Flexible OLED tech has come a long way and started sharking up the smartphone and tablet market, but Lenovo now apparently wants to use rolling OLED displays to increase screen real-estate on its laptops without actually making them much bigger. According to notorious leaker, Evan Blass, in a post on X, Lenovo will launch the sixth-generation of its ThinkBook Plus line-up with a rollable OLED display that can extend upwards to give it significantly more screen real-estate. Blass claims that the new ThinkBook Plus will launch at CES 2025, which is slated to take place between January 7 and January 10, 2025.

Looking at the renders that were shared alongside the leaks, and based on the size of the keyboard, the new ThinkBook will have a tall—it looks like 3:4 aspect ratio—screen that's somewhere in the neighborhood of 14 inches before the screen is fully unrolled. After unrolling, though, it appears to be able to fit two 16:9 windows on top of each other. Previous iterations of the ThinkBook Plus 17 had a small secondary display on the keyboard deck to the right of the keyboard, and the ThinkBook Plus 13 models consisted of the Gen 5 hybrid model with a detachable display and the Gen 4 variant, which had a 360° hinge and a color e-ink display on the back of the main OLED. While these designs all made compromises, whether in the suboptimal ergonomics of the mini screen of the 17 or the fact that you could only use one display at a time on the e-ink version. Previous ThinkBook versions were also compatible with an MPP stylus for handwriting, note-taking, and even image editing or sketching. It's unclear if the new ThinkBook Plus will be compatible with pen input, but there do not seem to be any images online showing the leaked laptop with a stylus in the same image.

AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 "Strix Halo" APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill's latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

It's an open secret by now that NVIDIA's GeForce RTX 5000 series GPUs are on the way, with an early 2025 launch on the cards. Now, preliminary details about the RTX 5070 Ti have leaked, revealing an increase in both VRAM and TDP and suggesting that the new upper mid-range GPU will finally address the increased VRAM demand from modern games. According to the leak from Wccftech, the RTX 5070 Ti will have 16 GB of GDDR7 VRAM, up from 12 GB on the RTX 4070 Ti, as we previously speculated. Also confirming previous leaks, the new sources confirm that the 5070 Ti will use the cut-down GB203 chip, although the new leak points to a significantly higher TBP of 350 W. The new memory configuration will supposedly run on a 256-bit memory bus and run at 28 Gbps for a total memory bandwidth of 896 GB/s, which is a significant boost over the RTX 4070 Ti.

Supposedly, the RTX 5070 Ti will also see a bump in total CUDA cores, from 7680 in the RTX 4070 Ti to 8960 in the RTX 5070 Ti. The new RTX 5070 Ti will also switch to the 12V-2x6 power connector, compared to the 16-pin connector from the 4070 Ti. NVIDIA is expected to announce the RTX 5000 series graphics cards at CES 2025 in early January, but the RTX 5070 Ti will supposedly be the third card in the 5000-series launch cycle. That said, leaks suggest that the 5070 Ti will still launch in Q1 2025, meaning we may see an indication of specs at CES 2025, although pricing is still unclear.

Update Dec 16th: Kopite7kimi, ubiquitous hardware leaker, has since responded to the RTX 5070 Ti leaks, stating that 350 W may be on the higher end for the RTX 5070 Ti: "...the latest data shows 285W. However, 350W is also one of the configs." This could mean that a TBP of 350 W is possible, although maybe only on certain graphics card models, if competition is strong, or in certain boost scenarios.

With the upcoming Nintendo Switch 2 all but a given, much has been said about the new handheld gaming console in leaks and rumors. Now, a new set of supposed leaks from Decky Wizard on X have caused a bit of consternation among the Switch community, given the seemingly random mix of upgrades and perceived downgrades coming to the next-gen Switch. Minor details include larger buttons, a redesigned dock, and three colorways at launch, however, details around the new display and controls are more significant. For starters, the leaks suggest that the Switch 2 will have larger buttons and Hall-effect joysticks, both of which would likely be a massive upgrade in the eyes of most gamers, however it also seems as though the Switch 2 will use an LCD, as opposed to an OLED display, for the base model.

