The long-promised gaming performance uplift for "Arrow Lake" processors is here, but for now, it is only available in China. Called Intel Performance Optimizations (IPO), this feature aims at system integrators rather than end users and offers a balanced approach between stock settings and full manual overclocking, all while preserving warranty coverage. IPO works by applying optimized profiles that adjust a range of CPU and memory parameters. On the CPU side, it fine‑tunes P‑core and E‑core frequencies, ring‑bus speeds, the UPI interconnect, D2D links between tiles, and both PL1 and PL2 power limits. For RAM, IPO raises transfer rates and tightens timings, pushing modules beyond their factory XMP or EXPO profiles. Early results from Chinese OEM Maxsun show that IPO can boost core clocks by about 200 MHz and elevate DDR5‑8000 kits to DDR5‑8400. In gaming tests provided by Maxsun, this translated to roughly a 10 percent uplift in frame rates, an encouraging figure given Arrow Lake's mild launch performance in gaming.

At debut, some Arrow Lake SKUs trailed their "Raptor Lake" predecessors because the chiplet‑based memory controller introduced extra latency and ring‑bus clocks ran slower. Supply‑chain constraints and tariffs have limited IPO's rollout to China so far, where pre‑built systems from vendors like Maxsun are shipping with the feature enabled. Warranty handling stays with the OEM, so users can enjoy the extra headroom without risking hardware support. Behind the scenes, Intel has been issuing firmware and microcode patches since December, most recently microcode 0x114 paired with CSME firmware 19.0.0.1854v2.2, to improve Arrow Lake's efficiency. IPO represents the next step in that effort and could become a model for global "opt‑in" BIOS presets if the pilot proves successful. For now, China is serving as the testing ground for Intel's latest attempt to squeeze more performance out of Arrow Lake. We have to wait and see if Western markets follow soon.

ZOTAC started teasing a refresh of its Apocalypse product line earlier in the year. Two months later, fairly concrete details of the (still) upcoming GeForce RTX 5080 16 GB variant emerged via the NVIDIA board partner's Weibo blog. Unfortunately, ZOTAC's ultra premium 3.5-slot thick/ARGB-lit behemoth design is expected to remain exclusive to the Chinese PC hardware market. Western hardcore gaming enthusiasts are best served by the manufacturer's alternative flagship triple-slotter: GeForce RTX 5080 AMP Extreme INFINITY ULTRA. ZOTAC's mainland China and Hong Kong offices have declared the arrival of brand-new Apocalypse SKUs at retail; utilizing NVIDIA's "Blackwell" GeForce RTX 5080 and RTX 5070 Ti GPUs.

Yesterday's Weibo bulletin commenced with: "when mecha aesthetics collide with technology, and gaming passion merges with extreme performance, the ZOTAC GeForce RTX 50 Apocalypse series graphics cards are born! After (our) continuous R&D, improvement, testing and adjustment—today, newly upgraded flagship graphics cards are officially launched!" The brand has advertised the return of an apparently much-missed product line mascot: "Apocalypse Princess is back with a new look, starting a game/AI exploration journey with you." Promotional imagery and box art feature a prominent illustration of ZOTAC's flagship series heroine—this "mecha artwork" demonstrates a serious sci-fi aesthetic, albeit with a cute female protagonist leading the way. A rival AIB specializes in this type of "marketing"—Yeston's similar-ish presentation language concentrates on enchanting fantasy characters.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, thrilled to announce an extraordinary overclocking milestone achieved by the Z890 AORUS TACHYON ICE motherboard paired with the latest Intel Core Ultra (Series 2) processor. Leveraging its proprietary LN2 SWITCH technology - the critical innovation behind this breakthrough—and V-COLOR Manta XFinity RGB DDR5 memory, legendary overclocker HiCookie has established a groundbreaking world record of DDR5-12752. This remarkable achievement solidifies GIGABYTE's position at the forefront of extreme Overclocking performance.

⁠The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. This extraordinary achievement showcases GIGABYTE's ongoing commitment to the overclocking community.

