BIWIN is a major memory and SSD OEM that manufactures products for leading PC brands, including Lenovo, HP, and Acer. These include everything from USB flash drives, to portable SSDs; and even memory DIMMs. Acer has been trying to enter the DIY hardware market in a big way with its Predator brand, it's tapping into BIWIN for the memory side of things. We've had the Acer Predator Hermes DDR5 RGB series at the high-end; and the Pallas II DDR5 series at the entry level, and Acer is looking to fill the gap with the Vesta II DDR5 series. The original Vesta II series won a Red Dot design award in 2022. The Vesta II comes in certain upper mid-range speeds of DDR5-6000, DDR5-6400, DDR5-6600, and DDR5-6800; with capacities that include 32 GB (2x 16), and 64 GB (2x 32 GB). We also ran into some SSDs that strick to Acer's main marquee, which includes the FA200, a PCIe Gen 4 drive, which is based on a high-end Gen 4 platform, with speeds of up to 7.2 GB/s sequential reads, and up to 6.2 GB/s sequential writes. The drive comes in capacities of up to 4 TB.

Switching gears, we see the first Lenovo-branded DIY client SSDs in the retail channel. The LN960 is a fairly premium M.2-2280 drive with a Gen 4 x4 interface, capacities of up to 4 TB, sequential speeds of up to 7.4 GB/s, and a graphene-based heatspreader. The LN860 is an entry-level NVMe drive based on a Gen 3 x4 interface, with sequential speeds of up to 3.5 GB/s. The LS800 is is being offered more as an upgrade option for those still on older machines with a 2.5-inch SATA 6 Gb/s drive bay. It comes in capacities of up to 1.92 TB, has modern SLC caching technology, and offers sequential speeds of up to 520 MB/s.

Montage Technology, a leading data processing and interconnect IC company, today introduced its 4th-gen DDR5 Registering Clock Driver (RCD), also called DDR5 RCD04, to the industry. Designed for DDR5 RDIMM memory modules, this chip supports blazing-fast data rates up to 7200 MT/s, a 50% increase over the 1st-gen DDR5 RCDs.

As a leader in memory interface technologies, Montage has led the development of JEDEC standards for DDR5 RCD chips and sustains high R&D investments to enable continuous product iterations and upgrades. Since debuting its 1st-gen DDR5 memory interface and memory module supporting chips in 2021, the company successfully released the second and third generation DDR5 RCD chips in 2022 and 2023 respectively.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its state-of-the-art Gen 4 DDR5 Registering Clock Driver (RCD) which began sampling to the major DDR5 memory module (RDIMM) manufacturers in the fourth quarter of 2023. The Rambus Gen 4 RCD boosts the data rate to 7200 MT/s, setting a new benchmark for performance and enabling a 50% increase in memory bandwidth over today's 4800 MT/s DDR5 module solutions. It supports the rapid pace of server main memory performance improvements to meet the demands of generative AI and other advanced data center workloads.

"With memory being an essential enabler of server performance, the need for greater memory bandwidth continues its meteoric rise driven by demanding workloads like generative AI," said Sean Fan, chief operating officer at Rambus. "The Rambus Gen 4 DDR5 RCD is the latest demonstration of our commitment to providing leadership products ahead of the market need to support our customers' current and planned server platforms."

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly announces that GIGABYTE DDR5 motherboards deliver breakthrough support for a memory capacity of single DIMM 64 GB with the latest Kingston FURY Renegade DDR5 memory. The 4DIMM model boosts the memory capacity up to 256 GB, while the 2DIMM model has a maximum capacity of up to 128 GB.⁠

With innovative layout design and top-notch components, GIGABYTE motherboards have played a leading role in memory performance. From the Intel 700 and 600 series to the AMD 600 series, GIGABYTE DDR5 motherboards will support a memory capacity of single DIMM 64 GB through BIOS update. The updated BIOS and memory support list will be available on the GIGABYTE official website, coinciding with the launch of the latest Kingston FURY Renegade DDR5 memory. Please stay tuned to the GIGABYTE official website for further information.

