Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces the remarkable overclocking achievement by Z890 AORUS TACHYON ICE motherboard with the latest Intel Core Ultra (Series 2) processor. Featuring Vcolor CUDIMM 24 GB x 2 modules, esteemed overclocker HiCookie has once again pushed the limits and set an astonishing record of DDR5-10600. This achievement reinforces GIGABYTE's commitment to providing cutting-edge technology for overclocking enthusiasts.

The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. Featuring the latest D5 Bionic Corsa, an AI-enhanced overclocking technology that seamlessly integrates software, hardware, and firmware, overclockers can now leverage AI technology to unlock groundbreaking DDR5 speeds with ease.
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XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has now expanded its product line and officially entered the field of workstations. Today XPG announced the launch of the first AICORE Overclocked DDR5 R-DIMM, with a maximum speed of 8,000 MT/s and a capacity of 32 GB, making challenging large-capacity workstation memory expansions a breeze. AICORE is built for improving overall system performance, process complex data, multi-tasking more quickly, and maximize the efficiency of AI computing.

Born for High-Speed Computing and AI Development
R-DIMM adopts a Register Clock Driver (RCD) and is characterized by high-speed, low-latency, and enhanced operational stability. AICORE Overclocked R-DIMM memory is designed for high speed and stability and is perfect for large-scale data processing, AI generation, 3D rendering and graphics, video post-production editing, and multitasking. AICORE is designed for securities markets that emphasize real-time data analysis and data science professionals or expert image creators to accelerate work efficiency and quickly complete various large-scale projects. AICORE Overclocked DDR5 R-DIMM memory has a maximum speed of 8,000 MT/s which is 1.6 times faster than standard R-DIMM memory, delivering more powerful performance to meet the rigorous speed requirements of high-end systems.

Team Group Industrial has officially introduced the industry's first industrial-grade DDR5 6400 MHz CU-DIMM/CSO-DIMM memory modules. The innovative product addresses challenges posed by high-frequency operation on signal stability by incorporating a specialized component known as the Client Clock Driver (CKD), which effectively buffers and drives clock signals, ensuring the signals remain stable and complete even under high-frequency conditions. This advancement sets a new benchmark in industrial storage technology, enhancing reliability and performance for demanding applications.

Team Group utilizes DDR5 Clocked Unbuffered Dual Inline Memory Module technology, which enables frequency and voltage adjustments based on system load and operating conditions, facilitating exceptional data transmission speeds and optimized power consumption performance, fully supporting the dynamic load requirements prevalent in industrial applications, and delivering solutions with outstanding performance and reliability.

Ahead of its launch, some of the first pictures of G.Skill Memory's Trident Z5 CK series DDR5 CUDIMMs leaked to the web. The "CK" brand extension is used to denote CUDIMMs, or DDR5 DIMMs with a client clock-driver (CKD) component. The CKD is a component that acts like a filter to the memory physical-layer digital waveform, "clearing up" the memory eyes at high memory clocks. This enables higher DDR5 speeds upward of 8000 MT/s, although CUDIMMs can also be found at speeds as low as 6400 MT/s. Intel considers DDR5-8000 the "sweetspot" memory speed for its Core Ultra "Arrow Lake-S" desktop processors, which means 8000 MT/s should be possible in Gear 2 mode, and future memory kits with speeds in excess of 10000 MT/s should be possible with Gear 4.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, is excited to introduce the all-new Z890A-SILVER motherboard designed for the latest Intel Core Ultra series-2 processors. Based on Intel Z890 single-chip architecture, this new SILVER series motherboard brings cutting-edge features, fine-tuned to deliver top-notch performance tailored for gamers, content creators, and casual users.

The BIOSTAR Z890A-SILVER motherboard supports up to 192 GB of DDR5 memory across 4 DIMM slots, providing exceptional bandwidth and enhanced performance for multitasking, which is ideal for high-performance computing setups. Furthermore, the Z890A-SILVER motherboard supports PCIe 5.0 M.2, delivering blazing-fast storage speeds for faster load times and overall system responsiveness. With 2.5 GbE LAN support, it ensures high-speed and stable network connectivity, while the inclusion of USB 3.2 Gen 2 Type-C provides versatile and fast data transfer options. The motherboard is also ready for Wi-Fi 7 and 6E modules (no Wi-Fi card included), allowing for the latest wireless connectivity standards.

