G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of high-speed, low-latency DDR5-6800 CL32 memory specification with large kit capacity of up to 96 GB (2x 48 GB), as well as DDR5-6400 CL28 32 GB (2x 16 GB) high-performance memory specification. These new memory specifications will be available under the G.SKILL Trident Z5 Royal, Trident Z5 RGB, and Ripjaws M5 RGB series, with Intel XMP 3.0 memory overclock profile support.

As G.SKILL continues to push memory performance to higher limits, an ideal memory solution for overclocking enthusiasts who are looking for both large capacity and high performance is born at DDR5-6800 CL32-42-42 at up to 96 GB (2x 48 GB). This new specification has been validated on both Intel Z790 and Z890 platforms. Please refer to the screenshots below for Memtest validation on the ASUS ROG Maximus Z890 Hero motherboard with the Intel Core Ultra 7 265K desktop processor, and the ASUS ROG Maximus Z790 Dark Hero motherboard with the Intel Core i9-14900K desktop processor.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

ChangXin Memory Technology (CXMT) is playing catch up with competitors based in neighboring nations—as reported earlier today, this Chinese memory module manufacturer is making advancements in the field of commercial DDR5 products. Reports from the region suggest that a well-known motherboard manufacturer has embraced some of ChangXin new portfolio. According to a recent ITHome article, MSI has implemented a multitude of optimizations for new-ish Intel "Arrow Lake" Core Ultra Series 2 CPU-oriented motherboards—notably the MAG B860 TOMAHAWK WIFI, MAG B860M MORTAR WIFI, and PRO B860M-A WIFI models.

The publication provided evidence of MSI enabling transfer rates of 6800 MT/s across four engaged modules—a welcome step up from the usual twin-stick setup. ITHome also points out that the motherboard specialist has prepared a new BIOS version for B860 chipset mainboards: "specially optimized for the recently popular DDR5 domestic memory particles of ChangXin Storage, which undoubtedly gives the gaming community (in China) more choices." MSI appears to be the first major international vendor to enable support for CXMT's DDR5 modules—thus, representing a significant achievement for the Chinese memory industry.

TechInsights has identified CXMT's new 16 nm DRAM chips in Gloway DDR-6000 UDIMM modules, confirming advancement in the Chinese memory industry. The CXMT 16 Gb DDR5 chip measures 67 square millimeters with a density of 0.239 Gb per square millimeter. The G4 DRAM cells are 20 percent smaller than CXMT's previous G3 generation. This follows the company's progression from 23 nm (G1) and 18 nm (G2) nodes. Despite this advancement, CXMT remains approximately three years behind Samsung, SK Hynix, and Micron in manufacturing capabilities. The Hefei-based company achieved this production milestone under US sanctions restricting access to certain manufacturing equipment and materials, setting it back years in gaining production of advanced memory nodes.

TechInsights found these chips in commercially available memory modules, confirming CXMT's entry into DDR5 production. DDR5 technology is projected to be the primary DRAM standard through 2027. The three major DRAM manufacturers have been producing DDR5 through multiple generations, with DDR5 now reaching 10,000 MT/s speeds. This represents CXMT's first DDR5 DRAM product to reach the consumer market. The chips meet basic compatibility requirements for current DDR5 specifications, meaning that the Chinese memory manufacturing has achieved "1z" memory manufacturing on its soil. This marks the second major news for the Chinese semiconductor industry, right after TechInsights also confirmed that YMTC has started shipping 292-layer NAND Flash. With domestic demand for memory and storage projected to remain strong, we wonder if the supply will exceed demand and allow some left-over chips for worldwide usage.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring the exclusive LN2 SWITCH function, which is key to breaking through in this overclocking attempt, and V-COLOR Manta Xfinity RGB, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-12726. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

Besides the astonishing memory frequency, Z890 AORUS TACHYON ICE also break another three world records of 3DMARK CPU Profile 1T/2T/8T.

Montage Technology today announced that it has successfully sampled its Gen 2 Multiplexed Rank Registering Clock Driver (MRCD) and Multiplexed Rank Data Buffer (MDB) chipset to leading global memory manufacturers. Designed for DDR5 Multiplexed Rank DIMM (MRDIMM), this new chipset supports data rates up to 12800 MT/s, delivering exceptional memory performance for next-generation computing platforms.

