HyperX has launched their Impact lineup of DDR4 DRAM, which boasts of high memory densities per stick for space-constrained setups such as laptops or SFF PCs. The new Impact SODIMMs are available in capacities up to 32 GB per stick, which should make possible for users to install up to 64 GB of DDR4 RAM in their system. All Impact SODIMM operate at 1.2 V, thus enabling relatively low power consumption.

Available operating frequencies stand at 2400 MHz (15-15-15); 2666 MHz (16-18-18); 2933 MHz (17-19-19); and 3200 MHz (20-22-22) - timings are slightly loose, but that's to be expected at these densities and, most importantly in space and/or cooling-constrained environments, voltage. HyperX Impact SODIMMs are available in single modules, dual channel kits, and quad channel kits. MSRP starts at $77 for a 16 GB module running at 2400 MHz, and apparently tops out at $358.99 for 2x 32 GB modules at 3200 MHz.

Kingston Technology Europe Co LLP, an affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has been ranked the top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce (formerly DRAMeXchange). Kingston retains its number 1 position with an estimated 80.33% market share on $12.9B (USD) revenue, according to TrendForce. The rankings for 2019 mark the 17th consecutive year that TrendForce has placed Kingston in the top spot.

TrendForce states DRAM prices were lower in 2019 due to an ample supply combined with weaker demand from both the server and client sides, thus resulting in less revenue for many module makers. Kingston was one of the few manufacturers to go against this trend and see market share grow, according to the analysts. Kingston has maintained its competitive advantage by working closely with its partners and customers to remain flexible while adapting to their ever-changing needs as well as market conditions. The following chart with results provided by TrendForce shows the top 10 DRAM module suppliers:

Transcend, a leading brand of industrial-grade memory products and storage solutions, recently announced the release of a new series of industrial-grade DDR4-3200 memory modules. Aiming at 5G networking and intelligent computing at the edge, DDR4-3200 memory modules feature high transmission bandwidth at 3200MT/s, low latency, and low power consumption, running at 1.2 V. The line-up includes Unbuffered Long-DIMM, Unbuffered SO-DIMM, ECC Long-DIMM, ECC SO-DIMM, and Registered Long-DIMM, addressing the varied, and often strict, form factor requirements of vertical markets. Fully complied with JEDEC specification, DDR4-3200 memory modules are optimized for Intel, AMD, and ARM processors. The DDR4-3200 DIMMs are ready to power up embedded telecommunication, in-vehicle, gaming, and smart healthcare applications in the approaching AIoT decade.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the widely-anticipated JESD79-5 DDR5 SDRAM standard. The standard addresses demand requirements being driven by intensive cloud and enterprise data center applications, providing developers with twice the performance and much improved power efficiency. JESD79-5 DDR5 is now available for download from the JEDEC website.

DDR5 was designed to meet increasing needs for efficient performance in a wide range of applications including client systems and high-performance servers. DDR5 incorporates memory technology that leverages and extends industry know-how and experience developing previous DDR memories. The standard is architected to enable scaling memory performance without degrading channel efficiency at higher speeds, which has been achieved by doubling the burst-length to BL16 and bank-count to 32 from 16. This revolutionary architecture provides better channel efficiency and higher application level performance that will enable the continued evolution of next-generation computing systems. In addition, the DDR5 DIMM has two 40-bit fully independent sub-channels on the same module for efficiency and improved reliability.

New features, such as DFE (Decision Feedback Equalization), enable IO speed scalability for higher bandwidth and improved performance. DDR5 supports double the bandwidth as compared to its predecessor, DDR4, and is expected to be launched at 4.8 Gbps (50% higher than DDR4's end of life speed of 3.2 Gbps).

