ASUS launched its socket LGA1150 motherboard lineup with three products in its coveted Republic of Gamers (ROG) lineup, the flagship Maximus VI Extreme, the micro-ATX Maximus VI Gene, and the mid-range Maximus VI Hero. A little earlier today, the mini-ITX Maximus VI Impact joined the team with a stunning feature-set for its size. At Computex, we pictured the last piece of the puzzle, the Maximus VI Formula. Pictured below, this ATX motherboard based on the Z87 chipset is best suited for liquid-cooled rigs with 3-way graphics cards. It borrows a piece of technology over from the TUF series, a thermal armor that covers most parts of the board. The armor makes contact with a water block that actively cools the board's CPU VRM.

The Maximus VI Formula uses an identical CPU VRM to the Maximus VI Extreme. The board draws power from a combination of 24-pin ATX and 8-pin EPS. A 4-pin ATX and Molex can be optionally connected to stabilize overclocks. The LGA1150 socket is wired to four DDR3 DIMM slots, and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4), it lacks the PEX8747 bridge chip of its bigger sibling. Three other PCI-Express 2.0 x1 chips make for the rest of the expansion. Connectivity on the Maximus VI Formula includes ten SATA 6 Gb/s ports, eight USB 3.0 ports, SupremeFX audio, gigabit Ethernet (Intel controller), 802.11 ac WiFi, and Bluetooth 4.0. ASUS didn't reveal launch plans.

Corsair, a worldwide designer of high-performance components to the PC hardware market, today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64 GB and speeds up to 2933 MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family (codenamed Haswell) and previous generation Intel and AMD platforms.

Vengeance Pro Series memory modules are built with eight-layer PCBs and RAM ICs specially selected for speed and overclocking headroom, and like all Vengeance memory, incorporate XMP 1.3 profiles allow for automatic, reliable overclocking. The memory kits are designed with new aggressively styled, aluminum heat spreaders for superior cooling. The memory kits are available in black with silver, red, blue, or gold accents to enable enthusiasts, gamers, and modders to customize the look of their PCs.

MSI rolled out a trio of socket LGA1150 motherboards in the mini-ITX form-factor, Z87I, H87I, and B85I, based on Intel Z87, H87, and B85 chipsets, respectively. Pin-compatibility between the three chipsets means that the three boards are based on a common design. The three feature a 4-phase CPU VRM, two full-size DDR3 DIMM slots, a PCI-Express 3.0 x16, and a combination of 24-pin and 4-pin power connectors.

The Z87I and H87I are nearly identical, with VRM cooling, 802.11 b/g/n WiFi, and Bluetooth 4.0. The Z87I edges past the H87I with support for CPU overclocking, and a second gigabit Ethernet connection. The B85I lacks a VRM heatsink, and the wireless connectivity card. Instead, it gives you a vacant mPCIe slot. It offers 6-channel HD audio, instead of the 8-channel solution, on the other two. All three feature at least one gigabit Ethernet connection, DVI and HDMI display outputs, six USB 3.0 ports, and a number of USB 2.0/1.1 ports.

ASUS announced a fleet of socket LGA1150 motherboards, covering its mainline (classic), Republic of Gamers (ROG), and The Ultimate Force (TUF) lines. With this series, ASUS is adopting a new color scheme for its mainline motherboards, breaking away from the black PCB with blue heatsinks scheme it maintained since the first LGA1156 motherboards, almost four years ago. The new mainline motherboards from ASUS feature black PCBs with golden-colored heatsinks covering the VRM and PCH, and simpler naming. ASUS' first wave of Z87-based mainline (classic) motherboards include the entry-level Z87-C and Z87-A, mid-range Z87-PLUS and Z87-PRO, and premium Z87-DELUXE.

MSI proudly announced the release of its new EPIC embedded board?MS-98D1. The MS-98D1 is a compact EPIC size embedded board with Intel Atom Dual Core processor for low-power fanless solution. Featuring with dual core, fanless design, rich I/O, and wide input voltage of 9 to 36 VDC, the MS-98D1 is especially ideal for industrial applications that involve control and communications, or any industrial fields that require fanless embedded systems.

The dual Gigabit LAN built-in also benefit the target applications by providing broad-band communication capability that is required by many industrial fields. For some systems that need additional communication or I/O interfaces, the PCI-104 slot of MS-98D1 allows system integrators to stack more modules with no limits, offering more application possibilities with this small board. Moreover, 2 independent displays with VGA, DVI, and Dual LVDS outputs enable the MS-98D1 to be applied for remote monitoring and control systems as well.