It seems as though most Switch fans were expecting an OLED panel right out the gate, given the Nintendo Switch OLED has been available for quite some time, now. Hall-effect joysticks will also likely solve one of the community's biggest complaints about the Switch controls—that being stick drift—but Nintendo would have to also provide a calibration tool in the Switch software to correct for wear and tear on the joysticks. Larger buttons may also be a welcome change for most Switch gamers, since cramped controls are a fairly common criticism of the original Switch. In addition to the news of the physical and technical specifications, Decky Wizard also claims that the Switch 2 will be lighter than the Steam Deck and be launched as soon as January 2025. In a subsequent post, Decky Wizard uploaded leaked images of the new Switch 2, showing off not only a fresh looking chassis with smaller screen bezels and a new built-in kickstand design, but also the design of the new first-party dock and two new, larger Joycon release buttons on the backs of each Joycon.

It's been public knowledge for a while now that Lenovo is planning an imminent successor to its Legion Go handheld that has proven rather popular among handheld gamers. Previous leaks and rumors indicated that the Legion Go S 8ARP1, as it will apparently be named, will be a more affordable version of the current Legion Go. Now, thanks to Roland Quandt, Windows Central, and WinFuture, more details about the upcoming Legion Go S have leaked, including images of the device, supposed specifications, and a potential price.

According to the leaks, the new affordable handheld gaming PC will feature some substantial hardware changes, including a slightly smaller eight-inch display, this time with a much lower 1920 × 1200p resolution and a slightly lower 120 Hz refresh rate. Gone, too, are the Nintendo Switch-style detachable controllers, with the Legion Go S instead featuring a white unibody design. What's more interesting than the leaked images of the Legion Go S or the hardware changes—detachable controllers or not, the Legion Go is still intended to be used as a handheld—is the new AMD APU that will seemingly power the Go S. The as-yet unannounced AMD Ryzen Z2G looks like it will be an odd core configuration featuring an AMD Radeon 680M iGPU and Zen 3+ cores. Ultimately, the APU seems like it will put the Legion Go S somewhere between the current-generation Legion Go and devices featuring the AMD Ryzen Z1 (non-extreme), which is a good place to be if Lenovo hopes to compete with the likes of the Steam Deck OLED, which will seemingly cost around the same as the Legion Go S, depending on which region you are in.

Earlier this week, details of two Intel Arc B580 "Battlemage" graphics cards from ASRock leaked, but there was no indication of any pricing, which lead to some speculations in the comments section. Now, serial leaker @momomo_us on X/Twitter has leaked the pricing for Intel's own card, which will apparently be known as the Intel Arc B580 Limited Edition Graphics card. The leaker suggests a retail price of US$250 for the 12 GB graphics card, which seems like a competitive starting point for what is expected to be a lower mid-tier GPU. However, this will most likely be the cheapest option on the market, since AIB's tend to charge higher pricing due to customised PCB and cooling, plus some extra bling over the Intel cards.

In addition to the pricing leak above, Videocardz did some digging and found an etailer that has listed the Intel Arc B580 card on its site, albeit without any details, for US$259.55, although the site didn't reveal the details of the etailer, beyond the fact that it's a US company. The question is how the B580 will compare in terms of performance against both Intel's own Arc A750 and A770—which comes with either 8 or 16 GB of VRAM—especially as you can pick up an Acer Predator BiFrost Arc A770 or a couple of different ASRock Challenger Arc A770 cards for as little as US$230.

MSI previously gave us a teaser of what to expect from its upcoming Claw 8 AI+ gaming handheld with Intel's Lunar Lake Core Ultra CPUs, calling it "the most advanced 8-inch gaming handheld in the market," but a recent CES listing has divulged more details about the upcoming challenger to the likes of the Lenovo Legion Go. For starters, the upgraded battery capacity has been revealed, along with an estimated battery life and performance figures. Supposedly, more information will be revealed about the Claw 8 AI+ at CES 2025, which starts on January 7, 2025.

