Neo Forza, a Taiwanese brand entity under Goldkey Technology Corporation, had a booth at Computex 2023, where the company showed its next-generation memory and storage products. Starting off, the company presented its DDR5 memory kits running at 8000 MHz speeds, indicating the maturity of DDR5 and that we are way past the initial 4800 MHz speeds at launch. The demonstrated kit was a part of the company's TRINITY lineup, which was displayed in white. For demo purposes, the kit was configured as two 16 GB DIMMs.

Next up, Neo Forza has showcased its next-generation PCIe Gen 5 NVMe SSD. Running at x4 lanes of the new PCIe 5.0 protocol, the 2 TB SSD was spotted running at 10 GB/s speeds in both read and write tasks set by CrystalDiskMark benchmark. Interestingly, the SSD also boasted a massive heatsink, as shown below.

G.Skill a the 2023 Computex showcased its fastest DDR5 memory kits, including some high-performance kits in the non-standard 24 GB DIMM densities. Our visit to the G.Skill booth begins with a handful very boutique custom PC builds. One of them looks like a xenomorph egg, another like a glass pyramid, and another like an Intel semiconductor wafer, and another like sci-fi drilling platform. The Trident Z5 series of DDR5 memory form the bullwark of G.Skill's current-gen lineup. The company showcased a W790 + Xeon W9-3495X workstation build with an 8-channel, 384 GB (8x 48 GB) DDR5-6000 memory setup, with rather tight timings of 30-39-39-96T.

The company also showed us how fast some of its non-standard capacity DIMMs can get, with a DDR5-6800 96 GB (2x 48 GB) build with 34-46-46-108 timings. The star attraction was a build with 48 GB memory (2x 24 GB), and a stellar DDR5-8000, at 40-48-48-128, and G.Skill even performed a live overclocking event, overclocking this to DDR5-8800 speed. Among the memory module models are special gold and silver-chrome variants of the Trident Z5 RGB, and debuting for the very first time, are the Trident Z5 Royal, with its premium aesthetic, and crushed-ice looking LED diffuser.The boutique builds at G.Skill booth follow.

ADATA and XPG, its gamer focused sub-brand, unveiled a plethora of memory and storage products at the 2023 Computex. We begin with PC memory, and we see the company showing off its upcoming models of the XPG DDR5 memory targeting enthusiasts. These include the XPG Caster RGB DDR5, which is capable of DDR5-9000, the XPG Lancer RGB ROG edition, capable of DDR5-7200, and the company's overclocking-capable DDR5-6400 R-DIMM targeting Xeon W workstations. The company also showed us "Project NeonStorm." This is an innovative new SSD cooling system that uses a self-contained liquid cooler.

The way this liquid cooler works is that a high conductivity heat spreader transfers heat to a chamber containing a coolant fluid. This coolant heats up an aluminium alloy tube via convection. The inner wall of this tube serves as an airflow channel for a 20 mm fan. ADATA claims that this solution offers "over 20% better heat dissipation compared to SSDs without water cooling." This is also one of the very first SSDs we've seen that utilize Silicon Motion SM2508 PCIe Gen 5 NVMe controller. ADATA claims sequential reads of up to 14 GB/s, with up to 12 GB/s sequential writes. The drive comes in capacity-based models of up to 8 TB (could include 2 TB, 4 TB, and 8 TB). ADATA also showed off the Legend 970 PCIe Gen 5 NVMe SSD that uses a Phison E26-series controller, and comes in capacities of 1 TB and 2 TB. This drive belts out up to 10 GB/s reads, with up to 10 GB/s writes.

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

PC OEM giant Acer has a growing lineup of retail channel PC products, including DIY enthusiast PC hardware under its Predator brand. The company showed some of this off at the 2023 Computex, in a booth organized by its memory products OEM BIWIN. First up, we have the Predator Hermes RGB line of high-end DDR5 memory kits. These feature elaborate aluminium heatspreaders with RGB LED illumination. We caught one of these in action, with a multi-zone RGB lighting. The Hermes RGB comes in 32 GB (2x 16 GB), and 64 GB (2x 32 GB) kits, and in speeds of DDR5-6800, DDR5-7200, DDR5-7600, DDR5-7800, and DDR5-8000, with CAS latencies ranging between 32 to 36T, and module voltages between 1.40 V to 1.45 V.

Among the consumer storage products showed off by the company include the MSC300 line of UHS-I microSDXC cards capable of 160 MB/s sequential speeds, which comes in capacities ranging between 32 GB to 256 GB. Among the SSD products shown were stuff we are already familiar with, including the FA100 Gen 4 NVMe SSD, RE100 Gen 3 NVMe SSD, the SA100 and RE100 SATA 6 Gbps SSDs; the SD100 lines of DDR4 and DDR5 SO-DIMM memory for laptops; CFE100 line of CFexpress cards, and and handful USB flash drives (UFDs).

