ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today introduced new industry-leading, single piece 8GB DDR3-1333 high-density memory modules. Implementing state-of-the-art technology and strict control of the production processes, these modules provide professionals and enthusiasts with new heights of high-speed computing experience.

ADATA is committed to providing high performance and stable memory solutions. This single piece 8GB Premier Series DDR3-1333 memory module series supports advanced user and professional data operation needs. With the limited space available on many motherboards, an insufficient number of DRAM slots is a common dilemma. This most recent advance in density further allows consumers to easily enhance overall system performance.

Leading international mainboard and graphics card manufacturer MSI today announces the official release of its X79A-GD65 (8D), X79A-GD65, X79A-GD45, and X79MA-GD45 mainboards. The new mainboards are based on Intel's latest X79 chipset and uses the LGA 2011 socket supporting the 2nd generation Core i7 processors. The X79A-GD65 (8D) features with 8 memory DIMMs, supports 16GB DDR3 memory modules, bringing maximum capacity up to a staggering 128GB! For superior quality and stability, MSI X79 series mainboards adopts Military Class III components. With DrMOS II - the next generation of DrMOS with improved double thermal protection - the lifetime of components is maximized, even in warmer environments or when the machine is heavily overclocked.

MSI X79 series mainboards also feature the latest PCI Express Gen 3 bus and MSI's proprietary Click BIOS II for maximum performance and user convenience. When taking into account all of the other advanced technologies supported such as 3-Way NVIDIA SLI and 4-way AMD CrossFireX multi-GPU processing technology, THX TruStudio PRO sound, Multi-BIOS II, Control Center II, and Super Charger, MSI X79-series mainboards are simply the best choice for enthusiasts!

Intel today released its Core i7-3000 series processor family, codenamed "Sandy Bridge-E". These new processors, along with the new Intel X79 chipset, make up for an entirely new platform. The processors are an upscale of the Sandy Bridge architecture found on chips in the LGA1155 package. The Sandy Bridge-E silicon measures 20.8 x 20.9 mm, with a humungous transistor count of 2.27 billion. In its Core i7-3000 configuration, the silicon has up to 6 cores, up to 15 MB of L3 cache, four DDR3 memory channels, and 40 PCI-Express 3.0 lanes ("some" devices "may" support Gen 3.0, Intel's words).

Sandy Bridge-E has the same instruction set as Sandy Bridge, which includes SSE up to version 4.2, AVX, AES, and features Turbo Boost 2.0, HyperThreading. It's the memory controller that's complete upscale. It features four independent 64-bit paths to DDR3 DIMMs, making it a quad-channel DDR3 IMC. DDR3-1600 MHz is natively supported. There are three models, the Core i7-3960X Extreme Edition leads the pack with a clock speed of 3.30 GHz, 3.90 GHz top Turbo Boost speed, and 15 MB of L3 cache. It has 6 cores and 12 threads with HTT enabled. This chip has all its multipliers unlocked and is geared for overclocking. It is priced at US $990 in 1000 unit tray quantities, though retailers might draw a decent margin for the boxed parts.

G.Skill has announced the development of its brand new RipjawsZ series quad-channel memory modules, designed specifically for Intel LGA2011 Sandy Bridge-E processors and X79 systems.

A World First in Super-Sized & Super-Speed, the new RipjawsZ builds on a history of Ripjaws world first performance boundaries and award-winning quality, by including extreme performance kits such as, DDR3 2,500MHz 16GB (4GBx4) 1.65V kit, and super size kits including DDR3 64GB (8GBx8) 2133MHz at only 1.5V, and the fastest ever 8GB DIMMs in the DDR3 2,400MHz 32GB(8GBx4) kit. The following screens show two RipjawsZ 2,400MHz 32GB(8GBx4) kits running together at 2400MHz 64GB and booting at breath-taking 2600MHz 64GB with ASUS Rampage IV Extreme motherboard.

