Mid-way through April, a few Asian media outlets proposed a fairly recent formation of Xiaomi's "chip platform department"—most likely operating as part of the Chinese corporation's mobile phone development operation. Industry insiders claimed that this special branch was tasked with the designing of "Xuanjie" chipsets, with added expertise provided by an ex-Qualcomm marketing director. Weeks later, Jukanlosreve has weighed in with alleged new details. The keen tracker—of unannounced flagship smartphone chips and semiconductor business revelations—believes that previous leaks were of merit, but made some corrections.

Given reported greater than expected "new division" headcounts, Xiaomi probably established its "Xring SoC" team a while ago—on this topic, Jukanlosreve divulged: "it operates as a new company; independent of the original parent firm. It's not a small team either—it has over 1000 people. To be honest, I see it as a positive development if a domestically produced chip gets used in a domestically made smartphone and sold globally. I genuinely hope it becomes reality. If Xring succeeds, it might encourage more companies to get involved, and even engineers currently working at major firms could see better pay opportunities."

Last September, AMD leadership publicly revealed UDNA—an "unforking" of previously separate enterprise and commercial GPU branches. Not long after this announcement, TechPowerUp's resident Serbian correspondent—AleksandarK—sat down with Team Red's Andrej Zdravkovic. The Chief Software Officer (and SVP) stated that a fair chunk of UDNA-related development work would be done by local engineers. Zdravkovic discussed this technology's eventual deployment in futuristic "AI PCs," but gamers have been salivating at the prospect of a proper successor to RDNA 4. A next-gen graphics architecture seeker—MrMPFR—has combed through official documents for any sign of UDNA preview material. The noted /Hardware subreddit member managed to distill their initial (very long) set of findings into an "easily digestible overview." They stated that this was just a small case of: "reporting and a little analysis on AMD's publicly available US patents filings," and other public-facing resources/archives.

Gleaned information included: "finalized architectural characteristics in future RDNA generations, AMD DXR IHV stacks (driver agnostic), and AMD sponsored titles. But please take everything with a grain of salt given my lack of professional expertise and experience with Real-time ray tracing (RTRT)". MrMPFR believes that Team Red started picking up former NVIDIA and Intel engineering talent, back in 2022/2023. In addition, a lot of new hires were apparently sourced from academic institutions. In theory, these newer team members have not had the time to make major inroads—in terms of getting finalized products out into the wild. MrMPFR reckons that noticeable contributions will accelerate AMD's making of "RDNA 6+/UDNA 2+," and beyond. Early 2025 leaks have pointed to the company collaborating with Sony; their "PlayStation 6" console is tipped to be powered by some fork of Team Red's "UDNA" graphics technology.

Mid-week, leakers produced an impressive list of unannounced next-gen AMD processor families—spanning across workstation, desktop, and laptop/notebook product lines. Additional data mining activities have outlined a possible "PRO model-only" release of Ryzen Threadripper Pro "Shimada Peak" 9000WX CPUs. AMD's upcoming Computex 2025 presentation plans could include an unveiling of their much-leaked Zen 5 workstation-grade processor family. Curiously, AMD's Technical Information Portal does not list a "Shimada Peak" High-End Desktop (HEDT) category—industry watchers expected to see a successor to the current-gen Ryzen Threadripper (non-PRO) 7000X "Storm Peak" series. In theory, next-gen HEDT models could be introduced at a later date. All leaked identifiers have featured "-5WX" affixes; denoting workstation deployments. Keen observers have not found products IPs ending with "-0X." InstLatX64's supplementary investigations seemed to confirm presences of the vast majority of recently disclosed next-wave product ranges—namely Ryzen 9000G "Gorgon Point" APUs and EPYC 4005 "Grado" CPUs. Another anomaly was discovered; the alleged Arm-based "Soundwave" SoC family was notably absent from Team Red's tech info repository.

Yesterday, Chosun Daily published a news report that alleges a key "Galaxy Z Flip 7-related" decision made by Samsung leadership. According to smartphone industry moles, the oft-leaked/rumored "Exynos 2500" chipset destined to debut in the company's next-gen (horizontal) foldable smartphone design. As stated in the South Korean insider article: "this is the first time that Samsung's own mobile application processor (AP) is being installed in a foldable phone." Prior to 2025, Galaxy Flip Z product lines made use of Qualcomm Snapdragon chipsets. Throughout early 2025, leaks have linked the "troubled" Exynos 2500 mobile processor to futuristic Galaxy Z Flip 7, Fold 7, and affordable "FE" Enterprise Edition models. The emergence of a superior 2 nm "Exynos 2600" flagship chip—apparently tailored for Galaxy S26 devices (2026)—has allegedly relegated the lesser SoC into lower leagues.