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, is excited to announce the launch of their new 32 GB memory modules into the VIPER STEEL SERIES DDR4 PERFORMANCE MEMORY. The new 32 GB modules are available in both UDIMM and SODIMM. The frequencies from 3000 MHz to 3600 MHz are available for UDIMM and the frequencies from 2400 MHz to 3000 MHz for SODIMM. The new modules are built from rigorously tested memory chips and components on a ten-layer PCB for optimum performance in gaming desktops and laptops.

The VIPER STEEL provides extra gaming performance and stability for the most demanding desktop and laptop environments across the latest Intel and AMD platforms. The VIPER STEEL modules bring Intel XMP 2.0 performance to the next level by offering hardcore gamers and enthusiasts the possibility to upgrade their gaming systems with more DRAM memory capacity and further extending their potential.

BIOSTAR, a leading manufacturer of motherboards and graphics cards, today announced the new RACING Z490GTA and the RACING Z490GTN motherboards which powers the new 10th Gen Intel Core processors. Geared Towards power efficiency and flawless performance, the BIOSTAR RACING Z490GTA and the RACING Z490GTN motherboards have been built to last, with its stylish RACING DNA carried down from their premium flagship motherboard the RACING Z490GTA EVO.

Much similar to their elder sibling, BIOSTAR's RACING Z490GTA and the RACING Z490GTN motherboards are built around the new LGA 1200 socket designed to support the high power requirements of the new 10th generation of Intel Core processors with their new microarchitecture Z490 chipset, and BIOSTAR has taken extra steps to ensure that their products are designed and tuned to perfection to run these processors on blazing fast boost speeds with some radical new features such as the Super Hyper PWM system that delivers stable power with 100% fixed voltage and offers excellent precision, performance and reliability.

GeIL has today announced a new line of memory for Intel 10th Gen and AMD Ryzen 4000 series mobile processors. The new 64 GB kit offered as 2x 32 GB DDR4-3200 modules is simply called "SO-DIMM". This new kit features high-density chips and a standard operating voltage of 1.2 V which helps maximize system performance. The new series of modules will also feature lower speed kits in DDR4 2933 MHz 64 GB and DDR4 2666 MHz 64 GB. The 3200 MHz kit comes with a latency of 22-22-22-52 while the 2933 Mhz features 21-21-21-48 and the 2666 MHz 19-19-19-43 which are all similar to other vendors offerings. These new kits should offer gamers and content creators a robust memory upgrade path for mobile devices, pricing and availability were not announced.

Deepcool today announced a refresh of their previously-released GAMMAXX X 400 tower cooler. The new version will see improved cooling performance, due in no small part to the new dual-fan support. DIMM clearance has also been revisited, so as to prevent the new GAMMAXX 400 EX from interfering with your DIMM slot installation. The number of fins has been increased to 56, which means an extra 20% heat dissipation are that can be served by the increased airflow from the dual-fan configuration. A 4x 6 mm sintered copper heat pipe design (sintered as in, produced via pressure or temperatures that don't liquefy the copper) with Direct Touch technology should accelerate heat transfer form the CPU heatsink through to the cooling fins.

This is kind of a weighty design, coming in at 930 g for a cooling solution. Dimensions stand at 129 mm width, 103 mm thickness, and 157.5 mm height. It's expected the GAMMAXX 400 EX will be available around the $39 mark. For that pricing, it includes 2x TF120 high performance fans.

Cadence, a fabless semiconductor company focusing on the development of IP solutions and IC design and verification tools, today posted an update regarding their development efforts for the 5th generation of DDR memory which is giving us some insights into the development of a new standard. The new DDR5 standard is supposed to bring better speeds and lower voltages while being more power-efficient. In the Cadence's blog called Breakfast Bytes, one of Cadence's memory experts talked about developments of the new standards and how they are developing the IP for the upcoming SoC solutions. Even though JEDEC, a company developing memory standards, hasn't officially published DDR5 standard specifications, Cadence is working closely with them to ensure that they stay on track and be the first on the market to deliver IP for the new standard.

