SK hynix announced on September 22 that it showcased its latest memory technologies and products at Intel Innovation 2023 held September 19-20 in the western U.S. city of San Jose, California. Hosted by Intel since 2019, Intel Innovation is an annual IT exhibition which brings together the technology company's customers and partners to share the latest developments in the industry. At this year's event held at the San Jose McEnery Convention Center, SK hynix showcased its advanced semiconductor memory products which are essential in the generative AI era under the slogan "Pioneer Tomorrow With the Best."

Products that garnered the most interest were HBM3, which supports the high-speed performance of AI accelerators, and DDR5 RDIMM, a DRAM module for servers with 1bnm process technology. As one of SK hynix's core technologies, HBM3 has established the company as a trailblazer in AI memory. SK hynix plans to further strengthen its position in the market by mass-producing HBM3E (Extended) from 2024. Meanwhile, DDR5 RDIMM with 1bnm, or the 5th generation of the 10 nm process technology, also offers outstanding performance. In addition to supporting unprecedented transfer speeds of more than 6,400 megabits per second (Mbps), this low-power product helps customers simultaneously reduce costs and improve ESG performance.

T-CREATE, the creator sub-brand of the global memory provider Team Group, today launched the T-CREATE MASTER DDR5 OC R-DIMM, an overclocking DDR5 ECC Registered DIMM memory. T-CREATE's MASTER series is designed specifically for workstations and servers. With its high specifications and large capacity, it fully satisfies the needs of professionals in handling large-scale projects, analyzing large data sets, and running multiple specialized applications concurrently. The T-CREATE MASTER DDR5 OC R-DIMM features a one-piece heat spreader with ventilation holes and thermally conductive silicone for quick heat dissipation. It also has on-die ECC, which allows systems to run more stably and provide excellent performance.

The T-CREATE MASTER memory module is an overclocking ECC Registered DIMM memory available in frequencies of 6000 MHz, 6400 MHz, and 6800 MHz. When the module is paired with workstation motherboards, memory capacity can reach up to a massive 384 GB, allowing professional creators to quickly complete all types of work and enjoy the creative flexibility that comes with large capacities. In addition to the on-die ECC that corrects bit errors within the DRAM chip, the MASTER memory also supports an ECC feature that corrects errors outside the chip and fixes data corruption, allowing for stable operation and greater peace of mind when creating. The MASTER R-DIMM is compatible with W790 series workstation motherboards and is made for creative professionals, developers, and engineers. When combined with the powerful computing of the latest Intel Xeon processors, the T-CREATE MASTER DDR5 OC R-DIMM memory delivers incredible performance and stability for content creation, graphic rendering, and the demanding applications of high-end workstations.

When Crucial cancelled its Ballistix gaming brand, it was unclear if the company would launch higher-end products in the future, although the company never said it wouldn't. Back in May of this year, Crucial launched its Pro series of memory, which was not exactly pro, at least not for the readership here which is used to an entirely different level of RAM. This was largely due to Crucial sticking to JEDEC spec, even though the company did launch some DDR5 5600 MHz modules.

Now—some six months later—it appears that Crucial is getting ready to deliver some higher performance modules with its new DDR5 6000 MHz modules, although at launch, they will only be available in a kit of two 24 GB modules. Although Crucial claims JEDEC spec, the 48-48-48 timings appear to either be slightly tighter than the original JEDEC spec, or JEDEC has updated the specs since they were announced. Although nothing about these modules screams high-end or pro, there's one thing that makes these stand out against the competition, they operate at 6000 MHz using only 1.1 Volt, whereas most 6000 MHz DIMMs on the market today, operate at 1.35 Volt higher. In addition to that, as these are JEDEC spec DIMMs, there's no need to enable XMP/EXPO settings to make them work at 6000 MHz, which could be a benefit to some. There might be some potential for tweaking these modules as well, something we'll have to wait for reviews to find out about. Crucial is asking for US$166.99 for the 48 GB kit, which puts them at a price disadvantage compared to its competitors, as you can get a similar kit for as little as $115 or possibly even less.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

