ASRock, a global leader in motherboards, graphics cards, gaming monitors, and small form factor PCs, is proud to announce the release of the X600TM-ITX, the world's first thin mini ITX motherboard supporting AMD AM5 series processors. This revolutionary motherboard brings exceptional performance and versatile features to users, enhancing their computing experience in various applications.

The X600TM-ITX stands out as the first thin mini ITX motherboard compatible with AMD AM5 series processors in the world. This compatibility ensures unprecedented performance, allowing users to experience faster computing speeds, better multitasking capabilities, and improved overall efficiency. Ideal for those who demand power in a compact form factor, the X600TM-ITX sets a new standard in motherboard technology.

IBASE Technology Inc., a leading innovator of embedded computing solutions, announces the launch of the MI1002 Mini-ITX motherboard powered by the latest Intel Core Ultra processors Series 1 (Meteor Lake-PS platform) with an LGA1851 socket. The new platform provides advanced AI capabilities, enhanced graphics, and remarkable energy efficiency, enabling the MI1002 to handle complex tasks effortlessly, whether deploying AI applications, managing edge computing, or driving IoT solutions.

The MI1002 is available in two variants, MI1002AF and MI1002AF-1, both equipped with two DDR5 memory sockets, multiple M.2 slots for ultra-fast storage and 5G connectivity, and dual 2.5G LAN ports for high-speed networking. The MI1002AF includes support for Intel iAMT 18.0 and dTPM 2.0, which are essential for enhanced security and remote management capabilities. The MI1002AF-1, on the other hand, is equipped with fTPM 2.0, providing a more cost-effective solution for applications where Intel iAMT is not required.

We are excited to announce the launch of the MS-CF10 Mini-ITX motherboard, designed to deliver exceptional performance and versatility for a wide range of applications. Powered by the latest 14th/13th/12th Gen Intel Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S series processors, including Core i9/i7/i5/i3, Pentium, and Celeron processors, the MS-CF10 is engineered to meet the demands of high-performance computing solutions.

Key Features:

• Advanced Processor Support: The MS-CF10 supports Intel 14th/13th/12th Gen Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S series processors with R680E/Q670E/H610E chipsets, ensuring top-tier performance and efficiency.
• High-Speed Memory: Equipped with 2x DDR5 5200 MT/s ECC/non-ECC SODIMM slots, the motherboard supports up to 64 GB of memory, providing robust data handling capabilities.
• Multiple Display Outputs: Featuring quadruple independent displays with 2x DP, HDMI 2.0, and LVDS/eDP, the MS-CF10 is ideal for applications requiring multiple high-resolution screens.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and advanced memory, has launched a new line of DDR5 Registered DIMMs (RDIMMs) with conformal coating which are specifically designed for use in liquid immersion servers. This innovative product line combines the superior performance of DDR5 technology with enhanced protection, ensuring reliability and longevity in the most demanding data center environments.

Arthur Sainio, DRAM product director for SMART explains the significance of this introduction, "Our new DDR5 RDIMMs with conformal coating represent the perfect fusion of cutting-edge performance and rugged reliability for the next generation of immersion-cooled data centers. By combining the speed and efficiency of DDR5 technology with advanced protective coatings, we're enabling our customers to push the boundaries of computing power while ensuring long-term durability in demanding liquid immersion environments. This product embodies our commitment to innovation and our drive to meet the evolving needs of high-performance computing applications."

Vecow has launched its TGS-1000 series of mini PCs, featuring stackable expansion options for networking, wireless mobility, and additional capabilities. The Vecow TGS-1000 Series is an ultra-compact, fanless, stackable embedded computer lineup that includes the TGS-1000 and TGS-1500 models, powered by Intel Core Ultra Meteor Lake processors with integrated CPU, GPU, and NPU. This series supports up to 96 GB of DDR5 memory. Optimized for edge AI applications, it delivers up to a 14% boost in CPU performance and enhanced graphics capabilities.

The TGS-1000 Series can drive up to five independent displays through two HDMI and three DisplayPort (DP) ports. It features a variety of I/O connections, including up to five USB 3.0 ports (four Type-A and one Type-C) and a 2.5GbE LAN port with TSN support. Its modular design allows for flexible expansion with options for USB, isolated DIO, COM, LAN, or 4G/LTE, making it suitable for AI, smart retail, office communication, and gaming. The TGS-1500 model adds support for MXM graphics cards up to RTX 5000 Ada.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, proudly presents all-new CRAS V RGB ROG-certified DDR5 Gaming Memory. Engineered by the masterful collaboration of KLEVV and ROG (Republic of Gamers)'s expert team, the CRAS V RGB ROG-certified DDR5 memory is purpose-built to unleash mind-bending performance with supreme stability. Available in 16 GB x2 and 24 GB x2 kits with a base clock speed of DDR5-7200, it is tailored for hardcore gamers and PC enthusiasts who demand the best.

