MSI, the world's leading gaming motherboard brand, proudly announces the new flagship Intel Z590 MEG Series motherboards - the MEG Z590 ACE GOLD EDITION, MEG Z590 UNIFY, and MEG Z590 UNIFY-X. They're not only tailored for enthusiast gamers but also offered more possibilities to satisfy various desires - the luster of gold against endless darkness.

Gold symbolizes a unique attribute of pride and elites. The pure luster of gold, 24K presents utmost in color and luminosity. With craftsmanship and hours of dedication, the 24K gold and state-of-the-art technology have been harmonized into one. The MEG Z590 ACE GOLD EDITION boasts premium aesthetics with a brand new color scheme - the platinum color finish and genuine 24K-gold foil heatsink perfectly show off the concept of beauty.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

The EUROCOM Sky Z7 R2, based on the Intel Z590 Express chipset, features the most powerful NVIDIA GeForce RTX GPUs available today (up to NVIDIA GeForce RTX 3080). This Mobile Supercomputer is available with choice of desktop-level 11th generation, Tiger Lake, Intel CPUs (up to i9-11900K), up to 128 GB DDR4 memory and up to a whopping 32 terabytes of the fastest NVMe storage available today (PCIe 4.0 is supported). The EUROCOM Sky Z7 R2 features high-speed Thunderbolt 4 technology along with a multitude of I/O ports, unmatched security, as well as award-winning network detection and prioritization via Killer E3000, with speeds up 2.5 Gbps.

This EUROCOM Mobile Supercomputer is specifically designed with fully-upgradeable components featuring upgradeable, non-MaxQ GPU (via MXM 3.1 V 2.0 technology) and desktop level CPU (via LGA1200 socket), with easy-to-access and fully-upgradeable internal hardware, battery and external power.

When governments need a hardware upgrade, they will usually take the route of exploring options with security in mind. However, if you happen to have some engineering talent to employ on a new project, why wouldn't you just build a custom motherboard for your own purposes. Today, GS Group Holding and Philax, have announced that they are starting the manufacturing of Russia's first motherboard based on a B450 chipset from AMD. Looking at the motherboard, which you can see below, you might find it very similar to those of ASRock. And that is because Philax has a licensing agreement with ASRock to use the design of the B450M Pro4 motherboard, with the addition of a TPM module which is often used by government agencies, to produce this board.

Producing around 40,000 pieces, these motherboards are expected to handle anything from 4000 series to 5000 series of AMD processors. As far as the specifications go, the board is coming in a standard Micro-ATX form factor. It is equipped with four DDR4 memory slots that can take a memory with up to 3200 MHz speed. There are two PCIe 3.0 x16 slots and one PCIe 2.0 x1 slot, which are of course limited by CPU choice. The motherboard enables four SATA III and two M.2 ports for storage expansion. When it comes to I/O, the board features HDMI, D-Sub, DVI-D, four USB 3.1 Gen1, two USB 2.0, one USB Type-C, and one USB 3.1 Gen2 Type-A port. GS Group Holding and Philax also have a partnership that goes beyond just motherboards. They also plan to produce about 50,000 custom monitors for government purposes as well.

TrendForce's investigations find that DRAM suppliers and major PC OEMs are currently participating in the critical period of negotiating with each other over contract prices for 2Q21. Although these negotiations have yet to be finalized, the ASP of mainstream DDR4 1G*8 2666 Mbps modules has already increased by nearly 25% QoQ as of now, according to data on ongoing transactions. This represents a higher price hike than TrendForce's prior forecast of "nearly 20%". On the other hand, prices are likewise rising across various DRAM product categories in 2Q21, including DDR3/4 specialty DRAM, mobile DRAM, graphics DRAM, and in particular server DRAM, which is highly related to PC DRAM and is therefore also undergoing a higher price hike than previously expected. TrendForce is therefore revising up its forecast of overall DRAM price hike for 2Q21 from 13-18% QoQ to 18-23% QoQ instead. However, the actual increase in prices of various DRAM product categories will depend on the production capacities allocated to the respective products by DRAM suppliers.

AAEON, an industry leader in embedded solutions, announces the GENE-CML5 3.5" subcompact board featuring the 10th Generation Intel Core processors (formerly Comet Lake). The GENE-CML5 brings the latest in computing technology and flexibility, enabling developers to deploy their next generation industrial and AI Edge applications.

