Corning Incorporated (NYSE: GLW) today announced the introduction of Corning Gorilla Glass Ceramic, an innovative, transparent, and strengthenable glass ceramic material to help bring advanced toughness to more mobile devices. Gorilla Glass Ceramic significantly improves drop performance on rough surfaces compared to competitive aluminosilicate glasses. The new material expands Corning's portfolio of durable cover materials for OEMs.

"Gorilla Glass has built a reputation of strength and resilience, and our new glass ceramic material continues this tradition. Designed to offer enhanced toughness, Gorilla Glass Ceramic reinforces our commitment to innovating and engineering high-quality, durable materials for display covers and enclosures," said David Velasquez, Vice President & General Manager, Corning Gorilla Glass.

TrendForce reports that NAND Flash suppliers began reducing production in the fourth quarter of 2024, and the effects are now starting to show. In anticipation of potential U.S. tariff increases, consumer electronics brands have accelerated production, further driving up demand. Concurrently, inventory restocking is underway across the PC, smartphone, and data center sectors. As a result, NAND Flash prices are expected to stabilize in the second quarter of 2025, with prices for wafers and client SSDs projected to rise.

Client SSD prices to rise 3-8% while enterprise SSD prices to remain flat
After three consecutive quarters of inventory depletion, client SSD demand is rebounding as OEMs resume production early. The upcoming end of Windows 10 support and the launch of new-generation CPUs are expected to drive replacement demand for PCs. Meanwhile, the DeepSeek effect is accelerating the adoption of edge AI, further fueling client SSD demand. With production cuts and supply adjustments gradually restoring balance, client SSD contract prices are projected to rise 3% to 8% QoQ in Q2.

Around late January, out-of-date AMD marketing material teased the existence of a Radeon RX 9070 series reference card design. Almost a month later, PC hardware news outlets picked up on an official signal about Team Red's launch lineup consisting entirely of board partner-produced options. First-party enthusiasts were disappointed by the apparent total lack of "Made by AMD" (MBA) solutions, but some unusual specimens appeared online roughly two weeks post-RDNA 4's launch. Reports pointed to triple-fan Radeon RX 9070 XT and dual-fan RX 9070 MBA cards being exchanged for cash via Chinese black market channels. Photographed examples seemed to sport a somewhat muted black shroud design—not quite as exciting when compared to AMD's marketed/rendered brushed metal effect promo units.

Members of the Chiphell forum have spent months leaking many aspects of Team Red's foray into a new generation of graphics architecture—going back to the days of old nomenclature: Radeon RX 8800 XT. Yesterday, one participant revealed their fresh purchase of a Radeon RX 9070 non-XT MBA card. They sold their old GeForce RTX 4070 SUPER 12 GB graphics card, in favor of Navi 48 GPU-based OEM hardware. The post focused mainly on photo uploads and screenshots, but a brief description stated: "purchased at original price (TPU note: presumably 4499 RMB), room temperature is 16 degrees Celsius. Dual fans on the front. The back panel has an AMD logo, but it's a sticker." As theorized by VideoCardz, AMD likely produced a limited number of pre-release "public" MBA cards. The publication reckons that partner companies have received a smattering of samples for evaluation or software development purposes. The presence of an old school Radeon logo (pre-RDNA era) is a head scratcher, given the unit's supposed first-party origin.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

Last week, we got a leaked picture of AMD's reference/OEM/Made by AMD (MBA) design of the Radeon RX 9070 XT in China. However, we have a non-XT card on the menu today, with the reference design also pictured in China. We already know that AMD is not releasing any MBA reference designs of its latest Radeon RX 9000 series GPUs based on the RDNA 4. However, the Chinese black market is the place to be when it comes to finding these MBA cards, probably manufactured in high double-digit or low tripe-digits of units. AMD usually has one of its AIB partners manufacture these for OEM integrated system distribution or partner testing/software optimization.

Pictured below is the Radeon RX 9070 non-XT GPU with an all-black shroud. Unlike official renders, this design is much more toned down. The official render shows a black/gray color combination with an LED-illuminated Radeon logo. However, the official version appears with only a simple aesthetic, without a hint of LED illumination. The card wasn't pictured running, but we assume that there is no LED illumination. Below, you can compare the pictured/leaked Radeon RX 9070 GPU with the official render.