Furthermore, when paired with a compatible ROG motherboard, the CRAS V RGB ROG-certified DDR5 can achieve blazing clock speeds of DDR5-7400, enabled by ROG's superior hardware synergy and software tuning, making them the ideal choice for high-end AAA games and power-hungry software. Inspired by KLEVV's award-winning CRAS V RGB series, which won the Red Dot and iF Design Awards in 2024, this special edition memory stands out with its unique and striking duotone color design. Rocking a sleek black-and-white aesthetic, complemented by an eye-catching advanced RGB light array, the CRAS V RGB ROG-certified DDR5 memory perfectly matches an all-ROG system that exudes undeniable power at a glance.

SK hynix has returned to Santa Clara, California to present its full array of groundbreaking AI memory technologies at FMS: the Future of Memory and Storage (FMS) 2024 from August 6-8. Previously known as Flash Memory Summit, the conference changed its name to reflect its broader focus on all types of memory and storage products amid growing interest in AI. Bringing together industry leaders, customers, and IT professionals, FMS 2024 covers the latest trends and innovations shaping the memory industry.

Participating in the event under the slogan "Memory, The Power of AI," SK hynix is showcasing its outstanding memory capabilities through a keynote presentation, multiple technology sessions, and product exhibits.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today released two GIGABYTE R-series servers (R183-ZK0 and R283-ZK0) with enhanced performance and reliability for cloud services and data-intensive applications. These highly scalable memory capacity servers support AMD EPYC 9004 processors and are ready for select 5th generation AMD EPYC processors with up to 192 CPU cores.

These new GIGABYTE servers are the first and only ones in the market that are one node with two CPUs that support 48 memory DIMMs. GIGABYTE's rich history in motherboard design and engineering with great signal integrity make this possible, a server with 12 TB memory using 256 GB DDR5 3DS RDIMMs. To accommodate a 12-memory channel platform with a 2DPC configuration and without compromising, a new memory layout was developed.

Thermaltake, a leading PC DIY brand for premium hardware solutions, kicked off the "2024 Thermaltake RAM MOD Invitational" an annual competition that gathers modders from all corners of the world to mod the designated Thermaltake ram into their own masterpiece. This year we invited six modders from Austria, Italy, Japan, Thailand, and the United Kingdom to modify the TOUGHRAM XG RGB D5 Memory DDR5.

Participating modders are given a specific time frame to modify the RAM heatsinks, without changing the overall appearance and layout of the RAM itself. Contestants must only use our TOUGHRAM XG RGB D5 modules and cannot add the ram to a motherboard or a PC build. However, they can create a stand or platform for the modules but the overall modules must remain intact with the original design as the main focus.

MSI, a global leader in AI and advanced computing solutions, proudly announces the launch of the MS-C906, a compact-size Box PC powered by the Intel 13th Gen Raptor Lake-P U Series Processor. Designed for ultra-low-power fanless operation, the MS-C906 is ideal for edge AI applications, offering unparalleled performance and reliability.

Key Features:

• High Performance: Supports up to 32 GB of DDR5 5200 MHz RAM and features quadruple independent HDMI displays, perfect for versatile visual output in various industrial and commercial environments.
• Robust Connectivity: Equipped with four Intel 2.5GbE LAN ports, ensuring robust network connectivity. M.2 and SATA interfaces provide ample storage options.

Qualcomm has started accepting preorders for its Snapdragon Dev Kit for Windows, based on the Snapdragon X Elite processor. Initially announced in May, the device is now available for preorder through Arrow at a competitive price point of $899. Despite its relatively high cost compared to typical mini PCs, it undercuts most recent laptops equipped with Snapdragon X processors, making it an attractive option for both developers and power users alike. Measuring a mere 199 x 175 x 35 mm, it comes equipped with 32 GB of LPDDR5x RAM, a 512 GB NVMe SSD, and support for the latest Wi-Fi 7 and Bluetooth 5 technologies. The connectivity options are equally robust, featuring three USB4 Type-C ports, two USB 3.2 Type-A ports, an HDMI output, and an Ethernet port.

This mini PC's heart lies the Snapdragon X Elite (X1E-00-1DE) processor. This chip houses 12 Oryon CPU cores capable of reaching speeds up to 3.8 GHz, with a dual-core boost potential of 4.3 GHz. The processor also integrates Adreno graphics, delivering up to 4.6 TFLOPS of performance, and a Hexagon NPU capable of up to 45 TOPS for AI tasks. While similar to its laptop counterpart, the X1E-84-100, this version is optimized for desktop use. It can consume up to 80 watts of power, enabling superior sustained performance without the constraints of battery life or heat dissipation typically associated with mobile devices. This dev kit is made primarily to optimize x86-64 software to run on the Arm platform; hence, removing the power limit is beneficial for translating the code to Windows on Arm. The Snapdragon Dev Kit for Windows ships with a 180 W power adapter and comes pre-installed with Windows 11, making it ready for immediate use upon arrival.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2024. The Company posted KRW 74.07 trillion in consolidated revenue and operating profit of KRW 10.44 trillion as favorable memory market conditions drove higher average sales price (ASP), while robust sales of OLED panels also contributed to the results.