The GENE-CML5 brings the LGA1200 socket 10th Generation Intel Core i3/i5/i7 processors, as well as Intel Pentium and Celeron processors to the 3.5" subcompact form factor. Supporting processors up to 4.4 GHz CPU frequency, the GENE-CML5 leverages the socket-type chipset to allow developers and end users to easily maintain, scale, and upgrade the platform to suit their processing requirements. Combined with 64 GB DDR4 memory, the GENE-CML5 delivers fast processing speeds on par with desktop systems. Additionally, the chipset allows the compact board to take advantage of Intel vPro and Intel Active Management Technology (iAMT), enabling remote system monitoring and management.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand new B550T-SILVER motherboard. Built to run the latest AMD Ryzen processors on AMD's B550 single chip architecture, the new B550T-SILVER motherboard from BIOSTAR is truly a masterpiece in design and engineering. With all the essentials for a motherboard of its kind, this Mini-ITX motherboard is versatile for any occasion.

Featuring a 2-DIMM DDR4 RAM configuration that can support up to 64 GB of high speed 4933+(OC) RAMs, the B550T-SILVER motherboard works amazingly well for a home or office PC that takes less space yet carries a lot of power at its core. PCIe 4.0 and WiFi 6 are some of the noticeable features of the B550T-SILVER motherboard powered by BIOSTAR's signature Digital PWM technology that delivers power throughout the system in a stable and reliable way. Furthermore, PCIe M.2 4.0 provides fast storage solutions with a 16 GT/s bit rate and backward compatibility.

G.SKILL, the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing a new addition of high-performance DDR4 memory kit series to the renowned Trident Z family - the Trident Z Royal Elite series. Featuring a meticulously sculpted crystalline pattern across the polished surface of the aluminium heatspreader, the Trident Z Royal Elite also retains the patented full-length crystalline light bar and 8-zone RGB lighting of the Trident Z Royal to enhance the aesthetics of any high-end PC system build. Representing the upper echelon of DDR4 performance, the G.SKILL Trident Z Royal Elite will be available at speeds of DDR4-3600 to DDR4-5333 at launch.

Evolved from the luxury-class design elements of the Trident Z Royal, G.SKILL is introducing the all-new Trident Z Royal Elite series that features a magnificent multi-faceted crystalline design across the reflective aluminium heatspreader. After more than a year of development in crafting the perfectly-sized crystalline pattern and sculpting the 3D structure onto a solid piece of aluminium, each Trident Z Royal Elite heatspreader is painstakingly chiseled with 76 total facets to bestow the ultimate luxury aesthetic to any PC build. Available in gold or silver colors, Trident Z Royal Elite modules also inherited the iconic full-length crystalline light bar for a dazzling refractive display of RGB lighting.

Silicon Power (SP) is releasing its newest DDR4 memory module series under its XPOWER gaming line. The Zenith is available in both RGB and non-RGB formats, the former intended to electrify any gaming rig with RGB lighting software support from major motherboard manufacturers. Ranging from blazing speeds of 3200 MHz to 4133 MHz with low 1.35 V - 1.4 V power consumption, the Zenith allows for gameplay at the highest settings with automatic overclocking. Its fully optimized testing ensures complete compatibility on most leading high-end motherboards to support the most hardcore gamers and modders. The iron grey colored heat spreader with a textured hairline finish results in a sharp and eye-catching design that is balanced by soft curves. The durable aluminium promotes maximum heat dissipation and thermal management, which prevents overheating and results in longer playtime.

Products by leading memory provider TEAMGROUP have been recognized with well-known international design awards. At the start of this spring, TEAMGROUP's gaming sub-brand T-FORCE won Germany's Red Dot Design Award 2021 for its T-FORCE TREASURE TOUCH External RGB SSD, and its recently launched creator sub-brand T-CREATE also received the Red Dot Design Award 2021 for its T-CREATE Memory series, proving once again TEAMGROUP's strengths in design creativity and R&D.

Along with Germany's IF Design Award, Japan's Good Design Award, and the U.S.' IDEA Award, the Red Dot Award is one of the four renowned design awards. Known as the Oscar of product design, the Red Dot Award is highly regarded in the international design community. The number of entries for the Red Dot Design Award 2021 was higher than in previous years, totaling 7,800 products. The TREASURE TOUCH External RGB SSD and the T-CREATE DDR4 Series Memory represent the gaming and creator sub-brands of TEAMGROUP, respectively, and have both been honored with one of the most prestigious international awards for design.

NVIDIA today announced its first data center CPU, an Arm-based processor that will deliver 10x the performance of today's fastest servers on the most complex AI and high performance computing workloads.

