AMD Socket AM4 continues to be relevant even in 2024, nearly seven years since its introduction, with the company announcing several new processor models at CES. AMD has extended Ryzen 5000 series "Zen 3" support across all three desktop chipset series, including the oldest AMD 300-series, and since all Socket AM4 motherboards feature USB BIOS Flashback, users have the full spread of Socket AM4 processors to upgrade to. The Ryzen 7 5800X3D continues to be a popular final upgrade destination for gamers on Socket AM4 who may have spent a pretty penny building a high-end gaming desktop in 2020-21. The 5800X3D offers gaming performance comparable to an Intel Core i9-12900K "Alder Lake," despite being based on the older "Zen 3" microarchitecture, since it enjoys a large 96 MB L3 cache, thanks to AMD's innovative 3D Vertical Cache technology. The 5800X3D commands a $360 street price, which may be a little steep for some users, and so AMD is increasing choice, with the introduction of the new Ryzen 7 5700X3D.

The Ryzen 7 5700X3D is an 8-core/16-thread Socket AM4 processor, which is practically the same silicon as the 5800X3D, but with lower clock speeds, and more importantly a 30% lower price. While the 5800X3D commands $360 in the market, the new 5700X3D is coming in at an attractive $250. The 5700X3D comes with a base frequency of 3.00 GHz, and maximum boost frequency of 4.10 GHz. In comparison the 5800X3D has a 3.40 GHz base frequency, and 4.50 GHz boost. Both chips enjoy the same power limits, with a TDP of 105 W. The 5700X3D gets the same 96 MB of L3 cache that includes 64 MB of 3D Vertical Cache; and 512 KB of L2 cache per core. The I/O is identical, too, with a 24-lane PCI-Express Gen 4 interface, and dual-channel DDR4 memory, with DDR4-3600 being the sweetspot frequency.Update Jan 9th: AMD clarified the specs of the Ryzen 5 5500GT in an updated slide. It is indeed a 6-core/12-thread processor.

Today marks the launch of not just two new incredibly well-designed NAS devices, but also two new features brand new to the ASUSTOR line of NAS devices with ARM processors. The introduction of the Drivestor 2 Pro Gen2 and Drivestor 4 Pro Gen2 come with an upgraded SoC, providing 21% more performance, which increases read and write speeds and performance for the features and apps available for the Drivestor Pro Gen2. The Drivestor Pro Gen2 series comes with 2.5-Gigabit Ethernet, hot-swappable hard drive bays, hardware transcoding, tool-free design and more! The upgraded iGPU found in the Drivestor Pro Gen2 now gives even better performance when transcoding multimedia.

The all-new Drivestor Pro Gen2 series comes with a new killer feature. Btrfs is now supported on the Drivestor Pro Gen2, a first for ASUSTOR NAS devices running ARM CPUs. Btrfs helps protect data by enabling snapshots of data at certain points in time and is able to rewind the clock should any unintentional modifications be made and restore data if needed.

TrendForce reports that the DRAM contract prices are estimated to increase by approximately 13-18% in 1Q24 with mobile DRAM leading the surge. It appears that due to the unclear demand outlook for the entire year of 2024, manufacturers believe that sustained production cuts are necessary to maintain the supply-demand balance in the memory industry.

PC DRAM: The market is buzzing with unfilled DDR5 orders, while savvy buyers brace for a continued surge in DDR4 prices, keeping procurement engines running. This trend, however, is shadowed by a gradual industry pivot toward DDR5, casting uncertainty over the expansion of DDR4 bit procurement volumes. Despite this, both DDR4 and DDR5 prices have yet to hit the target set by manufacturers, and buyers seem ready to ride the wave of price hikes into 1Q24. This sets the stage for an estimated 10-15% in PC DRAM contract prices, with DDR5 poised to take the lead over DDR4 in this pricing rally.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today is proud to introduce the BIQ67-AHP industrial motherboard, expertly crafted to facilitate system integration for both industrial and business applications, providing a robust and efficient solution for managing and streamlining complex processes and operations.

At the heart of the BIQ67-AHP's remarkable performance lies its compatibility with the Intel Core i7/i5/i3 processor (LGA1700), complemented by the Intel Q670 chipset and a Thermal Design Power (TDP) of 125 W. This powerful configuration ensures the BIQ67-AHP can easily handle demanding industrial and business applications. Its high-capacity memory support, featuring four DDR4 3200 MHz LONG-DIMM slots, enhances data reliability and system stability, making the BIQ67-AHP an ideal solution for environments where uninterrupted operation and data integrity are crucial.

