While Intel's primary product focus is on the processors, or brains, that make computers work, system memory (that's DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen). In heavy-duty computing jobs like weather modeling, computational fluid dynamics and certain types of AI, this mismatch could create a bottleneck—until now.

After several years of development with industry partners, Intel engineers have found a path to open that bottleneck, crafting a novel solution that has created the fastest system memory ever and is set to become a new open industry standard. The recently introduced Intel Xeon 6 data center processors are the first to benefit from this new memory, called MRDIMMs, for higher performance—in the most plug-and-play manner imaginable.

Expanding the system's computing capability with an additional accelerator like a GPU is common. However, expanding the system's memory capacity with room for more DIMM is something new. Thanks to ServeTheHome, we see that at the OCP Summit 2024, Lenovo showcased its ThinkSystem SR860 V3 server, leveraging CXL technology and Astera Labs Leo memory controllers to accommodate a staggering 16 TB of DDR5 memory across 128 DIMM slots. Traditional four-socket servers face limitations due to the memory channels supported by Intel Xeon processors. With each CPU supporting up to 16 DDR5 DIMMs, a four-socket configuration maxes out at 64 DIMMs, equating to 8 TB when using 128 GB RDIMMs. Lenovo's new approach expands this ceiling significantly by incorporating an additional 64 DIMM slots through CXL memory expansion.

The ThinkSystem SR860 V3 integrates Astera Labs Leo controllers to enable the CXL-connected DIMMs. These controllers manage up to four DDR5 DIMMs each, resulting in a layered memory design. The chassis base houses four Xeon processors, each linked to 16 directly connected DIMMs, while the upper section—called the "memory forest"—houses the additional CXL-enabled DIMMs. Beyond memory capabilities, the server supports up to four double-width GPUs, making it also a solution for high-performance computing and AI workloads. This design caters to scale-up applications requiring vast memory resources, such as large-scale database management, and allows the resources to stay in memory instead of waiting on storage. CXL-based memory architectures are expected to become more common next year. Future developments may see even larger systems with shared memory pools, enabling dynamic allocation across multiple servers. For more pictures and video walkthrough, check out ServeTheHome's post.

The world's leading brand for memory modules and flash memory - ADATA Technology and its gaming brand XPG (Xtreme Performance Gear) announced today that its DDR5 CUDIMM memory has been certified compatible by the world's four leading motherboard brands - ASRock, ASUS, Gigabyte and MSI's and included on their respective Qualified Vendor Lists (QVL) while supporting the latest Intel Core Ultra 2 series desktop processors.

XPG DDR5 CUDIMM gaming memory modules can be paired with Intel Z890 series motherboards from ASRock, ASUS, Gigabyte and MSI. As a result of close three-party collaboration, it delivers excellent performance at all frequencies whether adopting of two or four CUDIMM memory kits. Stable high-speed performance reaches up to 9600 MT/s, significantly boosting transmission speed while system operation remains smooth and all without the need to tediously adjust system parameters. XPG DDR5 CUDIMM also demonstrates ADATA's unique IC selection technology and CKD (Clock Driver) are key components reinforcing stability and efficiency and driving memory transfer speeds to new levels. In order to further strengthen its DDR5 memory product line, ADATA announced the launch of the ADATA DDR5 CUDIMM 6400 memory module. At the same time, XPG also plans to launch new LANCER RGB DDR5 CUDIMM gaming memory at four ultra-high-speed clocks: 8,400, 8,800, 9,200 and 9,600 MT/s.

In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.

The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.

Innodisk, a leading global AI solution provider, announces its DDR5 6400 DRAM series, featuring the industry's largest 64 GB single-module capacity. This 6400 series is purpose-built for data-intensive applications in AI, telehealth, and edge computing, where high performance at the edge is crucial. Available in versatile form factors, including CUDIMM, CSODIMM, and RDIMM, the series delivers unmatched speed, stability, and capacity to meet the rigorous demands of modern edge AI and industrial applications.