A month after debuting its Premier line of mainstream DDR3 memory modules, A-Data released new high-density 8 GB modules in the series. Available in both desktop UDIMM and notebook SO-DIMM form-factors, A-Data's new modules operate at PC3-10700 (DDR3-1333 MHz) speeds with CAS latency of 9T, and DRAM voltage of 1.5V. The new modules make use of 4 gigabit memory chips made possible in the mainstream segment by advancements in silicon fab processes. Unfortunately, the pricing isn't quite "mainstream" yet. One of these 8 GB Premier modules by A-Data could set you back by €159.90. They are backed by limited lifetime warranty.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage, and enthusiast computer products, today announces their new Mac Series XT SSDs and SODIMM lines. Optimized for the latest and popular Mac products, these premium offerings are geared for power users demanding the latest storage and memory technology to increase productivity and performance.

"Patriot Memory's Mac Series XT SSDs will provide users with a great alternative to traditional mechanical hard drives", says William Lai, Patriot Memory's Product Manager. "Offering an easy solid state and memory upgrade, Mac users will be able to maximize their computing experience almost instantly."

Here are the first pictures of MSI's socket LGA2011 motherboard in the micro-ATX form-factor. Earlier this week, we got to see through ASRock's X79 Extreme4-M that LGA2011 micro-ATX boards were indeed possible. Called the MSI X79MA-GD45 (MS-7738 V1.1), this board offers all the connectivity possible on a board with such a tight footprint. The LGA2011 socket is powered by a 9-phase VRM. It is wired to four DDR3 DIMM slots, two on either sides of the socket, powered by 2-phase VRM. Expansion slots include two each of PCI-Express 3.0 x16 and PCI-Express 2.0 x1. 2-way SLI and CrossFire are supported.

SATA connectivity includes two SATA 6 Gb/s (white), four SATA 3 Gb/s (black). There are no eSATA ports, but four USB 3.0, two on the rear panel, two by internal header, driven by Renesas-made controllers. The rest of the connectivity is fairly standard: 8+2 channel HD audio driven by Realtek ALC892 CODEC with optical and coaxial SPDIF outputs, single gigabit Ethernet driven by Realtek 8111E, and a number of USB 2.0 ports. One of the front-panel USB 2.0 headers is designed for charging portable devices even with the system shut down (yet plugged in). The board will be driven by UEFI firmware, we're getting to see some nifty features for overclockers such as voltage measurement points across a wide range of voltage domains.

Biostar's coveted TPower brand makes a comeback with TPower X79, Biostar's premium overclocking motherboard for the Core i7 "Sandy Bridge-E" platform. TPower motherboards have been known to be a part of some record-setting CPU OC feats right from the days of LGA775. The TPower X79 is another product that's meant for record-setting feats, with its strong VRM and slim feature-set that does away with everything overclockers don't need and adds to the bloat of the motherboard.

The CPU is powered by an 8-phase DuraMax VRM with active phase control and direct FETs. It draws power from two 8-pin EPS connectors, apart from the 24-pin ATX and an optional 4-pin Molex for PCIe slot stability. Apart from a strong VRM, the board makes use of POSCAP capacitors in the CPU area, and a high-quality clock generator. The VRM and chipset heatsinks are connected with a 6 mm heat pipe, the heatsinks are made of a ceramic surface material for better dissipation. The CPU is wired to just four DDR3 DIMM slots, one per channel, which shouldn't be an issue for overclockers. It gives you shorter memory traces. Apart from JEDEC speeds of up to DDR3-1600 MHz, the board supports DDR3-2400 MHz by overclocking.

Foxconn's latest premium gamer-overclocker segment motherboard, the Quantum Force X79, has finally taken shape. Foxconn's Quantum Force motherboards are designed to offer good overclocking features at a great value. The Quantum Force X79 uses a 14-phase VRM to power the LGA2011 "Sandy Bridge-E" processor, plus a 2-phase VRM for the memory. There are four DDR3 DIMM slots, one per memory channel. Expansion slots include three PCI-Express 3.0 x16 (PCI-E1_x16, PCI-E3_x16, and PCI-E4_x16. The second black slot (PCI-E2_x16) is electrical PCI-Express 2.0 x8.

