In the view of the demand for an ultra mini size platform with fanless design strongly inquired from customers, MSI IPC announces the latest 3.5" small form factor, I3-945GSE-D, based on the Intel Atom N270 processor and the Intel 945GSE chipset which gives devices based on it enhanced graphics and power-saving capabilities.

MSI I3-945GSE-D is fanless and comes to meet the requirements of an ultra-low power platform, especially in power input design, MSI I3-945GSE-D support wide range DC 9V ~ 36V inputs, and it also supports for numerous display, includes VGA and LVDS.

Apacer, one of the world's leading brands of memory modules, announced today its ARES DDR3 Overclocking Memory Module. The newly-unveiled memory module is named after the god of war "ARES." Features include advanced memory chips, zero noise heat pipe cooling system with a large red aluminum heat dissipation fin. It is able to operate at a blazing-fast clock rate of 2400MHz, allowing not only overclockers to create overclocking miracles but hardcore gamers to achieve their optimum performance during the games.

ARES, the god of war, clad in armor dashing in the ferocious battlefield, is thought to have been invincible in Greek mythology. After the previous launch of second-to-none Aeolus equivalent, Apacer again named its DDR3 memory module from the mythology. Just as its name suggested, ARES DDR3 Overclocking Memory Module promises to deliver amazing and stable overclocking performances that feed the needs of the overclocking experts.

Exceleram - the Highend Memory based in Landau, Germany, announces the availability of the first four Rippler Memory Kits. The name Rippler stands for a new Heatsink designed especially for the overclocking community. The German Exceleram Team completed the development and the Rippler Series is ready to ship now. First shipments are leaving the German warehouse this week. The Rippler Series will be expanded during the next weeks.

"We already have customer requests for other Rippler Kits and we will consider them of course." said Martim Reis Silva - Sales Director Exceleram. As a goody, there are also 2 highend kits with black 8layer PCB available. In the beginning the memory will be delivered in a noble aluminiumbox instead of plastic blister.

Mushkin, a global leader in high-performance computer products, announced today the release of 'Redline Ridgeback', a new variation on a heatsink that has become a staple in the high-performance and overclocking communities. Because of its aggressive yet sleek design and incredible heat dissipation qualities, enthusiasts the world over have demanded the Ridgeback heatsink for their memory cooling needs. Now, this exciting piece of technology has been prepared for Mushkin's world-renowned Redline Series with an engaging and strong blood-red appearance.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. Because of Ridgeback's success, we wanted to offer the cooling technology with a sharp new look, and to give customers new aesthetic options. Case modders and system builders now have a striking new look available to them when using Ridgeback. Redline has always been Mushkin's premier memory line, and we're happy to add Ridgeback to its mix. Our new blood-red Ridgeback heatsinks scream 'performance' and offer it in every respect." - Brian Flood, director of product development.