Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is elated to announce the launch of TOUGHRAM XG RGB - White DDR4 Memory, a new edition of the high-end TOUGHRAM XG RGB series. The new white series comes with frequencies up to 3600 MHz, 4000 MHz, 4400 MHz and 4600 MHz and capacities up to 16 GB (8 GB x2), 32 GB (16 GB x2) and 64 GB (32 GB x2), giving users a wide range of selections. Now users can match up the same white-colored chassis and cooling components to create their own style and to form the ideal PC build, especially for those who are seeking an all-white theme, the White TOUGHRAM XG RGB DDR4 series can help you to achieve a more comprehensive all-white setup.

Being compatible with the latest AMD and Intel motherboards, the White TOUGHRAM XG RGB series has been through rigorous tests to select tightly-screened ICs, designed with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. The White TOUGHRAM XG RGB series also carries an exclusive style from its appearance thanks to its special design, there are 2 different colors, detailing an aluminium trim with a chrome stripe in the middle which makes the TOUGHRAM XG RGB series stand out from your everyday RAM modules.

Intel's next entry-level processor for the Socket LGA1700 platform is the Core i3-12100. Carved out of the "Alder Lake-S" H0 silicon, this processor features 4 "Golden Cove" performance cores with HyperThreading enabling 8 logical processors, and no E-cores. The processor ticks at 3.30 GHz, with 4.30 GHz Turbo Boost 2.0 frequency. Each of the four cores has 1.25 MB of L2 cache, and they share 12 MB of L3 cache. The i3-12100 gets a Gen12 Xe LP-based iGPU, while a variant of the processor, the i3-12100F, lacks integrated graphics. Intel is rating the processor base power value at 60 W, with 77 W maximum turbo power.

XFastest scored an i3-12100 engineering sample, and wasted no time in comparing it with the Ryzen 3 3300X. The i3-12100 was tested on an ASRock Z690 Steel Legend motherboard that has DDR4 memory slots. 16 GB of dual-channel DDR4-3600 memory and RTX 3060 Ti were used on both the Intel and AMD test-beds. A Ryzen 3 3100 was also used on the AMD side. Right off the bat, we see the i3-12100 take a significant lead over the AMD chips at PCMark, posting a roughly 15% performance lead. Cinebench R23 is another test where the little "Alder Lake" scores big, posting a roughly 26% performance lead in the multi-threaded test, and 27% in the single-threaded test. This is mainly because the 3300X is based on "Zen 2" while the i3-12100 uses the cutting-edge "Golden Cove" cores. AMD hasn't bothered with "Zen 3" based Ryzen 3 desktop processors in the retail market.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced three of its latest automotive chip solutions: the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series.

"Smarter and more connected automotive technologies for enriched in-vehicle experiences including entertainment, safety and comfort are becoming critical features on the road," said Jaehong Park, Executive Vice President of System LSI Custom SOC Business at Samsung Electronics. "With an advanced 5G modem, an AI-enhanced multi-core processor, and a market-proven PMIC solution, Samsung is transfusing its expertise in mobile solutions into its automotive lineup and is positioned to expand its presence within the field."

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today released the new NVR network surveillance server - QVP-41B - that integrates a Power-over-Ethernet (PoE) switch with sixteen 30-watt Gigabit PoE ports, two RJ45/SFP combo ports, and two 2.5GbE host management ports, supporting all kinds of PoE devices and creating an intelligent surveillance infrastructure. Powered by an Intel Celeron J4125 quad-core processor, the QVP-41B comes with four 3.5-inch SATA drive bays, providing great storage potential and high-speed networking to meet the requirements of monitoring small/medium-sized environments.

"With built-in 140 W PoE and supporting up to 24 cameras, the QVP-41B provides complete network surveillance server capabilities. Surveillance feeds can also be simultaneously recorded and monitored using QNAP's QVR Smart Client application." said Alan Kuo, adding "recorded footage can be intelligently analyzed by using QVR Smart Search, and for large-scale deployments (such as retail) all QVR Pro servers including the QVP-41B can be centrally managed through QNAP's QVR Center."