The board is packed with features that help overclockers, starting with triple redundant BIOS, voltage measurement points for manual voltage measurements (with a wide range of voltage domains), manual overclocking buttons on board, power, reset, clear-CMOS buttons, POST speaker, and plenty of fan headers.

ASRock's socket LGA2011 motherboard lineup doesn't end with X79 Extreme7 as thought before, the company thinks there's scope for an even more loaded model that's literally bursting with connectivity and expansion features. Enter the X79 Extreme9. This board uses high-grade digital PWM circuitry to power the CPU. It draws power for the CPU VRM from two 8-pin EPS connectors. Unlike the X79 Extreme7, this board features eight DDR3 DIMM slots, two per memory channel. Expansion slots include five PCI-Express 3.0 x16, and a PCIe x1.

Since it completely ran out of room on the main PCB, ASRock put two important connectivity features on a separate (included) addon card, called the ASRock "Game Blaster". This card occupies the PCIe x1 slot, it packs a next-generation Creative SoundCore3D audio processor (more advanced than X-Fi), and a low-overhead/low-latency gigabit Ethernet connection. It's not exactly known if this connection is driven by a Killer 2100 or a more common PCIe GbE PHY backed by ASRock's proprietary packet prioritization software (XLAN).

ASRock showed off pictures of the first socket LGA2011 motherboard in the compact micro-ATX form-factor, the ASRock X79 Extreme4-M Within its small board footprint of 240 x 240 mm, the X79 Extreme4-M offers almost every feature the platform has to offer. To begin with, the LGA2011 socket is powered by an 8-phase VRM that makes use of high-grade solid-state chokes, and driver-MOSFETs. It is wired to four DDR3 DIMM slots, two on either sides of the socket. All four expansion slot bays available to the mATX form-factor are made use of, with three PCI-Express 3.0 x16 and one legacy PCI.

The electrical configuration of the three PCI-Express slots appears to be x16, x8, x16 (permanent). The chipset is cooled by an active fan-heatsink. All six of its SATA ports are wired as internal ports, with two SATA 6 Gb/s and four SATA 3 Gb/s. Connectivity features include 8+2 channel HD audio with optical and coaxial SPDIF outputs, four USB 3.0 ports (two on the rear panel, two via header), one gigabit Ethernet, a number of USB 2.0 ports, Firewire, and legacy PS/2. The CMOS can be reset from the rear panel. The board will be driven by UEFI firmware.

Here are pictures of the release-grade revision (1.0) of Gigabyte's socket LGA2011 motherboards in its main linuep, the GA-X79-UD3 and GA-X79-UD5. These are the release-grade 1.0 revisions, that are redesigned for X79 chipset with just six SATA ports (doing away with SAS). With the LGA2011 motherboard lineup, Gigabyte is doing away with the "UD7" model, in its segment there is GA-X79-OC. We saw this coming, because UD7 was meant to be an overclocking motherboard identifier. On the company website, for example, the product page of GA-X58A-UD7 (2.0) shows GA-X58A-OC as a "newer model". The GA-X79-UD3 is poised to be the most affordable LGA2011 motherboard from Gigabyte, while the GA-X79-UD5 offers some premium connectivity and memory expansion features.

The GA-X79-UD3 uses a simple 8+1 phase VRM to power the LGA2011 CPU. The memory is powered by a 4-phase VRM. There are just four DDR3 DIMM slots, one per channel. There are four PCI-Express 3.0 x16 slots, among which two are x16 capable, and all four are x8 capable. There are two PCIe x1, and surprisingly, a legacy PCI slot (uncommon for LGA2011 platform). All six SATA ports from the X79 chipset are assigned as internal ports: two SATA 6 Gb/s (white), and four SATA 3 Gb/s (black). Three Marvell-made SATA 6 Gb/s controllers provide four additional internal ports (gray), and two eSATA 6 Gb/s. There are just four USB 3.0 ports, two on the rear panel, and two via internal header. 8+2 channel HD audio, a number of USB 2.0 ports, and one gigabit Ethernet connection make for the rest of the GA-X79-UD3.

