Leading memory brand Team Group has announced its gaming brand T-FORCE and creator brand T-CREATE will launch non-binary DDR5 overclocking memory modules in capacities of 24 GB and 48 GB. The company has worked closely with major motherboard makers to complete compatibility testing with Intel 700 and 600 series motherboards of the modules' frequency and capability advancements. The modules will not only support XMP 3.0 but also come in various frequencies of 6,000 MHz and up, making them the fastest non-binary DDR5 high-capacity memory modules available. With excellent compatibility, capacity, and speed, they are the perfect RAM upgrades for gamers and creators.

T-FORCE LAB is committed to providing gamers with both great-performing and highly-compatible products, with T-FORCE DELTA RGB DDR5 taking the lead, launching 48 GB (2x 24 GB) dual-channel kits in 6,000 MHz, 6,400 MHz, 6,800 MHz, 7,200 MHz, 7,600 MHz and 8,000 MHz variants. It allows even motherboards with only two memory slots to harness the power of massive capacities and provide a next-level gaming experience. T-FORCE's latest 2x24GB dual-channel kit supports Intel XMP 3.0, allowing gamers to enjoy the smooth experience that high-capacity memory brings to system performance by simply enabling XMP 3.0 overclocking in BIOS.

AMD and JEDEC are collaborating to create a new industry standard for DDR5 memory called MRDIMMs (multi-ranked buffered DIMMs). The constant need for bandwidth in server systems provides trouble that can not easily be solved. Adding more memory is difficult, as motherboards can only get so big. Incorporating on-package memory solutions like HBM is expensive and can only scale to a specific memory capacity. However, engineers of JEDEC, with the help of AMD, have come to make a new standard that will try and solve this challenge using the new MRDIMM technology. The concept of MRDIMM is, on paper, straightforward. It combines two DDR5 DIMMs on a single module to effectively double the bandwidth. Specifically, if you take two DDR5 DIMMs running at 4,400 MT/s and connect them to create a single DIMM, you get 8,800 MT/s speeds on a single module. To efficiently use it, a special data mux or buffer will effectively take two Double Data Rate (DDR) DIMMs and convert them into Quad Data Rate (QDR) DIMMs.

The design also allows simultaneous access to both ranks of memory, thanks to the added mux. First-generation MRDIMMs can produce speeds of up to 8,800 MT/s, while the second and third generations modules can go to 12,800 MT/s and 17,600 MT/s, respectively. We expect third-generation MRDIMMs after 2030, so the project is still far away. Additionally, Intel has a similar solution called Multiplexer Combined Ranks DIMM (MCRDIMM) which uses a similar approach. However, Intel's technology is expected to see the light of the day as early as 2024/2025 and beyond the generation of servers, with Granite Rapids likely representing a contender for this technology. SK Hynix already makes MCRDIMMs, and you can see the demonstration of the approach below.

IBASE Technology Inc., a leading global provider of industrial-grade digital signage players, is pleased to unveil the SI-111-N, a palm-sized fanless 4K digital signage player system based on the Intel Atom x6211E and Celeron N6210 processors. Equipped with an HDMI 2.0b port that supports 3840 x 2160 @60Hz resolution, the industrial-grade system enables businesses to easily connect to a 4K display and create immersive visual experiences that attract attention and effectively promote their products or services.

IBASE values sustainable development and ESG practices. The SI-111-N incorporates various energy-saving features, including IBASE's proprietary iSMART green technology that enables power on/off scheduling with power resume capabilities, and the Observer utility that remotely monitors system voltages and temperature to ensure the system is operating efficiently while minimizing energy consumption. The SI-111-N's extensive I/O connectivity offers a rich array of expansion options, reliable data handling, and wireless operation, which includes 1x 2.5GbE LAN, 1x COM (RS-232) port, 1x M.2 M-Key (2280) and 1x M.2 E-Key (2230) sockets.

Kingston FURY, the high-performance division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of white heat spreaders to its award-winning line of Kingston FURY DDR5 memory modules providing more options for those looking to build a system that stands above the rest, in and out of the game.

Kingston FURY Beast DDR5 offers the superior speed and low latency solutions to take your experience to the next level of performance, now with a low-profile heatspreader design in white to combine outstanding cooling functionality and bold styling. Go for a simple and easy upgrade with Plug N Play at 4800MT/s1 or select an Intel XMP 3.0 or AMD EXPO Certified kit. Kingston FURY Beast DDR5 RGB lets users personalize even further with the Kingston FURY CTRL RGB tool by selecting or customizing one of the 18 built-in, vibrant, and stunning RGB lighting effects, all kept smooth and in unison with Kingston's patented Infrared Sync Technology. The Kingston FURY Beast DDR5 line hits speeds up to 6000MT/s, is available in 8 GB 16 GB and 32 GB single modules, and kits of 2 up to 64 GB, with kits of 4 coming next month.