Gamers are eagerly awaiting the launch of the RDNA 4-based Radeon RX 9070 and RX 9070 XT gaming GPUs from AMD, which are widely expected to offer commendable value, thanks to comparatively reasonable prices paired with perfectly admirable raw performance that trades blows with the GeForce RTX 5070 family from NVIDIA. Interestingly, a recently leaked retail box for a PowerColor Red Devil RX 9070 XT GPU has revealed a striking detail - the AIB card will boast a whopping 900-watt requirement for a PSU. This is an absurd number, considering that the ROG Astral RTX 5090 behemoth commands a 1000-watt PSU requirement. While some may deem the image to be fake, or perhaps a typo, AMD's Frank Azor has responded to the tweet, claiming that there will be "plenty" of RX 9070 XT cards with lower PSU requirements.

The packaging also confirms that the upcoming mid-range GPU from AMD will sport 64 CUs, which is hardly a surprise. The Red Devil 9070 XT GPU from PowerColor is a very high-end unit with a 3.0 GHz boost clock and 3x 8-pin power connectors for overclocking headroom, which explains the mammoth 900-watt PSU requirement. As pointed out by Redditors, the Red Devil 7900 XTX also featured a 900-watt PSU requirement, which is 100 watts more than what AMD officially recommends. According to VideoCardz, the PowerColor RX 9070 XT Reaper (reference card) carries a 750-watt PSU requirement, whereas the RX 9070 variant requires a 650-watt PSU. The official launch for the RDNA 4 cards is just around two weeks away, which is when we will finally know for sure.

Yes, the title is correct. One of NVIDIA's GeForce RTX 5090D "China" edition GPUs, not the regular RTX 5090, managed to run at 3.4 GHz under liquid nitrogen. With a staggering 575 W default TDP, Tony Yu, ASUS China's general manager, has performed physical modifications that allow the card to run up to 1000 W TDP. The RTX 5090D is a China-exclusive variant with virtually no difference from the regular RTX 5090, just limited general AI capability due to US export regulations. ASUS China used its top-end Astral OC variant for this stunt, which, as we proved in our review of the regular ASUS RTX 5090 Astral OC, has some pretty good chip binning, allowing the card to reach the highest overclock. We pushed the regular RTX 5090 Astral OC GPU on air to 3086 MHz, a +277 MHz over the stock boost setting. However, the RTX 5090D equivalent under LN2 manages to reach 3,390 MHz at peak loads, which is a +581 MHz difference.

For memory, the overclock is equally impressive with 34 Gbps. Regarding performance, the LN2-overclocked RTX 5090D surpassed stock performance by approximately 16%. During benchmark tests, the GPU outperformed multiple previous-generation graphics cards, including a dual RTX 3090 Ti configuration in Port Royal and a quad GTX 1080 Ti setup in Fire Strike. Power consumption figures indicate that 1,760 W was used in total for a rig with ASUS ROG Astral RTX 5090D, which is paired with the Ryzen 7 9800X3D on the ASUS ROG X870E Hero motherboard. This roughly yields a 1,000 W power consumption by the card, which has seen its PCB get physical modifications to output such high power.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring the exclusive LN2 SWITCH function, which is key to breaking through in this overclocking attempt, and V-COLOR Manta Xfinity RGB, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-12726. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

Besides the astonishing memory frequency, Z890 AORUS TACHYON ICE also break another three world records of 3DMARK CPU Profile 1T/2T/8T.

Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly launches today at CES 2025 the TOUGHRAM XG RGB D5 7200 MT/s 32 GB (16 GB x2), now equipped with the latest CKD (Client Clock Driver) technology. This new addition to Thermaltake's high-performance DDR5 memory lineup integrates advanced technology with a sleek design, offering an exceptional solution for PC enthusiasts and professionals. With CKD technology, the TOUGHRAM XG RGB D5 Memory ensures superior signal integrity, improved power efficiency, and enhanced overclocking stability, delivering consistent performance under the most demanding workloads. Ideal for gaming, creative projects, and AI-driven applications, this memory module is engineered to exceed the expectations of modern high-performance computing.

"Thermaltake is committed to redefining the limits of DRAM memory technology to meet the evolving needs of gamers and professionals," said Kenny Lin, CEO of Thermaltake. "The TOUGHRAM XG RGB D5 with CKD technology exemplifies our dedication to delivering cutting-edge solutions that offer superior speed, stability, and customization; whether for serious gamers, creators, or even AI development, this memory sets a new benchmark in high-performance computing."