ASUS' top-tier LGA2011 lineup is completed by the TUF Sabertooth X79. This board, along with the ROG Rampage IV Extreme and P9X79 Deluxe makes up for it. There will be many more affordable LGA2011 boards by ASUS, one such model we're hearing about is the P9X79 Pro. The TUF Sabertooth family is based on the idea of rock-solid stability and component durability, these motherboards are built to last, if not score accolades with overclocking like the ROG boards are designed for.

The Sabertooth X79 uses an ASUS-designed Digi+ VRM to power the CPU, which is spread across two sides of the socket (north and west). The heatsink cooling the VRM components to the west is actively cooled by a 40 mm fan, the one over the X79 PCH is cooled by a similarly sized lateral blower, too. Like with the other two top-tier boards from ASUS' stable, this one provides eight DDR3 DIMM slots supporting quad-channel memory.

Here are the first pictures of ASUS P9X79 Deluxe, the company's premium segment LGA2011 motherboard based on the X79 chipset. This features in ASUS' main motherboard lineup, and not sub-lineups such as Republic of Gamers (ROG) or The Ultimate Force (TUF). The P9X79 Deluxe is loaded with features and connectivity options. To begin with, the LGA2011 socket is powered by a next-generation Digi+ VRM design by ASUS, driven by Dual Intelligent Processors III (next-generation Energy Processing Unit (EPU) chip and TurboV Processing Unit (TPU)). Like with the ROG Rampage IV Extreme, VRM is spread across three sides of the socket, and each cluster of MOSFETs is cooled by heatsinks. The socket is wired to eight DDR3 DIMM slots in two sets of four slots, supporting quad-channel DDR3. The memory VRM uses a Digi+ design, too.

Among the six expansion slots, there are four PCI-Express x16 slots, and two PCIe x1. The PCH gives out six SATA ports, two 6 Gb/s (white), four 3 Gb/s (blue), the two additional 6 Gb/s ports come from a third-party controller. There are two power-eSATA ports on the rear panel. The eight USB 3.0 ports on this board are spread across as six ports on the rear-panel, and two via standard header. Other connectivity includes 8+2 channel HD audio, two gigabit Ethernet connections, USB 2.0, and Bluetooth.

Here is ASUS' top of the line LGA2011 motherboard targeting the gamer-overclocker market, the Republic of Gamers (ROG) Rampage IV Extreme. This board offers all the expansion room and connectivity you'll ever need, plus a wealth of nifty features that help overclockers and ease incremental upgrades. To begin with, the Rampage IV Extreme employs a strong digital PWM circuitry that supports heavy voltage-assisted overclocking with Vdroop control.

The LGA2011 socket is wired to eight DDR3 DIMM slots (two per channel). CPU and memory VRM areas are located along three sides of the socket, all cooled by heatsinks that are connected by heat pipes. These VRM heatsinks share heat with the one over the X79 PCH, which is actively cooled by a fan.

Just as its detractors thought they were done with it, and just as people started to think that attrition among some of its "popular" designers cost EVGA dearly, the company hit back with teaser pictures of the Super Record 3 or SR3, it promised back in June, it would deliver to the enthusiast community. And yes, it matches its description! The SR3 is a dual socket LGA2011 2P enthusiast desktop/workstation motherboard in the E-ATX form factor. Socket 0 is wired to eight DDR3 DIMM slots (two DIMMs/channel), while socket 1 to four slots (1 DIMM/channel).

