XPG, a gaming brand of ADATA Technology, a global leader in memory modules and flash memory, is proud to announce its successful collaboration with GIGABYTE Technology. Leveraging the XPG LANCER RGB DDR5 memory and LN2 (Liquid Nitrogen) cooling technology, achieved an astonishing 12,762 MT/s overclocking speed, breaking the DDR5 memory overclocking world record. This remarkable achievement has been verified by the renowned international overclocking scoring platform, HWBOT, reinforcing XPG's leadership in extreme overclocking memory.

A Legendary Overclocking Record By Two Industry Titans
This record-breaking overclocking effort was spearheaded by GIGABYTE's renowned overclocker and engineer, HiCookie. The setup featured the Z890 AORUS TACHYON ICE motherboard, meticulously designed for overclocking, paired with the XPG LANCER RGB DDR5 memory and an Intel Core Ultra 9 285K processor. The XPG LANCER's optimized PCB design, IC tuning capabilities, and integrated circuit technology ensured stable operation even under the extreme LN2 environment, laying a crucial foundation for this world record. The Z890 AORUS TACHYON ICE motherboard, boasting an array of overclocking-centric features, including an OC button and an LN2_SW liquid nitrogen mode switch, further facilitated the CPU's ability to achieve its peak performance under extreme conditions.

V-Color Technology Inc., a global leader in advanced, high-performance memory solutions, proudly announces the groundbreaking launch of the industry's first-ever 64 GB (32 GB x2) DDR5 O CUDIMM memory kit, featuring unprecedented speeds up to 9000 MT/s. Specifically tailored for Intel Core Ultra processors and the latest Z890 motherboards, this cutting-edge product expands V-Color memory solutions. This new kit will also be part of the acclaimed SCC lineup (Speed Booster, Colorful Makeover, Cost-effective), delivering unmatched capacity, speed, and reliability to empower systems for AI training, gamers, creators, and professional users worldwide.

In line with V-Color's tradition of continuously pushing the envelope, the introduction of this groundbreaking 64 GB (32 GB x2) DDR5 OC memory kit represents a significant milestone in the memory industry. This new kit combines ultra-high memory capacity with setting frequencies, ensuring exceptional performance and responsiveness for intensive workloads, gaming, and creative applications.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces exciting updates to its DDR5 Gaming/OC memory lineup. The new releases include stylish color options for the FIT V and BOLT V series, enhanced performance with lower latency SKUs, and "Optimized for AMD" variants across its DDR5 OC models. This update boosts overall system efficiency and expands platform compatibility, offering gamers, creators, and professionals even more choices to elevate their systems.

KLEVV introduces two fresh color variations to its FIT V and BOLT V memory series, complementing a broader range of system designs. The FIT V series now features an elegant Jet Black edition, delivering a minimalist and understated aesthetic tailored for creators and professionals. Meanwhile, the BOLT V series now features an all new pure White edition, combining a bold, modern aesthetic alongside high-speed performance tailored for gamers.

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the release of three new DDR5 memory specifications with AMD EXPO OC profiles for AMD platforms, including an extreme speed with low-latency at DDR5-8000 CL36-48-48 48 GB (24 GB x2), large-capacity & low-latency DDR5-6000 CL28-36-36 192 GB (48 GB x4), and a new DDR5-6000 CL26-39-39 with 48 GB (24 GB x2) kit capacity. Designed for PC enthusiasts, gamers, content creators, and AI applications, these cutting-edge DDR5 memory kits push the boundaries of speed, latency, and capacity on AMD AM5 platforms.

Pushing the Limits with Extreme DDR5-8000 CL36 24 GB x2
For users seeking top-tier performance, the new DDR5-8000 CL36-48-48 24 GB x2 memory kit with AMD EXPO OC profile is engineered for ultra-high memory speed at low CL36 latency timings. This extreme-speed and low-latency combination is ideal for exceptional system responsiveness and multitasking performance. See below for the Memtest validation screenshot showcasing its stability on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

AMD today launched the EPYC Embedded 9005 line of server processors in the embedded form-factor. These are non-socketed variants of the EPYC 9005 "Turin" server processors. The chips are intended for servers and other enterprise applications where processor replacements or upgradability are not a consideration. The EPYC Embedded 9005 "Turin" are otherwise every bit similar to the regular socketed EPYC 9005 series. These chips are based on a BGA version of the "Turin" chiplet-based processor, and powered by the "Zen 5" microarchitecture. Besides the BGA package, the EPYC Embedded 9005 series comes with a few features relevant to its form-factor and target use-cases.