Memory Market Continues To Recover; Solid Second Half Outlook Centered on Server Demand
The DS Division posted KRW 28.56 trillion in consolidated revenue and KRW 6.45 trillion in operating profit for the second quarter. Driven by strong demand for HBM as well as conventional DRAM and server SSDs, the memory market as a whole continued its recovery. This increased demand is a result of the continued AI investments by cloud service providers and growing demand for AI from businesses for their on-premise servers.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today launched the Marvell Structera product line of Compute Express Link (CXL) devices that enable cloud data center operators to overcome memory performance and scaling challenges in general-purpose servers.

To address memory-intensive applications, data center operators add extra servers to get higher memory bandwidth and higher memory capacity. The compute capabilities from the added processors are typically not utilized for these applications, making the servers inefficient from cost and power perspectives. The CXL industry standard addresses this challenge by enabling new architectures that can efficiently add memory to general-purpose servers.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its DDR5 Client Clock Driver (CKD) for next-generation, high-performance desktops and notebooks. The Rambus DDR5 CKD and SPD Hub are part of a new client memory interface chip product offering that brings server technology advancements to the client market. Leveraging over 30 years of memory system expertise, the Rambus DDR5 CKD enables new client DIMMs (CSODIMMs and CUDIMMs) to operate at state-of-the-art data rates of up to 7200 Megatransfers per second (MT/s), and deliver breakthrough performance in next-generation PCs.

"As advanced technologies first developed for the data center proliferate to the client space, increasingly powerful PCs will take gaming, content creation and AI to new levels," said Rami Sethi, SVP and general manager of Memory Interface Chips at Rambus. "This new DDR5 Client Clock Driver is the latest addition to our growing line up of chip solutions that enable breakthrough memory performance across the computing landscape, and bring more value to our customers."

ASRock has silently unveiled the X600TM-ITX, currently the "world's only" AM5 Thin Mini-ITX motherboard designed for AMD Ryzen 9000 "Zen 5" processors along with 8000 and 7000 series CPUs with a max TDP of 65 W. Its "Thin" Mini-ITX form factor (17.0 cm x 17.0 cm) stands out with a compact 25 mm I/O shield height compared to the standard 44 mm.

Unlike traditional Mini-ITX boards, the X600TM-ITX utilizes SODIMM memory (max. 96 GB of Dual DDR5 6400+) and supports onboard power supply via one DC Jack on the rear panel I/O, eliminating the need for a separate ATX PSU. This makes it an ideal choice for DIY mini PC enthusiasts. However, the board lacks PCIe slots for discrete GPUs, limiting its gaming potential. Nevertheless, the integrated graphics in AM5 processors should handle most games at lower settings, especially with higher-end CPUs.

IBASE Technology Inc., a leading manufacturer of industrial computers and embedded systems, unveils the IB962 3.5-inch single board computer (SBC) built on the advanced Intel Core Ultra 7/5 100 Series processors (formerly Meteor Lake U/H). Featuring 3D performance hybrid architecture, advanced AI capabilities, and available with built-in Intel Arc GPU, the processor delivers an optimal balance of performance and power efficiency and helps unlock the power of AI to create immersive graphics experiences.

The IB962 is available in a variety of models, with high-end models powered by the Intel Core Ultra 7-165H and Ultra 7-165U processors to meet different processing needs while maintaining a compact footprint of just 102 mm x 147 mm (4" x 5.8"). The IB962 series comprises two DDR5 SO-DIMM slots, supporting up to 64 GB of RAM to handle intensive multitasking and high-speed data processing with ease. A standout feature is its extensive display capability, supporting HDMI, DP++, LVDS, and eDP interfaces, allowing flexibility to connect multiple high-resolution displays simultaneously, whether for industrial automation, manufacturing, retail, entertainment, healthcare, or other edge AI applications.

AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

Chinese memory manufacturer YMTC has filed a lawsuit against U.S.-based Micron in California, alleging infringement of 11 patents related to 3D NAND Flash and DRAM products. YMTC seeks to halt Micron's sales of the allegedly infringing products in the U.S. and demands royalty payments. Founded in Wuhan, China, in 2016, YMTC is a key player in China's efforts to develop a domestic chip industry. However, in October 2022, the U.S. government placed YMTC on its Entity List, restricting its access to advanced U.S. manufacturing equipment for 3D NAND chips with 128 layers or more.