In LGA2011 2P systems, the processor sitting on socket 0 is wired to the PCH (SR3 looks to have Patsburg-T), while the processor on socket 1 is wired to the one on socket 0 using two QPI links, closing the daisy-chain. Socket 0, apart from its 4 GB/s DMI link, has a PCI-Express 2.0 x4 (another 4 GB/s) link to supplement the DMI link, so the storage controllers don't get bottlenecked with just DMI. Both processors contribute to the PCI-Express lane budget of the motherboard. There are seven PCI-Express x16 slots, among which four are PCI-Express 3.0 x16 capable, every slot is PCI-Express 3.0 x8 capable. NVIDIA 4-way SLI is supported. This board will support Sandy Bridge-EP Xeon processors, though we don't know at this juncture if Core i7 Sandy Bridge-E is 2P capable.

EVGA was missing on the LGA2011 motherboard wall at this year's Computex event in June. EVGA is one of the top brands overclockers and enthusiasts look forward to, for motherboards. As a late consolation, EVGA gave out a teaser picture of one of its upcoming X79 motherboards a little later in June. At GeForce LAN 6, however, EVGA made full use of the spotlight to unveil its X79 Classified (E799), a top-tier socket LGA2011 motherboard clearly designed for overclockers.

The X79 Classified uses a traditional LGA2011 motherboard layout, but with wide open spaces to make insulating it (against condensation) easier. The CPU power delivery seems to be in the hands of some very high-grade VRM design, it draws power from two 8-pin EPS connectors apart from the 24-pin ATX (that's right-angled). There are just four DDR3 DIMM slots, one per memory channel. A 4-phase memory VRM is deployed. Over the chipset area, a large contiguous heatsink covers most hot components in the central-right region. We don't expect there to be a bridge chip.

ASUS is ready with a new PCI-Express 3.0 compliant socket LGA1155 motherboard, adding to its recently-launched line of Intel Z68 chipset-based boards that feature Gen 3.0 PCI-Express x16 slots. This latest one is part of the elite Republic of Gamers (ROG) family, and is built on the compact micro-ATX form factor, called Maximus IV Gene-Z/Gen 3. This is the second modification of the Maximus IV Gene, the original was based on Intel P67 chipset, the Gene-Z replaced the chipset with Intel Z68 that supports Smart Response technology, while the Gene-Z/Gen 3 adds PCI-Express 3.0 x16 slots.

The board uses a 12-phase Digi+ VRM for the CPU, it is wired to four DDR3 DIMM slots supporting DRAM speeds of up to DDR3-2200 MHz with overclocking. The socket is wired to two PCI-Express 3.0 x16 slots over Gen 3 compliant switches and electrical components, the slots configure to PCI-Express 3.0 x8/x8 when both are populated. PCI-Express Gen 3 support requires next-generation 22 nm Ivy Bridge Core processors, which will be launched next year. The only other expansion slot is an open-ended PCI-Express 2.0 x4, wired to the Z68 PCH. NVIDIA SLI and AMD CrossFire are supported.

Gigabyte rolled out its latest budget socket LGA1155 motherboard in the micro-ATX form-factor, the GA-H61M-USB3-B3 rev. 2.0. This new board adds to the slim feature-set of Intel H61 with third-party SATA 6 Gb/s and USB 3.0 controllers. The CPU is powered by a 6-phase VRD12 compliant VRM, it is wired to just two DDR3 DIMM slots, supporting dual-channel DDR3-1333 MHz memory. Expansion slots include one PCI-Express 2.0 x16, a legacy PCI, and two PCI-Express 2.0 x1.

All four of the chipset's SATA 3 Gb/s ports are internal (H61 lacks SATA 6 Gb/s). An additional Marvell 88SE9172 controller gives out two SATA 6 Gb/s ports with RAID 0/1/0+1 support. An Etron EJ168 controller gives out two USB 3.0 ports on the rear panel. Gigabyte used a cost-effective Atheros AR8151 to handle gigabit Ethernet, while squeezing in the high-grade Realtek ALC889 HD audio codec to handle 6-channel audio. Display connectivity includes DVI, HDMI, and D-Sub. A number of USB 2.0 ports, and serial COM port (via header) make for the rest of the connectivity. The board is driven by dual AwardBIOS, with HybridEFI technology that lets it boot from >2 TB volumes. Pricing is unknown.

