Friday, November 1st 2024
Team Group Unveils CAMM2 DDR5 Memory Modules at 7200 and 6400 MHz
In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.
The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.
Compared to traditional SO-DIMM, U-DIMM, and R-DIMM memory, CAMM2 introduces a breakthrough design with several distinct advantages. It supports dual-channel mode with a single memory module, simplifying system architecture and significantly reducing power consumption. With an integrated CKD (Client Clock Driver) for improved signal integrity, CAMM2 memory is smaller and ideal for thin and light notebooks. Its improved thermal design allows for greater heat dissipation efficiency, unlocking more potential in a compact space. CAMM2 memory surpasses previous standards in overclocking, read speed, and latency, delivering an exceptionally smooth user experience. Through rigorous testing, Team Group has maximized the capabilities of CAMM2 to create endless possibilities for the memory market.
Team Group will continue to invest in CAMM2 technology, advancing both consumer and industrial specifications to deliver high-performance, reliable memory solutions. The Team Group CAMM2 memory series is expected to be released in Q1 2025, bringing a new experience to consumer PCs and industrial applications. Stay tuned to Team Group's official website and social media channels for the latest news.
The following screenshots are from a burn-in using the Intel i9-14900K processor with the Z790 PROJECT ZERO (CAMM2) motherboard. This test environment used an Intel i9-14900K processor paired with the Z790 PROJECT ZERO (CAMM2) motherboard.
Source:
Team Group
The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.
Team Group will continue to invest in CAMM2 technology, advancing both consumer and industrial specifications to deliver high-performance, reliable memory solutions. The Team Group CAMM2 memory series is expected to be released in Q1 2025, bringing a new experience to consumer PCs and industrial applications. Stay tuned to Team Group's official website and social media channels for the latest news.
The following screenshots are from a burn-in using the Intel i9-14900K processor with the Z790 PROJECT ZERO (CAMM2) motherboard. This test environment used an Intel i9-14900K processor paired with the Z790 PROJECT ZERO (CAMM2) motherboard.
21 Comments on Team Group Unveils CAMM2 DDR5 Memory Modules at 7200 and 6400 MHz
Desktops eventually...
Servers probably never... at least not any that may feature hot swapping RAM
www.techpowerup.com/322754/lpddr6-lpcamm2-pictured-and-detailed-courtesy-of-jedecLenovo has a workstation laptop that does.
www.techpowerup.com/321814/lenovo-unveils-its-new-ai-ready-thinkpad-p1-gen-7-mobile-workstation
Dell also have some that supports their original CAMM modules.
Also, why does AMD or Intel have to support CAMM2/LPCAMM2? It's just a difference way of adding the DRAM to the system, it's still DDR5 or LPDD5/X, it's just the physical attachment that differs.Chicken, egg.
Conjecture of course... but there are a few who will want a laptop with 64GB+ of RAM that isn't gonna be soldered to CPU package.That's not quite what the article states - "In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory" - and what they define as industrial points towards some edge cases with 'edge' computing devices, as well as the more traditional industrial PC.
For larger sizes, you either have to use Type B DC-modules (68mm width, 256GB max) or two stacked Type D SC modules (256GB max and 57mm each, stacked 512GB and likely 68mm as well).
MSI's Z790 Project Zero Plus-demonstration board used a Type A-module, but had cleared the space in front of it up to the margin of the board for larger modules. This space would normally be used for power connectors, USB-headers, onboard buttons or components.
CAMM and CAMM2 solve some of the problems with SoDIMM slots, which laptop vendors do actually like since they can offer multiple configurations from the same production run, rather than having to split production runs into different RAM size variants.
Hopefully we start to see CAMM2 laptops instead of soldered-RAM laptops in the next year.This. CAMM wasn't particularly about space saving - IIRC the CAMM modules take up more PCB area than a SoDIMM as a trade-off for being lower-profile.
Like you say, the primary reason for CAMM was to reduce the trace length to the CPU's memory controller which is why you won't find upgradeable laptops supporting DDR5 speeds much beyond 5200.
If they don't do this for CAMM2 as well I don't see it gaining any traction. They can use dual sided modules and more of them to increase capacity instead of using 4 different size types.
It really is technical necessity. Type A with 40mm length like the one Teamgroup has released seems to be intended as mainstream module and has been used in all showcases, but limited space dictates that it can't offer the same maximum amount of memory as four DIMMs do (128GB against 4x48=192GB with UDIMMs ord 4x128=512GB with RDIMMs atm). For that you need at least the longer type B (256GB) and type D stacked allows even for double that amount. I would have suspected that type B and D were intended for HEDT, WS and Servers only but since all demonstration boards until now had the space in front of the type A CAMM2 cleared, we can expect type B and D modules for consumers, too. But I suspect high clock modules will mostly be type A and frankly, 128GB max (possibly 192GB in the future) is more than enough for mainstream for a long time.
LP(5)CAMM2 is something different entirely and to me is the more important one but sadly hasn't gotten enough traction until now. As I understand, going beyond DDR5-5600 with SO-DIMMs and 6400 with CSO-DIMMs will be very difficult if not impossible, and right now less and less notebooks even use SO-DIMMs because highspeed LPDDR5X with 7.500-8.500MT/s and more coming really offers more performance. LPCAMM2 seems to be the only way to make RAM still replacable in mobile devices while offering the same speed soldered LPDDR does. And for me, that's very important. I'm very frustrated that all laptops with Ryzen AI 300 shown so far stick to LPDDR5X.As I understand, CAMM2 already has the same onboard clockdriver CU-DIMM uses and still offers the benefits of shorter traces, thus lower latancies, even higher clockrates in the future, easier cooling and less intrusion into the CPU-cooler. CU-DIMM is only the last evolution of old DIMM.
There are many advantages to using LPDDR5/LPDDR5x and LPCAMM2 solves the major upgradability problem. We wouldn't even need CAMM2 laptops with 128gb LPCAMM2 modules on the roadmap, put two of them together and you get a 256gb monster workstation. I suspect that might be the plan for Strix Halo (Ryzen AI Max - damn these stupid names) that allegedly has a 256b memory bus.
What also makes zero sense from a non-technical standpoint, is if the effective channels have staggered ic’s on the camm pcb, isn’t access to different ic’s on the pcb itself going to nullify any benefit from “shorter trace length” bs (the camm implementation on unavailable consumer boards don’t even have the actual camm socket remotely closer to the socket itself)?
I see little value in pursuing it tbh. If it were truly that much better we wouldve seen actual implementation in the desktop space before cu-dimms hit the market.
This one belongs in the trashcan for desktops imo.