According to the CES page, the new MSI Claw 8 AI+ will have an 8-inch display and an 82 WHr battery, which will supposedly be able to deliver "4+ hours of gameplay for AAA titles." However, these manufacturer claims are generally to be taken with healthy helpings of salt, especially in when it comes to claims as nebulous as "AAA titles" without any proposed quality settings, specific games, or frame rates. Regarding the display, it wouldn't be surprising to see MSI use the same display as the one found in the Lenovo Legion Go, since there is a somewhat limited selection of 8-inch displays for handheld gaming devices. The MSI Claw 8 AI+ will also use Intel's 2nd-generation ARC iGPUs in conjunction with AI-enhanced graphics, which should provide a healthy uptick in both performance and efficiency, with the CES listing touting 48 TOPS of compute power.

Assassin's Creed Shadows is seemingly not out of hot water with gamers just yet, although this time, the flak seems to have been mostly unwarranted. Earlier this week, rumors popped up on Reddit claiming to reveal the Assassin's Creed Shadows Animus Hub, which was supposedly the upcoming RPG's dedicated launcher, and a host of in-game season passes and rewards. The leak purports to detail the first free battle pass, which is referred to as "Eye in the Dark" and will consist of 20 reward tiers. Completing the battle pass allegedly rewards 9,050 Isu coins, which can be used to purchase various cosmetics in the form of character, weapon, and mount customization options. Somewhat comically, there appear to be in-game collaborations with the likes of VISA, Red Bull, Intel, BAPE Clothing and Sprecher, although how these will play out in the game is a mystery. This news made quite a stir when it was first announced, since Ubisoft was very clear when it confirmed the game's delay last month that there would be no season passes in Assassin's Creed Shadows.

As it turns out, though, the rumors were kicking up enough speculation about the return of paid subscriptions, battle passes, and season passes that Ubisoft took to its official Discord server to address the rumors directly. Although Ubisoft confirmed that the Animus Hub is a piece of software it has been working on, all the content and rewards offered in the Animus Hub will be free content. Ubisoft was, however, careful with its words, not denying the existence of season passes and battle passes, instead only commenting that those passes will not be paid. Additionally, Ubisoft confirmed that there will be additional in-game content available for free in the Animus Hub.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

Apple's M4 is an impressively powerful SoC that made its debut in the OLED iPad Pro launched earlier this year. Despite being held back by a passively cooled system, the M4 performed rather well, punching well above its weight class in both CPU and GPU benchmarks. The potent SoC will soon make its debut on the 14" and 16" MacBook Pro lineup, which, along with a redesigned Mac Mini and a refreshed 24" iMac, is set to see the light of day by the 30th of this month according to Bloomberg's Mark Gurman.

Gurman expects the new Macs to be unveiled via a pre-recorded live stream with a press release following soon after. His sources indicate that Apple is planning a hands-on event with creators next Wednesday, similar to what we witnessed last year. If his previous prediction holds true, Apple will finally unveil the higher-end M4 Pro and M4 Max SoCs for the MacBook Pro lineup. The redesigned Mac Mini will likely boast the M4 and M4 Pro SoCs, along with a major redesign that will entirely eliminate USB-A ports, opting instead for a USB-C-only solution. The 24" iMac, however, will be refreshed with the standard M4 alone.

As we await the launch of Intel's "Arrow Lake-S" Core Ultra 200S series of processors for desktops, we are getting some new leaks about Intel's mainstream mobile "Arrow Lake-H" update. A month ago, we got the specification table of the high-end mobile "Arrow Lake-HX," and now, thanks to Jaykihn X, we have the mainstream laptop chip specifications as well. The top-of-the-line includes Intel Core Ultra 9 285H, a 45 W TDP SKU with six P-cores, eight E-cores, and two LPE cores. The CPU packs integrated Xe2 graphics with eight cores and 24 MB of total L3 cache and has a maximum boost of 5.4 GHz for P-cores.