The release comes at a crucial time, as AI and big data analytics drive increasing demands for memory bandwidth in data centers. MRDIMM technology has emerged as a key solution to address this challenge, particularly as server processors continue to increase in core count.

As a leader in innovative technology, Acemagic is excited to announce the upcoming pre-sale launch of the F3A AI 370 MINI PC by the end of January 2025. Powered by AMD's latest Ryzen AI 9 HX 370 processor, this high-performance mini PC combines outstanding computational power with cutting-edge cooling technology, designed to meet the needs of professionals, content creators, and high-end users.

The F3A AI 370 MINI PC features an advanced 12-core, 24-thread processor, built on AMD's Zen 5 and Zen 5c architecture. With a base clock speed of 2.0 GHz and a turboboost up to 5.1 GHz, it delivers exceptional multithreaded performance and processing power. Additionally, the F3A is equipped with the third-generation Ryzen AI NPU (Neural Processing Unit) based on the XDNA2 architecture, offering up to 50 TOPS of AI computing performance. With seamless collaboration between the GPU and CPU, the F3A achieves an impressive total performance of up to 80 TOPS, making it ideal for high-demand applications like deep learning and AI inference.

We have witnessed quite a few affordable laptops hit shelves in the past few weeks, including offerings from Acer and ASUS. For those who are more interested in tablets but prefer a full-fledged Desktop OS will likely find the newly launched Lenovo S130 2-in-1 quite enticing, but there exists a major hurdle - the Lenovo S130 is China-only, for now at least. However, an international launch is not entirely out of the question.

At its core, the Lenovo S130 is powered by the Intel N100 processor. With four cores, four threads, and a maximum boost clock of 3.4 GHz, the 6-watt N100 is far from a powerhouse chip. That said, it should likely be enough for casual web-browsing and media consumption, but expecting anything more from the chip would be futile. The S130 does feature an impressive 13.3-inch display, with a resolution of 3000 x 2000 with a maximum brightness of 420 nits, making the S130 quite ideal for content consumption indeed.

Transcend Information Inc. (Transcend), a global leader in storage solutions, is proud to announce its new DDR5 6400 CUDIMM DRAM modules. Designed specifically for gamers, content creators, DIY PC enthusiasts, and demanding professionals, these modules offer enhanced performance and stability to meet varying speed and capacity requirements. Optimized from standard DIMMs, CUDIMMs include a Client Clock Driver (CKD) for stable and efficient operation, making them ideal for high-performance desktop systems that require greater bandwidth and reliability.

With data transfer rates of up to 6400 MT/s, Transcend's DDR5 6400 DRAM modules significantly boost gaming performance, video editing smoothness, and large file processing speeds. Whether you are tackling the latest AAA gaming titles, editing high-resolution videos, or multitasking across multiple applications, these modules keep your system running smoothly even under extreme load and deliver an exceptional user experience. Plus, built-in on-die Error Correction Code (ECC) technology ensures data integrity, safeguarding important files, game progress, and creative content.

Shipping manifests at NBD.ltd have revealed the presence of Intel's "Nova Lake" test chips, providing insight into the development timeline of the company's 2026 processor platform. The discovery comes as Intel prepares for the launch of its "Panther Lake" CPUs on the 18A process node in late 2025. Nova Lake is positioned to replace both Panther Lake for mobile devices and "Arrow Lake" for desktop systems. The manufacturing process remains unconfirmed, with Intel potentially using either its in-house 14A node or TSMC's 2 nm technology. Following recent practices, Intel may split production between its own facilities and TSMC for different components. Rumored specifications show that Nova Lake will use Coyote Cove performance cores and Arctic Wolf efficiency cores.

