MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, today introduced the new B850MT2-E DJ motherboard. Built on AMD's B850 chip architecture, B850MT2-E DJ is tailor-made for casual home and office use.

Engineered to support the latest AMD Ryzen 9000, 8000, and 7000 series processors, the B850MT2-E DJ ensures seamless multitasking and efficient power management, making it an ideal choice for modern computing needs. Supporting up to 128 GB of DDR5 across two DIMM slots, the B850MT2-E DJ offers more bandwidth than DDR4, delivering faster data access and smoother performance. Additionally, PCIe 4.0 M.2 support provides lower latency and lightning-fast speeds of up to 64 Gb/s, doubling the bandwidth of PCIe 3.0 M.2 for quick data transfers and minimal load times, ensuring a smooth and efficient user experience.

Micron Technology, Inc., today announced it is the first in the industry to ship samples of its 1γ (1-gamma), sixth-generation (10 nm-class) DRAM node-based DDR5 memory designed for next-generation CPUs to ecosystem partners and select customers. This 1γ DRAM milestone builds on Micron's previous 1α (1-alpha) and 1β (1-beta) DRAM node leadership to deliver innovations that will power future computing platforms from the cloud to industrial and consumer applications to Edge AI devices like AI PCs, smartphones and automobiles. The Micron 1γ DRAM node will first be leveraged in its 16 Gb DDR5 DRAM and over time will be integrated across Micron's memory portfolio to meet the industry's accelerating demand for high-performance, energy-efficient memory solutions for AI. Designed to offer speed capabilities of up to 9200 MT/s, the 16 Gb DDR5 product provides up to a 15% speed increase and over 20% power reduction compared to its predecessor.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the introduction of an enhanced revision of DDR5 R-DIMM memory to the market. Based on the newly released JEDEC revision standards for DDR5 R-DIMM, the new G.SKILL R-DIMM memory features a 16-layer PCB for improved signal integrity, as well as adding two transient voltage suppression (TVS) diodes and a fuse for voltage protection. Designed for enterprise servers and professional workstations, the new DDR5 R-DIMM memory brings cutting-edge advancements to performance and protection.

Improved Signal Integrity with 16-Layer PCB
These new DDR5 R-DIMM memory modules feature an advanced 16-layer PCB, a significant upgrade from previous 8- or 10-layer designs. The increase in the PCB layer count improves signal integrity for better reliability and stability in data transmission, even under high-performance or overclocked workloads - making it an ideal DDR5 R-DIMM memory choice for high-performance computing applications on servers or workstations.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

V-COLOR Technology Inc. proudly introduces the groundbreaking CKD SCC (Speed Booster, Colorful Makeover and Cost effective) O CUDIMM RGB Filler Kit 2+2 (2 DRAM Modules + 2 Filler Modules) additions to its DDR5 memory lineup, redefining high-performance and customization. With the launch of the new SCC O CUDIMM RGB Filler Kit now compatible with Intel Core Ultra CPUs Motherboards 800 series up to 8800 MT/s and not only that, the already existent SCC UDIMM kit just got a massive upgrade now reaching 8000 MT/s with dual profiles for Intel XMP 3.0 and AMD EXPO. This new SCC line will be under the family of the already amazing XFinity series that continues to push the boundaries of memory innovation.

The latest CKD SCC O CUDIMM is optimized for Intel Core Ultra CPUs and Z890 series motherboards, offering unmatched performance and stability. With speeds reaching 8000 MT/s ~ 8200 MT/s for 32 GB (2x 16 GB) configurations and 7000 MT/s ~ 8800 MT/s for 48 GB (2x 24 GB) configurations. The latest lineup of SCC technology doesn't just revolutionize the new O CUDIMM memory modules; it also pushes the boundaries of already existing UDIMMs to unprecedented levels. Speeds now reach an impressive 7200 MT/s up to 8000 MT/s, while the addition of dual profiles ensures seamless compatibility and performance optimization for both AMD EXPO and Intel XMP 3.0 systems. This development bridges accessibility across platforms, offering next-level performance for enthusiasts and professionals alike.

