ZOTAC USA Inc., a leading manufacturer of innovative gaming hardware solutions, is thrilled to announce the market launch of three new MEK HERO pre-built Gaming PCs: the MEK HERO A7647S, A7647STI, and A7748S built using the latest ZOTAC GAMING GeForce RTX 4070 SUPER Twin Edge OC, ZOTAC GAMING GeForce RTX 4070 Ti SUPER Trinity OC White Edition, and ZOTAC GAMING GeForce RTX 4080 SUPER Trinity Black Edition Graphic Cards. These are teamed up with AMD Ryzen 5 7600 and Ryzen 7 7700X processors, offering stunning 4K graphics for unprecedented gaming performance with AI-accelerated DLSS 3.5 and Real-Time Ray Tracing, bringing gamers an immersive gaming experience. This new series of MEK HERO offers 3 years of warranty coverage, specifically for the included ZOTAC GAMING GeForce RTX 40 SUPER Series Graphics Card component.

The MEK HERO A7647S, A7647STI, and A7748S Gaming PCs feature 16 GB DDR5 system memory and NVMe M.2 SSD storage, elevating PC gaming and the visual content creation process to new heights. Each MEK HERO Gaming PC undergoes meticulous assembly and hand-testing in the United States, ensuring the highest build quality. Crafted for optimal performance, durability, and an unmatched experience, MEK HERO Gaming PCs with GeForce RTX 40 SUPER Series Graphics Cards are tailored to meet the demands of hardcore gamers and content creators alike.

AMD's newly announced Ryzen 8000G "Hawk Point" desktop APUs do not support ECC memory, contrary to what the specifications on the AMD website had initially shown, Reddit users found out. The company has since quietly edited its product pages to remove the bit about ECC support. For the overwhelming majority of desktop client use cases, including enthusiast PCs, ECC memory support is irrelevant. That said, the memory controllers of "Phoenix" in Ryzen PRO 7000 mobile processors for commercial notebooks support ECC memory, and so it stands to reason that upcoming Ryzen PRO models for both commercial desktops and notebooks might feature it.

The AMD Ryzen 7 8700G and Ryzen 5 8600G are based on the 4 nm "Hawk Point" monolithic silicon, with a more overclocker-friendly set of DDR5 memory controllers than the ones found in the Ryzen 7000 "Raphael" processors. Besides support for several high-frequency DDR5 modes, the memory controller technically supports ECC (at least "Phoenix" does, on the Ryzen PRO 7000 mobile processors). The memory controller also supports a maximum of 256 GB of memory, or 64 GB dual-rank memory modules per slot. It also supports 24 GB and 48 GB DIMM densities.

It turns out that the 60-core Xeon W9-3595X leak from last week is part of a 14-SKU mid-lifecycle refresh of the Xeon W LGA4677 series targeting the workstation and HEDT markets. The underlying microarchitecture and silicon at the heart of these is "Sapphire Rapids Refresh," it's essentially the same as "Sapphire Rapids," but with CPU core-count increases across the SKUs. If you recall, the "Sapphire Rapids" MCM has a maximum core-count of 60-core/120-thread which is maxed out in Xeon Scalable server processors, but only hit up to 56-core/112-thread with the original W3400 and W2400 series HEDT/workstation chips. This unused 4-core headroom, combined with increases in clock speeds, is how Intel plans to create these 14 SKUs across the new W3500 and W2500 product lines.

As with the original W3400 and W2400 series; what set the W3500 series chips apart from the W2500 series, is the I/O. The W3500 series gets 8-channel DDR5 memory and 128 PCIe Gen 5 lanes, while the W2500 series chips get 4-channel DDR5 memory and 64 PCIe Gen 5 lanes. As we mentioned, this refresh is all about increasing the CPU core counts at existing price points. The top W9-3595X is a 60-core/120-thread chip, compared to the 56-core/112-thread W9-3495X it's replacing. The new W9-3575X gets a massive 8-core uplift, and is now a 44-core/88-thread processor, compared to the 36-core/72-thread W9-3475X. The W7-3565X is 32-core/64-thread, compared to the 28-core/56-thread W7-3465X.

