ASRock has a pretty comprehensive lineup of upcoming Socket LGA1851 motherboards based on the top Intel Z890 chipset, which the company will launch alongside the new Intel Core Ultra 2-series "Arrow Lake-S" desktop processors later this month. The company's Z890 lineup has been leaked to the web by VideoCardz. The lineup covers nearly every brand extension by ASRock, addressing a wide category of PC users, from the entry level that just wants an office desktop to harness the CPU power of the new processors, to the two distinct classes of the enthusiast segment—one which overclocks, and the other that needs every possible premium I/O from this platform, with the bulk of the lineup targeting gaming PC builders across price-segments.

At the very top are ASRock Z890 Taichi OCF and the ASRock Z890 Taichi. The Taichi OCF is the spiritual successor to the OC Formula series by ASRock targeting professional overclockers. It has the strongest possible CPU VRM solution from the company, the largest selection of overclocker-friendly features, and a 1 DIMM per channel (1DPC) memory configuration, for the highest possible memory overclocks. The Taichi OCF has most if not all of the I/O goodies ASRock has to offer. For this, you'll have to seek out the regular ASRock Z890 Taichi, with its four DDR5 memory slots, nearly the same overclocking feature-set as the Taichi OCF, but some added toys, such as Thunderbolt 4. The Z890 Taichi Lite is an interesting product—it has nearly all features that place it into the high-end segment, such as that 8-layer PCB, a strong CPU VRM, and premium onboard audio, among others; but skips on the bulk of the dramatic flair of the Z890 Taichi.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

AMD continually sets the industry standard with its EPYC Embedded processors, offering exceptional performance, efficiency, connectivity, and innovation for networking, storage, and industrial applications. Today we are extending that leadership with the fourth-generation, AMD EPYC Embedded 8004 Series processors.

The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded systems, delivering exceptional performance for high-demand workloads while maximizing power efficiency in a compact form factor for space- and power-constrained applications. It also integrates a comprehensive suite of embedded features to further enhance system performance and reliability. Engineered to excel in the most demanding embedded environments, the AMD EPYC Embedded 8004 Series is perfectly suited for networking systems, routers, security appliances, enterprise and cloud warm/cold storage, and industrial edge applications, ensuring seamless handling of dynamic workloads.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase an incredibly high-speed overclock of G.SKILL DDR5 memory at DDR5-9000 CL44-56-56 with 48 GB (24 GB x2) kit capacity, featuring AMD EXPO overclock profile and demonstrating the memory overclock capability of the ASUS ROG CROSSHAIR X870E HERO motherboard and the AMD Ryzen 7 8700G processor.

A New High-Speed Frontier with 24 GB x2 Continuing to explore the overclock limits of DDR5 memory speed in conjunction with the new ASUS NitroPath DRAM technology that provides enhanced DDR5 memory overclock performance, G.SKILL demonstrates an amazing DDR5-9000 CL44-56-56 with two 24 GB capacity modules. Refer to the screenshot below to see this G.SKILL memory kit reaching the astounding overclocked memory speed on the ASUS ROG CROSSHAIR X870E HERO motherboard with an AMD Ryzen 7 8700G processor

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.

T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.

V-COLOR Technology Inc. is pleased to announce an expanded partnership with ASRock Industrial, with a focus on full compatibility between V-COLOR's high-performance memory solutions and ASRock Industrial's latest line of motherboards and mini-PCs. This collaboration reaffirms both companies' commitment to providing optimal memory performance for industrial applications, including models such as the SBC-374, IMB-X1900 (R-DIMM), 4X4 BOX-8840U (SO-DIMM), and IMB-A1002 (U-DIMM), that support memory capacities of up to 96 GB.

V-COLOR's memory lineup is now fully integrated with ASRock Industrial's newest motherboards, ensuring superior performance, reliability, and scalability. With compatibility across DDR5 SO-DIMM, U-DIMM, and R-DIMM configurations, the supported devices—including SBC-374, IMB-X1900, 4X4 BOX-8840U, and IMB-A1002—are equipped to handle industrial workloads. These Intel-powered and AMD Ryzen -driven systems offer exceptional versatility for high-performance industrial computing.

Today at HP Imagine, HP Inc. (NYSE: HPQ) announced the company's newest innovations, including next-gen AI PCs, AI-enabled video conferencing solutions, and a scalable GPU performance sharing solution for AI developers - all designed to transform the future of work.