Intel debuted its 12th Gen Core "Alder Lake-S" desktop processor family late last month with only the unlocked "K" and "KF" SKUs targeting gamers and PC enthusiasts, alongside only the top Z690 chipset motherboards. The company is preparing to expand the lineup early next year with the addition of at least seven more SKUs (excluding additional "F" variants that lack integrated graphics). These processors could also introduce more value-conscious motherboard chipsets, such as the B660 and H670. momomo_us on Twitter, a reliable source with hardware leaks, predicts specs and a possible mid-January launch date for these chips.

The lineup possibly includes the Core i9-12900 and i9-12900F at the top, followed by the i7-12700 and i7-12700F, and the meaty Core i5 lineup that includes the i5-12600 and i5-12600F; the i5-12500, and the i5-12400/F. At least two Core i3 series SKUs could also be launched. The possible clock-speeds, and L3 cache sizes for the SKUs are tabulated below. What stands out from these SKUs is the specs of the Core i5-12600. We earlier thought it would be based on the larger "C0" silicon, with 6 P-cores and 4 E-cores, but it turns out, that the SKU is based on the smaller "H0" silicon with just 6 P-cores and no E-cores. Read more about the two silicon variants of "Alder Lake-S" in our older article. The i5-12600 will have significantly different performance and energy efficiency numbers than the i5-12600K.

DDR5 may soon have reason to be an even more expensive early-adopter piece of tech than it currently is, according to electronic component supplier 12chip. While semiconductor manufacturers worldwide grapple with logistics and components shortages, the DRAM market has been left somewhat unscathed - up to now. DRAM fabrication - even DDR5 - isn't done on leading-edge nodes but on older, more mature ones (such as 14 nm). According to 12chip, manufacturers are having no problem in scaling their DRAM manufacturing on these older nodes to meet demand.

However, DDR5 is being directly impacted by the current logistics issues due to lack of adequate Power Management Integrated Circuit (PMIC) chips - which DDR5 has integrated in the DIMM proper. Currently, lead times for PMIC orders are estimated at 35 weeks, placing additional strain on system assemblers and DRAM manufacturers - and forcing delays and bottlenecks throughout the supply chain. Additionally, the fact that PMIC chips for DDR5 are ten times as expensive as equivalent DDR4 power management solutions doesn't bode well for future price action on DDR. Should this situation continue, higher prices for DDR5 modules are to be expected due to a deteriorating supply/demand ratio - particularly relevant if you're thinking about putting together a build based on Intel's Alder Lake platform. As always, take this report with a grain of salt.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched the 3-bay RAID 5 2.5 GbE TS-364 NAS with M.2 PCIe Gen3 NVMe SSD slots and 2.5 GbE connectivity, providing optimized performance in home/office environments. Supporting light virtualization/containers and HDMI output, the TS-364 provides a centralized storage, backup, file sharing, and multimedia solution that features rich NAS applications for greater productivity and boundless entertainment.

"The new TS-364 NAS allows building a secure RAID 5 array with three disks for optimized storage capacity, cache performance and protection against one disk failing. With M.2 PCIe Gen3 slots, the TS-364 enables cache acceleration or SSD storage pools for improved performance, or Edge TPU for AI image recognition. Its 2.5 GbE port accelerates network transmission while its USB 3.2 Gen2 (10 Gbps) ports allow quickly transferring large media files," said Joseph Chiang, Product Manager of QNAP.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the brand-new RACING Z690GTA motherboard. Enter the battlefield in confidence with BIOSTAR's renowned RACING series Z690GTA motherboard. Designed based on the Intel Z690 chipset with the latest LGA1700 socket, the new RACING Z690GTA motherboard is the best choice to run the latest Intel 12th gen Alder Lake processors.

Carrying forward the legacy of its predecessors the new RACING Z690GTA motherboard looks and feels otherworldly. Style, power, and grace packed in an exciting new armor design; the motherboard is tastefully designed to make any PC build stand out from the rest. Featuring a 17-phase power design and Active cooling armor gear with fins heat sink, BIOSTAR has actively focused on stable power management and heat dissipation this year, greatly enhancing the performance and durability of its components.

EVGA today rolled out the X570 FTW WiFi, its second AMD Socket AM4 motherboard. While the X570 DARK is aimed at professional overclockers looking to squeeze the most out of Ryzen 5000 series processors, the X570 FTW is aimed at a slightly broader audience—enthusiasts. The board comes with four DDR4 DIMM slots to illustrate this, compared to two slots (1 DIMM per channel) on the X570 DARK. The board pulls power from a combination of 24-pin ATX, and 8+4 pin EPS. It features a 15-phase CPU VRM that's cooled by aluminium fin-stack heatsinks. The Socket AM4 processor is wired to four DDR4 DIMM slots, two PCI-Express 4.0 x16 (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring.