The mini PC market has grown substantially in the past few years, in no small part thanks to the commendable performance and efficiency improvements brought to the table by the x86 giants. Gigabyte has unveiled its fair share of such systems, with its latest offering sporting an Intel Core Ultra 5 225H CPU paired with up to a whopping 96 GB of memory. As of right now, we do not have any concrete information regarding when the system will be made available to the public, and at what price. But given the system specifications and Gigabyte's track record, we can expect the system to command an affordable price tag.

As mentioned, the mini PC, dubbed the GB-BRU5-225H, is powered by the Intel Core Ultra 5 225H CPU including four high-performance "Lion Cove" cores, eight high-efficiency "Skymont" cores, as well as two additional "low power" cores for a total of 14 cores and 14 threads. The 12.6 x 3.4 x 11.9 cm mini PC has no room for discrete graphics, and has to rely on the integrated Arc 130T iGPU with eight Xe cores. The system can be equipped with up to 96 GB of DDR5-6400 memory courtesy of its dual SO-DIMM slots. Considering the specifications, the mini PC should be sufficiently potent for the vast majority of moderately intensive workloads thrown its way.

Intel Corporation today reported fourth-quarter and full-year 2024 financial results. "The fourth quarter was a positive step forward as we delivered revenue, gross margin and EPS above our guidance," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "Our renewed focus on strengthening and simplifying our product portfolio, combined with continued progress on our process roadmap, is positioning us to better serve the needs of our customers. Dave and I are taking actions to enhance our competitive position and create shareholder value."

"The cost reduction plan we announced last year to improve the trajectory of the company is having an impact," said David Zinsner, interim co-CEO and chief financial officer of Intel. "We are fostering a culture of efficiency across the business while driving toward greater returns on our invested capital and improved profitability. Our Q1 outlook reflects seasonal weakness magnified by macro uncertainties, further inventory digestion and competitive dynamics. We will remain highly focused on execution to build on our progress and unlock value."

Transcend Information Inc. (Transcend), a global leader in storage solutions, is proud to announce its new DDR5 6400 CUDIMM DRAM modules. Designed specifically for gamers, content creators, DIY PC enthusiasts, and demanding professionals, these modules offer enhanced performance and stability to meet varying speed and capacity requirements. Optimized from standard DIMMs, CUDIMMs include a Client Clock Driver (CKD) for stable and efficient operation, making them ideal for high-performance desktop systems that require greater bandwidth and reliability.

With data transfer rates of up to 6400 MT/s, Transcend's DDR5 6400 DRAM modules significantly boost gaming performance, video editing smoothness, and large file processing speeds. Whether you are tackling the latest AAA gaming titles, editing high-resolution videos, or multitasking across multiple applications, these modules keep your system running smoothly even under extreme load and deliver an exceptional user experience. Plus, built-in on-die Error Correction Code (ECC) technology ensures data integrity, safeguarding important files, game progress, and creative content.

SMART Modular Technologies, Inc. ("SMART"), a Penguin Solutions, Inc. brand (Nasdaq: PENG) and a global leader in integrated memory solutions, solid-state drives, and hybrid storage products, today announced that its 4-DIMM and 8-DIMM CXL (Compute Express Link ) memory Add-in Cards (AICs) have successfully passed CXL 2.0 compliance testing. These products are now officially listed on the CXL Consortium's Integrators' List, marking a significant milestone in the company's commitment to delivering high-quality, interoperable memory solutions.

The inclusion of SMART Modular Technologies' products on the CXL Integrator's List underscores the company's dedication to adhering to industry standards and ensuring compatibility across a wide range of computing environments. The CXL Compliance Program, developed by the CXL Consortium, provides members with opportunities to test the functionality and interoperability of their products as defined in the CXL specification. This achievement not only highlights SMART Modular Technologies' technical expertise, but also reinforces its role as a leader in advancing integrated memory technology.

Micron at the 2025 International CES showed us product that hint at the company planning a strong comeback to the client and PC-DIY market segments. The company's Crucial brand is already a high-volume player in the client segment, but the company never really approached the enthusiast segment. Products like the company's new T705 Pro and P510 NVMe SSDs, and DDR5 Pro Overclocking memory, seek to change this. We begin our tour with PC memory, and the DDR5 Pro OC CUDIMMs. Crucial has jumped onto the CKD bandwagon, introducing memory modules and kits that come with DDR5-6400 out of the box, but which are geared for manual overclocking to take advantage of the 1β DRAM chips underneath (hence the name).

