Thursday, November 9th 2023
Micron Announces 128GB DRAM Low-Latency, High-Capacity RDIMMs
Micron Technology, Inc. (Nasdaq: MU), today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128 GB DDR5 RDIMM memory featuring best-in-class performance of up to 8000 MT/s to support data center workloads today and into the future. These high-capacity, high-speed memory modules are engineered to meet the performance and data-handling needs of a wide range of mission-critical applications in data center and cloud environments, including artificial intelligence (AI), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads.
Powered by Micron's industry-leading 1β (1-beta) technology, the 32Gb DDR5 DRAM die-based 128 GB DDR5 RDIMM memory delivers the following enhancements over competitive 3DS through-silicon via (TSV) products:
"We are proud to set a new standard for high-capacity, high-speed memory in the data center with Micron's 128 GB DDR5 RDIMMs, which delivers the memory bandwidth and capacity required for increasingly compute-intensive workloads," said Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "Micron continues to enable improvements to the data center ecosystem with early access to our advanced technologies and support in the design and integration of leading-edge high-capacity memory solutions."
Micron's 32Gb DDR5 memory solution uses innovative die architecture choices for leading array efficiency and the densest monolithic DRAM die. Voltage domain and refresh management features help optimize the power delivery network providing much-needed energy efficiency improvements. Additionally, the die-dimension aspect ratio was optimized to advance the manufacturing efficiency of the 32Gb high-capacity DRAM die.
By leveraging AI-powered smart manufacturing methods to enable these world-class innovations, Micron's 1β process technology node has achieved yield maturity in the fastest time in the company's history. Micron's 128 GB RDIMMs will be shipping in platforms capable of 4800 MT/s, 5600 MT/s, and 6400 MT/s in 2024 and designed into future platforms capable of up to 8000MT/s.
"Our latest 4th Gen AMD EPYC processors will benefit from optimized memory capacity per core with Micron's 128 GB RDIMMs, which use 32Gb monolithic DRAM to provide an improved total cost of ownership solution for business-critical data enterprise workloads, such as AI, high-performance computing and virtualization," said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. "As AMD advances compute with our next-gen EPYC processors, Micron's 128 GB RDIMMs will likely become one of the main memory options to deliver high-capacity and bandwidth per core capabilities to address the demands of memory-intensive applications."
"We look forward to Micron's 32Gb-based 128 GB RDIMM for the bandwidth and performance-per-watt solution benefits available in the server and AI systems market. Intel is evaluating this 32Gb memory offering for key DDR5 server platforms based on the resulting total cost of ownership benefits to cloud, AI and enterprise customers," said Dr. Dimitrios Ziakas, vice president of Intel's Memory and IO Technologies.
Micron 32Gb-DRAM die enables future expansion of the memory portfolio with enhanced bandwidth and energy-efficient MCRDIMM and JEDEC standard MRDIMM products in 128 GB, 256 GB and higher capacity solutions. With industry-leading process and design technology innovations, Micron offers a wide array of memory options across RDIMMs, MCRDIMMs, MRDIMMs, CXL and LP form factors to allow customers to integrate optimized solutions for AI and high-performance computing (HPC) applications that suit their needs for bandwidth, capacity and power optimization. For more information, visit Micron's DDR5 webpage.
Source:
Micron
Powered by Micron's industry-leading 1β (1-beta) technology, the 32Gb DDR5 DRAM die-based 128 GB DDR5 RDIMM memory delivers the following enhancements over competitive 3DS through-silicon via (TSV) products:
- more than 45% improved bit density
- up to 24% improved energy efficiency
- up to 16% lower latency
- up to a 28% improvement in AI training performance
Micron's 32Gb DDR5 memory solution uses innovative die architecture choices for leading array efficiency and the densest monolithic DRAM die. Voltage domain and refresh management features help optimize the power delivery network providing much-needed energy efficiency improvements. Additionally, the die-dimension aspect ratio was optimized to advance the manufacturing efficiency of the 32Gb high-capacity DRAM die.
By leveraging AI-powered smart manufacturing methods to enable these world-class innovations, Micron's 1β process technology node has achieved yield maturity in the fastest time in the company's history. Micron's 128 GB RDIMMs will be shipping in platforms capable of 4800 MT/s, 5600 MT/s, and 6400 MT/s in 2024 and designed into future platforms capable of up to 8000MT/s.
"Our latest 4th Gen AMD EPYC processors will benefit from optimized memory capacity per core with Micron's 128 GB RDIMMs, which use 32Gb monolithic DRAM to provide an improved total cost of ownership solution for business-critical data enterprise workloads, such as AI, high-performance computing and virtualization," said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. "As AMD advances compute with our next-gen EPYC processors, Micron's 128 GB RDIMMs will likely become one of the main memory options to deliver high-capacity and bandwidth per core capabilities to address the demands of memory-intensive applications."
"We look forward to Micron's 32Gb-based 128 GB RDIMM for the bandwidth and performance-per-watt solution benefits available in the server and AI systems market. Intel is evaluating this 32Gb memory offering for key DDR5 server platforms based on the resulting total cost of ownership benefits to cloud, AI and enterprise customers," said Dr. Dimitrios Ziakas, vice president of Intel's Memory and IO Technologies.
Micron 32Gb-DRAM die enables future expansion of the memory portfolio with enhanced bandwidth and energy-efficient MCRDIMM and JEDEC standard MRDIMM products in 128 GB, 256 GB and higher capacity solutions. With industry-leading process and design technology innovations, Micron offers a wide array of memory options across RDIMMs, MCRDIMMs, MRDIMMs, CXL and LP form factors to allow customers to integrate optimized solutions for AI and high-performance computing (HPC) applications that suit their needs for bandwidth, capacity and power optimization. For more information, visit Micron's DDR5 webpage.
22 Comments on Micron Announces 128GB DRAM Low-Latency, High-Capacity RDIMMs
My dad will like it as a hand me down. He can't stand touchpads without physical buttons.
For years he used an old beat to shit Panasonic Toughbook with a Core Duo CPU because and I quote "it has a handle." Took years to make him realize that is not the norm, lol.
Folks who say I have 16/32/64 and I'm fine. Yes you are. Clearly this kind of memory is not for you. Go into serious 3D, particle physics, fluid dynamics, DB servers etc and its basically:
How much memory do you need?
Yes.
I also thought I'll be fine with 64 at one time. Enough to say in last scene I've done with 25 characters that was about 80GB of character geometry without rest of the scene. So yes, there is plenty of applications for 128GB memory sticks, even at home studio, not to mention corporate IT.