Patriot Memory brought its full lineup of new memory and storage products to the Computex 2025 show in Taipei, and as the company is celebrating 40 years of innovation, it also showcased its special Xtreme 5 - 40th Anniversary Limited Edition DDR5 memory, and new storage products, like the PDP31 portable SSD and the Viper EV330 SSD enclosure.

Patriot Memory brought its full lineup of DDR5 memory modules and kits, including the Patriot Signature Line, Viper Venom RGB and non-RGB, Viper Elite 5 Ultra in RGB TUF Gaming Alliance or non-RGB versions, as well as its high-end Viper Xtreme 5 lineup, that comes in RGB, RGB MPOWER, non-RGB, CKD RGB and non-RGB versions. Plus the special 40th Anniversary Limited Edition kits, with capacities of up to 48 GB and speeds of up to 8,000 MT/s. The Viper Xtreme 5 CKD memory will be available in various modules and kits, reaching speeds of up to 9,600 MT/s. Patriot also showcased a couple of CKD CSODIMMs, that come in kits of up 32 GB and reach speeds of up to 7,200 MT/s.

Tiny PC maker Minisforum was showing off its upcoming N5 Pro NAS at Computex, and it's quite different from what most NAS makers have put out to date. For starters, it's built around AMD's Ryzen AI 9 HX Pro 370 SoC and has support for up to 96 GB of ECC DDR5 5600 MHz memory over two SO-DIMM slots. Connectivity consists of one 10 Gbps and one 5 Gbps Ethernet port, two USB4 ports—with DP Alt mode support—one HDMI 2.1 port, two USB 3.2 10 Gbps ports and one USB 2.0 port. For some reason the Oculink port, clearly visible around the back of the unit on display, isn't mentioned in the specs we were provided, but it's still mentioned on the product page, so we'll have to wait and see if that will be part of the final product or not.

On the storage side of things there's room for five 3.5-inch or 2.5-inch drives in traditional drive caddies, and drives up to 22 TB in size are supported. In addition to this, there's room for one M.2 NVMe slot which is limited to PCIe 4.0 X1, lengths of up to 110 mm are supported. There is also an extra PCB that can be slotted in that adds support for a further two NVMe drives in either the U.2 or M.2 form factor, one with a PCIe 4.0 x2 interface and one with PCIe 4.0 x1. Judging by the design of this expansion PCB, it might be a bit fiddly to install, but as the main PCB of the N5 Pro slides out for access, it could've been far worse. Internally there's also a full-length low-profile PCIe x16 slot—which was occupied by a GPU in the unit on display—although it's limited to four lanes electrically, as well as a USB 3.2 10 Gbps port. It will apparently come with MinisCloud OS, but Windows 11 is also supported, which means the N5 Pro could be used for something else than just as a NAS. No word on pricing, but the company is offering a 30 percent off discount if you sign up on their website.

This year at Computex, Apacer was showing off several new DDR5 memory modules and storage products. First up is its NOX RGB DDR5 CUDIMM which delivers a base speed of 8000 MT/s, but according to the company, can be overclocked to 9000 MT/s and there's also a non RGB version. Next up we have the Shield RGB DDR5 modules, which appears to want to take on Corsair's Dominator modules, at least design vise and these are also available without RGB. There was no mention of any speeds for these modules and as they'll only be available later this year, there's no information on the Apacer website either. Finally, Apacer has entered into a partnership with ASUS to produce TUF co-branded memory and was showing off the new NOX TUF RGB DDR5 modules. The already available non RGB version is available in speeds from 5200 MT/s to 6800 MT/s.