SafeDisk (AKA SoonHo Jeong) has tinkered with an AMD Ryzen 7 8700G APU and ASUS ROG Crosshair X670E GENE motherboard combination—earlier today, the professional overclocker set a validated/verified memory speed of DDR5-10600 world record on Team Red's AM5 platform. This has surpassed a previous result global-leading from late last week—DDR5-10346 was achieved with the same processor, but on a GIGABYTE B650E AORUS Tachyon board. SafeDisk has a distinct advantage in memory overclocking stakes, due to his workplace being the ASUS ROG labs in Taipei, Taiwan—his closest competitor, Benny Lodewijk Nitolo Lase (an Indonesian overclocker) now sits behind him in second place.

SafeDisk's test setup included the aforementioned APU plus motherboard combo, a Thermalright (not ASUS!) AIO, a twin pack of G.Skill Trident Z5 (F5-7800J3646H16G) DIMMs, and an ASUS GeForce GT 730 2 GB Silent graphics card. The ROG Crosshair X670E GENE's default set of VRM heatsinks were removed completely during test conditions. The two memory sticks were set at their default CL36 7800 MT/s speed at 1.45 V—SafeDisk's record breaking DDR5-10600 overclock was achieved with timings of 50-62-62-127-127. Wccftech noted that the: "overclock was able to boot directly into the OS and (SafeDisk) says that the whole OC procedure was very easy."

AMD is readying the new 800-series motherboard chipset to launch alongside its next-generation Ryzen 9000 series "Granite Ridge" desktop processors that implement the "Zen 5" microarchitecture. The chipset family will be led by the AMD X870E, a successor to the current X670E. Since AMD isn't changing the CPU socket, and this is very much the same Socket AM5, the 800-series chipset will support not just "Granite Ridge" at launch, but also the Ryzen 7000 series "Raphael," and Ryzen 8000 series "Hawk Point." Moore's Law is Dead goes into the details of what sets the X870E apart from the current X670E, and it all has to do with USB4.

Apparently, motherboard manufacturers will be mandated to include 40 Gbps USB4 connectivity with AMD X870E, which essentially makes the chipset a 3-chip solution—two Promontory 21 bridge chips, and a discrete ASMedia ASM4242 USB4 host controller; although it's possible that AMD's QVL will allow other brands of USB4 controllers as they become available. The Ryzen 9000 series "Granite Ridge" are chiplet based processors just like the Ryzen 7000 "Raphael," and while the 4 nm "Zen 5" CCDs are new, the 6 nm client I/O die (cIOD) is largely carried over from "Raphael," with a few updates to its memory controller. DDR5-6400 will be the new AMD-recommended "sweetspot" speed; although AMD might get its motherboard vendors to support DDR5-8000 EXPO profiles with an FCLK of 2400 MHz, and a divider.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the TS-h3077AFU, a highly reliable 30-bay SATA 6 Gb/s all-flash SSD NAS with a ZFS-based operating system, cutting-edge AMD Ryzen Embedded 7000 Series processors and integrated AMD Radeon Graphics. With up to 1.6M/1.2M iSCSI 4K random read/write IOPS, DDR5 RAM, built-in dual-port 10/2.5 GbE, upgradability to 100 GbE, PCIe Gen 4 expandability, and scalability to petabyte-scale storage, the TS-h3077AFU meets uncompromising performance demands in 4K/8K video workflows, storage centers, and virtualization. The QuTS hero operating system also features ZFS data reduction and SSD optimization, ensuring the utmost performance, lifespan, and efficiency from all-flash investments.

"The TS-h3077AFU redefines the landscape of storage solutions, offering not just capacity but also efficiency and performance for the most demanding business environments. Its capabilities in graphics processing, connectivity, and reliability, provided by the powerful AMD Ryzen Embedded 7000 Series Processor, position it as a game-changer in the industry," said Meiji Chang, General Manager of QNAP.