To begin with, the EPYC Embedded 9005 "Turin" series comes with NTB (non-transparent bridging), a technology that enables high-performance data transfer between two processor packages across different memory domains. NTB doesn't use Infinity Fabric or even CXL, but a regular PCI-Express 5.0 x16 connection. It isn't intended to provide cache coherence, but to absorb faults across various memory domains. Next up, the series supports DRAM flush for enhanced power-loss mitigation. Upon detecting a power loss, the processor immediately dumps memory onto NVMe storage, before the machine turns off. On restart, the BIOS copies this memory dump from the NVMe SSD back to DRAM. Thirdly, the processors in the series support dual SPI flash interfaces, which enables system architects to embed lightweight operating systems directly onto a 64 MB SPI flash ROM, besides the primary SPI flash that stores the system BIOS. This lightweight OS can act like a bootloader for operating systems in other local storage devices.

Biwin, a world-renowned innovator in cutting-edge memory and storage solutions, proudly introduces the Biwin Black Opal OC Lab Gold Edition DW100 RGB DDR5 192 GB Memory Kit (48 GB x 4), available in DDR5-6400 CL30-39-39-108 1.4 V and DDR5-6000 CL28-36-36-102 1.4 V specifications. Breaking the capacity limits of traditional consumer memory, this ultra-large 192 GB kit offers the performance boost needed for AI computing, large-scale data processing, and next-gen computing.

Push Memory Performance with Revolutionary 192 GB Memory Kit
Biwin Black Opal DW100, delivering an ultra-high-capacity 192 GB (48 GB x4) configuration, redefines what's possible with desktop memory and exceptional memory bandwidth, stability, and efficiency. This breakthrough enables users to take full advantage of DDR5's enhanced data throughput to power fast, out-of-the-box speeds for AI computing, large language models (LLMs), generative AI, and edge computing, and other data-rich workloads.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, today introduced the new B850MT2-E DJ motherboard. Built on AMD's B850 chip architecture, B850MT2-E DJ is tailor-made for casual home and office use.

Engineered to support the latest AMD Ryzen 9000, 8000, and 7000 series processors, the B850MT2-E DJ ensures seamless multitasking and efficient power management, making it an ideal choice for modern computing needs. Supporting up to 128 GB of DDR5 across two DIMM slots, the B850MT2-E DJ offers more bandwidth than DDR4, delivering faster data access and smoother performance. Additionally, PCIe 4.0 M.2 support provides lower latency and lightning-fast speeds of up to 64 Gb/s, doubling the bandwidth of PCIe 3.0 M.2 for quick data transfers and minimal load times, ensuring a smooth and efficient user experience.

Team Group Inc. announced today that it will participate in Embedded World 2025, a premier global event for embedded technology. The company will unveil its latest industrial-grade solutions, spanning three key product lines designed to meet the evolving demands of AI, high-performance computing, and data security. These innovations demonstrate Team Group's commitment to advancing efficiency and stability in industrial applications while laying a solid foundation for future technological progress.

Highlighting its leadership in embedded applications and groundbreaking technology, Team Group's D500R WORM Memory Card has been recognized with the prestigious Embedded Award. Join Team Group from March 11-13, 2025, at NürnbergMesse Convention Center in Nuremberg, Germany (Hall 5 / 5-239) to explore the latest breakthroughs and optimal solutions in industrial solutions.

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

TrendForce's latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Most contract prices across applications were seen to have reversed downward. However, increased procurement of high-capacity server DDR5 by major American CSPs helped sustain price momentum for server DRAM.

AAEON's UP brand this week confirmed the release of the UP Squared 7100 Edge, its fourth generation of Mini PC based on the compact UP Squared (85.6 mm × 90 mm) developer board. The UP Squared 7100 Edge comes equipped with either the Intel Processor N97 or Intel Processor N100 as its default CPU, a substantial upgrade on the Elkhart Lake platform offered by the PC range's previous generation. Further upgrades can be seen in its 16 GB of soldered LPDDR5 system memory, which delivers up to 50% higher data rates with greater power-efficiency.

