AMD is reportedly sampling its next-generation Ryzen desktop processor powered by the "Zen 6" microarchitecture, codenamed "Medusa Ridge," to close industry partners, such as platform designers and OEMs, says Yuri Bubliy, aka 1usmus, author of the Hydra tuning software, and the now-retired DRAM Calculator for Ryzen. The processor sees AMD update both the CCDs and client I/O die, he says. AMD confirmed that it is building the "Zen 6" CCD on the TSMC N2 (2 nm) node, which entered risk production earlier this year. The node is expected to be ready for mass-production of 2 nm chips later this year. The 2 nm node presents a significant jump in transistor densities from the current TSMC N4P node on which AMD builds its 8-core "Zen 5" CCD, which 1usmus and other sources say, that AMD will use to increase CPU core counts per CCD.

Sources point to the possibility of AMD increasing core counts per CCD to 12, and giving the CCD 48 MB of L3 cache. At this point we don't know if all 12 cores will be arranged in a single CCX with a monolithic slab of 48 MB L3 cache, or if there's a dual-CCX layout with 6 cores per CCX sharing 24 MB of L3 cache, each. The other big upgrade with "Medusa Ridge" is its client I/O die (cIOD). AMD is expected to build its new generation cIOD on a newer EUV node such as 5 nm N5 or 4 nm N4P, a significant upgrade from the current 6 nm N6. 1usmus says that the biggest reason for AMD to update its cIOD is the memory controller architecture. AMD is expected to give "Medusa Point" a new dual memory controller architecture. There are still two DDR5 channels per socket, but this is redesigned for increased memory speeds, letting AMD catch up with Intel in this area. As for the CPU frequency boosting technologies, such as PBO and Curve Optimizer, there are no updates expected, and 1usmus concludes that it Hydra support should be straightforward.

European Processor Initiative (EPI) is nearing completion of its first goal. SiPearl, the leading developer behind the Rhea1 processor, has finally reached the tapeout stage after a string of delays, but it will not be ready for delivery until 2026 at the earliest. When the project launched in 2020, SiPearl planned to begin production in 2023; however, the 61 billion-transistor chip only entered tapeout this summer. The design, built on TSMC's N6 process, features 80 Arm Neoverse V1 cores alongside 64 GB of HBM2E memory and a DDR5 interface. While these specifications once looked cutting‑edge, the industry has already moved on, and Rhea1's raw performance may seem dated by the time samples are available. SiPearl initially explored a RISC‑V architecture back in 2019 but abandoned it after early feedback and comments highlighted the instruction set's immaturity for exascale computing.

Development was further interrupted by shifting core‑count debates, with teams alternately considering 72 cores, then 64, before finally settling on 80 cores by 2022. Those back‑and‑forth decisions, combined with evolving performance expectations, helped push the timeline back by years. Despite missing its original schedule, Rhea1 remains vital to European ambitions for high‑performance computing sovereignty and serves as the intended CPU for the Jupiter supercomputer. Thanks to Jupiter's modular design, the system was not left idle; its GPU booster module, running NVIDIA Grace Hopper accelerators, is already operational and approximately 80 percent complete. With the CPU clusters slated for mid-2026 deployment, full system readiness is expected by the end of 2026. To support this effort, SiPearl has recently secured €130 million in new financing from the French government, industry partners, and Taiwan's Cathay Venture. As Rhea1 finishes its goal, work on Rhea2 is already underway, and we can expect more updates about Rhea2 in a year or two.

Patriot Memory, a global leader in high-performance memory, storage, and gaming-grade hardware, officially announces the launch of three new DDR5 memory modules: the Signature Line Premium DDR5, the Signature Line Premium DDR5 CKD, and the Signature Line Core DDR5 SODIMM, further expanding its DDR5 product lineup to meet diverse upgrade needs across platforms and usage scenarios.

The newly introduced Signature Line Premium DDR5 continues the series' core commitment to reliability and durability, while embracing a refreshed aesthetic direction. Incorporating a clean black-and-white color scheme and minimalist design language, the module delivers sleek industrial appeal for desktop users seeking refined visual identity in their builds. Offering speeds up to 5600 MT/s and operating at a low 1.1 V, this module ensures reduced power consumption and heat generation. Each unit is 100% hand-tested and backed by a limited lifetime warranty, delivering a dependable and trustworthy upgrade solution.