At a media event held in its Taipei headquarters, GIGABYTE demonstrated its AMP-UP integrated audio solution that will feature on some of its upcoming motherboards. On that pretense, it even got to show of two of its top socket LGA1150 motherboards, built for Core "Haswell" processors, the G1.Sniper 5, and the G1.Sniper M5. Positioned in gamer-overclocker targeted G1.Killer series, the two boards are based on Intel Z87 Express chipset. The G1.Sniper 5 is the larger standard ATX motherboard; while the M5 is a compact micro-ATX offering. The pictures also confirm that socket LGA1150 retention module and bolt-spacing is identical to sockets LGA1155 and LGA1156.

The G1.Sniper 5 appears to feature a 16-phase VRM, which uses ferrite-core chokes, and the same International Rectifier PowIRstage components as Ultra Durable 5 motherboards from the previous generation. This time around, the CPU plays a greater role in voltage regulation. The driver-MOSFETs on the board are cooled by an active fan-heatsink, which also has a liquid channel running through it, so you could make it part of your CPU loop. Thankfully GIGABYTE didn't let its imagination run away with designs of the other heatsinks on the board, one of which cools the Z87 Express chipset, and the other we imagine, a PLX PEX8747 48-lane PCI-Express 3.0 bridge chip. This chip gets you 4-way SLI/CrossFireX support.

ASUS is working on a variant of its ROG Rampage IV Extreme motherboard for people who've had enough with the red+black color scheme. The Rampage IV Extreme Black, as the name suggests, dons a largely black appearance, with hints of dark-gray; use of red is reduced to a minimum. Components like alternate DIMM and PCIe slots use shades of gray to contrast black. It is otherwise identical to the original. The Black variant could be ASUS' competitive offering to EVGA X79 Black. Based on Intel X79 Express chipset, the ROG Rampage IV Extreme Black supports Core i7 processors in the LGA2011 package, up to 64 GB of quad-channel DDR3 memory, four-way SLI/CrossFire, and a suite of overclocker-friendly features. There's no word on pricing or availability.

Axiomtek announced PICO831, its extreme-compact Pico-ITX SBC designed to support the newest ultra low-power Intel Atom dual core processor N2800 1.86 GHz and N2600 1.6 GHz with the Intel NM10 Express chipset. The PICO831's compact size, ultra low power consumption, and high performance make it a perfect fit for space-limited and power saving environments. The system memory on PICO831 can support either 2 GB or 4 GB of DDR3, depending on the processor. Its onboard SATA-3Gb/s connector and optional SATA SSD meet storage requirements with ease.

Considering to the various demands and networking requests, the tiny embedded board comes with full-size and half-size PCI Express Mini Card slots. It also provides internal connectors for VGA, 18/24-bit single channel LVDS and a Gigabit Ethernet, and a flexible I/O pin-header that integrates audio, four of USB 2.0, two of COM, LED, and power on/off interfaces. This Pico-ITX form factor board offers an excellent solution for in-vehicle PCs, medical imaging, gaming, in-flight entertainment systems, industrial automation systems, and the portable devices.

Apart from motherboards, the only big product segment ASRock made a name for itself is with pre-built mini-PCs. The company wants to put its experience to good use by cashing in for the market's newfound love for compact (mini-ITX) gaming PCs, the ones that save precious real-estate on congested living room TV racks and dorm rooms. Pictured below is the company's first such effort, timed with the launch of Intel's next-generation Core "Haswell" processor, and supporting socket LGA1150 platform based on Z87 Express chipset.

There are three components to ASRock's creation: a unique SFF case, co-designed by BMW Design; the ASRock Z87E-ITX motherboard, and a GeForce GTX 680 graphics card. The case looks pretty slick, coming from BMW. It stays slim by using a PCI-Express riser, allowing you to install graphics cards along the plane of the motherboard. The Z87-E ITX, like most efforts by ASRock in the past, is extremely feature-rich for its size. It uses a 6-phase VRM to power the LGA1150 CPU, features two DDR3 DIMM slots, PCI-Express 3.0 x16 and mini-PCIe 2.0, for the WLAN+Bluetooth card.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, launched the TYAN TA77-B7061, its latest and flexible 2U GPU supported platform; the S7042, entry-level dual socket motherboard; GT62A-B5512 and the GT20A-B7040, the cost-effective 1U server during the CeBIT. TYAN welcomes customers to visit the TYAN website for more detail product information during CeBIT or experience the latest products at ISS EMEA in Dublin, Ireland from April, 10-12.