The result of more than 10,000 engineering years of work, the NVIDIA Grace CPU is designed to address the computing requirements for the world's most advanced applications—including natural language processing, recommender systems and AI supercomputing—that analyze enormous datasets requiring both ultra-fast compute performance and massive memory. It combines energy-efficient Arm CPU cores with an innovative low-power memory subsystem to deliver high performance with great efficiency.

At a media event in China, MSI unveiled a handful new products it hasn't yet launched globally. These include the ATX MEG Z590 Unify series, and the new Spatium line of high-end M.2 NVMe SSDs. The company already launched the MEG Z590I Unify Mini-ITX motherboard, which will soon be joined by the larger MEG Z590 Unify and the MEG Z590 Unify-X, in the standard ATX form-factor. Both these Unify motherboards are targeted at professional overclockers, and are armed with powerful 16+2 phase CPU VRM solutions that use 90 A DrMOS, 8-layer PCBs, a trio of PCIe Gen 4 M.2 slots (possibly using PCIe segmentation of the x16 PEG slot); and the company's latest Audio Boost 5 onboard audio solution.

What sets the MEG Z590 Unify apart from the Unify-X is that the latter features just two DDR4 DIMM slots, or one DIMM per memory channel. This is the most desirable topology for memory overclocking (and a reason why memory OC records are usually set on Mini-ITX motherboards). Next up, the company unveiled the Spatium series of high-end M.2 NVMe SSDs. Available with a number of heatsink (options?), these drives take advantage of PCI-Express 4.0 x4 host interface, and come in capacities of up to 4 TB. They use 3D TLC NAND flash, and offer sequential transfer rates of up to 7000 MB/s reads, with up to 6900 MB/s writes.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announcesthat three of its products have been awarded the prestigious 2021 Red Dot Award: Product Design. The three award-winning products include the GAMMIX S70PCIe Gen4 solid state drive, SPECTRIX D70G DDR4 memory, and SPECTRIX D50 Xtreme DDR4 memory.

"We are thrilled that three of our products have been honored by Red Dot as it affirms our commitment to not only deliver products with cutting-performance but also meaningful industrial designs," said Ibsen Chen, Product Marketing Directorat ADATA. "With our deep-rooted heritage and leadership in storage and memory products, it is fitting that among our three Red Dot winners is one solid state drive and two DRAM modules."

In the course of our Core i5-11400F "Rocket Lake" processor review, we discovered that the Gear 2 memory mode has the potential to offer higher performance than Gear 1. The Gear 1 mode runs the memory frequency and memory controller frequency in 1:1 sync, while the Gear 2 mode runs them at 1:2, meaning that the memory controllers run at half the memory frequency, allowing you additional memory overclocking headroom. At lower, more stable, memory frequencies, it should be logical to use Gear 1. Our testing springs some surprising results.

Overall, a stock Core i5-11400F paired with DDR4-3733 MHz memory, was found to be 1.5% faster with Gear 2, when averaged across all our CPU tests, compared to Gear 1 at the same 3733 MHz frequency. Gear 2 was 3.42% faster in Cinebench R23 multi-threaded, and a staggering 6% in MySQL. Across rendering and media workloads that scale across all cores, we find Gear 2 faster by 1-3%. It's only with less parallelized workloads such as gaming, where we see Gear 2 lag behind Gear 1, though not by much. In our i5-11400F review, we show that by running your processor in Gear 2, you're making your memory controllers pull less power, freeing up power budget for the CPU cores, translating into the nT performance gains we see here. We discovered that the uncore can pull anywhere between 5 to 10 W more power in Gear 1 mode. This is valuable power eating into the already constrained power-budget of this 65 W TDP chip.

Read the Intel Core i5-11400F TechPowerUp Review

HyperX, the gaming division of Kingston Technology Company, Inc. and brand leader in gaming and esports, today announced that HyperX Predator DDR4 memory was used to set a new overclocking world record for the fastest DDR4 memory frequency at 7156 MHz. The world record for highest frequency was set by the MSI OC Team in Taiwan using a HyperX 4600 MHz Predator DDR4 8G module (part number: HX446C19PB3K2/16) on an MSI MEG Z590I UNIFY motherboard using a 11th Gen Intel Core i9-11900KF @ 3.50 GHz CPU. At the time of this release, the record breaking frequency is posted on HWBOT, the site for PC enthusiasts looking for news, tips and information on overclocking, benchmarks and competitions. The valid CPU-Z screenshot can be found here.