SK hynix shared its technology roadmap, solution strategies, and AI cloud vision for leading the AI era at HPE Discover Las Vegas 2025 held from June 23-26. HPE Discover is a global technology conference hosted by Hewlett Packard Enterprise (HPE). This year's Las Vegas event highlighted the arrival of the AI era and its future possibilities. The conference featured a wide range of technical presentations, a networking program with demos and exhibitions, and hands-on training sessions such as the Tech Pro University and AI Developer Workshop.

SK hynix showcased its technological leadership through presentations and exhibitions highlighting its next-generation AI memory, server, and storage solutions essential for developing AI infrastructure. The exhibition was divided into four key sections: HBM, Server DIMM, eSSDs and CMM (CXL Memory Module)-DDR5. Each section of the booth, which featured eye-catching designs including product mascots, presented key products and solutions.

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial panel PC and embedded computing solutions, introduced the MBB1005, a robust ATX motherboard crafted for industrial edge computing, AI acceleration, and automation platforms. Powered by Intel Core Ultra 200S processors on the LGA1851 socket, this board delivers outstanding compute performance, modular expansion, and rugged reliability, enabling OEMs to scale up fast in industrial and embedded markets.

The MBB1005 offers four DDR5 U-DIMM slots, supporting up to 192 GB memory. Its integrated graphics controller supports one HDMI 2.0b and three DisplayPort 1.4a outputs, enabling multi-display configurations essential in industrial monitoring. Networking is handled by dual Intel 2.5GbE ports—the I226LM with iAMT 19.0 for remote maintenance and the I226V for standard communication. For storage and modular expansion, the board offers four SATA III ports and four M.2 slots: two M-Key (2280) for NVMe, one B-Key (3052) for cellular modules, and one E-Key (2230) for WiFi or Bluetooth.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce the retail availability of its new high performance 64 GB DDR5 modules, with overclock specifications of up to DDR5-6000 CL32 256 GB (64 GB x4) and DDR5-6400 CL36 128 GB (64 GB x2) memory kits. Designed for high-performance computing, content creation, AI applications, and professional workstations, these new kit specifications combine ultra-low latency with massive memory capacity based on 64 GB modules to deliver powerful multitasking and data-intensive performance on the latest platforms.

G.SKILL readies a range of high-density kits based on high-performance 64 GB DDR5 memory modules, with overclock specifications of up to DDR5-6000 CL32-44-44-96 with 256 GB (64 GB x4) total kit capacity. Offering a combination of speed, latency, and capacity, these newly released memory kits are ideal for professional creators and users that demand the utmost from their systems. Featuring the AMD EXPO overclocking profile, these specifications are optimized for compatible AMD Ryzen DDR5 desktop platforms and will join the G.SKILL Trident Z5 Neo RGB and Flare X5 series.

TrendForce's latest findings show that the three major DRAM suppliers are shifting capacity toward high-end products and have begun announcing end-of-life (EOL) plans for PC and server-grade DDR4 and mobile LPDDR4X. This has triggered aggressive restocking of legacy-generation products, further fueled by traditional peak-season demand. Consequently, average contact prices for conventional DRAM are projected to rise by 10% to 15% in 3Q25. Including HBM, overall DRAM prices are expected to increase by 15% to 20%.

TrendForce notes that DDR4 demand remains strong in 3Q25, and suppliers are aiming to raise prices more aggressively. As Taiwanese manufacturers currently lack the capacity and product specifications to fully meet market needs, DDR4 supply is expected to remain tight in the short term. Moreover, DDR4 output is being prioritized for server applications, leaving limited availability for consumer-grade user.

Intel's next-generation "Oak Stream" platform is preparing to accommodate the upcoming "Diamond Rapids" Xeon CPU generation, and we are receiving more interesting details about the top-end configurations Intel will offer. According to the HEPiX TechWatch working group, the Diamond Rapids Intel Xeon 7 will feature up to 192 P-cores in the top-end SKU, split across four 48-core tiles. Intel has dedicated two primary SKU separators, where some models use eight-channel DDR5 memory, and the top SKUs will arrive with 16-channel DDR5 memory. Using MRDIMM Gen 2 for memory will enable Intel to push transfer rates to 12,800 MT/s per DIMM, providing massive bandwidth across 16 channels and keeping the "Panther Cove" cores busy with sufficient data. Intel planned the SoC to reach up to 500 W in a single socket.