On the storage side, Apacer had a new external USB4 Gen 3x2—otherwise known as 40 Gbps—SSD, which is based on the Phison U21 controller. The AS741 as the drive is called, will be available in sizes from 1 TB to 4 TB and it should offer sequential read speeds of up to 4000 MB/s and sequential write speeds of up to 3600 MB/s. It also has an integrated cable/handle, which is the blue part in the picture, but we're not sure how it really is intended to work. Apacer also had a new PCIe 5.0 x4 M.2 NVMe SSD that goes under the name of AS2280F4U, which is based on Silicon Motion SM2508 controller and it should offer read speeds of up to 14000 MB/s and write speeds of 13000 MB/s. It will come in sizes between 1 TB and 4 TB and the heatsink has a rather tiny fan built into it. Both of the SSDs will be available later this year.

darkFlash offers a variety of keyboards and mice designed for gaming and office use, featuring mechanical switches, wireless connectivity, and customizable options. The PXD98 mechanical keyboard is based on the best-selling GD series, featuring a small display that can show custom animations, wireless connectivity, and sound-dampening foam. The EZ68 is a compact 65% magnetic switch gaming keyboard with fully adjustable actuation points, an 8000 Hz polling rate, and RGB backlighting.

darkFlash showcased the DFM80 Series, an ultra-light gaming mouse weighing just 48 g, equipped with the PAW3395 optical sensor supporting up to 26,000 DPI. The Flow 3 vertical mouse, designed for creatives looking for more ergonomic options, was also on display in a wide range of colors.

ADATA's XPG sub-brand is best known for producing gaming hardware, but Project INFINITY signals a significant diversification. Two demonstration sample DDR5 UDIMMs were mounted on an open plan build, at the company's Computex booth. Despite bearing XPG branding and gaming-oriented aesthetics, these memory modules are not wholly related to a freshly presented Lancer Neon DDR5 product line. Instead, ADATA has deemed Project INFINITY worthy of inclusion in their "AI Revolution" portfolio.

Impressive credentials are outlined in PR material: "XPG pushes overclocking to new heights with memory solutions that blend extreme performance, bold design, and sustainable materials. Project INFINITY delivers up to 9200 MT/s with 48 GB capacity per module, featuring RGB lighting and an infinity mirror heatsink for a stunning visual effect. For professional workloads." According to an accompanying placard, XPG's bare build utilizes an ultra-expensive ASUS ROG Maximus Z890 Hero mainboard foundation. Intel's Arrow Lake-S flagship CPU—Core Ultra 9 285K—drives the Project INFINITY-centric PC system. Appropriately, the XPG team has selected an ADATA Mars 980 BLADE Gen 5 M.2 SSD, for ultra-fast storage purposes. Hopefully, additional/refined Project INFINITY examples will turn up in the near future.

Thermaltake has its TOUGHRAM XG RGB D5 memory kits up on display here at Computex 2025 with new Bubble Pink versions and speeds of 7200 MT/s. These will complement an already extensive range of DDR5 memory modules, such as the Black & White 16 GB x 2 kits with speeds up to 8000 MT/s and the Future Dusk, Bubble Pink, and Mocha Mousse 16 GB x 2 kits @ 6000 MT/s. If you didn't know already, the TOUGHRAM XG RGB D5 memory kits from Thermaltake feature support for Intel XMP 3.0 / AMD EXPO performance profile, 10-layer PCB with 2oz copper inner layer, 10μ gold contacts, CKD (Client Clock Driver) alongside their aluminium heatsink and 16 RGB LEDs.

GIGABYTE has just rolled out its refreshed Z890 AORUS Tachyon ICE CAMM2 motherboard, designed to give overclockers and power users a serious edge. The biggest change is support for CAMM2 DDR5 memory modules, which offer cleaner signaling and much higher speeds compared to traditional DIMMs. At first glance, the new board looks a lot like the previous Tachyon ICE model. It still features the distinctive 90-degree rotated CPU socket and top-mounted memory slots. But instead of multiple DIMM slots, you now get a single CAMM2 connector. That slot comes with a toolless heatsink for better cooling—no fiddly screws required, just snap it on and you're ready to push your memory harder. If you're into extreme memory overclocking, the original Z890 AORUS Tachyon ICE recently set a world record at DDR5-12752 thanks to GIGABYTE's in-house expert, HiCookie, using V-Color's Manta Xfinity RGB modules. That achievement shows just how far this platform can be pushed. We recently reported on G.Skill offering a DDR5-10000, 64 GB of density (2-channels or 4 sub-channels), and timings of CL56-70-70 in CAMM2 form factor. That might be interesting to keep an eye on in the future, as it is definitely a new possible world-record contender.