ZOTAC International, a leading innovator and channel manufacturer of graphics cards, motherboards and mini-PCs, today launches the latest addition to the ZBOX nano product lineup with the new ZBOX nano VD01 series - an affordable palm-sized mini-PC powered by a VIA Nano X2 processor.

The ZOTAC ZBOX nano VD01 series combines the latest VIA Nano X2 U4025 CPU and VX900H media system processor for outstanding energy-efficiency and performance. VIA Chrome9 graphics with ChromotionHD 2.0 processing enables the ZOTAC ZBOX nano VD01 series to deliver silky-smooth playback of popular high-definition video formats, including Blu-ray, MPEG2, H.264, VC-1 and streaming Internet video.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today debuts the palm-sized ZBOX nano AD10 series mini-PCs. The new ZOTAC ZBOX nano AD10 series shrinks the standard ZBOX form factor and adds more home theatre PC friendly features for your digital media needs.

Powered by the AMD "Brazos" E-350 APU Platform with Discrete-Class AMD Radeon HD 6310 graphics, the ZOTAC ZBOX nano AD10 series packs plenty of performance with hardware video decode acceleration technologies for popular high-definition video formats, including Blu-ray and Adobe Flash, into a miniature 127mm x 127mm x 45mm form factor that fits in the palm of your hand.

Crucial, a leading global brand of memory and storage upgrades, today introduced Crucial 8GB DDR3-1333 MHz UDIMM (desktop) and SODIMM (laptop) memory modules to fully support the latest 2nd generation Intel Core i7 and i5 processors. Users demand more from their computers than ever before, simultaneously running and switching between multiple, complex applications such as photo editing, high-definition video editing, and gaming software. With that in mind, Crucial high-capacity 8GB desktop and laptop memory modules enable users to meet these computing challenges head on, enhancing the user experience by providing a more responsive system.

The new modules also allow for high-capacity memory in smaller form factors such as laptops, All-in-One PCs, and home theater PCs. Traditionally, most laptops have been limited to one or two DIMM slots for system memory needs. As form factors continue to shrink, providing even less space on the motherboard to populate memory, an 8GB Crucial laptop module is ideal for newer, more portable form factors that only have one DIMM slot available. Additionally, these new 8GB DDR3-1333MHz SODIMM modules are 1.35V, compared to their standard 1.5V counterparts. For laptops that support the lower voltage, the modules help reduce power consumption and operating temperature while increasing battery life.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced worldwide retail availability of 4GB DDR3 memory for Apple Mac desktop and laptop PCs.

Corsair's Mac memory kits are tested at Apple Developer Compatibility Labs and are guaranteed to work with any Mac desktop or notebook PC that supports 4GB DDR3 SODIMMs, including iMac, Mac mini, Mac Pro, MacBook, and MacBook Pro models. This includes virtually all models offered by Apple since 2010.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung's advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

Team Group Inc. makes an active plan and layout to break into the industrial class and server memory module market in 201. Facing the emerging cloud computing market, Team Group is optimistic about the future potential of cloud technology. To satisfy the customer's need for a more flexible customized server production, Team Group has been actively trying to cut into the industrial class memory module market by means of its advantages in strong R&D and procurement.

Team Group's Registered DIMM memory module comes in two clock specifications, DDR3 1066/1333, and a selection of three capacities of 4GB, 8GB and 16GB. The 16GB was made under a more stringent technological standard than the industry's norm and a more rigorous product testing. It is double-sided and dual-layered to achieve the maximum capacity. The Registered DIMM is compatible with the latest chip sets such as Intel 5500/5520 and AMD SR5670/5690 to provide servers with the most stable memory storage space, making it the best partner for building a cloud server.