Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers. With a 33% increase in data rate and bandwidth over Gen 1 4800 MT/s solutions, the Rambus Gen 3 6400 MT/s DDR5 RCD enables a new level of main memory performance for data center servers. Delivering industry-leading latency and power, it offers optimized timing parameters for improved RDIMM margins.

"Data center workloads have an insatiable thirst for greater memory bandwidth and capacity, and our mission is to advance the performance of server memory solutions that meet this need for each new server platform generation," said Sean Fan, chief operating officer at Rambus. "We were first in the industry to 5600 MT/s, and now we have raised the bar with our Gen 3 DDR5 RCD capable of 6400 MT/s to support a new generation of RDIMMs for server main memory."

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

Laptop memory has been a controversial topic for many years. Its proprietary standard, SO-DIMM, has shown signs of aging as the decades-old JEDEC standard didn't adapt to other expanding capacities and speed trends. Today, JEDEC and Dell think that the future of laptop memory is in the new CAMM standard that both companies are working on. The introduction of CAMM comes from Dell, whose Senior Distinguished Engineer Tom Schnell is working on it. "We have unanimous approval of the 0.5 spec," said Mr. Schnell for PCWorld. One of the problems that SO-DIMM is facing is the capacity and speed issue, where the current DDR5 SO-DIMM memory stops at around 6400 MT/s. CAMM, on the other hand, starts from that speed and works its way up to offer higher capacities as well.

With Dell introducing CAMM in its laptops, it had no intentions of creating a proprietary solution but rather an expandable and upgradable memory platform with various benefits. With JEDEC's involvement in finalizing this, the CAMM standard is slowly on its way to becoming a viable option for different laptop manufacturers. Dell's Tom Schnell didn't reveal what companies are in the process of creating the final specification; however, we know that 32 of them are present, including Apple. If others join, the standard could take over future laptop designs and offer higher speeds and higher capacities, especially in the mobile workstation space where it matters. Below is an example of a CAMM memory module with a patent showing the SO-DIMM (upper left) versus CAMM (lower right) and CAMM's smaller trace path. With smaller tracing, the latency is also going down, so the new standard will bring additional efficiency. Additionally, devices that are based on LPDDR memory could have an upgrade path with the installment of CAMM.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

Inspur Information, a leading IT infrastructure solutions provider, announced that its G7 server platform fully supports 4th Gen Intel Xeon Scalable Processors. The 16 servers making up the brand-new lineup are industry-leading in terms of performance, openness, intelligent operation & maintenance, and sustainability. Compared with the previous generation of Intel-based products, these servers have 61% higher performance and up to 30% higher computing performance per unit of power consumption. The server platform is designed to be deployed in general-purpose computing, critical computing, AI, and other application scenarios.

Inspur Information's brand-new G7 platform was designed with green technology, open-source solutions, security, and intelligence as priorities. It is an industry-leading example of system design, energy efficiency, and operation & maintenance management. G7 servers support diversified computing, with the most comprehensive product lineup in the industry. With a focus on green energy, this product line supports cold plate and immersion cooling schemes, and has unique cooling designs such as T-shaped radiator and advance heat detection with intelligent regulation, which all work together to reduce energy consumption by up to 30%. The new series also supports cloud operation and maintenance for intelligent fault diagnosis with an accuracy rate up to 95%.

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

At the 2023 International CES, market leader Kingston expanded their FURY line of enthusiast-gaming PC memory with the introduction of several new DDR5 memory kits. The top-of-the-line FURY Renegade series comes in RGB and non-RGB trims, and with speeds of up to DDR5-7200 with Intel XMP 3.0 support. For the AMD crowd, the company showed off the FURY Beast RGB, which comes in speeds of up to DDR5-6000, and features AMD EXPO profiles along with extensive validation with Ryzen 7000 series processors.