In addition to new graphics cards, ASRock also showcased a couple of new motherboards at the Computex 2025 show in Taipei, including the new X870E Taichi OCF, X870 Taichi Creator, as well as the new Phantom Gaming X870 Nova Wi-Fi motherboard.

The star of the show is the new X870E Taichi OCF, which is also the first OC Formula motherboard based on AMD platform. This feature packed motherboard will support AMD Ryzen 9000, 8000, and 7000 series processors on AM5 socket. It features a 25-power phase VRM with 110A SPS, has two DDR5 DIMM slots, two PCIe 5.0 x16 and single PCIe 4.0 x4 slot, a total of six M.2 ports (two of which are PCIe Gen 5 x4), plenty of USB ports, 5 Gbps Ethernet, integrated Wi-Fi 7 and Bluetooth, and most importantly, "Professional Overclocking Toolkit", which means that this one is aimed at some high overclocking. ASRock also showcased the new X870 Taichi Creator, a more standard motherboard that has 21-phase VRM design, but comes with Marvell's 5 Gbps and 10 Gbps Ethernet ports.

G.Skill Memory at the 2025 Computex introduced its latest, high-performance gaming PC memory. We begin our tour with the new Trident Z5 NeoX RGB memory kit that ticks at a whopping DDR5-10600, with timings of CL58-63-63, and comes in densities of 24 GB per module. As a "Neo" branded kit from G.Skill, it comes with an EXPO profile for this speed, but which engages a UClk:MClk divider. G.Skill showed us the proof of its pudding on a machine powered by a Ryzen 5 8500G "Phoenix 2" processor, with a memory speed of 5300 MHz (DDR5-10600), timings of 62-63-63-126, and memory voltage of 1.4 V, in what is one of the highest memory overclocks for the AMD platform.

Next up, is possibly the world's fastest CAMM2 module, offering speeds of DDR5-10000 and 64 GB of density (2-channels or 4 sub-channels), and timings of CL56-70-70. A CAMM2 module is a dual-channel memory module designed to minimize vertical PCB footprint next to the CPU socket, which should benefit enthusiasts and overclockers. The speed was validated on a machine powered by a Core Ultra 9 285K processor. Winding things up is the white Trident Z5 NeoX RGB which ticks at DDR5-10747, with CL68-128-128, and validated on an Intel 285K platform. The Trident Z5 NeoX RGB comes in three bright colors of white, orange and fluorescent green.

AMD at Computex 2025 announced the Ryzen Threadripper PRO 9000 series processors targeting high-end desktops (HEDT) and workstations. These processors are codenamed "Shimada Peak," and are based on the "Zen 5" microarchitecture. "Shimada Peak" is a variation of the EPYC "Turin" MCM, designed for Socket TR5, with slightly modified I/O. The chip puts out up to 128 PCIe Gen 5 lanes but lacks CXL capability on these lanes, and the memory I/O is set to 8-channel DDR5 (16 sub-channels), down from 12-channel DDR5 on "Turin" (24 sub-channels).

The top SKU, the Ryzen Threadripper PRO 9995WX, comes with a 96-core/192-thread configuration, a 128-lane PCIe Gen 5 I/O, and an 8-channel DDR5 memory interface. The chip comes with a maximum boost frequency of 5.40 GHz, and a total of 384 MB of L3 cache (12x 32 MB). AMD claims a significant 10-20% gain in Cinebench 2024 nT performance over the previous generation 7995WX "Zen 4" processor, and nearly 220% gain over the Intel Xeon W9-3595X processor. Across a wide segment of media, design, architecture, science, and LLM inferencing use-cases, the 9995WX is shown posting performance leads ranging anywhere from 44% to 145% over the W9-3595X. The Threadripper PRO 9000 series will be an OEM-exclusive launch through workstation partners such as Lenovo.