Moving down the stack, there are Core Ultra 7 265H and Core Ultra 5 255H SKUs, which feature the same P/E/LPE core configuration. However, these SKUs are rated for 28 W TDP, having lower maximum frequencies and the same iGPU configuration. This time, we also have two Core Ultra 3 SKUs, with Core Ultra 3 235H and 225H bringing four P-cores, eight E-cores, and two LPE-cores in the 28 W package. The Core Ultra 3 235H has eight Xe2 cores in its iGPU, while the lowest-end Core Ultra 3 225H has only seven Xe2 iGPU cores. For a complete set of specifications, including all clock speeds in base and boost, please check out the table below.

Intel's Arrow Lake Core Ultra 200 series CPUs have appeared in a number of leaks now, and some benchmarks of the new chips have even started appearing on sites like Geekbench, however, there are still some questions surrounding the launch date of the new CPUs. Previous leaks indicated that the original mid-October launch was pushed back to October 24, and new information from VideoCardz sheds more light on the exact specifics of the launch, with October 24 pegged as the day Arrow Lake reviews and sales will be available to the public.

According to the leak, Intel will host a private media briefing for a select few press outlets and influencers on October 7. This will be followed by the official public announcement on October 10 and the review embargo and official retail launch on October 24. The October 7 event will reportedly feature a keynote from both Robert Hallock, Intel's VP and general manager of Client AI and technical marketing, and Roger Chandler, vice president of enthusiast PC and workstation product marketing.

The leaks and rumors surrounding Intel's upcoming Arrow Lake desktop CPU line-up are starting to heat up, with recent rumors tipping the existence of the Core Ultra 9 285K as the top-end chip in the upcoming launch. A new set of Geekbench 6 scores spotted by BenchLeaks on X, however, suggests the Core Ultra 9 285 non-K variant of this CPU might lag its Ryzen 9 counterparts significantly.

The Geekbench 6 test results, which were apparently achieved on an ASUS Prime Z890-P motherboard, reveal performance that falls short of even the current-generation AMD Ryzen 7 9700X, never mind any of the Ryzen 9 variants. The Geekbench 6 multicore score came in at an unimpressive 14,150, while the single-core score was a mere 3,081, falling short of the likes of the AMD Ryzen 7 9700X, which scored up to 19,381 and 3,624 in multi- and single-core tests, respectively. However, there appears to be more to this story—namely an odd test configuration that could heavily skew the test results, since the "stock" Intel Core Ultra 9 285K scores significantly higher in the Geekbench 6 charts than this particular 285 seems to.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

A new vulnerability was recently discovered in a widely used print server that is installed by default on many Linux and Unix-based systems with a graphical user interface. The primary attack vector for the vulnerability is the CUPS (Common Unit Printing System) print scheduler, specifically cups-browsed, and has the potential to execute code remotely with zero user interaction required.

The vulnerability has reportedly been given a CVSS score of 9.9 by RHEL and Canonical, although this score is hotly debated, with some arguing it should have a lower score, because, although code can be remotely downloaded to the system, it cannot be executed without user intervention. Fortunately, there is no evidence of the vulnerability having been exploited, although the disclosure was leaked online ahead of a planned private reveal in October, prompting the developer that discovered the vulnerability to post the full explanation in a write-up on their blog. This being the case, the vulnerability could very well start being exploited by malicious actors.

The upcoming Strix Point Halo processors from AMD now have a new name - Ryzen AI Max - and come with big promises of impressive power. This rumor, first reported by VideoCardz and originating from Weibo leaker Golden Pig Upgrade, reveals key details about the first three processors in this lineup, along with their specifications.

The leaker claims AMD might roll out a new naming system for these processors branding them as part of the Ryzen AI Max series. These chips will run on the anticipated Strix Halo APU. This series includes three models, with the top-end version boasting up to 16 Zen 5 cores and 40 Compute Units (CUs) for graphics. This setup is expected for the best model contrary to earlier rumors that AMD would drop such a variant. In fact, word has it that at least two of the models in this lineup will come with 40 RDNA 3.5 Compute Units. The leaker also hints that Strix Halo will handle up to 96 GB of video memory suggesting AMD aims to make this processor work with its ROCm (Open Compute Platform) system.