Besides this CPU-attached M.2 NVMe Gen 4 slot, two additional Gen 4 slots are put out by the X570 chipset, cooled by a large aluminium monoblock heatsink. The X570 chipset itself is cooled fanless, which means it's likely the X570S variant. Eight SATA 6 Gbps ports make for the rest of the storage connectivity. USB connectivity includes three 10 Gbps USB 3.1 Gen2 ports at the rear panel, two 5 Gbps Gen1 ports, and two additional Gen1 ports through internal headers. The onboard audio solution uses a Realtek ALC1220 CODEC with SV3H615 headphones amp. Networking connectivity includes Intel-sourced WiFi 6 and 1 GbE. Available to EVGA Elite members, the EVGA X570 FTW WiFi is priced at USD $499, about $200 cheaper than the X570 DARK.

With Intel's Alder Lake processor generation launch, the platform merges support of two different DDR memory standards: DDR4 and DDR5. While there are motherboards that offer the latest DDR5 standard, there are boards that provide users to use the cheaper DDR4 memory option in their builds as we transition to the newer standard and newer memory becomes more available. The DDR5 products are currently on the expensive side, and DDR4 represents a good choice for creating a PC build in the following years, at least in the transition to DDR5 standard's better availability and lower prices.

According to Moore's Law is Dead Twitter account, the DDR4 support may reside for a little longer on Intel's platforms. As per their sources, Intel's 13th generation Core processors, codenamed Raptor Lake, will carry over DDR4 platform support and possibly retain compatibility with the 12th generation Alder Lake platform. That means that the Z690 and future H670/B660/H610 boards could be compatible with Raptor Lake-S and also carry support for the DDR4 memory protocol for it. This could indicate that Alder Lake-S buyers that build PCs with DDR4 memory could have a viable processor upgrade path without upgrading the memory. Of course, information like this should be taken with a grain of salt.

The latest 12th Gen Core processor is the first to incorporate Intel 7 process technology and Hybrid Architecture. To match the performance of the 12th Gen Core processors, all MSI Z690 Series motherboards are upgraded. The highlight of the new platform is the latest PCIe 5.0 and DDR5. All MSI Z690 motherboards support PCIe 5.0 solution which provides 128 GB/s of transfer bandwidth. MSI has Z690 DDR5 and DDR4 motherboards to meet different needs. Excitingly, MSI OC LAB tuning boosts the memory frequency performance by over 30% based on MSI's exclusive Memory Boost technology. With the optimized layout, MSI uses the SMT process for both PCIe 5.0 and DDR5 to maintain the stability of high-speed transfer.

The newest core processors need mighty power phases. The MSI Z690 Gaming Series motherboards have at least 16 DrMOS with Duet Rail Power System and dual 8-pin CPU connectors, which guarantee stable and strong current delivered to the core processor. Moreover, the MSI Z690 Series motherboards have Server Grade PCB with 2oz thickened copper, which allows for higher transfer speed. (*1) The upgraded power phases typically have higher temperatures. However, heat dissipation isn't an issue for us. Our Z690 motherboards feature an Extended Heatsink, 7 W/mK thermal pad, and M.2 Shield Frozr. The MEG and MPG Series motherboards, which are popular among gamers all over the world, have Heat-pipe Design and double-side M.2 thermal that can drive maximum performance.

Newegg has been on a roll this week when it comes to leaking pricing of upcoming motherboards and this time they've managed to out no less than seven upcoming models from Gigabyte. Unfortunately we didn't get a first hand view of the leaks, so we have to make do with what little information is available for now.

The pricing of the seven leaked boards ranges from US$199.99 to US$469.99, which is less painful than what we've seen so far from other brands. The base model is the Gigabyte Z690 UD DDR4, which even at US$199.99 is almost $50 more than the current Z590 UD board from the same retailer. Moving up a step, we have the Z690 Gaming X DDR4 at US$229.99, followed by the Z690 Aorus Elite AX DDR4 at US$269.99 and the Z690 Aero G DDR4 at US$289.99.

