Team Group Inc., one of the leading manufacturers of memory products in the world, is expanding the SSD market this year. We are constantly working to improve ourselves in R&D capability. In addition to surpassing ourselves technically, Team Group is now rolling out the new generation power-saving SSD SATA II A1 to cut the power bills and watch out for the pockets of consumers who are suffering the increase of fuel and electricity prices. This is one new serious product with a high C/P value!

SSD SATA II A1 features high-speed NAND Flash as the data storage. The built-in 128MB DDR Cache memory combined with S.M.A.R.T, ECC automatic error correction protection, the supports for WIN7 TRIM Command and the PHISON 3105 controller allows writing/reading speed up to 270MB/s and 210MB/s, respectively, and random writing/reading up to 15000/6000 IOPS. It is a perfect evolution of data transmission speed and completeness. The zero-noise and lower power consumption design gives longer operation time and improved working efficiency for laptop users, making SSD SATA II A1.

RunCore, leading supplier of high-performance solid-state drives, announces the global launch of its InVincible Solid State Disc drive. This SATA SSD solution provides for highest data security through a special button device that allows for total physical destruction with a single click.

The RunCore InVincible SSDs allow you to protect sensitive data from third party access in two ways with a single click. One method is the intelligent elimination of all your data through overwriting the entire disk with meaningless code. This overwrite-deletion method ensures that there is no way to potentially recover previous data stored to the device, effectively setting you SSD back to factory default.

STEC, Inc., a leading global provider of solid-state drive (SSD) technologies and products, today announced that the company has validated its proprietary CellCare Technology's ability to extend the endurance of 24 nm consumer-grade multi-level cell (cMLC) NAND flash memory to 40,000 program/erase cycles. This represents an increase of greater than 13 times the manufacturer's specified endurance metric of 3,000 program/erase cycles.

This is a significant advancement in one of the company's core technologies, as it provides for the development of a new generation of STEC's enterprise-class SSDs that utilizes low-cost cMLC NAND chips, while still achieving 10 full capacity random writes to the drive each day for five years, and data retention for three months (at 40°C)-all with no degradation in performance. This equates to approximately 7.3 petabytes (PB) of data being written to a 400 GB SSD over the life of the drive.

Green House Japan unveiled a new line of industrial SDHC cards that are designed to endure operating temperatures as high as 70°C, and as low as 0°C, which makes them fit to serve as removable storage media in IPCs and outdoor static cameras. The cards further pack ECC logic to prevent data corruption. The cards make use of SLC NAND flash, and come in capacities of 256 MB, 512 MB, 1 GB, 2 GB, 4 GB, and 8 GB. The 256 and 512 MB models provide transfer rates as high as 19 MB/s reads with 7 MB/s writes, while the other models provide speeds as high as 20 MB/s reads with 13 MB/s writes. Green House left pricing to the open markets.

Team Group Inc., which is working very hard in the industrial and embedded storage devices, is making its entrance for the second time in ESEC, the largest embedded system exhibition in Japan, with boiling popularity from last year. In addition to the full series of industrial NAND flash and industrial control memory modules, Team Group will present industrial embedded NAND flash SSDs.

Team Group SSD series consists of 2.5" SATA and 1.8" PATA interfaces, and offers multiple choices of volume and customization service. The products feature high performance in vibration and impact resistance, ensuring smooth operations even in a harsh environment at a temperature of -40℃~+85℃. Team Group is hoping to grab the global storage market with these supreme products with good quality and high performance.

Team Group Inc., a major NAND flash manufacturer in the world, presents the brand new iCF, SD industrial NAND flash cards, which feature not only highly efficient transmission speed, but also the complete compatibility with IPC and other embedded platform, also support multiple transmission modes and functions. In addition to unprecedented ultra high reading and writing speed, they provide guaranteed high durability and reliability for application programs crucial for IPC, medical equipment, military equipment, point of sales (POS) systems and game consoles.