AMD today rolled out the new compacted Socket SP6 server platform designed for smaller servers locally deployed at the edge by organizations. With CPU core-counts of up to 64-core/128-thread, these processors are based on the "Zen 4c" microarchitecture, which comes with identical IPC and ISA to "Zen 4," but with smaller L3 cache available per core. The EPYC 8004 series targets traditional data-centers located on-site for organizations. Even if the heavy-lifting of the IT for them is performed by remote data-centers or cloud providers, organizations still need smaller edge server deployments. The EPYC 8004 series caters to a different kind of servers than the ones the lower core-count models of EPYC 9004 "Genoa" do.

With the EPYC 8004 series, AMD is debuting a new smaller CPU socket called SP6. The socket measures 58.5 mm x 75.4 mm, compared to the 76.0 mm x 80.0 mm of Socket SP5 powering EPYC 9004 "Genoa" and EPYC 97x4 "Bergamo." Socket SP5 is an LGA with a pin count of 4,844, compared to SP5, which is LGA-6096. The first line of processors for this socket, the EPYC 8004 series, are codenamed "Siena." These are very much part of the 4th Gen EPYC series, a lineage it shares with "Genoa" for data-center servers, "Genoa-X" for compute servers, and "Bergamo" for high-density cloud.

The rumors of Nintendo's next-generation Switch handheld gaming console have been piling up ever since the competition in the handheld console market got more intense. Since the release of the original Switch, Valve has released Steam Deck, ASUS made ROG Ally, and others are also exploring the market. However, the next-generation Nintendo Switch 2 is closer and closer, as we have information about the chipset that will power this device. Thanks to Kepler_L2 on Twitter/X, we have the codenames of the upcoming processors. The first generation Switch came with NVIDIA's Tegra X1 SoC built on a 20 nm node. However, later on, NVIDIA supplied Nintendo with a Tegra X1+ SoC made on a 16 nm node. There were no performance increases recorded, just improved power efficiency. Both of them used four Cortex-A57 and four Cortex-A53 cores with GM20B Maxwell GPUs.

For the Nintendo Switch 2, NVIDIA is said to utilize a customized variant of NVIDIA Jetson Orin SoC for automotive applications. The reference Orin SoC carries a codename T234, while this alleged adaptation has a T239 codename; the version is most likely optimized for power efficiency. The reference Orin design is a considerable uplift compared to the Tegra X1, as it boasts 12 Cortex-A78AE cores and LPDDR5 memory, along with Ampere GPU microarchitecture. Built on Samsung's 8 nm node, the efficiency would likely yield better battery life and position the second-generation Switch well among the now extended handheld gaming console market. However, including Ampere architecture would also bring technologies like DLSS, which would benefit the low-power SoC.

Patriot Memory has announced a full expansion of its latest DDR5 performance memory series, the Viper Xtreme 5 DDR5. This expansion will include new non-RGB models available in 7,600 MT/s and 8,200 MT/s kits, with kit capacities from 32 GB (16 GB x2) to 48 GB (24 GB x2). Previously unveiled at CES 2023, the Viper Xtreme 5 aims to take system performance to a new level with performance memory built for extreme overclockers, serious gamers and enthusiast tinkerers alike. With speeds reaching up to 8,200 MT/s, the Viper Xtreme 5 is Patriot Memory and Viper Gaming's fastest DRAM produced to date.

Since its debut, the Viper Xtreme 5 has received strong praise from gamers, tech enthusiasts and media alike, including a nomination for "Best System Memory Series" at the 2023 European Hardware Awards, FunkyKit Editor's Choice Award, Techpowerup Editor's Choice Award, TweakTown Editor's Choice Award and Overclockers.com's "Approved" Top Rating. The Viper Xtreme 5 was also featured in multiple record-breaking overclock competitions by overclockers Chewonthis and Fugger.