As one of the first mass-produced 18A node products, Diamond Rapids will be the first to support Intel's APX, also featuring numerous improvements to the efficiency of AMX. Intel also plans to embed native support for more floating-point number formats, such as NVIDIA's TF32, and lower-precision FP8. As most of the world's inference is good enough to run on a CPU, Intel aims to accelerate basic inference operations for smaller models, enabling power users to run advanced workloads on CPUs alone. With a 1S, 2S, and 4S LGA 9324 configuration, Diamond Rapids will offer 768 cores in a single server rack, with a power usage of only 2000 W. Supporting external accelerators will be provided via the PCIe Gen 6 connector. Scheduled for arrival in 2026, Intel could time the launch to coincide with its upcoming "Jaguar Shores" AI accelerators, making a perfect pair for a complete AI system.

Usually for newer technology rollout, prices are significantly higher compared to the last-gen. However, with DRAM, the story is the opposite. For the first time since the launch of DDR5, buyers are paying more for DDR4 memory modules than for the newer standard. A combination of tariff uncertainty and rapidly depleting DDR4 inventories is the main driver behind this. TrendForce data show that some high-demand DDR4 kits rose by as much as 40% in just one week, while DRAMeXchange reports that the average spot price for a 16 Gb (1Gx16) DDR4 module at 3,200 MT/s from Samsung and SK Hynix climbed to $12.50, with peak offers hitting $24. By contrast, dual-8 Gb DDR5 kits running between 4,800 MT/s and 5,600 MT/s remain near $6 on average, rarely exceeding $9. This unexpected surge follows Micron's announcement that it will wind down DDR4 production by year's end, accelerating the depletion of existing stocks over the next six to nine months.

Samsung also announced plans earlier this spring to retire its DDR4 lines and shift its focus to DDR5 and high-bandwidth memory, while China's CXMT confirmed it will scale back its DDR4 output despite recently reaching peak production levels. Taiwan's Nanya Technology is among the biggest beneficiaries of this topsy-turvy market. In the first quarter, the company held a DDR4 inventory valued at approximately NT$37.6 billion ($1.2 billion). Nanya even paused public price quoting to manage sales at these elevated levels. Many in the tech industry worry that renewed US-China trade tensions could spark another wave of panic buying. If additional tariffs target China's remaining DDR4 supply, module costs could climb to more than three times the price of DDR5, extending this rare pricing inversion well into the next quarter.

CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of the new CTL Chromebook PX121E. The PX121E is a K-12 student's everyday computing companion, with next-gen processing and a 12.2" display that delivers up to 30% more viewing area to empower tomorrow's immersive learning experiences.

"With the rich set of Google Workspace online tools, photo and video usage, and increasingly AI-infused applications, K-12 students need larger screen sizes for better viewing of today's online curriculum. And, larger screen sizes can reduce eye strain," explained Jeremy Burnett, VP of Technology for CTL. "The CTL Chromebook PX121E incorporates the latest Intel N-Series N150 Processor and is built to go the distance with automatic updates to 2035."

ASRock Industrial proudly presents its latest lineup of edge AI server boards - IMB-XA1901, IMB-X1902, and IMB-X1900 series designed to empower next-generation industrial, edge AI, and high-performance computing with robust power, reliable scalability, and AI-optimized architecture with Intel AMX. Supporting Intel Xeon 6 and Xeon W processors, these motherboards deliver exceptional performance with up to 86 cores, high-speed DDR5 memory, extensive PCIe Gen 5 expansions for up to four graphic cards, and IPMI remote management. Whether deployed in demanding AI workloads, smart manufacturing, or edge server environments, these motherboards provide the computing power and industrial reliability required to accelerate intelligent transformation.