Patriot Memory, a global leader in high-performance memory, storage, and gaming-grade hardware, returns to COMPUTEX 2025 with a powerful lineup of next-generation innovations. The company will unveil record-breaking DRAM speeds and the world's first DRAM-less PCIe Gen 5 SSD, alongside intelligent storage accessories designed for today's mobile lifestyles. In parallel, ACPI, Patriot's industrial brand, will debut robust enterprise and edge AI solutions—further reinforcing Patriot's leadership in performance and reliability across global markets.

Viper Xtreme 5 CKD RGB & Non-RGB High-Performance DRAM
The Viper Xtreme 5 CKD RGB and Non-RGB modules deliver ultra-high data rates of up to 9600 MT/s. Featuring an integrated Client Clock Driver (CKD) for independent signal timing, these modules maintain exceptional stability during extreme overclocking—without relying on the CPU's internal clock. It's a breakthrough solution designed for hardcore performance enthusiasts and overclockers.

According to a Financial Times (FT) news article, the US Government's Bureau of Industry and Security (BIS) is considering an implementation of additional "export blacklist" entries. Roughly two months ago, a significant update affected the export trade of around eighty Chinese business "entities." Despite a recent "cooling off" of elevated tariff-related activities, significant political tensions still exist between the two powerhouse nations. According to five of FT's unnamed insiders, ChangXin Memory Technologies (CXMT)—a rising star within China's growing memory manufacturing industry—is a potential candidate for "banishment." Semiconductor Manufacturing International Corp (SMIC), and Yangtze Memory Technologies Co. are (allegedly) already categorized as blacklisted organizations.

Apparently, the nation's most prominent chipmaker and memory module producer (respectively) have managed to sidestep certain restrictions, via offshoot avenues. FT believes that the US administration is actively investigating several of these subsidiaries. CXMT seems to be an independent body, with no military connections—specializing in commercial DDR5 and DDR4 products—but its rising profile has attracted international attention. Around March 2024, Bloomberg heard rumors about the US BIS department's "weighing up" of sanctions, with CXMT in mind. The relatively young DRAM manufacturer (established back in 2016) still trails behind South Korean and Western competitors, in terms of technological advancements—but its initial DDR5 efforts have (supposedly) impressed local evaluators and early adopters.

Silicon Power (SP) is excited to announce the launch of two new high-performance DDR5 memory modules under its acclaimed XPOWER gaming series: the XPOWER Cyclone DDR5 RGB CUDIMM and XPOWER Cyclone DDR5 RGB UDIMM. Leading with top-tier speeds up to 9200 MT/s, the company's first CUDIMM (Clocked Unbuffered DIMM) is a major milestone in its commitment to next-gen memory innovation tailored for elite gamers, overclockers, and PC enthusiasts.

CUDIMM: Power Meets Precision
The XPOWER Cyclone DDR5 RGB CUDIMM combines ultra-fast speeds, robust stability, and compatibility with cutting-edge platforms. With extreme speeds ranging from 8200 MT/s to 9200 MT/s the CUDIMM is purpose-built for gamers and overclockers who demand peak performance. Engineered with a built-in Clock Driver (CKD), this module delivers enhanced signal integrity and tighter timing control—key factors for maintaining system stability during demanding workloads. Full support for the latest Intel Core Ultra desktop processors (Series 2) and Intel Z890 series platforms ensures a seamless experience for users building or upgrading to next-gen systems.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs.

These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients.

AMD is preparing to set a new data-center performance bar with its upcoming 6th-generation EPYC "Venice" processors, built on the latest "Zen 6" and "Zen 6C" core designs and the industry's first 2 nm-class node from TSMC. Leaked engineering diagrams and forum reports suggest Venice will offer additional core scalability, memory capacity, and cache productivity for demanding server workloads. At the heart of the Venice platform lies a multi-chip module design featuring up to eight Core Complex Dies (CCDs) arrayed around one or more central I/O dies (IODs). In its Zen 6 configuration, each CCD houses 12 "classic" cores, yielding a maximum of 96 cores and 192 threads per socket. The cache per CCD is rumored to reach 128 MB of shared L3, double that of its predecessor, delivering up to 1 TB of L3 cache in a fully populated eight-CCD package.