If you act quickly and live in Canada, you might be able to score an MSI Pro Z690-A DDR4 motherboard from Newegg Canada, as they currently have the board listed for sale. This gives us an official price for the MSI board, which also gives us a rough indication of what to expect in terms of a price bump over the Z590 boards.

Newegg Canada has the board listed for C$279.99 (US$227), which should be compared to the MSI Z590-A Pro, which is listed at C$234.99, or a price premium of C$45 or US$37. Considering that the boards are almost identical in terms of features as per our earlier look at the leaked image of the board, bar an extra M.2 slot and an additional PCIe x16 slot, it seems like we can expect a fairly steep price hike across the board (no pun intended) when it comes to Z690 motherboards, as these physical connectors are worth the additional hike in price.

Update: It would appear that Newegg has realised their mistake and the board is no longer listed for sale.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to introduce the IPC970, its new feature-rich, expandable 4-slot industrial system. This intelligent industrial computer is powered by the Intel Xeon or 10th generation Intel Core i7/i5/i3 processors (code name: Comet Lake S) with the Intel W480E chipset. The powerful edge computing system supports NVIDIA GeForce RTX 3090 graphics card with 10,496 CUDA cores and a whopping 24 GB of GDDR6X memory for powerful GPU computing capability. The ruggedized IPC970 enables simultaneous AI processing for intelligent AI computing at the edge.

The Axiomtek's IPC970 provides flexible expansion options with one I/O module slot and three PCIe slots plus one blank expansion slot. In addition, it has a full-size PCIe Mini Card slot for Wi-Fi/Bluetooth/LTE modules, one M.2 Key B 3042/3050 socket for 5G wireless connections, and one M.2 Key E 2230 socket for Wi-Fi/Bluetooth modules. Its front-facing I/O design makes it easy to access and deploy. To ensure stable and reliable operation in harsh industrial environments, the IPC970 has a wide operating temperature range of -10°C to +70°C and a power input of 24 V DC (uMin=19 V/uMax=30 V) with power-on delay function, over-voltage protection, over current protection, and reverse voltage protection.

The first mainstream Z690 boards have made an appearance online in the shape of ASUS' Prime Z690-P series. As with most of ASUS' Prime boards, these are fairly basic boards, but shouldn't leave the average user wanting for much, although ASUS has made a rather odd layout decision on these boards that we can't quite grasp.

The four models on display are the Prime Z690-P WiFi D4, Prime Z690-P D4, Prime Z690-P and Prime Z690M-Plus D4. The last model doesn't strictly belong to the Prime Z690-P family, but it follows a pretty similar overall design. The Prime Z690-P is obviously the only DDR5 SKU among the four boards, although from what we can tell, there are no other differences between it and the equivalent DDR4 model.

With the rapid development of advanced technologies, such as 5G, the Internet of Things (IoT), Artificial Intelligence (AI), and 8K, people are placing more stringent requirements on the convenience, intelligence, and functional integration of their electronics. This has given rise to new development opportunities in the storage industry. As we progress further into the digital revolution, intelligent electronics will require small-capacity storage products which feature an increased level of reliability and stability. High-temperature tolerance in storage products will be vital for customers in the intelligent and small-sized consumer electronics market.

Longsys recently launched the FORESEE DDR4, which utilizes 96-ball thin fine ball grid array (TFBGA) encapsulation. The product's manufacturing process, transmission speed, power consumption, and high-temperature reliability all perform at an industry-leading level.

If the amount of upcoming Z690 was anything to go by, one could presume that the motherboard makers are backing Intel's upcoming platform to the max, as a leaked list of what should be close to every Z690 that will hit the market, counts a total of 98 boards. The list covers ASRock, ASUS, Biostar, NZXT, Gigabyte and MSI, but not EVGA and some other smaller players.

ASUS is apparently planning no less than 30 different models/SKUs, since some are clearly DDR4/DDR5 SKUs of the same model or SKUs with or without Wi-Fi, but even so, that's a massive launch lineup. Gigabyte isn't far behind with 27, followed by MSI at 24 and ASRock at 14, if we didn't count wrong. There isn't much news in terms of details of each of the boards here though, but it's clear that the high-end SKUs are mostly DDR5, while the mid-range and standard models are mostly using DDR4. The only slight surprise here is that only ASRock has more DDR4 than DDR5 models, with ASUS having exactly half of each, but Gigabyte and MSI are going with a preference for DDR5. ASRock, ASUS and Gigabyte appear to have liquid cooled SKUs, but it's not clear if MSI will offer such a SKU of its Godlike board.