At the 2023 Computex, we caught CORSAIR's flagship PC memory line, the DOMINATOR Titanium DDR5 series. These are built to, well, dominate the overclocking and benchmark records scene, and come in several high-speed models, such as DDR5-8000 and DDR5-8266, and capacities as high as 192 GB (4x 48 GB kits). The company also has a limited batch of 500 "First Edition" kits, which feature a gold-on-white color scheme, and the company's highest grade of manual binning.

A defining feature about the DOMINATOR Titanium DDR5 series is their heat spreader design, which consists of 2 mm-thick aluminium making contact with the DRAM chips, which connect to an upper copper heatsink with RGB LEDs studded. The edges of the top have mount-holes, so a set of 2 or 4 of these DIMMs can be bolted onto the company's latest DHX cooling module. This is essentially a chunky slab of anodized aluminium that soaks up and dissipates heat from the DIMMs, and has slats that let the RGB lighting through. CORSAIR is backing these with lifetime warranties, and plans to launch them in July 2023.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

GeIL, one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.

GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

The latest AMD AGESA 1.0.0.7 AM5 platform microcode that the company recently released to improve stability of machines powered by Ryzen 7000X3D processors, more importantly, prevent them from physical damage due to increased voltage in voltage-assisted overclocking scenarios; reportedly impacts memory overclocking capabilities, too, reports g01d3nm4ng0. The "PROCHOT Control" and "PROCHOT Deassertation Ramp" toggles that were available in the oldest versions of AGESA for AM5, are not available in the latest production AGESA.

The memory compatibility is also affected. AMD recently added support for odd-density DDR5 memory modules, such as 24 GB and 48 GB, which make up 48 GB and 96 GB 2-module (dual-channel, four sub-channel) kits. It is possible to max out 192 GB, but while the older AGESA 1.0.0.6 allowed memory frequencies of up to DDR5-6000 with SoC voltage of 1.3 V, the newer AGESA is only stable up to DDR5-4400 at this density. To be fair, most motherboards advertise maximum memory frequencies of under DDR5-4800 for memory configurations where there are two DIMMs per channel, and both DIMMs are dual-rank (so four dual-rank DIMMs in all, which is the least optimal memory configuration from a memory frequency and latency perspective).

KLEVV, an emerging memory brand introduced by Essencore, is excited to unveil two new high performance DDR5 overclocking memory, the CRAS V RGB and the BOLT V. Designed to cater to a wide range of users, the CRAS V RGB and BOLT V DDR5 memory empower all aspects of computational requirements. They deliver outstanding performance on the latest AMD and Intel platforms, from gaming to content creation, with Intel XMP 3.0 and AMD EXPO overclocking features. Furthermore, the CRAS V RGB and BOLT V DDR5 memory are fully battle-hardened, passing the QVL tests required by major motherboard manufacturers. With strictly selected memory chips and meticulous manufacturing processes, they ensure the highest level of reliability, tailored to perform multitasking operation effortlessly.

Released under KLEVV's flagship memory range, the CRAS V RGB memory features modern design refined with exquisite attention to detail. Precision crafted aluminium heatsink highlighted by signature RGB lights visible on both top and fine gaps on the sides make for a sight to behold. The RGB lights are fully customizable and controllable with third-party software provided by world-renown motherboard manufacturers like ASUS, ASROCK, Gigabyte, and MSI with corresponding hardware, serving as the centerpiece of any build. The 32 GB (16 GB x2) 288 Pin DDR5 unbuffered DIMM kits are available in four base clock options starting at 6000MT/s, 6400MT/s, 7200MT/s, 7600MT/s, and extending up to blazing-fast 8000 MT/s.

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.

Kingston FURY, the high-performance division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million overclockable modules. In 2002, Kingston entered the enthusiast market with a line of high-performance memory modules under the Kingston HyperX name. Over the next 19 years Kingston grew the HyperX name within the enthusiast and gaming space until its sale of the peripheral line to HP in 2021. Continuing the incredible success of the HyperX memory products, Kingston rebranded its high-performance component lines into Kingston FURY, investing resources and knowledge from its core business to create the next generation of enthusiast products. Today, the engineering expertise behind the numerous overclocking records and awards continues into a new era of leading-edge, high-performance, enthusiast and gaming solutions.