Team Group understands the cries for industrial level memory cards in the demanding storage market, and in response comes up with the high performance and high volume industrial memory cards that meet wide temperature requirements. They read and write at 45/40MBpersec, and support for ECC dynamic and static wear leveling. The features of vibration resistance and low energy consumption provide excellent performance, compatibility and reliability for hand-held barcode scanners, POS terminals, wireless communication devices, embedded systems, medical computers, set-top boxes, monitoring system and hand-held GPS and other application devices requiring frequent data access.

Imagine a day without your smartphone, music player, tablet, or any of your other favorite portable devices -- these are examples of the scenarios that Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, explores in its new NAND Flash Deprivation Experiment campaign. Launched to commemorate the 25th anniversary of Toshiba's invention of NAND flash, the campaign takes a look at what happens when people are deprived of NAND flash -- and all of the everyday devices they use that are enabled by it.

Solid manufacturing and strong pricing allowed Micron Technology Inc. and Hynix Semiconductor Inc. to post strong performances in the global NAND flash business in the fourth quarter, allowing them to narrow the gap in market share between them and the industry leaders, and setting the stage for further advances in 2012.

No. 3-ranked Micron Technology Inc. of the United States achieved 11.7 percent revenue growth in the fourth quarter compared to the third, according to a new IHS iSuppli Data Flash Market Tracker report from information and analytics provider IHS. Meanwhile, fourth-placed Hynix Semiconductor Inc. of South Korea expanded its revenue by 5.4 percent, as presented in the table below.

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF). The industry weathered the macroeconomic uncertainties in the U.S and Europe, the earthquake and tsunami in Japan, China's slow down in the second half of the year, and floods in Thailand. Meanwhile, device applications, such as smartphones, media tablets and e-readers, automotive infotainment, notebook PCs, datacenter servers, and wireless and wired communication infrastructure drove robust consumption of semiconductors.

IDC's SAF tracks more than 100 semiconductor companies. Over 40 of these companies experienced year-over-year revenue growth greater than 5%, while about the same number of companies saw their revenue decline by more than 5%.

RunCore, leading supplier of high-performance solid-state drives, has just started giving a sneak preview of two soon to be globally available special-use SSDs, the RunCore InVincible with a physical self-destruction mechanism, and the RunCore XAPEAR, allowing for complete remote data elimination through your mobile phone.

The RunCore InVincible SSDs allow you to protect your data from third party access in two ways with a single click. One method is the intelligent elimination of all your data through overwriting the entire disk with. A less subtle method is the physical destruction of your SSD by applying an over-current to the NAND flash memory and thereby rendering these. The RunCore InVincible product series is catering to embedded computer systems requiring high-speed serial switched fabric interconnects for rugged design implementation and more flexible power ranges. Delivering optimized storage options particularly in mission-critical fields such aerospace, military and general industrial applications.

MSC Vertriebs GmbH presents the first COM Express modules based on the 3rd generation Intel Core processor family (formerly codenamed 'Ivy Bridge'). The 3rd generation Intel Core processor family utilizes Intel's advanced 22nm process technology with three-dimensional transistors for higher performance at lower power. The new COM Express modules feature a further leap forward in computing power, graphics and video performance in comparison to modules based on the previous generation Intel platform. Important innovations of this new product generation are lower power consumption at higher clock frequencies and improved graphics and video performance. For the first time, the new Intel platform supports DirectX 11.

UBM TechInsights, the leader in technology and IP consulting, is pleased to recognize Intel - Micron for their collaboration on the Intel-Micron Flash Technologies (IMFT) 20 nm MLC NAND Flash and award them with the Insight Award for the 2011 Semiconductor of the Year.

UBM TechInsights' circuit analysis verified that Intel - Micron's latest Flash component was the first to be manufactured at the 20 nm process node. By using high-k dielectric to replace the silicon dioxide, that is traditionally used, Intel-Micron managed to reduce leakage while keeping power consumption low - a must for today's light weight portable electronics.