"We are extremely thrilled and humbled to be part of this exemplary DDR4 overclocking achievement," said Kristy Ernt, DRAM business manager, HyperX. "Our engineers work continuously to improve higher-speed memory yields to bring faster solutions by pushing boundaries that break performance records and bring best-in-class products to our gaming memory community."

Leading memory provider TEAMGROUP announced today the release of newly specification for T-FORCE high clock rated memory products that will coincide with the launch of Intel 11th Gen Rocket Lake processors: the T-FORCE XTREEM DDR4, XTREEM ARGB DDR4, and XTREEM ARGB WHITE DDR4. When these high clock rate memory modules are paired with the latest Z590 motherboards, users will experience blistering speeds and top performance that will satisfy overclocking enthusiasts and gamers around the world.

T-FORCE's R&D team continues to push clock speeds to greater heights and has successfully launched new 5600 MHz, 5333 MHz, and 5066 MHz DDR4 memory modules to pair with the latest Z590 motherboards and Intel 11th Gen Rocket Lake processors. Under its XTREEM product line, T-FORCE is releasing a DDR4 memory kit with a clock rate of 5600 MHz and a capacity of 16 GB (8 GB x 2) for the ultimate overclocking performance. At the same time, T-FORCE is releasing updated XTREEM/XTREEM ARGB/XTREEM ARGB WHITE DDR4 models with speeds of 5333 MHz and 5066 MHz and 16 GB (8 GB x 2) kits to meet the diverse needs of overclockers.

Rapid evolution in AI technology is infusing IoT devices with new capabilities, leading to the new trend of AIoT. Simply speaking, IoT devices acquire data then transmit that data through the network to an integrated backend system. Typical applications include automation, remote control, and connection with other IoT devices. AIoT brings the power of AI to these IoT devices, so that machine equipment and factories can play a more active role in the process and learn intelligently. Accumulation of data, continuous learning, and data analysis can achieve failure prevention or autonomous operation to implement a fully-fledged "smart factory." The GP-3000 is Cincoze's highly-acclaimed flagship model for AI and machine vision applications, combining high-end computing performance, rich high-speed I/O, and harsh environment resilience to enable edge computing in the AIoT framework. It is the first choice for effectively implementing multiple applications on the field side, such as smart manufacturing and transportation.

The key to rapid smart manufacturing upgrades is introducing high-efficiency GPU computers as the on-site data processing center. To that end, the GP-3000 supports an Intel Xeon /Core (Coffee Lake-R & Coffee Lake) processor and sports the Intel C246 chipset, with up to two sets of DDR4-2666 ECC/non-ECC SO-DIMMs for a maximum of 64 GB of total memory. This setup provides the coveted combination of efficient processing and parallel processing. The GPU Expansion Box (GEB) supports up to two 250 W high-end full-length (≤328 mm) GPU cards to further enhance its processing capabilities. The high-speed I/O ports, with the simple addition of a camera, become the machine equipment's eyes, allowing for the quick and accurate inspection and categorization of high-definition image inputs.

G.SKILL is excited to announce a series of high speed DDR4 kits for the new Intel Z590 platform. , including DDR4-5333 CL22 16 GB (8GBx2), DDR4-4800 CL17 16 GB (8GBx2), DDR4-4800 CL20 32 GB (16GBx2), and DDR4-4600 CL20 64 GB (32GBx2) under the Trident Z Royal, Trident Z RGB, and Ripjaws V series. These new DDR4 memory specifications offer a perfect choice for those pursuing extreme memory overclocking performance, building a powerful workstation, or for the ultimate gaming experience.

Ultimate Performance DDR4-5333 on the Intel Z590 Platform
Dedicated to developing ever-faster extreme overclocking memory, G.SKILL is pushing the 16 GB (8GBx2) kit capacity to a blistering speed of DDR4-5333. This demonstrates the remarkable memory overclocking support on the latest Intel Z590 platform, which has been validated on the ASUS ROG STRIX Z590-E GAMING WIFI, ASUS ROG MAXIMUS XIII APEX, and MSI MEG Z590I UNIFY motherboards with the latest Intel Core i9-11900K processor, as shown in the screenshots below:

Gigabyte Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest BIOS of B560 AORUS motherboards. Enhanced by the 12+1 phases DrMOS power stage with 60 Amps for each and full coverage VRM thermal design, B560 AORUS motherboards can support Intel Core i9 11900K (F) series processors overclocking to all cores 5.1 GHz. The exclusive anti-interference design of memory circuit enables DDR4 speed raising up to XMP 4800 MHz, and overclocking performance boost to DDR4 5300 MHz. which demonstrates GIGABYTE's strong R&D strength and persistence in quality. Users can enjoy the performance boost of time-limited overclocking by simply updating to the latest BIOS to meet their special needs.1