Marc Greenberg, a Cadence expert for memory solutions was sharing his thoughts in the blog about the DDR5 and how it is progressing. Firstly, he notes that DDR5 is going to feature 4800 MT/s speeds at first. The initial speeds will improve throughout the 12 months when the data transfer rate will increase in the same fashion we have seen with previous generation DDR standards. Mr. Greenberg also shared that the goals of DDR5 are to have larger memory dies while managing latency challenges, same speed DRAM core as DDR4 with a higher speed I/O. He also noted that the goal of the new standard is not the bandwidth, but rather capacity - there should be 24Gb of memory per die initially, while later it should go up to 32Gb. That will allow for 256 GB DIMMs, where each byte can be accessed under 100 ns, making for a very responsive system. Mr. Greenberg also added that this is the year of DDR5, as Cadence is receiving a lot of orders for their 7 nm IP which should go in production systems this year.

GIGABYTE has updated its Brix lineup of Mini-PCs with Intel's latest and greatest 10th generation Comet Lake mobile CPUs. Measuring 46.8 x 119.5 x 119.5 mm, the Brix mini PC is a small form factor machine with its 0,6-liter size. If anyone thinks that power is proportional to the size of a PC, the GIGABYTE Brix is here to prove them wrong. Available in four variants that differ only in CPU that is soldered inside, you can get anything from a dual-core Intel Core i3-10110U, all the way up to six-core Core i7-10710U CPU powerhouse. These CPUs are 15 W TDP models, so even though the Brix is small, its cooling solution should be able to handle the heat.

The Brix Mini-PC comes with a mounting bracket for 75 x 75 mm and 100 x 100 mm VESA mounts, meaning that you can place it behind a monitor. Storage options are limited to one 2.5-inch drive that can be up to 9.5 mm thick. For RAM, the Brix is using two SO-DIMM slots that can support up to 64 GB of DDR4 2666 MHz RAM. When it comes to connectivity options, GIGABYTE has equipped the Brix with Intel Dual Band Wireless-AC 3168 wireless adapter providing Bluetooth 4.2 and WiFi 802.11ac connectivity. The IO options are somewhat decent as Brix has three USB 3.2 Gen 2 ports at the front, along with a USB Gen 2 Type-C connector and 3.5 mm headphone jack. On the back, there are two HDMI 2.0a ports for video output, two additional USC 3.2 Gen 2 ports, power input, and of course an RJ45 Ethernet connector.

Razer had an interesting outing at CES 2020. There were no new PC gaming peripherals, other than Star Wars "storm trooper" co-branded Kraken, Goliathus, and Atheris; but three interesting exhibits. To begin with, Razer Kishi is an adjustable, split game controller for smartphones. The controller's two ends (meant for your left and right hands, wrap around the two ends of your smartphone. You get two analog thumbsticks, a D-pad, four action buttons, and four triggers. The Razer Gamepad app lets you map the controller to your smartphone over Bluetooth, and provides custom button mapping. The company also showed off Arctech line of smartphone sleeves that are designed to dissipate heat.

Having made its mark as a leading gaming notebook vendor, Razer is turning its attention to pre-built gaming desktops, and we saw one of its first creations, the Tomahawk SFF. Much like Apple, Razer has a serious focus on form as much as function, and that's evident with the aluminium CNC precision-milled chassis with tempered glass side-panels, and a size that's fit both for desks and the living room.

Crucial at CES 2020 showcased their upcoming changes to their memory portfolio, with their Crucial Ballistix lineup being condensed into just three brands: Ballistix, Ballistix RGB, and Ballistix MAX. These lineups replace the company's Ballistix Sport, Tactical, and Elite products under a redesigned portfolio and aesthetic language.

Ballistix will be the mainstream memory solutions, ranging through speeds from 2400 MHz to 3600 MHz and densities of 4 GB to 32 GB. The new, modernized aluminium heatspreader design is available in black, red, or white colors, and in DIMM or SODIMM form-factors. Ballistix RGB are basically the same sticks, but with an added 8 zones and 16 LEDs of RGB lighting to the heatspreader via usage of a diffuser.