For those still making the transition between DDR4 and DDR5, Kingston introduced the FURY Beast DDR4 RGB, which looks visually similar to their DDR5 FURY Beast, but comes with speeds of up to DDR4-3600, with validation on AMD Ryzen 5000 series processors. It also supports an Intel XMP 2.0 profile. For high-end gaming notebooks and SFF platforms, including the Intel NUC 12 Extreme, Kingston introduced the FURY Impact line of DDR5 SO-DIMM memory, which comes in speeds of up to DDR5-5600.

SK hynix Inc. announced today that it has developed working samples of DDR5 Multiplexer Combined Ranks (MCR) Dual In-line Memory Module, the world's fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8 Gbps, and at least 80% faster than 4.8 Gbps of the existing DDR5 products. MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5. Challenging the prevailing concept that the operation speed of DDR5 relies on that of DRAM chip itself, engineers sought to find a way to improve the speed of modules instead of chips for development of the latest product.

SK hynix designed the product in a way that enables simultaneous operation of two ranks by utilizing the data buffer installed onto the MCR DIMM based on Intel's MCR technology. By enabling simultaneous operation of two ranks, MCR DIMM allows transmission of 128 bytes of data to CPU at once, compared with 64 bytes fetched generally in conventional DRAM module. An increase in the amount of data sent to the CPU each time supports the data transfer rate of minimum 8 Gbps, twice as fast as a single DRAM.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the breakthrough DDR5 performance of XMP DDR5-7600 and O.C. performance to DDR5-7950 under fan cooling on Z790 AORUS XTREME and MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 7200 memory. Featuring Shielded Memory Routing of SMD memory DIMM, exclusive DDR5 overclocking BIOS setting, top-quality components, and enhanced design from hardware to firmware on motherboards, this performance proves GIGABYTE's strong leading role in product quality and performance.

To unleash the ultimate DDR5 performance, GIGABYTE Z790 AORUS XTREME and MASTER implement new generation Shielded Memory Routing design. By optimizing memory trace width, length, and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules. Further with low signal-loss PCB, signal loss inside PCB and external interference are greatly reduced which can maintain high-speed DDR5 signal transmission to achieve higher DDR5 speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7600 and DDR5-7950 O.C. under fan cooling with T-FORCE DELTA RGB DDR5 7200 memory. The detailed memory information is listed in the memory support list of the motherboard.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x 16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz enhances high end performance for advanced inspection equipment and improves efficiency.

Goldkey Technology Corporation (TPEx : 3135), aka "Neo Forza", offers products and solutions marketed under the label Neo Forza successfully completed qualification of its server modules with Dell PowerEdge R650 and R750 series servers, which DELL loaned to Neo Forza. Following successful qualification, Neo Forza announces commercial and industrial channel partner availability of Neo Forza DDR4 RDIMM server memory in adherence to industry qualifications, ranging from DDR4 2133MT/s to 3200MT/s.

"Data center staff need to maximize platform performance and extend platform longevity. Neo Forza's qualified DDR4 server memory assures these factors are met cost-effectively," said Jess Kung, vice president of sales. "Goldkey Technology Corporation has been on the forefront of the memory industry and is an integrated-circuit (I/C) specialist with technical acumen of more than 15 years. The successful qualification program amplifies our intrinsic value to our global customers."

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce (formerly DRAMeXchange). Kingston retains its number 1 position with an estimated 78.7% market share on $14.2B (USD) revenue. TrendForce states that Kingston increased revenue by 8% YoY marking the 19th consecutive year that Kingston has held the top spot.

According to the report, the world's top five memory module houses accounted for 90% of total sales in 2021 with Kingston holding nearly 80% of that market. As one of the leading buyers of DRAM chips in the world, Kingston provides a highly customized production model which has led to continuous growth in shipment scale and drove increased revenue by 8%. TrendForce states that pandemic-induced lifestyle changes and the demand for distance learning grew in the past two years, driving the growth of DRAM module shipments. Kingston took the approach to be prepared for those segments. Kingston's success is largely attributed to their working attitude of 'Kingston Is With You,' which solidifies the dominant force the company holds among consumers and organizations alike looking to upgrade new and existing systems.