Ahead of the rumored late-October debut of Intel's 12th Gen Core "Alder Lake" processors, motherboard makers started teasing their compatible Socket LGA 1700 products. Older reports suggest that in 2021, Intel will only release unlocked "K" and "KF" SKUs, and motherboard partners will only launch boards based on the top Intel Z690 chipset. The lineup is expected to be joined by more affordable non-K SKUs in Q1-2022, along with lower chipset models such as the B660 and H670.

The MEG Z690 ACE appears to introduce a new design scheme with die-cast metal mesh rear I/O shrouds, and a gold+black trim. The I/O shroud design is interesting as it lets the VRM heatsink underneath breathe better. The silver-white MPG motherboard is possibly the MPG Z690 Force. MSI is probably trying to get this to rival the ROG Strix-A SKU by ASUS. The third teaser, of a brushed gunmetal shroud, is likely the MAG Z690 Tomahawk. Like most other brands, MSI appears to have an extensive lineup of Socket LGA 1700 motherboards with DDR4 memory slots, although boards with DDR4 are restricted to the MAG and entry-level PRO series. The mid-tier MPG and enthusiast-segment MEG series boards only come with DDR5.

TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, presents its line-up of 8-bay storage servers designed to meet the needs of modern businesses for enterprise virtualization, data-intensive applications, and service continuity. TerraMaster's Rackmount NAS Series is equipped with the latest technologies and advanced securities to deliver efficient performance with excellent data security making it ideal for business and government use.

The TerraMaster 8-Bay Rackmount NAS Series support up to 1000 user accounts with RBAC rights management and Windows ACL. This allows easy user and access rights management. The 8-Bay Rackmount NAS Series supports 2.5" and 3.5" drives and comes fitted with four RJ-45 1 GbE LAN ports. All models also come with one PCIe 3.0 X16 slot and two PCIe 3.0 x8 slots offering expansion flexibility for 10GbE NIC cards or dedicated RAID cards.

The latest IRDM modules are designed for gamers and professionals to provide not only an aesthetic experience, but also high performance. Each module is equipped with 8 LEDs and is compatible with RGB lighting control software from leading motherboard manufacturers such as ASUS, MSI, GIGABYTE, and ASRock. This ensures that the lighting effects can be programmed in many different ways, resulting in the ability to synchronize with other RGB devices like the motherboard, computer case, cooling system, keyboard, headphones, or computer mouse. Initially, the modules will be available for sale in the currently most popular kit of 2x 8 GB 3600 MHz, but the manufacturer announces that products with other specifications will soon be added to the series.

IRDM RGB DDR4 modules are built from carefully selected components and Micron memory chips. The 3600 MHz frequency at 18-22-22 timings ensures fast and stable operation of the modules, while the black heatsink built from a combination of aluminium, silicon, and magnesium perfectly dissipates heat, even during intensive use. "We are handing our customers a product that has been long-awaited and desired on the market. We are convinced that the parameters of the new IRDM memory will be appreciated by the most demanding users, especially gamers, case modders, and enthusiasts of computer sets with RGB lighting. We wanted to provide the best product in terms of both technical characteristics and a timeless design", says Wiesław Wilk, the CEO of Wilk Elektronik SA.

GIGABYTE Technology,an industry leader in high-performance servers and workstations, today announced two new W-series workstations, W771-Z00 for AMD Ryzen Threadripper PRO processors and W331-Z00 for AMD Ryzen processors, as well as a WRX80 chipset motherboard, MC62-G40, and a TRX40 chipset rack server, G182-C20. Remote work and a high level of compute for 3D design or engineering are driving factors for these new professional products.

Today's engineers and power users are focused on high demanding workloads and require a powerful workstation to enable them to work effectively and efficiently. The W771-Z00 coupled with a top-tier processor from the AMD Ryzen Threadripper PRO family, such as the 3995WX with 64 cores 128 threads, make this the most powerful workstation to date. The motherboard for this workstation is the MC62-G40. Based around the AMD WRX80 chipset, the W771-Z00 shares high-end features that are typically only found in servers.