The DDR5 6400 series delivers a data transfer rate of 6400 MT/s, offering a 14% boost in speed over previous generations and doubling the maximum capacity to 64 GB. These enhancements make it an optimal choice for applications like Large Language Models (LLMs), generative AI, autonomous vehicles, and mixed reality, which require high-speed, reliable data processing in real time.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

Kingston Technology Company, Inc., a world leader in memory products, announced the upcoming release of Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel's new 800-series chipset (formerly codenamed Arrow Lake). Intel's 800-series chipset is the first platform to utilize Clock Drivers on CUDIMMs (Clocked Unbuffered Dual Inline Memory Modules). At 6400 MT/s DDR5, JEDEC mandates the inclusion of a Client Clock Driver (CKD) on UDIMMs and SODIMMs. This component buffers and redrives the clock signal from the processor, enhancing signal integrity to the module. To distinguish these advanced modules from standard DDR5 UDIMMs and SODIMMs, JEDEC has designated them as CUDIMMs and CSODIMMs, respectively.

Kingston FURY Renegade RGB and non-RGB CUDIMM modules start at an overclocked speed of 8400 MT/s and are available as 24 GB single modules and 48 GB dual channel kits. Since CUDIMMs and UDIMMs share the same 288-pin connector, Kingston FURY UDIMMs with XMP and EXPO profiles are also compatible with Intel 800-series motherboards. However, it's recommended to verify compatibility through the motherboard manufacturer's QVL (Qualified Vendor List) or by checking the Kingston Configurator for supported speeds and capacities.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring Vcolor CUDIMM 24 GB x 2 modules, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-10600. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. Featuring the latest D5 Bionic Corsa, an AI-enhanced overclocking technology that seamlessly integrates software, hardware, and firmware, overclockers can now leverage AI technology to unlock groundbreaking DDR5 speeds with ease.
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XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has now expanded its product line and officially entered the field of workstations. Today XPG announced the launch of the first AICORE Overclocked DDR5 R-DIMM, with a maximum speed of 8,000 MT/s and a capacity of 32 GB, making challenging large-capacity workstation memory expansions a breeze. AICORE is built for improving overall system performance, process complex data, multi-tasking more quickly, and maximize the efficiency of AI computing.

Born for High-Speed Computing and AI Development
R-DIMM adopts a Register Clock Driver (RCD) and is characterized by high-speed, low-latency, and enhanced operational stability. AICORE Overclocked R-DIMM memory is designed for high speed and stability and is perfect for large-scale data processing, AI generation, 3D rendering and graphics, video post-production editing, and multitasking. AICORE is designed for securities markets that emphasize real-time data analysis and data science professionals or expert image creators to accelerate work efficiency and quickly complete various large-scale projects. AICORE Overclocked DDR5 R-DIMM memory has a maximum speed of 8,000 MT/s which is 1.6 times faster than standard R-DIMM memory, delivering more powerful performance to meet the rigorous speed requirements of high-end systems.

MSI, a leading global provider of high-performance server solutions, is excited to showcase its comprehensive lineup of motherboards and servers based on the OCP Modular Hardware System (DC-MHS) architecture at the OCP Global Summit from October 15-17 at booth A6. These cutting-edge solutions represent a breakthrough in server designs, enabling flexible deployments for cloud and high-density data centers. Featured innovations include CXL memory expansion servers and AI-optimized servers, demonstrating MSI's leadership in pushing the boundaries of AI performance and computing power.

DC-MHS Series Motherboards and Servers: Enabling Flexible Deployment in Data Centers
"The rapidly evolving IT landscape requires cloud service providers, large-scale data center operators, and enterprises to handle expanding workloads and future growth with more flexible and powerful infrastructure. MSI's new rage of DC-MHS-based solutions provides the needed flexibility and efficiency for modern data center environments," said Danny Hsu, General Manager of Enterprise Platform Solutions.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced upcoming raw card designs currently in development in JEDEC's JC-45 Committee for DRAM Modules in collaboration with the JC-40 and JC-42 Committees. These raw card memory device standards are intended for use in client computing applications such as laptops and desktops and will be supported by related appendix specifications. The forthcoming raw cards will also complement two DDR5 Clock Driver standards published earlier this year: JESD323: DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common Specification and JESD324: DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Common Specification.

Integrating a Clock Driver (CKD) into a DDR5 DIMM provides numerous advantages, particularly in memory stability and performance, and enhances signal integrity and reliability at high speeds. By regenerating the clock signal locally on the DIMM, a CKD ensures stable operation even at elevated clock speeds. With a DDR5 CKD, DIMM data rates can be increased from 6400 Mbps to 7200 Mbps in the initial version of the standard, and targeting up to 9200 Mbps in future versions.