TYAN TA77-B7061 is the ideal platform designed for users who are looking for accelerated data-processing and efficient computing performance. Supporting up to four GPUs in a 2U server chassis, it is a high performance option that also offers outstanding computing density, saving both time and server/rack space in conjunction with industry-leading companies' GPU products such as Intel Xeon Phi processors, NVIDIA Tesla K20 Series and ATI FirePro. The non-compromised TA77-B7061 will be displayed at TYAN booth at ISS EMEA (Intel Solution Summit) in Dublin, Ireland from April, 10-12. TYAN TA77-B7061 supports (2) Intel Xeon E5-2600 Series Processors, (8+8) DDR-III R/U/LR-DIMM, (4) PCI-E x16 G3 slots, (1) PCI-E x8 G3 slots, (2) GbE ports and (8) 2.5" HDDs. Customers could enjoy more flexible and upgradeable computing performance to tailor to their own computing environment with TYAN's TA77-B7061 server platform.

Shuttle Computer Handels GmbH, the European subsidiary of Shuttle Inc., one of the leading developers and manufacturers of compact PC solutions such as the world-renowned XPC Mini-PC Barebones, expands its range of All-in-One PCs with integrated monitors and adds a 46.7 cm (18.5") version to its original 39.5 cm (15.6") machines.

As well as offering a larger display, the new Shuttle All-in-One Barebone X70S also provides significantly more power. For the first time conventional Intel desktop processors can be used for the LGA1155 socket, e.g. Intel Core i3/i5/i7 (up to 65 W TDP, heatpipe-cooled). DDR3 RAM up to a total of 16 GB can be installed in the two SO-DIMM slots. The 5.7 x 46.8 x 36.4 cm (DWH) chassis of the X70S also has space for a 2.5" drive (SSD/HDD) as well as expansions via the Mini-PCIe slot, which can be fitted, for example, with an mSATA module.

ASUS augmented its socket FM2 motherboard lineup with the F2A85-V, a lite variant of the F2A85-V Pro the company kicked off its Trinity APU-compatible motherboard lineup with. The new F2A85-V trims down on a few things over the -Pro variant, such as simpler independent VRM and FCH heatsinks with no heat-pipe connecting them, fewer APU power phases, and a lighter expansion slot layout that isn't ideal for multi-GPU setups.

To begin with, the F2A85-V features a 6-phase APU VRM that draws power from a 4-pin ATX connector, compared to the 8-phase one drawing from an 8-pin EPS, on the F2A85-V Pro. The FM2 socket is connected to four DDR3 DIMM slots, supporting a maximum of 64 GB of dual-channel DDR3-1866 MHz memory; and a single PCI-Express 2.0 x16. Other expansion slots include a PCI-Express 2.0 x16 (electrical x4, wired to the A85X FCH), two PCI-Express 2.0 x1, and three legacy PCI slots.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6 mm for a standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4 GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

Axiomtek announced the launch of the MANO872, a Mini ITX motherboard designed for the new 22nm 3rd Generation Intel Core i7/i5/i3 processors in the LGA1155 socket with Intel Q77 Express chipset. With features of Intel Active Management Technology (iAMT), Intel Small Business Advantage solution, Intel Smart Response Technology, and Intel Rapid Storage Technology, the high-performance MANO872 delivers maximum security and manageability. This industrial-grade Mini ITX motherboard also supports 16 GB DDR3 1333/1600 system memory, PCI Express x16 Gen3, USB 3.0, SATA 6Gb/s with RAID, and Trusted Platform Module 1.2. With the new Intel HD Graphics with DX11 support, the embedded board features powerful graphic processing and three independent displays using the DisplayPort, DVI-I, and LVDS connectors on board. This platform is ideal performance for high-end industrial applications, such as storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.

Eurocom, is shipping its new Uno 3.0 All-One-PC with 21.5" FHD Optional Multi Touch Display, TPM 1.2 and an integrated battery pack that is fully optimized for enterprise computing. "The EUROCOM Uno 3.0 All in One Desktop computer is ideal for a wide range of commercial applications," Mark Bialic, Eurocom President "with the plethora of connectivity ports, Multi Touch interface, internal battery, TPM 1.2 and VESA mount the Uno 3.0 will fit perfectly into any workspace."

The EUROCOM Uno 3.0 is designed primarily for corporate customers, the Eco-Friendly 120 Watts, 7.5kg (16.5lbs) easy to move around All in One PC allows companies to improve overall productivity, reduce downtime caused by power interruptions and greatly reduce energy costs.