MemoTrek Technologies, the leading wholesale supplier of branded USB flash drives and promotional USB memory has recently announced the launch of the MemoTrek MetalKey USB flash drive, a classical key shaped metal USB flash drive containing a high quality NAND flash memory solid state chip with a storage capacity of up to 32 GB.

The MemoTrek MetalKey 32 GB USB key of solid metal can be branded with a custom company logo to create sustainable marketing value and boost marketing ROI by giving an attractive and truly practical promotional gift to the two important segments of potential new customers or loyal VIPs.

Custodian of the Ultrabook specification, Intel pushed the storage industry to churn out slimmer devices to go with increasingly slimmer Ultrabooks sold by the various partner ODMs in the ecosystem. Even as HDD and SSD makers have only just come up with 7 mm-thick storage devices, Intel has a fresh list of changes it wishes to see with storage devices in the very near future, to be able to make it to the constantly-evolving Ultrabook specification. Intel wants near-future storage devices (SSDs and HDDs) to be no thicker than 5 mm.

Further, it wants to see the standard SATA host interface changed from "around" (out of) form, to "along" (inside) form host interface, which further slims down the drive compartment. These proposals were floated at IDF, Beijing. While coming up with slimmer SSDs was never really a tough task for SSD makers, as SSDs are essentially just millimeter-thick printed circuit boards with millimeter-thick components (controller logic, NAND flash memory, and ancillaries), it posed a huge technical challange to mechanical HDD designers, who have had to slim down key components that work to maintain inertial motion of spinning platters. This new proposal for 5 mm-thick HDDs could pose a newer, tougher desgin challenge.

Intel today finally announced its SSD 910 "Ramsdale" PCI-Express SSD family. This is Intel's first SSD in the PCI-Express add-on card form-factor. Like its 2.5" SSD 710 series, the SSD 910 utilizes HET-MLC NAND flash chips, arranged in four SSD subuits. SSD 910 design consists of three stacked PCBs, the one with the PCI-Express 2.0 x8 bus interface holds a PCI-Express to SAS bridge (essentially a RAID controller), and four SAS/NAND ASICs (SSD controllers). Each controller is wired out to its NAND flash memory chips, which are arranged in the other PCBs.

The PCIe-SAS bridge is made by LSI. The SSD 910 series comes in two variants based on capacity: 400 GB and 800 GB. The 400 GB variant has just two SSD subunits, and hence provides transfer rates (according to an older article) of 1 GB/s reads and 750 MB/s writes, with 90,000 IOPS reads, with 38,000 IOPS writes; while the 800 GB variant, with its four subunits, provides 2 GB/s reads with 1 GB/s writes, and 180,000 IOPS reads, with 75,000 IOPS writes. The launch price of the SSD 910 400 GB variant is US $1,929; while the 800 GB variant is priced at US $3859, at launch.

For those who thought with the Indilinx buyout and release of Everest and Kilimanjaro series NAND flash controllers, OCZ is on course of becoming a largely self-sufficient SSD industry player, here's a revelation. Its new Everest series silicon, used in recently-launched SSD families (such as Octane and Vertex 4), is essentially a re-badged Marvell controller (found on SSDs such as Crucial M4, Intel SSD 510), with custom firmware developed by OCZ. This discovery by Anandtech was confirmed by OCZ (Indilinx).

The Indilinx Everest (Octane and Petrol series) and Everest 2 (Vertex 4 series), are both re-badged Marvell chips with Indilinx firmware. Although it doesn't change anything, it perfectly explains how OCZ could come up with two "new" SSD controllers (Everest and Everest 2) almost instantly, after the Indilix acquisition. Everest 1 is essentially a higher-clocked Marvell 88SS9174, while Everest 2 could very well be a re-badged Marvell 88SS9187, according to the source.