The company also showed us their first DDR5 CSODIMM suitable for the next generation of notebooks with HX-segment processors. This module comes with a CKD and a DDR5-6400 JEDEC-standard SPD profile out of the box. Lastly, there's the Micron-branded LPCAMM2, which comes in speeds of up to LPDDR5X-8533, and is suitable for the next generation of ultraportables.

Biwin, a PC memory, SSD, and flash storage product licensee for top-tier PC brands, launched its consumer brand in December 2024. Here at CES 2025, the TechPowerUp team headed over to Biwin's booth to check out up close the entire lineup of products ranging from SSDs in all shapes and sizes, and DRAM modules to memory cards, and card readers. The products on display were available on Amazon Japan in December 2024, followed by Amazon UK this January, and at the start of 2025, they will be available in Taiwan, APAC, Mexico, Latin America, and the Indian market.

Biwin showcased Black Opal premium SSDs and DRAM modules such as the Biwin Black Opal X570 PRO PCIe Gen 5x 4 NVMe 2.0 SSD capable of reaching read speeds of up to 14,000 MB/s. The Black Opal DW100 RGB DDR5 CUDIMM series stands out with 9200 MT/s and a CAS latency of CL42, a product tailored for professionals and enthusiasts. For mainstream users, Biwin presented SSDs, DRR5 memory modules, memory cards, card readers, and USB flash drives.

Micron Technology, Inc., today announced expansions across its Crucial consumer memory and storage portfolio, including unveiling the high-speed Crucial P510 SSD, and expanding density and form factor options across its existing DRAM portfolio to enable broader choice and flexibility for consumers. The P510 features read and write speeds of up to 11,000/9,550 megabytes per second (MB/s), bringing blazing fast Gen 5 performance to the masses.

"With the exciting memory and storage offerings we're debuting today, Crucial's portfolio is now broader and stronger than ever before," said Dinesh Bahal, corporate vice president and general manager of Micron's Commercial Products Group. "These updates - from making fast Gen 5 SSDs available to the mainstream to launching high-density memory options - illustrate our commitment to driving innovation, performance and value for every consumer from casual gamers to creatives and students to hardcore enthusiasts."

Corsair today announced a bounty of new hardware for PC builders and content creators, ranging from new power supplies and cases to new storage and memory offerings. In addition to all-new hardware such as the XENEON EDGE 14.5" Touchscreen, EX400U USB4 External SSD, DOMINATOR TITANIUM Wave Accessory Kit, and Corsair Custom Lab memory, there are also updates to the distinguished RMe and HXi power supplies featuring boosted capabilities for next-gen GPUs. Finally, the revamped 5000T Series of mid-tower cases introduces support for reverse-connector motherboards, making them the perfect showcase for super-clean builds.

New hardware announcements:

• XENEON EDGE 14.5" LCD Touchscreen
• RMe Series (2025) Power Supplies
• 5000T Series Mid-Tower Cases
• HXi Series (2025) Power Supplies
• EX400U USB4 External SSD
• Corsair Custom Lab DRAM
• DOMINATOR TITANIUM Wave Accessory Kit

We stopped by at the 2025 International CES booth of Lexar, a brand known for high-quality memory and storage products for creative professionals and gamers alike. Our tour begins with the new Lexar NM1090 PRO, the company's flagship M.2 NVMe Gen 5 SSD, which is capable sequential speeds of up to 14 GB/s reads, with up to 13 GB/s writes. The drive comes in capacities of 1 TB, 2 TB, and 4 TB. Next up, we spotted the Lexar ARES DDR5 CUDIMM. This particular model offers speeds of DDR5-9600 and a density of 16 GB, to make 32 GB kits. From what we hear, this should easily overclock beyond the 10,000 MT/s mark on "Arrow Lake-S" with Gear 4.