IMB-XA1901 Series: flagship edge AI platform for ultimate performance
The IMB-XA1901, IMB-XA1901-10G stand as the highest-performance models in the lineup, supporting Intel Xeon 6700P/6500P/6700E Series processors optimized for performance and efficiency, delivering up to 1 TB of eight channel ECC DDR5 6400 MHz memory. For expansion, the boards offer two PCIe Gen 5 x16 slots, three PCIe Gen 5 x8 slots and dual MCIO interfaces with PCIe Gen 5 x8, supporting up to 4pcs of graphic cards for AI acceleration. They also include two 1GbE LAN ports, two 10GbE LAN ports (IMB-XA1901-10G), and a dedicated IPMI LAN port for remote management. Integrated with the ASPEED AST2600 BMC controller, the boards enable comprehensive remote monitoring and control over critical systems. Storage configuration includes two M.2 Key M slots for NVMe SSD, two U.2 ports, and two SATA 3 ports, providing a massive storage capacity. I/O connectivity includes two USB 3.2 Gen 1 ports, two USB 2.0 ports, two COM ports, and one VGA for display. Built on the ATX form factor (12 x 9.6 x 1.4 inches), the boards are well-suited for AI training/inference servers, edge data centers, and industrial automation systems that demand performance, expandability, and centralized control.

Intel appears set to retain its familiar 48 PCIe lanes while delivering a significant memory speed boost with the upcoming "Nova Lake‑S" desktop platform. Hardware leakers have shared fresh details indicating that Intel will allocate 24 PCIe 5.0 lanes directly from the CPU, with an additional four DMI Gen 5 lanes connecting to the chipset. The chipset itself will provide eight PCIe 5.0 lanes alongside sixteen PCIe 4.0 lanes, matching the total lane count of current-generation parts. For storage and peripherals, the new platform will support eight SATA 3.0 ports along with a wide assortment of USB options. Fourteen USB 2.0 ports will cover legacy devices, while five USB 3.2 ports at 20 Gbps, 10 at 10 Gbps, and 10 more at 5 Gbps. The CPU's PCIe lanes can be configured in multiple ways to suit different use cases: one 16-lane slot paired with two 4-lane connections, two 8-lane slots plus two additional 4-lane links, or a four-by-four configuration supplemented by two extra 4-lane connections.

Memory support is where Nova Lake‑S will shine. Whereas the current Arrow Lake-S lineup handles DDR5-6400 natively and may reach 9200 MT/s when overclocked, Nova Lake-S will offer 8000 MT/s out of the box in a one-DIMM per channel, single-rank configuration. This enhancement is expected to provide a performance boost for data-intensive tasks and games, where the rumored 52-core top-of-the-line SKU will need all the possible bandwidth to feed so many cores. A new LGA 1954 CPU socket and motherboard design will be required, although it remains unclear whether the improved memory speed stems from a redesigned on-die integrated memory controller or advanced motherboard trace layouts and power delivery systems. Partners have received preliminary specifications, but no engineering samples or motherboard prototypes have appeared in public benchmarks or regulatory filings as of yet.

Micron has informed its customers that its DDR4 memory products will reach the end of life in the coming quarters, with shipments expected to taper off over the next six to nine months. This announcement aligns Micron with the earlier plans of Samsung and SK Hynix to discontinue DDR4 production and focus on next-generation memory solutions, such as DDR5, LPDDR5, and high-bandwidth memory. In a recent interview, Micron's Executive Vice President and Chief Business Officer, Sumit Sadana, acknowledged that the phase‑out comes at a time when demand for DDR4 remains unexpectedly strong. He noted that shortages of both DDR4 and LPDDR4 modules have driven spot-market prices to levels that, in some cases, exceed those of newer DDR5 products.

To address this imbalance, Micron will prioritize supply for long‑term partners in the automotive, industrial, and networking sectors, where product reliability and contract stability are critical. The retirement of DDR4 has been partly driven by competitive pressure from Chinese memory manufacturers, which have flooded the market with lower‑cost modules. Yet, these newcomers may face challenges in matching the quality, long-term support, and volume capabilities that established players provide. Micron is urging its customer base to transition to DDR5 and LPDDR5 products, which have reached competitive price points and offer superior bandwidth and energy efficiency.

AMD at its 2025 Advancing AI event name-dropped its two next generations of EPYC server processors to succeed the current EPYC "Turin" powered by Zen 5 microarchitecture. 2026 will see AMD debut the Zen 6 microarchitecture, and its main workhorse for the server segment will be EPYC "Venice." This processor will likely see a generational increase in CPU core counts, increased IPC from the full-sized Zen 6 cores, support for newer ISA, and an updated I/O package. AMD is looking to pack "Venice" with up to 256 CPU cores per package.