Today, thanks to Yuuki_Ans on the Chinese Bilibili forum, we have more information about the upcoming "Avenue City" platform that powers Granite Rapids and Sierra Forest. Intel's forthcoming Granite Rapids and Sierra Forest Xeon processors will diverge the Xeon family into two offerings: one optimized for performance/core equipped with P-cores and the other for power/core equipped with E-cores. The reference platform Intel designs and shares with OEMs internally is a 16.7" x 20" board with 20 PCB layers, made as a dual-socket solution. Featuring two massive LGA-7529 sockets, the reference design shows the basic layout for a server powered by these new Xeons.

Capable of powering Granite Rapids / Sierra Forest-AP processors of up to 500 Watts, the platform also accommodates next-generation I/O. Featuring 24 DDR5 DIMMs with support for 12-channel memory, with memory speeds of up to 6400 MT/s. The PCIe selection includes six PCIe Gen 5 x16 links supporting CXL cache coherent protocol and 6x24 UPI links. Additionally, we have another piece of information that Granite Rapids will come with up to 128 cores and 256 threads in both regular and HBM-powered Xeon Max flavoring. You can see storage and reference platform configuration details on the slides below.

Intel's latest Xeon processors based on Sapphire Rapids uArch have arrived in the hands of overclockers. Last week, we reported that the Intel Xeon W9-3495X is officially a world record holder for achieving the best scores in Cinebench R23 and R20, Y-Cruncher, 3DMark CPU test, and Geekbench 3. However, today we have another extreme overclocking attempt to beat the world record, with little more details about power consumption and what the new SKU is capable of. Elmor, an overclocker working with ASUS, has tried to break the world record and overclocked the Intel Xeon W9-3495X CPU to 5.5 GHz on all 56 cores. What is more impressive is the power that the processor can consume.

With a system powered by two Superflower Leadex 1,600 Watt power supply units, the CPU consumed almost 1,900 Watts of power from the wall. To manage to cool this heat output, liquid nitrogen was used, and the CPU stayed at a cool negative 95 degrees Celsius. The motherboard of choice for this attempt was ASUS Pro WS W790E-SAGE SE, paired with eight GSKILL Zeta R5 DDR5 R-DIMMs modules. And results were incredible, as the CPU achieved 132,220 points in Cinebench R23. However, the world record of the previous week has remained intact, as Elmor 's result is a bit behind last week's score of 132,484 points. Check the video below for more info.

ASUS today announced that ASUS W790 workstation motherboards support ECC R-DIMM DDR5 RAM at up to 6800 MHz, unleashing class-leading overclocking capability to unlock even more performance potential. ASUS W790 workstation motherboards feature the memory capability of up to 2 TB RDIMM DDR5 memory to power the next generation of compute-intensive professional workloads. In addition, ASUS have been working with market-leading memory partners including G.SKILL, Kingston, and V-Color to establish multiple memory validations and to widely support 8-channel and quad-channel memory architectures. The Pro WS W790E-SAGE SE now supports up to 128 GB (8x16 GB) at 6800 MT/s, and the Pro WS W790-ACE supports up to 64 GB (4x16 GB) of DDR5 RAM at 6800 MT/s. This painstakingly cultivated collection of device validations helps ensure that an ASUS W790 workstation build supports a wide variety of scenarios.

Choosing the right CPU cooler for a workstation build can also be a challenge, because CPU sockets and form factors are different from those used in desktops. Therefore, ASUS has partnered with cooling experts including Enermax, EK and Noctua to offer air and liquid coolers for the LGA4677 socket used by the latest Intel Xeon workstation processors. These solutions are designed to offer optimal heat transfer and heat dissipation capacity through the cooler base and then to coolant tubes, heat pipes and radiator fins.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte of storage space in a 1U 16 bay rackmount system, followed by a full petabyte of storage space in a 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms. All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced massive new capacities for its DDR5 memory kits, thanks to new 24 GB and 48 GB UDIMM modules. For the first time from CORSAIR, PC builders can choose from 192 GB (4x 48 GB), 96 GB (2x 48 GB), or 48 GB (2x 24 GB) memory kits. Available in either VENGEANCE RGB DDR5 or VENGEANCE DDR5 kits, these new high capacities are ideal for the most demanding, high-capacity applications such as 8K video editing, as well as DRAM-heavy AI and deep learning workloads. Motherboards with just two memory slots, including Micro ATX and Mini-ITX builds, where space is tight but large capacities are needed also benefit.

CORSAIR VENGEANCE RGB DDR5 and VENGEANCE DDR5, already top choices for performance enthusiasts, are optimized for the latest gaming PCs and workstations and at these new capacities give custom PC enthusiasts the option to build with memory configurations that weren't possible until now. Both 96 GB and 48 GB kits are available immediately in both RGB and non-RGB flavors, running at 5,600MT/s and 5,200MT/s and support Intel XMP 3.0 memory overclocking to ensure owners can easily run their memory at the intended speeds.

Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers. With a 33% increase in data rate and bandwidth over Gen 1 4800 MT/s solutions, the Rambus Gen 3 6400 MT/s DDR5 RCD enables a new level of main memory performance for data center servers. Delivering industry-leading latency and power, it offers optimized timing parameters for improved RDIMM margins.