In a recent interaction with the community on Chinese social platforms, Tony Yu, better known as Uncle Tony and serving as the General Manager of ASUS China, shed light on several questions concerning ASUS's products. One question that captured attention was about the ROG Z790 APEX motherboard, a premium offering from ASUS designed explicitly for overclocking. Tony clarified that the motherboard is currently out of production as ASUS gears up to unveil an updated version. This move is in line with industry trends, with rivals like Gigabyte and MSI also refreshing their respective Z790 lineups. The updated motherboards from ASUS are expected to align with Intel's next-generation Core series known as Raptor Lake Refresh, featuring incremental improvements such as WiFi-7 standard integration, new color options, enhanced power delivery mechanisms, and advancements in memory overclocking capabilities.

Launched initially in November of the previous year with a price tag of $699, the ROG MAXIMUS Z790 APEX motherboard stood out for its superior features aimed at overclocking enthusiasts. These include 24 power supply modules, dual 8Pin power connectors, AI-driven overclocking technology, and support for DDR5 memory with speeds exceeding 8000 MT/s. It also offers a plethora of connectivity options, like five M.2 interfaces, a 2.5G network card, WiFi 6E, and USB 3.2 Gen 2x2 Type-C, along with 60 W QC 4+ fast charging. This motherboard gained popularity in December when it was used to set a world record CPU frequency of 9008.82 MHz using an Intel i9-13900K processor. Looking forward, the next generation of Intel Core processors could enable even higher overclocking frequencies. Apart from this, Tony tantalizingly hinted that ASUS is experimenting with innovative design changes, such as introducing connectors on the reverse side of motherboards, although this feature may not debut in the APEX series.

In order to meet the evolving needs of Netcom data center computing, global memory provider TEAMGROUP is proud to introduce the new DDR5 VLP ECC U-DIMM normal and wide temperature (-40° to +85°C) memory module. It features DDR5 high performance, high frequencies, and large-capacity industrial ICs. Designed to have an extremely low profile for greater performance and more compact hardware configurations, the U-DIMM provides users with better performance and reliability than ever before.

Team Group's DDR5 VLP ECC U-DIMM memory modules come in frequencies up to 4800 MHz and 5600 MHz to ensure fast data processing and enhance computing performance. The memory is also offered in a wide range of capacity options, from 16 GB to 48 GB, allowing users to select the most suitable capacity kit for their platform's workload and computing needs. This module comes in an ultra-low-profile design, with a board height of only 0.738 inches, half of the normal modules. This allows it to meet the hardware configuration requirements of blade servers and helps maximize space for the user's configuration of components, and achieves higher server density.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly unveils its latest creations: the Z790 AORUS PRO X and the B760M AORUS ELITE X AX. These masterpieces are meticulously engineered to not only unleash the full potential of the next-gen Intel processors but also support mind-bending DDR5-8266 and beyond.

Prepare to be captivated by the alluring all-white aesthetics of these motherboards. The PCB boards boast the latest color-matched solder mask, accompanied by entrancing lighting effects. The new UC BIOS also provides the white version which is redesigned as user-centered and offers an intuitive operation interface with an aesthetically pleasing design. Moreover, Quick Access function and nine customizable option slots for effortless access in Easy Mode are also at your fingertips. Paired with the sleek white antenna, assembling the most immersive, visually striking white-themed rig on the market has never been this effortless.

ADATA Technology Co., Ltd., the world's leading memory brand, announced a theme of "Dazzling Tomorrow" for its annual creator event " You Are a Rising Star," held from today until October 13th. Use creative techniques such as graphic design, 3D rendering, and video to weave your own moving story. Share your pieces publically on Instagram and you will have an opportunity to win excellent prizes valued at more than USD$5,700.