Intel is on the brink of launching its new line of enterprise PCI-Express SSDs, codenamed "Ramsdale", carrying the market name "SSD 910 Series". The new SSD 910 series is coming to existence leapfrogging SSD 710 series, which was also codenamed "Ramsdale", but never made it to the market. The original Ramsdale SSD 720 was meant to be primarily based on SLC NAND flash memory with the probability of an MLC variant, Intel decided against launching it, probably because it was hedging its bets on 25 nm HET-MLC NAND flash, which provides endurance levels closer to SLC, while offering the capacity-advantage of MLC. The SSD 910 implements this new NAND flash standard that attempts to offer the best of both SLC and MLC.

The new SSD 910 will be available in two capacity options: 400 GB and 800 GB. Built as a PCI-Express expansion card, the SSD 910 consists of three stacked PCBs that hold SSD subunits and HET-MLC NAND flash chips, lots of them. Each of these subunits interfaces with the core logic over SAS. The core logic connects to the host over PCI-Express 2.0 x8 bus interface. The 400 GB variant provides sequential read speeds up to 1 GB/s, and up to 750 MB/s writes. The 800 GB variant provides up to 2 GB/s reads, with up to 1 GB/s writes.

MOSAID Technologies Inc. today announced that it is sampling the industry's first NAND Flash MCP (multi-chip package) with a 16-die NAND stack operating on a single high-performance channel.

MOSAID's 512Gb HLNAND (HyperLink NAND) MCP combines a stack of 16 industry standard 32Gb NAND Flash die with two HLNAND interface devices to achieve 333MB/s output over a single byte-wide HLNAND interface channel. Conventional NAND Flash MCP designs cannot stack more than four NAND dies without suffering from performance degradation, and would require two or more channels to deliver similar throughput.

Intel made its SSD 313 series official, its product page was activated, and ARK pages of its variants maintain the products are already launched. The SSD 313 series succeeds SSD 311 series, it consists of SSDs specifically designed for SSD-caching technologies such as Intel Smart Response Technology, and upcoming technologies that the upcoming "Ivy Bridge" platform brings with it, including "Rapid Start" and "Smart Connect". The SSD 313 Series is introduced in two variants, a 20 GB variant, and a 24 GB variant.

The 20 GB variant offers sequential performance up to 220 MB/s and 100 MB/s (read and write), while the 24 GB variant offers 160 MB/s and 115 MB/s, which might make one wonder about the need for a 24 GB variant, given that it's also slower at 4K random-seek performance 33,000 IOPS / 4,000 IOPS vs. 36,000 IOPS / 3,300 IOPS of the 20 GB. One reason behind the 24 GB variant's existence could be that a combination of different Intel technologies partition the SSD, taking away small amounts of capacity. The extra 4 GB of capacity might more than make up for the slightly lower performance. Both drives use SLC NAND flash chips, which are more durable than MLC NAND flash, and can take more rewrite cycles (something that factors in heavily for caching SSDs). Both drives are available in 2.5" SATA 3 Gb/s and mSATA 3 Gb/s form-factors. The 20 GB variant was earlier put to test.

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it has reached a milestone -- 2012 marks the 25th anniversary of Toshiba's invention of NAND flash memory.

Much has changed since 1987 -- the NAND flash market has grown rapidly, with flash memory shipping almost 8X more gigabytes (GB) in 2011 than DRAM. NAND flash has become the high density silicon storage of choice. NAND flash memory is used in a variety of memory cards and USB drives, and is found in many consumer, industrial and enterprise cloud applications. Toshiba's innovation has carved out a path to a new era in which consumers are able to carry videos, music, books and data with them wherever they go. Designed with a very small cell size to enable a low cost-per-bit of stored data,Toshiba's NAND flash technology is unleashing the mobility of content, thus fueling innovation in the development of products for everyone from consumers to enterprise.

Intel's upcoming mainstream consumer SSD line, the SSD 330 series, could have attractive pricing, which could catalyze further proliferation of SSD technology, according to a LaptopReviews report, citing tease-listings by online retailers and other sources. The new lineup will embrace SATA rev. 3.0 (6 Gb/s) standard, and offer performance that takes advantage of it. The 120 GB variant of the SSD 330, for example, was listed for US $149, on MacMall.com, the listing is removed. This gives it a price/GB on par with other 120 GB SATA 6 Gb/s SSDs in the market, which underwent several rounds of price-adjustments to get there.