Semiconductor industry watchdogs reckon that the "Exynos 2500" will be manufactured via Samsung Foundry's own 3 nm GAA node process (aka SF3). Notebookcheck commented on this odd choice: "industry estimates from earlier suggested (SF3) yields were around 40%, making it less than ideal for mass production. But it seems Samsung decided to proceed anyway to save on costs, and likely give a new lease of life to its struggling foundry business." Jukanlosreve followed up with additional inside knowledge, just after the publication of Chosun Daily's news piece. The keen tracker of foundry-related revelations let slip with this observation: "the Exynos 2500 being used in the Flip 7 is said to be a lower-clocked chip due to its low yield. So it might as well be called the E2500E." Samsung is expected to unveil its Galaxy Z Flip 7 smartphone family during an "Unpacked" July event. Experts believe that Foundry employees will accumulate useful experience from the mass production of 3 nm parts; thus leading to improved output of finalized 2 nm (SF2) production lines.

Over the past weekend, members of the Chiphell discussion board started posting truly NDA-busting photo material—one example made headlines a few days ago. A fairly convincing list of next-gen NVIDIA RTX PRO Blackwell series graphics cards appeared online just over a month ago; only a smattering of physical specimens have emerged since then. As pointed out by interested Chiphellers, Leadtek Chinese language websites have started listing a small selection of upcoming "Blackwell" generation professional SKUs.

The previously leaked PCB design was linked to Leadtek/NVIDIA's "blower-style" RTX PRO 6000 Blackwell Max-Q Workstation Edition 96 GB model. A brave Chiphell forumite has shared shots of another alleged internal component; a shorter PCB design has come to light—in VideoCardz's expert opinion, this stubby unit is destined to be contained within the Leadtek-made (non-Max-Q) RTX PRO 6000 Blackwell Workstation Edition enclosure. Official Team Green promotional renders have already presented this darker alternative to existing Founders Edition gaming-oriented siblings. According to VideoCardz, Team Green's Professional Blackwell series review embargo is still in effect and official launch window information is still not a publicly-known quantity. The freshly leaked bare PCB seems to borrow design elements—namely a dual-sided GDDR7 memory module mounting setup—from NVIDIA's familiar GeForce RTX 5090 Founders Edition model.

The vast majority of High Bandwidth Memory (HBM) new stories—so far, in 2025—have involved or alluded to new-generation SK hynix and Micron products. As mentioned in recently published Samsung Electronics Q1 financial papers, company engineers are still working on "upcoming enhanced HBM3E products." Late last month, a neighbor/main rival publicly showcased their groundbreaking HBM4 memory solution—indicating a market leading development position. Samsung has officially roadmapped a futuristic "sixth-generation" HBM4 technology, but their immediate focus seems to be a targeted sales expansion of incoming "enhanced HBM3E 12H" products. Previously, the firm's Memory Business has lost HBM3 ground—within AI GPU/accelerator market segments—to key competitors.

Industry insiders believe that company leadership will attempt to regain lost market shares in a post-2025 world. As reported by South Korean news outlets, Kim Jae-joon (VP of Samsung's memory department) stated—during a recent earnings call, with analysts—that his team is: "already collaborating with multiple customers on custom versions based on both HBM4 and the enhanced HBM4E." The initiation of commercial shipments is anticipated at some point in 2026, hinging on mass production starting by the second half of this year. The boss notified listeners about development "running on schedule." A Hankyung article alleges that Samsung HBM4 evaluation samples have been sent out to "NVIDIA, Broadcom, and Google." Wccftech posits a positive early outlook: "Samsung will use its own 4 nm process from the foundry division and utilize the 10 nm 6th-generation 1c DRAM, which is known as one of the highest-end in the market. On paper, (their) HBM4 solution will be on par with competing models (from SK hynix), but we will have to wait and see."

Intel has only released two Arc Xe2 "Battlemage" desktop models: the B580 12 GB and B570 10 GB graphics cards. So far, these lower priced options have been warmly welcomed by reviewers and buyers alike—but gaming GPU enthusiasts are still actively clamoring for more potent second-gen "Battlemage" variants. The collective status of theorized "B750, B770, and (fancifully) B780" SKUs is frustratingly unclear. Intel has not generated any official new product noise since the launch of their B570 design, earlier this year—recent big announcements have focused on next-gen "AI PC" processor lines. A series of vague leaks have indicated cancelations and then revivals of speculated mid-to-high-end Arc Xe2 discrete cards.