AMD is looking to increase the CPU core count per CCD (CPU complex die) with "Zen 6." The company plans to build these CCDs on the 2 nm TSMC N2 process node. The sIOD (server I/O die) of "Venice" implements PCI-Express Gen 6 for a generational doubling in bandwidth to GPUs, SSDs, and NICs. AMD is also claiming memory bandwidth as high as 1.6 TB/s. There are a couple of ways they can go about achieving this, either by increasing the memory clock speeds, or giving the processor a 16-channel DDR5 memory interface, up from the current 12-channel DDR5. The company could also add support for multichannel DIMM standards, such as MR-DIMM and MCR-DIMMs. All said and done, AMD is claiming a 70% increase in multithreaded performance over the current EPYC "Turin," which we assume is comparing the highest performing part to its next-gen successor.

MSI, a global leader in high-performance server solutions, is showcasing its enterprise-grade, high-performance server platforms at ISC 2025, taking place June 10-12 at booth #E12. Built on standardized and modular architectures, MSI's AI servers are designed to power next-generation AI and accelerated computing workloads, enabling enterprises to rapidly advance their AI innovations.

"As AI workloads continue to grow and evolve toward inference-driven applications, we're seeing a significant shift in how enterprises approach AI deployment," said Danny Hsu, General Manager of Enterprise Platform Solutions at MSI. "With modular and standards-based architectures, enterprise data centers can now adopt AI technologies more quickly and cost-effectively than ever before. This marks a new era where AI is not only powerful but also increasingly accessible to businesses of all sizes.

GIGABYTE has a little surprise as it just listed a new B850 motherboard on its website, named B850M Force. This standard microATX form-factor AM5 motherboard marks the return of GIGABYTE's SOC Force series (i.e., GA-Z170X-SOC Force or GA-Z97X-SOC Force) that "eons ago" delighted Intel users with its striking orange aesthetics. Going from the cold, full white designs of its B850 Ice motherboards such as B850 Aorus Stealth Ice or B850M Eagle Ice series launched in January, this newly launched Force motherboard series packs a complete set of features tailored for a variety of users as well as retro enthusiasts from the Intel Z97 and Z170 times a decade ago.

The GIGABYTE B850 Force microATX motherboard is built around AMD's B850 chipset and supports the full range of AMD Ryzen processors for the AM5 socket, including the latest 9000 series CPUs. The board has an 8+2+2 phase digital VRM with heatsinks and supports up to 128 GB of DDR5 memory across two DIMM slots, with speeds up to overclocked 9600 MT/s (including AMD EXPO and XMP profiles). Storage connectivity consists of three M.2 slots supporting different PCIe configurations alongside four SATA 6 Gb/s connectors. Expansion capabilities include a PCIe x16 slot that supports PCIe 5.0 and an additional PCIe x4 slot from the chipset. Connectivity features include integrated Wi-Fi 6E with Bluetooth 5.3 (for the Wi-Fi 6E model), a 2.5 Gigabit Ethernet controller, and multiple USB ports including USB 3.2 Gen 2 and USB-C connections. Alongside its orange appearance, the motherboard has another surprise: a PS/2 port for those who are truly into the retro theme. Display outputs consist of HDMI 2.1 supporting 4K at 60 Hz and DisplayPort 1.4 capable of 4K at 144 Hz (depending on the iGPU capabilities of the installed processor).

ASRock Industrial proudly announces its next generation industrial motherboards powered by Intel Core 200S series processors (Bartlett Lake-S), supporting up to 24 cores and 32 threads. The new series delivers improved single-thread, multi-thread and AI-performance, along with DDR5 5600 MHz memory support up to 192 GB, advanced I/O capabilities, PCIe Gen 5/4 expandability, 4K quad-display powered by Intel UHD Graphics 770 with Xe architecture. With BIOS-level update support, the new series enables customers to seamlessly upgrade existing 14th, 13th, and 12th Gen Intel CPU-based motherboards to the latest generation. Available in Mini-ITX, microATX, and ATX form factors with longevity support, the motherboards are built for intelligent edge applications across smart manufacturing, autonomous robotics, machine vision, retail, kiosks, digital signage, gaming, and security environments.