With the generational change of processors and chipsets, DDR5 memory entering the mainstream, the rapid rise of Gen 4 SSDs and a migration to the Gen 5 era, coupled with the rise of generative AI tools, creator software and hardware must also improve in leaps and bounds. ADATA's online creator contest officially enters its fourth year and continues to provide a platform for talent in the fields of "graphic design," "video creation," "animation," and "photography" to unleash their creativity. This year, we continue our commitment to the spirit of "Build to Create" to produce better solutions for content creators, including major international award winning high-end and comprehensive products such as the LEGEND 970 Gen 5 SSD, ACE series memory module, SE920 USB4 external SSD, and other devices to inspire creativity.

Lexar, a leading global brand of flash memory solutions, is unveiling a variety of new products that are estimated to be launched in Q4 2023. Designed for photography professionals and PC enthusiasts to accelerate their workflow, the expanded portfolio includes a new microSD card, internal SSDs, DRAM, and portable SSDs.

The new Professional GOLD micro SDXC UHS-II card, available in 128 GB and 256 GB, leverages the high-speed performance and a Video Speed Class 60 (V60) rating, allowing users to quickly capture, play back, and transfer high-definition multimedia files, including 4K video, with a read transfer speed up to 280 MB/s. This card is also great for use with gaming devices, sports camcorders, tablets, or smartphones, and drones.

Chuwi, a leading global technology company, has unveiled its latest product, the CoreBox 5th Mini PC. The CoreBox 5th Mini PC is a powerful and versatile solution for the modern office, offering a combination of high performance, compact design, and state-of-the-art features.

The CoreBox 5th Mini PC is powered by Intel's latest 13th Gen Core i5-13500H processor, which is based on the Intel Alder Lake architecture. The Intel Core i5-13500H is a mobile CPU designed for mid-range laptops, utilizing the Raptor Lake-H series (Alder Lake or Raptor Lake architecture). Its release in early 2023 boasts 4 out of 6 performance cores (P-cores) based on the Golden Cove architecture, alongside all 8 efficient cores (E-) using the Gracemont architecture. With Hyper-Threading support on the P-cores, the CPU can handle up to threads in conjunction with the E-cores. The clock rate ranges from 2.6 to 4.7 GHz for single core boost (and up to 4.6 GHz for all cores) on the performance cluster, while the efficient cluster operates between 1.9 and 3.5 GHz. The performance of the E-cores is expected to be comparable older Skylake cores.

Today Lenovo is announcing its top-of-the-line Lenovo Legion 9i (16", 8), the first 16-inch gaming laptop in Lenovo Legion's ecosystem—and in the world—with a self-contained liquid-cooling system, designed for gamers and creators with heavy graphic workflow requirements who need a full development studio in their bag. The Lenovo Legion 9i caps out the Lenovo Legion lineup that also includes the Lenovo Legion Pro series for competitive gamers and the Lenovo Legion Slim series for gamers who value agility, as well as Lenovo Legion displays and peripherals. Also announced today are the Lenovo Legion 16" Gaming Backpack GB700 and GB400, two backpack options that give gamers a choice between slim and lightweight agility or extra storage without sacrificing protection for their Lenovo Legion 9i (16", 8) or any other laptops and accessories.

"The introduction of the Lenovo Legion 9i (16", 8) marks the latest pinnacle of Lenovo Legion's gaming laptop innovation. The Lenovo Legion 9i is first laptop in the Lenovo Legion ecosystem with an integrated liquid-cooling system and hardware AI chip tuning. The forged carbon A-cover, which in addition to its 'unique-to-each-laptop aesthetics' means a lighter laptop for gamers and creators who demand nothing but the best." said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "We are constantly challenging ourselves to push the limits when designing gaming solutions. The Lenovo Legion 9i (16", 8) has set a new benchmark for us that we are excited to meet—and exceed—in the future."

collaboration with diverse industries and support various applications
Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This achievement comes after Samsung began mass production of its 12 nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung's leadership in next-generation DRAM technology and signals the next chapter of high-capacity memory.

"With our 12 nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data," said SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics. "We will continue to develop DRAM solutions through differentiated process and design technologies to break the boundaries of memory technology."