V-Color Technology Inc., announced their collaboration with MSI, resulting in the creation of the Manta DDR5 XFinity MPOWER a dynamic memory series that achieves speeds of up to 8400, seamlessly combining the prowess and innovation of both companies. Engineered for overclocking, this new series is ready to deliver top performance and exceptional endurance.
The DDR5 Manta XFinity MPOWER is developed with overclocking in mind, providing top-tier performance and endurance, catering to the needs of PC enthusiasts and high-performance consumers. In addition to its superior performance, this series has a sleek and modern design with a heatsink ideal for dissipating high temperatures, adding a touch of style to any system. With 16 LEDs enhanced technology, it delivers smooth, vivid lighting effects with a focus on personalization and performance.

We already know about AMD Ryzen 7 8700G APU's enjoyment of overclocked memory—early reviews demonstrated the graphical benefits granted by fiddling with "iGPU engine clock and the processor's memory frequency." While gamers can enjoy a boosted integrated graphics solution that is comparable in performance 1080p stakes to a discrete Radeon RX 6500 XT GPU, AI enthusiasts are eager to experiment with the "Hawk Point" pat's Radeon 780M IGP and Neural Processing Unit (NPU)—the first generation Ryzen XDNA inference engine can unleash up to 16 AI TOPs. One individual, chi11eddog, posted their findings through social media channels earlier today, coinciding with the official launch of Ryzen 8000G processors. The initial set of results concentrated on the Radeon 780M aspect; NPU-centric data may arrive at a later date.

They performed quick tests on AMD's freshly released Ryzen 7 8700G desktop processor, combined with an MSI B650 Gaming Plus WiFi motherboard and two sticks of 16 GB DDR5-4800 memory. The MSI exclusive "Memory Try It" feature was deployed further up in the tables—this assisted in achieving and gauging several "higher system RAM frequency" settings. Here is chi11eddog's succinct interpretation of benchmark results: "7600 MT/s is 15% faster than 4800 MT/s in UL Procyon AI Inference Benchmark and 4% faster in GIMP with Stable Diffusion." The processor's default memory state is capable of producing 210 Float32 TOPs, according to chi11eddog's inference chart. The 6000 MT/s setting produces a 7% improvement over baseline, while 7200 MT/s drives proceedings to 11%—the flagship APU's Radeon 780M iGPU appears to be quite dependent on bandwidth. Their GIMP w/ Stable Diffusion benchmarks also taxed the integrated RDNA 3 graphics solution—again, it was deemed to be fairly bandwidth hungry.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, announces its 2024 preconfigured MG-1 gaming PCs, featuring the latest NVIDIA GeForce RTX 40-Series SUPER GPUs. Designed to redefine the gaming experience, these newly announced pre-configured systems, starting at $1,199, offer enhanced performance, diverse options, more memory, larger SSD capacities, and can be had with Windows 11 Pro.

"Refreshing the MG-1 Series to feature the latest gaming hardware and components represents our ongoing commitment to delivering cutting-edge gaming experiences. With the latest Intel & AMD processors, NVIDIA GPUs, including the new SUPERs, and a broader range of options in the MG-1, MAINGEAR continues to set the standard for gaming excellence." - Wallace Santos, CEO of MAINGEAR.

DFI, the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel Core Ultra processor. It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs). With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market.

According to the STL Partners report, the potential market value of global edge computing will increase from US$9 billion in 2020 to US$462 billion in 2030, representing a compound annual growth rate (CAGR) of 49%. Therefore, the development of products that utilize the core capabilities of chips to rapidly execute AI edge computing in devices has become a key focus for many major technology companies.

In addition to the 37 Gbps GDDR7 memory, Samsung Electronics prepares to showcase several other memory innovations at the 2024 IEEE-SSCC as compiled by VideoCardz. To begin with, the company is showcasing a new 280-layer 3D QLC NAND flash memory in the 1 Tb density, enabling next generation of mainstream SSDs and smartphone storage. This chip offers an areal density of 28.5 Gb/mm², and a speed of 3.2 GB/s. To put this into perspective, the fastest 3D NAND flash types powering the current crop of flagship NVMe SSDs rely on 2.4 GB/s of I/O data rates.