Micron Technology, Inc., today announced the availability of a brand-new category of clock driver memory with the launch of its Crucial DDR5 clocked unbuffered dual inline memory modules (CUDIMM) and clocked small outline dual memory modules (CSODIMM), which are now shipping in volume. The JEDEC-standard solutions run at speeds up to 6,400 MT/s (megatransfers per second), more than twice as fast as DDR4 and 15% faster than traditional non-clock-driver-based DDR5. Designed to provide more speed stability, faster downloads and better refresh rates, these solutions represent a completely new frontier of memory form factors for next-generation PCs. Micron's CUDIMM and CSODIMM solutions are the industry's first commercially available JEDEC-standard DDR5 CUDIMM and CSODIMM solutions to hit the market since JEDEC standardized the specification earlier this year.

In addition, Intel has validated Micron DDR5 CUDIMM and CSODIMM solutions up to capacities of 64 gigabytes (GB) for use with its Intel Core Ultra processors (Series 2), which were launched last week on Oct. 10.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today unveiled industry-first, complete memory interface chipsets for Gen 5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs). These innovative new products for RDIMMs and MRDIMMs will seamlessly extend DDR5 performance with unparalleled bandwidth and memory capacity for compute-intensive data center and AI workloads.

"The voracious memory demands of AI and HPC require the relentless pursuit of higher performance through continued innovation and technology leadership," said Sean Fan, chief operating officer at Rambus. "With our 30-plus years of renowned high-speed signal integrity and memory system expertise, the Rambus Gen5 RCD, and next-generation MRCD, MDB, and PMIC will be critical enabling chips in future-generation servers leveraging DDR5 RDIMM 8000 and MRDIMM 12800."

AMD has unveiled its latest EPYC processors, codenamed "Turin," featuring Zen 5 and Zen 5C dense cores. Phoronix's thorough testing reveals remarkable advancements in performance, efficiency, and value. The new lineup includes the EPYC 9575F (64-core), EPYC 9755 (128-core), and EPYC 9965 (192-core) models, all showing impressive capabilities across various server and HPC workloads. In benchmarks, a dual-socket configuration of the 128-core EPYC 9755 Turin outperformed Intel's dual Xeon "Granite Rapids" 6980P setup with MRDIMM-8800 by 40% in the geometric mean of all tests. Surprisingly, even a single EPYC 9755 or EPYC 9965 matched the dual Xeon 6980P in expanded tests with regular DDR5-6400. Within AMD's lineup, the EPYC 9755 showed a 1.55x performance increase over its predecessor, the 96-core EPYC 9654 "Genoa". The EPYC 9965 surpassed the dual EPYC 9754 "Bergamo" by 45%.

These gains come with improved efficiency. While power consumption increased moderately, performance improvements resulted in better overall efficiency. For example, the EPYC 9965 used 32% more power than the EPYC 9654 but delivered 1.55x the performance. Power consumption remains competitive: the EPYC 9965 averaged 275 Watts (peak 461 Watts), the EPYC 9755 averaged 324 Watts (peak 500 Watts), while Intel's Xeon 6980P averaged 322 Watts (peak 547 Watts). AMD's pricing strategy adds to the appeal. The 192-core model is priced at $14,813, compared to Intel's 128-core CPU at $17,800. This competitive pricing, combined with superior performance per dollar and watt, has resonated with hyperscalers. Estimates suggest 50-60% of hyperscale deployments now use AMD processors.

As a global leader in memory solutions, Team Group Inc. today unveiled its latest T-Force CKD (Client Clock Driver) DDR5 Gaming Memory. Following the worldwide attention received for the 7200 MHz T-CREATE EXPERT Ai CKD DDR5 showcased at COMPUTEX 2024, the T-Force gaming brand takes performance to new heights with the upcoming T-Force XTREEM CKD DDR5 8200 to 9000 (Gear 2) 2x24GB, featuring overclocking capabilities reaching up to 9600 MHz (Gear 4). Consumers can now push the limits of CUDIMM overclocking on the Intel Z890 platform with next-generation CKD DDR5 overclocking memory, achieving unprecedented performance breakthroughs.