Micron has today announced that it started sampling RDIMMs based on DDR5 technology to its industry partners. Designed for server operations, these DDR5 modules come in RDIMM form-factor and feature Error-Correcting Code (ECC) technology for removing any error that occurs inside electronic circuits. The new DDR5 standard offers a massive performance uplift compared to the previous generation of DDR4 memory. For starters, DDR5 will double the MT/s transfer rate to 6400 MT/s, double the speed of the original 3200 MT/s speed for DDR4 that was established by JEDEC. The bandwidth of the new DDR memory is supposed to be 32 GB/s, which is 25% faster than the original 25.6 GB/s bandwidth of DDR4.

With DDR5, the SDRAM prefetch buffer data size is being doubled to 16 data words per memory access, making for a 16n prefetching throughput. Another improvement is that the highest possible density for DDR5 chips is now being up to 64 Gb per chip. Additionally, DDR5 is supposed to bring the power needed for chip operation down to 1.1 volts, which is around 8% lower than what DDR4 achieved. There are also features like MIR (Mirror Pin) which provides better DIMM signaling, and more options for PRECHARGE and REFRESH commands that can now operate on a per bank basis, so specific banks can be refreshed in bank group. It is also worth pointing out that DDR5 chips are manufactured using 1znm memory manufacturing process.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the XPG Hunter DDR4 memory module. Geared toward PC enthusiasts and gamers, the XPG Hunter delivers all the benefits of DDR4 with remarkable performance and efficiency. It supports XMP 2.0 for easy overclocking and offers great stability, making it ideal for performance seekers - gaming to competitive benchmarking. It comes in U-DIMM and SO-DIMM variants to meet the needs of desktop and notebook users alike.

The XPG Hunter modules are made with high-quality chips selected through a strict filtering process. They are equipped with the finest PCBs and pass rigid reliability and compatibility tests to ensure longevity and rugged durability, which are vital for overclocking, gaming, and extreme benchmarking. The modules deliver high-speed performance of up to 3200 MHz and comes with capacities of 4 GB, 8 GB, 16 GB, or 32 GB to meet the needs of diverse users and budgets.

GIGABYTE expanded its AORUS RGB DDR4 memory family with two new kits that introduce a proprietary performance enhancement dubbed AORUS Memory Boost. Exclusive to GIGABYTE's AORUS-branded motherboards (listed below), and requiring a BIOS update to use, AORUS Memory Boost is a toggle that runs the memory at a clock-speed and timing combination that's a notch above its highest Intel XMP profile. For example, the memory kits debuting with the feature today feature an XMP 2.0 profile for DDR4-3600. Flicking on AORUS Memory Boost runs them at DDR4-3733, in essence making it an additional memory profile that's exclusive to GIGABYTE motherboards.

The memory kits being launched today are GP-AR36C18S8K2HU416R and GP-AR36C18S8K2HU416RD. The former is 2x 8 GB (16 GB) dual-channel, while the latter is 2x 8 GB (16 GB) with two dummy modules. These dummy modules fill up vacant DIMM slots, look and light up like real modules, and could boost the aesthetics of your build without having you spend on two additional real modules. Out of the box, the memory modules (real ones) in these kits run at DDR4-2667 with 19-19-19-43 on Intel processors and 20-19-19-43 on AMD ones. The included DDR4-3600 XMP profile has timings of 18-19-19-39. GIGABYTE didn't mention how AORUS Memory Boost affects timings. Out of the box, the module voltage is 1.2 V, and the XMP profile dials it up to 1.35 V. The dummies work with whatever module voltage you specify in the BIOS, and interface with GIGABYTE RGB Fusion software. The company didn't reveal pricing.