Unlike Lunar Lake, it will not incorporate on-package memory, maintaining a more conventional design approach. The test chip's appearance suggests Intel is adhering to its development schedule. This timing aligns with the company's plans for Panther Lake's mass production in the second half of 2025, a structured transition between generations. Documents point to "Razor Lake" as Nova Lake's eventual successor, though detailed specifications are not yet available. Panther Lake, the immediate predecessor to Nova Lake, will focus primarily on mobile computing, with desktop variants limited to Mini PC implementations. This approach mirrors the Meteor Lake generation, which saw limited desktop release through the "PS" series for Edge platforms. The Nova Lake platform is expected to support DDR5 memory and may introduce PCIe Gen 6.0 compatibility, with final specifications unconfirmed.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

AMD is rumored to be building its next-generation CCD (core complex die) that implements the "Zen 6" microarchitecture, on the 3 nm TSMC N3E foundry node. This is part of a set of rumors from ChipHell forum, which got past rumors on AMD right. Apparently, AMD will also refresh the I/O dies for its next generation process, building them on the 4 nm foundry node, likely the TSMC N4C. The TSMC N3E node offers a 20% speed improvement, over 30% power savings, and approximately 60% logic density increase over TSMC N5, whereas the TSMC N4P node that the company uses for its current "Zen 5" chiplets only clock minor increases in logic density and power over N5. The N3E node relies on EUV double-patterning to achieve its logic density increases.

Perhaps the most interesting piece of news is the new-generation I/O dies. AMD is building these on the 4 nm node, which is a significant step up from the 6 nm node its current I/O dies are built on. On the client side of things, 4 nm will enable AMD to give the new cIOD an updated iGPU, probably based on a newer graphics architecture, such as RDNA 3.5. It will also give AMD the opportunity to integrate an NPU. The company might also update its key I/O components, such as the DDR5 memory controllers, to support higher memory speeds unlocked by CUDIMMs. We don't predict any updates on the PCIe front, since AMD is expected to carry on with Socket AM5, which determines that the cIOD puts out 28 PCIe Gen 5 lanes. At best, the USB interface put out from the processor could be updated to USB4 through an on-die host controller. Over on the server side, the new-generation sIOD will bring much needed increases to the DDR5 memory speeds enabled by clock drivers.

GEEKOM, the Green Mini PC Global Leader, is going to release a new model named the A6 on January 17th, 2025. This mini PC is already available for pre-order on GEEKOM's official website. Priced at $449, it may just be the new best mini PC under $500.

According to the official information, the GEEKOM A6 mini PC employs a well-ventilated aluminium chassis which measures only 0.47 liter, but it packs enormous power under the hood, thanks to the perfect combination of a beefy processor, high-bandwidth DDR5 RAM, and a fast PCIe Gen 4 SSD.

Exciting things are happening in the world of memory right now. Many of the headlines are being claimed by a new variety of DIMM, called Clock Unbuffered DIMM (CUDIMM). Featuring an integrated clock driver on the memory stick itself for improved reliability and stability, CUDIMM kits are already shattering speed records. But perhaps you're more concerned with memory capacity than with raw speed. We have some good news for you. The trusted memory professionals at Kingston have cooked up a 64 GB memory module that you'll be able to purchase soon: the Kingston Value RAM DDR5 6400 MT/s 64 GB CUDIMM.

64 GB of DDR5 RAM on a single stick opens intriguing new possibilities. A 128 GB one-DIMM-per-channel (1DPC) configuration is rather tempting. We suspect that many enthusiasts will be tempted by the prospect of installing four of these modules, a move that puts a stunningly large 256 GB (4 x 64 GB) pool of memory at their disposal—without having to venture into quad-channel workstation hardware.

Thermaltake, a leading PC DIY brand for premium hardware solutions, proudly launches today at CES 2025 the TOUGHRAM XG RGB D5 7200 MT/s 32 GB (16 GB x2), now equipped with the latest CKD (Client Clock Driver) technology. This new addition to Thermaltake's high-performance DDR5 memory lineup integrates advanced technology with a sleek design, offering an exceptional solution for PC enthusiasts and professionals. With CKD technology, the TOUGHRAM XG RGB D5 Memory ensures superior signal integrity, improved power efficiency, and enhanced overclocking stability, delivering consistent performance under the most demanding workloads. Ideal for gaming, creative projects, and AI-driven applications, this memory module is engineered to exceed the expectations of modern high-performance computing.

"Thermaltake is committed to redefining the limits of DRAM memory technology to meet the evolving needs of gamers and professionals," said Kenny Lin, CEO of Thermaltake. "The TOUGHRAM XG RGB D5 with CKD technology exemplifies our dedication to delivering cutting-edge solutions that offer superior speed, stability, and customization; whether for serious gamers, creators, or even AI development, this memory sets a new benchmark in high-performance computing."