At the COMPUTEX 2021 Virtual Expo in May, TEAMGROUP presented the core value underlying its new products in 2021: "Chill the Heat, Feel the Speed, Make it Big", representing cooling, DDR5, and large capacity, the three major focuses TEAMGROUP builds its new products and design concepts around. Tonight at 10 PM (GMT+8), everyone is sincerely invited to the TEAMGROUP Online Launch Event 2021 via official website, Facebook Page, and YouTube channel as it again takes the three focuses to the next level with its powerful new technical capabilities and innovative technologies. To celebrate the event with the world, TEAMGROUP will give away a Gaming Desktop PC and other prizes worth up to $7,000 USD. Make sure to stay tuned for the TEAMGROUP Online Launch Event 2021.

In recent years, TEAMGROUP has been focusing on developing diverse cooling solutions and applying unique materials to the SSD of the Gaming product line, T-FORCE. Inspired by the four natural elements of wind, fire, water, and earth, TEAMGROUP has utilized four exclusive components of cooling to T-FORCE gaming products. The wind element can be found in TEAMGROUP's CARDEA A440 Pro M.2 PCIe SSD as further improvements are made on existing aluminium fin thermal conductivity technology for fluid ventilation and more effective cooling performance. The impressive read/write speeds of the CARDEA A440 Pro are also approaching the defined maximum speeds for Gen4 x4 by PCI-SIG at an outstanding 7,400/7,000 MB/s.

Once again, the Eurasian Economic Commission has provided us with a look into a wide range of upcoming motherboard models and this time it's Gigabyte's Z690 lineup. The company appears to be reading no less than 17 DDR5 models and 10 DDR4 models, which is simply a massive amount of motherboards. There are two models that caught our eye, firstly the Aorus Tachyon, which continues HiCookies overclocking SKU from the current Z590 Aorus Tachyon and secondly the Aorus Elite Stealth, which may or may not be a passively cooled board, suggesting the Z690 chipset might be coming with active cooling.

We'd hazard a guess and say that not all SKUs will be available at launch, since it's unlikely that there will be a demand for this many different models. A few other noteworthy mentions here include the Z690M Aorus Elite DDR4 (with or without Wi-Fi), which seems to be a higher-end mATX model and it looks like we're getting three Mini-ITX models with the Z690I Aorus Ultra, the Z690 Aero D and the Z690I A Ultra DDR4. Also gone is the Vision name, as it has been replaced with Aero, a brand Gigabyte has used for some of its AMD boards. Time will tell what actually lands in the various markets at the end, as it might be that some of these SKUs are region specific as well.

Following the peak period of production in 3Q21, the supply of DRAM will likely begin to outpace demand in 4Q21, according to TrendForce's latest investigations (the surplus of DRAM supply is henceforth referred to as "sufficiency ratio", expressed as a percentage). In addition, while DRAM suppliers are generally carrying a healthy level of inventory, most of their clients in the end-product markets are carrying a higher level of DRAM inventory than what is considered healthy, meaning these clients will be less willing to procure additional DRAM going forward. TrendForce therefore forecasts a downward trajectory for DRAM ASP in 4Q21. More specifically, DRAM products that are currently in oversupply may experience price drops of more than 5% QoQ, and the overall DRAM ASP will likely decline by about 3-8% QoQ in 4Q21.

Although WFH and distance learning applications previously generated high demand for notebook computers, increasingly widespread vaccinations in Europe and North America have now weakened this demand, particularly for Chromebooks. As a result, global production of notebooks is expected to decline in 4Q21, in turn propelling the sufficiency ratio of PC DRAM to 1.38%, which indicates that PC DRAM will no longer be in short supply in 4Q21. However, PC DRAM accounts for a relatively low share of DRAM manufacturers' DRAM supply bits, since these suppliers have allocated more production capacities to server DRAM, which is in relatively high demand. Hence, there will unlikely be a severe surplus of PC DRAM in 4Q21. It should also be pointed out that, on average, the current spot prices of PC DRAM modules are far lower than their contract prices for 3Q21. TrendForce therefore expects an imminent 5-10% QoQ decline in PC DRAM contract prices for 4Q21, with potential for declines that are even greater than 10% for certain transactions, as PC OEMs anticipate further price drops in PC DRAM prices in the future.