Since its inception, Kingston has taken pride in its testing innovations and industry-leading product reliability. Back in 2005, Kingston was granted a U.S patent on a proprietary, first of its kind, dynamic burn-in tester. This ensured the utmost reliability in server memory modules used in the world's largest data centres. Earlier this year, Kingston broadened its portfolio by adding the Kingston FURY Renegade Pro DDR5 RDIMM which provides overclockable server-class DDR5 memory for creators, engineers, and data science professionals to meet the requirements of the latest applications. Its award-winning line of Kingston FURY Beast DDR5 and Renegade DDR5 memory modules also received a makeover with the introduction of white heat spreaders to empower users to choose the colour that best fits their individual style.

Leading memory brand Team Group has announced its gaming brand T-FORCE and creator brand T-CREATE will launch non-binary DDR5 overclocking memory modules in capacities of 24 GB and 48 GB. The company has worked closely with major motherboard makers to complete compatibility testing with Intel 700 and 600 series motherboards of the modules' frequency and capability advancements. The modules will not only support XMP 3.0 but also come in various frequencies of 6,000 MHz and up, making them the fastest non-binary DDR5 high-capacity memory modules available. With excellent compatibility, capacity, and speed, they are the perfect RAM upgrades for gamers and creators.

T-FORCE LAB is committed to providing gamers with both great-performing and highly-compatible products, with T-FORCE DELTA RGB DDR5 taking the lead, launching 48 GB (2x 24 GB) dual-channel kits in 6,000 MHz, 6,400 MHz, 6,800 MHz, 7,200 MHz, 7,600 MHz and 8,000 MHz variants. It allows even motherboards with only two memory slots to harness the power of massive capacities and provide a next-level gaming experience. T-FORCE's latest 2x24GB dual-channel kit supports Intel XMP 3.0, allowing gamers to enjoy the smooth experience that high-capacity memory brings to system performance by simply enabling XMP 3.0 overclocking in BIOS.

AMD and JEDEC are collaborating to create a new industry standard for DDR5 memory called MRDIMMs (multi-ranked buffered DIMMs). The constant need for bandwidth in server systems provides trouble that can not easily be solved. Adding more memory is difficult, as motherboards can only get so big. Incorporating on-package memory solutions like HBM is expensive and can only scale to a specific memory capacity. However, engineers of JEDEC, with the help of AMD, have come to make a new standard that will try and solve this challenge using the new MRDIMM technology. The concept of MRDIMM is, on paper, straightforward. It combines two DDR5 DIMMs on a single module to effectively double the bandwidth. Specifically, if you take two DDR5 DIMMs running at 4,400 MT/s and connect them to create a single DIMM, you get 8,800 MT/s speeds on a single module. To efficiently use it, a special data mux or buffer will effectively take two Double Data Rate (DDR) DIMMs and convert them into Quad Data Rate (QDR) DIMMs.

The design also allows simultaneous access to both ranks of memory, thanks to the added mux. First-generation MRDIMMs can produce speeds of up to 8,800 MT/s, while the second and third generations modules can go to 12,800 MT/s and 17,600 MT/s, respectively. We expect third-generation MRDIMMs after 2030, so the project is still far away. Additionally, Intel has a similar solution called Multiplexer Combined Ranks DIMM (MCRDIMM) which uses a similar approach. However, Intel's technology is expected to see the light of the day as early as 2024/2025 and beyond the generation of servers, with Granite Rapids likely representing a contender for this technology. SK Hynix already makes MCRDIMMs, and you can see the demonstration of the approach below.

IBASE Technology Inc., a leading global provider of industrial-grade digital signage players, is pleased to unveil the SI-111-N, a palm-sized fanless 4K digital signage player system based on the Intel Atom x6211E and Celeron N6210 processors. Equipped with an HDMI 2.0b port that supports 3840 x 2160 @60Hz resolution, the industrial-grade system enables businesses to easily connect to a 4K display and create immersive visual experiences that attract attention and effectively promote their products or services.

IBASE values sustainable development and ESG practices. The SI-111-N incorporates various energy-saving features, including IBASE's proprietary iSMART green technology that enables power on/off scheduling with power resume capabilities, and the Observer utility that remotely monitors system voltages and temperature to ensure the system is operating efficiently while minimizing energy consumption. The SI-111-N's extensive I/O connectivity offers a rich array of expansion options, reliable data handling, and wireless operation, which includes 1x 2.5GbE LAN, 1x COM (RS-232) port, 1x M.2 M-Key (2280) and 1x M.2 E-Key (2230) sockets.

Kingston FURY, the high-performance division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of white heat spreaders to its award-winning line of Kingston FURY DDR5 memory modules providing more options for those looking to build a system that stands above the rest, in and out of the game.