"Data center workloads have an insatiable thirst for greater memory bandwidth and capacity, and our mission is to advance the performance of server memory solutions that meet this need for each new server platform generation," said Sean Fan, chief operating officer at Rambus. "We were first in the industry to 5600 MT/s, and now we have raised the bar with our Gen 3 DDR5 RCD capable of 6400 MT/s to support a new generation of RDIMMs for server main memory."

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

Laptop memory has been a controversial topic for many years. Its proprietary standard, SO-DIMM, has shown signs of aging as the decades-old JEDEC standard didn't adapt to other expanding capacities and speed trends. Today, JEDEC and Dell think that the future of laptop memory is in the new CAMM standard that both companies are working on. The introduction of CAMM comes from Dell, whose Senior Distinguished Engineer Tom Schnell is working on it. "We have unanimous approval of the 0.5 spec," said Mr. Schnell for PCWorld. One of the problems that SO-DIMM is facing is the capacity and speed issue, where the current DDR5 SO-DIMM memory stops at around 6400 MT/s. CAMM, on the other hand, starts from that speed and works its way up to offer higher capacities as well.

With Dell introducing CAMM in its laptops, it had no intentions of creating a proprietary solution but rather an expandable and upgradable memory platform with various benefits. With JEDEC's involvement in finalizing this, the CAMM standard is slowly on its way to becoming a viable option for different laptop manufacturers. Dell's Tom Schnell didn't reveal what companies are in the process of creating the final specification; however, we know that 32 of them are present, including Apple. If others join, the standard could take over future laptop designs and offer higher speeds and higher capacities, especially in the mobile workstation space where it matters. Below is an example of a CAMM memory module with a patent showing the SO-DIMM (upper left) versus CAMM (lower right) and CAMM's smaller trace path. With smaller tracing, the latency is also going down, so the new standard will bring additional efficiency. Additionally, devices that are based on LPDDR memory could have an upgrade path with the installment of CAMM.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

Inspur Information, a leading IT infrastructure solutions provider, announced that its G7 server platform fully supports 4th Gen Intel Xeon Scalable Processors. The 16 servers making up the brand-new lineup are industry-leading in terms of performance, openness, intelligent operation & maintenance, and sustainability. Compared with the previous generation of Intel-based products, these servers have 61% higher performance and up to 30% higher computing performance per unit of power consumption. The server platform is designed to be deployed in general-purpose computing, critical computing, AI, and other application scenarios.

Inspur Information's brand-new G7 platform was designed with green technology, open-source solutions, security, and intelligence as priorities. It is an industry-leading example of system design, energy efficiency, and operation & maintenance management. G7 servers support diversified computing, with the most comprehensive product lineup in the industry. With a focus on green energy, this product line supports cold plate and immersion cooling schemes, and has unique cooling designs such as T-shaped radiator and advance heat detection with intelligent regulation, which all work together to reduce energy consumption by up to 30%. The new series also supports cloud operation and maintenance for intelligent fault diagnosis with an accuracy rate up to 95%.

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

At the 2023 International CES, market leader Kingston expanded their FURY line of enthusiast-gaming PC memory with the introduction of several new DDR5 memory kits. The top-of-the-line FURY Renegade series comes in RGB and non-RGB trims, and with speeds of up to DDR5-7200 with Intel XMP 3.0 support. For the AMD crowd, the company showed off the FURY Beast RGB, which comes in speeds of up to DDR5-6000, and features AMD EXPO profiles along with extensive validation with Ryzen 7000 series processors.

For those still making the transition between DDR4 and DDR5, Kingston introduced the FURY Beast DDR4 RGB, which looks visually similar to their DDR5 FURY Beast, but comes with speeds of up to DDR4-3600, with validation on AMD Ryzen 5000 series processors. It also supports an Intel XMP 2.0 profile. For high-end gaming notebooks and SFF platforms, including the Intel NUC 12 Extreme, Kingston introduced the FURY Impact line of DDR5 SO-DIMM memory, which comes in speeds of up to DDR5-5600.

SK hynix Inc. announced today that it has developed working samples of DDR5 Multiplexer Combined Ranks (MCR) Dual In-line Memory Module, the world's fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8 Gbps, and at least 80% faster than 4.8 Gbps of the existing DDR5 products. MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5. Challenging the prevailing concept that the operation speed of DDR5 relies on that of DRAM chip itself, engineers sought to find a way to improve the speed of modules instead of chips for development of the latest product.

SK hynix designed the product in a way that enables simultaneous operation of two ranks by utilizing the data buffer installed onto the MCR DIMM based on Intel's MCR technology. By enabling simultaneous operation of two ranks, MCR DIMM allows transmission of 128 bytes of data to CPU at once, compared with 64 bytes fetched generally in conventional DRAM module. An increase in the amount of data sent to the CPU each time supports the data transfer rate of minimum 8 Gbps, twice as fast as a single DRAM.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.