Equipped with a solid I/O primarily geared towards industrial automation and communication tasks—such as dual Gigabit LAN and three USB Type-A ports—the UP Squared 7100 Edge sees AAEON add a second DB-9 port. This upgrade grants systems integrators with two COM ports, both supporting RS-232/422/485 signals.
The UP Squared 7100 Edge's design makes it a very suitable option for upgrading existing industrial automation setups that require communication with legacy equipment. However, with CPU-native functions such as Enhanced Intel SpeedStep Technology and AVX2 Instruction sets, the UP Squared 7100 Edge can execute more demanding edge computing workloads while remaining power-efficient, making it an equally good choice for new, more advanced projects.

Biwin, a leading innovator in storage and memory technology, in cooperation with the OC Lab, launches the new OC Lab Gold Edition DW100 RGB DDR5 at DDR5-8000 CL34 & CL36 32 GB (2×16 GB) along with a second DDR5-6400 CL28 EXPO profile.

Both DDR5-8000 options, with their ultra-high speeds and optimized timings, are tailored for overclocking and extreme performance scenarios that push the system to the limit. These profiles excel in scenarios where every ounce of speed is needed, such as high-end gaming, benchmarking, or other performance-demanding tasks. The DDR5-6400 option strikes a more balanced approach, prioritizing lower latencies while still delivering a strong performance. With its lower latency, the DDR5-6400 provides smooth gaming, faster application load times, and overall system responsiveness.

The Polish industrial memory manufacturer will once again be showcasing its product range at Embedded World, which takes place in Nuremberg, Germany, from 11 to 13 March. The company will be showcasing its latest solutions for industrial, defense, data center and artificial intelligence (AI) applications. Goodram Industrial offers DRAM modules, SSDs and Flash memory for use in demanding industrial environments. Manufacturing in Poland, full memory testing and an in-house R&D department underpin product quality. Goodram Industrial memory is characterized by reliability, long life and resistance to extreme operating conditions. The range includes customized solutions for automation, robotics, transportation, medical, security systems, energy and telecommunications.

This year's launches include DDR5 CUDIMM/CSODIMM memory modules. These offer not only high capacity but also increased speed and stability of operation. Another interesting innovation is a microSD card with pSLC-Boost technology, which offers up to 100,000 program/erase cycles, far exceeding the standard parameters.

Micron Technology, Inc., today announced it is the first in the industry to ship samples of its 1γ (1-gamma), sixth-generation (10 nm-class) DRAM node-based DDR5 memory designed for next-generation CPUs to ecosystem partners and select customers. This 1γ DRAM milestone builds on Micron's previous 1α (1-alpha) and 1β (1-beta) DRAM node leadership to deliver innovations that will power future computing platforms from the cloud to industrial and consumer applications to Edge AI devices like AI PCs, smartphones and automobiles. The Micron 1γ DRAM node will first be leveraged in its 16 Gb DDR5 DRAM and over time will be integrated across Micron's memory portfolio to meet the industry's accelerating demand for high-performance, energy-efficient memory solutions for AI. Designed to offer speed capabilities of up to 9200 MT/s, the 16 Gb DDR5 product provides up to a 15% speed increase and over 20% power reduction compared to its predecessor.

Senao Networks Inc., a global leader in advanced networking and computing solutions, proudly announces the launch of its AI PC, AC121, an ultra-compact intelligent PC that combines next-generation performance, AI-driven intelligence, and a sleek, space-saving design. Tailored for modern professionals, enterprises, and technology enthusiasts, the AC121 establishes a new standard in compact computing.

Unparalleled Performance
At the heart of the AC121 is the Intel Arrow Lake-S processor, offering 65 W/35 W TDP and integrated NPU to power AI-enhanced workloads. This makes the AIPC ideal for multitasking, content creation, and AI-enhanced applications.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the introduction of an enhanced revision of DDR5 R-DIMM memory to the market. Based on the newly released JEDEC revision standards for DDR5 R-DIMM, the new G.SKILL R-DIMM memory features a 16-layer PCB for improved signal integrity, as well as adding two transient voltage suppression (TVS) diodes and a fuse for voltage protection. Designed for enterprise servers and professional workstations, the new DDR5 R-DIMM memory brings cutting-edge advancements to performance and protection.