"HP is deeply ambitious in its commitment to reshape the way people work, fostering growth, nurturing creativity, and unleashing limitless innovation," said Alex Cho, President of Personal Systems at HP Inc. "We're bringing AI to life and delivering powerful new experiences through our next-gen AI PCs, advanced audio and video solutions, and innovative AI development platform."

ASUS today announced its all-new line-up of Intel Xeon 6 processor-powered servers, ready to satisfy the escalating demand for high-performance computing (HPC) solutions. The new servers include the multi-node ASUS RS920Q-E12, which supports Intel Xeon 6900 series processors for HPC applications; and the ASUS RS720Q-E12, RS720-E12 and RS700-E12 server models, embedded with Intel Xeon 6700 series with E-cores, will also support Intel Xeon 6700/6500 series with P-cores in Q1, 2025, to provide seamless integration and optimization for modern data centers and diverse IT environments.

These powerful new servers, built on the solid foundation of trusted and resilient ASUS server design, offer improved scalability, enabling clients to build customized data centers and scale up their infrastructure to achieve their highest computing potential - ready to deliver HPC success across diverse industries and use cases.

Nintendo's next-generation Switch 2 handheld gaming console is nearing its release. As leaks intensify about its future specifications, we get information about its planning stages. According to Moore's Law is Dead YouTube video, we learn that Nintendo didn't choose AMD APU to be the powerhouse behind Switch 2 due to poor battery life. In a bid to secure the best chip at a mere five watts of power, the Japanese company had two choices: NVIDIA Tegra or AMD APU. With some preliminary testing and evaluation, AMD APU wasn't reportedly power-efficient at 5 Watt TDP, while the NVIDIA Tegra chip was maintaining sufficient battery life and performance at target specifications.

Allegedly the AMD APU was good for 15 W design, but Nintendo didn't want to place a bigger battery so that the device remains lighter and cheaper. The final design will likely carry a battery with a 20 Wh capacity, which will be the main power source behind the NVIDIA Tegra T239 SoC. As a reminder, the Tegra T239 SoC features eight-core Arm A78C cluster with modified NVIDIA Ampere cores in combination with DLSS, featuring some of the latest encoding/decoding elements from Ada Lovelace, like AV1. There are likely 1536 CUDA cores paired with 128-bit LPDDR5 memory running at 102 GB/s bandwidth. For final specifications, we have to wait for the official launch, but with rumors starting to intensify, we can expect to see it relatively soon.

Detailed specifications and a somewhat blurry slide showing off all the details of MSI's upcoming high-end MEG Z890 Unify-X motherboard have leaked courtesy of @ChamberTech_ on X/Twitter. The motherboard is likely to appeal to those looking to squeeze every extra bit of performance out of their new Ultra 200K series CPU when they launch next month. You get support for memory speeds of up to 10,000 MT/s and with only two DIMM slots, it might be able to go even higher with the latest DDR5 CUDIMMs. The board also sports a 110 Ampere 20+1+1+1 VRM design on an eight layer PCB, and it also ships with what MSI calls an OC Tuning Controller, suggesting the board is targeting overclockers.

MSI has included a pair of PCIe 5.0 x16 slots for GPUs that presumably operate in dual x8 mode when both slots are in use, and a third PCIe 4.0 x16 slot that operates in x4 mode, as well as a single PCIe 4.0 x1 slot. There's also no less than six M.2 slots, of which two are PCIe 5.0 and one PCIe 4.0, as well as six SATA ports. Where things get a bit interesting is in the network connectivity, as the slide claims that the board features a 5 Gbps Intel Killer Ethernet interface, which is the first we've heard of such a thing, as well as an Intel Killer Wi-Fi 7 and Bluetooth 5.4 module for wireless connectivity.

Back in July, we polled our readers to find out what PC main memory type they are using, with the choices consisting of DDR5, DDR4, and DDR3. Nearly two months into the poll and close to 36,000 responses later, an interesting picture is emerging. DDR4 memory emerged a clear winner, with a simple majority of our readers—58.2% of them—responding that they're using it. The latest DDR5 memory type is a distant second, with close to one-third of the respondents or 32.5% picking it. The old DDR3 memory type attracted an impressive 9.3% of the vote.