For customers prioritizing raw thread count over per-core performance, the Zen 6C variant pushes the envelope to 256 "dense" cores and 512 threads by leveraging a leaner core design and higher CCD count. Despite the density boost, each Zen 6C core maintains 2 MB of L3 cache, preserving latency benefits even at scale. Memory bandwidth also receives a major uplift: Venice will support both 16-channel (SP7) and 12-channel (SP8) DDR5 configurations, accommodating up to 6 TB of system RAM per socket. The number of PCIe Gen 5 lanes is still unknown, but it could be well over 128 lanes, which the past 5th-generation EPYC CPUs had. Thermal and power targets differentiate the two sockets: SP7 models are expected to reach TDPs around 600 W, up from 400 W on current Zen 5 chips, while SP8 parts aim for 350-400 W to suit more moderate-density racks. This tiered approach will let hyperscalers and enterprise customers balance performance, efficiency, and cooling infrastructure, especially at the scale that hyperscalers have. A projected launch date is scheduled for late 2025 or early 2026.

Biwin, a global leader in storage and memory solutions, announces its participation in Computex 2025, held in the Taipei Nangang Exhibition Center from May 20th to 23rd. In Hall 1, Booth #J1028, Biwin will showcase its latest products setting new benchmarks for speed, reliability, and performance in the consumer storage market. Visitors to the booth will see cutting-edge custom PC builds equipped with Biwin storage products and hands-on live product demos. With the theme "Built to Win," Biwin's booth will feature a wide array of innovative storage products designed for work, play and mobility-- with top-of-the-range Biwin Black Opal SSDs and DRAM modules sure to satisfy even the most competitive gamers, modders and overclockers.

FEATURED PRODUCTS FROM BIWIN AT COMPUTEX 2025
Black Opal X570 PRO & X570
Biwin Black Opal X570 PRO and X570 harness the power of PCIe Gen5x4 to deliver groundbreaking speeds, setting a new benchmark for high-performance storage. The X570 PRO delivers read speeds up to 14000 MB/s and write speeds up to 13000 MB/s. With a 6 nm controller and 8-channel architecture, it maximizes data throughput while maintaining exceptional power efficiency. Featuring up to 4 GB DRAM cache, it reaches 2000K IOPS random read speeds for faster high-load scenarios. While the X570 delivers impressive read speeds up to 14500 MB/s in an efficient, DRAM-less design. By leveraging Host Memory Buffer (HMB) and dynamic SLC cache, it enables faster application launches, quicker game loading, and smoother file transfers.

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading computer brand, continues to redefine DIY PC building with its innovative Project STEALTH, first introduced in 2022. The Project STEALTH concept was the industry's pioneer in adopting reverse-connector motherboards for a cleaner, more streamlined assembly. Now, responding to the growing demand for all-white and cableless PC builds, GIGABYTE launches the STEALTH ICE Series, featuring the AMD X870 and B850 chipset motherboards.

Beyond aesthetics and easier assembly, GIGABYTE ensures that the Project STEALTH build is highly compatible. In addition to supporting its own chassis lineup (GIGABYTE C500P STEALTH Series), GIGABYTE has partnered with over 10 renowned case manufacturers, including Corsair, Cooler Master, Fractal Design, Phanteks, and more, to provide reverse-connector-ready cases across more than 25 models. This makes the GIGABYTE Project STEALTH Series the most compatible, the most widely supported and flexible solution in the market for cableless PC builds.

ADATA Technology Co., Ltd., a leading global memory brand, and its gaming brand XPG, have once again been honored with the prestigious Red Dot Design Award, widely recognized as the "Oscars of the design world." The award is internationally renowned for its evaluation of innovative design, ergonomics, and solutions. This recognition once again highlights the ADATA Group's profound R&D capabilities and human-centric innovative thinking.

The award-winning products include: the ADATA LEGEND 970 PRO PCIe Gen 5 SSD designed for creators, the XPG LANCER CUDIMM RGB DDR5 gaming memory that significantly enhances AI generation and deep learning, the XPG LANCER NEON RGB DDR5 gaming memory as the first to embody ESG concepts, and the innovatively designed XPG HURRICANE MAG magnetic fan. The Group continues to bring more groundbreaking products to consumers and gamers by combining cutting-edge technology with user-oriented design.