Crucial, a leading global brand of memory and storage upgrades, today announced its first DDR4 DRAM demonstration at CES 2013. As a global brand of Micron, the Crucial DDR4 DRAM demonstration is based on Micron's 30-nanometer (nm) technology, the 4-gigabit (Gb) DDR4 x8 part is the first piece of what is expected to be the industry's most complete portfolio of DDR4-based modules, which will include RDIMMs, LRDIMMs, SODIMMs and UDIMMs (standard and ECC).

The new Crucial DDR4 DRAM modules use up to 20 percent lower voltage than previous technology, enabling smaller, more efficient form factors and longer battery lives. The DDR4 DRAM will have lower voltage, operating at 1.2V in comparison to current DDR3 offerings operating from 1.35V to 1.5V. The new memory modules enable mainstream data rates that are up to twice as fast as DDR3 memory. This will enable systems to process data faster, load applications faster, improve system responsiveness, and increase the ability to multi-task and handle data-intensive programs.

Aiming at rising micro server market, world renowned memory and flash module manufacturer, KINGMAX, launches ECC DDR3 SO-DIMM today. The DIMMs, equipped with ECC(Error check and correction) function, which can increase system stability, are specially designed for space-constraint micro server or embedded system that execute critical missions.

The rising of networking development and Big Data application boost data center and micro server market. Micro servers simplify structure, save cost and reduce space. While ECC SO-DIMM is compact, it is a perfect fit for micro server's structure. KINGMAX ECC SO-DIMM utilizes ECC (Error check and correction) technology to check whether or not the data send to memory is correct. When error occurs, ECC can automatically correct it or ask system to resent the data. Thus, it is able to keep the system working normal and avoid sudden system failure due to memory error. Furthermore, it greatly increases system stability. KINGMAX ECC SO-DIMM includes speed of 1333 MHz and 1600 MHz, capacity of 4 GB and 8 GB. For the energy saving concern, KINGMAX also provides version of 1.35V, which can reduce 10% to 15% power while using ECC SO-DIMM.

MSI unveiled a new entry-level socket FM2 motherboard, the FM2-A75MA-P33. Based on the AMD A75 FCH chipset, the board supports newer A-series "Trinity" APUs. The board uses a 5-phase VRM to power the APU, which is wired to two DDR3 DIMM slots, supporting up to 32 GB of dual-channel DDR3-1866 MHz memory; and a PCI-Express 2.0 x16 slot. PCI-Express 2.0 x1, and legacy PCI make for the rest of the expansion.

Storage connectivity on the FM2-A75MA-P33 includes six internal SATA 6 Gb/s ports, supporting RAID 0/1/10. The A75 FCH gives out four USB 3.0 SuperSpeed ports, which are wired out as two type-A ports on the rear-panel, and two ports by header. The board features headers for legacy connectivity such as LPT (parallel) and COM (serial). Display connectivity includes one each of dual-link DVI and D-Sub. 6-channel HD audio, gigabit Ethernet, a number of USB 2.0/1.1 ports, and PS/2, make for the rest of the connectivity. The FM2-A75MA-P33 is expected to be priced around $70.

MSC Embedded Inc., manufacturer of highly integrated standard board level products and customer-specific boards and systems, today introduced a powerful, new COM Express Type 6 module family. This family, called MSC C6C-A7, is based on the AMD embedded R-Series processors also known as accelerated processing units (APUs). MSC C6C-A7 members are compact form factor computer-on-modules characterized by very powerful graphics and high parallel computing performance with low power dissipation.

The MSC C6C-A7 module family integrates AMD R-460L 2.0 GHz (2.8 GHz Turbo) or AMD R-452L 1.6 GHz (2.4 GHz Turbo) quad-core processors. The thermal design power (TDP) levels are 25 W and 19 W, respectively. The two dual-core versions are populated with the AMD R-260H 2.1 GHz (2.6 GHz Turbo) processor or the AMD R-252F 1.7 GHz (2.3 GHz Turbo) processor -- each featuring 17 W TDP. The processors support the AMD64 technology and the AMD-V virtualization technology. The AMD Fusion Controller Hub (FCH) A75 chipset was also selected. The main memory can be expanded to 16 GB DDR3-1600 dual-channel SDRAM via two SO DIMM sockets.