As of late, a larger "BMG-G31" GPU identifier has appeared in shipping manifests—a previous leak pointed to "prototype" units being moved between company facilities. Yesterday, Haze2K1 shared another extract from NBD inventory documents—crucially, they believe that these items are heading to a crucial manufacturing plant in Vietnam. This location is/was tasked with the assembling of first-party B570 and B580 Limited Edition products. Fresh conjecture suggests that "B7XX" Limited Edition cards are in the pipeline, but current circumstances are still hazy. VideoCardz reckons that a "Developer Edition" 24 GB model is still in active development, but this rumored workstation/productivity-oriented card could be based on Intel's readily available "BMG-G21" GPU die.

Recent evidence has emerged that Ubisoft may indeed be planning to—or may have been planning to—launch multiplayer game modes for Assassin's Creed Shadows. An online sleuth analyzed the Assassin's Creed Shadows website's Boostrap files and found several mentions of Multiplayer and PVP maps and training areas in the files. It may, thus, be the case that the introduction of the new Animus Hub may have been a move to facilitate multiplayer gameplay.

That said, Ubisoft recently hosted an Assassin's Creed Shadows 1 Year Roadmap on YouTube, and there was no direct mention of multiplayer gameplay in the roadmap. Ubisoft did, however, hint at the addition of what it called Special Collaborations in the regular content section and new Animus content coming in the near future. Previous leaks indicated that the multiplayer modes in AC Shadows would feature a co-op mode, akin to Assassin's Creed Unity, but the new leaks indicate that Ubisoft may be planning a PVP mode, as well, which would make it much more like Assassin's Creed IV: Black Flag. It's also possible that the mention of multiplayer in the site files is just left-over information from before the launch of Assassin's Creed Shadows, and Ubisoft has scrapped the idea altogether. As we reported previously, it has been a rocky road to get Assassin's Creed Shadows to launch, with Ubisoft switching up its launch strategy and delaying the game twice ahead of the official launch.

PC hardware watchers continue to pore over official AMD repositories and adjacent databases, in the hopes of finding unannounced next-gen technologies. Olrak29 and InstLatX64 have presented their latest Team Red-related findings; apparently reaching across futuristic desktop, mobile, and workstation product families. As outlined and interpreted by VideoCardz, several of these next-gen branches are already somewhat "known" properties—namely AMD's allegedly Zen 5-based Ryzen Threadripper "Shimada Peak" 9000WX (workstation) processor series. Following almost two years of leaks, an official introduction is expected to happen during Computex 2025. The Ryzen 9000G "Gorgon Point" desktop (Zen 5 + RDNA 3.5) APU series has turned up again; now "fully" linked to the AM5 socket platform (not a big surprise). The two leakers have also uncovered another rumored AM5-bound product lineup—"Grado" chips could be based on existing "Granite Ridge" foundations, but elevated to commercial/enterprise levels. These speculated basic/entry-level "EPYC 4005" processors are floated as natural successors to currently available 4004 forebears (related to Ryzen 7000 "Raphael" architecture).

Olrak29 and InstLatX64 have also found multiple mysterious FP8 socket-related Ryzen AI Mobile SoCs. "Krackan2" could be a cheaper refresh of current "Krackan Point" APUs—Tom's Hardware proposes smaller designs that sport fewer cores, and not configured with NPUs. Kepler_L2 has weighed in on the matter of three listed "Gorgon Point" IPs—he reckons that the third variant ("Gorgon Point3") will be a spin-off (aka refresh) of a "Krackan2" design. As suggested by insider knowledge, Team Red's convoluted scheme points to "Gorgon Point" being the sequel to "Strix Point." An FF5-based "Soundwave" processor design has appeared alongside the aforementioned futuristic Ryzen AI Mobile chipsets—industry whispers propose that AMD will be leveraging Arm architecture within a lower product tier. InstLatX64 pulled additional compelling information from AMD's Technical Information Portal—providing further insight into Ryzen AI "Medusa Point" APUs (Zen 6 + RDNA 3.5) being dreamt up, with a matching "larger footprint" FP10 platform.

Just over two weeks ago, NVIDIA officially outlined a vague May launch window for GeForce RTX 5060 Mobile 8 GB dGPU-based partner-produced laptops/notebooks—"starting at $1099." Industry watchdogs reckon that a comprehensive product reveal will happen at Computex 2025. Team Green's mid-April PR article mentioned that models "are coming from every major OEM"—an included promotional image showcased devices built by Acer, ASUS, Dell, GIGABYTE, HP, Lenovo, MSI, and Razer. The ever watchful Olrak29 has unearthed two unannounced COLORFUL devices; listings have appeared within the Geekbench Browser database. A next-gen "P15 Pro" entry—published on April 20—posted an OpenCL score of 109431 (in Geekbench 6.4).