Chinese company Sipeed has introduced the Lichee Pocket 4A, one of the first handheld gaming devices based on the RISC-V open-source instruction set architecture (ISA). Sipeed positions the device as a retro gaming platform capable of running simple titles via software rendering or GPU acceleration. At its core is Alibaba's T-Head TH1520 processor featuring four 2.50 GHz Xuantie C910 RISC-V general-purpose CPU cores and an unnamed Imagination GPU. The chip was originally aimed at laptop designs. Memory options include 8 GB or 16 GB LPDDR4X RAM and 32 GB or 128 GB of storage. The Lichee Pocket 4A has a 7-inch 1280x800 LCD touchscreen, Wi-Fi/Bluetooth connectivity, and an array of wired ports like USB and Ethernet. It weighs under 500 grams. The device can run Android or Linux distributions like Debian, Ubuntu, and others.

As an early RISC-V gaming entrant, performance expectations should be modest—the focus is retro gaming and small indie titles, not modern AAA games. Specific gaming capabilities remain to be fully tested. However, the release helps showcase RISC-V's potential for consumer electronics and competitive positioning against proprietary ISAs like ARM. Pricing is still undefined, but another Sipeed handheld console retails for around $250 currently. Reception from enthusiasts and developers will demonstrate whether there's a viable market for RISC-V gaming devices. Success could encourage additional hardware experimentation efforts across emerging open architectures. With a 6000 mAh battery, battery life should be decent. Other specifications can be seen in the table below, and the pre-order link is here.

Market research by Korean publication Danawa DPG provides valuable insights to how desktop AMD Ryzen processor users are charting their upgrade paths given the long upgrade longevity of AMD sockets. The research follows a 10-month date range from December 2022 to October 2023, and tracks the sales of motherboards based on various AMD chipset models. We're shown that toward the turn of the year, AMD B550 chipset motherboards sell the most. This is when AMD Ryzen 5000 Socket AM4 processors top sales for the company, Given that the B550 fully supports CPU overclocking, and that there are plenty of feature-packed B550 motherboard models, it explains why the B550 covers a wide price-band.

AMD launched the Ryzen 7000 series "Zen 4" to lukewarm response in September 2022, mainly because the platform lacked DDR4 memory support that was relevant at the time, and hence wasn't as flexible to consumers as Intel's LGA1700. Its launch caused price-cuts for Ryzen 5000 series processors, clearing out some upgrade headroom for those on the AM4 platform still using Ryzen 3000. Off to a slow start, we see its successor from Socket AM5, the B650 chipset, rise steadily over the time period, and for two reasons—DDR5 memory became affordable over the course of 2023; and AMD breathed life into the Ryzen 7000 series with the introduction of the Ryzen 7000X3D series, which restored gaming performance competitiveness to Intel's 13th Gen Core "Raptor Lake." The B650 has everything you need right now for a Ryzen 7000X3D build, given that both the GeForce RTX 40-series and Radeon RX 7000 series are PCIe Gen 4 graphics cards; and that the B650 has at least a Gen 5 NVMe slot. If you absolutely need a Gen 5 x16 slot, there's the premium B650E chipset to go with.

TrendForce investigations reveal a significant leap in the DRAM industry for 3Q23, with total revenues soaring to US$13.48 billion—marking 18% QoQ growth. This surge is attributed to a gradual resurgence in demand, prompting buyers to re-energize their procurement activities. Looking ahead to Q4, while suppliers are firmly set on price hikes, with DRAM contract prices expected to rise by approximately 13-18%, demand recovery will not be as robust as in previous peak seasons. Overall, while there is demand for stockpiling, procurement for the server sector remains tentative due to high inventory levels, suggesting limited growth in DRAM industry shipments for Q4.

Three major manufacturers witnessed Q3 revenue growth. Samsung's revenue increased by about 15.9% to US$5.25 billion thanks to stable demand for high-capacity products fueled by AI advancements and the rollout of its 1alpha nm DDR5. SK hynix showcased the most notable growth among manufacturers with a 34.4% increase, reaching about US$4.626 billion and significantly narrowing its market share gap with Samsung to less than 5%. Micron's revenue rose by approximately 4.2% to US$3.075 billion—despite a slight drop in ASP—supported by an upswing in demand and shipment volumes.