ASRock is announcing the support of 64 GB DDR5 memory module across Intel 700 Series and AMD AM5 Series motherboards. This enhancement boosts the maximum memory capacity to 256 GB with 4 DIMMs, offering increased performance and compatibility for enthusiasts. Additionally, we are committed to expanding support for the 64 GB DDR5 memory module across more motherboards with various chipsets, enhancing productivity for memory-intensive multitasking applications.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

SK hynix presented its leading AI and high-performance computing (HPC) solutions at Supercomputing 2023 (SC23) held in Denver, Colorado between November 12-17. Organized by the Association for Computing Machinery and IEEE Computer Society since 1988, the annual SC conference showcases the latest advancements in HPC, networking, storage, and data analysis. SK hynix marked its first appearance at the conference by introducing its groundbreaking memory solutions to the HPC community. During the six-day event, several SK hynix employees also made presentations revealing the impact of the company's memory solutions on AI and HPC.

Displaying Advanced HPC & AI Products
At SC23, SK hynix showcased its products tailored for AI and HPC to underline its leadership in the AI memory field. Among these next-generation products, HBM3E attracted attention as the HBM solution meets the industry's highest standards of speed, capacity, heat dissipation, and power efficiency. These capabilities make it particularly suitable for data-intensive AI server systems. HBM3E was presented alongside NVIDIA's H100, a high-performance GPU for AI that uses HBM3 for its memory.

KLEVV, an emerging memory brand introduced by Essencore, is excited to unveil brand new additions to its high-capacity non-binary DDR5 overclocking memory range, meticulously designed to meet the demanding needs of gamers, content creators, and PC enthusiasts across the globe. KLEVV's DDR5 memory lineup now boasts novel non-binary and high-capacity combinations aimed at bringing users a diverse, cutting-edge product range.

Globally popular CRAS V RGB, CRAS XR5 RGB, and BOLT V DDR5 gaming/overclocking memory are now available in non-binary 48 GB (24 GB x2) and high-capacity 64 GB (32 GB x2) kits, ensuring enhanced performance and multitasking capabilities. Ideal for modern-day computing needs, these new units are suitable for PC workstations and gaming rigs that settle for nothing but the very best. KLEVV's CRAS V RGB and CRAS XR5 RGB DDR5 gaming/overclocking memory offer up to 8000MT/s clock speed, perfect for content creators seeking to harness the unparalleled performance of the latest DDR5 technology.

Montage Technology, a leading data processing and interconnect IC company, today announced it has taken the lead in trial production of the 3rd-generation DDR5 Registering Clock Driver (RCD03) designed for use in DDR5 RDIMMs. With its blazingly fast 6400 MT/s data rate, the RCD03 sets a new bar for DDR5 memory performance in upcoming server platforms. It unlocks dramatic capacity, bandwidth, and latency improvements to meet the growing demands of data center, cloud, and AI applications.

The RCD03 marks a major advancement in Montage's continued role as an innovator driving rapid DDR5 developments. This chip achieves a 14.3% speed increase over the 2nd-gen DDR5 RCD and a 33.3% increase over the 1st--gen, making it one of the fastest DDR5 memory interface solutions available today.

Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops - and potentially even data centers. Samsung's groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel's platform. Historically, PCs and laptops have conventionally used LPDDR DRAM or DDR-based So-DIMMs. While LPDDR is compact, it's permanently attached to the motherboard, making it challenging to replace during repairs or upgrades. On the other hand, So-DIMMs can be attached or detached easily but have limitations with performance and other physical features.

LPCAMM overcomes the shortcomings of both LPDDR and So-DIMMs, addressing the increased demand for more efficient yet compact devices. Being a detachable module, LPCAMM offers enhanced flexibility for PC and laptop manufacturers during the production process. Compared to So-DIMM, LPCAMM occupies up to 60% less space on the motherboard. This allows more efficient use of devices' internal space while also improving performance by up to 50% and power efficiency by up to 70%. LPDDR's power-saving features have made it an attractive option for servers, since it could potentially improve total cost of operation (TCO) efficiency. However, using LPDDR can create operational difficulties such as the need to replace the entire motherboard when upgrading a server's DRAM specifications. LPCAMM offers a solution to these challenges, creating significant potential for it to become the solution of choice for future data centers and servers.