This leak lists a Intel Core i9-13900HX "Raptor Lake" CPU and an "NVIDIA GeForce RTX 5060 Laptop GPU." A more modern specced "iGame M15 Origo"—powered by Team Blue's Core Ultra 9 285HX "Arrow Lake" APU—option was also put through the Geekbench 6.4 wringer; this sample produced an OpenCL score of 102564 (on April 27). As observed by VideoCardz, the lower end "Blackwell" GPU beats its "Ada Lovelace" predecessor—GeForce RTX 4060 Mobile—by roughly 18% in overall OpenCL Geekbench gauntlets. Naturally, Vulkan-based scores would be better indicators of gaming performance. Early evaluators recorded maximum GPU clocks—of 2025 MHz and 2212 MHz (respectively)—on their GeForce RTX 5060 Mobile subjects.

A series of April leaks have suggested that Apple's mixed reality headset engineering team is concocting two distinct next-gen solutions. Mid-month, leakers shared alleged early shots of "Vision Air"-related connectors and external parts—hinting at a potential dark blue colorway. Combined with a selection of fairly legitimate-sounding predictions from a notorious industry watcher, so-called Vision Pro sequels are on the way. Apple's Chinese manufacturing partners are reportedly deep into mass production of crucial "Vision Pro 2" components. Mark Gurman's "Power On" newsletter has provided plenty of inside knowledge stories over the past couple of months—his latest article included a section dedicated to fresh VR/AR insights: "I reported earlier this month that Apple is full steam ahead on two new successors to the Vision Pro (2023): a lighter version at a cheaper price point, and a Mac-tethered model aimed at applications that need maximum responsiveness."

He continued: "all signs point to the lighter model arriving between the end of this year and the first half of 2026. Despite the first version selling poorly, the company isn't abandoning ship here. The main uncertainty is whether the lighter version will be considered a replacement for the Vision Pro or a cheaper alternative." In theory, Apple could test "more mainstream" gaming waters with an initial rollout of the claimed cheaper + lightweight "Vision Air" model—perhaps set to do battle with readily available rival devices; e.g. Meta's dominant Quest 3 range. A full-blown Vision Pro follow-up could launch later on in 2026—likely reserved for upper-crust customers, with an increased focus on productivity applications.

Industry watchdogs have held the belief that Samsung's foundry business has lost several key clients due to alleged yield problems—the South Korean megacorp appears to be diligently working on major improvements with currently "in-progress" manufacturing processes; namely 2 nm GAA (aka SF2). Semiconductor industry insiders believe that TSMC is still leading the way with a recently completed trial run of their own 2 nm design, but rumors of elevated prices have reportedly upset certain important customers. According to a fresh Sedaily news article, Qualcomm has conducted negotiations with Samsung Foundry top brass—semiconductor industry moles claim that a "Snapdragon 8 Elite 2nd generation product" was the main topic of discussion. This next-gen flagship mobile chipset was previously linked to a 3 nm TSMC node, but newer rumors point to a possible spin-off that will utilize a "more advanced 2 nm process"—courtesy of Samsung Electronic's prime "Hwaseong S3" facility.

Sedaily and Jukanlosreve reckon that mass production will kick off at this cutting-edge early next year. Earlier today, Jukanlosreve added extra conjecture/context via a long social media bulletin: "the completed chips are expected to be integrated into Samsung Galaxy smartphones slated for launch in H2 2026. Design work is to finish in Q2 2025, after which mass-production preparations will begin and wafer runs will start in Q1 2026. Output is estimated at roughly 1,000 twelve-inch wafers per month. Given that Samsung's current 2 nm capacity is about 7,000 wafers/month, this project would utilize only around 15 % of its available capacity—suggesting this is a modest order rather than a large-scale win." These predictions have surprised many industry observers; Samsung leadership has seemingly tried to prioritize the in-house Exynos mobile processor designs within futuristic flagship Galaxy smartphone devices. Jukanlosreve reckons that the Samsung Foundry is keen to embrace any new "golden opportunities," given the operation's weakened track record across the past half decade. One unnamed insider posited: "this Qualcomm partnership could pave the way for orders from other big tech players." Sedaily sent a query to Samsung HQ, regarding the latest inside talk—a company spokesperson replied with: "we cannot confirm anything related to customer orders."

Insider whispers regarding AMD's plans for not-yet-official Radeon RX 9060 XT graphics cards have floated a possible introduction on May 18, as well as a speculated early June retail launch. These leaked timeframes seem to hinge on something happening at next month's Computex 2025 trade show—similarly, NVIDIA could be readying competing products. BenchLife.info has disclosed inside track information from both camps—their report outlined vaguely refreshed conditions: "the entire 'Blackwell' gaming GPU range is expected to include an (unannounced) GeForce RTX 5050, but this particular graphics card has not yet been confirmed by NVIDIA. After the launch of Team Green's GeForce RTX 5060 8 GB model, AMD is also expected to launch the Radeon RX 9060 XT series graphics cards on May 21, but the finalized stock may not appear for sale until June."