Apacer, the leading manufacturer of industrial-grade memory, announces the release of the XR-DIMM. This rugged memory module is the first on the market to meet the exacting standards of the US RTCA DO-160G test, an aviation equipment certification that marks the XR-DIMM as resistant to high levels of vibration and therefore ideal for defense and aeronautical applications.

Since 2018, Apacer has been manufacturing DDR4 XR-DIMM modules with rugged stability in mind. Though previous models have been compliant with MIL-STD-810G, this new module is the first to be proven compliant with the US RTCA DO-160G standard, making it the ideal choice for manufacturers who need reliable operation through extreme vibration and shock.

GIGABYTE, a leading server systems builder which recently released a total of 17 new AMD EPYC 7002 Series "Rome" server platforms simultaneously with AMD's own official launch of their next generation CPU, is proud to announce that our new systems have already broken 11 different SPEC benchmark world records. These new world records have not only been achieved against results from all alternative processor based systems but even against competing vendor solutions using the same 2nd Generation AMD EPYC 7002 Series "Rome" processor platform, illustrating that GIGABYTE's system design and engineering is perfectly optimized to deliver the maximum performance possible from the 2nd Generation AMD EPYC.

Samsung Electronics, Ltd., has taken its leadership position in the memory market a step further today by announcing support of the Samsung PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM and LRDIMM dynamic random access memory (DRAM) for the AMD EPYC 7002 Generation Processors. AMD launched the 2nd Gen AMD EPYC processor in San Francisco yesterday.

"AMD has listened to the needs of its customers in developing the 2nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products," said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. "With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter."

SK Hynix Inc. announced today that its DRAM and Enterprise SSD (eSSD) solutions, including the up-to-date 1Y nm 8 Gb DDR4 DRAM, have been fully tested and validated with the new AMD EPYC 7002 Generation Processors, which were unveiled during AMD's launch event on August 7. The Company has worked closely with AMD to provide memory solutions fully compatible with the 2nd Gen AMD EPYC Processors, targeting high performance data centers.

The SK Hynix DDR4 DRAM supports the maximum speed of 3200 Mbps of the 2nd Gen EPYC Processors, which will increase memory performance more than 20% compared to the 1st Gen AMD EPYC Processors. The Company's various DDR4 DRAM solutions, based on the 1Xnm and 1Y nm technology with density of 8 Gb and 16 Gb, have been fully tested and validated with the 2nd Gen EPYC Processors. SK Hynix provides high-density DIMMs with density over 64 GB to support up to 64 cores per socket in the 2nd Gen EPYC.

SK Hynix also provides a full line-up of SATA and PCIe from 480 GB to 8 TB, which have also been validated and tested with the 2nd Gen EPYC. SK Hynix's eSSD solutions are optimized for the latest data center's read-intensive and mixed workload environment.

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced the addition of 32 GB modules to its range of VENGEANCE LPX high-performance DDR4 memory, allowing PC builders to equip their systems with more DDR4 memory than ever before. VENGEANCE LPX has long been a premiere choice for custom PC builders looking for high frequencies and ambitious overclocks, and that tradition continues with the launch of 32 GB modules - the first time that such a capacity of premium DRAM has been made widely available to consumers in a standard size DDR4 module.

The new modules feature the same craftsmanship and quality that CORSAIR customers expect from the VENGEANCE LPX name. Thoroughly tested for wide compatibility with most current DDR4 motherboards, designed for high-performance overclocking with a pure aluminium heatspreader, and available in multiple colors to match your system's look, VENGEANCE LPX 32 GB DDR4 modules set the standard for enthusiast memory. Launching in frequencies of 2,400 MHz and 2,666 MHz in kits of 1x, 2x,4x and 8x modules, or 3,000 MHz in kits of 1x and 2x modules, you'll be sure to find a configuration to fit your custom PC and take its memory capacity up to 128 GB on mainstream 4-DIMM slot, and up to 256 GB on high-end desktop 8-DIMM slot motherboards.