We also spotted Lexar's popular flash storage products, including CFexpress type-A and type-B memory cards under the Lexar Diamond Professional brand. The CFexpress type-A card offers sequential speeds of up to 3.7 GB/s reads, up to 3.4 GB/s writes, and a 400 MB/s write speed guarantee. The CFexpress type-B card offers up to 1.8 GB/s sequential reads, up to 1.4 GB/s sequential writes, and a 400 MB/s guaranteed write speed. Next up, is the Lexar Armor SD card meant for high-endurance applications, such as FPV drones, action cameras, and surveillance, with 280 MB/s max reads, 210 MB/s max writes, and 60 MB/s guaranteed write speeds. Lastly, the company showcased its Workflow Go line of portable 2-way backup solutions, which let you dock in your high-speed storage devices for rapid backup.

IBASE Technology Inc. (TPEx: 8050), a leading manufacturer of embedded computing solutions, introduces the IB996 Full-Size CPU Card, tailored to meet the demanding needs of industrial and embedded computing. Supporting 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors, this innovative solution adheres to the PICMG 1.3 standard and features the Intel Q670E chipset for robust performance and flexibility. It offers outstanding expandability and connectivity for applications in industrial automation, transportation, and medical systems.

The IB996 boasts seamless performance and compatibility, supporting up to 64 GB of DDR5 memory with dual DIMM slots and superior networking capability with two Intel 2.5G LAN ports. Integrated Intel Xe graphics allow for versatile display options, including DVI-I, LVDS, and DVI-D, making it suitable for a variety of visual data processing tasks. Additionally, it comes equipped with 8x USB 3.2, 5x SATA III, four COM, and two M.2 sockets (M-Key and E-Key), with the M.2 M-Key supporting PCIe for NVMe storage solutions, ensuring high-speed data transfer and optimal performance across Intel-based systems.

Team Group Inc.'s gaming brand T-FORCE launched the highly anticipated XTREEM CKD DDR5 8800 2x24GB Desktop Memory, designed with advanced Client Clock Driver (CKD) technology to enhance data transfer stability. With overclocking capabilities reaching up to 9600 MT/s, this memory module redefines overclocking potential with the groundbreaking CUDIMM platform, delivering exceptional performance and setting new industry milestones.

In close collaboration with leading motherboard manufacturers, the T-FORCE XTREEM CKD DDR5 is designed for stability at an exclusive frequency of 9600 MT/s on 2 DIMM motherboards. Featuring a premium 2 mm-thick aluminium alloy heat spreader and high thermal conductivity silicone, it significantly improves heat dissipation by 10%. Its CNC cutting technology, matte sandblasting, and black anodizing processes create a refined, understated aesthetic. Paired with the iconic T-FORCE logo, it offers gamers a product combining high performance and premium design. Utilizing patented IC classification and verification technology, the module integrates a power management chip for stable power consumption. It also supports on-die ECC for error detection and correction, ensuring exceptional system stability.

While Intel's primary product focus is on the processors, or brains, that make computers work, system memory (that's DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen). In heavy-duty computing jobs like weather modeling, computational fluid dynamics and certain types of AI, this mismatch could create a bottleneck—until now.

After several years of development with industry partners, Intel engineers have found a path to open that bottleneck, crafting a novel solution that has created the fastest system memory ever and is set to become a new open industry standard. The recently introduced Intel Xeon 6 data center processors are the first to benefit from this new memory, called MRDIMMs, for higher performance—in the most plug-and-play manner imaginable.

Expanding the system's computing capability with an additional accelerator like a GPU is common. However, expanding the system's memory capacity with room for more DIMM is something new. Thanks to ServeTheHome, we see that at the OCP Summit 2024, Lenovo showcased its ThinkSystem SR860 V3 server, leveraging CXL technology and Astera Labs Leo memory controllers to accommodate a staggering 16 TB of DDR5 memory across 128 DIMM slots. Traditional four-socket servers face limitations due to the memory channels supported by Intel Xeon processors. With each CPU supporting up to 16 DDR5 DIMMs, a four-socket configuration maxes out at 64 DIMMs, equating to 8 TB when using 128 GB RDIMMs. Lenovo's new approach expands this ceiling significantly by incorporating an additional 64 DIMM slots through CXL memory expansion.