SiFive, Inc., the gold standard for RISC-V computing, today announced the availability of its state-of-the-art HiFive Premier P550 development board. An initial pre-release batch of 100 Yocto Linux-based boards, called the "Early Access Edition," is available for purchase through Arrow Electronics. A broader release with Canonical Ubuntu 24.04 pre-installed is scheduled for December, providing developers with an unparalleled out-of-box experience.

"Since announcing the HiFive Premier P550 boards in April, we've worked closely with Canonical to deliver a best-in-class hardware and software experience," said Martyn Stroeve, Head of the HiFive board program at SiFive. "We know many developers are eager to get their hands on this powerful new board, so we decided to release a limited Early Access Edition. At the same time, we are finalizing the software stack for the December release, which we believe will deliver powerful performance and usability for developers. We're excited to see the innovation and creativity that will come from this."

Team Group Inc.'s gaming brand, T-FORCE, has launched two new color variants for its high-end XTREEM memory series: the T-FORCE XTREEM DDR5 in pink and the T-FORCE XTREEM ARGB DDR5 in snow white. T-FORCE is committed to delivering the ultimate performance experience for gamers. In addition to continuously enhancing technical specifications, the design is also innovative. These memory modules not only fully unleash the performance required by overclocking gamers but also introduce a new, stylish aesthetic, meeting both performance and fashion demands.

The T-FORCE XTREEM DDR5 now comes in a new diamond rose variant, featuring a sandblasted metal texture heat spreader adorned with the T-FORCE logo. It makes a stunning debut among the diverse range of memory options. Meanwhile, the T-FORCE XTREEM ARGB DDR5 launches in white, with a snow-white sandblasted heat spreader and dual light bars, carefully selected to showcase a multi-layered optical design. This creates an immersive soft white RGB aurora effect. The T-FORCE XTREEM series supports overclocking technology on both Intel and AMD platforms, offering one-click overclocking with dual-mode modules that fully unleash peak performance. While TEAMGROUP continues to develop high-spec products, it also remains attuned to market trends, offering a variety of vibrant design choices to provide the best memory solutions for gamers.

MSI, a leading global provider of high-performance server solutions, proudly announced it is showcasing new AI servers powered by the NVIDIA MGX platform—designed to address the increasing demand for scalable, energy-efficient AI workloads in modern data centers—at the OCP Global Summit 2024, booth A6. This collaboration highlights MSI's continued commitment to advancing server solutions, focusing on cutting-edge AI acceleration and high-performance computing (HPC).

The NVIDIA MGX platform offers a flexible architecture that enables MSI to deliver purpose-built solutions optimized for AI, HPC, and LLMs. By leveraging this platform, MSI's AI server solutions provide exceptional scalability, efficiency, and enhanced GPU density—key factors in meeting the growing computational demands of AI workloads. Tapping into MSI's engineering expertise and NVIDIA's advanced AI technologies, these AI servers based on the MGX architecture deliver unparalleled compute power, positioning data centers to maximize performance and power efficiency while paving the way for the future of AI-driven infrastructure.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces its first-ever CU-DIMM & CSO-DIMM memory modules, which work seamlessly with the latest Intel Core Ultra (Series 2) "Arrow Lake-S" Processors/ Z890 platform to unleash the true DDR5 performance. KLEVV's next-generation DDR5 memory lineup receives a substantial performance boost with the integration of advanced Client Clock Driver (CKD) technology. Incorporated via a small integrated circuit (IC) directly on the DIMM, CKD IC enhances the module's speed and efficiency for both desktop and laptop applications. By regenerating the memory chips' clock signal, it improves stability, supports higher operating frequencies, and minimizes electrical interference and signal degradation—pushing the boundaries of memory performance.

Designed for both performance desktop and laptop systems, KLEVV's new Standard CU-DIMM and CSO-DIMM memory modules combine the brand's renowned quality with cutting-edge DDR5 technology, making them ideal for both casual and professional users. Leveraging the innovative CKD architecture, these modules deliver exceptional stability and reliability, even at high speeds, effectively mitigating electrical interference that could otherwise hinder performance. With this advanced design, users can count on smooth, efficient operation, even under heavy workloads.

MSI, a leading global provider of high-performance server solutions, is excited to showcase its comprehensive lineup of motherboards and servers based on the OCP Modular Hardware System (DC-MHS) architecture at the OCP Global Summit from October 15-17 at booth A6. These cutting-edge solutions represent a breakthrough in server designs, enabling flexible deployments for cloud and high-density data centers. Featured innovations include CXL memory expansion servers and AI-optimized servers, demonstrating MSI's leadership in pushing the boundaries of AI performance and computing power.