Team Group continues to lead the industry in pushing boundaries by crafting the T-Force XTREEM CKD DDR5, which breaks beyond JEDEC frequency specifications. Utilizing CKD components and Intel XMP profiles on the Intel Z890 motherboard, users can effortlessly overclock to DDR5 speeds beyond 9000 MHz with a single click. Unlike JEDEC-compliant memory modules, the T-Force XTREEM CKD DDR5 leverages CKD components to enhance and buffer high-frequency signals from the CPU, ensuring more stable signal transmission to the memory modules. This enables DDR5 to push overclocking performance to even higher frequencies, surpassing traditional U-DIMM overclocking limitations.

ASRock Rack Inc., a leading innovative server company, announced upgrades to its extensive lineup to support AMD EPYC 9005 Series processors. Among these updates is the introduction of the new 6U8M-TURIN2 GPU server. This advanced platform features AMD Instinct MI325X accelerators, specifically optimized for intensive enterprise AI applications, and will be showcased at AMD Advancing AI 2024.

ASRock Rack Introduce GPU Servers Powered by AMD EPYC 9005 series processors
AMD today revealed the 5th Generation AMD EPYC processors, offering a wide range of core counts (up to 192 cores), frequencies (up to 5 GHz), and expansive cache capacities. Select high-frequency processors, such as the AMD EPYC 9575F, are optimized for use as host CPUs in GPU-enabled systems. Additionally, the just launched AMD Instinct MI325X accelerators feature substantial HBM3E memory and 6 TB/s of memory bandwidth, enabling quick access and efficient handling of large datasets and complex computations.

Asgard joined the ranks of V-Color to unveil its first high-frequency DDR5 memory, the Thor DDR5-9600. V-Color recently launched its DDR5-9200 memory, and Asgard one-upped it with DDR5-9600. Both these are CUDIMMs—UDIMMs that feature a client clock driver (CKD) component. These modules feature the highest bins of DDR5-9600 chips from SK Hynix. The advertised speed of DDR5-9600 is achieved using timings of 44-56-56-136, and a scorching DRAM voltage of 1.50 V. The module includes an XMP 3.0 profile to enable these settings on an Intel platform. With a single-rank configuration and 24 GB module density, the dual-channel kit gives you 48 GB. Asgard revealed that it is working on a DDR5-10000 kit. The company didn't announce US availability.

V-COLOR is set to revolutionize the future of memory technology with the launch of the world's first RGB DDR5 O CUDIMM (High Speed Overclocked CUDIMM). This groundbreaking innovation for the next-generation desktop platform, offering unmatched speeds and efficiency for desktop applications. This memory module has a new heatsink patent (Patent No. 113208127) to increase heat dissipation efficiency to a new level, and the introduction of the exclusive light guide rod patented coating technology (Patent No. M653290) allows the light guide rod to attract attention regardless of whether it has RGB effects or not.

The DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) technology dynamically adjusts clock frequency and voltage based on workload and system conditions. This cutting-edge capability results in faster data transmission, lower power consumption, and enhanced stability, making it a game-changer in the industry.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and advanced memory, has launched a new line of DDR5 Registered DIMMs (RDIMMs) with conformal coating which are specifically designed for use in liquid immersion servers. This innovative product line combines the superior performance of DDR5 technology with enhanced protection, ensuring reliability and longevity in the most demanding data center environments.

Arthur Sainio, DRAM product director for SMART explains the significance of this introduction, "Our new DDR5 RDIMMs with conformal coating represent the perfect fusion of cutting-edge performance and rugged reliability for the next generation of immersion-cooled data centers. By combining the speed and efficiency of DDR5 technology with advanced protective coatings, we're enabling our customers to push the boundaries of computing power while ensuring long-term durability in demanding liquid immersion environments. This product embodies our commitment to innovation and our drive to meet the evolving needs of high-performance computing applications."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today released two GIGABYTE R-series servers (R183-ZK0 and R283-ZK0) with enhanced performance and reliability for cloud services and data-intensive applications. These highly scalable memory capacity servers support AMD EPYC 9004 processors and are ready for select 5th generation AMD EPYC processors with up to 192 CPU cores.

These new GIGABYTE servers are the first and only ones in the market that are one node with two CPUs that support 48 memory DIMMs. GIGABYTE's rich history in motherboard design and engineering with great signal integrity make this possible, a server with 12 TB memory using 256 GB DDR5 3DS RDIMMs. To accommodate a 12-memory channel platform with a 2DPC configuration and without compromising, a new memory layout was developed.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

Micron Technology, Inc., today announced it is now sampling its multiplexed rank dual inline memory module (MRDIMMs). The MRDIMMs will enable Micron customers to run increasingly demanding workloads and obtain maximum value out of their compute infrastructure. For applications requiring more than 128 GB of memory per DIMM slot, Micron MRDIMMs outperform current TSV RDIMMs by enabling the highest bandwidth, largest capacity with the lowest latency and improved performance per watt to accelerate memory-intensive virtualized multi-tenant, HPC and AI data center workloads.1 The new memory offering is the first generation in the Micron MRDIMM family and will be compatible with Intel Xeon 6 processors.