Corsair at the 2025 International CES brought a couple of new products from its memory and storage lines. This company used to be called "Corsair Memory" before it became Corsair Gaming, so they know a thing or two about enthusiast-segment memory and storage products, going back decades. We begin our tour with the new EX400U, a portable SSD with a 40 Gbps USB4 interface. The drive comes in 1 TB, 2 TB, and 4 TB capacities, and offers sequential transfer speeds of up to 4000 MB/s reads, with up to 3600 MB/s writes. The company hasn't made any claims on minimum write performance, so we don't know if the drive can be used for 4K or 8K RAW cinematography. More than PC, Corsair wants you to be enthused about its mobile chops. It can connect to an iPhone 15 or later as a mass-storage device, and supports MagSafe. Corsair plans to formally launch this on January 23.

Corsair has been agile in the PC overclocking memory space, responding to new trends with product launches, without having to wait for platforms such as trade shows, so there are no new products as such (You can feast your eyes on a DDR5-10000 Vengeance kit which uses CKD), but the company made two new accessory announcements for its Vengeance and Dominator product lines. For Vengeance, Corsair's mainstream and performance-segment memory line, the company announced Corsair Custom Lab, a service that allows you to customize die-cast designs onto the module's heat spreaders. We've seen a few examples at CES, but we're sure there will be more. The Custom Lab Vengeance RGB modules should be available in Q1 2025.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, demonstrates high-speed DDR5 CSO-DIMM memory operating at DDR5-8133 with 48 GB (2x24GB) kit capacity on the newly announced ASRock DeskMini B860 system. CSO-DIMM is a relatively new form factor that adds a clock driver (CKD) onto the compact SO-DIMM design, and is supported by the latest platform generation with Intel Core Ultra 200 series processors.

DDR5-8133 48 GB (2x24GB) Extreme Speed with CSO-DIMM Modules
Thanks to the ASRock DeskMini B860 system that implements DDR5 CSO-DIMM support and provides outstanding memory overclock performance, G.SKILL is able to unleash the ultimate overclock potential of the new high-speed CSO-DIMM memory kits. The screenshot below shows the G.SKILL CSO-DIMM memory kit with 48 GB (2x24GB) running at DDR5-8133 CL46-52-52-130 with the ASRock B860M-STX motherboard and the Intel Core Ultra 9 285 desktop processor.

Advantech, a leader in embedded IoT computing solutions, is excited to introduce their AI-integrated desktop platform series: the Mini-ITX AIMB-2710 and Micro-ATX AIMB-589. These platforms are powered by Intel Core Ultra Processors (Series 2) S-Series, featuring the first desktop processor with an integrated NPU, delivering up to 36 TOPS for superior AI acceleration. Designed for data visualization and image analysis, both models offer PCIe Gen 5 support for high-performance GPU cards and feature 6400 MHz DDR5 memory, USB4 Type-C, multiple USB 3.2 Gen 2 and 2.5GbE LAN ports for fast and accurate data transmission in real time.

The AIMB-2710 and AIMB-589 excel in high-speed computing and AI-driven performance, making them ideal for applications such as medical imaging, automated optical inspection, and semiconductor testing. Backed by comprehensive software support, these platforms are engineered for the next wave of AI innovation.

PNY today announced the specifications and availability of its high-performance DDR5 notebook memory, offered in 64 GB (2x32GB) and 32 GB (2x16GB) kits. Designed for tech enthusiasts, creators, and gamers who demand unrivaled performance, premium quality, and blazing-fast speeds, this new memory module harnesses the power of DDR5, runs at 5600 MHz, and features a CAS latency of 46.

Next Generation Technology
PNY Performance DDR5 is built to support the growing lineup of motherboards compatible with the new DDR5 memory standard. This cutting-edge technology introduces a host of new features previously unavailable or limited in earlier generations of notebook memory. DDR5 enables higher-density modules, with capacities up to four times greater per module than DDR4 and supports faster standard frequencies. PNY's Performance DDR5 memory offers speeds of 5600 MHz for outstanding performance and is available in 64 GB (2x32GB) and 32 GB (2x16GB) kits.