V-COLOR Technology Inc. is proud to announce the launch of a new TUF Gaming Alliance Memory, available in both DDR5 XPrism and DDR4 Prism Pro series, showcasing a striking design and exceptional performance. This collaboration with the ASUS TUF Gaming Alliance ensures that components bearing this badge undergo testing that surpasses the industry's standard norms. This rigorous testing is implemented to ensure superior compatibility, stability, and durability, catering to the specific needs of gamers and PC enthusiasts globally.

The new memory kits are offered in configurations of 32 GB (2x 16 GB) with speeds ranging from 5600 MHz to 6400 MHz for DDR5, and 16 GB (2x 8 GB) to 32 GB (2x 16 GB) with speeds ranging from 3200 MHz to 3600 MHz for DDR4 memory. The memory modules are equipped with powerful SK Hynix chips. DDR5 memory is compatible with Intel XMP, and DDR4 is compatible with both INTEL and AMD platforms.

Lexar, a leading global brand of flash memory solutions, is excited to announce THOR OC DDR5 Desktop Memory. Featuring a complete redesign that pays homage to Thor's hammer, this memory also boasts a durable, solid aluminium heatsink that more than stands up to the challenges of overclocking by providing superior heat dissipation. Lexar THOR OC DDR5 Desktop Memory delivers up to 6000MT/s with timing as low as CL32 for a truly next-gen experience. It features a low-profile form factor that is perfect for compact PC builds. It also supports Intel XMP 3.0 and AMD EXPO overclocking and is compatible with most DDR5 motherboards.

Lexar THOR OC DDR5 Desktop Memory's on-die Error Correction Code (ECC) offers improved stability and reliability while its on-board Power Management IC (PMIC) enhances power efficiency. Another option for PC users is THOR OC DDR4 Desktop Memory. It offers 3200MT/s performance with timing of CL16 and is designed for PC enthusiasts and extreme gamers. It has an aluminium heat spreader with a winged design to keep systems running cool and is compatible with INTEL XMP 2.0 and AMD Ryzen.

TrendForce reports indicate a universal price increase for both DRAM and NAND Flash starting in the fourth quarter. DRAM prices, for instance, are projected to see a quarterly surge of about 3-8%. Whether this upward momentum can be sustained will hinge on the suppliers' steadfastness in maintaining production cuts and the degree of resurgence in actual demand, with the general-purpose server market being a critical determinant.

PC DRAM: DDR5 prices, having already surged in the third quarter, are expected to maintain their upward trajectory, fueled by the stocking of new CPU models. This forthcoming price hike cycle for both DDR4 and DDR5 is incentivizing PC OEMs to proceed with purchases. Although manufacturers still have substantial inventory and there's no imminent shortage, Samsung has been nudged to further slash its production. However, facing negative gross margins on DRAM products, most manufacturers are resistant to further price reductions, instead pushing for aggressive increases. This stance sets the stage for an anticipated rise in DDR4 prices by 0-5% and DDR5 prices by around 3-8% in the fourth quarter. Overall, as DDR5 adoption accelerates, an approximate 3-8% quarterly increase is projected for PC DRAM contract prices during this period.

Kingston FURY, the high-performance division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the updated new look of Kingston FURY Renegade DDR4 memory.

Kingston FURY Renegade DDR4 delivers amazing speeds up to 5333 MT/s, making it the ultimate choice for power users. The bold two-tone black heat spreaders are on double duty as they not only enhance the look of your build but also manages heat while you're deep at work or play to ensure optimal performance. For those seeking an extra dose of excitement, Kingston FURY Renegade DDR4 RGB boasts a stylish two-tone black heat spreader illuminated by 10 LEDs to create dynamic RGB lighting effects kept in lock-step by Kingston FURY's patented Infrared Sync Technology. Beyond its appearance it doesn't compromise on functionality, offering speeds up to 4600MT/s allowing users to boost frame rates, improve workflow, and edit game play in a flash.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company's new customized ultra-bandwidth elements (CUBE) enable memory technology to be optimized for seamless performance running generative AI on hybrid edge/cloud applications.

CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions. Designed to meet the growing demands of edge AI computing devices, it is compatible with memory density from 256 Mb to 8 Gb with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil the brand-new H610MS and H610MHD D5 motherboards designed to supplement the needs of modern day professionals and home users seamlessly. Built based on Intel H610 single-chip architecture, ready for 12th and 13th Gen Intel Core Processors, these motherboards are ideal for the working professional, making tasks such as web browsing, emailing, and document management a breeze. For the home user, it delivers an unparalleled experience whether watching movies on Netflix, listening to music, gaming, or even for HTPC uses like streaming, live TV recording, and more.

The H610MS motherboard supports the robust DDR4 memory modules. Users can utilize 2 DIMM slots with a capacity of up to 64 GB. Meanwhile, the H610MHD D5 motherboard is designed to handle the latest DDR5 memory modules across a similar 2-DIMM configuration of up to 96 GB of Memory, ensuring users have a breadth of choices for their distinct build preferences. These motherboards are brimming with cutting-edge features tailored to modern computing demands. Each board seamlessly supports USB 3.2 Gen 1, ensuring rapid data transfers and connectivity. Additionally, they are primed for the future with support for both PCIe 4.0 and PCIe 3.0 interfaces, offering enhanced versatility for expansions. Furthermore, they are equipped to accommodate the blazing speeds of PCIe 3.0 M.2 drives with a bandwidth of 32 Gb/s, catering to users who seek swift storage solutions.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, proudly presents the all-new H610MHC-E motherboard designed for home entertainment and office use. The H610MHC-E motherboard brings a perfect blend of features ideal for office users who run basic tasks such as web browsing, managing emails, and handling office applications like Word, PowerPoint, and Excel. At the same time, home users will relish its capabilities for online entertainment. Enjoy watching TV shows and movies from platforms like YouTube or Netflix, listening to music, playing casual games, and more. Moreover, it's a perfect fit for Home Theater PC (HTPC) setups, allowing for streaming, gaming, live TV recording, internet browsing, and other basic tasks, all from the comfort of your living room.

Anchored on the powerful Intel H610 chipset, the H610MHC-E is primed to support the 12th and 13th-generation Intel Core Processors. With its 2-DIMM DDR4 slots, users are presented with flexible memory solutions that can scale up to an impressive 64 GB. Beyond memory, the H610MHC-E shines in connectivity—boasting cutting-edge PCIe 4.0 and PCIe 3.0 interfaces, a high-speed M.2 slot optimized with PCIe 3.0 x 4 support, and efficient SATA III connectors. This intricate combination ensures a fluid user experience and efficient data management.

ADATA Technology Co., Ltd., the world's leading memory brand, announced a theme of "Dazzling Tomorrow" for its annual creator event " You Are a Rising Star," held from today until October 13th. Use creative techniques such as graphic design, 3D rendering, and video to weave your own moving story. Share your pieces publically on Instagram and you will have an opportunity to win excellent prizes valued at more than USD$5,700.

With the generational change of processors and chipsets, DDR5 memory entering the mainstream, the rapid rise of Gen 4 SSDs and a migration to the Gen 5 era, coupled with the rise of generative AI tools, creator software and hardware must also improve in leaps and bounds. ADATA's online creator contest officially enters its fourth year and continues to provide a platform for talent in the fields of "graphic design," "video creation," "animation," and "photography" to unleash their creativity. This year, we continue our commitment to the spirit of "Build to Create" to produce better solutions for content creators, including major international award winning high-end and comprehensive products such as the LEGEND 970 Gen 5 SSD, ACE series memory module, SE920 USB4 external SSD, and other devices to inspire creativity.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

Multiple leakers on Twitter/X have posted screenshots or pictures of Intel's upcoming Core i5-14600K CPU and it appears that some earlier rumours about this specific SKU weren't entirely accurate. It was believed that the Core i5-14600K was to get a core bump over the Core i5-13600K, but apparently this isn't the case, if the new leaks hold true. However, it also appears that the CPU will boost higher than expected, as earlier rumours suggested 5.3 GHz max boost clock and now it appears it'll go all the way up to 5.5 GHz, which is still lower than its Core i7 and Core i9 peers. The i5 also lacks Intel Turbo Boost Max Technology 3.0, so it won't be possible to squeeze some extra performance out of this chip without overclocking it the good old fashioned way.