Montage Technology, a leading data processing and interconnect IC design company, today announced that it is delivering the world's first Gen1 DDR5 Clock Driver (CKD or DDR5CK01) samples to the top DRAM memory vendors for their development of memory modules used in new-generation desktop and notebook computers.

For a long time, the clock driver functions have been integrated onto the register clock driver (RCD) device, which is used in the server platforms, rather than the PC computers. With the boost of the DDR5 data rate, the frequency of the clock signal becomes higher and higher, and the signal integrity issue of the clock becomes more and more challenging. As the DDR5 data rate reaches 6400MT/s and above, the memory modules such as UDIMMs and SODIMMs used in desktop and notebook computers, will need an on-DIMM clock driver to buffer and re-drive the clock signal of the memory modules, to meet the signal integrity and reliability requirement of the high-speed clock signal.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

SMART Modular Technologies, Inc. a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new Compute Express Link (CXL) Memory Module, the XMM CXL memory module. SMART's new DDR5 XMM CXL modules helps boost server and data center performance by enabling cache coherent memory to be added behind the CXL interface, further expanding big data processing capabilities beyond the current 8-channel/12-channel limitations of most servers.

The industry adoption of composable serial-attached memory architecture enables a whole new era for the memory module industry. Serial-attached memory adds capacity and bandwidth capabilities beyond main memory DIMM modules. Servers with XMM CXL modules can be dynamically configured for different applications and workloads without being shut down. Memory can be shared across nodes to meet throughput and latency requirements.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

Intel 700-series chipset motherboards could come with improved memory overclocking capabilities, suggest an alleged leaked specs-sheet of an MSI Intel Z790 chipset motherboard. As the pioneering platform for DDR5, Intel 600-series chipset motherboards, particularly those based on the Z690, typically marketed DDR5 memory overclock speeds of around DDR5-6000 or DDR5-6200 in their specs sheets, as the then-expensive DDR5 memory kits started at JEDEC-spec speeds of DDR5-4800 in the entry-level, with performance-segment kits around the DDR5-6000 mark.

The unnamed MSI Z790 chipset motherboard supports DDR5 overclocked frequencies of over DDR5-6800 at 1DPC (one DIMM per channel) with single-rank modules; over DDR5-6400 with 1DPC + dual-rank modules; over DDR5-6400 with 2DPC + single-rank modules; and over DDR5-5600 with 2DPC + dual-rank. Earlier reports suggested that Intel is "discouraging" motherboard vendors from coming up with 700-series motherboards that feature DDR4 memory slots, but this doesn't mean there won't be any. MSI has an Intel Z790 motherboard with DDR4 slots in the works, and it's capable of overclocks of up to DDR4-5000 in the most optimal configuration, and DDR4-4000 in the least optimal one.

AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today announced its new product family of mainstream dual socket storage servers. Powered by 3rd Gen. Intel Xeon Scalable processors, these rackmount storage servers are high-performance and designed with high flexibility to support various storage devices. This new product family provides options ranging from cost-efficiency servers to high performance all-flash NVMe platforms and can fulfill wide range of data storage applications from storage tiering, virtualization to cloud datacenters and high performance computing (HPC).

This new product family includes three models, SB101-A6, SB202-A6 and SB201-A6. These dual socket server systems are with AIC server board (codename: A6) that is based on 3rd Gen. Intel Xeon Scalable processors. By leveraging 3rd Gen. Intel Xeon Scalable processors 'great features, including CPU TDP supports up to 270 W, DDR4 memory, PCIe Gen4 ready, built-in AI and enhanced security, the new server systems provide excellent performances and low latency while maintaining the cost-effective benefits. Customers can utilize the enhanced Intel CPU performances, memory capabilities and doubled PCIe Gen4 I/O bandwidth to tackle the challenges in data storage workloads. Besides, the new server systems are designed with universal (tri-mode) backplanes and are able to support SAS, SATA, and NVMe, providing great flexibility for customers to load either 3.5"or 2.5" HDDs/SSDs. With tool-less features, the new server systems can save operators significant amount of maintenance resources, which is crucial for hyper-scaler and cloud environments.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the release of Kingston FURY Renegade DDR5 and Kingston FURY Renegade DDR5 RGB memory. The Kingston FURY Renegade DDR5 family is engineered to maximize the performance of your system.