The SSD 330 series from Intel, will be available in three capacities, 60 GB, 120 GB, and 180 GB. The 120 GB and 180 GB variants offer sequential transfer-rates of up to 500 MB/s (read) and 450 MB/s (write); the 60 GB variant offers 500 MB/s (read), and 400 MB/s (write). These drives use IMFlash Technologies-made 25 nm MLC NAND flash, and offer standard feature-set that includes support for TRIM, NCQ, 256-bit AES data-encryption, and limited SMART attributes.

Spansion Inc. and SK Hynix today announced an alliance to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to the embedded market. The first Spansion SLC NAND products resulting from this alliance will be available beginning in the second quarter of 2012. As part of the relationship, the companies will enter into a patent cross-licensing agreement.

Spansion's NAND products complement its NOR offering and complete its product line, which is targeted at embedded applications such as automotive, industrial and telecommunications. Spansion's high performance and high reliability SLC NAND product portfolio will come with Spansion's recognized customer support and commitment for longevity of supply, which is highly valued in the embedded market, where Spansion has established relationships. Spansion will apply its stringent process for qualification, testing, extended temperature support and packaging to its NAND products. The company plans to introduce a family of NAND products over the next few quarters.

EtronTech, which started out as a DRAM IC manufacturer, expanded into PC connectivity solutions, such as USB 3.0 host and webcam controllers, is now shipping its first USB 3.0 flash drive controllers. The EV268-series dual-core controllers come in 2-channel and 4-channel variants, with the ability to offer transfer-rates in excess of 230 MB/s. These controllers are designed to support 30 nm-class and 20 nm-class SLC/MLC/TLC NAND flash memory chips.

With the EV268, Etron entered a small but budding group of companies with USB 3.0 flash-drive controllers: VIA Technology/VIA Labs Inc. (VLI), Phison Electronics, and InnoStor Technology. By Q4 2012, it is estimated that USB 3.0 flash drives will make up 20% of all flash-drives shipped.

OCZ released the Arowana Flash Translation Layer (FTL) firmware update for SSDs running Indilinx Barefoot controllers, and 34 nm NAND flash. The update was announced in May, 2011, and released for the OCZ Vertex Plus family, but it's only now that users of the original Barefoot-controlled drives get a firmware to update their drives with. The new 3.55 firmware significantly improves sequential and random-seek performance. The screenshots below (in order) are of a Barefoot-driven OCZ Vertex drive with the old firmware (IDE), new firmware (IDE), and new fimware (AHCI). To learn more about the update, and how to go about do it to your drive, visit this page. Like most other SSD firmware updates, the process erases everything on your drive, so be sure to make a backup.

Fueled by strong sales growth in its core chip businesses-and boosted by a major acquisition-leading semiconductor supplier Intel Corp. in 2011 attained its highest annual market share in more than 10 years, according to the IHS iSuppli Competitive Landscape Tool from information and analytics provider IHS (NYSE: IHS). Intel in 2011 increased its overall semiconductor market share to 15.6 percent, up 2.5 percentage points from 13.1 percent in 2010, according to the final IHS semiconductor estimate for the year. This represents the highest market share for Intel going back to at least 2001, when it reached 14.9 percent. Over the last five years, Intel's share of the market ranged from 11.9 percent to 13.9 percent.

"Intel in 2011 captured the headlines with its major surge in growth," said Dale Ford, head of electronics and semiconductor research for IHS. "The company's rise was spurred by soaring demand for its PC-oriented microprocessors, and for its NAND flash memory used in consumer and wireless products. Intel's revenue also was boosted by its acquisition of Infineon's wireless business unit. The company's strong rise helped it to stave off the rising challenge mounted by No. 2 semiconductor supplier Samsung Electronics Co. Ltd., which had been whittling away at Intel's lead in recent years." The table below presents the final 2011 semiconductor market share ranking from the IHS.