Next up, is a new generation DDR5 memory chip offers data rates of DDR5-8000 with a density of 32 Gbit (4 GB). This chip uses a symmetric-mosaic DRAM cell architecture, and is built on a 5th generation 10 nm class foundry node Samsung optimized for DRAM products. What's impressive about this chip is that it will allow PC memory vendors to build 32 GB and 48 GB DIMMs in single-rank configuration with DDR5-8000 speeds; as well as 64 GB and 96 GB DIMMs in dual-rank configuration (impressive, provided your platform can play well with DDR5-8000 in dual-rank).

The first CPU-Z test results of AMD's upcoming Ryzen 7 8700G were sniffed out by serial leaker @momomo_us on X/Twitter and the new APU is looking very promising performance wise. It ends up being neck and neck with yours truly own Ryzen 7 7800X3D with a small lead to the CPU over the APU in single-threaded performance, but in the multi-threaded test the APU manages to stay ahead of the CPU, if only just. Both AMD chips are still somewhat behind Intel's Core i7-12700KF, but it has an extra four threads, even though those threads are slower due to them being on the E-cores.

The Ryzen 7 8700G test system was using an ASRock B650 Pro RS motherboard and the APU was paired with 32 GB of DDR5-6400 memory with reasonably tight timings of 32-39-39-102. The tester relied on the integrated Radeon 780M graphics in the APU and the Windows 11 operating system was installed on a 500 GB Seagate BarraCuda 510 SSD. In the single-threaded test the Ryzen 7 8700G scores 675 points vs 683 for the Ryzen 7 7800X3D and in the multi-threaded tests it came in at 7318 vs 7301. Not bad for a 65 W TDP APU vs a 120 W TDP CPU. For comparison, the average for Intel's Core i7-12700KF is 7754 in the mutli-threaded test. Although CPU-Z is far from an exhaustive test, it does at least give us a first glimpse of what to expect from the new Zen 4 APUs from AMD in terms of performance and it looks like it's in line with its best Zen 4 CPUs.

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

AMD is looking to debut its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture some time around May-June 2024, according to High Yield YT, a reliable source with AMD leaks. These processors will be built in the existing Socket AM5 package, and be compatible with all existing AMD 600 series chipset motherboards. It remains to be seen if AMD debuts a new line of motherboard chipsets. Almost all Socket AM5 motherboards come with the USB BIOS flashback feature, which means motherboards from even the earliest production batches that are in the retail channel, should be able to easily support the new processors.

AMD is giving its next-gen desktop processors the Ryzen 9000 series processor model numbering, as it used the Ryzen 8000 series for its recently announced Socket AM5 desktop APUs based on the "Hawk Point" monolithic silicon. "Granite Ridge" will be a chiplet-based processor, much like the Ryzen 7000 series "Raphael." In fact, it will even retain the same 6 nm client I/O die (cIOD) as "Raphael," with some possible revisions made to increase its native DDR5 memory frequency (up from the current DDR5-5200), and improve its memory overclocking capabilities. It's being reported that DDR5-6400 could be the new "sweetspot" memory speed for these processors, up from the current DDR5-6000.

SK hynix Inc. announced today that it recorded an operating profit of 346 billion won in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses. The company posted revenues of 11.31 trillion won, operating profit of 346 billion won (operating profit margin at 3%), and net loss of 1.38 trillion won (net profit margin at negative 12%) for the three months ended December 31, 2023. (Based on K-IFRS)

SK hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising. "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said. The financial results of the last quarter helped narrow the operating loss for the entire year to 7.73 trillion won (operating profit margin at negative 24%) and net loss to 9.14 trillion won (with net profit margin at negative 28%). The revenues were 32.77 trillion won.