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, in cooperation with the ASUS ROG team, is showcasing multiple overclock achievements on the newly announced ASUS ROG Crosshair X870E Apex motherboard, including a high memory speed of DDR5-10600 and another operating at DDR5-6800 CL28 in 1:1 mode, both under Memtest stress-test. Additionally, G.SKILL DDR5 memory is used by ASUS in-house overclocker, Safedisk, to break several overclock records with the latest AMD Ryzen 9 9950X desktop processor.

Exploring OC Limits at DDR5-10600 2x24 GB
Aiming to explore the limits of memory overclock potential of the new motherboard, Safedisk challenged the fastest possible dual-channel memory speed with Memtest stress-test running. The screenshot below shows a 48 GB (2x24GB) memory kit operating at DDR5-10600 with the ASUS ROG Crosshair X870E Apex motherboard and AMD Ryzen 5 8500G desktop processor, completing the Memtest stress-test with CPU and memory under water chiller cooling.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

In addition to the TITAN and GUARDIAN SKUs announced earlier this month, Sparkle is working on several other SKUs. The roadmap includes the low-profile version of the Arc B570, as well as the Arc B580 ROC OC Ultra, which is expected to come with a 2,800 MHz GPU factory overclock and 210 W TBP, both coming next year.

According to the roadmap, Sparkle plans to release the B580 ROC OC Ultra version in February 2025, and this one will be a part of Sparkle's ROC Luna series, featuring an all-white design. As said, it gets a 2,800 MHz GPU factory-overclock, which is 60 MHz higher than the Sparkle Arc B580 TITAN OC. It also has a slightly higher 210 W TBP. Sparkle included a small picture showing a 2.5-slot thick design with a dual-fan cooler. Additional roadmap also confirms the launch of the Arc B570 Low-Profile version, which will feature a lower 170 W TBP and a three-fan cooler, similar to what we have seen from GUNNIR lately.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, gaming monitors and power supply units, proudly announces a new milestone achieved with the Z890 Taichi OCF motherboard. In a remarkable overclocking feat, overclocker AKM broke a world record in memory overclocking, pushing memory frequency to a staggering DDR5-12527 MHz. This milestone was accomplished using the Intel Core Ultra 9 285K Processor, paired with the Z890 Taichi OCF motherboard and v-color Manta XFinity RGB memory, to set an impressive new benchmark in performance.

The Z890 Taichi OCF is the pinnacle of ASRock's commitment to extreme overclocking, embodying the philosophy "Built for Extreme Overclocking." Engineered to meet the demands of professional overclockers, this motherboard delivers unparalleled precision, overclocking capability, and performance. With an advanced design that allows for peak stability and high-frequency performance, the Z890 Taichi OCF has quickly set a new standard for enthusiasts and professionals who push their systems to the limit.

Intel has significantly changed its latest 0x112 microcode update, removing users' ability to bypass the Digital Linear Voltage Regulator (DLVR) through standard BIOS settings on "Arrow Lake" processors. DLVR, a technology designed to provide precise voltage control for individual performance cores and efficiency core clusters, offers great benefits during gaming sessions and light workloads. According to overclocker der8auer's analysis, DLVR can effectively manage power consumption during gaming, with power losses of around 20 W at typical gaming loads. However, these losses can shoot up to approximately 88 W under full CPU utilization. Previously, users could disable DLVR through a BIOS setting called "Power Gate" mode, which is particularly useful for intensive workloads where power losses might impact performance. With the new microcode update, this option has been removed from standard BIOS settings. It is also worth pointing out that DLVR is in its second iteration inside Arrow Lake CPUs, after the initial debut in "Raptor Lake," which had DLVR fused off.