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, proudly introduces the groundbreaking AORUS Z790 X Gen Motherboards. These motherboards are meticulously crafted to usher in the next generation of computing power, designed to perfectly complement Intel Core processors. With an exceptional focus on DDR5 performance, user-centric BIOS advancements, and innovative hardware enhancements, the AORUS Z790 X Gen Motherboards are built to fully unleash the next-gen power.

⁠DDR5 Performance Redefined
GIGABYTE's commitment to achieving unparalleled next-gen performance shines through in the AORUS Z790 X Gen Motherboards. Equipped with cutting-edge technologies, these motherboards deliver best-in-class DDR5 compatibility and performance. With support for up to DDR5 XMP-8266 or higher, the DDR5 XMP Auto Booster allows users to effortlessly boost native DDR5-5600 to 6000 with a single click. Furthermore, the newly introduced Back Drilling Technology enhances signal integrity, leading to improved system performance and heightened reliability.

Lexar, a leading global brand of flash memory solutions, joined Gamescom 2023 for the first time. Lexar also unveiled some of the new products that are estimated to be launched in Q4 2023 for the first time at the show. Designed for PC enthusiasts to accelerate their workflow, the new portfolio includes internal SSDs, DRAM.

The performance of Lexar ARES RGB DDR5 Desktop Memory reaches a new height of 8000MT/s and 8400MT/s, allowing hardcore gamers and PC enthusiasts to experience superior performance with next-gen DDR5. And, in addition to the performance, this memory also features Lexar RGB Sync so gamers can customize the RGB LED to their own style, and its sleek premium aluminium heat spreader keeps the system cool. It is built with on-die ECC, which leverages real-time data error correction for increased data stability and reliability. With on-board Power Management IC (PMIC), it provides better power control and power delivery.

V-Color Technology Inc, announced the highly anticipated expansion of their product lineup with the launch of the MANTA XPrism RGB DDR5 48 GB (2x 24 GB) Kit, now available in the SCC 2+2 configuration starting this mid-August. This combo will feature speeds from 6200 up to 6600. The kit showcases v-color's commitment to innovation and quality, highlighted by the Patented RGB Filler Kit designed specifically for Intel systems. It is fully Intel XMP 3.0-Ready, ensuring seamless automatic overclocking. It offers full control over lighting and performance, while being synchronized across motherboards from leading brands like ASUS, GIGABYTE, MSI, and ASROCK. The MANTA XPrism RGB DDR5 48 GB (2x 24 GB) Kit in SCC 2+2 configuration is set to be available in mid-August 2023, providing tech enthusiasts and professionals alike with a remarkable solution for their computing needs.

TrendForce reports that rising demand for AI servers has driven growth in HBM shipments. Combined with the wave of inventory buildup for DDR5 on the client side, the second quarter saw all three major DRAM suppliers experience shipment growth. Q2 revenue for the DRAM industry reached approximately US$11.43 billion, marking a 20.4% QoQ increase and halting a decline that persisted for three consecutive quarters. Among suppliers, SK hynix saw a significant quarterly growth of over 35% in shipments. The company's shipments of DDR5 and HBM, both of which have higher ASP, increased significantly. As a result, SK hynix's ASP grew counter-cyclically by 7-9%, driving its Q2 revenue to increase by nearly 50%. With revenue reaching US$3.44 billion, SK hynix claimed the second spot in the industry, leading growth in the sector.

Samsung, with its DDR5 process still at 1Ynm and limited shipments in the second quarter, experienced a drop in its ASP by around 7-9%. However, benefitting from inventory buildup by module houses and increased demand for AI server setups, Samsung saw a slight increase in shipments. This led to an 8.6% QoQ increase in Q2 revenue, reaching US$4.53 billion, securing them the top position. Micron, ranking third, was a bit late in HBM development. However, DDR5 shipments held a significant proportion, keeping their ASP relatively stable. Boosted by shipments, its revenue was around US$2.95 billion, a quarterly increase of 15.7%. Both companies saw a reduction in their market share.