Kingston FURY Renegade DDR5 family pushes the performance of next-gen DDR5 platforms to the extreme with ultra-fast memory up to 6400MT/s1and quick CL32 timings. With premium components hand-tuned by engineers, rigorously tested for compatibility across the industry's leading motherboards, backed by 100% factory testing at speed, and Intel XMP 3.0 Certified, customers can enjoy the ultimate overclock experience.

World-leading memory manufacturer, Team Group is embracing the new DDR5 generation in full force by offering products that meet a wide range of user demands. In this case, T-CREATE, Team Group's label targeting content creators, is launching the EXPERT Desktop DDR5 RAM and CLASSIC SO-DIMM Laptop DDR5 RAM to serve the booming digital content market and join hands with digital content creators around the world to usher in the next generation.

T-CREATE's EXPERT Desktop DDR5 RAM, unlike its DDR4 iteration, uses a dedicated DDR5 cooling module and all-new cooling fin design to strengthen cooling under high-intensity applications and ensure digital content creators can continue to experience high-speed performances at the ideal operating temperature. Digital content creators require strong performances and large capacities. The EXPERT DDR5 has the specs to achieve speeds of up to 5600 MHz and dual-channel options available in 16 GB x2 or 32 GB x2, which can fulfill any multi-tasking needs and drastically enhances the creative experience.

In response to the evolution of industrial DDR5 memory platform specifications, global memory brand TEAMGROUP has utilized its outstanding R&D capabilities to develop the first industrial U-DIMM, SO-DIMM, ECC-DIMM, and R-DIMM DDR5 memory modules at 5,600MHz clock speeds and run at 1.1V. They are expected to meet the diverse needs of next-generation platforms, Intel Raptor Lake and AMD Raphael-X, with high-performance specifications in line with JEDEC standards, accelerating the development of high-end industrial applications.

TEAMGROUP has been making strides in the industrial market for years and is focused on DDR5 memory applications. The company previously developed a complete range of DDR5 4,800 MHz modules, and now thanks to its industry-leading R&D, TEAMGROUP has successfully increased the frequencies of its DDR5 product line to 5,600 MHz. For added security in industrial applications, an SPD Write Protection feature was also adopted, which prevents SPD parameter changes caused by abnormal interference. With these enhancements, the risk of shutdown is greatly reduced and the memory is able to operate with substantially improved performance and stability.

To meet the demand for all types of multi-tasking, high-clock-speed experiences, and high-performance computing as well as to provide users with a full range of DDR5 upgrade options, TEAMGROUP, a global memory leader, has announced the release of its newly-updated ELITE SO-DIMM DDR5 and ELITE U-DIMM DDR5 5600 MHz high-speed memory modules. Both models will be available on Amazon in North America in early July, 2022. The high clock speed allows for higher-performance DDR5 memory for both desktop and laptop computers, enhancing user productivity and improving overall operational efficiency and storage performance. Consumers worldwide can also enjoy a more stable and efficient experience with lower power consumption provided by TEAMGROUP's ELITE memory.

In response to the growing demand for high-speed computing and digital technology, TEAMGROUP has introduced the upgraded ELITE SO-DIMM DDR5 5600 MHz and ELITE U-DIMM DDR5 5600 MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of business, learning, and entertainment applications on desktop and laptop computers. With a low operating voltage of 1.1 V, the power consumption of the memory is significantly reduced, extending the life of computers it is installed on. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process double the amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.