DC-MHS Series Motherboards and Servers: Enabling Flexible Deployment in Data Centers
"The rapidly evolving IT landscape requires cloud service providers, large-scale data center operators, and enterprises to handle expanding workloads and future growth with more flexible and powerful infrastructure. MSI's new rage of DC-MHS-based solutions provides the needed flexibility and efficiency for modern data center environments," said Danny Hsu, General Manager of Enterprise Platform Solutions.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced upcoming raw card designs currently in development in JEDEC's JC-45 Committee for DRAM Modules in collaboration with the JC-40 and JC-42 Committees. These raw card memory device standards are intended for use in client computing applications such as laptops and desktops and will be supported by related appendix specifications. The forthcoming raw cards will also complement two DDR5 Clock Driver standards published earlier this year: JESD323: DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common Specification and JESD324: DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Common Specification.

Integrating a Clock Driver (CKD) into a DDR5 DIMM provides numerous advantages, particularly in memory stability and performance, and enhances signal integrity and reliability at high speeds. By regenerating the clock signal locally on the DIMM, a CKD ensures stable operation even at elevated clock speeds. With a DDR5 CKD, DIMM data rates can be increased from 6400 Mbps to 7200 Mbps in the initial version of the standard, and targeting up to 9200 Mbps in future versions.

Micron Technology, Inc., today announced the availability of a brand-new category of clock driver memory with the launch of its Crucial DDR5 clocked unbuffered dual inline memory modules (CUDIMM) and clocked small outline dual memory modules (CSODIMM), which are now shipping in volume. The JEDEC-standard solutions run at speeds up to 6,400 MT/s (megatransfers per second), more than twice as fast as DDR4 and 15% faster than traditional non-clock-driver-based DDR5. Designed to provide more speed stability, faster downloads and better refresh rates, these solutions represent a completely new frontier of memory form factors for next-generation PCs. Micron's CUDIMM and CSODIMM solutions are the industry's first commercially available JEDEC-standard DDR5 CUDIMM and CSODIMM solutions to hit the market since JEDEC standardized the specification earlier this year.

In addition, Intel has validated Micron DDR5 CUDIMM and CSODIMM solutions up to capacities of 64 gigabytes (GB) for use with its Intel Core Ultra processors (Series 2), which were launched last week on Oct. 10.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today unveiled industry-first, complete memory interface chipsets for Gen 5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs). These innovative new products for RDIMMs and MRDIMMs will seamlessly extend DDR5 performance with unparalleled bandwidth and memory capacity for compute-intensive data center and AI workloads.

"The voracious memory demands of AI and HPC require the relentless pursuit of higher performance through continued innovation and technology leadership," said Sean Fan, chief operating officer at Rambus. "With our 30-plus years of renowned high-speed signal integrity and memory system expertise, the Rambus Gen5 RCD, and next-generation MRCD, MDB, and PMIC will be critical enabling chips in future-generation servers leveraging DDR5 RDIMM 8000 and MRDIMM 12800."

AMD has unveiled its latest EPYC processors, codenamed "Turin," featuring Zen 5 and Zen 5C dense cores. Phoronix's thorough testing reveals remarkable advancements in performance, efficiency, and value. The new lineup includes the EPYC 9575F (64-core), EPYC 9755 (128-core), and EPYC 9965 (192-core) models, all showing impressive capabilities across various server and HPC workloads. In benchmarks, a dual-socket configuration of the 128-core EPYC 9755 Turin outperformed Intel's dual Xeon "Granite Rapids" 6980P setup with MRDIMM-8800 by 40% in the geometric mean of all tests. Surprisingly, even a single EPYC 9755 or EPYC 9965 matched the dual Xeon 6980P in expanded tests with regular DDR5-6400. Within AMD's lineup, the EPYC 9755 showed a 1.55x performance increase over its predecessor, the 96-core EPYC 9654 "Genoa". The EPYC 9965 surpassed the dual EPYC 9754 "Bergamo" by 45%.