Last year, with the introduction of the Intel Z390 chipset, there was a spate of so-called "double capacity DIMMs" or DC DIMMs, tall memory modules with two rows of DRAM chips, which added up to 32 GB per DIMM. You needed a Z390 platform and a 9th generation Core processor that supported up to 128 GB of memory, to use these things. With the introduction of 16 Gb DDR4 DRAM chips by both Micron and Samsung, JEDEC-compliant 32 GB unbuffered DIMMs of standard height are finally possible, and ADATA put together the first of these, shown off at Computex 2019.

The AD4U2666732GX16 is a 32-gigabyte dual-rank unbuffered DIMM made using 16 Gb chips supplied by Micron Technology. The modules tick at JEDEC-standard DDR4-2666 speeds, at a module voltage of 1.2 Volts. ADATA didn't disclose timings. The 16 Gb DRAM chips are made by Micron in an advanced (3rd generation) 10 nm-class silicon fabrication process to achieve the desired transistor-density. 32 GB DIMMs are expected to hit critical-mass in 2H-2019/2020, with the advent of AMD's 3rd generation Ryzen "Matisse," and Intel's "Ice Lake-S" desktop processors. Memory manufacturers are also expected to put out speedy and highly-compatible single-rank 16-gigabyte DIMMs using 16 Gb chips, which could finally make 32 GB dual-channel the mainstream memory configuration, moving up from half a decade of 2x 8 GB.

ZADAK announced today the immediate worldwide release of their latest ultra-high-performance RGB gaming memory module, the SPARK RGB DDR4. Firmly aimed at the high-end PC enthusiasts and gamers market, the SPARK RGB DDR4 brings together powerful memory module, overclocking capability and top-notch design elements to form a valuable addition to the ZADAK DDR4 family that is compatible with high-end motherboards.

SPARK RGB DDR4 modules are available in kits ranging from 16GB (2x8GB) up to 64GB (4x16GB) with the top-end models running at 4133 MHz. Overclocking is made simple with XMP 2.0 support allowing users to select their preferred profile for stable and reliable overclocking.

PATRIOT , a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, today has announced the release of their latest Signature Premium series line of DDR4 UDIMM memory, which are Non-ECC unbuffered memory designed to deliver outstanding quality, rock solid stability and great performance expected by today's mainstream PC builder.

Signature Premium DDR4 memory provides a wide range of capacities allowing the builder to choose from a variety of speeds and capacities starting with 4GB single modules up to 32GB dual channel kits. The minimalist heat spreader design offers great heat dissipation and is made from high-purity aluminum. Signature Premium DDR4 series modules offer reliability to those who upgrade or build systems for work or business and are cost effective too.

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of two new high speed Predator DDR4 memory kits in 4266 MHz and 4600 MHz frequency versions. The new frequency options will be available as 8GB modules in kits of two and include a black aluminum heat spreader and black PCB to complement the look of the latest PC builds by system builders and DIY PC enthusiasts.

"The HyperX team is excited to offer Predator DDR4 for the next generation of PC enthusiasts who want the best performance from their systems," said Kristy Ernt, DRAM business manager, HyperX. "As HyperX continues to support the world of gaming and esports, the community sees us as a trusted leader for high speed memory in the gaming hardware industry."

VIPER GAMING, a trademarked brand of PATRIOT and a global leader in performance memory, solid state drives, and flash storage solutions, today announced the release of Viper Steel Series DDR4 SODIMM Performance Memory featuring cutting-edge performance with speeds up to 3000 MHz, available from 8GB to 16GB.

Gamers bring their full tower desktop PC to a LAN party to enjoy a whole week of gaming, staying up late, and honing their gaming performance. However, they dread moving that large tower to and from the event. Gamers attend LAN events because they are a great way to socialize and strive to strike a balance between gaming, performance, and portability. Many gamers have been pushed to adopt a high-performance ITX desktop or gaming laptop instead of a clumsy full tower PC while sacrificing the performance they need.