V-Color Technology Inc., a leading innovator in high-performance memory solutions, is proud to announce the industry's first DDR5 OC RDIMM RGB modules. Engineered to redefine workstation and professional computing performance, these revolutionary modules will come in capacities ranging from 16 GB per module up to 64 GB or 512 GB in configurations of 64 GB x 8 and with configurations that reach 8000 MT/s delivering exceptional speeds in addition a new ultra-low timing RDIMM of CL26 now enters the line-up, fully optimized for AMD Ryzen Threadripper and Intel Xeon processor platforms. Protected under Patent No. M667728, v-color's DDR5 OC RDIMM RGB modules feature an advanced design with RGB LEDs, combining vibrant visual aesthetics with outstanding performance, bandwidth, and reliability. Designed specifically for AI development, professional multitasking, data analytics, and demanding creative workloads, these modules deliver unmatched speed, reliability, and efficiency.

Elevating Memory Performance
Crafted with Premium Original Top-Tier ICs and ON-Die ECC technology, v-color's DDR5 OC RDIMM RGB modules deliver exceptional data integrity and stability for demanding professional workloads. Featuring an advanced memory architecture, these modules push the boundaries of performance, reaching speeds of up to 8000 MT/s while also offering configurations with ultra-low Timing like 6000 MT/s CL28. Designed for AI development, real-time analytics, and complex 3D rendering, they ensure lightning-fast responsiveness in the most intensive computing environments.

Essencore, a leading manufacturer in memory and storage solutions, with its consumer memory and storage brand KLEVV, is excited to announce its participation at COMPUTEX Taipei 2025, held from May 20th to May 23rd at the Taipei Nangang Exhibition Center.

POWER UP WITH NEXT-GEN GAMING AND PERFORMANCE MEMORY
KLEVV's premier memory solutions will be at the center of its COMPUTEX 2025 showcase, featuring a live demonstration of next-gen DDR5 modules built to run at blazing-fast speeds exceeding 10,000 MT/s, displayed across top-tier motherboards from leading vendors. This exclusive demo offers visitors a firsthand look at the performance headroom KLEVV is unlocking with its latest technology. Alongside the showcase, KLEVV's full gaming memory lineup is receiving a significant upgrade, featuring faster speeds and lower latencies to meet the demands of modern gaming and high-performance systems.

MSI, a global leader in industrial computing solutions, proudly announces the release of the MS-C927, a highly compact and fanless embedded Box PC designed to meet the growing demand for power-efficient edge computing in harsh and space-constrained environments. Powered by Intel 's Meteor Lake-U and Arrow Lake-U series Core Ultra processors, the MS-C927 delivers high performance, reliable connectivity, AI acceleration, and rich I/O in an ultra-compact form factor.

Feature-Rich, Future-Ready
With a footprint of only 130 x 155 x 40 mm, the MS-C927 fits seamlessly into tight enclosures while offering exceptional processing power and industrial-grade durability. It features DDR5 memory up to 96 GB, dual 4K DisplayPort outputs, dual LAN including 2.5GbE, and multiple M.2 slots for NVMe storage, wireless connectivity, and cellular communication.

As a global leader in memory modules and flash memory, ADATA Technology will join forces with its new enterprise storage brand, its industrial-grade embedded storage brand ADATA Industrial, and gaming brand XPG under the theme "Advancing AI Innovation" at COMPUTEX TAIPEI, the world's largest computer industry trade show, from May 20 to 23. The exhibition will focus on three key areas—AI Computing, Smart Living, and Gaming Lifestyle—showcasing innovative products that shaping the next generation and inviting consumers worldwide to experience the future firsthand.

"The AI Computing Zone" will spotlight the debut of ADATA's new enterprise storage brand, delivering SSDs optimized for AI servers and data centers with exceptional performance and energy efficiency. For industrial applications, the company will showcase high-capacity, low-latency industrial SSDs and patented software offering full lifecycle monitoring and stable, efficient performance. Also featured are JEDEC-compliant DDR5 LPCAMM2 modules and high-capacity memory, engineered to deliver fast, energy-efficient AI computing for next-generation laptops.