At Embedded World Germany, Qualcomm Technologies, Inc. announced the entry into an agreement to acquire EdgeImpulse Inc., which will enhance its offering for developers and expand its leadership in AI capabilities to power AI-enabled products and services across IoT. The closing of this deal is subject to customary closing conditions. This acquisition is anticipated to complement Qualcomm Technologies' strategic approach to IoT transformation, which includes a comprehensive chipset roadmap, unified software architecture, a suite of services, developer resources, ecosystem partners, comprehensive solutions, and IoT blueprints to address diverse industry needs and challenges.

"We are thrilled about the opportunity to significantly enhance our IoT offerings with Edge Impulse's advanced AI-powered end-to-end platform that will complement our strategic approach to IoT transformation," said Nakul Duggal, group general manager, automotive, industrial and embedded IoT, and cloud computing, Qualcomm Technologies, Inc. "We anticipate that this acquisition will strengthen our leadership in AI and developer enablement, enhancing our ability to provide comprehensive technology for critical sectors such as retail, security, energy and utilities, supply chain management, and asset management. IoT opens the door for a myriad of opportunities, and success is about building real-world solutions, enabling developers and enterprises with AI capabilities to extract intelligence from data, and providing them with the tools to build the applications and services that will power the digital transformation of industries."

TrendForce's latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Most contract prices across applications were seen to have reversed downward. However, increased procurement of high-capacity server DDR5 by major American CSPs helped sustain price momentum for server DRAM.

AMD has quietly updated its web presences with six new processor SKUs—as spotted by Everest (aka Olrak29), and a member of Team Red's subreddit. Community detective work indicates official CPU support lists being updated at some point after February 11. Model names and product identifiers were highlighted; AMD is likely introducing additional Zen 3 "Cezanne" options for OEM partners. The Ryzen 5000G lineup of Zen 3 and Vega iGPU-powered APUs was already well populated, going back to 2021. The "newly" listed AM4 models are: Ryzen 7 5705GE, Ryzen 7 5705G, Ryzen 5 5605GE, Ryzen 5 5605G, Ryzen 3 5305GE and Ryzen 3 5305G.

The familiar "G" tag indicates the presence of an integrated graphics solution; a Cezanne GPU that utilizes GCN 5.1 architecture. A "GE" designation denotes lower power variants; with 35 W TDPs. A small selection of Zen 3-based Ryzen PRO models are available in GE form, including the Ryzen 5 PRO 5650GE SKU. Three of the recently discovered models seem to share identical specifications with Team Red's well established roster of Ryzen 7 5700G, Ryzen 5 5600G, and Ryzen 3 5300G options. Currently, dedicated product pages are not populated with information; instead you are greeted with a "404: Page Not Found" warning. AMD is well known for keeping its older technologies alive for long periods; its RDNA 3+ graphics architecture is expected to last until 2027 (or beyond).

Logitech International announces the availability of original equipment manufacturer (OEM) replacement parts for more than 20 Logitech devices on the Logitech Repair Hub, hosted by iFixit. This action marks a significant global expansion, with spare parts and repair guides now offered in multiple languages to enhance repairability worldwide. A range of Logitech and Logitech G mice, keyboards, and headsets are supported by iFixit across 62 countries, including the United States, Canada, Australia, Japan, and Europe.

"Our products are designed for exceptional quality and longevity. Repairability extends their lifespan further - enhancing value and customer satisfaction," said Prakash Arunkundrum, chief operating officer at Logitech. "Normal wear and tear is inevitable, which is why we strive to make it simpler for people to access original Logitech replacement parts for their devices. Having global iFixit community repair guides in multiple languages encourages more people to do straightforward repairs, saving them money and reducing waste."

AMD's most affordable AM5 processor, the Ryzen 5 7400F, has emerged in Chinese retail channels priced at 849 RMB (approximately $116 with taxes). The pricing suggests the processor could retail for around $100 in other markets before local taxes. The newest silently announced CPU features 6 cores and 12 threads, joining AMD's existing Zen 4 processor lineup. Operating at a base clock of 3.7 GHz with boost capabilities up to 4.7 GHz, the chip maintains the same 32 MB L3 cache as its predecessors while running at a 65 W TDP. Unlike the previous Ryzen 5 7500F, which was limited to system builders and OEMs, the 7400F will be sold directly to consumers through regular retail channels. The processor includes a basic AMD Wraith Stealth cooler in its retail package.