These gains come with improved efficiency. While power consumption increased moderately, performance improvements resulted in better overall efficiency. For example, the EPYC 9965 used 32% more power than the EPYC 9654 but delivered 1.55x the performance. Power consumption remains competitive: the EPYC 9965 averaged 275 Watts (peak 461 Watts), the EPYC 9755 averaged 324 Watts (peak 500 Watts), while Intel's Xeon 6980P averaged 322 Watts (peak 547 Watts). AMD's pricing strategy adds to the appeal. The 192-core model is priced at $14,813, compared to Intel's 128-core CPU at $17,800. This competitive pricing, combined with superior performance per dollar and watt, has resonated with hyperscalers. Estimates suggest 50-60% of hyperscale deployments now use AMD processors.

As a global leader in memory solutions, Team Group Inc. today unveiled its latest T-Force CKD (Client Clock Driver) DDR5 Gaming Memory. Following the worldwide attention received for the 7200 MHz T-CREATE EXPERT Ai CKD DDR5 showcased at COMPUTEX 2024, the T-Force gaming brand takes performance to new heights with the upcoming T-Force XTREEM CKD DDR5 8200 to 9000 (Gear 2) 2x24GB, featuring overclocking capabilities reaching up to 9600 MHz (Gear 4). Consumers can now push the limits of CUDIMM overclocking on the Intel Z890 platform with next-generation CKD DDR5 overclocking memory, achieving unprecedented performance breakthroughs.

Team Group continues to lead the industry in pushing boundaries by crafting the T-Force XTREEM CKD DDR5, which breaks beyond JEDEC frequency specifications. Utilizing CKD components and Intel XMP profiles on the Intel Z890 motherboard, users can effortlessly overclock to DDR5 speeds beyond 9000 MHz with a single click. Unlike JEDEC-compliant memory modules, the T-Force XTREEM CKD DDR5 leverages CKD components to enhance and buffer high-frequency signals from the CPU, ensuring more stable signal transmission to the memory modules. This enables DDR5 to push overclocking performance to even higher frequencies, surpassing traditional U-DIMM overclocking limitations.

AMD (NASDAQ: AMD) today announced the availability of the 5th Gen AMD EPYC processors, formerly codenamed "Turin," the world's best server CPU for enterprise, AI and cloud. Using the "Zen 5" core architecture, compatible with the broadly deployed SP5 platform and offering a broad range of core counts spanning from 8 to 192, the AMD EPYC 9005 Series processors extend the record-breaking performance and energy efficiency of the previous generations with the top of stack 192 core CPU delivering up to 2.7X the performance compared to the competition.

New to the AMD EPYC 9005 Series CPUs is the 64 core AMD EPYC 9575F, tailor made for GPU powered AI solutions that need the ultimate in host CPU capabilities. Boosting up to 5 GHz, compared to the 3.8 GHz processor of the competition, it provides up to 28% faster processing needed to keep GPUs fed with data for demanding AI workloads.

The world's leading brand for memory modules and flash memory and long-term Intel partner, ADATA Technology and its gaming brand XPG (Xtreme Performance Gear) today announced the launch of new DDR5 CUDIMM memory, including XPG LANCER RGB DDR5 CUDIMM gaming memory and ADATA DDR5 CUDIMM memory, supporting the latest Intel Core Ultra Desktop Processor (Series 2) and providing a variety of options that satisfy the needs of extreme gamers and general users.

DDR5 CUDIMM features a base clock speed starting at 6,400MT/s and is equipped with a key CKD (Clock Driver) component which ensures stable operation at high frequencies. It is compatible with existing Intel Core Desktop Processors and memory speed can easily top 9,000MT/s when overclocked on a Z890 motherboard. This DDR5 CUDIMM is expected to be a powerful next-generation DDR5 memory, greatly improving the processing efficiency and stability of desktop platforms.

ASRock has unveiled a full lineup of Z890 motherboards, led by the new Taichi series flagship models. This series offers a powerful mix of options for extreme enthusiasts, including the ASRock Z890 Taichi AQUA, Taichi OCF, Taichi, and Taichi Lite. Other ASRock Z890 motherboards include the gaming-focused Phantom Gaming series, featuring the Nova, Riptide, and Lightning models, as well as the popular Steel Legend, LiveMixer, and Pro series for mainstream users. The new Z890 motherboards support the latest Intel Core Ultra 200 series processors, offering more high-speed expansion such as PCI-Express 5.0 support for a graphics card, as well as M.2 SSD, and more importantly up to two Thunderbolt 4 ports for all Z890 motherboards.