A leaked Intel documentation we reported on a few days ago covered the Arrow Lake-S platform and some implementation details. However, there was an interesting catch in the file. The leaked document indicates that the upcoming 15th-Generation Arrow Lake desktop CPUs could lack Hyper-Threading (HT) support. The technical memo lists Arrow Lake's expected eight performance cores without any threads enabled via SMT. This aligns with previous rumors of Hyper-Threading removal. Losing Hyper-Threading could significantly impact Arrow Lake's multi-threaded application performance versus its Raptor Lake predecessors. Estimates suggest HT provides a 10-15% speedup across heavily-threaded workloads by enabling logical cores. However, for gaming, disabling HT has negligible impact and can even boost FPS in some titles. So Arrow Lake may still hit Intel's rumored 30% gaming performance targets through architectural improvements alone.

However, a replacement for the traditional HT is likely to come in the form of Rentable Units. This new approach is a response to the adoption of a hybrid core architecture, which has seen an increase in applications leveraging low-power E-cores for enhanced performance and efficiency. Rentable Units are a more efficient pseudo-multi-threaded solution that splits the first thread of incoming instructions into two partitions, assigning them to different cores based on complexity. Rentable Units will use timers and counters to measure P/E core utilization and send parts of the thread to each core for processing. This inherently requires larger cache sizes, where Arrow Lake is rumored to have 3 MB of L2 cache per core. Arrow Lake is also noted to support faster DDR5-6400 memory. But between higher clocks, more E-cores, and various core architecture updates, raw throughput metrics may not change much without Hyper-Threading.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.

During CES, PCWorld had a chat with Donny Woligroski, Technical Marketing Manager at AMD. The new Ryzen 8000G APUs were a large part of what covered in the almost 17 minute long video and PCWorld got some details that weren't covered in the official press materials that AMD released at the launch. The officially supported memory speed listed by AMD is DDR5-5600, which is a step up from the official speed of DDR5-5200 for the Ryzen 7000-series CPUs.

However, we know that the Ryzen 7000-series is more than happy to use faster memory and as before, AMD has an unofficial memory sweet spot and just as with the Ryzen 7000-series, the Ryzen 8000G-series of APUs has a memory sweet spot of DDR5-6000. That said, it's unknown if the Ryzen 8000G-series will support faster memory or will start flaking out above DDR5-6000, like many Ryzen 7000-series CPUs do unless you switch to a 1:2 ratio. Woligroski is also pointing out that dual-channel is a must to get the best performance out of the new APUs, although this shouldn't really surprise anyone. Full video after the break.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

Global leader in embedded computing, Jetway, today introduced the JF35-ADN1, a 3.5" SubCompact single-board powered by the Intel Processor N97 CPU. A versatile board, the JF35-ADN1 is primarily targeted towards the industrial robotics sphere, with Automated Guided Vehicles (AGV) being one application singled out as being particularly suitable. However, Jetway have stated that the board also contains the right combination of display capability and encrypted mobile networking capacity to power both machine vision and payment systems solutions.

The JF35-ADN1 boasts a range of high-speed interfaces for camera, sensor, and card reader connectivity, such as two RJ-45 ports for Intel I225-V running at 2.5GbE, as well as both USB Type-A and Type-C ports. Further, a total of eight USB 2.0 interfaces are evenly split between physical ports and internal connectors. It is worth noting that the JF35-ADN1's high-speed data acquisition for its intended deployment areas is enhanced by the board's support for up to 32 GB of DDR5 system memory via SODIMM. This connectivity, alongside the board's optional onboard TPM 2.0, make it a suitable candidate to develop payment system solutions.

V-COLOR announces the launch of their DDR5 overclocking R-DIMM the TRX50 Motherboards powered by AMD Ryzen Threadripper 7000 series processors with capacity 192 GB (4x48GB) ready to hit the market in speeds ranging from 6400 MHz up to 7200 MHz for end users who require the maximum capacity and speed. This package is geared toward content makers, intensive 3D modelers, AI programmers, trading machines, and HFT (high frequency trading) firms.

With EXPO ready v-color DDR5 OC R-DIMM memory is ready to for full potential, designed for a diverse user base that includes both non-overclocking users and overclocking enthusiasts, with a specific focus on content creators, intensive 3D modelers, AI programmers, trading machines or HFT (high frequency trading) companies. This kit is meticulously crafted with the most advanced SK Hynix DDR5 chips and Automated Binning sort for more reliability and endurance, continuously tested for full compatibility with all the motherboards TRX50.