The ThinkSystem SR860 V3 integrates Astera Labs Leo controllers to enable the CXL-connected DIMMs. These controllers manage up to four DDR5 DIMMs each, resulting in a layered memory design. The chassis base houses four Xeon processors, each linked to 16 directly connected DIMMs, while the upper section—called the "memory forest"—houses the additional CXL-enabled DIMMs. Beyond memory capabilities, the server supports up to four double-width GPUs, making it also a solution for high-performance computing and AI workloads. This design caters to scale-up applications requiring vast memory resources, such as large-scale database management, and allows the resources to stay in memory instead of waiting on storage. CXL-based memory architectures are expected to become more common next year. Future developments may see even larger systems with shared memory pools, enabling dynamic allocation across multiple servers. For more pictures and video walkthrough, check out ServeTheHome's post.

The world's leading brand for memory modules and flash memory - ADATA Technology and its gaming brand XPG (Xtreme Performance Gear) announced today that its DDR5 CUDIMM memory has been certified compatible by the world's four leading motherboard brands - ASRock, ASUS, Gigabyte and MSI's and included on their respective Qualified Vendor Lists (QVL) while supporting the latest Intel Core Ultra 2 series desktop processors.

XPG DDR5 CUDIMM gaming memory modules can be paired with Intel Z890 series motherboards from ASRock, ASUS, Gigabyte and MSI. As a result of close three-party collaboration, it delivers excellent performance at all frequencies whether adopting of two or four CUDIMM memory kits. Stable high-speed performance reaches up to 9600 MT/s, significantly boosting transmission speed while system operation remains smooth and all without the need to tediously adjust system parameters. XPG DDR5 CUDIMM also demonstrates ADATA's unique IC selection technology and CKD (Clock Driver) are key components reinforcing stability and efficiency and driving memory transfer speeds to new levels. In order to further strengthen its DDR5 memory product line, ADATA announced the launch of the ADATA DDR5 CUDIMM 6400 memory module. At the same time, XPG also plans to launch new LANCER RGB DDR5 CUDIMM gaming memory at four ultra-high-speed clocks: 8,400, 8,800, 9,200 and 9,600 MT/s.

In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.

The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.

Innodisk, a leading global AI solution provider, announces its DDR5 6400 DRAM series, featuring the industry's largest 64 GB single-module capacity. This 6400 series is purpose-built for data-intensive applications in AI, telehealth, and edge computing, where high performance at the edge is crucial. Available in versatile form factors, including CUDIMM, CSODIMM, and RDIMM, the series delivers unmatched speed, stability, and capacity to meet the rigorous demands of modern edge AI and industrial applications.

The DDR5 6400 series delivers a data transfer rate of 6400 MT/s, offering a 14% boost in speed over previous generations and doubling the maximum capacity to 64 GB. These enhancements make it an optimal choice for applications like Large Language Models (LLMs), generative AI, autonomous vehicles, and mixed reality, which require high-speed, reliable data processing in real time.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

Kingston Technology Company, Inc., a world leader in memory products, announced the upcoming release of Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel's new 800-series chipset (formerly codenamed Arrow Lake). Intel's 800-series chipset is the first platform to utilize Clock Drivers on CUDIMMs (Clocked Unbuffered Dual Inline Memory Modules). At 6400 MT/s DDR5, JEDEC mandates the inclusion of a Client Clock Driver (CKD) on UDIMMs and SODIMMs. This component buffers and redrives the clock signal from the processor, enhancing signal integrity to the module. To distinguish these advanced modules from standard DDR5 UDIMMs and SODIMMs, JEDEC has designated them as CUDIMMs and CSODIMMs, respectively.

Kingston FURY Renegade RGB and non-RGB CUDIMM modules start at an overclocked speed of 8400 MT/s and are available as 24 GB single modules and 48 GB dual channel kits. Since CUDIMMs and UDIMMs share the same 288-pin connector, Kingston FURY UDIMMs with XMP and EXPO profiles are also compatible with Intel 800-series motherboards. However, it's recommended to verify compatibility through the motherboard manufacturer's QVL (Qualified Vendor List) or by checking the Kingston Configurator for supported speeds and capacities.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring Vcolor CUDIMM 24 GB x 2 modules, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-10600. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. Featuring the latest D5 Bionic Corsa, an AI-enhanced overclocking technology that seamlessly integrates software, hardware, and firmware, overclockers can now leverage AI technology to unlock groundbreaking DDR5 speeds with ease.
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