The New Era of Taichi
The white-styled ASRock Z890 Taichi AQUA introduces a unique hybrid thermal design developed in collaboration with Alphacool, which combines air and water cooling for the VRM and M.2 block. The Z890 Taichi AQUA also features the first detachable M.2 water block for Gen-5 SSDs, simplifying and streamlining installation.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and HiFi audio products, introduces its lineup of Intel Z890 motherboards to the newly launched Intel Core Ultra 200 Series processors. The new Intel Z890 motherboards feature several technological improvement including 40 Gbps USB4 connectivity, Wi-Fi 7, and higher DDR5 memory support among others. Upon launch, COLORFUL presents seven Z890 motherboards designed to cater a wide range of users from casual desktop users to more demanding users such as gamers and content creators.

For high-end PC builders, COLORFUL introduces the iGame Z890 VULCAN X/W, iGame Z890 FLOW and iGame Z890 ULTRA motherboards. The iGame Z890 VULCAN X/W is the flagship motherboard, packed with premium features designed to deliver performance and aesthetics - available in black and white models. For mainstream users, the CVN Z890 ARK FROZEN, CVN Z890M GAMING FROZEN and BATTLE-AX Z890M-PLUS motherboard offer a great balance of features and latest technologies.

In the past 13 years, global data production has surged, increasing an estimated 74 times. (1) Looking forward, McKinsey projects AI to spur 35% annual growth in enterprise SSD capacity demand, from 181 Exabytes (EB) in 2024 to 1,078EB in 2030. (2) To address this growing demand, ScaleFlux, a leader in data storage and memory technology, is announcing a significant expansion of its product portfolio. The company is introducing cutting-edge controllers for both NVMe SSDs and Compute Express Link (CXL) modules, reinforcing its leadership in innovative technology for the data pipeline. "With the release of three new ASIC controllers and key updates to its existing lineup, ScaleFlux continues to push the boundaries of SSD and memory performance, power efficiency, and data integrity," points out Hao Zhong, CEO and Co-Founder of the company.

Three New SoC Controllers to Transform Data Center Storage
ScaleFlux is proud to unveil three new SoC controllers designed to enhance data center, AI and enterprise infrastructure:

TrendForce's latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.

Smartphone brands continue to remain cautious despite some server OEMs continuing to show purchasing momentum. Consequently, TrendForce forecasts that Q4 memory prices will see a significant slowdown in growth, with conventional DRAM expected to increase by only 0-5%. However, benefiting from the rising share of HBM, the average price of overall DRAM is projected to rise 8-13%—a marked deceleration compared to the previous quarter.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its revolutionary Z890 motherboards. These next-generation motherboards are set to redefine the standards in performance, AI integration, and user experience for enthusiasts and professionals alike. Powered by state-of-the-art artificial intelligence, these motherboards push the boundaries of what's possible in computing.⁠

Infinite Memory Performance
GIGABYTE Z890 lineup equips the D5 Bionic Corsa technology to create phenomenal new peaks in memory performance to DDR5 XMP 9500 and above. A true marvel of AI-enhanced overclocking technology for DDR5 memory, D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards. The AORUS AI SNATCH is an auto-overclocking software by AI model, and enables users to unleash utmost performance with one-click activation. The AI SNATCH Engine is the AI model served as the core of AORUS AI SNATCH software, trained by AI TOP on diverse overclocking datasets to improve precision and optimize performance with stability. The AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups, while the Hypertune BIOS uses AI to optimize MRC and adapt to signals for peak efficiency, significant memory clock boost, and enhanced overall performance.

Intel's Arrow Lake-S launch line-up has been confirmed courtesy of serial leaker @9550pro on X/Twitter and although the leaked Intel product slide doesn't contain any real surprises by now, it does confirm that Intel will launch five different SKUs later this month. The Core 200S-series should be unveiled on Thursday by Intel, but retail availability isn't expected until the 24th of October. The Initial five CPU SKUs will be the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF and finally the Core Ultra 5 245K and 245KF. As noted earlier today in the performance leak of the Core Ultra 9 285K, the entire Arrow Lake-S series will lack Hyper-Threading in favour of more E-cores. The Core Ultra 9 285K features eight Lion Cove P-cores and 16 Skymont E-cores, followed by the Core Ultra 7 265 SKUs which retain the Lion Cove core count, but ends up with only 12 Skymont cores. Finally, the Core Ultra 5 SKUs have six Lion Cove P-cores and eight Skymont E-cores. All the upcoming SKUs feature Intel's Thermal Velocity Boost, a feature that used to be exclusive to the Core i9 tier of CPUs in the past, but only the Core Ultra 9 and Ultra 7 SKUs support Intel Turbo Boost Max Technology 3.0. The Core Ultra 9 and Ultra 7 SKUs have a maximum TDP of 250 W, with the Core Ultra 5 SKUs peaking at 159 W. All five processors have a base power of 125 W.