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

What appears to be the full details of all of Intel's upcoming 800-series chipsets have leaked and although we've already seen what the Z890 chipset will offer, no details of the other SKUs have leaked to date. Maybe the biggest news is that there won't be an H870 chipset this time around, according to the leaker @jaykihn0 over at X/Twitter. The full range appears to be Z890, B860 and H810 for consumers, W880 for workstations and Q870 for corporate desktops. That said, the Z890 and W880 are identical in terms of slots and ports, but whereas the W880 gains full ECC support and Intel vPro and remote management, it loses the CPU and bus overclocking features of the Z890. The Q870 loses four chipset PCIe 4.0 lanes, one 20 Gbps or two 10 Gbps USB 3.2 ports, but is otherwise similar to the Z890, minus all the overclocking features, but with Intel vPro and remote management.

The B860 ends up on the chopping block as always and loses not only 10 chipset PCIe lanes compared to the Z890 chipset, but also four lanes from the CPU and four lanes on the DMI interface to the chipset. On top of that bifurcation goes out the window toigether with PCIe RAID and the chipset is only capable of having two 20 Gbps or four 10 Gbps USB 3.2 ports, but at least memory overclocking is still on the table. Finally, the H810 chipset is as basic as it gets, with no extra CPU PCIe lanes beyond the 16 lanes for a graphics card, but they are at least PCIe 5.0 this time around. The chipset itself is only equipped with a mere eight PCIe 4.0 lanes and it gets zero 20 Gbps and two 10 Gbps USB 3.2 ports. Note that all platforms support one or two Thunderbolt 4 / USB4 ports, but it's unclear if this is native support or via an add-on chip. Also note that the USB ports are shared and the maximum count is that for the 5 Gbps ports in the details below, so the Z890 for example, doesn't have 25 USB 3.2 ports in total, but rather only 10. All in all, we'll see a migration to PCIe 5.0 for the x16 slot across the entire 800-series chipset range and from the B860 and up, all chipsets will have a dedicated PCIe 5.0 x4 interface that will most likely be used for an M.2 slot. Also, the PCIe lane count is the maximum, but due to Intel's HSIO layout, some resources will be shared with SATA and Ethernet, which means not all PCIe lanes will be accessible.

According to the leaked listing posted on X by user @Orlak29_, reports suggest that Pro versions of the AMD Ryzen 7 AI and Ryzen 9 AI are in the pipeline, with a potential game-changer in the form of the high-end "Strix Halo" model. The standout feature of the Strix Halo is its rumored support for up to 128 GB of RAM, a significant leap from AMD's current offerings. This massive memory capacity could prove valuable for AI workloads and data-intensive applications, potentially positioning AMD better against offerings from Intel and Qualcomm. Leaked diagrams hint at a unique design for the Strix Halo, featuring a chiplet layout reminiscent of a graphics card. The processor is reportedly surrounded by memory on three sides, enabling the massive 128 GB capacity.

While this top-tier model is expected to carry a premium price, it could find a ready market among professionals and enthusiasts demanding both raw processing power and extensive memory resources. On the performance front, rumors suggest the Strix Halo will boast up to 16 Zen 5 cores and a GPU with 40 Compute Units based on RDNA 3.5 architecture. This combination might rival the performance of high-end mobile GPUs like the RTX 4060 or even the RTX 4070 for laptops.
As with previous generations, AMD is expected to release Pro versions of these processors with additional features like ECC memory support.

AMD's Zen 5 Ryzen 9000 "Granite Ridge" series desktop processors are expected to be released on July 31st. The Ryzen AI 300 "Strix Point" series notebooks will hit stores earlier, on July 15th. This information comes from product listings on various e-commerce sites, as reported by ITHome and Videocardz. Additionally, a BestBuy listing shows one ASUS laptop with a Ryzen AI 300 "Strix Point" CPU launching on July 15th, ahead of the desktop processor release.