Intel explained to Hardwareluxx that this change was implemented to "prevent accidental misuse of DLVR bypass," restricting its use to extreme overclocking scenarios involving sub-ambient cooling methods like liquid nitrogen. The update has already been rolled out through BIOS updates on some Z890 chipset motherboards, with ASRock and MSI being among the first manufacturers to implement the new microcode. While DLVR bypass may still be accessible through specialized LN2 profiles on high-end motherboards, the average enthusiast user loses direct control over this feature. This development mainly affects early Arrow Lake adopters, as not all motherboards include extreme overclocking profiles. While Intel's move appears to prevent potential issues, we must remember that power settings are something that users should only change with plenty of consideration. Removing this power gate mod is Intel prevention for Raptor Lake-like situations where these chips had an issue with Vmin shift.

GeIL - Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers, announced today that its full range of DDR5 memory products, from 6400 MT/s to 8000 MT/s, will now be available in both CUDIMM and UDIMM options to meet diverse consumer needs. For high-end overclocking applications, GeIL is introducing two new high-speed specifications, 8800 MT/s and 9200 MT/s, offering overclocking enthusiasts an optimal choice for top performance. Both CUDIMM and UDIMM options ensure excellent compatibility and full support for Intel's latest Core Ultra Processors (Series 2).

According to the latest JEDEC standards, CUDIMM includes an additional CKD (Clock Driver) chip, which regenerates the clock signal directly on the DIMM. This integration reduces signal degradation and noise, resulting in enhanced memory stability and performance, with stable operation at speeds of 6400 MT/s and even reaching up to 7200 MT/s. For both standard and high-performance applications, the CKD chip plays a crucial role in signal integrity and reliability, enabling faster, more stable speeds.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

In actively verifying its next-generation CAMM2 (Compression Attached Memory Module 2) memory modules, global memory leader Team Group Inc. today announced two specifications: consumer-grade CAMM2 DDR5 7200 MHz and industrial-grade CAMM2 DDR5 6400 MHz. These new products provide expanded options for the memory market, delivering faster data transfer speeds, enhanced performance, and greater user flexibility.

The consumer-grade CAMM2 memory from Team Group operates at DDR5 7200 MHz CL34-42-42-84 under manual overclocking, delivering exceptional performance. Compared to the default JEDEC specification, the module offers write, copy, and read speeds of up to 108,000 MB/s, 106,000 MB/s, and 117,000 MB/s, respectively, while reducing overall latency to 55ns. The module delivers smoother performance when running large applications, gaming, or multitasking. The potential to achieve ultra-high frequencies of 8000-9000 MHz in the future further underscores its superior capabilities. In addition, Team Group Industrial is developing an industrial-grade CAMM2 memory, optimized for DDR5 6400 MHz, which is designed for industrial control, edge computing, and AI applications, providing robust support for high-performance computing and real-time data processing. The module will play a critical role in the development of technologies such as smart manufacturing, autonomous driving, and smart cities by improving both performance and reliability.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

Kingston Technology Company, Inc., a world leader in memory products, announced the upcoming release of Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel's new 800-series chipset (formerly codenamed Arrow Lake). Intel's 800-series chipset is the first platform to utilize Clock Drivers on CUDIMMs (Clocked Unbuffered Dual Inline Memory Modules). At 6400 MT/s DDR5, JEDEC mandates the inclusion of a Client Clock Driver (CKD) on UDIMMs and SODIMMs. This component buffers and redrives the clock signal from the processor, enhancing signal integrity to the module. To distinguish these advanced modules from standard DDR5 UDIMMs and SODIMMs, JEDEC has designated them as CUDIMMs and CSODIMMs, respectively.

Kingston FURY Renegade RGB and non-RGB CUDIMM modules start at an overclocked speed of 8400 MT/s and are available as 24 GB single modules and 48 GB dual channel kits. Since CUDIMMs and UDIMMs share the same 288-pin connector, Kingston FURY UDIMMs with XMP and EXPO profiles are also compatible with Intel 800-series motherboards. However, it's recommended to verify compatibility through the motherboard manufacturer's QVL (Qualified Vendor List) or by checking the Kingston Configurator for supported speeds and capacities.

Gigabyte, the world's leading computer brand, proudly announces that the AORUS Z890 series motherboards are now officially available for purchase. Designed to maximize the performance of the latest Intel Core Ultra processors, the groundbreaking D5 Bionic Corsa technology was introduced along with advanced thermal management and optimized power design on these boards. GIGABYTE's continuous partnership with HWiNFO further enhances the boards with real-time monitoring of CPU vCore power phase outputs and efficiency. With these powerful boards now on sale, users can enjoy unmatched performance and seamless customization, making them the ideal platform for enthusiasts and professionals.