Yesterday, Team Red and involved board partners surprised many industry watchdogs—up until very recently, the Radeon RX 9070 GRE 12 GB model's release status was in flux. VideoCardz believes that misleading information was deliberately sent out to moles and leakers. As correctly theorized by certain outlets, AMD will launch this (RDNA 4) generation's "Great Radeon Edition" card well in advance of lower end options. The aforementioned (alleged) May 21 introduction of Radeon RX 9060 XT cards aligns with AMD's scheduled Tuesday morning press conference. A few days ago, a smattering of news articles indicated the cancelation of Team Red's Radeon RX 9060 XT 8 GB variant—VideoCardz cannot verify this claim. Instead, they reckon that the 16 GB model will be prioritized; in terms of day zero/one media coverage.

Mere months after the launch of GeForce RTX 5080 16 GB and RTX 5070 12 GB graphics cards, industry rumors are already swirling about a potential "SUPER" semi-successor. Sections of NVIDIA's previous-gen "Ada Lovelace" GeForce RTX 40-series family received mid-generation refresh treatment around early 2024. It is not clear whether it will take a year+ for the speculated arrival of upgraded "Blackwell" desktop gaming solutions, but members of the Chiphell forum have been openly discussing alleged "in-progress" GeForce RTX 5080 SUPER 24 GB and RTX 5070 SUPER 18 GB card designs. Past weekend theorizations were highlighted by ITHome and VideoCardz—in particular, one Chiphell participant posited the two follow-ups will not be deployed with noticeably "faster" performance.

Larger pools of onboard GDDR7 VRAM could pave the way for improvements in AI productivity, although greater capacities could lead to beneficial conditions in gaming scenarios—e.g. extra provisions for large textures and complex assets. The speculated GeForce RTX 5080 SUPER card could borrow aspects from Team Green's GeForce RTX 5090 Mobile 24 GB model; namely the latter's usage of 3 GB GDDR7 memory modules. Press interpretations—of fresh Chiphell leaks—point to company engineers enabling existing PCB designs with 8×3 GB (24 GB) and 6×3 GB (18 GB) parts; thus preventing a major overhaul of board layouts. Global PC gaming hardware communities have often expressed a dislike of NVIDIA's repeated deployment of 8 GB and 12 GB capacity products. A theoretical GeForce RTX 5070 SUPER 18 GB option could receive a warmer welcome. Very early speculation proposes an introduction—of SUPER "Blackwell" models—just before or during CES 2026.

AMD's next-gen Ryzen Threadripper High-End Desktop (HEDT) processor family remains under wraps, but the latest insider whispers indicate a potential official introduction at Computex 2025. So far, leaks have provided the majority of insights into Team Red's speculated "Shimada Peak" 9000WX series. Mid-way through this month, three more unannounced product identifiers appeared online—industry observers are still seeking out a futuristic 96-core "9995WX" model. AMD's teaser material—regarding Jack Huynh's upcoming keynote presentation—does not list anything bearing a Threadripper label. Fresh evidence—not from a shipping manifest—points to a possible upcoming inclusion. As disclosed by the PCGH.de crew; GIGABYTE has rolled out an F10a BIOS update for TRX50 AERO D motherboards—accompanying release notes mention intriguing "Next Gen CPU Support."

PCGH's investigative piece put a spotlight on an exciting specification point, but potential customers will probably be greeted by corresponding extreme "niche" pricing. The article elaborated on this fan-favorite technology: "workstation and high-end desktop processors from the AMD Ryzen Threadripper 9000 and Ryzen Threadripper Pro 9000 series—also known as 'Shimada Peak'—will feature multiple 3D V-Caches consisting of up to four stacks on as many chiplets, and could thus represent, for the first time, an option for gamers who benefit from as many processor cores and massive L3 cache as possible...(this CPU platform) will continue to be housed on the already established LGA4844 ('sTR5') socket and will most likely be compatible with the two chipsets: the TRX50 and WRX90. However, the much more interesting information is provided by the UEFI/BIOS itself, as this is where the use of the CPU's 3D V-Cache can now be configured. Configurations with 1, 2, or even 4 memory 'stacks' are available, as well as a corresponding auto-feature." GIGABYTE's "official" leak suggests the distribution of evaluation samples—naturally, review outlet test rig's would require support for "Shimada Peak" CPUs.