In a groundbreaking leap forward for small form factor computing, Simply NUC, Inc, a leading mini PC solutions company, is thrilled to announce the launch of a new product family called Onyx. Powered by Intel's 13th Gen Raptor Lake "H" series processors, Onyx is the world's first 4x4 NUC to feature a Core i9 option. With support for up to an unprecedented 96 GB of DDR5-5200 memory, up to 16 TB of storage, and never before seen benchmark results, Onyx delivers unmatched computing performance for modern business.

"With the launch of Onyx we're redefining what is possible from a 4x4 NUC," said Jonny Smith, Co-CEO at Simply NUC. "Onyx is the culmination of customer-driven innovation and sets the new standard for ultra-small form factor compute power and performance."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, today announced a new VMware vSAN solution optimized to run enterprise class hyperconverged virtualized workloads. As virtualized workloads become more advanced, processing power and storage performance requirements increase, requiring greater capacity to meet application SLAs and maximize virtual machine density. This solution also utilizes the latest Intel AMX accelerator for AI workloads.

When compared to the Supermicro X11 BigTwin, benchmark testing conducted by Supermicro showed up to 4.7X higher IO throughput and 8.2X lower latency on the HCIBench benchmark, up to 4.9X faster image classification inference throughput on the ResNet50 model and up to 4X faster natural language processing throughput on BERT-Large model. In addition, the superior power and efficiency of the Supermicro X13 BigTwin architecture can deliver up to 3X cost and performance improvement within the same node footprint compared to a similar deployment based on older generation Supermicro systems, creating a compelling case for organizations to upgrade their aging infrastructure.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce new DDR5 memory kit specifications at DDR5-6400 CL32-39-39 in kit capacities of 32 GB (16 GB x2) and 48 GB (24 GB x2) under the Trident Z5 Neo RGB series, which also now comes in a new white version. Designed for AMD Ryzen 7000 series processors and AMD X670 chipset motherboards with AGESA 1.0.0.7c BIOS updates, and programmed with AMD EXPO overclock profile technology, these new specifications enable PC enthusiasts, overclockers, and DIY builders to build an ideal AMD system.

Overclocked Memory Speed Up to DDR5-6400
With the introduction of the AGESA 1.0.0.7c update, G.SKILL is updating the Trident Z5 Neo RGB series with DDR5-6400 memory kits, designed for use on compatible AMD platforms. Refer to the screenshot below to see the DDR5-6400 CL32-39-39 32 GB (16 GB x2) memory kit validated on the AMD Ryzen 9 7950X desktop processor and the ASUS ROG CROSSHAIR X670E HERO motherboard with the 1602 BIOS update. Memory performance and results may vary depending on the motherboard model, CPU model, and BIOS version used.

Intel's upcoming desktop platform based on Socket LGA1851 will retire support for the DDR4 memory standard. The socket will only support DDR5. With this, Intel would have gracefully transitioned the market from DDR4 to DDR5, with its current Socket LGA1700 that enables both memory stardards, having supported three generations of Core processors (12th thru 14th). Leaf Hobby, a reliable source with Intel leaks, says that LGA1851 will remain Intel's desktop platform till 2026.

LGA1851 is expected to debut with the company's Core desktop processor generation that succeeds 14th Gen "Raptor Lake Refresh." The socket itself has the same dimensions as LGA1700, and is expected to be cooler-compatible with the older socket. The socket will feature pins for up to 32 PCIe lanes—16 toward PEG, 8 toward DMI chipset bus, and two sets of 4 lanes toward CPU-attached NVMe storage. From these, the 16 PEG lanes, and one set of 4 lanes are expected to be Gen 5, while the chipset bus is expected to remain DMI Gen 4 x8, and the second CPU-attached NVMe slot is expected to be Gen 4. The socket could also feature wiring for updated display I/O, as Intel's next-gen processors are expected to introduce updates to the iGPU.