D5 Bionic Corsa is the core technology for AORUS Z890 series motherboards, which leverages AI-enhanced innovations across software, hardware, and firmware to boost DDR5 memory speeds to an unprecedented 9500+ MT/s. The AI SNATCH Engine, powered by advanced AI overclocking models, optimizes configurations for DDR5 XMP memory and CPUs, enabling up to 20% faster speeds. With XMP AI BOOST and CPU AI BOOST, users can achieve world-class overclocking performance with just one click. The AI-driven PCB Design enhances signal integrity by reducing reflection by 28.2%, while HyperTune BIOS fine-tunes the Memory Reference Code (MRC) for peak performance. The VRM Thermal Balance mechanism ensures heat dissipation across the VRM with a heatpipe design, while optimized PWM firmware balances current output for superior stability.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring Vcolor CUDIMM 24 GB x 2 modules, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-10600. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. Featuring the latest D5 Bionic Corsa, an AI-enhanced overclocking technology that seamlessly integrates software, hardware, and firmware, overclockers can now leverage AI technology to unlock groundbreaking DDR5 speeds with ease.
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Team Group Inc.'s gaming brand, T-FORCE, has launched two new color variants for its high-end XTREEM memory series: the T-FORCE XTREEM DDR5 in pink and the T-FORCE XTREEM ARGB DDR5 in snow white. T-FORCE is committed to delivering the ultimate performance experience for gamers. In addition to continuously enhancing technical specifications, the design is also innovative. These memory modules not only fully unleash the performance required by overclocking gamers but also introduce a new, stylish aesthetic, meeting both performance and fashion demands.

The T-FORCE XTREEM DDR5 now comes in a new diamond rose variant, featuring a sandblasted metal texture heat spreader adorned with the T-FORCE logo. It makes a stunning debut among the diverse range of memory options. Meanwhile, the T-FORCE XTREEM ARGB DDR5 launches in white, with a snow-white sandblasted heat spreader and dual light bars, carefully selected to showcase a multi-layered optical design. This creates an immersive soft white RGB aurora effect. The T-FORCE XTREEM series supports overclocking technology on both Intel and AMD platforms, offering one-click overclocking with dual-mode modules that fully unleash peak performance. While TEAMGROUP continues to develop high-spec products, it also remains attuned to market trends, offering a variety of vibrant design choices to provide the best memory solutions for gamers.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase an incredibly high-speed overclock of G.SKILL DDR5 memory at DDR5-9000 CL44-56-56 with 48 GB (24 GB x2) kit capacity, featuring AMD EXPO overclock profile and demonstrating the memory overclock capability of the ASUS ROG CROSSHAIR X870E HERO motherboard and the AMD Ryzen 7 8700G processor.

A New High-Speed Frontier with 24 GB x2 Continuing to explore the overclock limits of DDR5 memory speed in conjunction with the new ASUS NitroPath DRAM technology that provides enhanced DDR5 memory overclock performance, G.SKILL demonstrates an amazing DDR5-9000 CL44-56-56 with two 24 GB capacity modules. Refer to the screenshot below to see this G.SKILL memory kit reaching the astounding overclocked memory speed on the ASUS ROG CROSSHAIR X870E HERO motherboard with an AMD Ryzen 7 8700G processor

The WireView Pro GPU was developed in collaboration with Jon "elmor" Sandström, a renowned hardware R&D engineer, extreme overclocker, and founder of Elmor Labs, to introduce new functionalities. To better protect the graphics card from potential damage, the Pro version of the WireView includes sensor pin detection that recognizes whether the 12V-2x6 power connector is correctly plugged into the power supply.

Another new feature is the temperature sensors on the PCB of the WireView Pro GPU, which measure the temperature at the power connectors. Users can set a threshold via the WireView Pro GPU, which triggers an acoustic alarm when exceeded. Additionally, an alarm can be set to trigger when a defined current level is exceeded. The WireView Pro GPU also includes two additional temperature sensors that can be connected to monitor, for example, the temperature of the graphics card's memory or voltage regulators.