The chip supports standard features found across the AM5 platform, including memory overclocking through AMD EXPO and CPU performance tuning via Precision Boost Overdrive. Like other Ryzen processors, it maintains unlocked multipliers for manual overclocking. The 7400F's appearance follows AMD's recent pattern of quiet releases, similar to the Ryzen 5 9600 that appeared during CES 2025. No official announcement preceded the processor's retail availability. Early listings show the processor available through several Chinese retailers, though availability in other regions remains unclear. The competitive price point could make AMD's AM5 platform more accessible to users building on tighter budgets, though potential buyers will still need to factor in the cost of DDR5 memory and AM5 motherboards required by the platform.

Intel product change notification documents—published on January 6—have revealed the planned "End of Life" (EOL) phasing out of 12th Generation "Alder Lake" mobile processor models. Tom's Hardware has pored over the listed products/SKUs and concluded that the vast majority of Team Blue's mobile-oriented Alder Lake selection are destined for retirement. Team Blue's HX series is being kept alive for a little while longer. Two documents show differing "discontinuance timelines" for their respective inventories—including lower-end Celeron and Pentium Gold SKUs, as well as familiar higher-up Core i3, i5, i7, and i9 families. U, P, H and HK-affixed models are lined up for the chopping block.

Intel's 13th Generation "Raptor Lake" mobile processor selection—comprised of Core 100 (series 1) and Core 200 (series 2)—offers similar silicon makeup. Many equivalent alternatives to older generation "Alder Lake" chips reside here—Tom's Hardware presented a key example: "i5-1235U, which is designated for thin and lightweight laptops. OEMs can instead opt for the i5-1335U, the Core 5 120U, or the Core 5 220U, as they're just better bins of the 1235U on the same FCBGA1744 socket." A significant number of Alder Lake mobile SKUs will be available to OEMs for ordering up until 26 April, with final shipments heading out on 25 October. The rest have been assigned a July 25 order cut-off date, with final shipments scheduled on 26 January 2026.

According to a recent Citigroup analysis, CXMT, China's domestic memory chipmaker, is demonstrating significant progress in its DDR5 production yields. The company's DDR5 yield rates had reached approximately 80%, marking a substantial improvement from its initial 50% yields when production began. This progress builds on CXMT's experience with DDR4 manufacturing, where the company has achieved yields of around 90%. The company currently operates two fab facilities in Hefei, with Fab 1 dedicated to DDR4 production on 19 nm process technology and a 100,000 wafer per month capacity. Fab 2 focuses on DDR5 production using 17 nm technology, with a current capacity of 50,000 wafers per month. CXMT's DDR5 yields could improve further to approximately 90% by the end of 2025.

Despite these improvements, CXMT faces technological challenges compared to industry leaders. The company's current production process is 19 nm for DDR4 and 17 nm for DDR5, lagging behind competitors like Samsung and SK Hynix, which manufacture 12 nm DDR5 chips. This technology gap results in higher power consumption and less favorable form factors for CXMT's products. The company primarily targets domestic Chinese smartphone and computing OEM customers. Looking ahead, CXMT plans to expand its DDR5 and HBM capabilities, with a potential additional capacity of 50,000 wafers per month at Fab 2 in 2025, if market conditions prove favorable. The company is also making progress on HBM2 development, with customer sampling underway and low-volume production expected to begin in mid-2025.