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI. Designed for digital signage and self-service kiosks in the smart retail industry, or in large vehicles fitted with display-board advertising, this unique mini-PC offers up to 4 display outputs that can showcase a variety of rich and vibrant content. The highly flexible solution can display 4 different screens, mirror all screens the same, split one image across 4 displays, or splits of 3-and-1 or 2-and-2, affording maximum flexibility to cover wide areas of retail spaces that can easily plan and push a multitude of content to inform and advertise in attractive, dynamic, high-resolution visuals, all from a single device. The LIVA X3A mini-PC is ready to go right out the box, along with ECSIPC's own content management software to streamline product deployment.

Powered by a highly efficient Rockchip octa-core featuring a 4x Arm Cortex-A76 and 4x Arm Cortex-A55 processors in this Arm-based CPU, the highly efficient, fanless design ensures a sustainable solution that accommodates many use-cases. In addition, 8 GB of fast LPDDR5 and 64 GB of internal storage is preinstalled, while dual GbE, Wi-Fi 6 and Bluetooth 5.3 provide a variety of internet connectivity built-in, which can be further expanded with optional PoE and 4G LTE to meet specific deployment requirements.

Alienware is entering new arenas at CES 2024 with the debut of notebooks, peripherals and monitors that were inspired by our community and developed to appeal to all gamers. Whether you play to compete, play to get immersed in the game or play to socialize, Alienware can outfit your gaming needs. From the beginning, Alienware has offered high-performance hardware and software to the most demanding gamers. And here's what I can tell you: our focus on the enthusiast gamer hasn't changed. At the same time, the gaming landscape has evolved and is becoming more diverse than ever.

That's why we're eager to introduce products designed for wider audiences, from students who play dorm room sessions with friends, to working professionals who wind down the evening with a relaxing indie title, and pro athletes who game for a living. While these products reach new audiences, their DNA remains distinctly Alien, meaning they deliver the latest innovations in technology, performance and design. Meet Alienware's latest product portfolio:

• Three new gaming notebooks debut - the redesigned Alienware m16 R2, the ultra-premium x16 R2, and our performance juggernaut, the m18 R2.
• We've doubled our QD-OLED family by adding the Alienware AW3225QF and AW2725DF - two first of their kind QD-OLED monitors.
• Built in collaboration with 100+ esports athletes, our new Alienware Pro Wireless Keyboard and Pro Wireless Mouse mark our breakthrough into the pro gaming peripherals space.

Lexar previewed part of their CES lineup late last week—we got a quick briefing that outlined various upcoming portable SSDs, M.2 NVMe SSDs, and professional CFExpress cards. TPU staffers spent some quality time at the storage specialist's booth in Las Vegas—they have reported back that emphasis has been placed on Lexar's portable SSD products. The headliner appears to be the prominently placed ARMOR 700 Portable SSD—this boasts an extra rugged design, thus providing the level of on-the-go protection that is required by modern professionals.

The ARMOR 700 will be available in three capacities: 1 TB, 2 TB and 4 TB. Maximum read and write speeds of 2000 MB/s are advertised on Lexar's wall-mounted exhibit, with support for 6K RAW video files. The rugged and durable housing has been certified at IP65, with drop-resistant properties. The already released SL660 BLAZE Gaming Portable SSD was showcased at CES, but it was joined by a similar looking (non-RGB equipped) sibling—the new SL600 is a more sober looking option, aimed at professional types. The SL500 Portable SSD sports credentials for a wide range of purposes: mobile devices, laptops, cameras as well as gaming on current generation games consoles. Lexar states that the SL500 is powered by Silicon Motion Technology portable SSD controllers—with speeds up to 2000 MB/s read and 1800 MB/s write. Capacities noted on the exhibit wall are 1 TB, 2 TB and 4 TB—this applies to the SL600 specification as well.

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.