When Crucial cancelled its Ballistix gaming brand, it was unclear if the company would launch higher-end products in the future, although the company never said it wouldn't. Back in May of this year, Crucial launched its Pro series of memory, which was not exactly pro, at least not for the readership here which is used to an entirely different level of RAM. This was largely due to Crucial sticking to JEDEC spec, even though the company did launch some DDR5 5600 MHz modules.

Now—some six months later—it appears that Crucial is getting ready to deliver some higher performance modules with its new DDR5 6000 MHz modules, although at launch, they will only be available in a kit of two 24 GB modules. Although Crucial claims JEDEC spec, the 48-48-48 timings appear to either be slightly tighter than the original JEDEC spec, or JEDEC has updated the specs since they were announced. Although nothing about these modules screams high-end or pro, there's one thing that makes these stand out against the competition, they operate at 6000 MHz using only 1.1 Volt, whereas most 6000 MHz DIMMs on the market today, operate at 1.35 Volt higher. In addition to that, as these are JEDEC spec DIMMs, there's no need to enable XMP/EXPO settings to make them work at 6000 MHz, which could be a benefit to some. There might be some potential for tweaking these modules as well, something we'll have to wait for reviews to find out about. Crucial is asking for US$166.99 for the 48 GB kit, which puts them at a price disadvantage compared to its competitors, as you can get a similar kit for as little as $115 or possibly even less.

V-Color Technology Inc, announced the highly anticipated expansion of their product lineup with the launch of the MANTA XPrism RGB DDR5 48 GB (2x 24 GB) Kit, now available in the SCC 2+2 configuration starting this mid-August. This combo will feature speeds from 6200 up to 6600. The kit showcases v-color's commitment to innovation and quality, highlighted by the Patented RGB Filler Kit designed specifically for Intel systems. It is fully Intel XMP 3.0-Ready, ensuring seamless automatic overclocking. It offers full control over lighting and performance, while being synchronized across motherboards from leading brands like ASUS, GIGABYTE, MSI, and ASROCK. The MANTA XPrism RGB DDR5 48 GB (2x 24 GB) Kit in SCC 2+2 configuration is set to be available in mid-August 2023, providing tech enthusiasts and professionals alike with a remarkable solution for their computing needs.

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

During yesterday's HBM3 Gen2 memory products yesterday, Micron also shared an updated roadmap with select media and partners. The most interesting details on that roadmap were updates to DRAM and GDDR memory products, with increases in capacity coming for both types of memory. Micron is aiming to launch 32 Gbit or 4 GB DDR5 memory ICs somewhere in the beginning of 2024, which means we can look forward to 32 GB single sided DIMMs with a single DRAM die per memory IC. This should, in theory at least, enable cheaper 32 GB DIMMs, but as always, it's unlikely that the cost saving will be passed on to the end customer. As far as server customers goes, Micron is planning 128 GB DIMMs for 2024, followed by 192 GB DIMMs in 2025 and 256 GB DIMMs in 2026.

When it comes to GDDR, Micron will be launching JEDEC standard GDDR7 memory with 16 and 24 Gbit dies, or 2 and 3 GB capacity, the latter could be the highest capacity GDDR7 memory IC on the market and could see some interesting graphics card configurations. Micron is promising speeds of up to 32 Gbps per pin or 128 GB/s per chip, which is a big jump up from its current best GDDR6X memory which tops out at 24 Gbps per pin or 96 GB/s per chip. GDDR7 differs from Micron's proprietary GDDR6X by using PAM-3 rather than PAM-4 signalling, although this is simply something that the likes of AMD and NVIDIA would have to design their GPUs around. Micron doesn't appear to have any plans for GDDR7X at this point in time. The company is also working on several new iterations of HBM memory over the coming years, with the company expecting to hit 2 TB/s sometime in 2026 or later.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

In July 2022, Intel announced that the company was winding down its Optane division, effectively discontinuing the development of 3D XPoint memory that it has been marketing for a long time. Once viewed as a competitive advantage, the support for Optane has been removed from future platforms. However, Intel has announced plans to extend Optane shipments by another quarter amidst additional stock or significant demand from customers buying Optane DIMMs for their enterprises. Initially set to ship the final Optane Persistent Memory 100-series DIMMs on September 30, Intel extends this date by three months to December 29, 2023.