Improved Signal Integrity with 16-Layer PCB
These new DDR5 R-DIMM memory modules feature an advanced 16-layer PCB, a significant upgrade from previous 8- or 10-layer designs. The increase in the PCB layer count improves signal integrity for better reliability and stability in data transmission, even under high-performance or overclocked workloads - making it an ideal DDR5 R-DIMM memory choice for high-performance computing applications on servers or workstations.

GIGABYTE, a global leader in computing innovation and technology, will showcase its full-spectrum AI computing solutions that bridge development to deployment at MWC 2025, taking place from March 3-6.

"AI+" and "Enterprise-Reinvented" are two of the themes for MWC. As enterprises accelerate their digital transformation and intelligent upgrades, the transition of AI applications from experimental development to democratized commercial deployment has become a critical turning point in the industry. Continuing its "ACCEVOLUTION" initiative, GIGABYTE provides the comprehensive infrastructure products and solutions spanning cloud-based supercomputing centers to edge computing terminals, aiming to accelerate the next evolution and empower industries to scale AI applications efficiently.
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Loongson Technology has announced its next-generation 3B6600 processor—according to recent Chinese press reports, early details were disclosed in "investor relations activity" documentation. Their eight-core design is still in development, with the fabless company (allegedly) setting some lofty performance goals. According to a MyDrivers report (citing Fast Technology), the 3B6600 processor's single-core and multi-core "high level" performance is touted to match that of Core i5 and i7 offerings from Intel's 12th and 13th Generation portfolios. In the past, Loongson has compared its older products to Western equivalents. Last year, their 3A6000 chip design was mentioned in the same sentence as "AMD Zen 4 and Intel Raptor Lake" processor families. Around November 2023, reports had it approximating Team Blue Core i3-10100 "Comet Lake" CPU performance.

The next-gen 3B6600 CPU is supposedly using its predecessor (3A6000) as a springboard; MyDrivers believes that the same in-house LoongArch ISA design (fabricated on 12 nm/14 nm) will be revisited. The publication highlighted a significant area of optimization: "single-core performance of 3B6600 is expected to be in the world's leading ranks...Loongson 3B6600 will continue to use mature technology, and the architecture core will be upgraded to the new LA864. The same frequency performance is greatly improved by about 30%, compared with the Loongson 3A6000's LA664 architecture." Loongson engineers are reportedly targeting a maximum turboboost frequency of 3.0 GHz, but under normal operation the 3B6600 chip is predicted to offer a main frequency of 2.5 GHz. The new design will integrate a new "LG200 GPGPU" graphics computing core—additionally, supported standards include: DDR5 memory, PCIe 4.0 bus, and HDMI 2.1.

AMD is readying two important client segment processors powered by the next-generation "Zen 6" microarchitecture, according to a sensational new report by Moore's Law is Dead. These are the "Medusa Point" mobile processor, and the "Olympic Ridge" desktop. The former is a BGA roughly the size and Z-Height of the current "Strix Point," but the latter is being designed for the existing Socket AM5, making it the third (and probably final) microarchitecture to do so. If you recall, Socket AM4 served three generations of Zen, not counting the refreshed "Zen+." At the heart of the effort is a new CPU complex die (CCD) that AMD plans to use across its client and server lineup.

The "Zen 6" performance CCD is being designed for a 3 nm-class node, likely the TSMC N3E. This node promises a significant increase in transistor density, power, and clock speed improvements over the current TSMC N4P node being used to build the "Zen 5" CCD. Here's where it gets interesting. The CCD contains twelve full-sized "Zen 6" cores, marking the first increase in core-counts of AMD's performance cores since its very first "Zen" CCD. All 12 of these cores are part of a single CPU core complex (CCX), and share a common L3 cache. There could be a proportionate increase in cache size to 48 MB. AMD is also expected to improve the way the CCDs communicate with the I/O die and among each other.

Maxsun has just launched its MS-iCraft B860M CROSS "Aiga" Micro-ATX motherboard series for Intel CPUs, which includes both a standard and a Pro version. While both models share similarities—such as an all-white design—they also have key differences. The Pro version of the MS-iCraft B860M CROSS "Aiga" motherboard features a 3.4-inch display on the upper-left I/O armor, capable of showing real-time system information as well as custom graphics. In contrast, the standard version has a smaller screen that displays Aiga animations. Another distinction is that the Pro version is equipped with an Intel BE200 wireless network card, whereas the standard version uses the Intel AX211.