Die shots of Intel's "Arrow Lake" desktop processors have appeared online, confirming the chiplet design we have known about since the launch. The images annotated by the YouTube channel HighYield show a four‑tile arrangement mounted on a base die made with Intel's 22 nm FinFET process. The compute tile sits at the top left, built on TSMC's N3B node and covering 117.24 mm². To its right are the SoC tile on TSMC's N6 node measuring 86.65 mm², and the GPU tile, which houses four Xe cores alongside an Arc Alchemist render slice. The I/O tile, at 24.48 mm² on the same N6 node, completes the group at the bottom left. Intel has redesigned its hybrid core layout for Arrow Lake, moving away from separate P‑core and E‑core clusters. Four of the eight high‑performance P‑cores line the die's outer edges, with the remaining four in the center. In between these lie the four efficiency E‑core clusters, each sharing 3 MB of L2 cache. A unified 36 MB L3 cache ring bus connects to every core, allowing E‑cores to tap into that larger cache pool for the first time. Intel aims to spread heat more evenly and boost background task performance.

The I/O tile integrates Thunderbolt 4 controllers, PCIe buffers and PHYs. The SoC tile carries display engines, media accelerators and DDR5 memory controllers. All tiles are bonded to the base die via Intel's Foveros Omni stacking technology. Arrow Lake also reflects a shift in Intel's manufacturing strategy. Plans to use Intel's 20A node were dropped in favor of TSMC processes, making this the first desktop CPU from Intel that relies almost entirely on external foundries. On the software side, Intel has begun offering its IPO profiles in select prebuilt systems. These presets optimize CPU and memory settings for a hassle‑free performance boost that remains within warranty limits. Meanwhile, the native 200S Boost overclocking option is rolling out via BIOS updates. Early tests suggest that 200S Boost alone yields modest gains unless paired with very high-speed DDR5 modules, while IPO profiles deliver more consistent improvements with mainstream memory configurations.

ASUS today announced the arrival of TUF Gaming T500, a compact desktop with the power to drive the latest and greatest AAA and esports games. Powered by up to an Intel Core i7-13620H processor, up to an NVIDIA GeForce RTX 5060 Ti GPU, up to 64 GB of DDR5 RAM and 2 TB of PCIe 4.0 storage, T500 is a well-rounded machine for esports and AAA gamers alike. With a compact chassis that features classic TUF Gaming style, T500 is an excellent fit in bedrooms and dorm rooms anywhere.

High-performance components
Powered by up to an Intel Core i7-13620H processor with six Performance cores and eight Efficiency cores and a max boost of 5.0 GHz, T500 can drive incredible gaming experiences alongside a snappy desktop experience. T500 packs up to an NVIDIA GeForce RTX 5060 Ti GPU. Boasting the latest NVIDIA Blackwell architecture, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the GeForce RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4 featuring Super Resolution, Ray Reconstruction, and Multi Frame Generation. The GeForce RTX 5060 Ti is ready to power incredible performance in the games of today and tomorrow.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is showcasing large-capacity overclocked memory at DDR5-8400 128 GB (2x 64 GB) on the ASUS ROG Crosshair X870E APEX motherboard and AMD Ryzen 9 9950X3D desktop processor. This memory overclock milestone redefines what's possible for high-performance computing with the newly announced G.SKILL DDR5 64 GB memory module, built with high-performance SK hynix DDR5 ICs. With 128 GB of overclocked high-speed memory capacity, this DDR5-8400 memory would be able to empower content creators, researchers, and professionals with more performance and capacity to complete computing tasks faster and more efficiently.

This extreme overclock achievement showcases G.SKILL's continued advancement in pushing DDR5 memory to new limits. While high-frequency memory kits have traditionally been limited to lower module capacities, this latest demonstration demonstrates that enthusiasts and professionals can now harness both blazing-fast speeds and massive memory capacity in a single kit. It provides an ideal choice for AI model development, high-resolution content creation, machine learning, and other professional workloads that demand both large memory pools and rapid memory data speeds.