Ultra Accelerator Link (UALink ) Consortium, led by Board Members from AMD, Amazon Web Services (AWS), Astera Labs, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft, have announced the incorporation of the Consortium and are extending an invitation for membership to the community. The UALink Promoter Group was founded in May 2024 to define a high-speed, low-latency interconnect for scale-up communications between accelerators and switches in AI pods & clusters. "The UALink standard defines high-speed and low latency communication for scale-up AI systems in data centers"

Back in August, Intel started shipping its 0x129 microcode update for 13/14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This update fixed incorrect voltage requests to the processor that are causing elevated operating voltage. Intel's analysis showed that the root cause of stability problems is voltage levels that are too high during the operation of the processors. These increases in voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin." Today, the company discovered the root cause of this instability issue and informed users that a new microcode patch is underway. As explained by Intel, the Vmin Shift instability problem stems from a clock tree circuit in the IA core. When exposed to high voltage and temperature conditions, this circuit is vulnerable to reliability degradation. Intel's research has shown that these factors can cause a shift in the duty cycle of the clocks, resulting in system instability.

There are four scenarios that can cause Vmin Shift: increased motherboard power delivery, eTVB microcode algorithm running at higher performance operating states even at higher temperatures, microcode SVID algorithm requesting higher voltages at higher frequencies and longer durations, and finally microcode and BIOS requesting elevated core voltages. For motherboard power settings, mitigation is switching back to default settings. For the eTVB issue, the fix is a 0x125 microcode update. The 0x129 patch fixes the SVID algorithm, and the fourth condition, where microcode and BIOS request elevated core voltage, is fixed by the upcoming 0x12B microcode update. Intel is reportedly working with OEMs to start rolling out the 0x12B update with no apparent performance degradation. While the timeframe for shipping this update is unknown, we expect to see it soon. Additionally, Intel once again confirmed that the upcoming "Arrow Lake" CPUs don't have these issues.

A new forecast from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker shows shipments of personal computing devices are expected to grow 2.6% year over year in 2024 to 398.9 million units. The traditional PC market will remain flat in 2024 with 261 million units shipped while the tablet market is forecast to grow 7.2% year over year as a refresh cycle and project investments are expected to drive the market.

For traditional PCs, the global market excluding China is expected to grow 2.8% in 2024 as China continues to suffer through a confluence of macroeconomic challenges, including high youth employment, deflation, and a tumultuous real estate market. However, China's economic concerns have largely impacted just the PC market as tablet demand has proven to be more resilient thanks to Huawei's efforts.

Intel's Sales and Marketing Group (SMG) has announced a 35% reduction in costs as the company looks to streamline operations and adapt to challenging market conditions. The cuts, revealed during an all-hands meeting on August 5th, will impact both jobs and marketing expenses within the SMG. Intel has directed the group to "simplify programs end-to-end" by the end of the year, a directive that comes on the heels of the company's announcement that it would lay off 15% of its global workforce to save $10 billion in operating expenses. "We are becoming a simpler, leaner, and more agile company that's easier for partners and customers to work with while ensuring we focus our investments on areas where we see the greatest opportunities for innovation and growth," Intel said in a statement to CRN. The company emphasized that this restructuring is about "building a stronger Intel for the future," with partners integral to its plans.

The job cuts within the SMG are expected to target overlapping responsibilities, such as account managers and industry-focused teams, which can confuse customers navigating Intel's complex organization. Additionally, the company plans to significantly reduce its marketing budget and simplify programs, aiming to save at least $100 million in the latter half of 2024 and an additional $300 million in the first half of 2025. The impact will also be felt in Intel's market development fund (MDF), a crucial tool for supporting OEMs and other partners through events, training, and more. An ex-Intel executive warned that the MDF had become vital as the company's product leadership waned, allowing it to maintain valuable relationships with partners. As Intel navigates these changes, its partners are bracing for the impact, with one CEO describing the situation as everyone "hunkering down and just waiting to hear something." Another partner executive expressed concerns about Intel's ability to maintain the level of service and support its customers have come to expect.

AMD today announced the signing of a definitive agreement to acquire ZT Systems, a leading provider of AI infrastructure for the world's largest hyperscale computing companies. The strategic transaction marks the next major step in AMD's AI strategy to deliver leadership AI training and inferencing solutions based on innovating across silicon, software and systems. ZT Systems' extensive experience designing and optimizing cloud computing solutions will also help cloud and enterprise customers significantly accelerate the deployment of AMD-powered AI infrastructure at scale. AMD has agreed to acquire ZT Systems in a cash and stock transaction valued at $4.9 billion, inclusive of a contingent payment of up to $400 million based on certain post-closing milestones. AMD expects the transaction to be accretive on a non-GAAP basis by the end of 2025.