Intel states, "Customers are recommended to secure additional Optane units at the specified 0.44% annualized failure rate (AFR) for safety stock. Intel will make commercially reasonable efforts to support last time order quantities for Intel Optane Persistent Memory 100 Series."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce a new white colored edition of its flagship Trident Z5 RGB series DDR5 memory, featuring extreme overclocked speeds of up to DDR5-8200 at 24 GB x 2 kit capacity.

The White Choice of Overclocked Performance DDR5 Memory
The new white version of the Trident Z5 RGB series boasts a sleek white aluminium heat spreader and features a black brushed-aluminium strip inset across the center, providing PC enthusiasts an ideal high-performance overclocked memory kit in a white themed PC build.

Innodisk has the right idea about how to do PCIe Gen 5 NVMe SSDs—to ditch the M.2 form-factor, and make them PCIe add-in cards. This would remove the need for cartoonishly disproportionate cooling solutions with high-pitched 20 mm fans; and rather allow SSD designers to use cooling solutions resembling those of graphics cards. Gen 5 NVMe controllers have a TDP of around 15 W, or roughly similar to that of a motherboard chipset. The M.2-2280 form-factor is tiny for the deployment of a sufficiently large heatsink, and so SSD designers are resorting to active cooling, using 20 mm fans that don't sound pleasant. Most single-slot VGA cooling solutions can make short work of 15 W of heat while being much quieter, some even fanless.

The Innodisk 5TG-P AIC SSD uses a PCIe Gen 5 + NVMe 2.0 SSD controller with a large passive heatsink, a PCI-Express 5.0 x4 host interface, and 32 TB of capacity. The drive runs entirely on slot power, and besides the 3D TLC NAND flash, uses a large DDR4 DRAM cache. The company claims sequential transfer speeds of up to 13 GB/s in either direction. Innodisk is targeting the PCIe 5TG-P at workstation and HEDT use-cases. The company is building them in server-relevant form-factors such as U.2 and E.1S. A CDM screenshot shows 13.62 GB/s sequential reads, with 11.55 GB/s sequential writes.

Neo Forza, a Taiwanese brand entity under Goldkey Technology Corporation, had a booth at Computex 2023, where the company showed its next-generation memory and storage products. Starting off, the company presented its DDR5 memory kits running at 8000 MHz speeds, indicating the maturity of DDR5 and that we are way past the initial 4800 MHz speeds at launch. The demonstrated kit was a part of the company's TRINITY lineup, which was displayed in white. For demo purposes, the kit was configured as two 16 GB DIMMs.

Next up, Neo Forza has showcased its next-generation PCIe Gen 5 NVMe SSD. Running at x4 lanes of the new PCIe 5.0 protocol, the 2 TB SSD was spotted running at 10 GB/s speeds in both read and write tasks set by CrystalDiskMark benchmark. Interestingly, the SSD also boasted a massive heatsink, as shown below.

G.Skill a the 2023 Computex showcased its fastest DDR5 memory kits, including some high-performance kits in the non-standard 24 GB DIMM densities. Our visit to the G.Skill booth begins with a handful very boutique custom PC builds. One of them looks like a xenomorph egg, another like a glass pyramid, and another like an Intel semiconductor wafer, and another like sci-fi drilling platform. The Trident Z5 series of DDR5 memory form the bullwark of G.Skill's current-gen lineup. The company showcased a W790 + Xeon W9-3495X workstation build with an 8-channel, 384 GB (8x 48 GB) DDR5-6000 memory setup, with rather tight timings of 30-39-39-96T.