There could be many reasons why DDR4 remains the king—the AMD AM4 platform remains current, as AMD continues to release processors for this platform. Intel's LGA1700 platform supports DDR4, and there's a fairly wide selection of DDR4 motherboards for this platform, letting enthusiasts save on memory costs by carrying over their old memory or opting for cheaper memory. DDR5 at 32% isn't too discouraging, considering that the standard has been around just 3 years now, compared to the 9 years of DDR4.

In today's fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines cutting-edge innovation with unparalleled processing power and AI acceleration to drive the future of high-performance systems. Designed to elevate industry standards and redefine performance in demanding environments, the IMB-X1900 exemplifies ASRock Industrial's commitment to excellence. With powerful processing capabilities, expansive memory support, and advanced connectivity options, this motherboard is built on the robust Intel Xeon W-3500/3400 and W-2500/2400 Series Processors, ensuring it effortlessly manages even the most complex parallelized tasks, delivering exceptional efficiency and speed.

Key Features of the IMB-X1900 Motherboard:

• Unrivaled Processing Power: Featuring Intel Xeon W-3500/3400 and W-2500/2400 Series Processors with W790 chipset, the IMB-X1900 supports up to 60 cores, making it a powerhouse for computationally intensive workloads. This capability is crucial for industries such as 3D rendering, product simulation, and large-scale AI models training and inference.
• Expansive Memory Capacity: With support for up to 2 TB of DDR5 RDIMM ECC memory across 8 slots, the IMB-X1900 ensures seamless management of extensive datasets and complex simulations. This inclusion of ECC memory further enhances system reliability and data integrity, essential for industries like financial analysis, scientific research, and mission-critical applications.

BIWIN unveils the DW100 RGB DDR5 OC CUDIMM, innovative CUDIMM technology that delivers the fastest speed of 9200 MT/s with an ultra-low CAS latency of CL42. Biwin DW100 RGB DDR5 OC CUDIMM brings high-end features including peak speeds, advanced thermal management, and customizable RGB lighting for a superior memory upgrade that gamers dream of.

Designed for high-speed computing, this module leverages the expertise of the Biwin OC Lab to deliver top-tier overclocking performance. At the core of the lab's innovation is the advanced manufacturing process that meticulously selects the finest semiconductor materials to meet extreme performance standards.

AAEON, a global leader in embedded computing, has introduced the GENESYSM-ADN6, a slimline SubCompact System powered by Intel Core Processor N-series CPUs. Measuring just 178 mm x 134.1 mm x 43 mm, the GENESYSM-ADN6 is a compact option built to satisfy demand for mini PCs suitable for smart retail, industrial automation, and edge gateway applications. The PC's connectivity and scalability clearly align it with the latter of these vertical markets, with a standout feature being its three LAN ports, configured for Intel Ethernet Controller I226 running at 2.5GbE speed. Alongside this is extensive expansion options for Wi-Fi, 5G, and additional storage through the system's M.2 2230 E-Key, M.2 3052 B-Key, and mSATA slots respectively.

In addition to its compact size, the GENESYSM-ADN6 is well-suited to deployment in industrial settings, with a wide power input range of 9 V to 36 V and fanless operation. Moreover, the system boasts two COM ports for RS-232/422/485, with the option of two additional ports for RS-232. Elsewhere, two USB 3.2 Gen 2 ports, an 8-bit GPIO, and SMBus/I2C are available for integrating sensors, actuators, and other peripheral devices, making it an excellent option when it comes to PLCs, robotic arms, and SCADA systems. The system's interfaces are bolstered by high-bandwidth, SODIMM-based DDR5 system memory for expedited data processing and optional TPM 2.0 for added data security.

Asgard joined the ranks of V-Color to unveil its first high-frequency DDR5 memory, the Thor DDR5-9600. V-Color recently launched its DDR5-9200 memory, and Asgard one-upped it with DDR5-9600. Both these are CUDIMMs—UDIMMs that feature a client clock driver (CKD) component. These modules feature the highest bins of DDR5-9600 chips from SK Hynix. The advertised speed of DDR5-9600 is achieved using timings of 44-56-56-136, and a scorching DRAM voltage of 1.50 V. The module includes an XMP 3.0 profile to enable these settings on an Intel platform. With a single-rank configuration and 24 GB module density, the dual-channel kit gives you 48 GB. Asgard revealed that it is working on a DDR5-10000 kit. The company didn't announce US availability.