ITHome also reported potential retail prices for the AMD Ryzen 9 series CPUs, at least for the Philippine market. Worldwide prices may be lower or higher depending on taxes in each region.

• Ryzen 9 9950X: $648
• Ryzen 9 9900X: $597
• Ryzen 7 9700X: $409
• Ryzen 5 9600X: $315

AMD "Zen 5" CPU microarchitecture will introduce a significant performance increase for AVX-512 workloads, with some sources reported as high as 40% performance increases over "Zen 4" in benchmarks that use AVX-512. A Moore's Law is Dead report detailing the execution engine of "Zen 5" holds the answer to how the company managed this—using a true 512-bit FPU. Currently, AMD uses a dual-pumped 256-bit FPU to execute AVX-512 workloads on "Zen 4." The updated FPU should significantly improve the core's performance in workloads that take advantage of 512-bit AVX or VNNI instructions, such as AI.

Giving "Zen 5" a 512-bit FPU meant that AMD also had to scale up the ancillaries—all the components that keep the FPU fed with data and instructions. The company therefore increased the capacity of the L1 DTLB. The load-store queues have been widened to meet the needs of the new FPU. The L1 Data cache has been doubled in bandwidth, and increased in size by 50%. The L1D is now 48 KB in size, up from 32 KB in "Zen 4." FPU MADD latency has been reduced by 1 cycle. Besides the FPU, AMD also increased the number of Integer execution pipes to 10, from 8 on "Zen 4." The exclusive L2 cache per core remains 1 MB in size.Update 07:02 UTC: Moore's Law is Dead reached out to us and said that the slide previously posted by them, which we had used in an earlier version of this article, is fake, but said that the information contained in that slide is correct, and that they stand by the information.

Speculated lower-end Intel second generation Arc GPUs popped up via SiSoftware Sandra database entries around mid-March—evaluation samples are likely in the hands of trusted hardware partners. Yesterday, momomo_us happened upon another interesting shipping manifest, following a series of AMD-related leaks. The latest list reveals five "Battlemage" products—three utilizing the BMG-21 GPU, and the remaining two being based on the BMG-10 design. These identifiers have appeared in older leaks, although the latter has been viewed in place sight—chez Intel Malaysia's Failure Analysis Lab.

Previous leaks suggest that these second generation Arc models (Xe2) reside within a "High-Performance Graphics" (HPG) discrete GPU family—the Xe2-HPG BMG-10 range is likely targeting an "enthusiast" market segment, while the Xe2-HPG BMG-21 tier is rumored to offer mid-tier performance. Intel staffers have expressed confidence about a possible late 2024 launch window. Back in January, Tom "TAP" Petersen revealed that the Arc hardware team had already moved onto third-gen "Celestial" GPU endeavors: "I'd say about 30% of our engineers are working on Battlemage, mostly on the software side because our hardware team is on the next thing." The first-gen deck has not been cleared fully it seems—the Alchemist family could be joined by two new variants in the near future.

AMD's Instinct family has welcomed a new addition—the MI388X AI accelerator—as discovered in a lengthy regulatory 10K filing (submitted to the SEC). The document reveals that the unannounced SKU—along with the MI250, MI300X and MI300A integrated circuits—cannot be sold to Chinese customers due to updated US trade regulations (new requirements were issued around October 2023). Versal VC2802 and VE2802 FPGA products are also mentioned in the same section. Earlier this month, AMD's Chinese market-specific Instinct MI309 package was deemed to be too powerful for purpose by the US Department of Commerce.

AMD has not published anything about the Instinct MI388X's official specification, and technical details have not emerged via leaks. The "X" tag likely implies that it has been designed for AI and HPC applications, akin to the recently launched MI300X accelerator. The designation of a higher model number could (naturally) point to a potentially more potent spec sheet, although Tom's Hardware posits that MI388X is a semi-custom spinoff of an existing model.