Rumors about the recent cancelation of an unannounced Blade Runner project; following the alleged completion of a pre-production phase at Supermassive Games. Insider Gaming's "exclusive" article proposes that the UK-based computer game development studio had started work on a "character focused, cinematic, action adventure" around September 2024. An inside source disclosed a "Blade Runner: Time To Live" title, and a futuristic "New Zurich" setting—in 2065. The online publication has acquired "internal company documents" that apparently outlined a 10-12 hour single player campaign experience and a "compelling story blending the philosophical themes of Blade Runner, with kinetic action-adventure gameplay." Veteran members of Supermassive's "The Quarry" core dev team were reportedly involved in the IP's early-stage production cycle.

Insider Gaming outlined a surprising mix of internal details—sourced from their industry mole—suggesting that this project is/was not related to Alcon Interactive Group and Annapurna Interactive's still in-progress Blade Runner title. The report described some of Supermassive's key goals: "a full release was planned for September 2027 on PlayStation 5, Xbox Series X|S, PC, and the 'Gen 10' Xbox and PlayStation systems. It was set to have a full development budget of roughly $45 million with $9 million of it being used for external performance capture and acting talent. What wasn't included in the budget, however, was original music production, image rights and usage fees for performers, QA and game testing, localization, and any future DLC. As with any budget, the amount was subject to change as development got underway and costs rose or fell." The British company is still working on Directive 8020, an original premise sci-fi interactive adventure—presumably, nearing the end of full-blown production within the coming months.

Officially, AMD is set to reveal the next wave of RDNA 4—in desktop form—at some point within the second quarter of this year. Unlike its main rival—NVIDIA—company representatives have not publicly discussed a comprehensive branch-off into dedicated laptop graphics solutions. Team Red's previous-gen "Navi Mobile" Radeon RX 7000M lineup received little fanfare, and early 2025 "official" talk indicated that company engineers were focused on delivering RDNA 4 to desktop. Additionally, late March leaks suggested an increased future reliance on integrated RDNA 3.5-based graphics solutions. Seemingly out of nowhere, All The Watts!! has produced a list of six tentative Radeon RX 9000M family variants. As interpreted by VideoCardz, the leaker has cryptically included supposed compute unit (CU) counts and VRAM configurations. A rumored Radeon RX 9080M flagship SKU could be based on AMD's Navi 48 GPU design; prepped with 64 RDNA 4 compute units (or 4096 stream processors) and 16 GB of video memory.

The leaked Radeon RX 9070M XT's basic details match certain data points present on the rumored Radeon RX 9070 GRE 12 GB desktop card's specification sheet. VideoCardz reckons that the RX 9070M XT will also utilize Team Red's Navi 48 GPU, but with a reduced compute unit count of 48 (or 3072 SPs). The four remaining RDNA 4 laptop SKUs—RX 9070M, RX 9070S, RX 9060M and RX 9060S—are said to be based on company's Navi 44 GPU IP, and configured with 8 GB pools of VRAM. Two days ago, AMD hinted about new generation Radeon Mobile gaming experiences getting introduced at next month's Computex 2025 trade show.

As revealed during a recent Q1 earnings call, Intel leadership mentioned that "external clients are getting their ASICs designs tested." The company's foundry business is working towards the finalization of its much discussed 18A node process, with alleged trial samples receiving an "impressive performance rating." According to Ctee Taiwan, Team Blue's foundry service has submitted test subjects to the likes of NVIDIA, Broadcom and Faraday Technology. The latter organization has (reportedly) disclosed that the 18A platform tape-out was completed last October—since then, received samples have been "successfully connected." Industry moles believe that NVIDIA and Broadcom are in the middle of conducting manufacturing tests. Additional whispers suggest the delivery of 18A prototypes chez IBM and several other unnamed partner companies. Insiders have indicated impressive/good "verification results." Contrary to reports from other sources, Ctee has picked up on insider chatter about Intel's next-gen Nova Lake compute tile design being "not entirely outsourced." Further conjecture points to Team Blue becoming increasingly confident in its own manufacturing techniques.

On April 15, NVIDIA revealed its "coming soon + starting at $299" GeForce RTX 5060 8 GB graphics card model—along with the freshly launched GeForce RTX 5060 Ti 16 GB and 8 GB cards. Not long after that, board partners introduced entire custom GeForce RTX 5060 Series product ranges. To the surprise of many, Team Green's mid-month PR material seemed to place a lot of emphasis on the cheapest offering. VideoCardz reckons that public demand for launch day GeForce RTX 5060 cards is not expected to reach high levels, but NVIDIA seems to be readying a simultaneous retail release and lifting of review embargoes. According to inside track information, May 19 appears to be the big day of choice.

