First Pictures of Intel Ibex-Peak Chip Packages Emerge
Intel's mainstream market implementation of the Nehalem architecture will come in the form of monolithic quad-core a dual-core chips that have northbridge machinery integrated. Based on the Lynnfield (quad-core) and Arandale (dual-core) designs, Intel will place the processors on a common system design dubbed the "Ibex-Peak". The processors are likely to be branded as Core i5, Core i4 or even Core i3 depending on a lot of factors. Additionally, Intel plans enterprise variants of the said chips.
To seat these chips, Intel is designing new sockets: LGA-1155, LGA-1156 the two can be classified into the sockets for the desktop variants, with another LGA-1167 socket most likely to be exclusive for the Xeon variants. PCGH sourced some images from Intel's Design Development Tools (DDT) portal (found here), which tell that Intel names its new series of sockets as "socket H". Pictured below is a processor package viewed from its business-end. The other three you can see, are interposer-boards. These are devices that resemble the actual product packages that sit on the sockets. You can see a grid of leads over the "IHS" of the package. The leads serve to help in the technical development of products based on the package design, hence it is found on the DDT portal. It should give you an idea of what an LGA-1155, LGA-1156 and LGA-1167 processor should look like, sans the leads on the IHS. The images below in the same order. Finally, pictured much earlier, is the Ibex-Peak platform motherboard that demonstrates the design.
To seat these chips, Intel is designing new sockets: LGA-1155, LGA-1156 the two can be classified into the sockets for the desktop variants, with another LGA-1167 socket most likely to be exclusive for the Xeon variants. PCGH sourced some images from Intel's Design Development Tools (DDT) portal (found here), which tell that Intel names its new series of sockets as "socket H". Pictured below is a processor package viewed from its business-end. The other three you can see, are interposer-boards. These are devices that resemble the actual product packages that sit on the sockets. You can see a grid of leads over the "IHS" of the package. The leads serve to help in the technical development of products based on the package design, hence it is found on the DDT portal. It should give you an idea of what an LGA-1155, LGA-1156 and LGA-1167 processor should look like, sans the leads on the IHS. The images below in the same order. Finally, pictured much earlier, is the Ibex-Peak platform motherboard that demonstrates the design.