"Our acquisition of ZT Systems is the next major step in our long-term AI strategy to deliver leadership training and inferencing solutions that can be rapidly deployed at scale across cloud and enterprise customers," said AMD Chair and CEO Dr. Lisa Su. "ZT adds world-class systems design and rack-scale solutions expertise that will significantly strengthen our data center AI systems and customer enablement capabilities. This acquisition also builds on the investments we have made to accelerate our AI hardware and software roadmaps. Combining our high-performance Instinct AI accelerator, EPYC CPU, and networking product portfolios with ZT Systems' industry-leading data center systems expertise will enable AMD to deliver end-to-end data center AI infrastructure at scale with our ecosystem of OEM and ODM partners."

Intel has officially started shipping the "0x129" microcode update for its 13th and 14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This critical update is currently being pushed to all OEM/ODM partners to address the stability issues that Intel's processors have been facing. According to Intel, this microcode update fixes "incorrect voltage requests to the processor that are causing elevated operating voltage." Intel's analysis shows that the root cause of stability problems is caused by too high voltage during operation of the processor. These increases to voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin"—it's a theoretical construct, not an actual voltage, think "speed for an airplane required to fly". The latest 0x129 microcode patch will limit the processor's voltage to no higher than 1.55 V, which should avoid further degradation. Overclocking is still supported, enthusiasts will have to disable the eTVB setting in their BIOS to push the processor beyond the 1.55 V threshold. The company's internal testing shows that the new default settings with limited voltages with standard run-to-run variations show minimal performance impact, with only a single game (Hitman 3: Dartmoor) showing degradation. For a full statement from Intel, see the quote below.

Despite recent rumors speculating on NVIDIA's supposed cancellation of the B100 in favor of the B200A, TrendForce reports that NVIDIA is still on track to launch both the B100 and B200 in the 2H24 as it aims to target CSP customers. Additionally, a scaled-down B200A is planned for other enterprise clients, focusing on edge AI applications.

TrendForce reports that NVIDIA will prioritize the B100 and B200 for CSP customers with higher demand due to the tight production capacity of CoWoS-L. Shipments are expected to commence after 3Q24. In light of yield and mass production challenges with CoWoS-L, NVIDIA is also planning the B200A for other enterprise clients, utilizing CoWoS-S packaging technology.

In a statement for Tom's Hardware, Intel has announced a two-year warranty extension for its 13th and 14th Generation Core processors. This decision comes in response to widespread reports of crashes and instability affecting a broad range of models, from high-end flagship chips to mid-range offerings. The extension effectively increases the standard warranty period from three to five years for most boxed processors, with even the limited-edition models seeing an increase from one to three years. This move aims to reassure customers and mitigate concerns about potential long-term damage to affected chips. Intel has identified excessive voltage as the root cause of the problem, which has led to unexpected system crashes and blue screens of death (BSODs), particularly during gaming and other demanding tasks.

The company plans to release a microcode update by mid-August to prevent further degradation in unaffected processors. However, this update will not resolve issues in chips that have already experienced problems, and users with malfunctioning processors will need to seek replacements. The tech giant has faced criticism for its delayed response to the issue, which has plagued users for months. In its statement, Intel also addressed concerns about Via Oxidation, clarifying that while this separate issue was discovered in 2022, it is not the cause of the current instability problems. The company claims to have implemented fixes and enhanced screening procedures for Via Oxidation by early 2023, with affected chips reportedly removed from the supply chain by early 2024.

Long-term reliability issues continue to plague Intel's 13th Gen and 14th Gen Core desktop processors based on the "Raptor Lake" microarchitecture, with users complaining that their processors have become unstable with heavy processing workloads, such as games. This includes the chips that have minor levels of performance tuning or overclocking. Intel had earlier isolated many of these stability issues to faulty CPU core frequency boosting algorithms, which it addressed through updates to the processor microcode that it got motherboard- and prebuilt manufacturers to distribute as UEFI firmware updates. The company has now come out with new findings of what could be causing these issues.