Intel Core 200S Processor Motherboards with DDR5 Support
ASRock industrial's Intel Core 200S DDR5 supported motherboards are available in Mini-ITX, microATX, and ATX form factors, built on Intel W680, Q670, and H610 chipsets to meet a broad range of industrial computing demands.

TrendForce's latest investigations find that DDR4 contract prices for servers and PCs are expected to rise more sharply in the second quarter of 2025 due to two key factors: major DRAM suppliers scaling back DDR4 production and buyers accelerating procurement ahead of U.S. tariff changes. As a result, server DDR4 contract prices are forecast to rise by 18-23% QoQ, while PC DDR4 prices are projected to increase by 13-18%—both surpassing earlier estimates.

TrendForce notes that DDR4 has been in the market for over a decade, and demand is increasingly shifting toward DDR5. Given the significantly higher profit margins for HBM, DDR5, and LPDDR5(X), suppliers have laid out EOL plans for DDR4, with final shipments expected by early 2026. Current EOL notifications largely target server and PC clients, while consumer DRAM (mainly DDR4) remains in production due to continued mainstream demand.

Micron Technology, Inc. (Nasdaq: MU), announced today that it is shipping qualification samples of the world's first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory, designed to accelerate AI applications on flagship smartphones. Delivering the industry's fastest LPDDR5X speed grade of 10.7 gigabits per second (Gbps), combined with up to a 20% power savings, Micron LPDDR5X transforms smartphones with faster, smoother mobile experiences and longer battery life - even when executing data-intensive workloads such as AI-powered translation or image generation.

To meet the industry's increasing demand for compact solutions for next-generation smartphone designs, Micron's engineers have shrunk the LPDDR5X package size to offer the industry's thinnest package of 0.61 millimeters, making it 6% thinner compared to competitive offerings, and representing a 14% height reduction from the previous generation. The small form factor unlocks more possibilities for smartphone manufacturers to design ultrathin or foldable smartphones.

TrendForce's latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes. Samsung's redesign of its HBM3e products eased the HBM production squeezes. This prompted downstream players to clear inventories and extended the price declines seen since 4Q24.

Looking ahead to 2Q25, as PC OEMs and smartphone makers complete inventory corrections and ramp up system production ahead of the 90-day U.S. reciprocal tariff grace period, bit procurement momentum is expected to strengthen significantly. This will drive notable increases in supplier shipment volumes. On the pricing side, TrendForce forecasts a rebound across major application contract prices, with both conventional DRAM and combined DRAM (including HBM) contract prices expected to rise.

The memory market starts to show a slowdown after months of steady price hikes according to TrendForce's latest memory spot price trend report. DDR5 memory prices, which had been going up consistently, are now stabilizing as they've hit fairly high levels that sometimes go beyond contract prices. While DDR5 still sees small price increases compared to DDR4, buyers and traders are growing more wary and leaning towards DDR4 products. The common DDR4 chips (i.e., DDR4 1Gx8 3200 MT/s) saw a big 12.8% rise this week going from $2.18 to $2.46, but industry experts think these big price jumps will ease off in the third quarter.

NAND flash memory prices are cooling off after big jumps since late February. NAND flash chip costs have shot up, but customers are losing interest as more products flood the market. This change in supply and demand is showing up in the numbers - 512 GB TLC chips dipped by 0.18% this week to $2.73, as buyers take a "wait and see" approach. The big picture hints that the memory market might be settling down after months of steep price hikes. Nevertheless, major North American cloud providers' AI investments drive enterprise SSD demand surge, creating a supply shortage and supporting up to 10% quarterly price increases in Q3 2025.

Corsair, a leading global developer and manufacturer of high-performance gear and technology for gamers, content creators, and PC enthusiasts, is proud to launch the Corsair ONE i600 PC, the latest compact powerhouse PC in the award-winning Corsair ONE PC line. Building on the success of the Corsair ONE i500, the new i600 delivers even more power, efficiency, and thermal performance—perfect for creators, AI developers, and gamers who demand cutting-edge capability in a space-saving form factor.