Aside from these differences, both motherboards have similar specifications. They support up to 192 GB of DDR5 RAM across four DIMM slots, with overclocking speeds reaching up to 9066 MT/s. Power delivery is handled by a 16+1+1 phase power supply design with 50 A DrMOS. Additionally, both models include a PCIe 5.0 x16 slot for high-performance graphics cards, and one PCIe 4.0 x4 slot.

Back in January, we covered a report about AMD designing its next-generation "Zen 6" CCDs on a 3 nm-class node by TSMC, and developing a new line of server and client I/O dies (cIOD and sIOD). The I/O die is a crucial piece of silicon that contains all the uncore components of the processor, including the memory controllers, the PCIe root complex, and Infinity Fabric interconnects to the CCDs and multi-socket connections. Back then it was reported that these new-generation I/O dies were being designed on the 4 nm silicon fabrication process, which was interpreted as being AMD's favorite 4 nm-class node, the TSMC N4P, on which the company builds everything from its current "Strix Point" mobile processors to the "Zen 5" CCDs. It turns out that AMD has other plans, and is exploring a 4 nm-class node by Samsung.

This node is very likely the Samsung 4LPP, also known as the SF4, which has been in mass-production since 2022. The table below shows how the SF4 compares with TSMC N4P and Intel 4, where it is shown striking a balance between the two. We have also added values for the TSMC N5 node from which the N4P is derived from, and you can see that the SF4 offers comparable transistor density to the N5, and is a significant improvement in transistor density over the TSMC N6, which AMD uses for its current generation of sIOD and cIOD. The new 4 nm node will allow AMD to reduce the TDP of the I/O die, implement a new power management solution, and more importantly, the need for a new I/O die is driven by the need for updated memory controllers that support higher DDR5 speeds and compatibility with new kinds of DIMMs, such as CUDIMMs, RDIMMs with RCDs, etc.

V-COLOR Technology Inc. proudly introduces the groundbreaking CKD SCC (Speed Booster, Colorful Makeover and Cost effective) O CUDIMM RGB Filler Kit 2+2 (2 DRAM Modules + 2 Filler Modules) additions to its DDR5 memory lineup, redefining high-performance and customization. With the launch of the new SCC O CUDIMM RGB Filler Kit now compatible with Intel Core Ultra CPUs Motherboards 800 series up to 8800 MT/s and not only that, the already existent SCC UDIMM kit just got a massive upgrade now reaching 8000 MT/s with dual profiles for Intel XMP 3.0 and AMD EXPO. This new SCC line will be under the family of the already amazing XFinity series that continues to push the boundaries of memory innovation.

The latest CKD SCC O CUDIMM is optimized for Intel Core Ultra CPUs and Z890 series motherboards, offering unmatched performance and stability. With speeds reaching 8000 MT/s ~ 8200 MT/s for 32 GB (2x 16 GB) configurations and 7000 MT/s ~ 8800 MT/s for 48 GB (2x 24 GB) configurations. The latest lineup of SCC technology doesn't just revolutionize the new O CUDIMM memory modules; it also pushes the boundaries of already existing UDIMMs to unprecedented levels. Speeds now reach an impressive 7200 MT/s up to 8000 MT/s, while the addition of dual profiles ensures seamless compatibility and performance optimization for both AMD EXPO and Intel XMP 3.0 systems. This development bridges accessibility across platforms, offering next-level performance for enthusiasts and professionals alike.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the 9th Annual OC World Cup 2025 extreme overclocking competition, starting with the Online Qualifier Stage, which will run from February 15, 2025 until March 19, 2025 on HWBOT.org. A total of 9 finalists from the Online Qualifier stage will be invited to compete live on the Live Qualifier stage at Computex from May 20 through May 23, 2025, which will be held in Taipei, for a share of the total prize pool of $40,000 USD. The OC Champion of the OC World Cup 2025 competition will be taking home $10,000 USD.

Consisting of three stages, beginning with the Online Qualifier, and ending with the Live Qualifier and Grand Final stages, which will be held in Taipei at Computex 2025, the G.SKILL OC World Cup is considered one of the most challenging overclocking competitions. The top 9 overclockers of the Online Qualifier stage will be invited to compete against each other live during the week of Computex 2025 at the G.SKILL booth in Nangang Exhibition Hall, and the top 3 overclockers from the Live Qualifier stage will go on competing for the title of OC Champion in the Grand Final stage.