In a statement Intel posted on its website on Monday (22/07), the company said that it has been investigating the processors returned to it by users under warranty claims (which it has been replacing under the terms of its warranty). It has found that faulty processor microcode has been causing the processors to operate under excessive core voltages, leading to their structural degradation over time. "We have determined that elevated operating voltage is causing instability issues in some 13th/14th Gen desktop processors. Our analysis of returned processors confirms that the elevated operating voltage is stemming from a microcode algorithm resulting in incorrect voltage requests to the processor."

According to a recent leak from Golden Pig on Weibo, AMD is gearing up to introduce the Ryzen 7 8745HS, a modified version of the existing Ryzen 7 8845HS APU. The key difference in this new chip lies in its neural processing capabilities. While the 8845HS boasts AMD's XDNA-based NPU (Neural Processing Unit), the upcoming 8745HS is rumored to have this feature disabled. Specifications for the 8745HS are expected to closely mirror its predecessor, featuring eight Zen 4 cores, 16 threads, and a configurable TDP range of 35-54 W. The chip will likely retain the Radeon 780M integrated GPU with 12 Compute Units. However, it is possible that AMD might introduce slight clock speed reductions to differentiate the new model further.

It is also worth pointing out that Hawk Point generation is not Copilot+ certified due to first-generation XDNA NPU being only 16 TOPS out of 40 TOPS required, so having an NPU doesn't help AMD advertise these processors as Copilot+ ready. The success of this new variant will largely depend on its pricing and adoption by laptop/mobile OEMs. Without the NPU, the 8745HS could offer a more budget-friendly option for users who don't require extensive local AI processing capabilities. After all, AI workloads remain a niche segment in consumer computing, and many users may find the 8745HS an attractive alternative if pricing is reduced, especially given the availability of cloud-based AI tools.

TrendForce reports that while the enterprise sector continues to invest in server infrastructure—especially with the rising adoption of AI driving demand for enterprise SSDs—the consumer electronics market remains lackluster. This, combined with NAND suppliers aggressively ramping up production in the second half of the year, is expected to push the NAND Flash sufficiency ratio up to 2.3% in the third quarter, curbing the blended price hike to a modest 5-10%.

This year, NAND Flash prices saw a robust rebound as manufacturers kept production in check during the first half, helping them regain profitability. However, with a noticeable ramp-up in production and sluggish retail demand, wafer spot prices have dropped significantly. Some wafer prices are now over 20% below contract prices, casting doubts on the sustainability of future price hikes.

Intel, in its Computex 2024 event unveiled its Core Ultra 300 "Lunar Lake" processor, along with a Q3 2024 date for the processors. It now turns out that the processors won't arrive until Fall 2024, specifically September, when the various notebook OEMs will merely announce their products based on the chips, followed by market availability of these notebooks through Holiday 2024, according to a DigiTimes report. The report also says that Intel's Core Ultra "Arrow Lake-S" desktop processors could see an October 2024 announcement and availability for at least the Unlocked K- and KF SKUs, along with compatible Socket LGA1851 motherboards based on the top Intel Z890 chipset.

The DigiTimes report invited a clarification from Intel through Digital Trends. The company in a statement reaffirmed that the chips will be available "starting in Q3 2024, as noted at Computex." This statement aligns with the timeline that the company would commence shipments of "Lunar Lake" processors to OEMs starting in June, followed by product announcements and market availability in the following months.

The PC (desktops, notebooks, and workstations) market in Mainland China is forecast to contract by 1% in 2024 according to the latest Canalys data. The first quarter of the year already saw a sharp decline, with shipments down 12%, in contrast to the global market which returned to growth. Desktop shipments are expected to perform well in 2024, growing 10% annually as they benefit from commercial sector refresh demand, especially from large state-held enterprises and local governments. Notebook shipments are set to drop 5%, as demand from consumers and the private sector is anticipated to remain cautious on short-term expenditure such as PCs.

China's PC market trajectory is diverging from global trends in its recovery journey. In Q1 2024, the commercial sector bore the brunt of the market downturn, undergoing a 19% decline due to weak IT spending by large enterprises. The decline in consumer shipments was milder, with shipments dropping 8%. However, despite the muted performance in 2024, significant local developments point to a stronger market in 2025, in which PC shipments are expected to grow 12%.