"Micron's latest innovative main memory solution, MRDIMM, delivers the much-needed bandwidth and capacity at lower latency to scale AI inference and HPC applications on next-generation server platforms," said Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "MRDIMMs significantly lower the amount of energy used per task while offering the same reliability, availability and serviceability capabilities and interface as RDIMMs, thus providing customers a flexible solution that scales performance. Micron's close industry collaborations ensure seamless integration into existing server infrastructures and smooth transitions to future compute platforms."

ASUS Republic of Gamers today announced the launch of the ROG NUC gaming PC. The first-ever ROG NUC PC is packed with cutting-edge technology and performance for AAA gaming and more.

Gaming, redefined
Featuring Intel Core Ultra 9 or Intel Core Ultra 7 processors and NVIDIA GeForce RTX 4070 or 4060 discrete graphics, the ROG NUC PC is a compact powerhouse that delivers unmatched gaming experiences. The high-performance hybrid architecture of Intel Core Ultra processors provides gamers with the power needed to stream, edit, record and play without skipping a beat. The 2.5-liter chassis is designed for quick system access to make upgrades and cleaning easy. Plus, the compatible ROG Raikiri Pro controller can be used to deliver a console-like experience for gamers seeking uncompromised performance and flexibility in a compact form factor.

SK hynix presented its leading AI memory solutions at COMPUTEX Taipei 2024 from June 4-7. As one of Asia's premier IT shows, COMPUTEX Taipei 2024 welcomed around 1,500 global participants including tech companies, venture capitalists, and accelerators under the theme "Connecting AI". Making its debut at the event, SK hynix underlined its position as a first mover and leading AI memory provider through its lineup of next-generation products.

"Connecting AI" With the Industry's Finest AI Memory Solutions
Themed "Memory, The Power of AI," SK hynix's booth featured its advanced AI server solutions, groundbreaking technologies for on-device AI PCs, and outstanding consumer SSD products. HBM3E, the fifth generation of HBM1, was among the AI server solutions on display. Offering industry-leading data processing speeds of 1.18 terabytes (TB) per second, vast capacity, and advanced heat dissipation capability, HBM3E is optimized to meet the requirements of AI servers and other applications. Another technology which has become crucial for AI servers is CXL as it can increase system bandwidth and processing capacity. SK hynix highlighted the strength of its CXL portfolio by presenting its CXL Memory Module-DDR5 (CMM-DDR5), which significantly expands system bandwidth and capacity compared to systems only equipped with DDR5. Other AI server solutions on display included the server DRAM products DDR5 RDIMM and MCR DIMM. In particular, SK hynix showcased its tall 128-gigabyte (GB) MCR DIMM for the first time at an exhibition.

On June 4th, COMPUTEX 2024 was successfully held at the Taipei Nangang Exhibition Center. Mnemonic Electronic Co., Ltd., the Taiwanese subsidiary of Longsys, showcased industry-leading high-capacity SSDs under the theme "Embracing the Era of High-Capacity SSDs." The products on display included the Mnemonic MS90 8TB SATA SSD, FORESEE ORCA 4836 series enterprise NVMe SSDs, FORESEE XP2300 PCIe Gen 4 SSDs, and rich product lines comprising embedded storage, memory modules, memory cards, and more. The company offers reliable industrial-grade, automotive-grade, and enterprise-grade storage products, providing high-capacity solutions for global users.

High-Capacity SSDs
For SSDs, Mnemonic Electronic presented products in various form factors and interfaces, including PCIe M.2, PCIe BGA, SATA M.2, and SATA 2.5-inch. The Mnemonic MS90 8 TB SATA SSD supports the SATA interface with a speed of up to 6 Gb/s (Gen 3) and is backward compatible with Gen 1 and Gen 2. It also supports various SATA low-power states (Partial/Sleep/Device Sleep) and can be used for nearline HDD replacement, surveillance, and high-speed rail systems.