memory and Windows 11 Pro.

"The all-new Intel Evo based Portégé X40L-K is truly a masterpiece every way you look at it and serves as an impressive demonstration of Dynabook's nearly four decades of experience in engineering premium laptops for mobile professionals," said James Robbins, General Manager, Dynabook Americas, Inc. "It's compact, powerful, durable, uniquely stylish, and secure. While all impressive, none of these qualities sum up the magic of this laptop. You must hold it to truly appreciate the incredible engineering and craftsmanship that went into making it the lightest and highest-performing 14-inch laptop in our history."

Acer today updated its popular Swift line of notebooks with new models of the Swift 5 and Swift 3. To push the limits of what's possible with a thin and light device, these new laptops come with 12th Gen Intel Core processors, gorgeous touchscreen displays, and all-day battery life: everything a mobile professional needs.

"Designed for executives and mobile professionals, the latest Acer Swift 5 offers a perfect balance of performance and portability," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "The Intel Evo-verified laptop not only provides a great experience, it is housed in a stylish thin-and-light CNC-machined unibody chassis featuring a gorgeous touchscreen display." "Intel and Acer have a long history of co-engineering to deliver amazing laptops," said Josh Newman, VP and GM of Client Computing Group Mobile Innovation. "Now, more than ever, our engineers are focused on the experiences that matter most with the Intel Evo platform, powered by 12th Gen Intel Core processors."

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website. HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution's market success, including graphics processing and high-performance computing and servers.

We've already seen some leaked pictures of Lenovo's awkwardly named ThinkBook Plus Gen 3, but what they didn't convey was the specs and almost all of them are quite impressive. The main display might be the most impressive part, as it's a 17.3-inch, 120 Hz 16:10 panel with a resolution of 3072x1440, which is as far as we know, the first of its kind. Then there's the "tablet" which measures 8-inches, although it's fairly low resolution at 1280x800. It comes with a "digital pen" as Lenovo calls it and is designed for graphics works courtesy of a software plugin that allows it to work with Pantone colours.

CPU wise, we're looking at the brand new 12th gen Intel Core H-series of CPUs, although no mention of the exact SKUs was offered. There's support for up to 32 GB of LPDDR5 RAM and 2 TB of storage. Sadly, graphics are limited to the Intel Iris Xe GPU built into the CPU, which means it might not be the ideal notebook for some of the types of work it was intended for.

Today at CES 2022, Intel announced the world's fastest mobile processor, bringing its performance hybrid architecture to mobile platforms for the first time with new 12th Gen Intel Core mobile processors that are up to 40 percent faster than the previous generation mobile processor. Intel introduced 28 new 12th Gen Intel Core mobile processors that deliver a feature-rich suite of capabilities to create laptops for people to compute whenever and wherever they need - without compromise.

With the introduction of the full 12th Gen Intel Core desktop processor lineup, the 12th Gen Intel Core processor family also represents the company's most scalable lineup to date, powering designs across consumer, enterprise, the Internet of Things (IoT) and other applications. "Intel's new performance hybrid architecture is helping to accelerate the pace of innovation and the future of compute," said Gregory Bryant, executive vice president and general manager of Intel's Client Computing Group. "And, with the introduction of 12th Gen Intel Core mobile processors, we are unlocking new experiences and setting the standard of performance with the fastest processor for a laptop—ever."