Intel B series chipset motherboards have been always excluded from overclocking due to the product positioning. Although the memory XMP overclocking is unlocked on 500 series, the processor frequency can only reach up to 4.8 GHz by Turbo Boost. Thanks to the efforts of Gigabyte's R&D team, the processor can be overclocked to 5.1 GHz and maintain low temperature under the Prime95 no AVX burn-in test. This powerful performance benefits from the top-quality materials of GIGABYTE AORUS motherboards and product design capabilities, which include 12+1 phases/ 60Apms DrMOS power stage, 6 layers 2Oz ultra-cool PCB, full-covered VRM thermal design, and the latest Smart Fan 6 technology for temperature control. These features allow processors to have a stable and pure power supply under ultra-high frequency operation, providing the most solid backing for the CPU limited-time overclocking.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

TEAMGROUP's T-CREATE brand, which gives creators around the world the tools to express their creativity and inspiration, has updated its product lines again with today's launch of the EXPERT DDR4 OC10L desktop memory, CLASSIC PCIe 4.0 SSD, and CLASSIC DDR4 10L laptop memory. T-CREATE continues to launch diverse new products with improved specifications, producing powerful hardware to meet the needs of creators.

The T-CREATE EXPERT DESKTOP DDR4 OC10L not only has up to 32 GB of capacity per module but also an overclocking feature that automatically increases its frequency to 3600 MHz, providing worry-free overclocking with stable, high-frequency performance. It comes in a titanium grey finish that exudes the tasteful minimalism of the EXPERT product line. In addition, the memory uses a 10-layer PCB with a specialized anti-noise design for better processing capability, allowing creators to work on tasks simultaneously, whether it be producing animation, video editing, or converting large files. It substantially improves work efficiency and excels in multitasking during creative projects.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."

AMD today announced its 3rd generation EPYC (7003 series) enterprise processors, codenamed "Milan." These processors combine up to 64 of the company's latest "Zen 3" CPU cores, with an updated I/O controller die, and promise significant performance uplifts and new security capabilities over the previous generation EPYC 7002 "Rome." The "Zen 3" CPU cores, AMD claims, introduce an IPC uplift of up to 19% over the previous generation, which when combined by generational increases in CPU clock speeds, bring about significant single-threaded performance increases. The processor also comes with large multi-threaded performance gains thanks to a redesigned CCD.

The new "Zen 3" CPU complex die (CCD) comes with a radical redesign in the arrangement of CPU cores, putting all eight CPU cores of the CCD in a single CCX, sharing a large 32 MB L3 cache. This the total amount of L3 cache addressable by a CPU core, and significantly reduces latencies for multi-threaded workloads. The "Milan" multi-chip module has up to eight such CCDs talking to a centralized server I/O controller die (sIOD) over the Infinity Fabric interconnect.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, today announced the official release of the TOUGHRAM XG RGB DDR4 16 GB (8 GB x 2) Memory Kit, and is now available for purchase on TTPremium.com and Thermaltake.com. The TOUGHRAM XG RGB comes in frequencies ranging from 3,600 MHz up to 4,600 MHz 16 GB (8GBx2), featuring a distinguished style for users who seek unconventional gaming styled ram modules.

Compatible with the latest AMD and Intel DDR4 motherboards, the TOUGHRAM XG RGB DDR4 16 GB (8 GB x 2) has been through rigorous tests in order to select tightly-screened ICs for high and stable performance. The aluminium heat spreader of the TOUGHRAM XG has been trimmed with a geometrical pattern for a sleek and fresh look, meanwhile it can also enhance heat dissipation while in use. As the high end memory kit of the TOUGHRAM series, the TOUGHRAM XG RGB has been upgraded to 16 LEDs with a unique X-shaped light bar to control 8 lighting zones for splendid colors. Users can choose over 25 pre-set lighting modes from the TOUGHRAM software, or to synchronize it with multiple RGB software including our advanced light editing software NeonMaker to set-up timeline. The TOUGHRAM XG continues the legacy of building a full RGB ecosystem, it can be synchronized to the TT RGB Plus software along with other enabled components. Other than that, the TOUGHRAM XG can support motherboards equipped with 5 V addressable RGB header, allowing users to control lighting effects directly from the motherboard RGB software.