Clever day one maneuvering could be in play—VideoCardz outlined a potential strategy: "this approach means customers may purchase the card without prior access to independent performance data. In other words, gamers will have to rely on NVIDIA's official benchmarks, unless they want to risk not being able to buy the card at MSRP." Team Green's mid-April "desktop family" marketing piece did tease the GeForce RTX 5060's Tensor and RT Core performance (respectively): 614 AI TOPs and 58 TFLOPS—versus RTX 5060 Ti's 750 AI TOPS, and 72 TFLOPS. Insider whispers suggest that AMD is readying rival hardware for release within a similar time frame; Radeon RX 9060 XT. The competing companies could be making important new product announcements just before the start of Computex 2025 (on May 20).

Industry insiders have disclosed fairly fresh theories about AMD delaying the launch of Radeon RX 9070 GRE graphics cards into the fourth quarter of 2025. Earlier leaks suggested a potential surprise arrival at some point in May (early next month), ahead of rumored wallet-friendly Radeon RX 9060 XT 16 GB and 8 GB models. In another bizarre turn of pre-release events, VideoCardz has acquired promotional shots of two—alleged—PowerColor Radeon RX 9070 GRE 12 GB custom designs. The online news outlet seems to have a strong "inside" connection to a source familiar with goings-on—within or adjacent to—the Taiwanese company.

Familiar images of flagship and entry level cards have emerged from an unnamed figure—reportedly, the manufacturer has reused its existing portfolio of RDNA 4 generation shroud and backplate designs. Curiously, a mid-tier Hellhound GRE card was not included in a recent NDA-busting exchange. VideoCardz believes that the exact same Red Devil enclosure—present on Radeon RX 9070 XT and RX 9070 siblings—is up for repeat business. A significant difference seems to be the reported utilization of two 8-pin power connectors (versus three on the flagship), and a minimum requirement of a 650 W-rated PSU. March-time whispers suggested a forthcoming mass production of board partner Radeon RX 9070 GRE cards; so the sudden appearance of two PowerColor SKUs seems to semi-verify older online claims. VideoCardz posits that AMD is deliberately seeding "incorrect information" within insider knowledge channels.

An unlucky owner of a GIGABYTE AORUS GeForce RTX 5080 MASTER ICE 16 GB graphics card has reported a baffling instance of thermal gel leakage. A forum post—titled: "5080 oh my god thermal problem"—on the Quasar Zone BBS alerted the wider world to this bizarre fault. The South Korean MMORPG enthusiast described circumstances up until the point of critical liquefaction: "it's been exactly a month since I bought it. I use it for (Blizzard's) World of Warcraft. Two hours of use per day. I set up the card with a riser kit. Thermal (material) is crawling out?!" Early 2025 press coverage has largely focused on other types of unwanted high temperature events involving GeForce RTX 50-series cards, but the seeping out of "server-grade thermal conductive gel" compound is something new. As reported by several PC hardware news outlets, GIGABYTE has utilized fancy thermal conductive gel within flagship SKUs—instead of traditional/conventional thermal pads. This gel was placed over the card's VRAM and MOSFET sections; following fairly light usage (as described above) some of this material started to head down—getting ever closer to the unit's PCIe interface.

Assisted by the AORUS RTX 5080 MASTER ICE's vertical orientation, the (apparently) highly deformable, but non-fluid thermal gel was susceptible to the effects of gravity. JC Hyun System Co., Ltd.—GIGABYTE's official domestic importer (for South Korea)—weighed in with a separate bulletin: "we are aware of the thermal gel issue with the GIGABYTE GeForce RTX 50 series, which was first posted on Quasar Zone—(we) are currently discussing the thermal gel issue with GIGABYTE HQ and future customer service regulations. In addition, we sincerely apologize for the confusion caused to many customers who love and use GIGABYTE products due to inaccurate guidance provided to customers who received the products due to unclear customer service regulations regarding the issue that occurred this time. Lastly, when the manufacturer's customer service policy regarding this thermal gel issue is finalized, we will also forward the service policy to CS Innovation so that it can be processed smoothly in accordance with the service policy. We will also provide information through a separate post so that more customers can be aware of the information." As mentioned by Notebookcheck, GIGABYTE uses this special thermal gel solution on other highly expensive custom: "RTX 50-series cards like the GeForce RTX 5090 XTREME WATERFORCE 32G, RTX 5090 MASTER ICE, RTX 5070 Ti MASTER, and others."