Kingston FURY Beast DDR5 offers the superior speed and low latency solutions to take your experience to the next level of performance, now with a low-profile heatspreader design in white to combine outstanding cooling functionality and bold styling. Go for a simple and easy upgrade with Plug N Play at 4800MT/s1 or select an Intel XMP 3.0 or AMD EXPO Certified kit. Kingston FURY Beast DDR5 RGB lets users personalize even further with the Kingston FURY CTRL RGB tool by selecting or customizing one of the 18 built-in, vibrant, and stunning RGB lighting effects, all kept smooth and in unison with Kingston's patented Infrared Sync Technology. The Kingston FURY Beast DDR5 line hits speeds up to 6000MT/s, is available in 8 GB 16 GB and 32 GB single modules, and kits of 2 up to 64 GB, with kits of 4 coming next month.

Today, thanks to Yuuki_Ans on the Chinese Bilibili forum, we have more information about the upcoming "Avenue City" platform that powers Granite Rapids and Sierra Forest. Intel's forthcoming Granite Rapids and Sierra Forest Xeon processors will diverge the Xeon family into two offerings: one optimized for performance/core equipped with P-cores and the other for power/core equipped with E-cores. The reference platform Intel designs and shares with OEMs internally is a 16.7" x 20" board with 20 PCB layers, made as a dual-socket solution. Featuring two massive LGA-7529 sockets, the reference design shows the basic layout for a server powered by these new Xeons.

Capable of powering Granite Rapids / Sierra Forest-AP processors of up to 500 Watts, the platform also accommodates next-generation I/O. Featuring 24 DDR5 DIMMs with support for 12-channel memory, with memory speeds of up to 6400 MT/s. The PCIe selection includes six PCIe Gen 5 x16 links supporting CXL cache coherent protocol and 6x24 UPI links. Additionally, we have another piece of information that Granite Rapids will come with up to 128 cores and 256 threads in both regular and HBM-powered Xeon Max flavoring. You can see storage and reference platform configuration details on the slides below.

Intel's latest Xeon processors based on Sapphire Rapids uArch have arrived in the hands of overclockers. Last week, we reported that the Intel Xeon W9-3495X is officially a world record holder for achieving the best scores in Cinebench R23 and R20, Y-Cruncher, 3DMark CPU test, and Geekbench 3. However, today we have another extreme overclocking attempt to beat the world record, with little more details about power consumption and what the new SKU is capable of. Elmor, an overclocker working with ASUS, has tried to break the world record and overclocked the Intel Xeon W9-3495X CPU to 5.5 GHz on all 56 cores. What is more impressive is the power that the processor can consume.

With a system powered by two Superflower Leadex 1,600 Watt power supply units, the CPU consumed almost 1,900 Watts of power from the wall. To manage to cool this heat output, liquid nitrogen was used, and the CPU stayed at a cool negative 95 degrees Celsius. The motherboard of choice for this attempt was ASUS Pro WS W790E-SAGE SE, paired with eight GSKILL Zeta R5 DDR5 R-DIMMs modules. And results were incredible, as the CPU achieved 132,220 points in Cinebench R23. However, the world record of the previous week has remained intact, as Elmor 's result is a bit behind last week's score of 132,484 points. Check the video below for more info.

ASUS today announced that ASUS W790 workstation motherboards support ECC R-DIMM DDR5 RAM at up to 6800 MHz, unleashing class-leading overclocking capability to unlock even more performance potential. ASUS W790 workstation motherboards feature the memory capability of up to 2 TB RDIMM DDR5 memory to power the next generation of compute-intensive professional workloads. In addition, ASUS have been working with market-leading memory partners including G.SKILL, Kingston, and V-Color to establish multiple memory validations and to widely support 8-channel and quad-channel memory architectures. The Pro WS W790E-SAGE SE now supports up to 128 GB (8x16 GB) at 6800 MT/s, and the Pro WS W790-ACE supports up to 64 GB (4x16 GB) of DDR5 RAM at 6800 MT/s. This painstakingly cultivated collection of device validations helps ensure that an ASUS W790 workstation build supports a wide variety of scenarios.

Choosing the right CPU cooler for a workstation build can also be a challenge, because CPU sockets and form factors are different from those used in desktops. Therefore, ASUS has partnered with cooling experts including Enermax, EK and Noctua to offer air and liquid coolers for the LGA4677 socket used by the latest Intel Xeon workstation processors. These solutions are designed to offer optimal heat transfer and heat dissipation capacity through the cooler base and then to coolant tubes, heat pipes and radiator fins.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte of storage space in a 1U 16 bay rackmount system, followed by a full petabyte of storage space in a 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms. All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.