Intel's upcoming Core Ultra 200 "Arrow Lake-S" desktop processors will herald a new wave of overclocking memory kits as the architecture is expected to support even higher memory speeds than the current 14th Gen Core. The product page of an ASRock Z890 motherboard lists out maximum memory speeds for various DIMM configurations. The most overclocker-friendly config—1 single-rank DIMM per channel—sees ASRock mention support for DDR5-9200+ (OC). The fastest DDR5 OC memory kits in the market are DDR5-8600, and over the Summer, JEDEC announced standardization of high frequency DDR5 configurations, including the likes of DDR5-8800. Such high frequencies require the DIMM to feature a clock driver.

Those looking for high capacity memory configurations have big reason to cheer. For two single-rank DIMMs per channel, or one dual-rank DIMM per channel, the motherboard's product page mentions an OC speed of DDR5-6800+. This should be a boon for those wanting large memory capacities such as 96 GB or 128 GB using dual-rank DIMMs at reasonably high speeds. Even the densest memory configuration, two dual-rank DIMMs per channel, has a maximum OC speed of DDR5-5800+. This should allow users to approach the platform's maximum memory capacity, such as 256 GB using four 64 GB dual-rank DIMMs, or 192 GB using four 48 GB DIMMs, but at much higher speeds that what the current platforms are capable of.

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:

• Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
• High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
• Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
• Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.

The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

Acer today expanded its Copilot+ PC lineup with the new Swift Go 14 AI and Swift 14 AI laptops, delivering versatile performance and elevated productivity with incredible battery life.

The Swift Go 14 AI features the latest Snapdragon X Plus 8-core processor in an ultra-portable design. Acer also announced the Swift 14 AI featuring the new AMD Ryzen AI 300 Series processors which leverage the advanced AMD XDNA 2 architecture to utilize greater AI processing power and performance without compromise. Whether creating, working, or streaming on-the-go, these Copilot+ PCs streamline daily tasks and workloads more efficiently and enable Acer's on-device AI applications to help elevate users' digital experiences.

COLORFIRE has introduced the new Aries series memory modules. The new Aries memory will be sold in kits, with the main specifications being DDR4 3600 8 GB x2 and 16 GB x2, all with a timing of CL16. It also includes DDR5 variants, offering DDR5-6000 16 GB x2 and 6400 16 GB x2 at different frequencies. The Aries memory, positioned above the previously released Scorpio series, features optimized timing and the addition of DDR5 standards. By incorporating zodiac elements into the memory design, COLORFIRE is continuing to experiment with its product offerings.

COLORFIRE, a brand by Chinese hardware maker COLORFUL, is tailored to cater to younger users and a range of different styles. The products align with diverse elements like cute, anime, and trendy lifestyle themes. COLORFIRE has successfully captivated users with its "Cyber Rua Cat" theme, launching the highly popular MEOW series, which includes VGA, motherboards, memory, SSDs, and a full range of peripherals such as speakers and headphones.

V-COLOR is set to revolutionize the future of memory technology with the launch of the world's first RGB DDR5 O CUDIMM (High Speed Overclocked CUDIMM). This groundbreaking innovation for the next-generation desktop platform, offering unmatched speeds and efficiency for desktop applications. This memory module has a new heatsink patent (Patent No. 113208127) to increase heat dissipation efficiency to a new level, and the introduction of the exclusive light guide rod patented coating technology (Patent No. M653290) allows the light guide rod to attract attention regardless of whether it has RGB effects or not.

The DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) technology dynamically adjusts clock frequency and voltage based on workload and system conditions. This cutting-edge capability results in faster data transmission, lower power consumption, and enhanced stability, making it a game-changer in the industry.

Embedded computing pioneer AAEON (stock code: 6579) has launched the PICO-ASL4 and GENE-ASL6, both featuring the new Intel Atom x7000RE Processor Series for the Edge (formerly Amston Lake). Both the 2.5" PICO-ITX and 3.5" subcompact Board go-to-market with models equipped with Intel Atom x7433RE and Intel Atom x7835RE, while the GENE-ASL6 will also have the adoption of the Intel Atom x7213RE Processor, with all three maxing out at 12 W.

Built on the standard 100 mm x 72 mm PICO-ITX form factor, the PICO-ASL4 offers extensive onboard options, including dual LAN and six USB ports, along with Intel Time Coordinated Computing and Time-Sensitive Networking (TSN). As a result, AAEON has identified this compact solution as an ideal choice for those seeking a discreet single-board computer capable of managing latency-sensitive workloads in fields such as smart transportation and manufacturing.