A part of AMD's enthusiast fanbase scoffed at the prospect of a rumored Radeon RX 9070 GRE 12 GB model arriving ahead of—officially teased—lower end RDNA 4 options. This new generation's "Great Radeon Edition" seemed to be heading into mass production; according to insider track information. Last week, fairly legitimate specifications leaked out and TechPowerUp's GPU-Z utility was updated with support for this slightly mysterious Navi 48 GPU-based gaming card. Members of the Board Channels forum have heard fresh whispers from industry moles—most likely from AIBs—regarding a possible delay of Team Red's Radeon RX 9070 GRE design. Alleged initial plans suggested an original release at retail; on May 8. Further conjecture points to a revised Q4 2025 launch window—perhaps just before November 11. The same Board Channel report also mentioned an expedited rollout of AMD's Radeon RX 9060 XT cards—earlier theories signalled an early June (aka post-Computex 2025) arrival, but insiders now posit May 18.

An alleged partial close-up capture of the Nintendo Switch 2's chipset has leaked out; courtesy of Kurnal (@Kurnalsalts). This fresh leak is being hyped up as putting an end to all online debate regarding the upcoming hybrid console's technological underpinnings. Despite late 2024/early 2025 reports pointing to a custom NVIDIA "T239" SoC design, certain voices continued to produce conjecture about a more "cutting edge" solution. Surprisingly, Team Green's PR department did issue a statement about the Switch 2 being powered by: "a custom processor featuring an NVIDIA GPU with dedicated RT Cores and Tensor Cores for stunning visuals and AI-driven enhancements."

As expected, Nintendo staffers remained guarded during recent press junkets—in-depth tech talk was deferred in NVIDIA's general direction. Kurnal's sharing of a speculative "T239" partial die shot does not provide any major new revelations or insights—as discussed on the Nintendo Switch 2 Subreddit, tech enthusiasts continue to rely on specification details from the big hack of NVIDIA repositories (three years ago). Newer speculation has focused on Nintendo's choice of foundry—Digital Foundry's Richard Leadbetter continues to express his personal belief that Nintendo has selected a Samsung 8 nm DUV foundry node. In opposition, certain critics have persisted with a 5 nm EUV node process theory.

Mid-way through April, we heard about sanctions affecting shipments of NVIDIA's H20 AI chips into China. Despite (rumored) best efforts made by Jensen Huang and colleagues, the US government has banned the export of Team Green's formerly sanction-conformant design. Similarly, NVIDIA prepared a slightly less potent GPU for gaming applications—exclusively for the Chinese market. Despite sporting a restricted GB202 "Blackwell" GPU die, the GeForce RTX 5090D 32 GB is still a monstrous prospect. According to Chinese PC hardware news sources, Team Green representatives have sent alerts to "all" of its Chinese add-in-card partners (AICs)—early warning signs have indicated a possible cut-off of GB202 GPUs in the near future. A member of the Chiphell forum disclosed some insider knowledge and dismissed unfounded speculation about RTX 5090D cards being replaced by "full fat" RTX 5090 options.

sthuasheng commented on Team Green's alleged bulletin—distributed at some point last week: "the notice only said that the supply of RTX 5090D was suspended, ...this did not mean any sales or transportation ban; it urged everyone not to make any speculations or judgments unless there was an official notice issued at a later date. After this notice was issued, each AIC began to notify agents to suspend sales, because the inventory of 5090D has always been very small, so it is necessary to keep these stocks to observe the subsequent situation and deal with the subsequent after-sales. At the same time, we might as well speculate that each AIC and dealer may also have the intention to stockpile 5090D units and then sell them at an elevated price." BenchLife.info decided to reach out to industry moles, following an absorption of various Chiphell whispers.

Not long after Intel's launch of the Arc Xe2 "Battlemage" B580 12 GB graphics card design, insiders started generating noise about potential spin-offs bound for release in 2025. In theory, the speculated "B580 24 GB" variant could arrive as a workstation-oriented discrete graphics solution—possibly lined up as a next-gen entry within Team Blue's Arc Pro family. Three mysterious BMG (aka "Battlemage") PCI identifiers turned up at the end of January; sending online PC hardware debates into overdrive; one faction believed that Team Blue was readying fabled productivity-focused B-series cards—complete with enlarged pools of GDDR6 VRAM. Apparently, Sparkle's Chinese branch has provided comment on newer rumors—from March, according to VideoCardz. The Taiwanese manufacturer is a key Intel board partner in the field of Arc GPU-based graphics card products—across gaming and professional desktop lines. Unfortunately, the company's head office (in Taiwan) has dismissed "official" claims about a May/June launch of an unnamed 24 GB model. Sparkle's Chinese social media account engaged with members of the PC hardware community, and outlined an "original plan" to release something new within the second quarter of 2025—apparently the incoming card is "still being arranged."