AMD today unveiled nine new mid-range and entry-level AMD Opteron 4300 Series and 3300 Series server processors increasing performance per watt versus the previous generation to maximize compute capabilities in power-constrained environments1, while delivering outstanding value to cloud providers and web hosts. The AMD Opteron 3300 Series processors provide enterprise-class features in a low power envelope at a desktop processor price, making it ideal for web hosts and small- and medium-sized businesses.

The AMD Opteron 4300 Series processors offer up to 15 percent better performance versus the prior generation, based on SPECint benchmark results2. And SPECpower results show up to a 24 percent improvement in performance per watt. As with the AMD Opteron 6300 Series processors, these are socket compatible with the previous generation processor, providing an effortless upgrade path for customers.

Micron's channel brand Crucial Memory is on the verge of launching half-height DDR3 memory modules for the enthusiast PC market, under the Ballistix Sport VLP series. Pictured below, next to standard Ballistix Sport modules, the VLP ("very low profile") series consists of memory modules that are nearly half the height of standard 240 pin UDIMMs, making them ideal for crammed up mini-ITX builds. The series will be available in most common configurations, the one pictured below runs at DDR3-1600 MHz with timings of 9-9-9-24, and 1.35V DRAM voltage. The modules will be available in 4 GB and 8 GB densities, and will make up single-, dual-, and quad-channel kits.

Foxconn Channel brand unveiled the AT-5570, a new mini PC based on the AMD "Brazos" 2.0 platform. Measuring 19 cm x 13.5 cm x 3.8 cm, and weighing 600 g, this VESA-mountable PC is driven by AMD C-70 APU with Radeon HD 7290 graphics. It features one DDR3 SO-DIMM slot, supporting up to 8 GB of memory, and a 2.5-inch SATA 6 Gb/s drive bay.

Connectivity options on the AT-5570 include two USB 3.0 and four USB 2.0/1.1 ports; SD/SDHC/MS/MS Pro/MMC card reader, stereo HD audio, 802.11 b/g/n WLAN, gigabit Ethernet, HDMI, and D-Sub (VGA). The AT-5570 from Foxconn is expected to be launched later this month.

MSI unveiled a new all-integrated mini-ITX motherboard that steps above the Intel Atom and AMD E-Series crowd, being based on Intel Celeron 847 dual-core processor (1.10 GHz, 32 nm "Westmere" micro-architecture, 2 MB L3 cache, SSE4.2, EM64T). MSI used a small fan-heatsink to cool the chip, which has 17W TDP. The processor is backed by Intel NM70 chipset. It is based on the compact 1023-pin BGA package, and is hardwired to the motherboard. One of the features that give the processor its edge over Atom and E-Series is its dual-channel DDR3 integrated memory controller with maximum memory support of up to 16 GB. The chip is wired to two DDR3 DIMM slots.

The only expansion slot is a PCI-Express 2.0 x1. Storage connectivity includes one each of SATA 6 Gb/s and SATA 3 Gb/s. Display outputs include DVI and D-Sub. A missed opportunity here is the lack of HDMI. 6-channel HD audio, gigabit Ethernet, legacy PS/2, and a number of USB 2.0/1.1 connectors make for the rest of it. Surprisingly, MSI designed the board with modern UEFI BIOS, which lets you take advantage of Windows 8 Secure Boot feature. There is no word on availability and pricing of the C847IS-P33.

MSI designed the new Hetris H61 Ultra, a 10 liter commercial barebones desktop for the European market. Measuring 330 x 94 x 320 mm, its chassis houses an Intel H61 chipset-based socket LGA1155 motherboard, which supports Core/Pentium/Celeron processors based on the 32 nm "Sandy Bridge" and 22 nm "Ivy Bridge" micro-architectures. It features two 240-pin DDR3 DIMM slots, supporting up to 8 GB of dual-channel DDR3-1333 MHz memory. Among the drive bays in the chassis are a 3.5-inch/2.5-inch SATA bay for hard drives, and a 5.25-inch bay for optical drives.

The Hetris H61 Ultra packs an 80 Plus-compliant 270W power supply. It features a PCI-Express riser that allows you to install up to two PCIe expansion cards along the plane of the motherboard. Connectivity includes 6-channel HD audio, gigabit Ethernet, two USB 3.0 ports on the front, four USB 2.0/1.1 ports on the rear, a pair of serial COM ports, PS/2 keyboard/mouse, eSATA 3 Gb/s, and display connectivity that includes DVI, D-Sub, and HDMI. The Hetris H61 Ultra could also be sold with a number of entry-level CPU, memory, and HDD combinations.