Before these restrictions, YMTC had obtained certification from Apple for its 128-layer 3D NAND chips, with the US tech giant considering using YMTC chips to reduce costs and diversify its supply chain beyond Samsung, SK Hynix and Micron. The lawsuit specifically targets Micron's 3D NAND Flash products with 96, 128, 176, and 232 layers, as well as certain DDR5 SDRAM products. This legal action follows a similar suit filed by YMTC against Micron in November, alleging infringement of eight U.S. patents related to 3D NAND Flash. With government backing, Chinese firms are increasingly engaging in patent litigation both domestically and internationally. Last year alone, Chinese courts handled over 5,000 technical intellectual property and monopoly cases.

TrendForce's latest report on the memory industry reveals that DRAM and NAND Flash revenues are expected to see significant increases of 75% and 77%, respectively, in 2024, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM.

Furthermore, industry revenues are projected to continue growing in 2025, with DRAM expected to increase by 51% and NAND Flash by 29%, reaching record highs. This growth is anticipated to revive capital expenditures and boost demand for upstream raw materials, although it will also increase cost pressure for memory buyers.

AMD's upcoming "Strix Halo" mobile processor that features up to 16 "Zen 5" CPU cores and a powerful iGPU with 40 compute units, is beginning to surface in online benchmark databases. We've gone into the juicy technical bits about the processor in our older articles, but put simply, it is a powerful mobile processor meant to square off against the likes of the Apple M3 Pro and M3 Max. A chiplet-based processor, much like the upcoming "Granite Ridge" desktop processor and "Fire Range" mobile processor, "Strix Halo" features up to 16 full-sized "Zen 5" cores, as it uses up to two of the same "Eldora" CCDs as them; but wired to a large I/O die that contains the oversized iGPU, and an NPU, besides the memory controllers. The iGPU has 40 compute units (2,560 stream processors), and is based on the RDNA 3.5 graphics architecture, while the NPU is the same 50 TOPS-class unit carried over from "Strix Point."

A prototype HP laptop powered by a "Strix Halo" processor that uses a single 8-core "Zen 5" CCD, was spied on the web. This chip has eight full-sized "Zen 5" cores that share a 32 MB L3 cache. The iGPU on the I/O die has its own 32 MB Infinity Cache memory that cushions memory transfers. In our older reports, we speculated as to what the memory interface of "Strix Halo" would be. It turns out that the chip exclusively features a 256-bit wide LPDDR5X memory interface, which is double the bus width of "Strix Point." This is essentially what a "quad-channel DDR5" memory interface would be, and AMD is using a memory speed standard of at least LPDDR5X-8000. From the machine's point of view, this would be just a couple of hardwired LPDDR5X chips, or a pair of LPCAMM 2 modules. Back to the benchmarks, and we are shown a single-thread CPU score of 2099 to 2177 points, and a multithreaded score ranging between 5477 points to 13993 points. The laptop was tested with an unknown version and distribution of Linux. The CPU cores are shown boosting up to 5.35 GHz.

GIGAIPC, an embedded solution-focused subsidiary of GIGABYTE, is excited to announce the launch of its new series of all-in-one industrial panel PCs, specifically designed to meet the unique needs of the retail industry. These cutting-edge PCs are available in three sizes—21.5", 15.6", and 11.6"—making them perfect for kiosks, POS systems, and a variety of other retail applications.

The models, named TA-215AN97A-A1, TA-156AN97A-A1, and TA-116AN97A-A1, are powered by high-performance Intel Alder Lake N97 processors. These processors provide significant improvements in speed and efficiency, allowing for seamless multitasking and enhanced processing power, which is essential for demanding retail applications. This ensures that businesses can operate smoothly, even during peak hours.

Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.

Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Trident Z5 Royal Neo series DDR5 memory, designed for AMD AM5 platforms. Trident Z5 Royal Neo memory comes with AMD EXPO (Extended Profiles for Overclocking) technology, and will be available up to DDR5-8000 CL38-48-48-127 extreme speed memory specification in 32 GB (2x16GB) and 48 GB (2x24GB) kit capacities. With a mirrored finish in gold or silver, this new memory series is the ideal DDR5 memory solution for enthusiasts and overclockers to build a stylish, high-performance AMD PC system.

Luxury-Class DDR5 with AMD EXPO
Following the luxury-class Trident Z5 Royal design with CNC-cut aluminum heatspreader in mirrored-finish gold or silver colors and a crystalline light bar for magnificent RGB lighting, the Trident Z5 Royal Neo is designed for AMD AM5 platforms with AMD EXPO profile. Customizable RGB lighting is supported through the G.SKILL Trident Z Lighting Control software or third-party motherboard lighting software.