The company also showed us how fast some of its non-standard capacity DIMMs can get, with a DDR5-6800 96 GB (2x 48 GB) build with 34-46-46-108 timings. The star attraction was a build with 48 GB memory (2x 24 GB), and a stellar DDR5-8000, at 40-48-48-128, and G.Skill even performed a live overclocking event, overclocking this to DDR5-8800 speed. Among the memory module models are special gold and silver-chrome variants of the Trident Z5 RGB, and debuting for the very first time, are the Trident Z5 Royal, with its premium aesthetic, and crushed-ice looking LED diffuser.The boutique builds at G.Skill booth follow.

ADATA and XPG, its gamer focused sub-brand, unveiled a plethora of memory and storage products at the 2023 Computex. We begin with PC memory, and we see the company showing off its upcoming models of the XPG DDR5 memory targeting enthusiasts. These include the XPG Caster RGB DDR5, which is capable of DDR5-9000, the XPG Lancer RGB ROG edition, capable of DDR5-7200, and the company's overclocking-capable DDR5-6400 R-DIMM targeting Xeon W workstations. The company also showed us "Project NeonStorm." This is an innovative new SSD cooling system that uses a self-contained liquid cooler.

The way this liquid cooler works is that a high conductivity heat spreader transfers heat to a chamber containing a coolant fluid. This coolant heats up an aluminium alloy tube via convection. The inner wall of this tube serves as an airflow channel for a 20 mm fan. ADATA claims that this solution offers "over 20% better heat dissipation compared to SSDs without water cooling." This is also one of the very first SSDs we've seen that utilize Silicon Motion SM2508 PCIe Gen 5 NVMe controller. ADATA claims sequential reads of up to 14 GB/s, with up to 12 GB/s sequential writes. The drive comes in capacity-based models of up to 8 TB (could include 2 TB, 4 TB, and 8 TB). ADATA also showed off the Legend 970 PCIe Gen 5 NVMe SSD that uses a Phison E26-series controller, and comes in capacities of 1 TB and 2 TB. This drive belts out up to 10 GB/s reads, with up to 10 GB/s writes.

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

PC OEM giant Acer has a growing lineup of retail channel PC products, including DIY enthusiast PC hardware under its Predator brand. The company showed some of this off at the 2023 Computex, in a booth organized by its memory products OEM BIWIN. First up, we have the Predator Hermes RGB line of high-end DDR5 memory kits. These feature elaborate aluminium heatspreaders with RGB LED illumination. We caught one of these in action, with a multi-zone RGB lighting. The Hermes RGB comes in 32 GB (2x 16 GB), and 64 GB (2x 32 GB) kits, and in speeds of DDR5-6800, DDR5-7200, DDR5-7600, DDR5-7800, and DDR5-8000, with CAS latencies ranging between 32 to 36T, and module voltages between 1.40 V to 1.45 V.

Among the consumer storage products showed off by the company include the MSC300 line of UHS-I microSDXC cards capable of 160 MB/s sequential speeds, which comes in capacities ranging between 32 GB to 256 GB. Among the SSD products shown were stuff we are already familiar with, including the FA100 Gen 4 NVMe SSD, RE100 Gen 3 NVMe SSD, the SA100 and RE100 SATA 6 Gbps SSDs; the SD100 lines of DDR4 and DDR5 SO-DIMM memory for laptops; CFE100 line of CFexpress cards, and and handful USB flash drives (UFDs).

At the 2023 Computex, we caught CORSAIR's flagship PC memory line, the DOMINATOR Titanium DDR5 series. These are built to, well, dominate the overclocking and benchmark records scene, and come in several high-speed models, such as DDR5-8000 and DDR5-8266, and capacities as high as 192 GB (4x 48 GB kits). The company also has a limited batch of 500 "First Edition" kits, which feature a gold-on-white color scheme, and the company's highest grade of manual binning.

A defining feature about the DOMINATOR Titanium DDR5 series is their heat spreader design, which consists of 2 mm-thick aluminium making contact with the DRAM chips, which connect to an upper copper heatsink with RGB LEDs studded. The edges of the top have mount-holes, so a set of 2 or 4 of these DIMMs can be bolted onto the company's latest DHX cooling module. This is essentially a chunky slab of anodized aluminium that soaks up and dissipates heat from the DIMMs, and has slats that let the RGB lighting through. CORSAIR is backing these with lifetime warranties, and plans to launch them in July 2023.