@9550pro posted a screenshot of CPU-Z in Chinese showing the Core i5-14600K running in a Gigabyte Z790 Gaming X AX motherboard, but it's unknown what the rest of the system configuration was. However, it does show the CPU having a clock multiplier ranging from 8 to 55, confirming the 5.5 GHz max CPU clock speed. @wxnod posted a picture of an MSI Z690 Edge TI WiFi DDR4 motherboard with a Core i7-14700K paired with 16 GB of DDR4 memory running at 4600 MHz on Gear 1, which in itself is a feat, although it's unknown if this was stable. The CPU was shown as running at 6.3 GHz, which is most likely a manual overclock of the CPU, as the Core i7-14700K isn't expected to be a 6 GHz plus part. We're getting close to the launch of Intel's 14th gen Core processors, so we won't have to wait too long to find out the full specs of these CPUs.

Update 07:17 UTC: Twitter/X bot Benchleaks has found some Geekbench results for the Core i5-14600K which @harukaze5719 made a nice graph of that we've added below. This suggests that Intel has managed to eke out quite a bit of extra performance from these "refreshed" CPUs.

Lexar, a leading global brand of flash memory solutions, is excited to announce three additions to its gaming product lineup - the new Lexar NM790 M.2 2280 PCIe Gen 4×4 NVMe SSD, Lexar ARES DDR5 Desktop Memory in 6400MT/s, and Lexar ARES RGB DDR4 Desktop Memory in 3600MT/s.

The NM790 M.2 NVMe SSD is perfect for gamers and content creators, delivering incredible speeds of 7400 MB/s read, 6500 MB/s write thanks to its PCIe Gen 4 tech, which includes HMB 3.0 and Dynamic SLC Cache. So whether users are looking to vanquish foes in their gaming battles or conquer their latest creative pursuits, the NM790 SSD is ready to take on the challenge.

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial computing solutions, unveils the SI-624-AI industrial AI computer, which won the Embedded Computing Design's Embedded World 2023 Best in Show Award in Germany. This recognition highlights the exceptional performance and innovation of the rugged system in the field of AI deep learning.

The SI-624-AI is designed to meet the demands of high-speed multiple tasks for artificial neural network applications. Powered by the 12th Gen Intel Core CPU and incorporating the NVIDIA Ampere Architecture MXM GPU, this cutting-edge system delivers image processing capabilities that enable real-time analysis of visual data, enhancing automation, quality control, and overall production efficiency for AIoT applications in smart factory, retail, transportation or medical fields. It is suitable for use as a digital signage control system in mission-critical control rooms in transportation networks, smart retail, healthcare, or AI education where remote AI data analysis capabilities are required.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, announces the best-performing business and casual motherboards for Intel 12/13th gen core processors in 2023. Tailored to cater to a wide range of users, from office applications to system integration businesses and home entertainment, the B760MX2-E, B760MZ-E PRO, B760MX2-E D4, and B760MX2-E PRO D4 motherboards pack an impressive suite of features and functionality ready to perform at the highest standard.

Powered by Intel's 12th and 13th-generation processors, these motherboards provide a seamless computing experience with higher performance, improved data integrity, and lower power consumption, setting new benchmarks in their respective segments. With B760MX2-E, B760MZ-E PRO motherboards supporting DDR5, and B760MX2-E D4, B760MX2-E PRO D4 motherboards supporting DDR4 memory, they provide exceptional memory support and performance. The B760MZ-E PRO and the B760MX2-E PRO D4 motherboards support up to 128 GB of memory while the B760MX2-E and the B760MX2-E D4 motherboards support up to 64 GB of memory capacity, providing users ample choice when it comes to system performance.

TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline. Despite suppliers' concerted efforts, inventory levels persistently remain high, keeping prices low. While production cutbacks may help to curtail quarterly price declines, a tangible recovery in prices may not be seen until 2024.

PC DRAM: The benefits of consolidated production cuts on DDR4 by the top three suppliers are expected to become evident in the third quarter. Furthermore, inventory pressure on suppliers has been partially alleviated due to aggressive purchasing by several OEMs at low prices during 2Q23. Evaluating average price trends for PC DRAM products in 3Q23 reveals that DDR4 will continue to remain in a state of persistent oversupply, leading to an expected quarterly price drop of 3~8%. DDR5 prices—influenced by suppliers' efforts to maintain prices and unmet buyer demand—are projected to see a 0-5% quarterly decline. The overall ASP of PC DRAM is projected to experience a QoQ decline of 0~5% in the third quarter.

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."