Micron at the 2025 International CES showed us product that hint at the company planning a strong comeback to the client and PC-DIY market segments. The company's Crucial brand is already a high-volume player in the client segment, but the company never really approached the enthusiast segment. Products like the company's new T705 Pro and P510 NVMe SSDs, and DDR5 Pro Overclocking memory, seek to change this. We begin our tour with PC memory, and the DDR5 Pro OC CUDIMMs. Crucial has jumped onto the CKD bandwagon, introducing memory modules and kits that come with DDR5-6400 out of the box, but which are geared for manual overclocking to take advantage of the 1β DRAM chips underneath (hence the name).

The company also showed us their first DDR5 CSODIMM suitable for the next generation of notebooks with HX-segment processors. This module comes with a CKD and a DDR5-6400 JEDEC-standard SPD profile out of the box. Lastly, there's the Micron-branded LPCAMM2, which comes in speeds of up to LPDDR5X-8533, and is suitable for the next generation of ultraportables.

Biwin, a PC memory, SSD, and flash storage product licensee for top-tier PC brands, launched its consumer brand in December 2024. Here at CES 2025, the TechPowerUp team headed over to Biwin's booth to check out up close the entire lineup of products ranging from SSDs in all shapes and sizes, and DRAM modules to memory cards, and card readers. The products on display were available on Amazon Japan in December 2024, followed by Amazon UK this January, and at the start of 2025, they will be available in Taiwan, APAC, Mexico, Latin America, and the Indian market.

Biwin showcased Black Opal premium SSDs and DRAM modules such as the Biwin Black Opal X570 PRO PCIe Gen 5x 4 NVMe 2.0 SSD capable of reaching read speeds of up to 14,000 MB/s. The Black Opal DW100 RGB DDR5 CUDIMM series stands out with 9200 MT/s and a CAS latency of CL42, a product tailored for professionals and enthusiasts. For mainstream users, Biwin presented SSDs, DRR5 memory modules, memory cards, card readers, and USB flash drives.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Today marks the launch of the new ASUS Vivobook Pro 15 (N6506CU), the latest version of this high-performance 15.6-inch laptop designed for pro creators and pro gamers.

ASUS Vivobook Pro 15 offers seamless creativity and gaming with cutting-edge components: up to the latest Intel Core Ultra 9 processor (Series 2) with a built-in 13 TOPS NPU, NVIDIA GeForce RTX 4050 GPU with a low-latency MUX switch, 24 GB DDR5 RAM, and a 2 TB PCIe SSD. It boasts advanced ASUS IceCool Pro cooling technology that enables up to a 125-watt combined thermal design power (TDP).

ASUS today announced the 2025 TUF Gaming laptop lineup, including the first 18-inch member of the family. Featuring the latest processors from AMD, Intel, and NVIDIA, the TUF Gaming A16, F16, and A18 aim to deliver incredible performance without breaking the bank.

The first TUF Gaming 18-inch laptop
The TUF Gaming Alliance is proud to introduce the A18, the first 18-inch laptop in the TUF Gaming lineup. Equipped with up to an AMD Ryzen 7 260 processor and an NVIDIA GeForce RTX 5070 Laptop GPU, the TUF Gaming A18 can easily handle the latest games. Also featuring up to 32 GB of DDR5 5600 MHz memory and up to 2 TB of PCIe Gen 4 storage, gamers can easily game, stream, and store their entire library. The A18 also boasts a gorgeous 2.5K resolution 240 Hz display, with an extra-tall 16:10 aspect ratio, 500 nits of peak brightness, and 100% coverage of the DCI-P3 colors space for incredibly immersive gameplay.

Micron Technology, Inc., today announced expansions across its Crucial consumer memory and storage portfolio, including unveiling the high-speed Crucial P510 SSD, and expanding density and form factor options across its existing DRAM portfolio to enable broader choice and flexibility for consumers. The P510 features read and write speeds of up to 11,000/9,550 megabytes per second (MB/s), bringing blazing fast Gen 5 performance to the masses.

"With the exciting memory and storage offerings we're debuting today, Crucial's portfolio is now broader and stronger than ever before," said Dinesh Bahal, corporate vice president and general manager of Micron's Commercial Products Group. "These updates - from making fast Gen 5 SSDs available to the mainstream to launching high-density memory options - illustrate our commitment to driving innovation, performance and value for every consumer from casual gamers to creatives and students to hardcore enthusiasts."