The Corsair ONE i600 takes performance to a new level with the GeForce RTX 5080 graphics with 16 GB VRAM and Intel Core Ultra 9 processor—both kept cool by individual 240 mm liquid coolers that deliver quiet operation and brilliant performance. Equipped with 64 GB DDR5 memory and 4 TB NVMe SSD storage, the Corsair ONE i600 minimizes load times, streamlines AI workflows, and delivers seamless 4K gaming experience—encased in a sleek aluminium chassis that complements any modern setup.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is pleased to announce that CENS from Germany has once again claimed the title of OC Champion and the grand cash prize of $10,000 USD in the OC World Cup 2025 extreme overclock competition held live at Computex 2025. After an intense series of extreme overclocking challenges, CENS emerged victorious, demonstrating unmatched overclocking knowledge and technical skill with liquid nitrogen cooling, using the latest Intel Core Ultra 9 285K processor and ASUS ROG Maximus Z890 Apex motherboard. This is his second consecutive OC Champion title, after his victory last year at the OC World Cup 2024.

Exhilarating Competition with G.SKILL DDR5 24 GB Modules
This year at the live competition, the contestants are only allowed to use G.SKILL's high-performance 24 GB DDR5 module. It gave the contestants a new challenge to explore the 24 GB module's overclocking behavior and benchmarking potential. These 24 GB modules, built with SK hynix ICs, showcased exceptional headroom on Intel Z890 chipset platforms, allowing CENS to achieve up to DDR5-10266 CL32 2x24GB for benchmarking under LN2 cooling. At the same time, Seby, a rival overclocker contestant in the G.SKILL OC World Cup 2025, achieved DDR5-12666, which was the fastest memory frequency validation throughout the live competition.

The rising profile of ChangXin Memory Technologies (CXMT) has supposedly attracted international scrutiny as-of-late. Despite dealing in commercial memory product lines—currently DDR5, DDR4, LPDDR5 and LPDDR4X—the Chinese manufacturer could be stepping up its game in the near future. According to a fresh DigiTimes Asia news report, the nation's "top DRAM supplier" could be freeing up production capacity—in favor of enterprise-grade third-gen High-Bandwidth Memory (HBM3). Industry moles believe that a major sacrifice will be made; namely CXMT's DDR4 line. Despite an alleged early 2025 ramping up of related activities, the firm's factories could refocus on new endeavors by mid-2026. Additionally, insiders reckon that company leadership is shifting commercial priorities: "by year-end 2025, DDR5 is expected to make up more than 60% of CXMT's output, alongside LPDDR4/5."

The move into more advanced memory technologies is reportedly the result of government instruction. DigiTimes outlined a new strategy: "as CXMT scales up, it's also shifting rapidly to DDR5. The company only began mass-producing DDR4 in late 2024, yet it's already expected to issue an end-of-life (EOL) notice by the third quarter of 2025. The speed of this pivot and retooling has surprised many across the industry. Industry sources say the sudden shift is policy-driven, as Beijing pushes key chipmakers to accelerate alignment with national goals, especially around AI and cloud infrastructure." Murmurs of CXMT's forthcoming exit from DDR4 production have spread across local chip making businesses; causing a sudden doubling of Nanya-branded 8 Gb DDR4 chip prices in China. The manufacturer's early journey into DDR5 territories looked promising on paper—around January 2025—but the latest DigiTimes report disclosed inside track info regarding troubled quality and yield issues. In particular, initial samples have reportedly exhibited unstable performance when crossing a 60°C (140°F) threshold.

SK hynix presented its leading memory solutions optimized for AI servers and AI PCs at Dell Technologies World (DTW) 2025 in Las Vegas from May 19-22. Hosted by Dell Technologies, DTW is an annual conference which introduces future technology trends. In line with DTW 2025's theme of "Accelerate from Ideas to Innovation," a wide range of products and technologies aimed at driving AI innovation was showcased at the event.

Based on its close partnership with Dell, SK hynix has participated in the event every year to reinforce its leadership in AI. This year, the company organized its booth into six sections: HBM, CMM (CXL Memory Module)-DDR5, server DRAM, PC DRAM, eSSDs, and cSSDs. Featuring products with strong competitiveness across all areas of DRAM and NAND flash for the AI server, storage and PC markets, the booth garnered strong attention from visitors.