As such, we're looking at boost speeds of up to 5.7 GHz for the Core Ultra 9, 5.5 GHz for the Core Ultra 7 and 5.2 GHz for the Core Ultra 5 processors. The Core Ultra 5 has the highest base frequency of the three SKUs with the P-cores clocking in at 4.2 GHz and the E-cores at 3.6 GHz. The Core Ultra 7 follows at 3.9 GHz for the P-Cores and 3.3 GHz for the E-cores and finally the Core Ultra 9 has a base frequency of 3.7 GHz for the P-Cores and 3.2 GHz for the E-cores. Intel has upped the JEDEC memory support to DDR5-6400, which is an 800 MHz jump in the officially supported memory speed from its 14th Gen Core i processors. Up to 192 GB of RAM is supported, which is the same as the previous generation of desktop CPUs from Intel. The IGP sports four Xe-cores across the board of the K SKU CPUs, with a base clock of 300 MHz and a boost clock of up to 2 GHz, although the Core Ultra 5 SKUs end up with an IGP that only boosts to 1.9 GHz. All SKUs also feature a third generation NPU capable of 13 TOPS, which is a lot weaker than the mobile Core Ultra 200V Lunar Lake CPUs which have an NPU capable of up to 48 TOPS, depending on the SKU. As this leak appears to be from the same original source as the performance figures that leaked earlier, we'd assume the information is correct, especially as it lines up with earlier leaks, but it should still be taken with a pinch of salt until everything has been confirmed by Intel.

It's finally here! ASUSTOR NAS devices with AMD Ryzen CPUs have finally launched! With four to ten drive bays; the Lockerstor Gen3 series arrives with both flexibility and performance. The Lockerstor Gen3 series is designed for extreme performance while maintaining extreme efficiency. In a first for ASUSTOR, the Lockerstor Gen3 features a Quad-Core AMD Ryzen Embedded SoC that boosts to 3.8 GHz. Take advantage of four to ten drive bays, and four M.2 slots for NVMe SSDs that use PCIe 4.0, dual 10GbE, dual 5GbE, and dual USB4. 16 GB of ECC DDR5-4800 memory that's expandable to 64 GB. This combination of powerful hardware is not only faster, but sets the new performance standard.

The AMD Ryzen V3C14 SoC is built on a 6 nm process for maximum performance and efficiency. At a 25 W maximum TDP, it achieves energy savings even when crunching high-performance tasks. All Lockerstor Gen3 devices are equipped with dual 10GbE and dual 5GbE network ports, with single-port 10 GbE read/write speeds reaching up to 1176 MB/s and 1018 MB/s, while SMB multi-channel performance using RAID 5 can reach up to 2005 MB/s and 1090 MB/s respectively.

High-resolution die-shots of the AMD "Zen 5" 8-core CCD were released and annotated by Nemez, Fitzchens Fitz, and HighYieldYT. These provide a detailed view of how the silicon and its various components appear, particularly the new "Zen 5" CPU core with its 512-bit FPU. The "Granite Ridge" package looks similar to "Raphael," with up to two 8-core CPU complex dies (CCDs) depending on the processor model, and a centrally located client I/O die (cIOD). This cIOD is carried over from "Raphael," which minimizes product development costs for AMD at least for the uncore portion of the processor. The "Zen 5" CCD is built on the TSMC N4P (4 nm) foundry node.

The "Granite Ridge" package sees the up to two "Zen 5" CCDs snuck up closer to each other than the "Zen 4" CCDs on "Raphael." In the picture above, you can see the pad of the absent CCD behind the solder mask of the fiberglass substrate, close to the present CCD. The CCD contains 8 full-sized "Zen 5" CPU cores, each with 1 MB of L2 cache, and a centrally located 32 MB L3 cache that's shared among all eight cores. The only other components are an SMU (system management unit), and the Infinity Fabric over Package (IFoP) PHYs, which connect the CCD to the cIOD.